KR102201336B1 - Wafer holder for apparatus manufacturing a semiconductor device and edge ring assembly comprising the same - Google Patents

Abstract

An embodiment relates to an edge ring assembly for controlling the degree of deposition of a thin film on the edge of a wafer when forming a thin film on the wafer. According to the present invention, the edge ring assembly comprises: a coupling portion connected to an edge ring; and a holder portion for supporting an edge of a wafer. The coupling portion includes any one of a slide rail and a slide rail groove, and is slide-coupled or separated from the edge ring.

Description

A wafer holder used in equipment manufacturing semiconductor devices, and an edge ring assembly including the same {WAFER HOLDER FOR APPARATUS MANUFACTURING A SEMICONDUCTOR DEVICE AND EDGE RING ASSEMBLY COMPRISING THE SAME}

The embodiment relates to a wafer holder used in equipment for manufacturing a semiconductor device and an edge ring assembly including the same.

A wafer is manufactured into a chip, which is a semiconductor device, by repeatedly performing a number of unit processes such as a photo process, an etching process, a thin film deposition process, and an ion implantation process. The thin film deposition process is a process of forming a thin film of a predetermined thickness on a wafer, and is largely classified into a physical vapor deposition method and a chemical vapor deposition method according to a thin film deposition method.

Among them, the chemical vapor deposition method forms a thin film on a wafer due to a chemical reaction after decomposing a gaseous compound. In the chemical vapor deposition method, AP CVD (Atmospheric Pressure Chemical Vapor Deposition) in which chemical vapor deposition is performed at atmospheric pressure depending on the reaction pressure, reaction temperature and injected energy, and LP CVD (Low Pressure Chemical Vapor Deposition) in which chemical vapor deposition is performed at low pressure. And PE CVD (Plasma Enhanced Chemical Vapor Deposition) in which chemical vapor deposition is performed by plasma in a low pressure state.

1 and 2, the chemical vapor deposition apparatus includes: a chamber 1 providing a space for forming a metal thin film on a wafer W; A pedestal 2 on which the wafer W is loaded and supported; A shower head (3, Shower Head) providing a process gas for forming a metal thin film; An edge ring assembly (hereinafter referred to as an edge ring assembly) for controlling deposition of a thin film on an edge of the wafer W when a film is formed on the wafer W; A wafer indexing plate 5 for movement of the edge ring assembly 4; And a transfer means for moving the wafer W.

The shower head 3 is disposed corresponding to each of the pedestal 2 to supply a source gas and a reaction gas for forming a metal thin film to the upper surface of the wafer W. The supplied gas changes to a plasma state and then is deposited onto the surface of the wafer W. At this time, deposition may be controlled on the edge of the wafer W by the edge ring assembly 4.

The main purpose of chemical vapor deposition is to obtain the largest possible effective area in order to obtain the largest possible number of devices from a wafer. At this time, since the edge portion of the wafer is formed to be inclined during the deposition process, it may affect the effective area, and thus the edge ring assembly is applied to control deposition uniformity.

3 and 4, the edge ring assembly 4 is coupled to the edge ring 41 in contact with the edge of the wafer W, and the lower surface of the edge ring 41, and the edge ring 41 is It includes a plurality of wafer holders 42 that lift the wafer when lifted by the indexing plate 5.

In addition, the wafer holder 42 includes a holder body 421 having one side coupled to the outer bottom surface of the edge ring 41 and the other side facing the inner bottom surface of the edge ring 41 at an interval; Fastening means 422 for coupling the edge ring 41 and the holder body 421 while being fastened to the holder body 421 through the edge ring 41; A wheel 423 rotatably coupled to the other side of the holder body 421 and on which the edge of the wafer is seated; And it is coupled to the holder body 421 includes a clip 425 for preventing the separation of the pin 424 for supporting the wheel 423 to rotate.

5 and 6, on the other side of the holder body 421, a wheel space 421a in which the wheel 423 is located, and a pin hole through which a pin 424 for supporting the wheel 423 to rotate 421b) is formed. Both ends of the pin 424 are exposed to the surface of the holder body 421, and as the clip 425 is coupled with the holder body 421, the ends thereof support both ends of the pin 424 in the holder body 421 424 is not to be separated from the pinhole (421b).

The edge ring assembly 4 separates the edge ring 41 and the wafer holder 42, cleans them, and then combines them for reuse. At this time, the operation was cumbersome due to an increase in the process according to the separation and coupling of the holder body 421, the wheel 423 and the pin 424. In addition, as the separation and coupling of the edge ring assembly 4 is repeated a number of times, the clip 425 and the fastening means 422 are damaged. In addition, as the fastening means 422 is made of bolts such as flat head, flat head, and round head, the head of the bolt is easily damaged during the separation and coupling process as the head is exposed to the process gas.

