KR102135575B1 - Manufacturing method for LED display module - Google Patents

Abstract

The present invention has an effect of providing a method of manufacturing an LED display module capable of improving a yield for manufacturing and efficiently performing an inspection process to obtain a high quality LED display module. The method comprises the steps of: preparing a substrate; preparing a plurality of pixel units; and mounting the pixel units on the substrate.

Description

Manufacturing method for LED display module{Manufacturing method for LED display module}

The present invention relates to a method for manufacturing an LED display module, and more particularly, to a method for manufacturing an LED display module capable of obtaining a high-quality LED display module by improving yield for production and efficiently performing an inspection process.

Resolves the problem that the LEDs mounted on the electrode pads are tilted due to the fact that the cross section of the electrode pads in the LED display module is formed in a rectangular shape, and the solder ball melts and is biased toward the edge region of the electrode pads during the reflow process. These techniques were developed to improve the yield to some extent. However, in the manufacture of such a display module, despite the fact that various components are provided for the substrate on which the substrate is based, there were many points that were insufficient to obtain a quality substrate. Therefore, in the manufacture of the final LED display module, there are many cases in which a high quality LED display module cannot be obtained, and thus, there are problems in that a number of fish vessels, yield and cost are generated.

Korean Registered Patent No. 10-1752316

An object of the present invention is to provide a method of manufacturing an LED display module that can improve the yield for production and efficiently perform an inspection process to obtain a high quality LED display module.

The present invention, a display module manufacturing method, comprising: preparing a substrate; Preparing a plurality of pixel units; And mounting the pixel units on the substrate, wherein the substrate undergoes a via hole inspection process that is previously formed through a via hole inspection device. The via hole inspection device includes a loading area (A) for seating the substrate, The inspection housing 10 is provided with an unloading area B, a first inspection area, and a second inspection area disposed on one side of the first inspection area for photographing the substrate. An unloading unit 30 loaded, a first transfer unit 40 for transporting the substrate, and a second transfer unit 50 for transporting the substrate between the first inspection area and the second inspection area , A hole photographing unit 60 for photographing the substrate for each preset shooting section, wherein the inspection housing 10 is provided with a mounting unit at the bottom, and the mounting unit is mounted with the inspection housing 10. The mounting body 110, the first structure 111 of a rectangular parallelepiped structure provided on the lower portion of the mounting body 110, and the rectangular parallelepiped structure provided on the lower portion of the mounting body 110, The second structure 112 and the third structure 113, which is provided below the mounting body portion 110 and is located between the first structure 111 and the second structure 112, is a cuboid-shaped polygonal structure. And, a fourth structure 114 that is provided in the lower portion of the mounting body 110 is located between the third structure 113 and the second structure 112 is a rectangular structure of a rectangular parallelepiped shape, the In the first structure 111 and the third structure 113, first extensions 111a and 3-1 extensions 113a1 are respectively protruded in opposite directions, and the second structure 112 is formed. And the fourth structure 114, the second extension portion 112a and the fourth-1 extension portion 142a1 are protruded in opposite directions, respectively, and the third structure 113 and the fourth structure ( 114), the 3-2 extension part 112a and the 4-2 extension part 142a2 are respectively protruded in opposite directions, and the mounting unit includes the first structure 11 It is provided between 1) and the third structure 113 and pressurized contact with the first extension part 111a and the 3-1 extension part 113a1 by reciprocating movement between the upper side and the lower side in the free space LS1. The first rotating body 115 of the polygonal shape and the second structure 112 and the fourth structure 114 are provided to enable vertical rotation of the forward rotation or the reverse rotation in the pressed contact state. It is provided in the free space (LS2) in the reciprocating movement between the upper and lower pressure contact with the second extension portion (112a) and the 4-1 extension portion (142a1), forward or reverse rotation in the pressure contact state It is provided between the second rotating body 116 of the polygonal shape and the third structure 113 and the fourth structure 114, which are provided to enable vertical rotation of the system, upward and downward in the free space LS3. It is a reciprocating movement between the 3-2 extension part 112a and the 4-2 extension part 142a2, and is provided in such a manner that a vertical rotation of a forward rotation or a reverse rotation method is possible in a press contact state. Provided is a method of manufacturing an LED display module including a third rotating body 117 in the form.

According to the present invention, it is possible to improve the yield for production and to provide a method for manufacturing an LED display module capable of obtaining a high-quality LED display module by efficiently performing an inspection process.

