KR102114737B1 - Led illuminating device with heat sink of stamping type using transparent cover - Google Patents

Abstract

Disclosed is a light emitting diode (LED) lighting device with a stamping type heat sink using a transparent cover. According to the present invention, the LED lighting device comprises: the heat sink including a first longitudinal plate made by a stamping manufacturing method and a pair of heat radiating parts extended from the upper and lower ends of the first longitudinal plate to the rear side of first the longitudinal plate and having a rectangular groove formed on the front surface of the longitudinal plate by punching; a printed circuit board (PCB) assembly closely attached to and installed in the groove formed on the front surface of the first longitudinal plate of the die-casting heat sink and including at least one LED; the transparent cover (plastic lenses) installed on the PCB assembly installed in the groove; a sealant applied to an edge of the transparent cover; a potting material filled between the transparent cover and the groove to protect the PCB assembly from vibration and water; and a fixed cover covering the front surface of the die-casting heat sink while the transparent cover is exposed. Accordingly, the LED lighting device includes an external heat sink and an internal heat sink, thereby efficiently radiating heat.

Description

LED lighting fixture using a floodlight cover and equipped with a stamping type heat sink {LED ILLUMINATING DEVICE WITH HEAT SINK OF STAMPING TYPE USING TRANSPARENT COVER}

The present invention relates to a light emitting diode (LED) lighting fixture, and specifically to a LED lighting fixture using a light-transmitting cover and equipped with a stamping type (stamping type) heat sink (heat sink).

Lighting equipment has various problems to be noted due to various characteristics.

First, all lighting fixtures are turned on for a long time. It is an important problem to efficiently dissipate heat generated during long-time on. Poor heat dissipation can lead to electric fire accidents.

In addition, lighting fixtures are often installed on ceilings or high walls that are out of reach. In this case, the dust accumulated in the lighting fixture cannot be easily removed. Particularly, when dust enters and accumulates inside the lens of the lighting device, it may easily lead to fire due to the hot heat of the lighting light. Dust accumulated on the outside of the lighting fixture is relatively less likely to lead to ignition, but dust entering the lens can easily ignite. However, most lighting fixtures are not designed to prevent dust inside the lens.

In addition, when water flows through the lens gap, it can cause a fatal electric accident.

On the other hand, the lens of the lighting equipment is often made of glass, it is very heavy and may break and cause a safety accident.

As such, existing lighting fixtures have not been provided with a means to effectively cope with the above traditional problems and issues.

Published Patent Publication 10-2019-0091114 Registered Patent Publication 10-1308697

An object of the present invention is to provide an LED lighting fixture using a floodlight cover and having a stamping type heat sink.

The LED lighting fixture using the light-transmitting cover according to the above-described object of the present invention and equipped with a stamping type heat sink comprises: a first transverse plate having a rectangular shape manufactured by a stamping manufacturing method, and the first transverse direction It is composed of a pair of first heat dissipation parts extending from the top and bottom of the plate to the rear of the first transverse plate, and a rectangular groove is formed on the front surface of the first transverse plate by punching. A heat sink formed; A printed circuit board assembly (PCB) assembly mounted in close contact with a groove formed in the front surface of the first horizontal plate of the heat sink, and having at least one light emitting diode (LED); A plastic lens mounted on the front surface of the PCB assembly mounted on the groove; A sealant applied to the edge of the translucent cover; A potting material filled in a space between the light-transmitting cover which is an edge region of the groove and the groove for dust-proofing and waterproofing the PCB assembly; It may be configured to include a fixed cover (cover) covering the front surface of the heat sink in a state in which the transparent cover is exposed.

Here, the inner heat sink 111 further comprises a second transverse plate 111a having the same shape as the heat sink 110 and a pair of second heat dissipation units 111b, wherein the inner heat sink ( 111) is mounted on the rear side of the first horizontal plate 110a, but is installed between the pair of first heat dissipation units 110b.

In addition, a plurality of punched blind holes and nuts embedded in the punch blind holes are provided on the front surface of the first transverse plate, and the PCB assembly drives screws in the nuts. It may be configured to be mounted in close contact with the first horizontal plate.