As related prior art,

US Patent 6,143,082 (published on November 7, 2000) and

Korea Public Utility Model Publication 20-2013-0006691 (published on November 20, 2013), etc.

The above-described background technology is technical information possessed by the inventors for derivation of implementation examples or acquired during the derivation process, and is not necessarily known to be disclosed to the general public prior to filing the present invention.

The embodiment provides an edge ring assembly having improved durability due to separation and bonding used in equipment for manufacturing a semiconductor device, and a wafer holder included therein.

In order to achieve the above object, the wafer holder according to the embodiment,

It is a wafer holder of the edge ring assembly that controls the deposition of a thin film on the edge of the wafer,
A coupling part connected to the edge ring; And a holder part supporting the edge of the wafer,
The coupling portion is slide-coupled or separated from the edge ring,
The coupling portion includes a coupling body and a slide rail groove,
The slide rail groove is disposed inside the coupling body and opened to one side of the upper surface of the coupling body,
It is disposed on the coupling body may further include an insertion groove into which a movement preventing member for fixing the coupling body and the edge ring to each other is inserted.
In order to achieve the above object, the wafer holder according to the embodiment,

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It is a wafer holder of the edge ring assembly that controls the deposition of a thin film on the edge of the wafer,
A coupling part connected to the edge ring; And a holder part supporting the edge of the wafer,
The coupling portion is slide-coupled or separated from the edge ring,
The coupling portion includes a coupling body and a slide rail,
The slave rail has a protrusion disposed on the upper portion of the coupling body and coupled to the slide rail groove of the edge ring,
It is disposed on the coupling body may further include an insertion groove into which a movement preventing member for fixing the coupling body and the edge ring to each other is inserted.
In one embodiment, a motion preventing member may be further disposed in the insertion groove.
In one embodiment, the holder unit includes a wheel that is detachably coupled to the holder unit and guides the wafer to be mounted; A wheel support member that supports the wheel to rotate; And a wheel support member seating groove for fixing the wheel support member.
In one embodiment, the holder unit further includes a wheel space and a wheel support member guide groove, the wheel space is a space allowing the arrangement or movement of the wheel, and the wheel support member guide groove is connected to the wheel space The wheel support member may be moved to the wheel support member seating groove, and the wheel support member seating groove may be connected to the wheel space and limit horizontal movement of the wheel support member.
In one embodiment, the holder unit, the holder body located under the lower surface of the edge ring; And a support body protruding from the holder body in the center direction of the edge ring and supporting the edge of the wafer, wherein a thickness of one end of the support body may be thicker than a thickness of the other end of the holder body.
In one embodiment, the wheel support member guide groove is inclined from the upper surface of the other side of the holder body to the wheel support member seating groove, and the wheel support member seating groove may limit the vertical movement of the wheel support member. .
In order to achieve the above object, the edge ring according to the embodiment,
An edge ring that combines with a wafer holder to form an edge ring assembly,
The edge ring includes a ring body having a center vertically penetrating it; And a mounting piece protruding outwardly of the ring body,
The edge ring is disposed on the edge of the wafer,
The mounting piece is slide-coupled or separated from the wafer holder supporting the edge of the wafer,
The mounting piece includes i) a slide rail groove or ii) a slide rail,
The i) slide rail groove has a form coupled to the slide rail of the wafer holder,
The ii) slide rail has a form coupled to the slide rail groove of the wafer holder,
The mounting piece may further include a hole into which a motion preventing member fixing the wafer holder and the edge ring to each other is inserted.
In order to achieve the above object, the edge ring assembly according to the embodiment,
It is an edge ring assembly that controls the deposition of a thin film on the edge of the wafer,
The edge ring assembly includes an edge ring and a wafer holder,
The edge ring has a center vertically penetrating and disposed on the edge of the wafer, and includes a ring body and a mounting piece protruding outward from the ring body,
The wafer holder may include a coupling part connected to the edge ring; And a holder part supporting the edge of the wafer,
The coupling portion and the edge ring are slide-coupled or separated,
The coupling portion includes a coupling body and i) a slide rail groove or ii) a slide rail,
The i) slide rail groove is disposed inside the coupling body and opened to one side of the upper surface of the coupling body,
The ii) slide rail has a protrusion disposed on the upper portion of the coupling body and coupled to the slide rail groove of the edge ring,
Further comprising a movement preventing member for fixing the edge ring and the wafer holder to each other,
The coupling body has an insertion groove corresponding to the shape of the movement preventing member,
The mounting piece further includes a hole into which the movement preventing member is inserted,
The movement preventing member may pass through the mounting piece and be inserted into the insertion groove.

