KR102197127B1 - Four contact connector for testing semiconductor - Google Patents

Four contact connector for testing semiconductor Download PDF

Info

Publication number
KR102197127B1
KR102197127B1 KR1020190083220A KR20190083220A KR102197127B1 KR 102197127 B1 KR102197127 B1 KR 102197127B1 KR 1020190083220 A KR1020190083220 A KR 1020190083220A KR 20190083220 A KR20190083220 A KR 20190083220A KR 102197127 B1 KR102197127 B1 KR 102197127B1
Authority
KR
South Korea
Prior art keywords
contact
sides
contact portions
pin
support
Prior art date
Application number
KR1020190083220A
Other languages
Korean (ko)
Inventor
신용선
백충국
Original Assignee
캠아이티(주)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 캠아이티(주) filed Critical 캠아이티(주)
Priority to KR1020190083220A priority Critical patent/KR102197127B1/en
Application granted granted Critical
Publication of KR102197127B1 publication Critical patent/KR102197127B1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
    • H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
    • H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means

Abstract

According to a connector used for a board for testing a semiconductor, the present invention provides a four-contact connector for testing the semiconductor including: a support portion provided inside the board; first and second front contact portions formed on both sides of the support portion and touched by elastically pressing both sides of the pin inserted into the support portion; third and fourth rear contact portions respectively formed on both sides of the support portion at a position opposite to the first and second front contact portions and touched by elastically pressing both sides of the pins passing through the first and second front contact portions; and a PCB terminal contact portion extending from the end of the support portion and extending to the outside of the board. The present invention can stably fix pins by implementing the four-contact connector.

Description

반도체 테스트 보드용 4접점 커넥터{Four contact connector for testing semiconductor}Four contact connector for testing semiconductor}

반도체 테스트 보드용 4접점 커넥터에 관한 것으로, 구체적으로 반도체 테스트를 하기 위한 보드에 4접점으로 핀을 접점하여 핀의 고정구조를 개선한 반도체 테스트 보드용 4접점 커넥터에 관한 기술이다.It relates to a four-contact connector for a semiconductor test board, and specifically relates to a four-contact connector for a semiconductor test board in which a pin is contacted with four points on a board for semiconductor testing to improve the fixing structure of the pin.

반도체, 메모리, 비메모리 분야에서 사용되는 모든 IC(Integrated Circuit)은 제품으로 장착되기 전에 AC/DC 기능 테스트를 거쳐야 하고, 테스트 기능 수행을 위한 보드가 필요하다. 보드 내부에는 커넥터가 형성되어 PCB 접촉단자와 핀을 전기적으로 연결시켜 주게 된다.All ICs (Integrated Circuits) used in semiconductor, memory, and non-memory fields must undergo an AC/DC function test before being installed as a product, and a board is required to perform the test function. A connector is formed inside the board to electrically connect the PCB contact terminal and the pin.

종래에는 보드에 삽입된 핀을 양측에서 2접점 하여 고정하는 구조를 통상적으로 많이 사용해 왔다.Conventionally, a structure in which a pin inserted into a board is fixed by making two contacts from both sides has been commonly used.

그러나, 종래의 2접점 구조는 삽입되는 핀의 양측에서 고정하는데 핀의 길이가 길어 고정구조가 취약하며, 핀을 단단히 고정하기 위해 가압력이 높아야 하나 가압력이 높은 경우에는 핀에 걸리는 접기 접촉 저항값이 높아지는 문제점이 있다.However, the conventional two-contact structure is fixed on both sides of the inserted pin, and the pin is long and the fixing structure is weak.In order to securely fix the pin, the pressing force must be high, but if the pressing force is high, the folding contact resistance value applied to the pin is increased. There is an increasing problem.

KR20-0311472 Y1 "반도체 패키지 테스트용 기판 커넥터"KR20-0311472 Y1 "Board connector for semiconductor package test"

상기와 같은 문제를 해결하기 위하여, 본 발명은 4접점 커넥터를 구현하여 안정적으로 핀을 고정할 수 있는 반도체 테스트 보드용 4접점 커넥터를 제공하는데 그 목적이 있다.In order to solve the above problems, an object of the present invention is to provide a 4 contact connector for a semiconductor test board capable of stably fixing pins by implementing a 4 contact connector.