1 is a view showing one pixel unit in an LED display module according to an embodiment of the present invention.
FIG. 2 is a vertical sectional view taken along II-II of FIG. 1.
3 is a view showing various examples of the electrode pads of FIG. 1.
FIG. 4 is a layer-by-layer drawing showing a plurality of pixel units arrayed in an LED LED display module in order to describe a top layer (TOP), a first layer (L10), and a second layer (L20) in a vertical cross-sectional view of FIG. 2. to be.
5 is a vertical cross-sectional view for each layer, and (b) is a cross-sectional view taken along III-III of (a). (c) is a cross-sectional view taken along line IV-IV in (a).
6 is a planar layout view showing a via hole inspection apparatus for a substrate according to an embodiment of the present invention.
7 is a plan view showing a loading unit in the via hole inspection device of the substrate according to an embodiment of the present invention.
8 is a side view showing a loading unit in the via hole inspection device of the substrate according to an embodiment of the present invention.
9 is a plan view showing an unloading unit in a via hole inspection apparatus of a substrate according to an embodiment of the present invention.
10 is a plan view illustrating a first transfer unit in a via hole inspection apparatus for a substrate according to an embodiment of the present invention.
12 is a side view showing a coupled state of the first adsorption unit in the via-hole inspection device of the substrate according to an embodiment of the present invention.
12 is a side view showing a coupled state of the first adsorption unit in the via-hole inspection device of the substrate according to an embodiment of the present invention.
13 is a front view showing a second transfer unit in the via hole inspection apparatus of the substrate according to an embodiment of the present invention.
14 is a plan view illustrating a second transfer unit in a via hole inspection apparatus for a substrate according to an embodiment of the present invention.
15 is a side view showing a hole photographing unit in a via hole inspection apparatus of a substrate according to an embodiment of the present invention.
16 is a plan view showing an upper photographing unit in a via hole inspection apparatus of a substrate according to an embodiment of the present invention.
17 is a block diagram showing a control unit in a via hole inspection apparatus of a substrate according to an embodiment of the present invention.
18 is a plan view illustrating an inspection operation unit in a via hole inspection apparatus of a substrate according to an embodiment of the present invention.
19 is a plan view showing a transfer operation unit in a via hole inspection apparatus of a substrate according to an embodiment of the present invention.
20 is a flowchart sequentially showing a method of manufacturing a display module according to an embodiment of the present invention.
21 to 28 are views showing the configurations according to FIG. 20.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
<LED display module>
1 is a view showing one pixel unit in an LED display module according to an embodiment of the present invention. FIG. 2 is a vertical sectional view taken along II-II of FIG. 1. 3 is a view showing various examples of the electrode pads of FIG. 1. FIG. 4 is a layer-by-layer drawing of a plurality of pixel units arranged in an arrayed LED LED display module to illustrate a top layer (TOP), a first layer (L10), and a second layer (L20) in a vertical cross-sectional view of FIG. 2. to be. 5 is vertical for each layer
As a cross-sectional view, (b) is a cross-sectional view taken along III-III of (a). (c) is a cross-sectional view taken along IV-IV in (a). The LED LED display module of the present invention includes a plurality of pixel units arranged in a matrix form having a row direction and a column direction, and one pixel unit includes a red LED, a green LED and a blue LED, a micro LED array, A substrate including a top layer on which the pixel units are mounted, a first layer positioned below the top layer, and a second layer positioned below the first layer, and formed on the substrate, the pixel Each of the LEDs in the unit includes pairs of electrode pads to which the first electrode and the second electrode are connected.
One pixel unit includes a red LED PL11, a green LED PL12, and a blue LED PL13, as shown in FIG. 1. The LEDs PL11, PL12, and PL13 are each mounted on a corresponding pair of electrode pads. The red LED (PL11) is mounted on the R electrode pad pair (R11a, R11b), the green LED (PL12) is mounted on the G electrode pad pair (G11a, G11b), and the blue LED (PL13) is the B electrode pad pair (B11a) , B11b). Each of the electrode pad pairs R11a, R11b, G11a, G11b, B11a, and B11b is divided into first electrode pads R11a, G11a, and B11a and second electrode pads R11b, G11b, and B11b. That is, the first electrode pad R11a to which the first electrode of the red LED PL11 is connected, and the second electrode pad R11b to which the second electrode of the red LED PL11 is connected (R11a and R11b are a pair of R electrode pads) ), the first electrode pad G11a to which the first electrode of the green LED PL12 is connected, and the second electrode pad G11b to which the second electrode of the green LED PL12 is connected (G11a and G11b are a pair of G electrode pads) ), the first electrode pad (B11a) to which the first electrode of the blue LED (PL13) is connected, the second electrode pad (B11b) to which the second electrode of the blue LED (PL13) is connected (B11a and B11b are a pair of B electrode pads) ). From the perspective of the LED LED display module in which such pixel units are arranged in a row and column direction in a matrix form, a plurality of electrode pad pairs for mounting the pixel units within a limited area are formed on the substrate at substantially the same spacing and the same size. Since the size of the LEDs and the size of the LEDs must be considered, the size of the electrode pads is greatly restricted. In order to reduce the size of the electrode pads, a connection portion between a via and an electrode pad in a multi-layer substrate must also be considered for efficient wiring, while increasing the size of the electrode pads or cross-sectioning like conventional electrode pads. In the case of the rectangular shape, as mentioned above, in the reflow process, the solder ball flows to the edge portion (see "E" in FIG. -1), and a tilt phenomenon occurs in which the mounted LED chip is distorted, yielding. Will have a significant effect on
Therefore, in the LED LED display module of the present invention, in the arrangement of the electrode pad pairs (eg, R11a, R11b) on the substrate, the peripheral spacing of each of the electrode pad pairs is formed wider than the central spacing. That is, the pair of electrode pads to which the first electrode and the second electrode of each of the LEDs in the pixel unit are connected includes a facing portion, and the interval between the facing portions of each of the pair of electrode pads is rectangular in cross section. Unlike the conventional case, the central gap between the facing portions is not constant and is formed to be relatively narrower than the peripheral gap. Here, the facing portion is a portion facing each other in the first electrode pad (for example, R11a) and the second electrode pad (R11b) forming one electrode pad pair, and as shown in FIG. 3, connects between the lowest points of the electrode pads. The angle A formed by the tangent line L2 at one point on the outer edge of the electrode pads in one line L1 is defined as an acute angle and the outer edges F1 and F2 close to the corresponding electrode pad. The angle A is an angle measured in a counterclockwise direction when measured in the lower portion of the electrode pad in the drawing, and an angle measured in a clockwise direction when measured in the upper portion of the electrode pad. In addition, when considering the center line connecting the center of the electrode pads, the center gap is defined as the distance d1 between two points in the facing portion of the electrode pads located on the center line. That is, d1 is the minimum interval. When the cross sections of the first electrode pad R11a and the second electrode pad R11b are circular as shown in FIG. 3(a), when the electrode pads R11a and R11b are respectively divided by drawing a vertical line based on a center point, , The right half of the outer edge of the first electrode pad R11a and the left half of the outer edge of the second electrode pad R11b are facing portions. In addition, when the cross section is circular as shown in (a) or the vertices face each other, there is only one straight line with a center distance d1, but in the case of a polygon of the form (b), some sections in the face portion There are several minimum distances d1 in. Therefore, in this case, the center portion appears as a partial section having the minimum distance d1, which is also defined as the center portion spacing.
In addition, when the cross section of the electrode pad is polygonal as in (b) and (c), the face portion is less than half of the outer edge. The peripheral portion spacing is a portion having a spacing other than the portion having the minimum spacing d1 in the face portion, and is a portion having a relatively wide spacing than the central spacing. In addition, in a multi-layer substrate, a cross-sectional view taken along II-II in FIG. 1 may have the structure in FIG. 2. Referring to FIG. 2, first electrode pads R11a, G11a, and B11a are positioned under LEDs PL11, PL12, and PL13 constituting the pixel unit. For discrimination, R11a is referred to as a first R electrode pad, G11a is referred to as a first G electrode pad, and B11a is referred to as a first B electrode pad. The first electrode of the red LED (PL11) is connected to the first R electrode pad (R11a), the first electrode of the green LED (PL12) is connected to the first G electrode pad (G11a), and of the blue LED (PL13) The first electrode is connected to the first B electrode pad B11a. Although not shown, the connection structure between the second electrode of the LEDs and the second electrode pads is the same. However, as described later with reference to FIG. 5(c), the connection between the vias and the wires below the electrode pads is different. Here, the first electrode of each of the LEDs may be a cathode terminal, and the second electrode may be an anode terminal. The electrode pad pairs are formed on the top layer (TOP), the row direction wiring (not shown) is formed on the first layer (L10), and the column direction wiring (not shown) is formed on the second layer (L20).
Also, the first vias RV11, GV11, and BV11 are connected to connect the column direction wiring and the first electrode pads R11a, G11a, and B11a, and the row direction D1 wiring and the second electrode pads are included. And second vias for connecting the liver (see CV21 in FIG. 5(c)). In FIG. 2, RC11, GC11, and BC11 are contact portions for connection to the column direction wiring, and SB11, SB12, and SB13 are formed on the first electrode and the top layer (TOP) of each of the LEDs (PL11, PL12, PL13). 1 These are solder balls for electrically connecting between electrode pads (R11a, G11a, B11a), and are connected through a reflow process. Although not shown, the connection structure between the second electrode and the second electrode pads of the LEDs PL11, PL12, and PL13 is the same. 3 shows some examples of electrode pad pairs. As shown in (a), the cross section of each of the electrode pad pairs may be formed in a circular shape, as shown in (b), may be a polygon in the form of a truncated edge portion in a square shape, or a hexagonal shape as in (c) As, the vertices may be formed to face each other. As such, instead of the conventional rectangular cross-section, the spacing of the facing portions is not constant (d1, d2), and the central spacing d1 is formed to be relatively narrower than the peripheral spacing in the facing portion. In addition, in FIG. 3, RV11 is a first via for connecting a column direction wiring formed in the first R electrode pad R11a and the second layer L2, and CV11 is a row row wiring with the second R electrode pad R11b. It is the second via for connecting. As mentioned above, even if the area of the electrode pad pairs is reduced, the outer edge of the upper end of the first via should be formed so as not to deviate from the outer edge of the first electrode pad. Similarly, in the second electrode pad and the second via, similarly, the outer edge of the upper end of the second via should be formed so as not to deviate from the outer edge of the second electrode pad. In addition, the shape of the pair of electrode pads, in addition to that shown in Figure 3, may be formed of a corner portion of a polygon (at least a pentagon or more) as a curved surface, or may be formed in various other structures.
Next, to describe a structure in which a plurality of pixel units are arranged in a matrix form, refer to FIGS. 4 and 5. 4 and 5, in the LED LED display module according to an embodiment of the present invention, the micro LED array, a plurality of pixel units arranged in a matrix form having a row direction (D1) and a column direction (D2) Includes One pixel unit (see FIG. 1) includes a red LED PL11, a green LED PL12, and a blue LED PL13. In the present specification, the row direction D1 is a unit connected so that a scan signal is commonly applied when scanning in a row unit, and the column direction D2 means one unit for current sinking. The row direction D1 is connected to each pixel unit, and the column direction is connected to each LED in the pixel unit.
In the present specification, the expression that any one component is connected to another component is used to mean that two components are directly and electrically connected to each other. In addition, in the LED LED display module of the present invention, it is preferable that the red LED, the green LED, and the blue LED constituting one pixel are all flip-bonded. The substrate in which the LEDs in the plurality of pixel units are mounted in the row direction (D1) and the column direction (D2) includes a top layer (TOP), a first layer (L10) under the top layer (TOP), and a first layer ( L10) a second layer (L20) of the lower portion, each of which is shown in Figure 4 (a), (b), and (c). In addition, as illustrated in FIG. 5, another layer L30 ′ for additional wiring may be further included under the second layer L20. When considering the finally-produced full-color LED display device, in the row direction D1, it is commonly connected in row units to receive scan signals in row units according to a predetermined scan period, and in the column direction D2 Is connected to the driver IC (not shown) side for current sinking. The connection in the column direction D2 is independently connected so that the LEDs can be individually controlled in one pixel unit.