In order to achieve the above object, the method of manufacturing a wafer according to the embodiment,

A preparation step of preparing a wafer seated in the holder portion of the edge ring assembly according to the above in the inner space of the deposition apparatus; And

Including a deposition step of forming a deposition film on the wafer by injecting a reaction material and a gas into the inner space, it is possible to manufacture a wafer on which the deposition film is formed.

According to an embodiment, the coupling portion is slide-coupled with the edge ring. Accordingly, it is possible to eliminate the bolt coupling used for fixing the edge ring and the like as in the related art, thereby preventing economic loss due to damage thereof, and the coupling process between the wafer holder and the edge ring can be simplified.

In addition, according to the embodiment, the wheel support member for supporting the wheel that guides the wafer so as to be rotatable may be guided to the wheel support member seating groove through the wheel support member guide groove to be seated and fixed inside the holder body, The clip used to prevent separation of the wheel support member can be eliminated, thereby preventing economic loss due to clip breakage.

1 is a schematic diagram for explaining a chemical vapor deposition apparatus.
2 is a cross-sectional view taken along line II-II by combining FIG. 1;
Figure 3 is a bottom perspective view showing the edge ring assembly of Figure 1;
Figure 4 is an exploded view of the wafer holder of Figure 3;
5 is a cross-sectional view of FIG. 3 taken along line VV.
6 is a cross-sectional view of FIG. 5 taken along line VI-VI.
7 is a bottom perspective view of an edge ring assembly to which a wafer holder is coupled according to an embodiment.
8 is an enlarged view of the wafer holder of FIG. 7.
9 is an enlarged view of part A of FIG. 8.
10 is an exploded bottom view showing an edge ring assembly according to an embodiment.
11 is a perspective view showing the wafer holder of FIG. 10;
12 is a cross-sectional view taken along line XII-XII in a state in which the wafer holder of FIG. 10 is coupled.

Hereinafter, one or more embodiments will be described in detail with reference to the accompanying drawings so that those of ordinary skill in the art may easily implement the invention. However, implementations may be implemented in various different forms and are not limited to the embodiments described herein. The same reference numerals are assigned to similar parts throughout the specification.

In the present specification, when a certain configuration "includes" other configurations, it means that other configurations may be further included rather than excluding other configurations unless otherwise specified.

In the present specification, when a configuration is said to be "connected" with another configuration, this includes not only a case of being'directly connected' but also a case of being'connected with another configuration in between'.

In the present specification, the meaning that B is located on A means that B is located directly on A or B is located on A while another layer is located between them, and B is located so as to contact the surface of A. It is limited to that and is not interpreted.

In the present specification, the term "combination of these" included in the expression of the Makushi format refers to one or more mixtures or combinations selected from the group consisting of components described in the expression of the Makushi format, and the components It means to include one or more selected from the group consisting of.

In the present specification, the description of "A and/or B" means "A, B, or A and B".

In this specification, terms such as "first", "second", or "A" and "B" are used to distinguish the same terms from each other unless otherwise specified.

In the present specification, the singular expression is interpreted as meaning including the singular or plural, interpreted in context, unless otherwise specified.

Wafer Holder(130)

Hereinafter, a wafer holder according to an embodiment will be described with reference to FIGS. 7 to 16.

The wafer holder 130 is coupled to the edge ring 110 of the edge ring assembly that controls the deposition of the thin film on the edge of the wafer when a thin film is formed on the wafer in a chemical vapor deposition method, so that the edge ring 110 is a wafer indexing plate. When ascending by (5) (refer to Fig. 1 and Fig. 2), the wafer W (refer to Fig. 2) is lifted.

Wafer holder (130)-coupling portion (120)

The coupling part 120 includes any one of the slide rail 123 or the slide rail groove 122 and a coupling body 121 and connects the holder part 131 of the wafer holder 130 to the edge ring 110. I can.

The slide rail 123 has a predetermined length and may be coupled to the slide rail groove 122 formed on the lower surface of the mounting piece 112. When viewed from the front of the slide rail 123 may be formed in a "凸" shape.

The coupling body 121 may be formed in a block shape. A slide rail groove 122 opened to one side of the upper surface of the coupling body 121 may be disposed inside the coupling body 121. The shape of the inner circumference of the slide rail groove 122 may correspond to the shape of the slide rail 123 that may be formed on the lower surface of the mounting piece of the edge ring 110. The coupling body 121 can be coupled to the slide rail 123 through the slide rail groove 122 and can be separated. When the slide rail is coupled to the slide rail groove, the upper surface of the coupling body 121 may contact the lower surface of the mounting piece 112.

