KR102158630B1 - Display device and manufacturing method thereof - Google Patents

Abstract

A display device capable of implementing a narrow bezel with a flexible characteristic while simplifying a manufacturing process and a manufacturing method thereof are provided. The display device includes a first substrate; And a second substrate formed and positioned on the first substrate, one side extending from a side portion of the first substrate, and an extended portion bent along a side portion of the first substrate.

Description

Display device and manufacturing method thereof TECHNICAL FIELD

The present invention relates to a display device, and more particularly, to an organic light emitting display device capable of implementing a narrow bezel with a flexible characteristic while reducing the number of manufacturing processes, and a method of manufacturing the same.

As a flat panel display device proposed to replace the existing cathode ray tube display device, a liquid crystal display, a field emission display, and a plasma display device (Plasma Display Panel) and organic light-emitting display devices (Organic Light-Emitting Diode Display, OLED Display).

Among them, the organic light emitting display device has a high luminance and low operating voltage characteristics of an organic light emitting diode provided in the display panel, and is a self-luminous type that emits light by itself, so the contrast ratio is large and the ultra-thin display It has the advantage that it can be implemented. In addition, it is easy to implement a moving image with a response time of several microseconds (µs), there is no limit on the viewing angle, and it has stable characteristics even at low temperatures.

Such organic light-emitting display devices form display elements on a glass substrate, but recently, instead of a glass substrate that is not flexible, a flexible material such as plastic or metal foil is used to maintain display performance even if it is bent like paper. A flexible organic light emitting display device is being manufactured.

1 is a schematic diagram of a conventional organic light emitting display device, FIG. 2 is a cross-sectional view of FIG. 1 taken along the line II to II', and FIGS. 3A and 3B are manufacturing process diagrams of the organic light emitting display device of FIG. .

Referring to the drawings, a conventional organic light emitting display device 1 includes a display area formed on a flexible substrate, such as a plastic substrate 2 to display an image, and a non-display area formed surrounding the display area. do.

A light emitting area 7 and an encapsulating area 8 are provided in the display area. The emission area 7 includes a thin film transistor (not shown) and an organic emission layer (not shown), and the encapsulation area 8 includes one or more organic or inorganic layers (not shown) covering and protecting the emission area 7 do.

The non-display area includes a driver 5 providing a driving signal to the display area and a plurality of wiring patterns (not shown) through which driving signals are transmitted. The driving unit 5 is connected to the substrate 2 by a connecting member 4, for example, a flexible printed circuit board (FPCB). This non-display area is covered by a bezel.

Further, a member for supporting the substrate 2, for example, a back film 6 is provided under the substrate 2.

As shown in FIGS. 3A and 3B, the organic light emitting display device 1 described above is first coated (or deposited) with a material of a flexible material on the front surface of the glass substrate 10 to a predetermined thickness. 2) to form. Subsequently, a light emitting region 7 and an encapsulation region 8 are formed on the flexible substrate 2.

Next, the glass substrate 10 and the flexible substrate 2 are separated using a laser or the like, and the driving unit 5 is mounted in a non-display area on one side of the flexible substrate 2.

Then, a back film 6 for supporting the substrate is attached to the lower portion of the flexible substrate 2 to complete the organic light emitting display device 1.

In the organic light emitting display device 1 thus completed, at least one of the non-display areas, for example, the area in which the driver 5 is formed, is bent toward the rear surface of the flexible substrate 2 in order to implement a narrow bezel.

Meanwhile, in the conventional organic light emitting display device 1, as the flexible substrate 2 is bent together with the back film 6, the thickness of the back film 6 must be changed according to the size of the bending area, for example, the bending curvature.

In other words, when the bending curvature becomes small, the back film 6 should have a small thickness, and when the bending curvature becomes large, the back film 6 should have a large thickness. Accordingly, the selection of the back film 6 is restricted during the manufacturing process of the organic light emitting display device 1.

