KR102175007B1 - Organic light emitting diode display device and method for manufacturing the same - Google Patents

Abstract

An organic light emitting display device according to an aspect of the present invention includes a substrate; A pixel electrode positioned on the substrate; An organic emission layer positioned on the pixel electrode; And a common electrode including a metal layer on the organic light-emitting layer, a conductive organic layer on the metal layer, and a first metal oxide layer on the conductive organic layer, and a region of the surface of the metal layer exposed to foreign substances. And an insulating portion formed in the insulating portion, wherein the insulating portion insulates the pixel electrode and the common electrode.

Description

Organic light emitting diode display device and method for manufacturing the same}

The present invention relates to an organic light emitting display device and a manufacturing method thereof, and more particularly, to an active organic light emitting display device and a manufacturing method thereof.

Recently, with the development of the information society, the development of light and thin flat panel displays is actively progressing. Representative flat panel displays include a liquid crystal display and an organic light emitting diode display device.

The organic light emitting display device is thinner, has a lower power consumption, and has an advantage of realizing clearer image quality because it does not require a separate light source such as a backlight used in a liquid crystal display device.

Among such organic light emitting display devices, an active organic light emitting display device in which pixels are independently driven generally includes a plurality of pixels including three subpixels of red, green, and blue.

Each subpixel is defined by crossing a gate line and a data line, and is independently driven by a driving circuit including a separate thin film transistor (TFT).

Each pixel includes an organic light emitting device driven by the driving circuit. The organic light-emitting device includes a pixel electrode and a common electrode, and includes an organic emission layer between the two electrodes. However, during the process of forming the organic light emitting device, foreign substances such as particles having a diameter larger than the thickness of the pixel electrode, the common electrode, or the organic light emitting layer may be generated.

The pixel electrode may be patterned and formed through a photolithography process, and foreign matter may remain after the pixel electrode is formed.

Foreign substances are highly likely to occur during the process of forming a thin film that is commonly formed on a substrate, and an organic light emitting layer and a common electrode are typical thin films formed in common on a substrate.

In particular, the organic light emitting layer can be formed by vacuum deposition using a shadow mask, laser transfer, thermal transfer, and screen printing, and residues after the process are Remaining defects may occur. In addition, in the top emission type organic light emitting display device, light is emitted through a common electrode. Since the luminance at the center of the screen may decrease as the resistance increases, the screen is It may include auxiliary electrodes connected to the common electrode at various places in the center.

In order to connect the common electrode and the auxiliary electrode, a metal oxide layer having a large step coverage may be used, and the metal oxide layer may penetrate between foreign substances, thereby further increasing the possibility of a short circuit between the pixel electrode and the common electrode.

1 is a cross-sectional view illustrating an organic light emitting display device in which a defect occurs due to a foreign material. In FIG. 1, the foreign material is shown as a particle P.

Referring to FIG. 1, the pixel electrode 120, the organic emission layer 150, and the common electrode 160 formed on the substrate 110 may generate particles P during the formation process, and the diameter of the particles P When the thickness is greater than the thickness of the pixel electrode 120, the organic emission layer 150, and the common electrode 160, the pixel electrode 120 and the common electrode 160 are connected to each other, thereby causing a short circuit. Here, the common electrode 160 may include a metal layer 161 and a conductive organic layer 162. In FIG. 1, reference numeral "121" is an auxiliary electrode, "130" is a bank layer, and "140" is a partition layer.

When a short occurs between the pixel electrode 120 and the common electrode 160, since no current flows through the organic emission layer 150, the entire pixel cannot emit light. Accordingly, a pixel in which a short circuit occurs between the pixel electrode 120 and the common electrode 160 may become a defective pixel that does not emit light.

Organic light emitting device manufacturing equipment (Patent Application No. 10-2011-0056070)

An object of the present invention is to provide an organic light emitting display device capable of reducing the occurrence of defective pixels in order to solve the above-described problems.

An organic light emitting display device according to an aspect of the present invention for achieving the above object includes: a substrate; A pixel electrode positioned on the substrate; An organic emission layer positioned on the pixel electrode; And a common electrode including a metal layer on the organic light-emitting layer, a conductive organic layer on the metal layer, and a first metal oxide layer on the conductive organic layer, and a region of the surface of the metal layer exposed to foreign substances. And an insulating portion formed in the insulating portion, wherein the insulating portion insulates the pixel electrode and the common electrode.