Of course, the first electrode pads (for example, N11, N21 and N31) to which the first terminals of the neighboring LEDs are mounted in the column direction D2 are commonly wired to each other. With this configuration, the full-color LED display device receives a scan signal from top to bottom or bottom to top in row units according to a predetermined scan period, and in the column direction D2, red LEDs, green LEDs, and blues in pixels. It is implemented so that each LED can perform current sinking independently and adjust color or brightness. Looking at each layer in detail, as shown in Figure 4 (a), a plurality of second electrode pads (C11, C21, C31,...) and a plurality of second electrode pads (N11, N21, N31) , ...) are formed on the top layer (TOP) of the substrate. Electrode pad pairs (eg, C11, N11) corresponding to each of the red LED, green LED, and blue LED constituting one pixel unit are formed, and the red LED, green LED, and blue LED are mounted in each column direction. As illustrated, the first electrode pad N11 includes a first R electrode pad R11a, a first G electrode pad G11a, and a first B electrode pad B11a, and the second electrode pad C11 ) Includes a second R electrode pad R11b, a second G electrode pad G11b, and a second B electrode pad B11b. The first electrode of each of the LEDs in one pixel unit is connected to each of the first R electrode pad (R11a), the first G electrode pad (G11a), and the first B electrode pad (B11a), and the second of each of the LEDs. The electrode is connected to the second R electrode pad R11b, the second G electrode pad G11b, and the second B electrode pad B11b. Here, the first electrode may be a cathode terminal, and the second electrode may be an anode terminal. In addition to the second electrode pads (R11b, G11b, B11b) on which LEDs constituting one pixel unit are mounted, second electrode pads (for example, C11, C12) to which neighboring pixel units are connected in the row direction (D1) ) Is applied to the common scan signal through the row direction wiring (30' of (b)). And, as shown, each of the first electrode pads (R11a, G11a, B11a) and the second electrode pads (R11b, G11b, B11a) on which the LEDs constituting one pixel unit are mounted, each has a row direction (D1) ). Furthermore, the second electrode pads (for example, N11 and N21) neighboring in the column direction D2 are connected through common column direction wirings 31R, 31G, and 31B of (c).
In this way, a pair of electrode pads including a first electrode pad and a second electrode pad are formed in a row direction so that a red LED, a green LED, and a blue LED can be arranged in a row direction D1 within one pixel unit. . In addition, when the number of pixel units is expressed by m * n (m is the number of columns and n is the number of rows), the number of row direction wirings (reference numerals 30a', 30b, 30c in FIG. 4B) is n Dogs, and the number of column wirings (reference numerals 31R, 31G, 31B, ... in FIG. 4C) is 3 m pieces. In the first layer L10 positioned under the top layer TOP and the second layer L20 positioned under the first layer L10, the row direction wiring 30' and the column direction wiring 31R, 31G, 31B), the second electrode pads (eg, C11 and C12) adjacent in the row direction D1 are line-aligned, and the first electrode pads adjacent in the column direction D2 are aligned. 1 R electrode pads (example
For example, R11a and R21a are line-aligned in the column direction, and adjacent first G electrode pads (eg, G11a and G21a) in the column direction D2 are also line-aligned in the column direction D2, and the column direction D2 ), it is preferable that the adjacent first B electrode pads (for example, B11a, B21a) are also line-aligned in the column direction D2. In the first layer L10 shown in FIG. 4B, row Row direction wirings 30' are formed to correspond to the number. Through the row direction wiring 30', a scan signal is applied according to a predetermined scan period in a row unit to supply an operating voltage to each pixel. The row direction wiring 30 ′ of the first layer L10 is connected to the second electrode pads of the top layer TOP positioned on a row basis. The second electrode pads (eg, C21) formed on the top layer (TOP) and the row direction wiring (eg, 30b) formed on the first layer (L10) are connected through the second vias (CV21) (Fig. 5). (c) Section III-III). Although only the second vias CV21 are shown as one, the second electrode pads (eg, R11b, G11b, and B11b) are respectively connected to the second electrode pads (eg, one pixel unit). When the second electrode pads to be connected are referred to as one second electrode pad group, each of the second electrode pad groups) must be connected to the row direction wiring of the first layer L10. Therefore, the second vias are provided to correspond to the positions of the second electrode pads. In addition, the first layer (L10) has a column direction wiring (for example, 31R, 31G, 31B) formed in the lower second layer (L20) and the upper
The via holes VH are formed so that vias for connecting between the second electrode pads N11, N21, and N31 formed on the top layer (TOP) (RB11, GV11, BV11 in FIG. 5) can pass through. Is formed. In the second layer L20 illustrated in FIG. 4C, column direction wirings 31R, 31G, 31B, 32R, 32G, 32B, ... are formed. A plurality of column direction wirings may be formed to correspond to the number (m) of columns of the pixel unit. The correspondence is not a one-to-one correspondence to the number of rows of pixels, but 3m pieces are formed so that LEDs in one pixel can be controlled independently. For example, a set of column wiring lines denoted by reference numerals 31R, 31G and 31B is formed of m sets. In one set of column wiring lines, each column wiring line includes three sub lines, namely an R line (eg, 31R), a G line 31G, and a B line 31B. For example, the first R electrode pads R11a, R21a, and R31a neighboring in the column direction are connected to the R line 31R, and the first G electrode pads G11a neighboring in the column direction to the G line 31G. , G21a, G31a are connected, and the first B electrode pads B11a, B21a, B31a adjacent in the column direction are connected to the B line 31B. In addition, the thermal wiring, so that the electrical connection with the first electrode pad (R11a) of the top layer (TOP) via vias (RV11 in Figure 5 (b)) in the thermal wiring lines (for example, 31R), can be In the line 31R, contact portions RC11 having a relatively wide wiring width may be formed.
Next, with reference to FIG. 5, the wiring relationship between the top layer (TOP), the first layer (L10) and the second layer (L20) will be further described. Figure 5 (b) is a cross-sectional view of III-III to illustrate the vertical structure between the first electrode pads (R11a, G11a, B11a; N11) in (a), Figure 5 (c) is To illustrate the vertical structure between the second electrode pad C21 and the first electrode pad B21a in (a), an IV-IV cross section is illustrated. As shown in section III-III (FIG. 5(b)), the first electrode pads R11a, G11a, and B11a are column-directed wirings formed in the corresponding second layer L20 (FIG. 4). It is connected to the contact portions (RC11, GC11, BC11) in the 31R, 31G, 31B. The contact portions RC11, GC11, and BC11 and the first electrode pads R11a, G11a, and B11a are formed with first vias RV11 and GV11 formed through a via hole (VH in FIG. 4) formed in the first layer L10. , BV11). That is, in order to configure one pixel unit, the first R electrode pad R11a to which the red LED is connected is a contact portion RC11 in the column direction wiring 31R formed in the second layer L20 through RV11 among the first vias. ), and the first G electrode pad G11a to which the green LED is connected is connected to the contact portion GC11 in the column direction wiring 31G formed in the second layer L20 through GV11 among the first vias, and the blue LED is The first B electrode pad B11a to be connected is connected to the contact portion BC11 in the column direction wiring 31B formed in the second layer L20 through BV11 among the first vias.
In addition, as shown in the IV-IV cross-section (FIG. 5(c)), the first electrode pad (B21a in (c)) described above is the column direction wiring 31B formed in the second layer L20. Compared to the inner contact portion BC21, the second electrode pad B21b is connected to the row direction wiring 30b formed in the first layer L10 through the second via CV21. Among the second electrode pads C21, only a cross section is shown for B21b, but this connection type may be applied to all second electrode pads. That is, all the second electrode pads are connected to the row direction wirings formed in the first layer L10 through the second vias. And, as mentioned above, the scan signal applied in units of rows is applied through the row direction wirings (30a', 30b, 30c of FIG. 4) formed in the first layer L10. In the drawings, the number of first electrode pads of the top layer TOP, the number of second electrode pads, the number of row direction wirings formed in the first layer L10, and the number of column direction wirings formed in the second layer are: Considering the size of the LED display device, it can be changed to various numbers (m * n pieces) as needed. For example, assuming that the number of pixel units disposed in the LED LED display module is 2 * 2, that is, four, the description will be given with reference to FIGS. 4 and 5. The pixels are divided into a first pixel unit, a second pixel unit, a third pixel unit, and a fourth pixel unit, and the first pixel unit and the second pixel unit are adjacent in the row direction D1, and the third pixel unit is The four pixel units are also adjacent in the row direction D1. The first pixel unit and the third pixel unit are adjacent in the column direction D2, and the second pixel unit and the fourth pixel unit are also adjacent in the column direction D2. In the top layer (TOP) for mounting the LEDs constituting the first to fourth pixel units, a first electrode pad N11 corresponding to the first pixel unit and a first electrode pad N12 corresponding to the second pixel are provided. , A first electrode pad N21 corresponding to the third pixel unit, and a first electrode pad N22 corresponding to the fourth pixel unit are formed. In addition, the top layer TOP includes a second electrode pad C11 corresponding to the first pixel unit, a second electrode pad C12 corresponding to the second pixel unit, and a second electrode pad corresponding to the third pixel unit ( C21), a second electrode pad C22 corresponding to the fourth pixel unit is formed. Each of the first electrode pads N11, N12, N21, and N22 includes a first R electrode pad, a 1G electrode pad, and a first B electrode pad. The first electrode of the red LED is connected to each of the first R electrode pads, the first electrode of the green LED is connected to each of the first G electrode pads, and the first electrode of the blue LED is connected to each of the first B electrode pads. It is connected. In addition, a second electrode of a red LED, a green LED, and a blue LED in each pixel is connected to each of the second electrode pads. The second electrode is commonly connected to the column direction wiring from the bottom via the second via. In this way, each of the red LED, green LED, and blue LED in each pixel unit is arranged in the column direction D2, and is arranged adjacent to the row direction D1. In the first layer L10, row direction wirings 30a' and 30b for electrically connecting second electrode pads adjacent in the row direction D1 are formed. In addition, via holes for connecting between the first electrode pads and the column direction wirings 31R, 31G, 31B, 32R, 32G, 32B formed on the first electrode pads and the second layer 20 through the first layer L10 ( VH) is formed. The second electrode pads and the row wirings are connected through second vias (CV21 in FIG. 5C ). In the second layer L20, column direction wirings 31R, 31G, 31B, 32R, 32G, and 32B are formed. The contact portions (RC11, RC21, GC11, GC21, RC11, GC21) formed at a position corresponding to each of the first electrode pads of the top layer (TOP) in the column direction wirings, compared to other portions in the column direction wirings , RC12, GC12, BC12, RC22, GC22, BC22) are formed. In addition, the contact parts and the first electrode pads are connected through the first vias (RV11, GV11, BV11 in FIG. 5B). Through this configuration, the LED LED display module of the present invention can arrange routing in a row direction by arranging first electrode pads to which the first electrodes of the LEDs are independently connected within one pixel, thereby simplifying the routing and adjusting the pixel spacing. Can be reduced. In addition, since the cross-section of the conventional electrode pads is formed in a rectangular shape, a phenomenon in which a solder ball is melted and skewed to the edge region of the electrode pads during the reflow process is solved, and the LEDs mounted on the electrode pads are solved. By doing so, it has the effect of improving the yield.
<How to manufacture LED display module>
20 to 28, an LED display module manufacturing method based on an LED display module and an inspection device for inspecting via holes described in the present specification includes: preparing a substrate; Preparing a plurality of pixel units; And mounting the pixel units on the substrate, wherein the substrate undergoes a via hole inspection process that is previously formed through a via hole inspection device.
The via hole inspection apparatus includes a loading area (A) for mounting a substrate, an unloading area (B), a first inspection area, and a first area to be photographed on the side of the first inspection area for imaging the substrate. 2 An inspection housing provided with an inspection area 10, an unloading unit 30 on which the substrate is inspected, and a first transfer unit 40 for transporting the substrate, the first inspection area and the It includes a second transfer unit 50 for transporting the substrate between the second inspection area, and a hole photographing unit 60 for photographing the substrate for each predetermined shooting section.
The inspection housing 10 is provided with a mounting unit at the bottom, and the mounting unit has a mounting body portion 110 on which the inspection housing 10 is mounted, and a rectangular parallelepiped shape provided under the mounting body portion 110. The first structure 111, which is a polygonal structure, and the second structure 112, which is a polygonal structure having a rectangular parallelepiped shape provided under the mounting body part 110, and the lower part of the mounting body part 110 are provided in the A third structure 113, which is a polygonal structure having a rectangular parallelepiped shape located between the first structure 111 and the second structure 112, and the third structure 113, which are provided below the mounting body portion 110, The second structure 112 further includes a fourth structure 114 that is a polygonal structure having a cuboid shape. In the first structure 111 and the third structure 113, first extensions 111a and 3-1 extensions 113a1 protrude in mutually opposite directions, respectively, and the second structure 112 ) And the fourth structure 114, the second extension portion 112a and the fourth-1 extension portion 142a1 are protruded in opposite directions, respectively.