In addition, the coupling portion 120 may include a slide rail 123 extending to the rear of the coupling body 121 while protruding upward from the upper surface of the coupling body 121, as opposed to the slide rail groove 122. At this time, the slide rail 123 may be formed and inserted in a shape corresponding to the slide rail groove 122 that may be formed under the mounting piece 112 of the edge ring 110. One side of the upper surface of the coupling body 121 may also be in contact with a reinforcing rail 122a that may be formed under the mounting piece 112 of the edge ring 110, and the other side of the upper surface of the coupling body 121 is a mounting piece 112 ), you can face it at an interval.

The coupling part 120 may further include a movement preventing member 124 that fixes the coupling body 121 so as not to move while the coupling body 121 is coupled to the slide rail 123.

The motion preventing member 124 may have a predetermined length and may be formed in a form in which the cross-sectional area becomes narrower from the top to the bottom. The movement preventing member 124 may pass through the mounting piece 112 and be inserted into the coupling body 121. Accordingly, an insertion groove 121a corresponding to the shape of the movement preventing member 124 may be formed in the coupling body 121. The coupling body 121 hung on the motion preventing member 124 may be fixed without moving in a state coupled to the slide rail 123.

The motion preventing member 124 may be in the form of a pin having a cross-sectional area such as a circle or an elliptical polygon, or may include a headless bolt and a nut. In the case of including the tanning bolt and the nut, the tanning bolt may be inserted into the other side of the coupling body 121 through the mounting piece 112 to be fastened to the insertion groove 121a of the coupling body 121. In addition, the nut is positioned on the upper surface of the mounting piece 112 and may be coupled to the upper portion of the tanned bolt protruding. At this time, since only the nut is exposed to the process gas, not the whole bolt can be replaced, but only the nut can be replaced, thereby reducing maintenance costs.

In addition, at the bottom of the insertion groove 121a, the tool insertion groove 121b may penetrate through the lower surface of the coupling body 121. The diameter of the tool insertion groove 121b may be smaller than the bottom diameter of the insertion groove 121a. When the movement preventing member 124 is withdrawn from the insertion groove 121a, a tool such as a pin may be inserted into the insertion groove 121a through the tool insertion groove 121b. The tool continuously inserted into the insertion groove 121a may lift the movement preventing member 124. Accordingly, the movement preventing member 124 may be pulled out while rising from the upper surface of the mounting piece 112. When the motion preventing member 124 is withdrawn from the insertion groove 121a, the coupling body 121 may be separated from the slide rail 123.

Such a coupling portion may be made of the same material as the holder portion according to the embodiments of FIGS. 7 to 9 described below.

A holder portion 131 of the wafer holder 130 supporting the edge of the wafer W may be connected to the other side of the coupling body 121. Since the configuration and operation of the wafer holder 130 and the holder unit 131 are the same as those of the wafer holder according to the embodiments of FIGS. 7 to 16 described below, a duplicate description will be omitted, and other configurations are shown in FIG. 7. The configuration of the embodiment of FIG. 16 may be applied as it is.

Since the holder portion 131 of the wafer holder 130 is coupled to and separated from the edge ring 110 in a slide manner by the coupling portion 120, assembling property of the edge ring assemblies 100a and 100b is improved.

Since the motion-preventing member 124 penetrates the mounting piece 112 and is inserted into the insertion groove 121a, it is not exposed to the process gas, so that the motion-prevention member 124 is damaged by the process gas or the durability is reduced significantly. I can.

In the process of use, periodic cleaning of the chamber is required, and due to the nature of the edge ring assembly that repeats disassembly and assembly during the cleaning process, the durability of the motion-preventing member, etc., may be reduced, resulting in a shortened replacement cycle of consumables. In addition, damage that occurs while driving the plasma device may cause particles to be generated in the chamber, thereby reducing the product manufacturing yield. When the above motion preventing member 124 is applied, the function of the edge ring assembly can be maintained at the same level as before, and the occurrence of such problems can be reduced.

Wafer holder 130-holder part 131

The wafer holder 130 includes a holder part 131, a wheel 132, and a wheel support member 133 and improves durability due to separation and coupling.

The holder part 131 includes a holder body 131a and a support body 131b and is disposed under the lower surface of the edge ring 110 to support the wafer W and form the overall outer shape of the wafer holder.

One side of the holder body 131a having a preset length may be connected to the lower surface of the edge ring 110 through the coupling portion 120. The upper surface of the holder body 131a faces the lower surface of the edge ring 110 at an interval, and the other side of the holder body 131a may face the center of the edge ring 110.

The support body 131b may protrude toward the center of the edge ring 110 from the lower portion of the other side of the holder body 131a, and may form a step with the holder body 131a. In addition, the thickness of one end of the support body 131b may be thicker than the thickness of the other end of the holder body 131a. The step difference may form the inclined surface 131c. The lower surface of the edge of the wafer W may be placed on the upper surface of the support body 131b. In addition, a protrusion 131d for supporting the wafer W may protrude on the upper surface of the support body 131b while minimizing a contact area with the wafer W.