In order to achieve the above object, a method of manufacturing an organic light emitting display device according to an aspect of the present invention includes forming a pixel electrode on a substrate; Forming an organic emission layer on the pixel electrode; Forming a common electrode including a metal layer on the organic emission layer, a conductive organic layer on the metal layer, and a first metal oxide layer on the organic layer; And forming an insulating portion formed in a region of the surface of the metal layer exposed to foreign substances.

According to the present invention, even if foreign substances such as particles are generated during the process of the organic light emitting device including the organic light emitting layer, by forming an insulating part between the pixel electrode and the common electrode to prevent short circuit, only the area where the foreign material has occurred is darkened, and the remaining areas of the pixel Has the effect of being able to drive normally.

In addition, according to the present invention, as described above, only the area where the particles are generated is darkened, and the remaining areas of the pixels can be normally driven, thereby reducing the occurrence of defective pixels.

In addition, according to the present invention, by forming a conductive organic layer between the organic light emitting layer and the common electrode to prevent the first metal oxide layer included in the common electrode from being connected to the pixel electrode, short circuit between the pixel electrode and the first metal oxide layer There is an effect that can prevent.

The effects of the present invention are not limited to the above-mentioned effects, and other effects that are not mentioned will be clearly understood by those skilled in the art from the following description.

Since the contents of the invention described in the problems to be solved above, the problem solving means, and effects do not specify essential features of the claims, the scope of the claims is not limited by the matters described in the contents of the invention.

1 is a cross-sectional view illustrating an organic light emitting display device in which a defect occurs due to a foreign substance.
2 is a cross-sectional view illustrating an organic light emitting display device according to an embodiment of the present invention.
3 is a cross-sectional view of an organic light emitting display device according to another exemplary embodiment of the present invention.
4A to 4E are cross-sectional views illustrating a method of manufacturing an organic light emitting display device according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 is a cross-sectional view illustrating an organic light emitting display device according to an embodiment of the present invention. As shown in FIG. 2, the organic light emitting display device according to an embodiment of the present invention includes a substrate 210, a pixel electrode 220, a common electrode 260, a pixel electrode 220, and a common electrode 260. ) And an organic emission layer 250 positioned between.

First, the substrate 210 may include any one of glass, plastic, and metal. The substrate 210 may be implemented as a flexible substrate that includes any one of the above materials and can be bent.

The plastic is polyethersulphone (PES), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (Polyethyelenen Napthalate; PEN), polyethylene terephthalate (Polyethyelene Terepthalate; PET). , Polyphenylene Sulfide (PPS), Polyallylate, Polyimide, Polycarbonate (PC), Cellulose Triacetate (TAC), Cellulose Acetate Propionate (CAP) It can be any one of.

Next, the pixel electrode 220 is positioned on the substrate 210. In the present invention, the pixel electrode 220 may be an anode electrode, and indium, silver (Ag), zinc, tin, silver zinc oxide (AZO), gallium zinc oxide (GZO), zinc It may be formed as a single layer or multiple layers including at least one of oxide (ZnO), indium tin oxide (ITO), indium zinc oxide (IZO), and indium tin zinc oxide (ITZO). When the pixel electrode 220 is formed in multiple layers, it may include at least one transparent conductive oxide layer and at least one metal layer.

Since the transparent conductive oxide layer has a high work function, holes can be supplied to the organic emission layer 250. Accordingly, the transparent conductive oxide layer may contact the organic emission layer 250.

Next, the organic emission layer 250 is positioned on the pixel electrode 220.

The organic emission layer 250 is formed of a thin film of an organic material, and generates light by using holes and electrons injected through the pixel electrode 220 and the common electrode 260. Although not specifically shown in FIG. 2, the organic light emitting layer 250 includes a hole injection layer (HIL), a hole transport layer (HTL), an emission layer (EML), and an electron transport layer (Electron). Transport Layer: ETL) can be included.

The pixel electrode 220 of the present invention may serve as an anode electrode, and the common electrode 260 may serve as a cathode electrode, but is not limited thereto.