Moreover, when the bending curvature is small as the flexible substrate 2 and the back film 6 are bent together, a phenomenon in which the flexible substrate 2 and the back film 6 are folded occurs, such as wiring formed on the flexible substrate 2 This leads to a problem of being broken.

In addition, in the conventional organic light emitting display device 1, even when only a partial region of the flexible substrate 2, that is, the region where the driver 5 is mounted, is bent, the detachment process of the glass substrate 10 described above and the back film It is necessary to perform the attachment process of (6), which complicates the manufacturing process and increases the cost.

The present invention is to improve the above-described problems, and to provide a display device capable of implementing a narrow bezel with a flexible characteristic while simplifying a manufacturing process and a manufacturing method thereof.

A display device according to an exemplary embodiment of the present invention for achieving the above object includes: a first substrate; And a second substrate formed and positioned on the first substrate, one side extending from a side portion of the first substrate, and an extended portion bent along a side portion of the first substrate.

In order to achieve the above object, a method of manufacturing a display device according to an exemplary embodiment of the present invention includes: forming a second substrate on a first substrate; Irradiating a laser to a region of a rear surface of the first substrate; Cutting an area of the first substrate irradiated with the laser to expose the second substrate from the cut surface of the first substrate; And bending the exposed portion of the second substrate along the cut surface of the first substrate.

According to the display device and its manufacturing method of the present invention, in a flexible organic light emitting display device in which only a partial area is bent, a manufacturing process can be simplified to reduce manufacturing cost, and a narrow bezel can be implemented.

1 is a schematic diagram of a conventional organic light emitting display device.
FIG. 2 is a cross-sectional view of FIG. 1 taken along the line II-II'.
3A and 3B are manufacturing process diagrams of the organic light emitting display device of FIG. 1.
4 is a cross-sectional view of an organic light emitting display device according to an exemplary embodiment of the present invention.
5 is a partially enlarged view of FIG. 4.
6A to 6D are manufacturing process diagrams of the organic light emitting display device of FIG. 4.
7 is a cross-sectional view of an organic light emitting display device according to another exemplary embodiment of the present invention.
8 is a cross-sectional view of an organic light emitting display device according to another exemplary embodiment of the present invention.
9A to 9D are manufacturing process diagrams of the organic light emitting display device shown in FIG. 7.

Hereinafter, a display device and a method of manufacturing the same according to the present invention will be described with reference to the accompanying drawings. For convenience of description, in the present invention, an organic light emitting display device in which a part is bent to implement a narrow bezel is described, but the present invention is not limited thereto. For example, the present invention can be applied to a liquid crystal display device requiring a narrow bezel.

4 is a cross-sectional view of an organic light emitting display device according to an exemplary embodiment of the present invention, and FIG. 5 is a partially enlarged view of FIG. 4.

First, referring to FIG. 4, the organic light emitting display device 100 may include a first substrate 101 and a second substrate 105 stacked to correspond to each other.

Here, the first substrate 101 may be a glass substrate, and the second substrate 105 may be a flexible substrate. The second substrate 105 is polycarbon, polyimide, polyester sulfone (PES), polyarylate, polyethylene naphthalate (PEN), or polyethylene terephthalate ( polyethyleneterephthalate (PET) may be used.

The second substrate 105 may be bonded to the first substrate 101 through an adhesive or the like, and may have a predetermined thickness so as to have flexible characteristics.

One side of the second substrate 105 may extend longer than the first substrate 101. For example, the second substrate 105 may include a display area in which an image is displayed and a non-display area formed surrounding the display area. In the non-display area, a driving unit 150 generating a driving signal for driving the display area and a wiring pattern (not shown) transmitting a driving signal generated by the driving unit 150 to the display area may be formed.