The 3rd structure 113 and the 4th structure 114, the 3-2 extension part 112a and the 4-2 extension part 142a2 protrude in mutually opposing directions, respectively, and the mounting unit is , It is provided between the first structure 111 and the third structure 113, the first extension part 111a and the third-1 extension part by reciprocating movement between the upper side and the lower side in the free space LS1. The first rotating body 115 of a polygonal shape, and the second structure 112 and the fourth, which are in pressure contact with (113a1) and are provided to enable vertical rotation in a forward rotation or a reverse rotation method in the pressure contact state. It is provided between the structures 114 and is in pressure contact with the second extension part 112a and the 4-1 extension part 142a1 by reciprocating movement between the upper side and the lower side in the free space LS2, and in a pressurized contact state. It is provided between the second rotating body 116 of the polygonal shape and the third structure 113 and the fourth structure 114 that are provided to enable vertical rotation of the forward rotation or the reverse rotation method, and the clearance space LS3 is provided. ) In the reciprocating movement between the upper and lower in the pressure contact with the 3-2 extension part (112a) and the 4-2 extension part (142a2), the vertical rotation of the forward or reverse rotation in the pressure contact state It includes a third rotating body 117 of a polygonal shape provided to enable this.
The inspection housing 10 is located between the first structure 111 and the third structure 113, and is located below the first extension part 111a and the 3-1 extension part 113a1. The polygonal first sub-rotator 121 is provided, and between the second structure 112 and the fourth structure 114, the second extension part 112a and the 4-1 extension part ( 142a1) is provided with a second sub-rotary body 122 of a polygonal shape.
Between the third structure 113 and the fourth structure 114, the third sub having a polygonal shape located below the third-2 extension part 112a and the fourth-2 extension part 142a2. A rotating body 123 is provided, and the first sub-rotating body 121 is capable of reciprocating up and down, and is pressed against the lower portion of the first extension portion 111a and the 3-1 extension portion 113a1. And, it is rotated in the same or opposite direction to the first rotating body 115 in a contact-pressurized state.
The second sub-rotation body 122 is capable of reciprocating up and down and contacting and pressing the lower portion of the second extension portion 112a and the fourth-1 extension portion 142a1, and the second in the contact pressurized state. The rotation body 116 rotates in the same or opposite direction, and the third sub-rotation body 123 is capable of reciprocating up and down, and the 3-2 extension part 112a and the 4-2 extension part ( 142a2) is contact-pressed, and rotates in the same or opposite direction to the third rotating body 117 in a contact-pressed state.
The first structure 111 to the fourth structure 114 further includes a supporting portion 130 provided below, the supporting portion 130, the first sub-rotating body 121 is raised upwards ), the first tumbling body 131 for pressing, and the second tumbling body 132 for releasing upward and pressing the second sub-rotating body 122, and the third sub-rotating body for releasing upward (123) is provided with a third emergent body 133 for pressing. The first and second rotators 131 to 133, the first sub-rotator 121 to the third sub-rotator 123, respectively, the first extension 111a to the In the state of pressing the 4-2 extension part 142a2, it protrudes upward and presses.
The first rotating body 115 is provided with a first protrusion B1 mounted on the first extension 111a and the 3-1 extension 113a1 under the first protrusion B1. ) By applying a rotational pressing force to the first extension part 111a and the 3-1 extension part 113a1, and the second rotation body 116 has the second extension part 112a at the bottom. And a second protrusion B2 mounted on the 4-1 extension 142a1, so that the second extension 112a and the 4-1 extension are interposed through the second protrusion B2. A rotary pressure force is applied to (142a1).
The third rotating body 117 is provided with a third protrusion (B3) mounted on the third-2 extension part (112a) and the fourth-2 extension part (142a2) at the bottom, so that the third protrusion Rotational pressing force is applied to the 3-2 extension part 112a and the 4-2 extension part 142a2 via (B3).
The first sub-rotation body 121 is provided with a first sub-protrusion (SB1) mounted on the first extension 111a and the 3-1 extension 113a1 at the bottom, so that the first sub A rotational pressing force is applied to the first extension portion 111a and the 3-1 extension portion 113a1 through the projection portion SB1. The second sub-rotation body 122 is provided with a second sub-protrusion portion SB2 mounted on the second extension portion 112a and the 4-1 extension portion 142a1 at the bottom thereof, so that the second sub A rotational pressing force is applied to the second extension part 112a and the 4-1 extension part 142a1 through the protrusion SB2.
The third sub-rotation body 123 is provided with a third sub-protrusion (SB3) mounted on the third-2 extension portion (112a) and the fourth-2 extension portion (142a2) at the lower portion. 3 A rotary pressing force is applied to the 3-2 extension part 112a and the 4-2 extension part 142a2 via the sub-projection part SB3.
The support unit 130, the first driving unit 151 capable of flowing in a certain range on one side, and the first driving unit 151 is provided on the upper portion of the polygonal first binding to the first structure 111 The government 153, a second driving part 152 capable of flowing in a certain range on the other side, and a second fixing part of a polygonal shape provided on the second driving part 152 and bound to the second structure 112 ( 154) is provided, the first fixing portion 153 is provided on the side, a plurality of first mounting projection (LT1) selectively protruding into the interior of the side portion of the first structure 111, the first 1 A certain range flows downward from the driving unit 151 to apply a downward pressing force.
The second fixing part 154 is provided in a large number on the side, and when the second mounting protrusion (LT2) selectively protruding enters the inside of the side portion of the second structure 112, the second driving part 152 It flows down a certain range and exerts downward pressure. At least one of the first structure 111 to the fourth structure 114 is rotated in a horizontal direction in a horizontal direction on the mounting body portion 110 and the support portion 130.
The first structure 111 to the fourth structure 114 includes an interlocking module 160 for interlocking each other, and the interlocking module 160 includes the third structure 113 and the fourth structure. The first upper mounting body 161 which is inserted and mounted in 114, and the first upper fluid 162 provided as one of the first upper mounting bodies 161 as a “c” shaped structure, and “c “A first interlocking module 160 including a second upper fluid 163 provided in the other direction of the first upper mounting body 161 as a child-shaped structure, the third structure 113 and the fourth The first lower mounting body 164 which is inserted and mounted in the structure 114, and the first lower fluid 165 provided as one of the first lower mounting bodies 164 as a “U” shaped structure, and ” As a "c-shaped" structure, the second interlocking module 160 including the second lower fluid 166 provided as the other of the first lower mounting body 164 is included.
The first upper fluid 162 of the first interlocking module 160 is mounted on the outside of the first fixing part 153 to the inner side, and is retracted a certain range to the inner side of the first upper mounting body 161, the The second upper fluid 163 of the second interlocking module 160 is mounted on the outside of the second fixing part 154 to the inner side, and is retracted by a predetermined range toward the inner side of the first upper mounting body 161.
The first lower fluid 165 of the second interlocking module 160 is mounted on the outside of the first fixing part 153 to the inside, and is retracted by a certain range to the inside of the first lower mounting body 164, the The second lower fluid 166 of the second interlocking module 160 is mounted on the outside of the second fixing part 154 to the inner side, and is retracted by a predetermined range toward the inner side of the first lower mounting body 164. The first lower mounting body 164 of the second interlocking module 160 is provided with a predetermined interlocking structure LM above, and the first upper mounting body 161 of the first interlocking module 160 is provided. Is bound to the interlocking structure LM, and the first lower mounting body 164 and the first upper mounting body 161 flow upwards of the interlocking structure LM on the first lower mounting body 164. Alternatively, a fixing force is generated between each other based on the downward flow.
The first upper mounting body 161 is provided as a pair facing each other, the first upper fluid 162 is provided in each of the pair of the first upper mounting body 161, a pair of driven each 1 movable body (162a) is provided, a pair of the first movable body (162a) is provided with a first rotary driving unit (162b) for generating a rotational force at each end, the first rotary driving unit (162b) A first contact body 162c for pressing the outside of the first fixing part 153 is provided therebetween, and the first contact body 162c has a polygonal cross-section, so that it is engaged with the first fixing part and mounted. It is provided, and is rotated in a forward rotation or reverse rotation manner to apply a rotational pressing force to the first fixing portion 153.
The second upper fluid 163 is provided on each of the pair of first upper mounting bodies 161, and is provided with a pair of second movable bodies 163a to be driven, and a pair of the second movable bodies Each of the (163a) is provided with a second rotary drive (163b) for generating a rotational force at the end. A second contact body 163c for pressing the outside of the second fixing part 154 is provided between the second rotation driving parts 163b, and the second contact body 163c has a polygonal cross-section. It is provided so as to be engaged with the second fixing part, and rotates in a forward or reverse rotation manner to apply rotational pressing force to the first fixing part 153.
The first lower mounting body 164 is provided as a pair facing each other, the first lower fluid 165 is provided in each of the pair of the first lower mounting body 164, a pair of driven A third movable body (165a) is provided, a pair of the third movable body (165a) is provided with a third rotary driving unit (165b) for generating a rotational force at each end, the third rotary driving unit (165b) A third contact body 165c for pressing the outside of the first fixing part 153 is provided between them, and the third contact body 165c has a polygonal cross-section and is fitted with the first fixing part. It is provided as possible, and rotates in a forward or reverse rotation manner to apply a rotational pressing force to the first fixing part 153.
The second lower fluid body 166 is provided in each of the pair of first lower mounting bodies 164, and is provided with a pair of fourth movable bodies 166a to be driven, and a pair of the fourth movable bodies Each of the (166a) is provided with a fourth rotary driving unit (166b) for generating a rotational force at the end, a fourth contact for pressing the outside of the second fixing unit 154 between the fourth rotary driving unit (166b) A sieve 166c is provided. The fourth contact body 166c has a longitudinal cross-section and is provided to be engaged with the second fixing part, and is rotated in a forward or reverse rotation manner to apply rotational pressure to the second fixing part 154. Add. A second mounting unit 55 adjacent to the mounting unit is further included, and the second mounting unit 55 and the sinking unit are provided to interlock with each other by the composite interlocking body 180.
The composite interlocking body 180 includes a first interlocking fastener 171 in a polygonal shape that is bound to the lower portion of the support unit 130 of the mounting unit, and the first under the first interlocking fastener 171. The first interlocking body 182 for rotating the interlocking fastener 171 in the circumferential direction, and the second interlocking fastener 171 in a polygonal shape that is bound to the lower portion of the supporting part 135 of the second mounting unit 55 And, a second interlocking body 183 for rotating the second interlocking fastener 171 in the circumferential direction under the second interlocking fastener 171, and the first interlocking body 182 and the second interlocking It is provided between the body 183, the both ends of the first interlocking body 182 and the second interlocking body 183 further includes a base driving body 181 that is interlocked to the inside and is provided to be able to flow back and forth.
<Via hole inspection device of substrate>
6 to 19, a via hole inspection apparatus of a substrate according to an embodiment of the present invention is a via hole processed by a laser drilling machine facility on a flexible substrate S It is the operator to visually inspect the processing status of. The via hole inspection apparatus of the substrate according to an embodiment of the present invention implements a non-contact inspection method in which an operator does not contact the substrate S in the inspection of the via hole, while inspecting and handling the inspection process and handling of the substrate S (substrate S) Input and discharge, inspection of the substrate (S), transfer of the substrate (S), etc.) can be automated inline. The via-hole inspection apparatus of the substrate according to an embodiment of the present invention may inspect via hole inspection items, such as inspection of whether a via hole is processed, inspection of an eccentricity of a via hole, inspection of a through hole shape, and inspection of a through hole diameter of a via hole based on a photographed image. It can be done.
In one embodiment of the present invention, the first direction indicates the slide movement direction in the X-axis direction, the second direction indicates the slide movement direction in the Y-axis direction, and the height direction indicates the elevation movement direction in the Z-axis direction. . The via hole inspection apparatus of the substrate according to an embodiment of the present invention includes an inspection housing 10, a loading unit 20, an unloading unit 30, a first transfer unit 40, and a second transfer unit ( 50), a hole photographing unit 60, and a display unit 70, and further includes an inspection operation unit 81, a transfer operation unit 82, and a control unit 80.