Meanwhile, a wheel 132 may be positioned on the other side of the holder body 131a and a portion of the support body 131b or a wheel space 131e allowing movement may be formed. The wheel space 131e may accommodate at least a portion of the wheel 132, and the support body 131b may have one end of the side on which the wheel space 131e is disposed. The wheel space 131e may be formed to penetrate up and down. Wheel support member seating grooves 131f may be formed on both sides of the inner surface of the wheel space 131e at a preset position. Wheel support member mounting groove (131f) may be formed in a curved surface concave. Further, wheel support member guide grooves 131g connecting the upper surface of the holder body 131a and the wheel support member seating groove 131f may be formed on both inner surfaces of the wheel space 131e. The wheel support member guide groove 131g may be formed in a partially concave curved surface. The upper portion of the wheel support member guide groove (131g) may include an upper groove that can be inserted corresponding to the maximum length of the wheel support member 133, and leads from the upper groove to the wheel support member seating groove (131f). A path having a narrower gap (width) than the maximum length of the wheel support member may be included. The width of the path may be 0.5 to 0.95 times, and may be 0.6 to 0.9 times the maximum length of the wheel support member. In this way, a path narrower than the maximum length of the wheel support member is formed so that the wheel 132 including the wheel support member 133 can move obliquely to the wheel support member seating groove 131f, and the seating groove 131f ) Can make it difficult to get out through the path again during chemical vapor deposition. The wheel support member guide groove and path may be formed to be inclined at a set angle. The inclination angle of the wheel support member guide groove and the path may be inclined from 5 degrees to 70 degrees downward from the top of the wheel space 131e toward the support member (x-axis direction), and from 10 degrees to 50 degrees. It can be inclined, and it can be inclined 10 degrees to 40 degrees. In addition, the path may be inclined by 5 to 50 degrees, and may be inclined by 10 to 40 degrees based on the boundary between the wheel space and the path. The wheel support member guide groove having such an inclination angle may stably guide the wheel support member and the wheel from the upper groove to the wheel support member seating groove through a path. Here, the depth of the wheel support member mounting groove 131f based on the inner surface of the wheel space 131e may be formed deeper than the depth of the wheel support member guide groove 131g. Accordingly, a stepped step 131h may be formed at the boundary between the wheel support member guide groove 131g and the wheel support member mounting groove 131f, and a stepped step may be formed at the other boundary of the wheel support member mounting groove 131f. have. Accordingly, the wheel support member seating groove (131f) may limit movement of the wheel support member 133 and the wheel 131 in the horizontal direction (x-axis direction) and vertical direction (z-axis direction), and the vertical direction is the wheel space ( A direction toward the edge ring 110 at 132 and a horizontal direction may be a direction orthogonal to the vertical direction.

The wafer holder 130 and the edge ring 110 may include alumina and sapphire.

The density of the wafer holder 130 and the edge ring 110 may be 3 g/cm ^{3 or} more and 5 g/cm ³ or less.

The bending strength of the wafer holder 130 and the edge ring 110 may be 280 MPa or more and 400 MPa or less.

The compressive strength of the wafer holder 130 and the edge ring 110 may be 1400 MPa or more and 2300 MPa or less.

At room temperature to 800°C of the wafer holder 130 and the edge ring 110, the coefficient of thermal expansion may be 5×10 ^-6 /°C or higher, and 10×10 ^-6 /°C or lower.

The thermal shock resistance of the wafer holder 130 and the edge ring 110 may be 250 ΔT or more and 350 ΔT or less. The thermal shock resistance may be the maximum allowable temperature difference at which no crack occurs from room temperature.

The maximum usable temperature of the wafer holder 130 and the edge ring 110 may be 1500 °C or less.

The wafer holder 130 and the edge ring 110 having such physical properties may exhibit good durability and reliability in a chemical vapor deposition method.

The wheel 132 is located in the wheel space 131e, and may include a wheel support member 133 that supports the wheel to rotate in the wheel space.

The radius of the wheel 132 may be 0.6 to 1.8 times the thickness of one end of the support body 131b, and may be 0.8 to 1.6 times. The wheel 132 having such a thickness ratio may be stably inserted into the wheel space 131e of the support body 131b.

The wheel support member 133 may be formed integrally with the wheel 132 or as a separate member, and when formed integrally with the wheel 132 may have a protrusion formed at both ends of the center of the wheel. When formed separately from the wheel 132, a shaft-shaped wheel support member 133 may be applied as an example, and the wheel support member 133 may penetrate the center of the wheel.

When the wheel support member 133 is inserted into the wheel 132, both ends of the wheel support member may protrude to the outside of the wheel. When an external force is applied to the wheel 132, the wheel 132 may rotate along the circumferential direction of the wheel support member 133.