상기와 같은 과제를 해결하기 위하여 본 발명은 반도체 테스트를 위한 보드에 사용되는 커넥터에 있어서, 보드 내부에 구비되는 받침부; 상기 받침부의 양측에 각각 형성되어 상기 받침부로 삽입되는 핀의 양측을 탄성적으로 가압하여 접점되는 제1,2전방접점부; 상기 제1,2전방접점부와 대향되는 위치에서 상기 받침부의 양측에 각각 형성되어 상기 제1,2전방접점부를 통과한 핀의 양측을 탄성적으로 가압하여 접점되는 제3,4후방접점부; 및 상기 받침부의 단부에서 연장되고 상기 보드 외부로 연장되는 PCB 단자 접촉부;가 포함되어 이루어지는 것을 특징으로 하는 반도체 테스트 보드용 4접점 커넥터를 제공한다.In order to solve the above problems, the present invention provides a connector used in a board for semiconductor testing, comprising: a support part provided inside the board; First and second front contact points formed on both sides of the support part and contacted by elastically pressing both sides of the pin inserted into the support part; Third and fourth rear contact portions respectively formed on both sides of the support portion at a position opposite to the first and second front contact portions to elastically press both sides of the pins passing through the first and second front contact portions to make contact; And a PCB terminal contact part extending from an end of the support part and extending to the outside of the board. It provides a four-contact connector for a semiconductor test board, characterized in that it comprises.

상기 제1,2전방접점부는, 상기 받침부 측면에 수직방향으로 형성되는 고정부와, 상기 고정부 단부에서 상기 받침부 길이방향을 따라 길게 형성되고 단부로 갈수록 상호 간격이 좁아지게 연장되어 상기 핀의 양측을 탄성적으로 가압하는 접촉부로 구성되는 것을 특징으로 한다.The first and second front contact portions include a fixing part formed in a vertical direction on a side surface of the supporting part, and an end of the fixing part extending along the length direction of the supporting part and extending to a narrow distance toward the end of the pin. It characterized in that it consists of a contact portion for elastically pressing both sides of the.

상기 제3,4후방접점부는, 상기 받침부 측면에 수직방향으로 형성되는 고정부와, 상기 고정부 단부에서 상기 받침부 길이방향으로 따라 길게 형성되고 단부로 갈수록 상호 간격이 좁아지게 연장되어 상기 핀의 양측을 탄성적으로 가압하는 접촉부로 구성되는 것을 특징으로 한다.The third and fourth rear contact portions include a fixing portion formed in a vertical direction on a side surface of the support portion, and an end portion of the fixing portion extending in a lengthwise direction of the support portion and extending to a narrower distance toward the end portion. It characterized in that it consists of a contact portion for elastically pressing both sides of the.

상기 제3,4후방접점부에는, 상기 PCB 단자 접촉부 방향으로 절곡 되어 상기 제3,4후방접점부의 강성을 보강하고 상기 제3,4후방접점부를 통과한 핀의 단부와 접촉되어 상기 핀의 삽입 깊이를 제한되게 하는 한 쌍의 격납부가 형성되는 것을 특징으로 한다.The third and fourth rear contact portions are bent in the direction of the PCB terminal contact portion to reinforce the rigidity of the third and fourth rear contact portions, and are in contact with the ends of the pins passing through the third and fourth rear contact portions to insert the pin. It is characterized in that a pair of containment portions to limit the depth are formed.

상기 PCB 단자 접촉부는, 상기 받침부에서 상향 경사지게 절곡되어 상기 격납부의 하측면을 받쳐 변형을 방지하는 경사부와, 상기 경사부에 연장되어 PCB 단자에 접촉하는 핀부로 구성되는 것을 특징으로 한다.The PCB terminal contact portion is formed of an inclined portion that is bent upwardly inclined at the receiving portion to support a lower surface of the storage portion to prevent deformation, and a pin portion extending to the inclined portion to contact the PCB terminal.

상기의 해결 수단에 의하면 다음과 같은 효과를 기대할 수 있다.According to the above solution, the following effects can be expected.

먼저. 전방접촉부와 후방접촉부가 양쪽에서 4접점으로 핀을 고정할 수 있어 안정적인 고정이 가능하며, 접촉부의 가압이 분산되므로 상대물 체결 횟수에 대한 내구성이 높아지며 장시간 사용에도 전기 접촉 저항값이 안정적이다.first. Since the front and rear contact portions can fix the pin with 4 contacts on both sides, stable fixing is possible, and since the pressure of the contact portion is distributed, the durability against the number of times of fastening the counterpart is increased, and the electrical contact resistance value is stable even when used for a long time.