The hole injection layer HIL is a buffer layer for improving the efficiency in which holes are injected from the pixel electrode 220 by lowering the energy barrier between the pixel electrode 220 and the emission layer EML. The hole transport layer HTL binds electrons injected from the common electrode 260 and transferred to the emission layer EML in the emission layer EML, thereby increasing the efficiency of recombining electrons and holes in the emission layer EML. Similarly, the electron transport layer (ETL) is a buffer layer that lowers the energy barrier between the common electrode 260 and the emission layer (EML), improves the efficiency in which electrons are injected from the common electrode 260, and is transferred to the emission layer (EML). The resulting holes are confined in the emission layer (EML), thereby increasing the efficiency of recombining electrons and holes in the emission layer. The emission layer EML is formed of a thin film of a low-molecular or high-molecular organic material, is injected from each of the pixel electrode 220 and the common electrode 260, and holes and electrons transferred to the emission layer EML recombine, and excitons ( exiton) is generated, and the energy emitted when the excitons fall from the excited state to the ground state is generated as light. In this case, the color of the emitted light varies according to the band-gap energy of the organic material forming the emission layer EML.

Next, a common electrode 260 is positioned on the organic emission layer 250. In more detail, the common electrode 260 includes a metal layer 261 disposed on the organic emission layer 250, a conductive organic layer 262 disposed on the metal layer 261, and a first metal oxide layer disposed on the conductive organic layer 262. (263) may be included.

Since the common electrode 260 serves as a cathode electrode in the present invention, electrons can be supplied to the organic light emitting layer 250. In order to supply electrons to the organic emission layer 250, a work function of a region in contact with the organic emission layer 250 must be relatively lower than the work function of the pixel electrode 220. Therefore, a metal, which is a material having a low work function, must be located in a region in contact with the organic emission layer 250. Accordingly, the metal layer 261 is located in a region in contact with the organic emission layer 250. That is, the metal layer 261 may be positioned on the organic emission layer 250.

The metal layer 261 may include any one or at least one of silver (Ag), magnesium (Mg), calcium (Ca), aluminum (Al), lithium (Li), and neodymium (Nd), and the following alloys It may be formed of any one, or may include any one or at least one of the following alloys. Examples of the alloy include LiF/Al, CsF/Al, Mg:Ag, Ca/Ag, Ca:Ag, LiF/Mg:Ag, LiF/Ca/Ag, and LiF/Ca:Ag, but are not limited thereto.

In addition, the metal layer 261 may include an insulating portion INS on a surface of the surface exposed to foreign substances. During the process of forming the pixel electrode 220, the organic emission layer 250, or the common electrode 260, there is a possibility that unintended foreign matter may occur. As shown in FIG. 2, when particles P larger than the thickness of each thin film are formed, the pixel electrode 220 and the common electrode 260, especially the metal layer 261 are connected to each other, resulting in a short. It is likely to occur. In this case, there may be a problem that the entire pixel on which the foreign material is located does not emit light.

Therefore, after completing the formation of the common electrode 260, if the pixel electrode 220 and the common electrode 260 are located in a short state where the particle P is located, the pixel electrode 220 and the common electrode 260 ), the metal layer 261 in a region where the pixel electrode 220 and the common electrode 260 meet may be oxidized to form the insulating portion INS. Accordingly, the insulating portion INS may prevent a short circuit between the pixel electrode 220 and the common electrode 260 and insulate the pixel electrode 220 and the common electrode 260. The metal layer 261 in the area where the pixel electrode 220 and the common electrode 260 meet may be a surface of the metal layer 261 in the area where the particle P is located, as shown in FIG. 2.

The conductive organic layer 262 is positioned on the metal layer 261 and may be formed of a conductive organic material or may include a conductive organic material. Since the conductive organic layer 262 must have conductivity, it may include any one of materials forming the organic emission layer 250 or may be formed of the same material as the organic emission layer 250.

It is preferable that the thickness of the conductive organic layer 262 is formed between 100 Å and 5,000 Å. Since the conductive organic layer 262 is formed to prevent the first metal oxide layer 263 from being connected to or conducting with the pixel electrode 220, the conductive organic layer 262 is maintained above the thickness to be separated between the particles P and the conductive organic layer 262. Penetration of the first metal oxide layer 263 may be prevented.

The conductive organic layer 262 increases the volume of the common electrode 260 by allowing the lowermost metal layer 261 and the uppermost first metal oxide layer 263 constituting the common electrode 260 to communicate with each other. By doing so, it is possible to prevent an increase in resistance and a voltage drop. In particular, since the first metal oxide layer 263 may be connected to the auxiliary electrode 221 to be described later, the conductive organic layer 262 conducts the metal layer 261 and the first metal oxide layer 263 to increase resistance and It is very important to avoid voltage drop.

