KR102108564B1 - 전도성 필름 및 그 제조방법 - Google Patents
전도성 필름 및 그 제조방법 Download PDFInfo
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- KR102108564B1 KR102108564B1 KR1020160149212A KR20160149212A KR102108564B1 KR 102108564 B1 KR102108564 B1 KR 102108564B1 KR 1020160149212 A KR1020160149212 A KR 1020160149212A KR 20160149212 A KR20160149212 A KR 20160149212A KR 102108564 B1 KR102108564 B1 KR 102108564B1
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- 239000004973 liquid crystal related substance Substances 0.000 claims description 19
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 12
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 12
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- 150000004706 metal oxides Chemical class 0.000 claims description 11
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
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- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
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- 239000006229 carbon black Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- VPXSRGLTQINCRV-UHFFFAOYSA-N dicesium;dioxido(dioxo)tungsten Chemical compound [Cs+].[Cs+].[O-][W]([O-])(=O)=O VPXSRGLTQINCRV-UHFFFAOYSA-N 0.000 claims description 4
- 125000003700 epoxy group Chemical group 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 4
- 229910052749 magnesium Inorganic materials 0.000 claims description 4
- 229910052750 molybdenum Inorganic materials 0.000 claims description 4
- 239000011733 molybdenum Substances 0.000 claims description 4
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- 239000004332 silver Substances 0.000 claims description 4
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 4
- 229910001887 tin oxide Inorganic materials 0.000 claims description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 4
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- 241001101998 Galium Species 0.000 claims description 3
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- FWLHAQYOFMQTHQ-UHFFFAOYSA-N 2-N-[8-[[8-(4-aminoanilino)-10-phenylphenazin-10-ium-2-yl]amino]-10-phenylphenazin-10-ium-2-yl]-8-N,10-diphenylphenazin-10-ium-2,8-diamine hydroxy-oxido-dioxochromium Chemical compound O[Cr]([O-])(=O)=O.O[Cr]([O-])(=O)=O.O[Cr]([O-])(=O)=O.Nc1ccc(Nc2ccc3nc4ccc(Nc5ccc6nc7ccc(Nc8ccc9nc%10ccc(Nc%11ccccc%11)cc%10[n+](-c%10ccccc%10)c9c8)cc7[n+](-c7ccccc7)c6c5)cc4[n+](-c4ccccc4)c3c2)cc1 FWLHAQYOFMQTHQ-UHFFFAOYSA-N 0.000 claims description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
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- ZTXONRUJVYXVTJ-UHFFFAOYSA-N chromium copper Chemical compound [Cr][Cu][Cr] ZTXONRUJVYXVTJ-UHFFFAOYSA-N 0.000 claims description 2
- 229910003437 indium oxide Inorganic materials 0.000 claims description 2
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 claims description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N iron oxide Inorganic materials [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims description 2
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- 239000010955 niobium Substances 0.000 claims description 2
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 2
- 229920000767 polyaniline Polymers 0.000 claims description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 2
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- OYKPJMYWPYIXGG-UHFFFAOYSA-N 2,2-dimethylbutane;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CCC(C)(C)C OYKPJMYWPYIXGG-UHFFFAOYSA-N 0.000 description 1
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
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- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/16—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer formed of particles, e.g. chips, powder or granules
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/02—Layer formed of wires, e.g. mesh
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/16—Layered products comprising a layer of metal next to a particulate layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/72—Cured, e.g. vulcanised, cross-linked
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
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- Conductive Materials (AREA)
Abstract
Description
도 2는, 본 출원의 제조방법에 따라, 마이셀 내부로 전도성 입자가 침투한 것을 촬영한 이미지이다.
도 3은, 본 출원의 제조방법에 따라 제조된 전도성 필름을 촬영한 이미지이다.
Claims (22)
- 하부 전도성 기재; 및 상기 하부 전도성 기재 상에 마련되어 하나의 층을 형성하고, 액정 또는 전도성 입자를 함유하는 복수의 마이셀;을 포함하며,
상기 마이셀에 포함된 양친매성 화합물의 헤드는 경화성 관능기를 갖고 서로 화학적으로 결합되어 경화막을 형성하는 전도성 필름.
- 제1항에 있어서, 상기 마이셀에 의해 형성되는 마이셀층을 갖는 전도성 필름
- 제2항에 있어서, 하부 전도성 기재와 대향하도록 마련되는 상부 전도성 기재를 더 포함하는 전도성 필름.
