KR102175209B1 - Inner Diameter Chip Detecting System - Google Patents

Abstract

The present invention, a jig frame for detachably supporting an object to be inspected having an O-ring groove on one side; A detection operation unit provided to be movable between a detection position that is a position close to the O-ring groove and a standby position that is separated from the detection position to wait; A turntable coupled to the other side of the jig frame so as to rotate the detection operation unit; A grounding part electrically connected to the test object and the detection operation part so as to be mutually insulated; And a control unit that detects whether the ground unit is electrically connected while the detection operation unit rotates along the O-ring groove at the detection position.
Accordingly, in the present invention, it is possible to simply and conveniently inspect and confirm the presence of chips due to processing after processing of an inner diameter portion that is difficult to check with the naked eye. It is possible to provide an inner diameter chip detection system and a detection method thereof capable of preventing defects such as leakage oil that may occur in advance.

Description

Inner Diameter Chip Detecting System

The present invention relates to an inner diameter chip detection system and a detection method thereof, and more specifically, an inner diameter chip detection system having an improved structure to inspect and confirm the presence or absence of chips generated by processing in an inner diameter processing portion to which an O-ring is coupled, and It relates to the detection method.

There are various kinds of machines that are helpful in human life or in industrial facilities.

Among these machines, automobiles, which are closely related to real life, consist of many components.

The components that make up the machine have a wide variety of functions.

This includes a function of mutually fastening each mechanical part such as a bolt and a nut, a function of transmitting power such as a chain and a belt, and a function of maintaining airtightness such as an O-ring or packing.

In order to maintain this function, each machine part needs to have a screw machined in order for the bolt to be coupled, a sprocket needs to be machined for the chain to be coupled, and an O-ring groove for the O-ring to be joined.

After such processing is performed, inspection and confirmation of whether or not the processing area is correctly processed should not cause problems in the post process or after assembly.

Here, for example, after processing the O-ring groove to which the airtight means including the O-ring is coupled, it is desirable to determine whether chips generated during processing are present in the O-ring groove. The reason is that if there is a chip generated during processing inside the O-ring groove, the O-ring bonded to the O-ring groove is damaged by the chip due to the presence of the chip, and the original function is broken or damaged by continuous or repeated pressure applied. Because you lose.

In particular, the O-ring groove processed on the inner diameter side of the O-ring grooves is processed to be concave on the inside, so it is difficult for an inspector or confirmer to grasp with the naked eye, so it is very desirable to use a special jig.

[references]

Unexamined Patent Publication No. 10-2008-0068984 (published on 25 July 2008)

Registered Patent Publication No. 10-1033208 (2011.05.06. Announcement)

It is an object of the present invention to provide an inner diameter chip detection system and a detection method that can more effectively and conveniently inspect and confirm the presence of chips due to processing after processing of an inner diameter portion that is difficult to check with the naked eye.

In addition, another object of the present invention is to provide an inner diameter chip detection system and a detection method that can prevent in advance defects such as leaks that may occur due to damage to the combined oil due to the presence of chips in the processing area after assembly. .

In addition, another object of the present invention is to provide an inner diameter chip detection system and a detection method thereof capable of improving the reliability of a product.

An object of the present invention is a jig frame for detachably supporting an object to be inspected having an O-ring groove on one side; A detection operation unit provided to be movable between a detection position that is a position close to the O-ring groove and a standby position that is separated from the detection position and waits; A turntable coupled to the other side of the jig frame so as to rotate the detection operation unit; A grounding part electrically connected to the test object and the detection operation part so as to be mutually insulated; And a control unit that detects whether the ground unit is electrically connected while the detection operation unit rotates along the O-ring groove at the detection position, and is achieved by the inner diameter chip detection system.

In addition, it is preferable that the O-ring groove is formed inside the object to be inspected, and the control unit determines that foreign matter including chips generated during processing exists inside the O-ring groove when the ground portion is energized.

In addition, it is preferable that the object to be inspected includes parts for a vehicle transmission, and the material of the object to be inspected includes aluminum.

In addition, it is preferable that the control unit generates an alarm signal including sound and light when the ground unit is energized.