The inspection housing 10 forms an exterior. The inspection housing 10 includes a loading area A for seating the substrate S to be inspected in a flat state as shown in FIG. 6 and an unloading area arranged on one side of the loading area A along the first direction ( B), the first inspection area W1 disposed between the loading area A and the unloading area B, and the first along the second direction intersecting the first direction for imaging the substrate S It can be divided into a second inspection area (W2) disposed on one side of the inspection area (W1). Then, the first inspection area W1 is used as a buffer space required for loading the substrate S, unloading the substrate S, and inspecting the substrate S. The transport wheel 11 is rotatably coupled to the bottom of the inspection housing 10 to smoothly move the inspection housing 10. The height adjustment part 12 is screwed to the bottom of the inspection housing 10 to accurately adjust the level of the inspection housing 10 at the installation site. On the front of the inspection housing 10, an operation table 13 in which an inspection operation unit 81 is installed may be protruded.
A control input unit 83 to be described later may be installed on the operating table 13. The loading unit 20 is loaded with the substrate S to be inspected. The loading unit 20 is provided in the loading area (A). The loading unit 20 is provided in the loading area 21 in which the substrate S to be inspected is loaded with the substrate sensing hole portion 214 formed therethrough, and the loading area A so that the loading loading portion 21 is seated. It may include a loading support unit 22 provided, and a substrate sensing unit 201 for sensing the substrate S loaded on the loading loading unit 21 through the substrate sensing hole unit 214. Here, the substrate sensing hole portion 214 is formed through the bottom of the loading loading portion 21 so that the substrate sensing portion 201 is exposed. In addition, a plurality of loading wing portions 211 supporting the edge of the substrate S to be loaded may be formed to protrude in the height direction in the loading loading portion 21. Further, in the loading loading part 21, the substrate S to be loaded is guided to the bottom of the loading loading part 21, and is directed toward the outside of the loading loading part 21 from the upper end of the loading wing part 211 so that it is in position. The loading extension 212 that is formed to be inclined may be formed to protrude. In addition, a loading direction wing portion 213 indicating the loading direction of the substrate S may be provided on the loading loading portion 21. Here, a plurality of loading support parts 22 are spaced apart from each other in the loading area A. A loading seating groove 221 in which the edge of the loading loading portion 21 is seated and supported may be formed in the loading supporting portion 22 corresponding to the edge of the loading loading portion 21 among the loading supporting portions 22. In addition, the loading guide 22 is formed with an inclined loading inducing portion 222 leading the edge of the loading loading portion 21 to the loading seating groove 221 so that the loading loading portion 21 is correctly positioned in the loading supporting portion 22. Can be.
Here, the substrate sensing unit 201 senses the substrate S exposed through the substrate sensing hole unit 214. And when the substrate (S) of the loading and loading unit 21 is all transported to the second transfer unit 50 by the first transfer unit 40, the substrate sensing hole 214 is exposed, thereby the substrate sensing unit 201 Since the substrate S is not sensed, a substrate member signal is generated in the substrate sensing unit 201, and the control unit 80 finally transmits the substrate to the second transfer unit 50 based on the substrate member signal. After delivering (S) to the unloading unit 30,
After moving the first transfer unit 40, the second transfer unit 50, and the hole photographing unit 60 to the initial position, the inspection ends. Then, the loading unit 20 is replaced in the loading area A, the unloading unit 30 is replaced in the unloading area B, and then the substrate S of the replaced loading unit 20 is inspected again. Can. The unloading unit 30 is loaded with the substrate S that has been inspected. The unloading unit 30 is provided in the unloading area B. The unloading unit 30 forms a slide movement path of the unloading loading part 31 on which the inspected substrate S is loaded and the unloading loading part 31.
The unloading rail part 32, the mounting restriction part 33 for determining the sliding position of the unloading loading part 31 in the unloading area B, and the unloading loading part in the unloading area B ( 31) may include a loading unit sensing unit 301 for sensing. Here, the unloading loading part 31 may be provided with an exact seating part 311 coupled with the mounting limiting part 33 to confirm the correct position in the unloading area B. In addition, the unloading loading part 31 may be provided with a loading gripping part 312 for gripping of an operator.
Here, the unloading rail part 32 may be provided with an unloading induction part 222 which guides the unloading loading part 31 that is input to the unloading area B to the unloading area B. The unloading induction part 222 may be provided inclined in the unloading rail part 32 so that the input part of the unloading rail part 32 is expanded. Here, the loading unit sensing unit 301 detects the unloading loading unit 31 in a state where the in-position seating unit 311 and the mounting limiting unit 33 are combined. When the loading of the substrate S, which has been inspected, is completed on the unloading loading part 31, the unloading loading part 31 moves along the unloading rail part 32 and is released from the unloading area B. Then, the combination of the fixed position seating part 311 and the mounting restriction part 33 is released, and the loading part sensing part 301 does not detect the unloading loading part 31, so the loading part sensing part 301 In, a loading member signal is generated, and the control unit 80 suspends a new inspection process based on the loading member signal. Then, when the new unloading loading part 31 is input and the loading part sensing part 301 detects the unloading loading part 31, a new inspection process can be smoothly performed.
The first transfer unit 40 adsorbs and transports the substrate S between the loading area A and the first inspection area W1, or the substrate between the first inspection area W1 and the unloading area B. (S) can be adsorbed and transported. The first transfer unit 40 is loaded on the loading unit 20 in the loading area (A), and the first adsorption unit 41 for adsorbing and supporting two opposite sides of the four sides of the substrate S to be inspected. , A second adsorption unit (42) for adsorbing and supporting two opposite sides of the four sides of the substrate (S) loaded on the second transfer unit (50) in the first inspection area (W1), and the first, A first connecting member 44 connecting the adsorption unit 41 and the second adsorption unit 42 to be spaced apart from each other, and a second connecting member connecting the inspection housing 10 and the first connecting member 44 (406), the first drive member 44 and the first drive unit 41 and the second drive unit 43 for moving up and down the suction unit 42 in the height direction with respect to the second connecting member ( The first adsorption unit 45 and the first adsorption unit provided in the loading area A and the first adsorption unit 45 for sliding the first adsorption unit 41 and the second adsorption unit 42 in the first direction based on 406) (41) may include a grip sensing unit 401 for detecting whether the substrate (S) is adsorbed and supported by a sheet.
The gripping sensing unit 401 may detect whether the single substrate S adsorbed by the first adsorption unit 41 is sufficiently spaced from the loading unit 20. When the gripping sensing unit 401 detects the substrate S between the first adsorption unit 41 and the loading unit 20, an error signal is generated, and the gripping sensing unit 401 is the first adsorption unit 41 ) And when the substrate S is not detected between the loading unit 20, a normal signal may be generated. Then, the control unit 80 temporarily stops the operation of the first transfer unit 40, the second transfer unit 50, and the hole photographing unit 60 based on the error signal so that the operator can correct the error. have. In addition, the control unit 80 can normally control the operation of the first transfer unit 40, the second transfer unit 50 and the hole photographing unit 60 based on the normal signal. Here, the first adsorption unit (41) corresponds to two opposite sides of the adsorption bracket (411) connected to the lifting driving unit (43) and the four sides of the substrate (S) to the opposite ends of the adsorption bracket (411). A pair of transfer adsorption rods 412 to which the adsorption force for adsorption of the substrate S is transferred, coupled to the transfer adsorption rod 412, which are respectively coupled to adsorb and support the edge of the substrate S by adsorption force
A transport adsorption nozzle 413 and an adsorption sensing unit 416 for sensing the substrate S supported by the transport adsorption nozzle 413 may be included. When the adsorption sensing unit 416 detects the substrate S, a normal signal is generated, and when the adsorption sensing unit 416 does not detect the substrate S, an error signal may be generated. Then, the control unit 80 temporarily stops the operation of the first transfer unit 40, the second transfer unit 50, and the hole photographing unit 60 based on the error signal so that the operator can correct the error. have. In addition, the control unit 80 can normally control the operation of the first transfer unit 40, the second transfer unit 50 and the hole photographing unit 60 based on the normal signal. The transport adsorption nozzle 413 is coupled to the transport adsorption rod 412 in a state in which a plurality of spaced apart from each other can prevent sagging or poor adsorption of the substrate (S).
The second adsorption unit 42, like the first adsorption unit 41, includes an adsorption bracket 411, a transport adsorption rod 412, a transport adsorption nozzle 413, and an adsorption sensing unit 416. Can. Since the second adsorption unit 42 has the same configuration as the first adsorption unit 41, a description thereof will be omitted. The first transport unit 40 is a hoist for guiding the hoisting movement of the first adsorption unit 41 or the second adsorption unit 42 based on the first connecting member 44 according to the operation of the hoist driving unit 43. The copper guide 431 and the first direction guide 451 for guiding the slide movement of the first connection member 44 based on the second connection member 406 according to the operation of the first direction driving unit 45 and , Support coupled to the first adsorption unit 41 or the second adsorption unit 42 to adsorb and support at least one of the other two sides except the two sides supported by the corresponding adsorption unit among the four sides of the substrate S The adsorption unit 47 and the first adsorption unit 41 and the second adsorption unit 42 are respectively coupled to the shock absorbing unit 48 for absorbing shock transmitted when adsorbing and supporting the substrate S, and the first At least one of the sheet separation units 49 coupled to the adsorption unit 41 or the second adsorption unit 42 to move the corner part up and down while adsorbing and supporting at least one corner part of the four corners of the substrate S It may further include any one.
The lifting driving guide 431 includes a first lifting guide coupled to the first connecting member 44 and a second lifting guide coupled to the first suction unit or the second suction unit 42. Then, according to the operation of the elevating driving unit 43, the second elevating guide may be moved up and down along the first elevating guide in a state of being movably coupled to the first elevating guide. The first direction guide 451 includes a first-first direction guide coupled to the second connection member 406 and a first-two direction guide coupled to the first connection member 44. Then, according to the operation of the first direction driving unit 45, the 1-2 direction guide may slide along the 1-1 direction guide in a state where the slide is slidably coupled to the 1-1 direction guide. In the first direction guide 451, the first direction limiting units 452 for setting the slide movement limit of the first connection member 44 may be arranged in a spaced apart state.
The support adsorption unit 47 is connected to the first adsorption unit 41 or the second adsorption unit 42, the connection bracket 471 and the connection bracket 471 are coupled to the first adsorption unit 41 or the second The other two except for the two sides of the support adsorption rod 472 through which the adsorption force provided to the adsorption unit 42 is transmitted and the substrate S supported by the adsorption unit by adsorption force coupled to the support adsorption rod 472. It may include a support adsorption nozzle 473 for adsorbing and supporting at least one of the sides. The adsorption surface of the substrate S to be adsorbed and supported by the corresponding adsorption unit is supported by the support adsorption nozzle 473 and the adsorption surface of the substrate S to be adsorbed and supported to adsorb and support the substrate S in a flat state. . The connection bracket 471 may be coupled to the adsorption bracket 411 or the transport adsorption rod 412 or integrally formed with the adsorption bracket. The support adsorption rod 472 is disposed in a direction crossing the transfer adsorption rod 412 to stably adsorb and support the edge of the substrate S.
The buffer unit 48 is spaced apart from the buffer rod 481 coupled to the first adsorption unit 41 or the second adsorption unit 42 and the first adsorption unit 41 or the second adsorption unit 42. A shock absorbing bracket 484 coupled to the copper guide 431 or the lifting driving unit 43, and a shock absorbing bush 482 provided on the shock absorbing bracket 484 so that the shock absorbing rod 481 is coupled to be movable up and down, It may include an elastic member 483 elastically supporting the first adsorption unit 41 based on the first connecting member 44 or elastically supporting the second adsorption unit 42 based on the first connecting member 44. have.