In addition, the PCB assembly is configured to include a plurality of LED device arrays of different types, and the LED device array may be configured to emit light through one convex lens for each LED device array.

And the light-transmitting cover may be formed of polycarbonate.

In addition, the sealant is formed of silicon, and may be configured to prevent the insertion material from seeping between the transparent cover and the PCB assembly.

In addition, the present invention may be configured to further include an IP connector connected to the PCB assembly through an IP connector hole provided in the groove of the first horizontal plate.

According to the LED lighting fixture using the above-described light-transmitting cover and equipped with a stamping type heat sink, there is an effect of efficiently dissipating heat by configuring the heat sink as an external heat sink and an internal heat sink.

In addition, by applying a sealant made of silicone to the edge of the light-transmitting cover, and inserting the insertion material in the space between the heat sink and the light-transmitting cover, it has a dust-proof and waterproof effect of IP66 level, thereby preventing fire and electrical accidents caused by dust. It has a preventable effect.

In addition, since the light-transmitting cover is configured to be made of polycarbonate, a very light-transmitting cover can be manufactured at a low cost, and a safety accident due to the breakage of the light-transmitting cover can be prevented. In addition, since a desired shape and a desired number of convex lenses can be easily formed by polycarbonate casting, diversity in the shape of the lens can be provided, and a desired lighting effect can be achieved.

In addition, each convex lens formed on the light-transmitting cover is configured to arrange an LED element array composed of LED elements of various numbers and shapes, thereby providing a variety of lighting effects.

1 and 2 are perspective views of the present invention.
3 is a front view of the present invention.
4 is an exploded perspective view of an LED lighting fixture using a light-transmitting cover according to an embodiment of the present invention and having a stamping type heat sink.
5 is a perspective view of a PCB assembly according to an embodiment of the present invention.
6A and 6B are perspective views of a light transmissive cover according to an embodiment of the present invention.
7 is an LED device array according to an embodiment of the present invention.
8 is a perspective view of a sealant according to an embodiment of the present invention.
9 is a perspective view of an insert material according to one embodiment of the present invention.
10 and 11 are perspective views of a fixing cover according to an embodiment of the present invention.
12 is a perspective view of an IP connector according to an embodiment of the present invention.
13 is a cross-sectional view of the present invention.
14 is a partially enlarged view of area A shown in FIG. 13.

The present invention can be applied to various changes and may have various embodiments, and specific embodiments are illustrated in the drawings and described in detail in detail for carrying out the invention. However, this is not intended to limit the present invention to specific embodiments, and should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. In describing each drawing, similar reference numerals are used for similar components.

Terms such as first, second, A, and B may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from other components. For example, the first component may be referred to as a second component without departing from the scope of the present invention, and similarly, the second component may be referred to as a first component. The term and / or includes a combination of a plurality of related described items or any one of a plurality of related described items.

When an element is said to be "connected" or "connected" to another component, it is understood that other components may be directly connected to or connected to the other component, but there may be other components in between. It should be. On the other hand, when a component is said to be "directly connected" or "directly connected" to another component, it should be understood that no other component exists in the middle.

The terms used in the present application are only used to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, terms such as “include” or “have” are intended to indicate that a feature, number, step, operation, component, part, or combination thereof described in the specification exists, one or more other features. It should be understood that the existence or addition possibilities of fields or numbers, steps, operations, components, parts or combinations thereof are not excluded in advance.

Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by a person skilled in the art to which the present invention pertains. Terms such as those defined in a commonly used dictionary should be interpreted as having meanings consistent with meanings in the context of related technologies, and should not be interpreted as ideal or excessively formal meanings unless explicitly defined in the present application. Does not.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 and 2 are perspective views of the present invention, and FIG. 3 is a front view of the present invention. And Figure 4 is an exploded perspective view of an LED lighting fixture using a light-transmitting cover according to an embodiment of the present invention and equipped with a stamping type heat sink, Figure 5 is a perspective view of a PCB assembly according to an embodiment of the present invention, 6A and 6B are perspective views of a light-transmitting cover according to an embodiment of the present invention, FIG. 7 is a plan view of an LED device array according to an embodiment of the present invention, and FIG. 8 is a perspective view of a sealant according to an embodiment of the present invention 9 is a perspective view of an insert material according to an embodiment of the present invention, FIGS. 10 and 11 are perspective views of a fixing cover according to an embodiment of the present invention, and FIG. 12 is according to an embodiment of the present invention It is a perspective view of the IP connector. 13 is a cross-sectional view of the present invention, and FIG. 14 is a partially enlarged view of area A shown in FIG. 13.

