KR102125240B1 - 아민과 폴리아크릴아미드와 설톤의 반응 생성물의 화합물을 함유하는 구리 전기도금욕 - Google Patents
아민과 폴리아크릴아미드와 설톤의 반응 생성물의 화합물을 함유하는 구리 전기도금욕 Download PDFInfo
- Publication number
- KR102125240B1 KR102125240B1 KR1020187010819A KR20187010819A KR102125240B1 KR 102125240 B1 KR102125240 B1 KR 102125240B1 KR 1020187010819 A KR1020187010819 A KR 1020187010819A KR 20187010819 A KR20187010819 A KR 20187010819A KR 102125240 B1 KR102125240 B1 KR 102125240B1
- Authority
- KR
- South Korea
- Prior art keywords
- copper
- formula
- hydrogen
- electroplating bath
- sultone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 0 CCC(C)(C(*)(*C1)C1(OC(C)C(C)(C)C(*)(*)OC(C)C(*)(*)C(C)C)I)N Chemical compound CCC(C)(C(*)(*C1)C1(OC(C)C(C)(C)C(*)(*)OC(C)C(*)(*)C(C)C)I)N 0.000 description 2
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/02—Polyamines
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2015/091435 WO2017059565A1 (en) | 2015-10-08 | 2015-10-08 | Copper electroplating baths containing compounds of reaction products of amines, polyacrylamides and sultones |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20180052752A KR20180052752A (ko) | 2018-05-18 |
| KR102125240B1 true KR102125240B1 (ko) | 2020-06-22 |
Family
ID=58487163
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020187010819A Active KR102125240B1 (ko) | 2015-10-08 | 2015-10-08 | 아민과 폴리아크릴아미드와 설톤의 반응 생성물의 화합물을 함유하는 구리 전기도금욕 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US10604858B2 (enExample) |
| EP (1) | EP3359552B1 (enExample) |
| JP (1) | JP6622908B2 (enExample) |
| KR (1) | KR102125240B1 (enExample) |
| CN (1) | CN108026129A (enExample) |
| TW (1) | TWI609101B (enExample) |
| WO (1) | WO2017059565A1 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108026655B (zh) * | 2015-10-08 | 2020-04-14 | 罗门哈斯电子材料有限责任公司 | 含有胺和聚丙烯酰胺的反应产物的化合物的铜电镀覆浴 |
| CN108026129A (zh) * | 2015-10-08 | 2018-05-11 | 罗门哈斯电子材料有限责任公司 | 包含胺、聚丙烯酰胺和磺酸内酯的反应产物化合物的铜电镀浴 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2453847B1 (fr) | 1979-04-13 | 1985-08-16 | Anvar | Procede pour l'obtention d'ampholytes porteurs utilisables dans les diverses techniques d'electrofocalisation |
| IT1254898B (it) * | 1992-04-21 | 1995-10-11 | Gianfranco Palumbo | Idrogeli di tipo polietereammidoamminico come materiali eparinizzabili |
| US5534611A (en) * | 1993-10-29 | 1996-07-09 | Nalco Chemical Company | Sulfonated and carboxylated aminoethylenephosphonic acid and aminobis (methylene) phosphinic acid |
| US5866660A (en) * | 1997-03-13 | 1999-02-02 | Isp Investments Inc. | Polyvinyl prolidone and crosslinker with divinyl and chelation group |
| EP2199315B1 (en) * | 2008-12-19 | 2013-12-11 | Basf Se | Composition for metal electroplating comprising leveling agent |
| WO2012164509A1 (en) * | 2011-06-01 | 2012-12-06 | Basf Se | Composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias and interconnect features |
| KR101385280B1 (ko) * | 2012-05-23 | 2014-04-16 | 한국과학기술원 | 역상 현탁중합과 전구체를 이용한 가교된 하이퍼브랜치 폴리아미도아민 입자의 제조 방법 |
| EP2917265B1 (en) * | 2012-11-09 | 2019-01-02 | Basf Se | Composition for metal electroplating comprising leveling agent |
| WO2014186980A1 (en) * | 2013-05-24 | 2014-11-27 | Basf Corporation | Ge1 polymer electrolyte and lithium-ion batteries employing the ge1 polymer electrolyte |
| US9922844B2 (en) * | 2014-03-12 | 2018-03-20 | Mediatek Inc. | Semiconductor package and method for fabricating base for semiconductor package |
| CN104762643A (zh) * | 2014-12-17 | 2015-07-08 | 安捷利电子科技(苏州)有限公司 | 一种通孔、盲孔和线路共镀的镀铜药水 |
| CN108026129A (zh) * | 2015-10-08 | 2018-05-11 | 罗门哈斯电子材料有限责任公司 | 包含胺、聚丙烯酰胺和磺酸内酯的反应产物化合物的铜电镀浴 |
-
2015
- 2015-10-08 CN CN201580083217.6A patent/CN108026129A/zh active Pending
- 2015-10-08 US US15/752,636 patent/US10604858B2/en active Active
- 2015-10-08 JP JP2018514983A patent/JP6622908B2/ja not_active Expired - Fee Related
- 2015-10-08 EP EP15905663.9A patent/EP3359552B1/en active Active
- 2015-10-08 KR KR1020187010819A patent/KR102125240B1/ko active Active
- 2015-10-08 WO PCT/CN2015/091435 patent/WO2017059565A1/en not_active Ceased
-
2016
- 2016-09-30 TW TW105131756A patent/TWI609101B/zh active
-
2020
- 2020-01-17 US US16/745,400 patent/US11761107B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP6622908B2 (ja) | 2019-12-18 |
| TW201716638A (zh) | 2017-05-16 |
| EP3359552A4 (en) | 2019-04-17 |
| WO2017059565A1 (en) | 2017-04-13 |
| US10604858B2 (en) | 2020-03-31 |
| JP2018531301A (ja) | 2018-10-25 |
| TWI609101B (zh) | 2017-12-21 |
| US20200149176A1 (en) | 2020-05-14 |
| US11761107B2 (en) | 2023-09-19 |
| KR20180052752A (ko) | 2018-05-18 |
| EP3359552A1 (en) | 2018-08-15 |
| CN108026129A (zh) | 2018-05-11 |
| US20180237931A1 (en) | 2018-08-23 |
| EP3359552B1 (en) | 2020-04-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| PA0105 | International application |
Patent event date: 20180417 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PA0201 | Request for examination | ||
| PG1501 | Laying open of application | ||
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20190919 Patent event code: PE09021S01D |
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| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20200323 |
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| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20200616 Patent event code: PR07011E01D |
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| PR1002 | Payment of registration fee |
Payment date: 20200616 End annual number: 3 Start annual number: 1 |
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| PG1601 | Publication of registration | ||
| PR1001 | Payment of annual fee |
Payment date: 20230518 Start annual number: 4 End annual number: 4 |
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| PR1001 | Payment of annual fee |
Payment date: 20240514 Start annual number: 5 End annual number: 5 |