The buffer rod 481 is fixed to the adsorption bracket 411, and the buffer bracket 484 is spaced apart from the adsorption bracket 411. The elastic member 483 may include a coil spring that elastically supports between the first adsorption unit 41 and the buffer bracket 484 or elastically supports between the second adsorption unit 42 and the buffer bracket 484. The sheet separation unit 49 includes a first separation bracket 491 coupled to the first adsorption unit 41 or the second adsorption unit 42, and a second separation bracket 4 spaced apart from the first separation bracket 491 ( 492), a first driving unit (41) coupled to the second separation bracket (492) and the separation driving unit (493) for moving the second separation bracket (492) while being coupled to the first separation bracket (491) ) Or the separation adsorption rod 494 to which the adsorption force provided to the second adsorption unit 42 is transmitted, and a corner portion of the substrate S which is coupled to the separation adsorption rod 494 and supported by the adsorption unit by the adsorption force. It may include a separation adsorption nozzle (495) to adsorb and support. The adsorption surface of the substrate S to be adsorbed and supported by the corresponding adsorption unit is the same as the adsorption surface of the substrate S to which the separation adsorption nozzle 495 is to be adsorbed and supported so that the substrate S can be adsorbed and supported in a flat state. .
The first separation bracket 491 may be coupled to the adsorption bracket 411 or the transfer adsorption rod 412 or integrally formed with the adsorption bracket 411. The first separation bracket 491 may be bent or a plurality of pieces may be mutually coupled to match the adsorption surface of the substrate S. In addition, the second separation bracket 492 is disposed on a substantially same plane as the adsorption bracket 411, so that the adsorption surface of the substrate S can be easily matched. The separation adsorption rod 494 may be disposed in a direction intersecting with the transfer adsorption rod 412 or parallel to the support adsorption rod 472 to stably adsorb and support the corner portion of the substrate S. Looking at the operation of the first transport unit 40, in the initial position, the first adsorption unit 41 is spaced apart from the loading area A to the upper side of the loading unit 20, and the second adsorption unit 42 is the first 1 is spaced apart from the inspection area W1 to the upper side of the second transfer unit 50. The first adsorption unit 41 is operated in response to the input signal of the control unit 80. The first adsorption unit 41 adsorbs and supports the substrate S of the loading area A and transports it to the first inspection area W1.
In more detail, the lift driving unit 43 is operated in response to the input signal of the control unit 80. The lifting driving unit 43 lowers the first adsorption unit 41 toward the loading unit 20 so that the transfer adsorption nozzle 413 contacts the substrate S. At this time, by the operation of the buffer unit 48, the transfer adsorption nozzle 413 can absorb the force pressing the substrate (S). In addition, an adsorption driving unit (not shown) that generates an adsorption force in response to the input signal of the control unit 80 provides the adsorption force to the first adsorption unit 41. Then, the transfer adsorption nozzle 413 can adsorb and support the substrate S.
Next, according to the operation of the lift driving unit 43, the first adsorption unit 41 is raised by a predetermined amount to separate the substrate S adsorbed and supported by the first adsorption unit 41 from the loading unit 20. At this time, the sheet separation unit 49 is operated to separate the substrate S raised along the substrate of the sheet adsorbed and supported by the first adsorption unit 41. In particular, since the sheet separation unit 49 reciprocates the corner portion of the substrate S, the separation of the substrate S can be performed quickly and easily. At this time, it can be confirmed that the single substrate S is adsorbed and supported by the first adsorption unit 41 according to the operation of the gripping sensing unit 401 and the adsorption sensing unit 416. Finally, the first adsorption unit 41 is raised to the initial position according to the operation of the lifting driving unit 43, and then the first adsorption unit 41 is first inspected according to the operation of the first direction driving unit 45. It is transported to the upper side of the second transfer unit 50 of the area W1, and is again driven up and down.
According to the operation of the unit 43, the first adsorption unit 41 descends, and since the adsorption force provided to the first adsorption unit 41 is released according to the operation of the adsorption driving unit (not shown), the substrate S is removed. 2 is seated on the transfer unit (50). The second suction unit 42 is operated in response to the discharge signal from the control unit 80. The second adsorption unit 42 adsorbs and supports the substrate S of the first inspection area W1 and transports it to the unloading area B. Since the specific operation is the same as the operation of the first adsorption unit 41, a description thereof will be omitted. Since the operation of the gripping sensing unit 401 is omitted in the operation of the second adsorption unit 42, the second adsorption unit 42 adsorbs and supports the substrate S and then directly rises to the initial position. The second transfer unit 50 may adsorb and transport the substrate S between the first inspection area W1 and the second inspection area W2. The second transfer unit 50 is mounted on the substrate seating portion 51 on which the substrate S carried by the first adsorption unit 41 is seated, and the substrate seating portion 51 for alignment of the substrate S A first direction alignment unit 52 for moving the substrate S in the first direction, and a second direction for moving the substrate seated on the substrate mounting unit 51 in the second direction for alignment of the substrate S Alignment section 53, the first inspection area (W1) and the second inspection area
Between the (W2) may include a second direction driving unit 54 for sliding the substrate mounting portion 51 along the second direction. The substrate seating portion 51 may be provided with a seating nozzle 511 for adsorbing and supporting the substrate S in a fixed position of the substrate S. The seating nozzle 511 is provided with the adsorption force generated in the seating driving unit (not shown) along with the position of the substrate S, so that the position of the board S can be stably maintained. In the substrate seating portion 51, a rear photographing hole portion 512 is formed through the corresponding portion of a predetermined section for photographing the back side of the substrate S.
Can be. In one embodiment of the present invention, the preset shooting section may be set in advance by an operator corresponding to the size of the substrate S and the shooting area of the hole photographing unit 60. For example, the preset shooting section may be divided into 3 rows and 3 columns in a matrix, 4 rows and 3 columns, or 3 rows and 4 columns. An alignment origin 515 in which any one of the four corners of the substrate S coincide with the substrate seating portion 51 may be formed. In one example, the alignment origin 515 is set to the lower left corner of the substrate seating portion 51 as shown in FIG. 14. The substrate seating portion 51 includes a first alignment jaw 513 extending from the alignment origin 515 to intersect with the first direction, and a second alignment jaw 514 extending from the alignment origin 515 to intersect with the second direction. ) May be provided. Accordingly, the first direction aligning unit 52 moves the substrate S in the first direction to move any one of the four sides of the substrate S to the first.
Aligning the alignment jaw 513, and the second direction alignment unit 53 moves the substrate S in the second direction to match the other one of the four sides of the substrate S with the second alignment jaw 514. I can do it. The second transfer unit 50 further includes a second direction guide 541 that guides the slide movement of the substrate seating portion 51 based on the inspection housing 10 according to the operation of the second direction driving unit 54. can do. The second direction guide 541 may include a 2-1 direction guide coupled to the inspection housing 10 and a 2-2 direction guide coupled to the substrate seating portion 51. Then, according to the operation of the second direction driving unit 54, the 2-2 direction guide may slide along the 2-1 direction guide in a state where the slide is slidably coupled to the 2-1 direction guide. In the second direction guide 541, the second direction limiting parts 542 for setting the slide movement limit of the substrate seating part 51 may be arranged to be spaced apart from each other. The second transfer unit 50 is provided in the inspection housing 10 in a state spaced apart from the second direction guide 541, a guide guide rail 55 formed long along the second direction, and a substrate seating portion 51 It is provided in the guide guide rail (55) to be slidably coupled
It may further include a guide slider (56). Accordingly, the slide movement of the substrate seating portion 51 is smoothed, and the substrate S is transferred from the first inspection area W1 to the second inspection area W2, or the substrate S is moved according to a preset shooting section. When possible, the flow of the substrate S can be prevented, and the in-situ state of the substrate S can be stably maintained. Looking at the operation of the second transfer unit 50, in the initial position, the substrate seating portion 51 is arranged to face each other in a state spaced apart from the second adsorption unit 42 in the first inspection area W1. At this time, the substrate S carried by the first adsorption unit 41 is seated on the substrate seating portion 51. When the first adsorption unit 41 is raised from the substrate seating portion 51, the first direction aligning unit 52 and the second direction aligning unit 53 operate in response to the first transfer signal of the control unit 80. do. The first direction alignment unit 52 and any one of the four sides of the substrate (S) and the first alignment jaw 513
The second direction alignment unit 53 matches the other one of the four sides of the substrate S to the second alignment jaw 514 to match any one of the four corners of the substrate S with the alignment origin. . Then, in response to the first transfer signal of the control unit 80, a seating driving unit (not shown) provides an adsorbing force to the substrate seating unit 51. Then, the seating nozzle 511 can adsorb and support the substrate S at the substrate seating portion 51. Next, the substrate seating portion 51 is moved to the second inspection area W2 according to the operation of the second direction driving unit 54. And the second direction driving unit 54 is operated in response to the inspection signal of the control unit 80. Then, the substrate seating unit 51 is intermittently moved in response to the preset shooting section according to the operation of the second direction driving unit 54. At this time, the hall photographing unit 60 is also operated in response to the inspection signal of the control unit 80, so that the substrate S can be photographed in response to a preset photographing section. When the photographing of the substrate S is completed, the second direction driving unit 54 is operated in response to the second transfer signal of the control unit 80. Then, the substrate seating portion 51 is moved to the initial position according to the operation of the second direction driving unit 54. At this time, the second transfer of the control unit 80
In response to the call, the hole photographing unit 60 is also moved to the initial position. The hall photographing unit 60 photographs the substrate S carried in the second inspection area W2 for each preset shooting section. The hole photographing unit 60 is arranged to be spaced from the second inspection area W2 to the upper side of the substrate S and the upper imaging unit 601 to be spaced apart from the second inspection area W2 to the lower side of the substrate S. It may include a lower imaging unit 602. Accordingly, the hole photographing unit 60 photographs both the upper and lower surfaces of the substrate S, thereby simultaneously inspecting the upper and lower surfaces of the substrate S without inversion of the substrate S.
The upper imaging unit 601 and the lower imaging unit 602 are respectively separated from the substrate S disposed in the second inspection area W2, the camera unit 61, and the first coupled to the inspection housing 10. The first direction based on the photographing connecting member 63, the second photographing connecting member 65 connecting the camera unit 61 and the first photographing connecting member 63, and the first photographing connecting member 63 In accordance with the photographing driving unit 62 for slidingly moving the camera unit 61 and the photographing elevating unit 64 for moving the camera unit 61 up and down along the height direction based on the second photographing connecting member 65 can do.
Here, the camera unit 61 is coupled to the shooting bracket 611 and the shooting bracket 611 to be perpendicular to the substrate S to be radiated toward the substrate S to be perpendicular to the substrate S. It may include a lighting unit 612 and a camera unit 613 coupled to the shooting bracket 611 on one side of the lighting unit 612 to photograph the substrate S to which the light of the lighting unit 612 is irradiated. At this time, the gaze direction of the camera unit 613 is formed to be inclined toward the substrate S to prevent the light reflected from the substrate S from being directly transmitted to the camera unit 613, and the captured image is the lighting unit 612 It can be prevented from being seen or distorted by the light. In addition, the upper photographing unit 601 and the lower photographing unit 602 slide the second photographing connecting member 65 based on the first photographing connecting member 63 according to the operation of the photographing driving unit 62, respectively. Guide the shooting transfer guide (621) and the second shooting connecting member (65)
As a reference, a shooting guide 641 for guiding the moving movement of the camera unit 61 may be further included. The photography transfer guide 621 includes a first photography guide coupled to the first photography connection member 63 and a second photography guide coupled to the second photography connection member 65. Then, in accordance with the operation of the second direction driving unit 54, the second shooting guide may be slided along the first shooting guide in a state in which the slide is movably coupled to the first shooting guide. In the photographing transfer guide 621, the photographing transfer limiting unit 622 for setting the slide movement limit of the second photographing connecting member 65 may be disposed in a spaced apart state. The shooting elevating guide 641 includes a first shooting elevating guide coupled to the second shooting connecting member 65 and a second shooting elevating guide to which the first adsorption unit 41 or the second adsorption unit 42 is coupled. do. Then, according to the operation of the elevating driving unit 43, the second photographing elevating guide may be moved up and down along the first photographing elevating guide in a state in which it is movably coupled to the first photographing elevating guide. Looking at the operation of the hole photographing unit 60, in the initial position, the camera units 61 are respectively spaced apart on the upper and lower portions of the substrate S seated on the substrate mounting portion 51, respectively. When the substrate seating unit 51 is positioned in the second inspection area W2 according to the operation of the second transfer unit 50, the photographing driving unit 62 is operated in response to the inspection signal of the control unit 80. . Then, the photographing driving unit 62 intermittently moves in association with the second direction driving unit 54 in response to a preset photographing section. Then, in response to the inspection signal of the control unit 80, the camera unit 61 photographs the upper and lower surfaces of the substrate S in a predetermined shooting section. The photographed image is displayed on the display unit 70.