At this time, one of the non-display areas of the second substrate 105, for example, the non-display area in which the driving unit 150 is located, extends in one direction from the end of the first substrate 101, that is, the side of the first substrate 101. Can be formed. Also, in some cases, all non-display areas of the second substrate 105 may be formed to extend from corresponding ends of the first substrate 101. The non-display area of the second substrate 105 formed by extending from the side of the first substrate 101 may be bent along the side of the first substrate 101 to be positioned on the rear surface of the first substrate 101.

A protective member 130 may be further positioned on the side of the first substrate 101 in contact with the rear surface of the second substrate 105 to be bent. The protection member 130 may prevent the second substrate 105 from being bent from being damaged by preventing the side portion of the first substrate 101 from directly contacting the second substrate 105. In addition, the protection member 130 may maintain a state when the second substrate 105 is bent, that is, a bending curvature. The protection member 130 may be formed of a soft material such as silicon, and may be attached to and positioned on the side of the first substrate 101.

In the display area of the second substrate 105, a light emitting area 110 including a thin film transistor and an organic light emitting layer and an encapsulation layer 120 encapsulating the light emitting area 110 may be formed.

Referring to FIG. 5, a pixel region (not shown) may be defined on the second substrate 105. The pixel region is a minimum unit for image realization and may be formed as a region surrounded by a gate and a data line (not shown) intersecting each other.

A switching thin film transistor (not shown), a driving thin film transistor DTr, and an organic light emitting layer E may be formed in each pixel region.

When explaining the manufacturing process in detail, first, amorphous silicon is deposited on the second substrate 105 to form a silicon layer (not shown), crystallized to form a polysilicon layer (not shown), and then through a mask process. The semiconductor layer 103 may be formed by patterning the polysilicon layer.

Meanwhile, although not shown in the drawing, a buffer layer (not shown) may be further formed on the second substrate 105 before the semiconductor layer 103 is formed, and the buffer layer is a single silicon oxide (SiO2) or silicon nitride (SiNx) layer. It may have a layered or double layered structure.

Subsequently, silicon oxide may be deposited on the semiconductor layer 103 to form the gate insulating layer 104. Then, a first metal layer (not shown) is formed by depositing one of a low-resistance metal material such as aluminum (Al), aluminum alloy (AlNd), copper (Cu), and copper alloy on the gate insulating layer 104, The first metal layer may be patterned through a mask process to form a gate electrode 107 and a gate wiring (not shown) corresponding to the center of the semiconductor layer 103.

Subsequently, impurities, such as a trivalent element or a pentavalent element, may be doped on the entire surface of the second substrate 105 by using the gate electrode 107 as a blocking mask. Accordingly, an active region 103a of pure polysilicon is formed in a portion of the semiconductor layer 103 corresponding to the gate electrode 107, and source and drain regions doped with impurities except for the active region 103a ( 103b, 103c) may be formed.

Subsequently, an inorganic insulating material such as silicon nitride or silicon oxide is deposited on the entire surface of the second substrate 105 on which the semiconductor layer 103 is formed to form a first interlayer insulating film 109a, and a first interlayer insulating film through a mask process. The first and second contact holes 116 exposing the source and drain regions 103b and 103c of the semiconductor layer 103 may be formed by simultaneously or collectively patterning the 109a and the gate insulating layer 104.

Subsequently, a second metal layer (not shown) is formed by depositing one of aluminum, aluminum alloy, copper, copper alloy, chromium (Cr), and molybdenum (Mo) on the first interlayer insulating film 109a, and through a mask process. A source electrode 108a, a drain electrode 108b, and a data line (not shown) may be formed. Here, the source electrode 108a and the drain electrode 108b may contact the source and drain regions 103b and 103c through the first and second contact holes 116, respectively.

The semiconductor layer 103, the gate insulating layer 104, the gate electrode 107, the first interlayer insulating layer 109a, the source electrode 108a, and the drain electrode 108b formed through the above-described process are the driving thin film transistors ( DTr) can be achieved.