1 to 14, the LED lighting fixture 100 using a floodlight cover according to an embodiment of the present invention and equipped with a stamping type heat sink includes a heat sink 110 and an internal heat sink ( 111), PCB assembly (printed circuit board assembly) 120, plastic lenses 130, sealant 140, potting material 150, fixed cover 160 ), May include an IP connector (170).

Hereinafter, a detailed configuration will be described.

The heat sink 110 is configured to dissipate heat generated from the PCB assembly 120.

The heat sink 110 may be formed by stamping, that is, pressing.

The heat sink 110 includes a rectangular first transverse plate 110a and a pair of agents extending rearwards of the first transverse plate 110a from the top and bottom of the first transverse plate 110a. It may be composed of one heat dissipation unit (110b).

Here, the PCB assembly 120 may be attached to the front surface of the first horizontal plate 110a.

In addition, the first heat dissipation unit 110b in the form of a pair of wings is configured to dissipate heat generated from the PCB assembly 120 through the first transverse plate 110a, thereby increasing heat dissipation efficiency by increasing its area. Can be increased.

Meanwhile, as illustrated in FIG. 4, a rectangular groove 110c may be formed on the front surface of the first horizontal plate 110a by punching. The PCB assembly 120 may be in close contact with the groove 110c to be seated.

A punched blind hole 110d, a nut 110e, and an IP connector hole 110f may be formed in the rectangular groove 110c. The punch blind hole 110d is a plurality of holes formed by punching, and a nut 110e may be inserted into the punch blind hole 110d. The PCB assembly 120 may be fixed in close contact with the groove 110c by fixing a screw to the nut 110e. The IP connector hole 110f is configured to allow the IP connector 170 to penetrate the rear surface of the first horizontal plate 110a and be connected to the PCB assembly 120.

The internal heat sink 111 may include a second horizontal plate 111a and a pair of second heat dissipation units 111b.

The internal heat sink 111 is made of the same shape as the heat sink 110 and a smaller size, and the first horizontal plate 110a in the space between the pair of first heat dissipation units 110b of the heat sink 110. ) Can be fixed in close contact with the back. For close fixing, the inner heat sink 111 may be provided with a punch blind hole (not shown), a nut (not shown), an IP connector hole (not shown), and the like.

The internal heat sink 111 may be further provided with a separate heat sink to be used to increase the heat dissipation effect.

The PCB assembly 120 may be configured to include a plurality of LED device arrays 121. It can be seen that the LED element array 121 may have a plurality of LED elements arranged in various forms as shown in FIG. 7. According to the arrangement form of the number of LED elements in the LED element array 121, it is possible to produce lighting intensity and various lighting effects.

One LED element array 121 is disposed to face each other with the convex lens 132 formed on the transparent cover 130.

The transparent cover 130 may be mounted on the front surface of the PCB assembly 120 seated in the groove 110c.

The light-transmitting cover 130 may be configured to have a plurality of convex lenses 132, and may be manufactured in various shapes by stamping or die casting. In particular, the light-transmitting cover 130 may be formed of polycarbonate, which is much lighter and has no risk of breakage compared to conventional glass.

In addition, the shape of the transparent cover 130 can be freely formed by stamping or die casting. The number of convex lenses 132 or the size and shape thereof may be varied. The convex lenses 132 of various shapes can be matched with the number or arrangement of LED elements in the LED element array 121 to produce various lighting effects. For example, the convex lens 132 may be variously formed, such as a cuboid, a hemisphere, a tetrahedron, and the like.

The sealant 140 may be applied to the edge of the translucent cover 130. The sealant 140 may be made of silicon.

The sealant 140 is configured to prevent the insertion material 150 from seeping between the transparent cover 130 and the PCB assembly 120.