또한, 전방접촉부와 후방접촉부가 각각 독립적으로 형성되어 있으므로 탄성에 의해 빠르게 복원 가능하도록 구성되어 복원력이 약해지는 현상을 방지할 수 있다.In addition, since the front contact portion and the rear contact portion are each independently formed, it is configured to be quickly restored by elasticity, thereby preventing a phenomenon that the restoring force is weakened.

그리고, 반도체 솔더링(soldring)시 후방접촉부의 단턱부에 의해 격납구조를 형성하여 솔더 웨이브(solder wave)의 용융된 납성분이 커넥터 접촉부분으로 솔더(solder)가 침누하는 것을 방지할 수 있다.In addition, the storage structure is formed by the stepped portion of the rear contact portion during semiconductor soldering, so that the molten lead component of the solder wave can prevent the solder from infiltrating the connector contact portion.

도 1은 본 발명의 실시예에 따른 반도체 테스트 보드용 4접점 커넥터의 전체 사시도.
도 2는 도 1의 측면도.
도 3은 본 발명의 실시예에 따른 반도체 테스트 보드용 4접점 커넥터의 결합도.1 is an overall perspective view of a four-contact connector for a semiconductor test board according to an embodiment of the present invention.
Figure 2 is a side view of Figure 1;
3 is a combination of a four-contact connector for a semiconductor test board according to an embodiment of the present invention.

이하에서는 첨부된 도면을 참조하여 본 발명의 실시예를 상세하게 설명하고자 한다. 하기 설명 및 첨부 도면에 나타난 바는 본 발명의 전반적인 이해를 위해 제시된 것이므로 본 발명의 기술적 범위가 그것들에 한정되는 것은 아니다. 그리고 본 발명의 요지를 불필요하게 흐릴 수 있는 공지 구성 및 기능에 대한 상세한 설명은 생략하기로 한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Bars shown in the following description and accompanying drawings are presented for a general understanding of the present invention, so the technical scope of the present invention is not limited thereto. In addition, detailed descriptions of known configurations and functions that may unnecessarily obscure the subject matter of the present invention will be omitted.

도 1은 본 발명의 실시예에 따른 반도체 테스트 보드용 4접점 커넥터의 전체 사시도이고, 도 2는 도 1의 측면도이다.1 is an overall perspective view of a four-contact connector for a semiconductor test board according to an embodiment of the present invention, and FIG. 2 is a side view of FIG. 1.

도 1을 참조하면, 본 발명은 받침부(100), 제1,2전방접점부(200,300), 제3,4후방점접부(400,500) 및 PCB 단자 접촉부(600)를 포함하여 이루어진다.Referring to FIG. 1, the present invention includes a support part 100, first and second front contact parts 200 and 300, third and fourth rear contact parts 400 and 500, and a PCB terminal contact part 600.

상기 받침부(100)는 상기 보드 내부의 공간(커넥터가 설치되는 공간)의 일면에 위치하게 되는 플레이트 형상으로 형성된다.The support part 100 is formed in a plate shape positioned on one surface of a space inside the board (a space in which a connector is installed).

상기 제1,2전방접점부(200,300)는 핀을 탄성적으로 접점하기 위한 구성이다.The first and second front contact portions 200 and 300 are configured to elastically contact the pins.

상기 제1,2전방접점부(200,300)는 상기 받침부(100)의 양측에 각각 연장 형성되어 상기 받침부(100)로 삽입되는 핀의 양측을 탄성적으로 가압하여 접점되게 된다.The first and second front contact portions 200 and 300 are formed to extend on both sides of the support portion 100 to be contacted by elastically pressing both sides of the pins inserted into the support portion 100.

구체적으로 상기 제1,2전방접점부(200,300)는 그 구성을 상기 받침부 측면에 수직방향으로 형성되는 고정부(220,320)와, 상기 고정부(220,320) 단부에서 상기 받침부(100) 길이방향을 따라 길게 형성되고 단부로 갈수록 상호 간격이 좁아지게 연장되어 상기 핀의 양측을 탄성적으로 가압하는 접촉부(240,340)로 구성되는 것을 특징으로 한다.Specifically, the first and second front contact portions 200 and 300 have a configuration of the fixing portions 220 and 320 formed in a vertical direction on the side of the support, and the support 100 at the ends of the fixing portions 220 and 320 in the longitudinal direction. It is formed along the length and extends to narrow the gap toward the end, characterized in that it consists of a contact portion (240, 340) elastically pressing both sides of the pin.