The auxiliary electrode 221 described above is positioned on the substrate 210 and may receive the same voltage as the voltage applied to the common electrode 260. In the present invention, the common electrode 260 serves as a cathode electrode, and may be connected to the low potential voltage terminal Vss.

Accordingly, the auxiliary electrode 221 may also be connected to the low potential voltage terminal Vss. Meanwhile, the pixel electrode 220 serves as an anode electrode and may be connected to the high potential voltage terminal Vdd.

Further, the auxiliary electrode 221 may be formed at the same time when the pixel electrode 220 is formed, and thus, the auxiliary electrode 221 may be positioned on the same layer as the pixel electrode 220.

That is, the auxiliary electrode 221 may be formed of the same material as the pixel electrode 220 or may include at least one of the same material as the pixel electrode 220.

When the pixel electrode 220 is formed of a single layer, the auxiliary electrode 221 may be formed of the same material as the single layer, and when the pixel electrode 220 is formed by stacking a plurality of thin films, the auxiliary electrode ( 221) may be formed of the same material as any one of the thin films.

The auxiliary electrode 221 is connected to the common electrode 260 to prevent a voltage drop of the common electrode 260, and in particular, may be connected to the first metal oxide layer 263. The common electrode 260 may be connected to the low voltage terminal Vss in the pad portion of the non-display area (not shown), which is the edge region of the substrate 210, and not connected to the low voltage terminal Vss in the central portion of the substrate 210. . Accordingly, a voltage drop phenomenon may occur due to an increase in the resistance of the common electrode 260 at the center of the substrate 210, so that the low voltage terminal Vss is connected to the auxiliary electrode 221, and the auxiliary electrode 221 is the common electrode 260. ), it is possible to prevent the voltage drop as described above.

As described above, in order for the auxiliary electrode 221 to be connected to the common electrode 260 with the organic emission layer 250 therebetween, the partition wall layer 240 is formed in a region where the bank layer 230 is located outside the emission region, Through this, the auxiliary electrode 221 and the common electrode 260 may be connected to each other. The partition wall layer 240 may be positioned between the bank layers 230 in a reverse taper shape, and the gap between the partition wall layer 240 and the bank layer 230 is small, so that the organic emission layer 250 and the common electrode The metal layer 261 and the conductive organic layer 262 of 260 are not connected to the auxiliary electrode 221 and are applied only on the partition wall layer 240.

However, when the first metal oxide layer 263 is formed by sputtering, since the step coverage property is very good, it penetrates between the partition wall layer 240 and the bank layer 230. A thin film can be formed. Accordingly, the first metal oxide layer 263 may be connected to the auxiliary electrode 221.

Although not shown in FIG. 2, the common electrode 260 may further include a second metal oxide layer held between the metal layer 261 and the conductive organic layer 262.

When the second metal oxide layer is included in the common electrode 260, there are advantages of improving electron injection efficiency and increasing sheet resistance.

The second metal oxide layer may be thinly formed so as not to be short-circuited by being connected to the pixel electrode 220, and may be formed to have a thickness ranging from 10 Å to 500 Å.

In an embodiment in which the second metal oxide layer is formed, the conductive organic layer 262 is preferably formed to a thickness in the range of 100 Å to 10,000 Å, and the first metal oxide layer 263 is formed to a thickness in the range of 100 Å to 5,000 Å. It is desirable to be.

3 is a cross-sectional view illustrating an organic light emitting display device according to a modified embodiment of the present invention.

Referring to FIG. 3, as another embodiment of the present invention, the common electrode 260 does not include the metal layer 261 shown in FIG. 2, but a first metal oxide layer 263, a conductive organic layer 262, It may be composed of a second metal oxide layer 264.

When the metal layer 261 is not included, the pixel electrode 220 and the common electrode 260 are formed by the particle P to the pixel electrode 220 and the common electrode 260, in detail, the pixel electrode 220 and the second metal. The oxide layer 264 may be connected at the periphery of the particle P.

Since the pixel electrode 220 and the common electrode 260 are connected at the periphery of the particle P through the second metal oxide layer 264 by the particle P, the pixel electrode 220 and the common electrode 260 When a voltage is applied, the second metal oxide layer 264 in the region where the pixel electrode 220 and the common electrode 260 are connected by the particle P is destroyed by the voltage, and the common electrode ( An insulating portion INS between the 260 and the pixel electrode 220 is generated.