The insertion material 150 may be configured to be filled in a space between the light-transmitting cover 130 and the groove 110c, which is an edge region of the groove 110c, for dustproofing and waterproofing the PCB assembly 120. It can be configured to be dustproof and waterproof to the IP66 level by the insert material 150, it is possible to prevent a fire caused by dust or an electric accident caused by water.

In the case of the light-transmitting cover 130, it is manufactured in a rectangular shape to match the shape of the groove 110c, and the fixed cover 160 may be configured to cover the front surface of the heat sink 110 with the light-transmitting cover 130 exposed. have.

The IP connector 170 may be configured to penetrate the IP connector hole 110f provided in the groove 110c of the first horizontal plate 110a to be connected to the PCB assembly 120.

As illustrated in FIG. 10, the fixed cover 160 has a transparent cover installation hole 161 through which the transparent cover 130 is fitted, and the front edge of the transparent cover 130 is illustrated in FIG. 6A. As shown, the stepped 131 is processed, and the stepped 131 is fixed over the edge of the light transmission cover installation hole 161.

The left end and the right end of the first horizontal plate 110a are exposed outside the left end and the right end of the fixed cover 160, as shown in FIG. 1, and the left end and the right end of the fixed cover 160. The bolt insertion hole 110a1 is processed to be coupled to the panel on the first horizontal plate 110a exposed outside.

The transparent cover 130 facing the LED mounted on the PCB assembly 120 is equipped with two or more convex lenses 132 to diffuse light emitted from the LED.

On the front left and right sides of the light-transmitting cover 130, as shown in Figure 6a, a protrusion 133 protruding forward of the light-transmitting cover 130 is formed, and the front surface of the protrusion 133 is processed into an arc shape, The top and bottom surfaces of the protrusion 133 and one side contacting the left end or right end of the light transmission cover installation hole 161 are processed in a flat shape.

The structure of the protrusion 133 prevents the transparent cover 130 fitted in the transparent cover installation hole 161 from flowing.

The LED driver circuit unit mounted on the PCB assembly 120 may be accommodated in the protrusion 133 or a power line or control line extending from the IP connector 170 may be accommodated.

As shown in FIGS. 10 and 11, a fixed bar 162 protruding to the rear of the fixed cover 160 is formed at a rear edge of the fixed cover 160, and is caught at an end of the fixed bar 162 The hook 163 is formed.

In addition, a fixing cover fixing hole 110g is penetrated through the front surface of the heat sink 110 facing the fixing bar 162 so that the end of the fixing bar 162 and the hook 163 are inserted.

The end of the fixing bar 162 and the hooking hook 163 are fitted into the fixing cover fixing hole 110g to fix the fixing cover 160 to the heat sink 110.

When the fixing cover 160 is coupled to the heat sink 110, the reason why the potting process is selected instead of screw fixing is first, when the fixing cover 160 is screwed to the heat sink 110, the light-transmitting cover is achieved to achieve IP66. Excellent tolerance control between the 130 and the heat sink 110 is required, and the torque for each screw must be precisely controlled for the tolerance control.

At this time, if one of the anti-vibration waterproofing cannot be controlled, both the anti-vibration waterproofing will fail.

In addition, when the fixing cover 160 is screwed to the heat sink 110, internal stress is always generated in the light-transmitting cover 130, resulting in internal cracking, and thus, dust-proof waterproofing may fail.

Therefore, when using the potting process of inserting the hook hook 163 into the fixed cover fixing hole 110g, tolerance control between the light transmitting cover 130 and the heat sink 110 is easy and the internal stress of the light transmitting cover 130 is reduced. Lowered.

The insert material 150 uses a polyurethane (PU) mixture.

The reason for using polyurethane as the insert material 150 requires a material having a low viscosity in the potting process. For this, a silicone or PU mixture having a low viscosity may be used.

However, since the shear strength of the PU mixture is higher than that of the silicone having the same viscosity as the PU mixture, it may have better reliability and protection performance against gas generated from automobiles and asphalt roads.

Although described with reference to the above embodiments, those skilled in the art can understand that the present invention can be variously modified and changed within the scope not departing from the spirit and scope of the present invention as set forth in the claims below. There will be.

