KR102207309B1 - System and method for treating substrate - Google Patents

Abstract

The present invention relates to a substrate processing apparatus, wherein the substrate processing apparatus according to an embodiment of the present invention includes a housing having an inner space for performing a process on a substrate, a support unit supporting a substrate in the housing, and the process. And a control unit for controlling the substrate processing apparatus to perform a process, wherein the control unit has a process recipe for controlling a flow of a process step according to the process and a process recipe for controlling the process step, wherein the process recipe is the process recipe It may include an extended area that restricts user access by dividing the internal memory.

Description

Substrate processing equipment and substrate processing method {SYSTEM AND METHOD FOR TREATING SUBSTRATE}

The present invention relates to a substrate processing facility and a substrate processing method using the same.

In order to manufacture a semiconductor device, various processes such as photography, etching, deposition, ion implantation, and cleaning are performed. Among them, the photo process is a process for forming a pattern and plays an important role in achieving high integration of semiconductor devices.

The photographic process is largely composed of a coating process, an exposure process, and a developing process, and a bake process is performed before and after the exposure process. The bake process is a process of heat-treating a substrate. When a substrate is placed on a support plate, the substrate is heat-treated through a heater provided on the support plate. The control unit that controls the flow and type of these processes is composed of a process recipe that controls the entire process and a process recipe that controls each detailed process. Recipes are indispensable in the process of performing the process, and can always be checked from the user interface. Recipes restrict access by setting passwords for security, but security is weak when passwords are leaked.

An object of the present invention is to provide a substrate processing facility excellent in security.

The problem to be solved by the present invention is not limited to the above-described problems, and the problems that are not mentioned can be clearly understood by those of ordinary skill in the technical field to which the present invention belongs from the present specification and the accompanying drawings. will be.

The present invention relates to a substrate processing apparatus.

A substrate processing apparatus according to an embodiment of the present invention includes a housing having an inner space for performing a process on a substrate, a support unit supporting a substrate in the housing, and controlling the substrate processing apparatus to perform the process. It has a control unit, wherein the control unit has a processing recipe for controlling the flow of the processing step according to the process and a processing recipe for controlling the processing step, wherein the processing recipe divides the memory in the processing recipe to limit user access It may include an extended area.

The process recipe may include the extended area in the process recipe.

Each of the processing recipe and the extended area of the process recipe may be generated when the process is selected.

A plurality of processing steps may be provided.

A plurality of process recipes may be provided, and the plurality of process recipes may correspond to each of the plurality of processing steps.

When the same process step is included in the process multiple times, the control unit may not duplicate the process recipe corresponding to the process step.

When the process is completed, the controller may control to automatically delete each of the processing recipe and the extended area of the process recipe.

According to an embodiment of the present invention, a substrate processing facility excellent in security can be provided.

The effects of the present invention are not limited to the above-described effects, and effects that are not mentioned will be clearly understood by those of ordinary skill in the art from the present specification and the accompanying drawings.

1 is a schematic diagram of a substrate processing facility according to an embodiment of the present invention.
2 is a perspective view illustrating an example of the processing unit of FIG. 1.
3 is a plan view of a first processing chamber.
4 is a plan view of a second processing chamber.
5 is a diagram showing a process recipe and a process recipe confirmation screen.
6 is a diagram illustrating a process in which a controller controls a substrate processing apparatus.

The embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be construed as being limited by the embodiments described below. This embodiment is provided to more completely explain the present invention to those of ordinary skill in the art. Therefore, the shape of the constituent elements in the drawings is exaggerated to emphasize a more clear description.

Hereinafter, a baking apparatus according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. First of all, in adding reference numerals to elements of each drawing, it should be noted that the same elements have the same numerals as possible, even if they are indicated on different drawings. In addition, in describing the present invention, if it is determined that a detailed description of a related known configuration or function may obscure the subject matter of the present invention, a detailed description thereof will be omitted.

(Example)

In the present embodiment, a semiconductor substrate is illustrated and described as an example as a substrate processed by the substrate processing facility 1, but the present invention is not limited thereto and may be applied to various types of substrates such as a glass substrate.

1 is a diagram schematically showing an example of a substrate processing facility 1 of the present invention. The substrate processing facility 1 performs a photolithography process on a wafer.

Referring to FIG. 1, a substrate processing facility 1 includes a substrate processing apparatus 2 and a control unit 6. The substrate processing apparatus 2 has an index portion 10, a processing portion 20, and an interface portion 30, which are sequentially arranged side by side in one direction (hereinafter, a first direction 62). The substrate processing apparatus 2 performs a process on a substrate. The index unit 10 has a cassette holder 12 and a robot movement path 14.