Both ends of the wheel support member 133 may be formed in a curved surface and may be inserted obliquely through the wheel support member guide groove (131g), and move along the path of the wheel support member guide groove, and the wheel support member mounting groove (131f) ) Can be seated and fixed.

Both ends of the wheel support member 133 may be fixed to the inside of the holder body 131a without being exposed to the outside of the holder body 131a. In addition, the wheel support member 133 does not fall out from the wheel support member seating groove 131f to the wheel support member guide groove 131g by the stepped jaw 131h. Accordingly, loss or loss caused by the wheel support member 133 being separated from the holder body 131a can be prevented.

On the other hand, when the wheel support member 133 is located in the wheel support member mounting groove (131f), a portion of the outer circumference of the wheel 132 is on the other side of the upper surface of the holder body (131a), the inclined surface (131c) to the outside of the support body (131b). It can be exposed. The outer periphery of the exposed wheel 132 may be in contact with the wafer W located on the support body 131b. In addition, the wheel 132 guides the edge of the wafer W to be seated on the support body 131b when the wafer W is inserted between the support body 131b and the lower surface of the edge ring 110.

The wheel 132 and the wheel support member 133 may include alumina and sapphire.

The density of the wheel 132 and the wheel support member 133 may be 3 g/cm ^{3 or} more and 5 g/cm ³ or less.

The hardness of the wheel 132 and the wheel support member 133 may be 1500 kg/mm ^{2 or} more and 2500 kg/mm ² or less according to a 9 Mohs std Knoop hardness measurement test.

The compressive strength of the wheel 132 and the wheel support member 133 may be 1.5 GPa or more and 2.5 GPa or less.

Tensile strength of the wheel 132 and the wheel support member 133 may be 250 MPa or more and 450 MPa or less.

The coefficient of thermal expansion of the wheel 132 and the wheel support member 133 may be 4.0×10 ^-6 /°C or more at 1000°C, and may be 5.0×10 ^-6 /°C or less.

The maximum usable temperature of the wheel 132 and the wheel support member 133 may be 1800 °C or less.

The wheel 132 and the wheel support member 133 having such physical properties may exhibit good durability and reliability in a chemical vapor deposition method.

Since the wheel support member 133 is seated and fixed in the wheel support member seating groove (131f) through the wheel support member guide groove (131g), the assembly process is reduced compared to the conventional structure in which the wheel support member is fixed with a clip. It is easy to separate and combine.

The wheel support member 133 that supports the wheel 132 that guides the wafer (W) to be rotated is guided to the wheel support member seating groove (131f) through the wheel support member guide groove (131g) and seated, while the holder body It can be fixed inside of (131a). Accordingly, as in the prior art, the clip used to prevent separation of the wheel support member can be eliminated, thereby preventing economic loss due to clip breakage.

Edge Ring(110)

The edge ring 110 includes a ring body 111 and a mounting piece 112 and may control deposition of a thin film on the edge of the wafer.

The ring body 111 has a center vertically penetrating it and is located in a hole of the wafer indexing plate 5 (see Figs. 1 and 2), and a support 20 on which a wafer W is loaded and supported, Figs. 1 and 2 Reference) can face the edge.

The mounting piece 112 may protrude outward from the ring body 111. A plurality of mounting pieces 112 may be formed at intervals along the outer circumference of the ring body 111, and 2 to 8 pieces may be formed. The interval between the adjacent mounting pieces 112 may be equal intervals based on the circumferential direction of the ring body 111. The mounting piece 112 may be placed in a mounting groove connected to the hole of the wafer indexing plate 5 while the ring body 111 is located in the hole of the wafer indexing plate 5. By the mounting piece 112, the edge ring 110 is positioned in the hole of the wafer indexing plate 5 to face the edge of the wafer W located below.

The lower portion of the mounting piece 112 of the edge ring 110 may include a slide rail 123 or a slide rail groove 122, and when a slide rail groove is included, a reinforcing rail reinforcing the periphery of the slide rail groove ( 122a). At this time, the upper portion of the coupling body 121 of the coupling portion 120 may be formed with a slide rail groove 122 or a slide rail 123 so that the upper portion of the coupling body 121 corresponds to the lower portion of the mounting piece 112 to be slidably coupled.

Since the material of the edge ring 110 is the same as that of the edge ring 110 described above, a duplicate description will be omitted.

Edge ring assembly (100a, 100b)

Next, an edge ring assembly according to an embodiment will be described with reference to FIGS. 7 to 16.

The edge ring assembly is also called a Minimum Overlapped Exclusion Ring (MOER) depending on the handling company, and it can control the deposition of a thin film on the edge of the wafer when forming a thin film on the wafer in the chemical vapor deposition method.