Next, an organic insulating material such as photo acryl or benzocyclobuden (BCB) is applied on the second substrate 105 on which the source electrode 108a and the drain electrode 108b are formed, and through a mask process. The second interlayer insulating layer 109b may be formed by patterning. In this case, a third contact hole 117 exposing the drain electrode 108b may be formed in the second interlayer insulating layer 109b.

Subsequently, a first electrode 111 constituting an anode may be formed on the second interlayer insulating layer 109b as a component of the organic emission layer E. The first electrode 111 may contact the drain electrode 108b through the third contact hole 117.

Subsequently, one of a photosensitive organic insulating material, such as black resin, graphite powder, gravure ink, black spray, and black enamel, is applied on the top of the first electrode 111 and patterned to form the bank 119. The bank 119 is formed in a matrix type having a lattice structure as a whole on the second substrate 105 to distinguish between pixel regions.

Subsequently, the light emitting layer 113 may be formed by applying or depositing an organic light emitting material on the top of the bank 119.

In addition, the second electrode 115 may be formed by depositing a metal material on the emission layer 113. The second electrode 115 may be formed by depositing a transparent conductive material on a translucent metal layer.

The first electrode 111, the bank 119, the emission layer 113, and the second electrode 115 formed through the above-described process may form the organic emission layer E.

In addition, an encapsulation layer 120 formed of one or more organic or inorganic layers may be formed on the organic emission layer E, and the encapsulation layer 120 encapsulates the driving thin film transistor DTr and the organic emission layer E from the outside. Can protect.

6A to 6D are manufacturing process diagrams of the organic light emitting display device of FIG. 4.

Referring to FIG. 6A, a first substrate 101, that is, a second substrate 105, that is, a flexible substrate may be formed on the front surface of the glass substrate to a predetermined thickness. Here, the second substrate 105 may be formed by coating the material having the above-described flexible characteristics to a predetermined thickness on the first substrate 101 through a method such as slit coating or printing. The first substrate 101 and the second substrate 105 may include a display area and a non-display area.

A light emitting region 110 including a thin film transistor and an organic light emitting layer may be formed in the display region of the second substrate 105, and an encapsulation layer 120 may be formed on the light emitting region 110. The formation of the light emitting region 110 and the encapsulation layer 120 is the same as described above with reference to FIG. 5.

Referring to FIG. 6B, a part of the first substrate 101 may be cut by irradiating a laser from the rear surface of the first substrate 101.

In other words, in the non-display area of the rear surface of the first substrate 101 around the reference line A, that is, the non-display area of the first substrate 101 corresponding to the non-display area of the second substrate 105 to be bent. The laser can be irradiated with a predetermined intensity.

As the laser is irradiated, the first substrate 101 and the second substrate 105 may be separated from each other in the area. In addition, the separated first substrate 101 may be etched and cut.

In this way, as a partial region of the first substrate 101 is separated from the second substrate 105 and cut, the corresponding region of the second substrate 105, that is, a bending region, is a cut surface, that is, the first substrate 101 It can be exposed and extended from the side of.

After a partial region of the first substrate 101 is cut, the driving signal is on the corresponding second substrate 105, that is, a non-display region of the second substrate 105 extending from the side of the first substrate 101 A driving unit 150 for generating a may be mounted and positioned.

Referring to FIG. 6C, the protection member 130 may be attached to the cut surface of the cut first substrate 101. As described above, the protective member 130 prevents direct contact between the first substrate 101 and the second substrate 105 so that the second substrate 105 is damaged by the cut surface of the first substrate 101. Can be prevented. In addition, the protection member 130 may maintain the bending curvature when the second substrate 105 is bent.

Meanwhile, as shown in FIG. 6D, a second substrate that is bent by forming a cut surface of the first substrate 101, that is, a side cross-section to have a curved shape 101 ′, in place of the protection member (130 in FIG. 6C) It is also possible to prevent the damage of (105).