At this time, according to the operation of the photographing elevating unit 64 and the camera unit 61, the photographed image may be enlarged or the photographed image may be reduced or the focus of the photographed image may be adjusted. When the photographing of the substrate S is completed, the photographing driving unit 62 is operated in response to the photographing return signal of the control unit 80. Then, the camera unit 61 is moved to the initial position according to the operation of the photographing driving unit 62. At this time, the photographing return signal of the control unit 80 is linked to the second transfer signal of the control unit 80 to operate the second direction driving unit 54, so that the substrate seating portion 51 can be moved to the initial position. have.
The display unit 70 displays an image photographed through the hall photographing unit 60. The display unit 70 may simultaneously display an image of the upper surface of the substrate S and an image of the rear surface of the substrate S. The control unit 80 of the first transfer unit 40 and the second transfer unit 50 and the hole photographing unit 60 and the display unit 70 according to the operation of the inspection operation unit 81 and the transfer operation unit 82 Control the action. The inspection operation unit 81 operates the operations of the first transfer unit 40, the second transfer unit 50, and the hole photographing unit 60 to photograph the via hole formed in the substrate S. "Head transfer" is an operation unit that selects the camera unit 61 and the substrate seating unit 51 to move in response to a preset shooting section. The "input" is an operation unit that selects the input signal to be generated in the control unit 80. The "joystick" is an operation unit that controls slide movement of the camera unit 61 in a first direction or a second direction in a preset shooting section. &Quot;Selection" is an operation unit for selecting the camera unit 61 that shoots either the upper surface of the substrate S or the lower surface of the substrate S. According to the operation of "selection", the camera unit 61 photographing the upper surface of the substrate S is initially selected, and once operated, the camera unit 61 photographing the lower surface of the substrate S is selected, Once again, the operation is switched to the camera unit 61 photographing the top surface of the substrate S. "ZOOM IN" and "ZOOM OUT" are controls that control the enlargement and reduction of the recorded image. "ZOOM IN" and "ZOOM OUT" can be combined with the operation of "Selection". "Camera UP" and "Camera DOWN" are controls that control the focus of the image being shot. The "recovery" is an operation portion for selecting discharge according to the defect of the substrate S.
It is an operation unit that selects to generate an emission signal from the control unit 80 according to the normal determination of the "product discharge" substrate S. The "inspection advance" is an operation unit that selects the movement to the next imaging section based on the current shooting section in the course of the imaging of the substrate S for the preset shooting section. The "inspection backward" refers to the substrate for the preset shooting section ( It is an operation unit to select a return to the previous shooting section based on the current shooting section in the shooting process of S). Reference numeral 81a is an emergency stop for emergency stop during operation of the inspection device. The emergency stop unit 81a is adjusted by an operator to stop the entire operation of the inspection device in response to an emergency situation. The emergency stop portion 81a is installed on the operating table 13. Then, while inspecting the via hole based on the image displayed on the display unit 70, the operator can monitor the inspection device and surrounding conditions. And when operating the emergency stop unit 81a in response to an emergency, the operation signal of the emergency stop unit 81a is transmitted to the control unit 80, and the control unit 80 stops the entire operation of the inspection device. The first transfer unit 40 and the second transfer unit 50 by transmitting the emergency stop signal for the first transfer unit 40, the second transfer unit 50, and the hole photographing unit 60, respectively. And, the operation of the hole photographing unit 60 can be stopped emergency.
The transfer operation unit 82 is a first transfer unit 40 and a second transfer unit for controlling the operation of the first transfer unit 40 and the second transfer unit 50 and the hole photographing unit 60 for initial position setting The operation of the 50 and the hole photographing unit 60 is operated. "Manual/automatic" is an operation unit for selecting whether to automatically or manually set initial positions of the first transfer unit 40, the second transfer unit 50, and the hole photographing unit 60. "Start" is an operation unit for selecting whether to start setting the initial position. "Stop" is an operation unit for selecting whether to stop setting the initial position. "Origin" is an operation unit for selecting the origin determined according to the initial position setting. "RESET" is the control panel that initializes the settings. "Emergency stop" is an operation unit that selects an emergency stop for the operation of the inspection device in the initial position setting. "Power" is a control unit for applying power to the first transfer unit 40, the second transfer unit 50, the hole photographing unit 60, and the control unit 80. "ON" indicates a power supply state, "OFF" indicates a state in which power is not applied. In FIG. 19, the square box in the upper part represents the touch panel. In addition, the square box in the lower left portion in FIG. 19 represents the pressure against the adsorption force of the first transfer unit 40 and the second transfer unit 50. The control input unit 83 inputs a command for controlling the inspection device. The control input unit 83 is divided into a keyboard unit 831 for inputting commands in a character form and a mouse unit 832 for selecting and executing icons on the screen for input of commands.
can do. The mouse portion 832 may be implemented as a touch screen provided in the display unit. The emergency notification unit 85 displays a visual indication in response to an emergency stop of the inspection device. Hereinafter, a method of inspecting a via hole of a substrate according to an embodiment of the present invention will be described. First, according to the operation of the main power source (not shown) provided in the inspection housing 10, power is applied to the inspection device to activate the entire inspection device. In addition, while applying the power to the first transfer unit 40, the second transfer unit 50, the hole photographing unit 60 and the control unit 80 according to the operation of the "power supply" provided in the transfer operation unit 82, Make them electrically connected to each other. In addition, the control unit 80 is booted to execute the program of the control unit 80. When booting is completed, it is displayed on the display unit 70 to execute a program for controlling the inspection device.
At this time, by selecting whether or not the origin is displayed on the display unit 70, the initial positions of the first transfer unit 40, the second transfer unit 50, and the hole photographing unit 60 can be set automatically or manually. Next, through the message displayed on the display unit 70 confirms the input standby position. The initial position setting is made according to the operation of the transfer operation unit 82. When the initial position setting is completed, switch to the automatic mode by operating "Manual/Auto", then operate "Start". Next, the inspection information displayed on the display unit 70 is matched with actual inspection information and stored. Then, when the inspection operation unit 81 is operated, the substrate S loaded on the loading unit 20 is transported to the second inspection area W2 as a single sheet, and the substrate S is photographed for each predetermined shooting section, and the display unit is photographed. The via hole formed in the substrate S is inspected by visually inspecting the image displayed on (70). When the inspection mode is the first item mode, the inspection is performed while moving all the preset shooting sections, and in the mass production mode, the inspection is performed while moving only some of the preset shooting sections.
When the inspection of the substrate S is completed, the "S" is operated in the manual mode to transport the substrate S to the unloading unit 30, and in the continuous mode, the substrate S is automatically unloaded unit 30. Is loaded on. According to the via hole inspection apparatus of the above-described substrate, an operator can inspect whether the via hole formed through the substrate is normal. In addition, the via hole inspection device of the substrate can be inlined to improve the transport and inspection speed of the substrate S within the inspection device, and to prevent worker accidents.
In addition, according to the inspection intention of the operator, the operator may control the transport and inspection speed of the substrate S, and prevent the defective substrate from being mixed into the normal substrate. In addition, the loading direction of the substrate S in the loading area A is specified through the detailed configuration of the loading unit 20, and the substrate S separated from the first transfer unit 40 is safely loaded and loaded 21 ), the loading loading part 21 is correctly positioned in the loading area A, and when all the substrates S of the loading loading part 21 are loaded, the operation of the first transfer unit 40 is performed. By stopping, it is possible to prevent damage to the first transport unit 40 and the loading loading part 21. In addition, through the detailed configuration of the unloading unit 30, the unloading loading part 31 in the unloading area B is specified, the entry/exit direction is specified, the unloading loading part 31 is conveniently transported, and the unloading is performed. The unloading loading part 31 can be safely positioned in the area B, and the unloading loading part 31 is stopped by stopping the operation of the first transport unit 40 depending on whether the unloading loading part 31 is mounted. ) Can be easily discharged.
In addition, through the detailed configuration of the first transfer unit 40, the transport of the substrate S to the two adsorption units can be quickly progressed, and the slide movement between the loading area A and the first inspection area W1 and Stabilize the slide movement between the first inspection area (W1) and the unloading area (B), compensate for the step difference due to the loading of the substrate (S) in each area, and the first adsorption unit (41) and the second adsorption unit It enables the individual lifting and moving of the 42 and prevents a plurality of substrates S from being connected when adsorbing the substrate S in the loading area A, and the first adsorption unit 41 and the second adsorption. Each unit 42 allows only the single substrate S to be adsorbed and supported, and the single substrate S can be safely adsorbed and supported in the loading area A, and within the foreign material or via hole remaining on the surface of the substrate S Residual foreign matter can be removed, the first adsorption unit 41 and the second adsorption unit 42 stabilize the adsorption support state of the substrate S, and in the process of adsorbing and supporting the substrate S, the substrate S ) Prevents the substrate S from being deformed or damaged by the pressure applied to the substrate, and stably maintains the flatness of the substrate S when the flexible substrate S is adsorbed and supported. In the course of transport, the substrate S is not separated, or the substrate S is not released from the seating position of the substrate S when the adsorption is released, and the flexible substrate S can be minimized, and the first adsorption unit ( 41) and the distance between the second adsorption unit 42 and the distance between the adsorption rods can be adjusted, and various sizes of substrates S can be inspected.
In addition, through the detailed configuration of the second transfer unit 50, the substrate S for inspection can be accurately positioned on the substrate seating portion 51, and the front and rear surfaces of the substrate S can be simultaneously inspected. The slide movement between the first inspection region W1 and the second inspection region W2 is stabilized, and the slide movement of the substrate S is precisely controlled in response to a preset imaging section, and the substrate S is the second. When moving along the direction, it is possible to prevent the flow of the substrate seating portion 51 in the inspection housing 10 and the flow of the substrate S in the substrate seating portion 51. In addition, through the detailed configuration of the hole photographing unit 60, the front surface of the substrate S and the rear surface of the substrate S can be simultaneously photographed to inspect the processing state of the via hole, and the enlargement and reduction of the via hole and focus on the via hole Correspondingly, the moving and sliding movement of the camera unit 61 is free, and image distortion caused by reflection of light emitted from the lighting unit 612 can be prevented. In addition, fine adjustment of the hole photographing unit 60 is possible through the inspection operation unit 81 and the control unit 80, and the inspection operation of the substrate S can be adjusted according to the intention of the operator. It is easy to adjust the focus and enlarge/reduce the image, and it is possible to clearly check the blind spot between preset shooting sections. In addition, the operation of the first transfer unit 40 and the second transfer unit 50 is stably controlled through the transfer operation unit 82 and the control unit 80, and a preset shooting section is set or the first transfer unit ( 40) and the operation of the second transfer unit 50 can be precisely controlled.
Although the present invention has been described with reference to the embodiments shown in the drawings, these are merely exemplary, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Therefore, the true technical protection scope of the present invention should be determined by the technical spirit of the appended claims.