여기서 상기 접촉부(240,340)는 일단이 상기 고정부(220,320)에만 고정되어 있어 타단부측으로 갈수록 유연하게 되며 탄성력이 극대화 된다. 도 2의 측면도를 보면 고정부(220)의 접촉부(240)가 고정되고 받침부(100)와 이격되어 있어 양측면으로 쉽게 휘어질 수 있게 된다.Here, since the contact portions 240 and 340 have one end fixed only to the fixing portions 220 and 320, they become more flexible toward the other end and the elastic force is maximized. In the side view of FIG. 2, the contact part 240 of the fixing part 220 is fixed and spaced apart from the support part 100 so that it can be easily bent to both sides.

상기 제3,4후방접점부(400,500)는 상기 제1,2전방접점부(200,300)를 통과한 핀을 탄성적을 접점하기 위한 구성이다.The third and fourth rear contact portions 400 and 500 are configured to elastically contact the pins that have passed through the first and second front contact portions 200 and 300.

상기 제3,4후방접점부(400,500)는 상기 제1,2전방접점부(200,300)와 대향되는 위치에서 상기 받침부(100)의 양측에 각각 형성되어 상기 제1,2전방접점부(200,300)를 통과한 핀의 양측을 탄성적으로 가압하여 접점된다.The third and fourth rear contact portions 400 and 500 are formed on both sides of the support portion 100 at positions opposite to the first and second front contact portions 200 and 300, respectively, and the first and second front contact portions 200 and 300 ), it is contacted by elastically pressing both sides of the pin passing through.

구체적으로 상기 제3,4후방접점부(400.500)는 상기 받침부(100) 측면에 수직방향으로 형성되는 고정부(420,520)와, 상기 고정부(420,520) 단부에서 상기 받침부(100) 길이방향으로 따라 길게 형성되고 단부로 갈수록 상호 간격이 좁아지게 연장되어 상기 핀의 양측을 탄성적으로 가압하는 접촉부(440,540)로 구성되는 것을 특징으로 한다.Specifically, the third and fourth rear contact portions 400.500 are fixed portions 420 and 520 formed in a vertical direction on the side of the support portion 100, and at the ends of the fixing portions 420 and 520, the support portion 100 is in a longitudinal direction. It is formed along the length and extends to narrow the gap toward the end, and is characterized in that it consists of contact portions 440 and 540 elastically pressing both sides of the pin.

여기서 상기 접촉부(440,540)는 일단이 상기 고정부(420,520)에만 고정되어 있어 타단부측으로 갈수록 유연하게 되며 탄성력이 극대화 된다. 그리고, 도시된 바오 같이 상기 접촉부(440,540)의 최종단부는 양측으로 벌어지게 형성되어 상기 제1,2전방접점부(200,300)를 통과한 핀의 삽입이 용이하게 하는 것이 바람직하다.Here, since the contact portions 440 and 540 have one end fixed only to the fixing portions 420 and 520, they become more flexible toward the other end and the elastic force is maximized. In addition, it is preferable that the final ends of the contact portions 440 and 540 are formed to be widened to both sides to facilitate insertion of the pins passing through the first and second front contact portions 200 and 300 as shown.

한편, 상기 제3,4후방접점부(400,500)에는, 상기 PCB 단자 접촉부(600) 방향으로 절곡 되어 상기 제3,4후방접점부(400,500)의 강성을 보강하고 상기 제3,4후방접점부(400,500)를 통과한 핀의 단부와 접촉되어 상기 핀의 삽입 깊이를 제한되게 하는 한 쌍의 격납부(460,560)가 형성되는 것을 특징으로 한다. 여기서 격납부(460,560)는 상호 마주보는 방향으로 절곡되게 된다.Meanwhile, the third and fourth rear contact portions 400 and 500 are bent in the direction of the PCB terminal contact portion 600 to reinforce the rigidity of the third and fourth rear contact portions 400 and 500, and the third and fourth rear contact portions It is characterized in that a pair of storage portions 460 and 560 are formed to limit the insertion depth of the pin by contacting the end of the pin passing through (400,500). Here, the storage portions 460 and 560 are bent in a direction facing each other.