On the other hand, the object of the present invention, and the process of detachably seating a test object having an O-ring groove on one side of the jig frame; Coupling a turntable to the other side of the jig frame so as to be rotatable at the detection position between a detection position that is a position close to the O-ring groove and a standby position moving from the detection position to wait; Electrically connecting a ground part to the test object and the detection operation part so as to be mutually insulated; A process in which the detection operation part rotates along the O-ring groove at the detection position and detects whether the ground part is electrically connected. It is also achieved by the inner diameter chip detection method.

Accordingly, according to the present invention, it is possible to provide an inner diameter chip detection system and a detection method thereof that can more effectively and conveniently inspect and confirm the presence of chips due to processing after processing of an inner diameter portion that is difficult to visually check.

In addition, it is possible to provide an inner diameter chip detection system and a detection method thereof capable of preventing in advance defects such as leakage that may occur due to damage to the bonded oil due to the presence of chips in the processing area after assembly.

In addition, it is possible to provide an inner diameter chip detection system and a detection method thereof capable of improving the reliability of a product.

1 is a schematic diagram of an inner diameter chip detection system according to an embodiment of the present invention,
2A to 2C are a conceptual diagram and a partially enlarged cross-sectional view illustrating an operation process of the inner diameter chip detection system;
3 is a flow chart for explaining a method for detecting an inner diameter chip.

An inner diameter chip detection system 1000 (hereinafter referred to as a'chip detection system') and a method thereof according to an embodiment of the present invention will be described in detail below with reference to FIGS. 1 to 3.

1 is a schematic diagram of an inner diameter chip detection system according to an embodiment of the present invention, FIGS. 2A to 2C are conceptual diagrams and partially enlarged cross-sectional views illustrating an operation process of an inner diameter chip detection system, and FIG. 3 is a method for detecting an inner diameter chip. This is a flow chart for explanation.

The chip detection system 1000 includes a jig frame 1330 for detachably supporting the test object 100 having an O-ring groove 110 on one side, as shown in FIG. 1; A detection position that is a position close to the O-ring groove 110 (refer to position "B" in Fig. 2A, Fig. 2B and Fig. 1) and a standby position separated from the detecting position (refer to position "A" in Fig. 2B) A detection operation unit 1350 provided to be movable therebetween; A turntable 1351 coupled to the other side of the jig frame 1330 so as to rotate the detection operation unit 1350 at the detection position; A grounding part 1370 electrically connected to the test object 100 and the detection operation part 1350 so as to be mutually insulated; It is preferable to include a control unit 1500 which detects whether the ground unit 1370 is electrically connected while the detection operation unit 1350 rotates along the O-ring groove at the detection position.

The jig frame 1330 is a structure supporting the configuration of the present invention, and may be made of a variety of materials or bent a plate, and attachable and detachable parts for an automobile automatic transmission as shown in FIG. 1, which is an embodiment of the present invention. It is preferable to have the test subject seating portion (1333). The test subject seating unit 1333 further includes a coupling means such as a chuck, not shown, to firmly fix the test subject 100 so that the detection operation unit 1350 does not move in the process of detecting the state of the O-ring groove 110 can do.

Although the subject 100 of the present invention is a component for an automatic transmission for a vehicle, it is not limited to this embodiment. It is preferable that the test object 100 is made of a material capable of passing electricity, and the material of the test object 100 may pass electricity such as iron or aluminum.

For example, the O-ring groove 110 of the object to be detected 100 is formed on the inside while having a particularly complex structure than that formed on the outside of the object to be inspected 100, which can be easily checked with the naked eye. have. However, the O-ring groove 110 does not necessarily include only those formed on the inner side, but may include those formed on the outside, and in this case, the structure of the pin operation unit 1351 to be described later may be modified.

Here, when chips generated during processing are present in the O-ring groove 110, the original function of maintaining airtightness by causing breakage or damage due to the pressure applied to the O-ring coupled to the O-ring groove 110 and repeated pressing force, etc. There is a high risk of loss. Accordingly, by deriving the present invention, such concerns can be prevented in advance.

The insulating part 1380 functions to prevent the respective ground parts 1373 and 1375 (refer to'Ground A'and'Ground B'in FIGS. 1 to 2B) from being electrically connected to each other, and includes various insulating materials. For example, MC nylon is an example. Unlike the present embodiment, the position of the insulating part 1380 may be changed within a range that does not impair the technical spirit of the present invention.