4A to 4E are cross-sectional views illustrating a method of manufacturing an organic light emitting display device according to an embodiment of the present invention.

First, as shown in FIG. 4A, a pixel electrode 220 is formed on a substrate 210. While forming the pixel electrode 220, the auxiliary electrode 221 may be simultaneously formed. However, the present invention is not limited thereto, and the auxiliary electrode 221 may be formed separately from the pixel electrode 220.

Next, a bank layer 230 is formed on the pixel electrode 220. The bank layer 230 overlaps with a portion of the edge of the pixel electrode 220 to define a light emitting area in which the pixel electrode 220 and the organic emission layer 250 contact each other. The bank layer 230 may also overlap a portion of the edge of the auxiliary electrode 221. The partition wall layer 240 is positioned on the auxiliary electrode 221 exposed by the bank layer 230. The partition wall layer 240 has an inverted taper shape, and the bank layer 230 and the partition wall layer 240 are spaced apart to form a space through which the first metal oxide layer 263 to be formed can penetrate.

After the bank layer 230 and the partition wall layer 240 are formed, the organic emission layer 250 is formed on the pixel electrode 220. Since the organic emission layer 250 is formed in common over the entire substrate 210, it may also be formed on the bank layer 230 and the partition wall layer 240. However, as described above, a thin film is not formed by penetrating into the space between the bank layer 230 and the partition wall layer 240.

The organic emission layer 250 may be formed by a method such as vacuum deposition, laser transfer, thermal transfer, and screen printing, and is formed on the pixel electrode 220. In the case where the particles P are generated, they may not be formed in the area around the particles P.

Next, as shown in FIG. 4B, a metal layer 261 may be formed on the organic emission layer 250. The metal layer 261 may also be formed in the same region as the organic emission layer 250 because it does not have excellent step coverage characteristics. The metal layer 261 includes any one or at least one of silver (Ag), magnesium (Mg), calcium (Ca), aluminum (Al), lithium (Li), and neodymium (Nd), or LiF/Al, CsF/Al , Mg:Ag, Ca/Ag, Ca:Ag, LiF/Mg:Ag, LiF/Ca/Ag, LiF/Ca:Ag, and the like.

Next, as shown in FIG. 4C, a conductive organic layer 262 may be formed on the metal layer 261. The conductive organic layer 262 may be formed to have a thickness in the range of 100 Å to 5,000 Å, and may be formed of the same material as the organic emission layer 250, or may include at least one of the same material.

Although not shown in the drawing, a second metal oxide layer (not shown) positioned between the metal layer 261 and the conductive organic layer 262 may be further formed. The second metal oxide layer (not shown) may be the same material as the first metal oxide layer 263, may be formed thin so as not to be shorted with the pixel electrode 220, and preferably formed to a thickness in the range of 10 Å to 500 Å. Can be.

Next, as shown in FIG. 4D, a first metal oxide layer 263 may be formed on the conductive organic layer 262. In particular, the first metal oxide layer 263 may be formed by a sputtering method to further improve step coverage characteristics. The first metal oxide layer 263 is connected to the auxiliary electrode 221 but is not connected to the pixel electrode 220.

Finally, as shown in FIG. 4E, after forming the common electrode 260 including the metal layer 261, the conductive organic layer 262, and the first metal oxide layer 263, the pixel electrode 220 and the common electrode 260 are formed. ) To form an insulating part INS on the surface of the metal layer 261 exposed to particles P, which are foreign substances. In the present invention, since the pixel electrode 220 serves as an anode and the common electrode 260 serves as a cathode, a low potential voltage is applied to the pixel electrode 220 and a high potential voltage is applied to the common electrode 260. When a reverse voltage is applied by applying, the metal layer 261 may be oxidized so that the insulating part INS may be formed on the surface of the metal layer 261 exposed to foreign materials.

In addition, even when the first metal oxide layer 263 penetrates to the bottom of the particle P and partially is connected to the pixel electrode 220, the first metal oxide layer 263 and the first metal oxide layer 263 Since the region to which the pixel electrode 220 is connected is insulated, a short circuit between the pixel electrode 220 and the common electrode 260 may be prevented.

