KR102182483B1 - 로봇 조립체들, 기판 프로세싱 장치, 및 전자 디바이스 제조에서 기판들을 운송하기 위한 방법들 - Google Patents

로봇 조립체들, 기판 프로세싱 장치, 및 전자 디바이스 제조에서 기판들을 운송하기 위한 방법들 Download PDF

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KR102182483B1
KR102182483B1 KR1020187014572A KR20187014572A KR102182483B1 KR 102182483 B1 KR102182483 B1 KR 102182483B1 KR 1020187014572 A KR1020187014572 A KR 1020187014572A KR 20187014572 A KR20187014572 A KR 20187014572A KR 102182483 B1 KR102182483 B1 KR 102182483B1
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South Korea
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assembly
idler
drive
robot
coupled
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Korean (ko)
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KR20180061393A (ko
Inventor
폴 제트. 워스
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어플라이드 머티어리얼스, 인코포레이티드
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J5/00—Manipulators mounted on wheels or on carriages
    • B25J5/02—Manipulators mounted on wheels or on carriages travelling along a guideway
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3202—Mechanical details, e.g. rollers or belts
    • H01L21/67173—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/10—Program-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/104—Program-controlled manipulators characterised by positioning means for manipulator elements with cables, chains or ribbons
    • B25J9/1045—Program-controlled manipulators characterised by positioning means for manipulator elements with cables, chains or ribbons comprising tensioning means
    • H01L21/67766—
    • H01L21/67778—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3214—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicle
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
KR1020187014572A 2015-10-23 2016-09-28 로봇 조립체들, 기판 프로세싱 장치, 및 전자 디바이스 제조에서 기판들을 운송하기 위한 방법들 Expired - Fee Related KR102182483B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/921,806 US9799544B2 (en) 2015-10-23 2015-10-23 Robot assemblies, substrate processing apparatus, and methods for transporting substrates in electronic device manufacturing
US14/921,806 2015-10-23
PCT/US2016/054093 WO2017069920A1 (en) 2015-10-23 2016-09-28 Robot assemblies, substrate processing apparatus, and methods for transporting substrates in electronic device manufacturing

Publications (2)

Publication Number Publication Date
KR20180061393A KR20180061393A (ko) 2018-06-07
KR102182483B1 true KR102182483B1 (ko) 2020-11-24

Family

ID=58557609

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187014572A Expired - Fee Related KR102182483B1 (ko) 2015-10-23 2016-09-28 로봇 조립체들, 기판 프로세싱 장치, 및 전자 디바이스 제조에서 기판들을 운송하기 위한 방법들

Country Status (6)

Country Link
US (1) US9799544B2 (https=)
JP (1) JP6860562B2 (https=)
KR (1) KR102182483B1 (https=)
CN (1) CN108028215B (https=)
TW (1) TWI704038B (https=)
WO (1) WO2017069920A1 (https=)

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US10043689B2 (en) * 2015-06-05 2018-08-07 Hirata Corporation Chamber apparatus and processing system
TWI724971B (zh) 2016-06-28 2021-04-11 美商應用材料股份有限公司 包括間隔上臂與交錯腕部的雙機器人以及包括該者之系統及方法
US10453725B2 (en) 2017-09-19 2019-10-22 Applied Materials, Inc. Dual-blade robot including vertically offset horizontally overlapping frog-leg linkages and systems and methods including same
US10943805B2 (en) 2018-05-18 2021-03-09 Applied Materials, Inc. Multi-blade robot apparatus, electronic device manufacturing apparatus, and methods adapted to transport multiple substrates in electronic device manufacturing
US11850742B2 (en) 2019-06-07 2023-12-26 Applied Materials, Inc. Dual robot including splayed end effectors and systems and methods including same
KR102211252B1 (ko) * 2019-06-26 2021-02-04 세메스 주식회사 기판 처리 장치
US11565402B2 (en) 2020-03-09 2023-01-31 Applied Materials, Inc. Substrate transfer devices, systems and methods of use thereof
CN113675119A (zh) * 2020-05-15 2021-11-19 拓荆科技股份有限公司 基片传输模块及半导体处理系统
WO2022197996A1 (en) * 2021-03-18 2022-09-22 Persimmon Technologies Corporation Distributed-architecture robot with multiple linkages
CN118952179B (zh) * 2024-08-27 2025-05-02 中科芯微智能装备(沈阳)有限公司 传动装置、真空机械手及真空机械手的传动方法

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KR101190872B1 (ko) 2008-02-26 2012-10-12 삼성테크윈 주식회사 기판 이송장치

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JP2003209156A (ja) * 2002-01-17 2003-07-25 Juki Corp 基板搬送装置
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JP4824645B2 (ja) 2007-08-03 2011-11-30 株式会社アルバック 基板搬送装置
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Also Published As

Publication number Publication date
JP2018535548A (ja) 2018-11-29
TWI704038B (zh) 2020-09-11
TW201725099A (zh) 2017-07-16
US9799544B2 (en) 2017-10-24
US20170117171A1 (en) 2017-04-27
KR20180061393A (ko) 2018-06-07
CN108028215A (zh) 2018-05-11
WO2017069920A1 (en) 2017-04-27
JP6860562B2 (ja) 2021-04-14
CN108028215B (zh) 2022-07-29

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