In other words, after cutting the first substrate 101 by irradiating the first substrate 101 with a laser in FIG. 6B, double etching is performed on the cut surface, that is, the side cross-section of the first substrate 101 to form a curved shape ( 101') can be formed. For example, a curved surface 101 ′ may be formed by double-etching the side cross-section of the first substrate 101 into a reverse taper and a positive taper shape. In addition, the curved surface shape 101 ′ may be formed by polishing the cross section through a mechanical polishing operation after etching once in a reverse taper or normal taper shape. In addition, the cut surface of the first substrate 101 may be precipitated in a chemical solution to form a curved shape 101 ′.

6C and 6D, after the first substrate 101 is cut, the second substrate 105 may be bent toward the rear surface of the first substrate 101. In other words, the second substrate 105 extending from the first substrate 101 may be bent along the side of the first substrate 101 to be positioned on the rear surface of the first substrate 101.

Accordingly, the organic light-emitting display device 100 according to the present invention can reduce the width of the bezel by bending the non-display area where the driving unit 150 is located to the rear surface of the first substrate 101, thereby implementing a narrow bezel. I can. In addition, by cutting the first substrate 101 in consideration of the bending area of the second substrate 105, the detachment process of the glass substrate required in the manufacturing process of the conventional flexible organic light emitting display device in which only a partial area is bent and attachment of the back film The process may be omitted, and accordingly, the manufacturing process may be simplified, and the manufacturing cost may also be reduced.

7 is a cross-sectional view of an organic light emitting display device according to another exemplary embodiment of the present invention, and FIG. 8 is a cross-sectional view of an organic light emitting display device according to another exemplary embodiment of the present invention.

In the organic light emitting display devices 101 and 102 according to other embodiments of the present invention illustrated in FIGS. 7 and 8, the flexible substrate, that is, the second substrate 105 ′ is a partial region of the first substrate 101, for example, It is the same as the organic light emitting display device 100 according to an embodiment of the present invention described above with reference to FIG. 4, except that it is formed in a non-display area on one side of the first substrate 101, and thus the same member Detailed description of the will be omitted.

7 and 8, the organic light emitting display devices 101 and 102 according to other embodiments of the present invention correspond to a first substrate 101 and a non-display area on one side of the first substrate 101. It may include a second substrate 105 ′ formed to extend in one direction from an end of the first substrate 101, that is, a side portion of the first substrate 101.

For example, the first substrate 101 may include a display area and a non-display area formed surrounding the display area. A light emitting area 110 and an encapsulation layer 120 may be formed in the display area. The process of forming the light-emitting region 110 and the encapsulation layer 120 may be the same as described with reference to FIG. 5.

The second substrate 105 ′ may be bonded to the non-display area of the first substrate 101. For example, the second substrate 105 ′ may be formed in a region where bending is required, that is, a region in which the driving unit 150 is to be positioned among the non-display regions of the first substrate 101.

The second substrate 105 ′ may partially overlap with the encapsulation layers 120 and 120 ′ in the display area. In other words, after bonding the second substrate 105 ′ to a region requiring bending among the non-display regions of the first substrate 101, the light emitting region 110 and the encapsulation layers 120 and 120 are attached to the first substrate 101. '), but the encapsulation layers 120 and 120' may be formed to partially overlap the second substrate 105'.

Here, as shown in FIG. 7, the encapsulation layer 120 is formed to the side of the first substrate 101 to partially overlap the second substrate 105 ′, or as shown in FIG. 120' may be formed to extend further from the side of the first substrate 101 to overlap most of the second substrate 105'.

The driving unit 150 may be mounted and positioned on the second substrate 105 ′. The second substrate 105 ′ may be bent along the side of the first substrate 101. In this case, the protective member 130 may be positioned on the side of the first substrate 101, and damage to the second substrate 105 ′ may be prevented by the protective member 130, and the bending curvature may be maintained.