10: Inspection housing
30: unloading unit
40: first transfer unit
50: second transfer unit

Claims (9)

In the manufacturing method of the LED display module,
Preparing a substrate; Preparing a plurality of pixel units; And mounting the pixel units on the substrate, wherein the substrate undergoes a via hole inspection process that is previously formed through a via hole inspection device.
The inspection device,
An inspection provided with a loading area (A) for mounting the substrate, an unloading area (B), a first inspection area, and a second inspection area disposed on one side of the first inspection area for imaging the substrate A housing 10,
The unloading unit 30 on which the substrate has been inspected is loaded, a first transfer unit 40 for transporting the substrate, and a second for transporting the substrate between the first inspection area and the second inspection area It includes a transfer unit 50, and a hole photographing unit 60 for photographing the substrate for each predetermined shooting section,
The inspection housing 10 is provided with a mounting unit at the bottom,
The mounting unit,
And the mounting body portion 110, the inspection housing 10 is mounted,
The first structure 111, which is a polygonal structure having a rectangular parallelepiped shape provided on the lower portion of the mounting body 110,
A second structure 112 of a rectangular parallelepiped structure provided on the lower portion of the mounting body 110,
A third structure 113 that is provided in the lower portion of the mounting body 110 and located between the first structure 111 and the second structure 112 is a rectangular parallelepiped structure,
Further provided on the lower portion of the mounting body 110, the third structure 113 and the second structure 112, the fourth structure 114 is a polygonal structure of a rectangular parallelepiped shape,
The first structure 111 and the third structure 113,
The first extension portion 111a and the 3-1 extension portion 113a1 are protruded in mutually opposite directions, respectively.
The second structure 112 and the fourth structure 114,
The second extension portion 112a and the 4-1 extension portion 142a1 are respectively protruded in opposite directions,
The third structure 113 and the fourth structure 114,
The 3-2 extension part 112a and the 4-2 extension part 142a2 are protruded in mutually opposite directions, respectively.
The mounting unit,
It is provided between the first structure 111 and the third structure 113, and the first extension part 111a and the third-1 extension part are provided by reciprocating movement between the upper side and the lower side in the free space LS1. 113a1), the first rotating body 115 of a polygonal shape, which is provided in such a manner that it is pressurized and is capable of vertical rotation in a forward or reverse rotation state in a pressurized contact state,
It is provided between the second structure 112 and the fourth structure 114, and the second extension part 112a and the fourth-1 extension part reciprocate upward and downward in the free space LS2. 142a1), and the second rotating body 116 of the polygonal shape provided to enable the vertical rotation of the forward rotation or the reverse rotation method in pressure contact with the pressure contact,
It is provided between the third structure 113 and the fourth structure 114 and extends the 3-2 extension part 112a and the 4-2 by reciprocating movement between the upper and the lower side in the free space LS3. A method of manufacturing an LED display module comprising a third rotating body 117 of a polygonal shape which is pressed into contact with the portion 142a2 and is provided to enable vertical rotation of a forward rotation or a reverse rotation method in a pressed contact state. The method according to claim 1,
Between the first structure 111 and the third structure 113,
The first extension part 111a and the first sub-rotator 121 of a polygonal shape located below the 3-1 extension part 113a1 are provided,
Between the second structure 112 and the fourth structure 114,
The second extension part 112a and the second sub-rotation body 122 of a polygonal shape positioned below the 4-1 extension part 142a1 are provided,
Between the third structure 113 and the fourth structure 114,
A third sub-rotation body 123 having a polygonal shape is provided under the 3-2 extension part 112a and the 4-2 extension part 142a2,
The first sub-rotation body 121,
It is possible to reciprocate up and down, contacting and pressing the lower portions of the first extension portion 111a and the 3-1 extension portion 113a1, in the same or opposite direction to the first rotating body 115 in a contact-pressed state. Will be rotated to
The second sub-rotation body 122,
Up and down reciprocating flow is possible, and the second extension portion 112a and the lower portion of the 4-1 extension portion 142a1 are contact-pressed, and in the same or opposite direction to the second rotating body 116 in a contact-pressed state. Rotating flow,
The third sub-rotation body 123,
It is possible to reciprocate up and down, and presses and lowers the lower portions of the 3-2 extension portion 112a and the 4-2 extension portion 142a2, and is the same or opposite to the third rotating body 117 in the contact pressurized state. Manufacturing method of LED display module that rotates and flows in the direction. The method according to claim 2,
Further comprising a base portion 130 provided below the first structure 111 to the fourth structure 114,
The support portion 130,
A first appearance body 131 for pressurizing the first sub-rotation body 121, and a second appearance body 132 for pressing the second sub-rotation body 122 to appear upward. Wow,
A third emergent body 133 is provided to press the third sub-rotary body 123 to be raised upward.
The first tumbling body 131 to the third tumbling body 133,
The first sub-rotation body 121 to the third sub-rotation body 123 respectively protrude upward and pressurized while pressing the first extension portion 111a to the 4-2 extension portion 142a2 How to manufacture LED display module. The method according to claim 3,
The first rotating body 115,
The first extension part 111a and a first protrusion part B1 mounted on the 3-1 extension part 113a1 are provided at a lower portion, and the first extension part (B) is interposed through the first protrusion part B1. 111a) and the 3-1 extension portion (113a1) applying a rotational pressing force,
The second rotating body 116,
The second extension part 112a and the second protrusion part B2 mounted to the 4-1 extension part 142a1 are provided at the lower portion, and the second extension part (2) via the second protrusion part B2 is provided. 112a) and applying a rotational pressing force to the 4-1 extension (142a1),
The third rotating body 117,
A third protrusion (B3) mounted on the third-2 extension part (112a) and the fourth-2 extension part (142a2) is provided at the lower portion, and the third through the third protrusion (B3) is provided. 2 A method of manufacturing an LED display module that applies rotational pressing force to the extension portion 112a and the 4-2 extension portion 142a2. The method according to claim 4,
The first sub-rotation body 121,
A first sub-protrusion portion SB1 mounted on the first extension portion 111a and the 3-1 extension portion 113a1 is provided at a lower portion, and the first extension is performed via the first sub-protrusion portion SB1. A rotary pressing force is applied to the portion 111a and the 3-1 extension portion 113a1,
The second sub-rotation body 122,
A second sub-protrusion (SB2) mounted on the second extension (112a) and the 4-1 extension (142a1) is provided at the lower portion, and the second extension via the second sub-projection (SB2) is provided. A rotary pressing force is applied to the portion 112a and the 4-1 extension portion 142a1,
The third sub-rotation body 123,
A third sub-protrusion (SB3) mounted on the 3-2 extension (112a) and the 4-2 extension (142a2) is provided at a lower portion, and the third sub-protrusion (SB3) is used as a medium. A method of manufacturing an LED display module that applies a rotational pressing force to the 3-2 extension 112a and the 4-2 extension 142a2. The method according to claim 5,
The support portion 130,
A first drive unit 151 capable of flowing in a certain range on one side, and
The first driving unit 151 is provided on the upper portion of the first fixing portion 153 in a polygonal shape to be coupled to the first structure 111,
A second driving unit 152 capable of flowing in a certain range on the other side;
The second driving unit 152 is provided on the upper portion of the polygonal second fixing portion 154 is provided on the second structure 112, the binding,
The first fixing part 153,
When the first mounting protrusion (LT1) is provided in a large number on the side and selectively protrudes into the inside of the side portion of the first structure 111, the first driving portion 151 flows downward from the first driving portion 151 to apply a downward pressing force. Add
The second fixing part 154,
When the second mounting protrusion (LT2) is provided in a large number on the side and selectively protrudes into the inside of the side portion of the second structure 112, the second driving portion 152 flows downward from the second driving portion 152 to apply downward pressing force. Manufacturing method of applied LED display module. The method according to claim 6,
At least one of the first structure (111) to the fourth structure (114) is a method for manufacturing an LED display module that rotates one point range in the horizontal direction on the mounting body 110 and the support 130. The method according to claim 7,
The first structure 111 to the fourth structure 114 includes an interlocking module 160 for interlocking each other,
The interlocking module 160,
The first upper mounting body 161 which is inserted and mounted in the third structure 113 and the fourth structure 114 and a structure of a “U” shape are provided as one of the first upper mounting body 161. A first interlocking module 160 including a first upper fluid 162 to be formed, and a second upper fluid 163 provided as the other side of the first upper mounting body 161 as a “c” shaped structure ,
The first lower mounting body 164 is inserted and mounted in the third structure 113 and the fourth structure 114, and is formed as one of the first lower mounting body 164 as a “U” shaped structure. A second interlocking module 160 including a first lower fluid 165 and a second lower fluid 166 provided as the other side of the first lower mounting body 164 as a “c” shaped structure Manufacturing method of LED display module including. delete

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