7 to 16, the edge ring assembly 100a, 100b according to the embodiment includes an edge ring 110, a coupling portion 120, a wafer holder 130, and a holder portion 131, and has durability. It is improved so that it is not damaged when separated and combined for cleaning, inspection, etc.

Since the configuration and operation of the edge ring 110 is the same as that of the edge ring 110 according to the above-described embodiment, a duplicate description will be omitted.

Since the configuration and operation of the coupling portion 120 is the same as that of the coupling portion 120 according to the above-described embodiment, a redundant description will be omitted.

Since the holder portion 131 of the wafer holder 130 is coupled to and separated from the edge ring 110 in a slide manner by the coupling portion 120, assembling property of the edge ring assemblies 100a and 100b is improved. In addition, since the motion-preventing member 124 penetrates the mounting piece 112 and is inserted into the insertion groove 121a, the motion-prevention member 124 is not damaged by the process gas because it is not exposed to the process gas.

Wafer manufacturing method

Next, a method of manufacturing a wafer to which the edge ring assembly according to the embodiment is applied will be described.

A method of manufacturing a wafer according to an embodiment,

A preparation step of preparing a wafer seated on the support body 131b in the holder portion 131 of the edge ring assembly 100a, 100b in the inner space of the deposition apparatus; And

Including a deposition step of forming a deposition film on the wafer by injecting a reaction material and a gas into the inner space, it is possible to manufacture a wafer on which the deposition film is formed.

In the preparation step, the edge (edge) of the wafer may be seated on the protrusion 131d of the lower support body 131b of the edge ring 110 as shown in FIGS. 1, 2 and 9.

Wafer mounting in the preparation step is performed by moving the wafer into the space between the edge ring 110 and the holder 130 in the edge ring assemblies 100a and 100b, and then the wafer through the wheel 132 of the holder 130. It can be guided to be seated on the protrusion (131d) of the edge holder support body.

The deposition apparatus in the preparation step may be a chemical vapor deposition apparatus.

The deposition step may be activated in a state in which a reaction material and gas injected into the internal space are supplied with energy in the form of heat, light, and electric field, and are excited to cause a chemical reaction. The activated materials may be physically deposited on a wafer, or may form a chemical bond with atoms on the wafer or deposited atoms to form a deposition film. At this time, the reaction near the edge of the wafer can be controlled by the influence of the edge ring 110, etc., and activated materials move along the wafer surface in some cases, and find an optimal position to form a stable continuous net structure. In this process, atoms or by-products that are incompletely bonded may be detached and exhausted to the outside by an exhaust pump or the like.

The conventional edge ring assembly 4 shown in FIGS. 4 to 6 is due to an increase in the amount of work due to the separation and coupling of the pins 424 in the process of separating and cleaning the edge ring assembly 4 after the deposition process, etc. There is a cumbersome point, there is a problem that the clip 425, the fastening means 422, etc. are easily damaged. In addition, the head of the bolt 422 such as a round head may be exposed to the process gas, and there is a concern that the head of the bolt may be easily damaged during the separation and coupling process.

The edge ring assembly 100a, 100b according to the embodiment is a process of applying a slide method and a movement preventing member 124 in the process of connecting the wafer holder 130 to the edge ring 110, and fixing the wheel 132 It is fixed through the guide groove (131g) and the path of the wheel support member rather than the clip, and is easy to reuse by designing structures such as the stepped step (131h) and the path width of the guide groove (131g) to prevent the wheel from leaving during the process. The film was stably formed on the wafer.

Although the preferred embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements by those skilled in the art using the basic concept of the present invention defined in the following claims are also present. It belongs to the scope of rights of

100a, 100b: edge ring assembly 110: edge ring
111: ring body 112: mounting piece
120: coupling portion 121: coupling body
121a: insertion groove 121b: tool insertion groove
122: slide rail groove 122a: reinforcement rail
123: slide rail 124: motion preventing member
130: wafer holder 131: holder portion
131a: holder body 131b: support body
131c: slope 131d: protrusion
131e: wheel space 131f: wheel support member seating groove
131g: wheel support member guide groove 131h: stepped
132: wheel 133: wheel support member

Claims (11)