여기서 상기의 격납부(460,560)는 상기 PCB 단자 접촉부(600)와 격납시켜 반도체 솔더링(soldring)시 용융된 납성분이 커넥터 내부로 침투되는 것을 방지할 수 있게 된다. 또한, 상기 격납부(460,560)는 제3,4후방접점부(400,500)에 연장되게 형성되어 그 강성을 보강할 수도 있는 효과가 있다.Here, the storage portions 460 and 560 are stored with the PCB terminal contact portion 600 to prevent the molten lead component from penetrating into the connector during semiconductor soldering. In addition, the containment portions 460 and 560 are formed to extend to the third and fourth rear contact portions 400 and 500 to have an effect of reinforcing their rigidity.

상기 PCB 단자 접촉부(600)는 커넥터에서 PCB 단자와 전기적으로 연결되는 구성이다.The PCB terminal contact part 600 is configured to be electrically connected to the PCB terminal in the connector.

상기 PCB 단자 접촉부(600)는 상기 받침부(100)의 단부에서 연장되고 상기 보드 외부로 노출되도록 연장된다.The PCB terminal contact part 600 extends from an end of the support part 100 and extends to be exposed to the outside of the board.

상세하게 상기 PCB 단자 접촉부(600)는 상기 받침부에서 상향 경사지게 절곡되어 상기 격납부(460,560)의 하측면을 받쳐 변형을 방지하는 경사부(620)와, 상기 경사부(620)에 연장되어 PCB 단자에 접촉하는 핀부(640)로 구성되는 것을 특징으로 한다.In detail, the PCB terminal contact part 600 is bent upwardly inclined at the support part to support the lower side of the storage parts 460 and 560 to prevent deformation, and the inclined part 620 extends to the PCB It is characterized in that it is composed of a pin portion 640 in contact with the terminal.

여기서 경사부(620)는 60도 가량 경사지게 형성됨으로써 핀부(640)가 커넥터 의 중심부에서 연장될 수 있게 되는 효과도 있게 된다.Here, the inclined portion 620 is formed to be inclined by about 60 degrees, so that the pin portion 640 can extend from the center of the connector.

도 3은 본 발명의 실시예에 따른 반도체 테스트 보드용 4접점 커넥터의 결합도이다.3 is a combination diagram of a four-contact connector for a semiconductor test board according to an embodiment of the present invention.

도 3을 참조하면, 보드(S)에 격벽을 통하여 수십개의 커넥터가 설치되게 되고, 본 발명에서는 제1,2전방접점부(200,300)가 상호 마주보는 위치에서 탄성에 의해 핀(P)의 전방 양측 2점을 접점하고, 제3,4전방접점부(400,500)가 핀(P)의 후방 양측 2점을 접점하여 총 4개소에서 접점하게 되어 안정적인 접점이 가능하다.3, dozens of connectors are installed on the board (S) through a partition wall, and in the present invention, the front of the pin (P) by elasticity at the position where the first and second front contact portions (200, 300) face each other. Two points on both sides are contacted, and the third and fourth front contact points (400,500) contact two points on both sides of the rear of the pin (P) to make contact at a total of four points, thereby enabling a stable contact point.

이상과 같이 본 발명은 반도체 테스트 보드용 4접점 커넥터를 기본적인 기술적인 사상으로 하고 있음을 알 수 있으며, 이와 같은 본 발명의 기본적인 사상의 범주내에서, 당업계의 통상의 지식을 가진 자에게 있어서는 다른 많은 변형이 가능함은 물론이다.As described above, it can be seen that the present invention uses a four-contact connector for a semiconductor test board as a basic technical idea, and within the scope of the basic idea of the present invention, for those of ordinary skill in the art Of course many variations are possible.