The detection operation unit 1350 moves the detection pin 1355 and the detection pin 1355 between the standby position and the detection position in a shape corresponding to the shape of the O-ring groove 110 at the end. For example, it includes a pin operation unit 1353 such as an air chuck that is operated by supply of compressed air. The pin operation unit 1352 may apply various known means such as a hydraulic type, a linear guide, and a linear motor type capable of moving the detection pin 1355 between the standby position and the detection position, as well as a means operated by compressed air. I can.

When the detection pin 1355 is in the standby position, the user can attach and detach the test object 100 to the test object seating part 1333 of the jig frame, and when the detection pin 1355 is in the detection position, the detection pin 1355 ) Is rotated to determine whether a chip or the like exists in the O-ring groove 110.

Here, the shape of the groove proximity arm 1355a is provided in a shape corresponding to the concave O-ring groove 110, and it is preferable that the gap with the O-ring groove 110 rotates and exists within a set tolerance.

The turntable 1351 rotates the detection operation unit 1350 with the detection pin 1355 located at the detection position. The turntable 1351 may include various types of known rotating means including a rotary actuator.

Accordingly, as the detection pin 1355 rotates along the O-ring groove 110, the presence of foreign substances such as chips in the O-ring groove 110 is determined by energization of the ground part 1370 or a change in the set current value, as described later. can do.

The ground part 1370 is a means for determining whether there is a material electrically communicating inside the O-ring groove 110, for example, a chip generated during processing, and a frame grounding part electrically connected to the test object 100 ( 1375) and an arm grounding portion 1373 electrically connected to the detection pin 1355.

That is, it is preferable that the ground part 1370 is in a disconnected state without being electrically connected due to the gap between the O-ring groove 110 and the groove proximity arm 1355a.

Here, if necessary, when a chip smaller than the gap exists in the gap between the O-ring groove 110 and the groove proximity arm 1355a in the controller 1500, the controller 1500 may set a fine current to flow. . In this case, not only chips larger than the interval but also chips slightly smaller than the interval can be detected. In addition, in some cases, when the subject 100 is a cast product, a cavity existing in the O-ring groove 110 may also be detected. For example, when a current is supplied to the ground part 1370 and the detection pin 1355 is rotated so that a current set in the gap between the O-ring grooves 110 is generated, the O-ring when there is a cavity in the O-ring groove 110 Since there is an area farther than the distance between the groove 110 and the detection pin 1355, the control unit 1500 can detect that a smaller current flows in this area than the normal case, and the control unit 1500 can detect the cavity. It is determined that there is, and the result can be informed by an alarm signal or the like.

That is, it is preferable that the controller 1500 determines whether or not a foreign substance including a chip exists in the O-ring groove 110 by determining whether the ground portions 1370 are electrically connected to each other or out of a set amount of current.

The control unit 1500 is a means for supplying power (not shown), and when the user presses the operation button after seating the test object 100, the detection pin 1355 automatically moves from the standby position to the detection position, and then the turntable turns 1 An operation button (not shown) capable of rotating and placing the detection pin 1355 in its original position, a means for informing the detection result (refer to the'good product' and'defective' indications in FIGS. 1 to 2B), In case of failure, an alarm means (not shown) that notifies the user with light, sound, etc., operates the detection operation unit 1350, and the turntable 1351, and based on the result detected by the ground unit 1370, this is made into a related configuration. It is preferable to include a means for transmitting and receiving and a PLC that controls automatic and manual operation, and the like.

Of course, in this process, the process of moving the detection pin 1355 and the process of rotating the turntable 1351 by the user may be manually controlled by the controller 1500, respectively.

The chip detection system 1000 according to the present invention having such a configuration will be described below with reference to FIGS. 2A to 3.

First, when power is supplied to the control unit 1500 from the outside, power is supplied to the control unit 1500, the ground unit 1370, the detection operation unit 1350, and the turntable 1351 to be ready for operation.

The user mounts the test subject 100 on the test subject seating portion 1333 of the jig frame 1330 (S120) and is firmly coupled to the jig frame 1330.

Of course, in this process, the test object 100 and the detection pin 1355 mounted on the jig frame 1330 are grounded (see “Ground A” and “Ground B”) to form a ground part 1370 (S110).

Next, the user operates the pin operation unit 1352 to place the detection pin 1355 in the standby position (refer to the position'A' in FIG. 2A) and the detection position close to the O-ring groove 110 (position'B' in FIG. 2A). Reference) (S130). By this movement, the groove proximity arm 1355a provided in a shape corresponding to the O-ring groove 110 may be positioned with a mutually set interval (see FIG. 2C) therebetween.