The cassettes 12a in which semiconductor substrates such as wafers are accommodated are placed on the cassette holder 12. A robot 14a that transfers wafers between the cassette 12a placed on the cassette holder 12 and the processing unit 20 is installed in the robot movement path 14. The robot 14a has a structure that can be moved in a direction perpendicular to the first direction 62 (hereinafter, referred to as the second direction 64) and an up-down direction on a horizontal plane. A structure for transporting the robot 14a in the horizontal direction and the vertical direction can be easily configured by those skilled in the art, so a detailed description thereof will be omitted.

The processing unit 20 performs a coating process of applying a photoresist, such as a photoresist, to the wafer, and a developing process of removing the photoresist of the exposed area or the opposite area of the wafer where the exposure process has been performed. The processing unit 20 is provided with an application unit 120a, a developing unit 120b, and a baking unit 200.

An interface unit 30 connected to the exposure unit 40 is provided on one side of the processing unit 20. A robot 32 that transfers wafers between the exposure unit 40 and the processing unit 20 is disposed in the interface unit 30. The robot 32 has a structure that can be moved in the second direction 64 and the vertical direction described above.

2 is a perspective view showing an example of the processing unit 20 of FIG. 1.

The processing unit 20 has a first processing chamber 100a and a second processing chamber 100b. The first processing chamber 100a and the second processing chamber 100b have a stacked structure. Units performing the coating process are provided in the first processing chamber 100a, and units performing the developing process are provided in the second processing chamber 100b. That is, the application units 120a and the bake units 200 are provided in the first processing chamber 100a, and the developing units 120b and the bake units 200 are provided in the second processing chamber 100b. According to an example, the first processing chamber 100a is disposed above the second processing chamber 100b. Alternatively, the first processing chamber 100a may be disposed under the second processing chamber 100b.

Due to the above-described structure, the wafer includes the index unit 10, the first processing chamber 100a, the interface unit 30, the exposure unit 40, the interface unit 30, the second processing chamber 100b, and the index unit 10. ) Are moved sequentially. That is, during the photolithography process, the wafer is moved vertically in a loop manner.

3 is a plan view of the first processing chamber 100a.

Referring to FIG. 3, in the first processing chamber 100a, a first moving path 160a at the center is provided elongated in the first direction 62 described above. One end of the first moving path 160a is connected to the index unit 10, and the other end of the first moving path 160a is connected to the interface unit 30. Bake units 200 are arranged in a line along the first movement path 160a on one side of the first movement path 160a, and the application units 120a are disposed on the other side of the first movement path 160a. It is arranged in a line along (160a). In addition, the bake units 200 and the application units 120a are arranged so that a plurality of the bake units 200 and the application units 120a are stacked up and down. A first robot 162a for transferring wafers between the interface unit 30, the application unit 120a, the bake unit 200, and the index units 10 is provided in the first movement path 160a. A guide rail 164a is provided in the first movement path 160a so that the first robot 162a linearly moves in the first direction 62.

4 is a plan view of the second processing chamber 100b.

Referring to FIG. 4, in the second processing chamber 100b, a second moving path 160b is provided in the center in the first direction 62 as described above. One end of the second movement path 160b is connected to the index unit 10, and the other end of the second movement path 160b is connected to the interface unit 30. Bake units 200 are arranged in a row along the second moving path 160b on one side of the second moving path 160b, and developing units 120b are arranged on the other side of the second moving path 160b. It is arranged in a line along (160b). In addition, the bake units 200 and the developing units 120b are disposed so as to be stacked vertically. A second robot 162b for transferring wafers between the interface unit 30, the developing unit 120b, the bake unit 200, and the index units 10 is provided in the second moving path 160b.

A guide rail 164b is provided in the second movement path 160b so that the second robot 162b linearly moves in the first direction 62. Unlike the above, a first moving path may be disposed on one side of the first treatment chamber, and coating units and bake units may be disposed on the other side of the first treatment chamber. Further, a second moving path may be disposed on one side of the second processing chamber, and developing units and bake units may be disposed on the other side of the second processing chamber.