Here, in the organic light emitting display device 101 illustrated in FIG. 7, only the second substrate 105 ′ may be bent along the side of the first substrate 101 at one side of the encapsulation layer 120. In addition, in the organic light emitting display device 102 illustrated in FIG. 8, a part of the encapsulation layer 120 together with the second substrate 105 ′ may be bent along the side of the first substrate 101.

That is, the organic light-emitting display devices 101 and 102 according to other embodiments of the present invention illustrated in FIGS. 7 and 8 are the organic light-emitting display devices 101 and 102 according to the exemplary embodiment described with reference to FIG. 4. In contrast to 100), since the second substrate 105 ′ is not formed on the front surface of the first substrate 101, manufacturing cost can be reduced.

In addition, in the organic light emitting display device 102 illustrated in FIG. 8, since the encapsulation layer 120 ′ is bent together with the second substrate 105 ′, a narrower bezel may be formed.

9A to 9B are manufacturing process diagrams of the organic light emitting display device shown in FIG. 7.

Hereinafter, a manufacturing process of the organic light emitting display device 101 illustrated in FIG. 7 will be described, but this may also be applied to the manufacturing process of the organic light emitting display device 102 illustrated in FIG. 8.

Referring to FIG. 9A, a second substrate 105 ′ may be formed to have a predetermined thickness in a partial region of the first substrate 101, that is, in a non-display region on one side of the non-display region of the first substrate 101. The second substrate 105 ′ may be formed by being coated on the first substrate 101 by a method such as slit coating or printing.

Here, the first substrate 101 may be a glass substrate, and the second substrate 105 ′ is one or more of polycarbon, polyimide, polyester sulfone, polyarylate, polyethylene naphtharate, or polyethylene terephthalate. It may be a formed flexible substrate.

A light emitting region 110 including a thin film transistor and an organic light emitting layer may be formed in the display region of the first substrate 101, and an encapsulation layer 120 may be formed on the light emitting region 110. The formation of the light emitting region 110 and the encapsulation layer 120 is the same as described above with reference to FIG. 5.

Meanwhile, the encapsulation layer 120 formed in the display area may be formed to overlap a part of the second substrate 105 ′. For example, the light emitting area 110 formed in the display area of the first substrate 101 may include an active area in which an image is substantially displayed, and a dummy area in which signal wiring and dummy pixels are formed. In addition, after the second substrate 105 ′ is formed in a partial region on the first substrate 101, the light emitting region 110 and the encapsulation layer 120 may be formed on the first substrate 101. Here, the active region may be formed on the first substrate 101, and the dummy region may be formed together on the first substrate 101 and the second substrate 105'. In addition, since the encapsulation layer 120 is formed to cover the emission region 110, the second substrate 105 ′ may overlap the encapsulation layer 120.

Referring to FIG. 9B, a part of the first substrate 101 may be cut by irradiating a laser from the rear surface of the first substrate 101.

In other words, a laser in a non-display area of the first substrate 101 corresponding to the bent area of the second substrate 105 ′, that is, a non-display area centered on the reference line A on the rear surface of the first substrate 101 Can be irradiated with a predetermined intensity.

As the laser is irradiated, the first substrate 101 and the second substrate 105 ′ may be separated from each other in the region. In addition, the separated first substrate 101 may be etched and cut.

In this way, as a partial region of the first substrate 101 is cut apart from the second substrate 105 ′, the corresponding region of the second substrate 105 ′ is the cut surface of the first substrate 101, that is, the first It may be exposed and extended from the side of the substrate 101.

After a partial region of the first substrate 101 is cut, the corresponding second substrate 105 ′, that is, on the non-display region of the second substrate 105 ′ extending from the side of the first substrate 101 A driving unit 150 for generating a driving signal may be mounted and positioned.

Referring to FIG. 9C, the protection member 130 may be attached to the side of the cut first substrate 101. As described above, the protective member 130 prevents direct contact between the first substrate 101 and the second substrate 105 ′ so that the second substrate 105 ′ is a cut surface of the first substrate 101, That is, it is possible to prevent damage by the side. In addition, the protection member 130 may maintain a bending curvature when the second substrate 105 ′ is bent.