100: 받침부
200: 제1전방접점부
300: 제2전방접점부
400: 제3후방접점부
500: 제4후방접점부
600: PCB 단자 접촉부
220,320,420,520: 고정부
240,340,440,540: 접촉부
460,560: 격납부
620: 경사부
640: 핀부100: base
200: first front contact portion
300: second front contact portion
400: third rear contact portion
500: 4th rear contact part
600: PCB terminal contact
220,320,420,520: fixed part
240,340,440,540: contact
460,560: containment
620: slope
640: pin part

Claims (5)

반도체 테스트를 위한 보드에 사용되는 커넥터에 있어서,
보드 내부에 구비되는 받침부;
상기 받침부의 양측에 각각 형성되어 상기 받침부로 삽입되는 핀의 양측을 탄성적으로 가압하여 접점되는 제1,2전방접점부;
상기 제1,2전방접점부와 대향되는 위치에서 상기 받침부의 양측에 각각 형성되어 상기 제1,2전방접점부를 통과한 핀의 양측을 탄성적으로 가압하여 접점되는 제3,4후방접점부; 및
상기 받침부의 단부에서 연장되고 상기 보드 외부로 연장되는 PCB 단자 접촉부;가 포함되어 이루어지는 것을 특징으로 하되,
상기 제1,2전방접점부는,
상기 받침부 측면에 수직방향으로 형성되는 고정부와, 상기 고정부 단부에서 상기 받침부 길이방향을 따라 길게 형성되고 단부로 갈수록 상호 간격이 좁아지게 연장되어 상기 핀의 양측을 탄성적으로 가압하는 접촉부로 구성되고,
상기 제3,4후방접점부는,
상기 받침부 측면에 수직방향으로 형성되는 고정부와, 상기 고정부 단부에서 상기 받침부 길이방향으로 따라 길게 형성되고 단부로 갈수록 상호 간격이 좁아지게 연장되어 상기 핀의 양측을 탄성적으로 가압하는 접촉부로 구성되는 것을 특징으로 하는 반도체 테스트 보드용 4접점 커넥터.In the connector used in the board for semiconductor testing,
A support part provided inside the board;
First and second front contact portions respectively formed on both sides of the support portion and contacted by elastically pressing both sides of the pin inserted into the support portion;
Third and fourth rear contact portions respectively formed on both sides of the support portion at a position opposite to the first and second front contact portions to elastically press both sides of the pins passing through the first and second front contact portions to make contact; And
It characterized in that it comprises a; PCB terminal contact portion extending from the end of the support and extending to the outside of the board,
The first and second front contact portions,
A fixing part formed in a vertical direction on the side of the support part, and a contact part that is formed longer along the length direction of the support part from an end of the fixing part and extends to narrow the distance toward the end to elastically press both sides of the pin Consists of,
The third and fourth rear contact portions,
A fixing part formed in a vertical direction on the side of the supporting part, and a contact part that is formed long from an end of the fixing part in the longitudinal direction of the supporting part and extends so as to have a narrower distance toward the end to elastically press both sides of the pin 4 contact connector for a semiconductor test board, characterized in that consisting of. 삭제delete 삭제delete 제1항에 있어서,
상기 제3,4후방접점부에는,
상기 PCB 단자 접촉부 방향으로 절곡 되어 상기 제3,4후방접점부의 강성을 보강하고 상기 제3,4후방접점부를 통과한 핀의 단부와 접촉되어 상기 핀의 삽입 깊이를 제한되게 하는 한 쌍의 격납부가 형성되는 것을 특징으로 하는 반도체 테스트 보드용 4접점 커넥터.The method of claim 1,
In the third and fourth rear contact portions,
A pair of storage portions that are bent in the direction of the PCB terminal contact portion to reinforce the rigidity of the third and fourth rear contact portions and contact the end of the pin passing through the third and fourth rear contact portions to limit the insertion depth of the pin. 4 contact connector for a semiconductor test board, characterized in that formed. 제4항에 있어서,
상기 PCB 단자 접촉부는,
상기 받침부에서 상향 경사지게 절곡되어 상기 격납부의 하측면을 받쳐 변형을 방지하는 경사부와, 상기 경사부에 연장되어 PCB 단자에 접촉하는 핀부로 구성되는 것을 특징으로 하는 반도체 테스트 보드용 4접점 커넥터.The method of claim 4,
The PCB terminal contact part,
A four-contact connector for a semiconductor test board, comprising: an inclined portion bent upwardly inclined at the support portion to support the lower side of the storage portion to prevent deformation; and a pin portion extending in the inclined portion to contact the PCB terminal. .
KR1020190083220A 2019-07-10 2019-07-10 Four contact connector for testing semiconductor KR102197127B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020190083220A KR102197127B1 (en) 2019-07-10 2019-07-10 Four contact connector for testing semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020190083220A KR102197127B1 (en) 2019-07-10 2019-07-10 Four contact connector for testing semiconductor