110: heat sink 110a: first horizontal plate
110a1. Bolt insertion hole 110b: first heat dissipation part
110c: groove 110d: punch blind hole
110e: Nut 110f: IP connector hole
110g: Fixed cover fixing hole 111: Internal heat sink
111a: second horizontal plate 111b: second heat dissipation unit
120: PCB assembly 121: LED device array
130: flood cover 131: stepped
132: convex lens 140: sealant
150: insert material 160: fixing cover
161: Flood cover mounting hole 162. Fixed bar
163. Jam hook 170: IP connector

Claims (6)

A first transverse plate 110a having a rectangular shape manufactured by a stamping manufacturing method, and extending from the top and bottom of the first transverse plate 110a to the rear of the first transverse plate 110a It is composed of a pair of first heat dissipation unit (110b), a heat sink (heat) in which a rectangular groove (110c) (groove) is formed in front of the first horizontal plate 110a by punching (punching) sink) 110;
A printed circuit board assembly (PCB assembly) mounted in close contact with a groove 110c formed on the front surface of the first horizontal plate 110a of the heat sink 110 and provided with at least one light emitting diode (LED) ( 120);
A plastic lenses 130 mounted on the front surface of the PCB assembly 120 mounted on the groove 110c;
A sealant 140 applied to an edge of the translucent cover 130;
A potting material 150 filled in a space between the light-transmitting cover 130 which is an edge region of the groove 110c and the groove 110c for dustproofing and waterproofing the PCB assembly 120 );
The transparent cover 130 includes a fixed cover (cover) 160 covering the front surface of the heat sink 110 in an exposed state,
The inner heat sink 111 further comprises a second horizontal plate 111a having the same shape as the heat sink 110 and a pair of second heat sinks 111b, and the inner heat sink 111 Is mounted on the rear side of the first horizontal plate 110a but is installed between the pair of first heat dissipation units 110b,
In the groove 110c formed on the front surface of the first transverse plate 110a,
A plurality of punched blind holes (110d) and a nut (110e) embedded in the punch blind hole (110d) is provided,
The PCB assembly 120,
It is configured to be mounted in close contact with the first horizontal plate (110a) by driving a screw (screw) on the nut (110e),
The PCB assembly 120,
It is configured to include a plurality of different types of LED device array (array) (121),
The LED element array 121,
Convex lens 132 formed on the light-transmitting cover 130 facing each other,
The transparent cover 130,
It is formed of polycarbonate,
The sealant 140 is formed of silicon, and is configured to prevent the insertion material 150 from seeping between the transparent cover 130 and the PCB assembly 120,
An IP connector hole 110f is penetrated into the groove 110c of the first horizontal plate 110a, and an IP connector 170 is mounted to the IP connector hole 110f.
The fixed cover 160 is provided with a light transmission cover installation hole 161 to fit the light transmission cover 130,
The stepped edge 131 is processed on the front edge of the transparent cover 130,
The stepped 131 is fixed over the edge of the light transmission cover installation hole 161,
Left and right ends of the first horizontal plate 110a are exposed outside the left and right ends of the fixed cover 160,
A bolt insertion hole 110a1 is processed to be coupled to a panel in the first horizontal plate 110a exposed to the left and right ends of the fixed cover 160,
On the front left and right sides of the transparent cover 130, protrusions 133 protruding forward of the transparent cover 130 are formed,
The front surface of the protrusion 133 is processed into an arc shape,
The upper surface and the lower surface of the protrusion 133 and one side of the light emitting cover installation hole 161 that comes into contact with the left end or the right end are processed in a flat shape,
A fixed bar 162 protruding to the rear of the fixed cover 160 is formed at the rear edge of the fixed cover 160,
A hook 163 is formed at the end of the fixing bar 162,
A fixing cover fixing hole 110g is penetrated through the front surface of the heat sink 110 facing the fixing bar 162 so that the end of the fixing bar 162 and the hook 163 are inserted,
The end of the fixing bar 162 and the hook hook 163 is fitted to the fixing cover fixing hole (110g) using a light-transmitting cover characterized in that to fix the fixing cover 160 to the heat sink 110, LED lighting fixture with stamping type heat sink.
delete delete delete delete According to claim 1,
The insert material 150 is a LED lighting fixture with a heat sink of the stamping type using a light-transmitting cover, characterized in that using a polyurethane (PU) mixture.

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