On the other hand, as shown in FIG. 9D, by forming a side cross-section of the first substrate 101 to have a curved surface, it is possible to prevent damage to the second substrate 105 ′.

For example, after the first substrate 101 is cut by irradiating the first substrate 101 with a laser, double etching is performed on the cut surface, that is, the side cross-section of the first substrate 101 to obtain a curved shape 101 ′. Can be formed. For example, a curved surface 101 ′ may be formed by double-etching the side cross-section of the first substrate 101 into a reverse taper and a positive taper shape. In addition, the curved surface shape 101 ′ may be formed by polishing the cross section through a mechanical polishing operation after etching once in a reverse taper or normal taper shape. In addition, the cut surface of the first substrate 101 may be precipitated in a chemical solution to form a curved shape 101 ′.

As shown in FIGS. 9C and 9D, after the first substrate 101 is cut, the second substrate 105 ′ may be bent toward the rear surface of the first substrate 101. In other words, the second substrate 105 ′ extending from the first substrate 101 may be bent along the side of the first substrate 101 to the rear surface of the first substrate 101.

Here, the second substrate 105 ′ may be bent at the front end of the encapsulation layer 120, that is, at a portion that does not overlap with the encapsulation layer 120. However, as shown in FIG. 8, when the encapsulation layer 120 ′ overlaps most of the second substrate 105 ′, the encapsulation layer 120 ′ is bent together with the second substrate 105 ′. It could be.

Accordingly, in the organic light emitting display device 101 according to the present invention, the width of the bezel can be reduced, thereby implementing a narrow bezel, and the process of attaching and detaching a glass substrate can be omitted. It can be simplified, and manufacturing costs can also be reduced.

Although many items are specifically described in the above description, this should be interpreted as an example of a preferred embodiment rather than limiting the scope of the invention. Therefore, the invention should not be determined by the described embodiments, but should be defined by the claims and equivalents to the claims.

101: first substrate 105, 105': second substrate
110: light emitting area 120: encapsulation layer
130: protection member 150: driving unit

Claims (12)

A first substrate including a display area and a non-display area surrounding the display area;
A light emitting region disposed on the first substrate in the display region;
An encapsulation layer disposed on the emission area;
A second substrate on which a driving unit is mounted, disposed on the first substrate so as to overlap at least a portion of the non-display area, and extending outward of the first substrate; And
A protective member disposed on a side portion of the first substrate overlapping the second substrate and formed in a curved shape,
The encapsulation layer is disposed to overlap with portions of the first substrate and the second substrate,
The second substrate and the encapsulation layer overlapping the second substrate are bent together to the rear surface of the first substrate. The method of claim 1,
The display device according to claim 1, wherein in the bending area of the second substrate, the curved surface of the protection member and the second substrate are in contact with each other so that the second substrate maintains a constant bending curvature. delete delete The method of claim 1,
A display device including a thin film transistor and an organic emission layer in the emission area. delete Providing a first substrate including a display area and a non-display area surrounding the display area;
Attaching a second substrate to a non-display area of the first substrate;
Forming a light emitting area in the display area of the first substrate;
Forming an encapsulation layer so as to overlap with a portion of the first substrate on which the emission region is formed and a second substrate attached to the non-display region;
Forming a protective member having a curved shape on a side portion of the first substrate overlapping the second substrate; And
And bending the second substrate and the encapsulation layer in a region overlapping the second substrate together with the rear surface of the first substrate. The method of claim 7,
The method of manufacturing a display device, wherein in the bending area of the second substrate, the curved surface of the protection member and the second substrate are in contact with each other to maintain a constant bending curvature of the second substrate. delete delete The method of claim 7,
Forming the light-emitting region,
And forming a thin film transistor and an organic light emitting layer on the first substrate. delete

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