KR102125240B1 - 아민과 폴리아크릴아미드와 설톤의 반응 생성물의 화합물을 함유하는 구리 전기도금욕 - Google Patents

아민과 폴리아크릴아미드와 설톤의 반응 생성물의 화합물을 함유하는 구리 전기도금욕 Download PDF

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KR102125240B1
KR102125240B1 KR1020187010819A KR20187010819A KR102125240B1 KR 102125240 B1 KR102125240 B1 KR 102125240B1 KR 1020187010819 A KR1020187010819 A KR 1020187010819A KR 20187010819 A KR20187010819 A KR 20187010819A KR 102125240 B1 KR102125240 B1 KR 102125240B1
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South Korea
Prior art keywords
copper
formula
hydrogen
electroplating bath
sultone
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English (en)
Korean (ko)
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KR20180052752A (ko
Inventor
웨이징 루
링글리 두안
주크흐라 니아짐베토바
첸 첸
마리아 르제즈니크
Original Assignee
롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨
다우 글로벌 테크놀로지스 엘엘씨
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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/02Polyamines
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/12Semiconductors
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/58Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/12Semiconductors
    • C25D7/123Semiconductors first coated with a seed layer or a conductive layer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • H05K3/423Plated through-holes or plated via connections characterised by electroplating method

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
KR1020187010819A 2015-10-08 2015-10-08 아민과 폴리아크릴아미드와 설톤의 반응 생성물의 화합물을 함유하는 구리 전기도금욕 Active KR102125240B1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2015/091435 WO2017059565A1 (en) 2015-10-08 2015-10-08 Copper electroplating baths containing compounds of reaction products of amines, polyacrylamides and sultones

Publications (2)

Publication Number Publication Date
KR20180052752A KR20180052752A (ko) 2018-05-18
KR102125240B1 true KR102125240B1 (ko) 2020-06-22

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KR1020187010819A Active KR102125240B1 (ko) 2015-10-08 2015-10-08 아민과 폴리아크릴아미드와 설톤의 반응 생성물의 화합물을 함유하는 구리 전기도금욕

Country Status (7)

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US (2) US10604858B2 (enExample)
EP (1) EP3359552B1 (enExample)
JP (1) JP6622908B2 (enExample)
KR (1) KR102125240B1 (enExample)
CN (1) CN108026129A (enExample)
TW (1) TWI609101B (enExample)
WO (1) WO2017059565A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108026655B (zh) * 2015-10-08 2020-04-14 罗门哈斯电子材料有限责任公司 含有胺和聚丙烯酰胺的反应产物的化合物的铜电镀覆浴
CN108026129A (zh) * 2015-10-08 2018-05-11 罗门哈斯电子材料有限责任公司 包含胺、聚丙烯酰胺和磺酸内酯的反应产物化合物的铜电镀浴

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2453847B1 (fr) 1979-04-13 1985-08-16 Anvar Procede pour l'obtention d'ampholytes porteurs utilisables dans les diverses techniques d'electrofocalisation
IT1254898B (it) * 1992-04-21 1995-10-11 Gianfranco Palumbo Idrogeli di tipo polietereammidoamminico come materiali eparinizzabili
US5534611A (en) * 1993-10-29 1996-07-09 Nalco Chemical Company Sulfonated and carboxylated aminoethylenephosphonic acid and aminobis (methylene) phosphinic acid
US5866660A (en) * 1997-03-13 1999-02-02 Isp Investments Inc. Polyvinyl prolidone and crosslinker with divinyl and chelation group
EP2199315B1 (en) * 2008-12-19 2013-12-11 Basf Se Composition for metal electroplating comprising leveling agent
WO2012164509A1 (en) * 2011-06-01 2012-12-06 Basf Se Composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias and interconnect features
KR101385280B1 (ko) * 2012-05-23 2014-04-16 한국과학기술원 역상 현탁중합과 전구체를 이용한 가교된 하이퍼브랜치 폴리아미도아민 입자의 제조 방법
EP2917265B1 (en) * 2012-11-09 2019-01-02 Basf Se Composition for metal electroplating comprising leveling agent
WO2014186980A1 (en) * 2013-05-24 2014-11-27 Basf Corporation Ge1 polymer electrolyte and lithium-ion batteries employing the ge1 polymer electrolyte
US9922844B2 (en) * 2014-03-12 2018-03-20 Mediatek Inc. Semiconductor package and method for fabricating base for semiconductor package
CN104762643A (zh) * 2014-12-17 2015-07-08 安捷利电子科技(苏州)有限公司 一种通孔、盲孔和线路共镀的镀铜药水
CN108026129A (zh) * 2015-10-08 2018-05-11 罗门哈斯电子材料有限责任公司 包含胺、聚丙烯酰胺和磺酸内酯的反应产物化合物的铜电镀浴

Also Published As

Publication number Publication date
JP6622908B2 (ja) 2019-12-18
TW201716638A (zh) 2017-05-16
EP3359552A4 (en) 2019-04-17
WO2017059565A1 (en) 2017-04-13
US10604858B2 (en) 2020-03-31
JP2018531301A (ja) 2018-10-25
TWI609101B (zh) 2017-12-21
US20200149176A1 (en) 2020-05-14
US11761107B2 (en) 2023-09-19
KR20180052752A (ko) 2018-05-18
EP3359552A1 (en) 2018-08-15
CN108026129A (zh) 2018-05-11
US20180237931A1 (en) 2018-08-23
EP3359552B1 (en) 2020-04-01

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