It is a wafer holder of the edge ring assembly that controls the deposition of a thin film on the edge of the wafer,
A coupling part connected to the edge ring; And a holder part supporting the edge of the wafer,
The coupling portion is slide-coupled or separated from the edge ring,
The coupling portion includes a coupling body and a slide rail groove,
The slide rail groove is disposed inside the coupling body and opened to one side of the upper surface of the coupling body,
It is disposed on the coupling body further comprises an insertion groove into which a movement preventing member for fixing the coupling body and the edge ring to each other is inserted,
The holder part,
A wheel detachably coupled to the holder unit and guiding the wafer to be seated;
A wheel support member that supports the wheel to rotate; And
It includes a wheel support member seating groove for fixing the wheel support member,
The holder portion further includes a wheel space and a wheel support member guide groove,
The wheel space is a space that allows the arrangement or movement of the wheel,
The wheel support member guide groove is connected to the wheel space and allows movement of the wheel support member to the wheel support member seating groove,
The wheel support member seating groove is connected to the wheel space and restricts horizontal movement of the wheel support member,
The upper portion of the wheel support member guide groove includes an upper groove that can be inserted corresponding to the maximum length of the wheel support member,
The wheel support member guide groove includes a path extending from the upper groove to the wheel support member seating groove and having a width narrower than the maximum length of the wheel support member.
It is a wafer holder of the edge ring assembly that controls the deposition of a thin film on the edge of the wafer,
A coupling part connected to the edge ring; And a holder part supporting the edge of the wafer,
The coupling portion is slide-coupled or separated from the edge ring,
The coupling portion includes a coupling body and a slide rail,
The slide rail has a protrusion disposed on the upper portion of the coupling body and coupled to the slide rail groove of the edge ring,
It is disposed on the coupling body further comprises an insertion groove into which a movement preventing member for fixing the coupling body and the edge ring to each other is inserted,
The holder part,
A wheel detachably coupled to the holder unit and guiding the wafer to be seated;
A wheel support member that supports the wheel to rotate; And
It includes a wheel support member seating groove for fixing the wheel support member,
The holder portion further includes a wheel space and a wheel support member guide groove,
The wheel space is a space that allows the arrangement or movement of the wheel,
The wheel support member guide groove is connected to the wheel space and allows movement of the wheel support member to the wheel support member seating groove,
The wheel support member seating groove is connected to the wheel space and restricts horizontal movement of the wheel support member,
The upper portion of the wheel support member guide groove includes an upper groove that can be inserted corresponding to the maximum length of the wheel support member,
The wheel support member guide groove includes a path extending from the upper groove to the wheel support member seating groove and having a width narrower than the maximum length of the wheel support member.
delete The method according to claim 1 or 2,
In the insertion groove, a motion preventing member is further disposed.
delete delete The method of claim 1,
The holder part,
A holder body located under the lower surface of the edge ring; And
Includes; a support body protruding from the holder body in the center direction of the edge ring and supporting the edge of the wafer,
The thickness of one end of the support body is thicker than the thickness of the other end of the holder body, the wafer holder.
The method of claim 7,
The wheel support member guide groove is inclined from the upper surface of the other side of the holder body to the wheel support member seating groove,
The wheel support member seating groove restricts vertical movement of the wheel support member.
delete It is an edge ring assembly that controls the deposition of a thin film on the edge of the wafer,
The edge ring assembly includes an edge ring and a wafer holder,
The edge ring has a center vertically penetrating and disposed on the edge of the wafer, and includes a ring body and a mounting piece protruding outward from the ring body,
The wafer holder may include a coupling part connected to the edge ring; And a holder part supporting the edge of the wafer,
The coupling portion and the edge ring are slide-coupled or separated,
The coupling portion includes a coupling body and i) a slide rail groove or ii) a slide rail,
The i) slide rail groove is disposed inside the coupling body and opened to one side of the upper surface of the coupling body,
The ii) slide rail has a protrusion disposed on the upper portion of the coupling body and coupled to the slide rail groove of the edge ring,
Further comprising a motion preventing member for fixing the edge ring and the wafer holder to each other,
The coupling body has an insertion groove corresponding to the shape of the movement preventing member,
The mounting piece further includes a hole into which the movement preventing member is inserted,
The movement preventing member is inserted into the insertion groove through the mounting piece,
A wheel detachably coupled to the holder to guide the wafer to be seated; And
Including; a wheel support member for supporting the wheel to rotate,
The holder part includes a wheel support member seating groove for fixing both ends of the wheel support member,
The holder portion further includes a wheel space and a wheel support member guide groove,
The wheel space is a space that allows the arrangement or movement of the wheel,
The wheel support member guide groove is connected to the wheel space and allows movement of the wheel support member to the wheel support member seating groove,
The wheel support member seating groove is connected to the wheel space and restricts horizontal movement of the wheel support member,
The upper portion of the wheel support member guide groove includes an upper groove that can be inserted corresponding to the maximum length of the wheel support member,
The wheel support member guide groove extends from the upper groove to the wheel support member seating groove and includes a path having a width narrower than the maximum length of the wheel support member.
A preparation step of preparing a wafer seated in the holder portion of the edge ring assembly according to claim 10 in an internal space of the deposition apparatus; And
Including a deposition step of forming a deposition film on the wafer by injecting a reaction material and a gas into the inner space; manufacturing a wafer on which the deposition film is formed.

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