KR102152247B1 - 유기전자장치용 봉지재 - Google Patents
유기전자장치용 봉지재 Download PDFInfo
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- KR102152247B1 KR102152247B1 KR1020180130840A KR20180130840A KR102152247B1 KR 102152247 B1 KR102152247 B1 KR 102152247B1 KR 1020180130840 A KR1020180130840 A KR 1020180130840A KR 20180130840 A KR20180130840 A KR 20180130840A KR 102152247 B1 KR102152247 B1 KR 102152247B1
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- adhesive
- resin
- organic electronic
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/28—Metal sheet
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/16—Elastomeric ethene-propene or ethene-propene-diene copolymers, e.g. EPR and EPDM rubbers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
- C09J123/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
- C09J123/22—Copolymers of isobutene; Butyl rubber ; Homo- or copolymers of other iso-olefines
-
- H01L51/5246—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Electroluminescent Light Sources (AREA)
- Laminated Bodies (AREA)
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| KR1020180130840A KR102152247B1 (ko) | 2018-10-30 | 2018-10-30 | 유기전자장치용 봉지재 |
| CN201910983249.1A CN111129336B (zh) | 2018-10-30 | 2019-10-16 | 有机电子装置用密封材料 |
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| KR1020180130840A KR102152247B1 (ko) | 2018-10-30 | 2018-10-30 | 유기전자장치용 봉지재 |
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| KR102152247B1 true KR102152247B1 (ko) | 2020-09-04 |
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| CN114670517B (zh) * | 2020-12-24 | 2024-01-26 | 利诺士尖端材料有限公司 | 有机电子装置用封装材料及包含其的有机电子装置 |
Citations (4)
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| JP2006295064A (ja) | 2005-04-14 | 2006-10-26 | Hitachi Chem Co Ltd | 半導体用接着フィルム、これを用いたリードフレーム及び半導体装置並びに半導体装置の製造方法 |
| JP2011159481A (ja) | 2010-01-29 | 2011-08-18 | Sumitomo Bakelite Co Ltd | 導電接続シート、端子間の接続方法、接続端子の形成方法、半導体装置および電子機器 |
| KR101693797B1 (ko) | 2015-12-29 | 2017-01-09 | 주식회사 이녹스 | 유기전자장치 봉지재용 점착필름 및 이를 포함하는 봉지재 |
| KR101936793B1 (ko) | 2017-08-08 | 2019-01-09 | (주)이녹스첨단소재 | 유기전자장치용 접착필름 및 이를 포함하는 유기전자장치용 봉지재 |
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| KR20060030718A (ko) | 2004-10-06 | 2006-04-11 | 에스케이씨 주식회사 | 유기발광 다이오드 표시 소자 및 이의 봉지 방법 |
| KR101176957B1 (ko) * | 2010-09-30 | 2012-09-07 | 주식회사 케이씨씨 | 반도체 패키지 제작용 접착제 조성물 및 접착시트 |
| KR101665593B1 (ko) * | 2015-12-04 | 2016-10-14 | 주식회사 이녹스 | 유기전자장치용 접착필름 및 이를 포함하는 유기전자장치용 봉지재 |
| CN108778715B (zh) * | 2016-03-11 | 2021-01-08 | 株式会社Lg化学 | 封装膜 |
| JP6814010B2 (ja) * | 2016-10-05 | 2021-01-13 | 旭化成株式会社 | 照明部品用成形品及び照明部品 |
| KR20170019397A (ko) * | 2017-02-13 | 2017-02-21 | 삼성디스플레이 주식회사 | 유기발광 디스플레이 장치 및 그 제조방법 |
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Patent Citations (4)
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|---|---|---|---|---|
| JP2006295064A (ja) | 2005-04-14 | 2006-10-26 | Hitachi Chem Co Ltd | 半導体用接着フィルム、これを用いたリードフレーム及び半導体装置並びに半導体装置の製造方法 |
| JP2011159481A (ja) | 2010-01-29 | 2011-08-18 | Sumitomo Bakelite Co Ltd | 導電接続シート、端子間の接続方法、接続端子の形成方法、半導体装置および電子機器 |
| KR101693797B1 (ko) | 2015-12-29 | 2017-01-09 | 주식회사 이녹스 | 유기전자장치 봉지재용 점착필름 및 이를 포함하는 봉지재 |
| KR101936793B1 (ko) | 2017-08-08 | 2019-01-09 | (주)이녹스첨단소재 | 유기전자장치용 접착필름 및 이를 포함하는 유기전자장치용 봉지재 |
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| Publication number | Publication date |
|---|---|
| CN111129336B (zh) | 2022-08-02 |
| CN111129336A (zh) | 2020-05-08 |
| KR20200048605A (ko) | 2020-05-08 |
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