Publications (1)

Publication Number Publication Date
KR102197127B1 true KR102197127B1 (en) 2020-12-30

Family

ID=74087721

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020190083220A KR102197127B1 (en) 2019-07-10 2019-07-10 Four contact connector for testing semiconductor

Country Status (1)

Country Link
KR (1) KR102197127B1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220140145A (en) 2021-04-09 2022-10-18 캠아이티(주) Multi-contact connector for semiconductor test board
KR102558681B1 (en) 2023-01-16 2023-07-26 부천공업(주) Wafer for 4-contact housing

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200311472Y1 (en) 2003-01-27 2003-05-01 (주)티에스이 Board connector for testing semiconductor package
KR200423590Y1 (en) * 2006-05-30 2006-08-08 한국단자공업 주식회사 Terminal for lamp holder
KR100642312B1 (en) * 2005-02-14 2006-11-03 한국단자공업 주식회사 A Lamp Terminal For Automobile
KR100744997B1 (en) * 2006-05-24 2007-08-02 김대수 Socket terminal of bga(ball grid array) test socket
KR20090011368U (en) * 2008-05-02 2009-11-05 주이-시앙 린 Terminal structure of female connector
KR20160095927A (en) * 2015-02-04 2016-08-12 주식회사 신화콘텍 Plug terminal for Connector
JP6372208B2 (en) * 2014-07-11 2018-08-15 山一電機株式会社 Board connector

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200311472Y1 (en) 2003-01-27 2003-05-01 (주)티에스이 Board connector for testing semiconductor package
KR100642312B1 (en) * 2005-02-14 2006-11-03 한국단자공업 주식회사 A Lamp Terminal For Automobile
KR100744997B1 (en) * 2006-05-24 2007-08-02 김대수 Socket terminal of bga(ball grid array) test socket
KR200423590Y1 (en) * 2006-05-30 2006-08-08 한국단자공업 주식회사 Terminal for lamp holder
KR20090011368U (en) * 2008-05-02 2009-11-05 주이-시앙 린 Terminal structure of female connector
JP6372208B2 (en) * 2014-07-11 2018-08-15 山一電機株式会社 Board connector
KR20160095927A (en) * 2015-02-04 2016-08-12 주식회사 신화콘텍 Plug terminal for Connector
KR101680273B1 (en) * 2015-02-04 2016-11-29 주식회사 신화콘텍 Plug terminal for Connector

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220140145A (en) 2021-04-09 2022-10-18 캠아이티(주) Multi-contact connector for semiconductor test board
KR102534174B1 (en) * 2021-04-09 2023-05-26 캠아이티(주) Multi-contact connector for semiconductor test board
KR102558681B1 (en) 2023-01-16 2023-07-26 부천공업(주) Wafer for 4-contact housing

Similar Documents

Publication Publication Date Title
US6645012B2 (en) Card edge connector comprising a housing and a plurality of contacts
KR20040024458A (en) Lga socket contact
KR20010007118A (en) Ic socket
KR102197127B1 (en) Four contact connector for testing semiconductor
KR102197313B1 (en) Probe pin and test socket using the same
US11081823B2 (en) Conductive terminal and electrical connector
KR102534174B1 (en) Multi-contact connector for semiconductor test board
US6942509B2 (en) ESD type connector
US4334727A (en) Connector for a leadless electronic package
US6923662B2 (en) Electrical connector
KR960027076A (en) Electrical connector
JP2000048880A (en) Card connector assembly
US10622744B2 (en) Multipole connector
KR102191759B1 (en) Probe pin and test socket using the same
JP2003123923A (en) Socket of semiconductor package and contact
JPS58176883A (en) Connector
KR101026992B1 (en) test socket for memory module
KR102644964B1 (en) Socket connector
KR100324007B1 (en) Mutual Contact Device For Module Devices
KR100400686B1 (en) Socket for handler
KR200169516Y1 (en) Contact pin of semiconductor package testing socket
JP2004327103A (en) Socket for electric component
CN101403764A (en) The connecting device for burn in testing equipment
KR0121048Y1 (en) Connector housing
KR20090071815A (en) Test socket for memory module

Legal Events

Date Code Title Description
E701 Decision to grant or registration of patent right
GRNT Written decision to grant