As described above, even if foreign substances such as particles P are generated during the process of the organic light emitting device including the organic light emitting layer, an insulating portion INS is formed between the pixel electrode 220 and the common electrode 260 to prevent short circuit, Only the area in which (P) occurs is darkened, and the remaining areas of the pixel can be normally driven. In addition, as described above, only the area in which the particle P is generated is darkened, and the remaining areas of the pixel can be normally driven, thereby reducing the occurrence of defective pixels. In addition, a conductive organic layer 262 is formed between the organic emission layer 250 and the common electrode 260, so that the first metal oxide layer 263 included in the common electrode 260 is formed with particles P and the organic emission layer 250. ) To be connected to the pixel electrode 220 through the gap, thereby preventing a short between the pixel electrode 220 and the first metal oxide layer 263.

Although the embodiments of the present invention have been described in more detail with reference to the accompanying drawings, the present invention is not necessarily limited to these embodiments, and various modifications can be made without departing from the spirit of the present invention. . Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but to explain the technical idea, and the scope of the technical idea of the present invention is not limited by these embodiments. Therefore, it should be understood that the embodiments described above are illustrative in all respects and not limiting. The scope of protection of the present invention should be interpreted by the claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present invention.

210: substrate
220: pixel electrode
221: auxiliary electrode
230: bank layer
240: bulkhead layer
250: organic emission layer
260: common electrode
261: metal layer
262: conductive organic layer
263: first metal oxide layer
264: second metal oxide layer
P: particle
INS: insulation

Claims (18)

Board;
A pixel electrode on the substrate;
An organic emission layer positioned on the pixel electrode;
A common electrode including a metal layer disposed on the organic emission layer, a conductive organic layer disposed on the metal layer, and a first metal oxide layer disposed on the conductive organic layer; And
Including; an insulating portion formed in a region of the surface of the metal layer exposed to foreign substances,
The insulator part insulates the pixel electrode and the common electrode. The method of claim 1,
Further comprising an auxiliary electrode positioned on the substrate,
The auxiliary electrode is an organic light emitting display device, characterized in that connected to the first metal oxide layer. The method of claim 2,
The organic light emitting display device, wherein the auxiliary electrode is applied with the same voltage as the voltage applied to the common electrode. The method of claim 2,
And the auxiliary electrode is disposed on the same layer as the pixel electrode. The method of claim 1,
The organic electroluminescent display device, wherein the first metal oxide layer has a thickness of 100 Å to 5,000 Å. The method of claim 1,
The organic light emitting display device, wherein the organic light emitting layer and the conductive organic layer are made of the same material. The method of claim 1,
The organic light emitting display device, wherein the conductive organic layer has a thickness of 100 Å to 10,000 Å. The method of claim 1,
The common electrode further comprises a second metal oxide layer disposed between the metal layer and the conductive organic layer. The method of claim 8,
The organic light emitting display device, wherein the second metal oxide layer has a thickness of 10 Å to 500 Å. A pixel electrode positioned on the substrate;
An organic emission layer positioned on the pixel electrode;
A first metal oxide layer on the organic emission layer;
A conductive organic layer on the first metal oxide layer; And
An organic light emitting display device comprising: a second metal oxide layer on the conductive organic layer. The method of claim 10,
The organic electroluminescent display device, wherein the first metal oxide layer has a thickness of 100 Å to 5,000 Å. The method of claim 10,
The organic light emitting display device, wherein the organic light emitting layer and the conductive organic layer are made of the same material. The method of claim 10,
The organic light emitting display device, wherein the conductive organic layer has a thickness of 100 Å to 10,000 Å. The method of claim 10,
The organic light emitting display device, wherein the second metal oxide layer has a thickness of 10 Å to 500 Å. Forming a pixel electrode on a substrate;
Forming an organic emission layer on the pixel electrode;
Forming a common electrode including a metal layer on the organic emission layer, a conductive organic layer on the metal layer, and a first metal oxide layer on the organic layer; And
And forming an insulating portion formed on a surface of the metal layer exposed to foreign substances. The method of claim 15,
Further comprising the step of forming an auxiliary electrode on the substrate,
The auxiliary electrode is a method of manufacturing an organic light emitting display device, characterized in that connected to the first metal oxide layer. The method of claim 15,
The insulating portion is formed by applying a reverse voltage to the pixel electrode and the common electrode. A method of manufacturing an organic light emitting display device. The method of claim 15,
The method of manufacturing an organic light emitting display device further comprising forming a second metal oxide layer between the metal layer and the conductive organic layer.

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