5 is a diagram showing a process recipe and a process recipe confirmation screen. 6 is a diagram illustrating a process in which the controller 6 controls the substrate processing apparatus 2. Hereinafter, a process in which the controller 6 controls the substrate processing apparatus 2 will be described with reference to FIGS. 5 and 6. The control unit 6 controls the substrate processing apparatus 2. The control unit 6 controls the substrate processing apparatus 2 to perform a process. The control unit 6 sets a process to be performed by the substrate processing apparatus 2. The control unit 6 programs and provides a process to be performed for each substrate processing apparatus and process. When the control unit 6 sets a process type, a process recipe and a process recipe are set accordingly. The process recipe and process recipe are provided process dependent. The treatment recipe controls the flow of progress steps according to the performed process. At this time, a recipe that controls each detailed step of the processing recipe is a process recipe. The treatment recipe may include a plurality of process recipes. In this case, the processing recipe includes an extended area B for limiting the user's access by dividing the memory in the processing recipe. The extended area B is created in a separate space in the processing recipe. Process information performed on the substrate is recorded in the extended area B. The processing recipe generated in the extended area (B) cannot be checked by a user in a user interface, so security can be maintained.

The process recipe controls each step of the process. A plurality of process recipes may be provided. When a plurality of processing steps are provided, a plurality of process recipes may be provided to correspond to each other. On the other hand, when the same process step is set multiple times in one process, the process recipe may be provided without overlapping. For example, in the process recipe, only one process recipe may be set for overlapping progress steps. On the other hand, process recipes used for different processes are separately generated and controlled so that there is no interference between each process. In this case, the process recipe includes an extended area (B) for restricting the user's access by dividing the memory in the process recipe. The extended area B is created in a separate space in the process recipe. Process information performed on the substrate is recorded in the extended area B. The process recipe generated in the extended area (B) cannot be checked by a user in a user interface, so security can be maintained.

When the control unit 6 sets a process type, a process recipe and a process recipe according to the process type are set. In this case, when a processing recipe is set, an extended area within the processing recipe may be created. In addition, when a process recipe is set, an extended area within the process recipe can be created. The processing recipe setting and the process recipe setting may be performed simultaneously with each other. The control unit 6 may control the process recipe and process recipe generated in the extended area B to automatically disappear when a process is performed on the substrate and the process is completed. Accordingly, in the substrate processing apparatus, the security of the process recipe and the process recipe is improved, and the process can be performed without being displayed on the user interface. In addition, during the process, it is possible to change and modify the process recipe and process recipe.

In the above-described embodiment, for convenience of description, a single control unit has been described as an example, but it goes without saying that the control unit may include a plurality of control units. As an example, the control unit is composed of a module program unit and a system control unit, and may use the MELSEC_Net communication protocol. In addition, the present invention is not limited thereto and may be provided for each process module according to the configuration of the facility system.

The above description is merely illustrative of the technical idea of the present invention, and those of ordinary skill in the art to which the present invention pertains will be able to make various modifications and variations without departing from the essential characteristics of the present invention. Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but to explain the technical idea, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be interpreted by the following claims, and all technical ideas within the scope equivalent thereto should be interpreted as being included in the scope of the present invention.

1: substrate processing equipment
2: substrate processing device
6: control unit
10: index part
20: processing unit
30: interface unit

Claims (10)

In the substrate processing facility,
A substrate processing apparatus that performs a process on a substrate; And
It has a control unit for controlling the substrate processing apparatus to perform the process,
The control unit,
A processing recipe for controlling the flow of the processing step according to the process; And
It has a process recipe to control the proceeding step,
The processing recipe includes an extended area for restricting access by a user by dividing a memory in the processing recipe. The method of claim 1,
The process recipe includes the extended area in the process recipe. The method of claim 2,
Each of the processing recipe and the extended area of the process recipe is generated when the process is selected. The method of claim 3,
A substrate processing facility in which a plurality of the proceeding steps are provided. The method of claim 4,
A plurality of process recipes are provided, and the plurality of process recipes correspond to each of the plurality of processing steps. The method of claim 5,
The control unit is a substrate processing facility that does not duplicately generate the process recipe corresponding to the process when the same process step is included multiple times in the process. The method of claim 6,
The control unit controls to automatically delete each of the processing recipe and the extended area of the process recipe when the process is completed. A substrate processing method for controlling the process using a substrate processing apparatus that performs a process on a substrate, the method comprising: selecting the process; Setting a processing recipe for controlling the flow of the processing step; And setting a process recipe for controlling the processing step, wherein the setting of the processing recipe comprises dividing a memory in the processing recipe to create an extended area limiting user access. Way. The method of claim 8,
The step of setting the process recipe includes creating the extended area in the process recipe. The method of claim 9,
The step of setting the processing recipe and the step of setting the process recipe are performed simultaneously with each other.

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