Next, the detection pin 1355 of the pin operation unit 1352 is rotated using the turntable 1351 (S140). As the groove proximity arm 1355a rotates along the O-ring groove 110 by the rotation of the turntable 1351, it is determined whether or not a chip is present in the O-ring groove 110 (see'Ground A') and a frame. The controller 1500 detects and determines whether the ground parts 1375 (refer to “Ground B”) are electrically connected to each other (S150).

In step S150, if it is determined that there are no separate chips or foreign substances in the O-ring groove 110 (S153) (see (1) in FIG. 2C, there is no electrical connection to the ground part 1370), the user inspects It is determined in the next process whether or not the set number of objects to be tested 100 has been completed (S180). If the set number is not satisfied (S183), another test object is seated on the test subject seating unit 1333, and when the set number is satisfied (S185), the operation is terminated.

On the other hand, if it is determined that there is a separate chip or foreign material in the O-ring groove 110 in step S150 (S153) (see (2) in FIG. 2C, there is an electrical connection of the ground part 1370), the user The test object 100 may be separated from the jig frame 1330 and corrected to remove the chip (S160) and reconfirmed. If there is a chip or the like, the alarm means of the control unit 1500 is activated so that the user can easily know this.

Of course, in this process, after the turntable 1351 rotates once and the detection pin 1355 rotates along the O-ring groove 110, after a set time elapses, the detection pin 1355 moves from the detection position to the standby position (S170). ).

Here, since there are two detection pins 1355, the detection pin 1355 will rotate along the entire O-ring groove 110 even if the turntable 1351 is rotated 1/2, so the turntable 1351 is 1/ You may only need to do two rounds.

After the rotation of the turntable 1351 is completed, the detection pin 1355 is moved from the detection position to the standby position (S170).

The test subject 100 newly fixed to the test subject seating unit 1333 undergoes the above-described processes such as S130, S140, S150, S170, S180 (or S160) repeatedly.

Accordingly, according to the present invention, it is possible to provide an inner diameter chip detection system and a detection method thereof that can more effectively and conveniently inspect and confirm the presence of chips due to processing after processing of an inner diameter portion that is difficult to visually check.

In addition, it is possible to provide an inner diameter chip detection system and a detection method thereof capable of preventing in advance defects such as leakage that may occur due to damage to the bonded oil due to the presence of chips in the processing area after assembly.

In addition, it is possible to provide an inner diameter chip detection system and a detection method thereof capable of improving the reliability of a product.

Here, although one embodiment of the present invention has been illustrated and described, it will be appreciated that those of ordinary skill in the technical field to which the present invention belongs can modify the present embodiment without departing from the principles or spirit of the present invention. will be. The scope of the invention will be determined by the appended claims and their equivalents.

1000: chip detection system 1330: jig frame
1333: subject seating portion 1350: detection operation portion
1351: turntable 1353: pin operating part
1355: detection pin 1355a: groove proximity arm
1370: ground part 1373: arm ground part
1375: frame ground part 1380: insulation part
1500: control unit
100: subject 110: O-ring groove
130: chip

Claims (5)

A jig frame for detachably supporting an object to be inspected having an O-ring groove therein;
It is possible to move between a detection position, which is a position extending radially from the center axis of the test object and proximate to the O-ring groove, and a standby position which is separated from the detection position and waits by being constricted in a radial direction from the central axis of the test object, A detection operation unit located inside the jig frame and having a groove proximity arm having a shape corresponding to the O-ring groove;
A turntable coupled to the other side of the jig frame so as to rotate the detection operation unit;
A grounding part electrically connected to the test object and the detection operation part so as to be mutually insulated;
Including; wherein the detection operation unit rotates along the O-ring groove at the detection position to detect whether the ground portion is electrically connected;
In the detection position, even if the groove proximity arm rotates along the inside of the O-ring groove, when there is no foreign matter including chips generated when the O-ring groove is processed, the inside of the O-ring groove and the groove proximity arm are positioned so that the grounding portion is not energized. And, when the ground portion is energized while the groove proximity arm rotates at the detection position, the control unit determines that the foreign material is present. delete The method of claim 1,
The test object includes parts for a transmission of an automobile, and the material of the test object includes aluminum. The method of claim 1 or 3,
The control unit generates an alarm signal including sound and light when the ground unit is energized. delete

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