- 제3항에 있어서, 상부 및 하부 전도성 기재는 투명 전도성 금속 산화물을 포함하고, 상기 투명 전도성 금속 산화물은 ITO(Indium Tin Oxide), In2O3(indium oxide), IGO(indium galium oxide), FTO(Fluor doped Tin Oxide), AZO(Aluminium doped Zinc Oxide), GZO(Galium doped Zinc Oxide), ATO(Antimony doped Tin Oxide), IZO(Indium doped Zinc Oxide), NTO(Niobium doped Titanium Oxide), ZnO(zink oxide), 또는 CTO (Cesium Tungsten Oxide) 중 어느 하나인 전도성 필름.
- 제3항에 있어서, 상부 및 하부 전도성 기재는 은(Ag), 구리(Cu), 알루미늄(Al), 마그네슘(Mg), 금(Au), 백금(Pt), 텅스텐(W), 몰리브덴(Mo), 티탄(Ti), 니켈(Ni) 또는 이들의 합금 중에서 선택된 금속성분을 포함하는 메탈메쉬인 전도성 필름.
- 제5항에 있어서, 상기 상부 및 하부 전도성 기재는 2개의 금속 산화물층 사이에 금속층이 개재된 OMO(oxide/metal/oxide) 전극인 전도성 필름.
- 제6항에 있어서, 상기 금속산화물층은 Sb, Ba, Ga, Ge, Hf, In, La, Ma, Se, Si, Ta, Se, Ti, V, Y, Zn 및 Zr로 이루어진 군에서 선택되는 1 이상의 금속 산화물을 포함하는 전도성 필름.
- 제7항에 있어서, 상기 금속층을 이루는 금속은 은(Ag), 구리(Cu), 알루미늄(Al), 마그네슘(Mg), 금(Au), 백금(Pt), 텅스텐(W), 몰리브덴(Mo), 티탄(Ti),또는 니켈(Ni)을 포함하는 전도성 필름.
- 제1항에 있어서, 상기 전도성 입자는 (-) 또는 (+) 전하를 띠는 하전 입자이고, 상기 하전 입자는 카본 블랙(carbon black), 산화철(ferric oxides), 크롬구리(CrCu), 또는 아닐린 블랙(aniline black)인 전도성 필름.
- 제1항에 있어서, 상기 마이셀은 구동 용액을 더 포함하고, 상기 전도성 입자는 마이셀 내에서 이동 가능한 전도성 필름.
- 경화성 관능기를 헤드에 포함하는 양친매성 화합물(a1)로부터 형성된 마이셀(a2)의 헤드를 부분 경화한 후, 액정 또는 전도성 입자(b)를 마이셀 내부로 도입하고, 상기 마이셀의 헤드를 완전 경화하는 단계;
를 포함하는 전도성 필름의 제조방법.
- 제11항에 있어서, 상기 마이셀(a2)은,
친수성 또는 소수성의 분산매(c), 개시제(d), 및 경화성 관능기를 갖는 양친매성 화합물(a1)을 포함하는 제1 조성물을 혼합하여 마련되는 전도성 필름의 제조방법.
- 제12항에 있어서, 상기 제1 조성물은, 상기 친수성 또는 소수성의 분산매(c) 100 중량부 대비, 개시제(d) 0.01 내지 5 중량부, 및 경화성 관능기를 갖는 양친매성 화합물(a1) 0.5 내지 25 중량부를 포함하는 전도성 필름의 제조방법.
- 제12항에 있어서, 마이셀 내부로의 전도성 입자(b) 도입은,
액정 또는 전도성 입자(b), 및 상기 친수성 또는 소수성의 분산매(c)와 불혼화성(immiscible)인 구동 용매(e)를 포함하는 제2 조성물을, 상기 제1 조성물과 혼합하여 이루어지는 전도성 필름의 제조방법.
- 제14항에 있어서, 상기 제2 조성물은, 상기 구동 용매(e) 100 중량부 대비 상기 액정 또는 전도성 입자(b) 0.1 내지 15 중량부를 포함하는 전도성 필름의 제조방법.
- 제14항에 있어서, 상기 제1 조성물 100 중량부 대비 상기 제2 조성물 1 내지 50 중량부를 혼합하는 전도성 필름의 제조방법.
- 제11항에 있어서, 상기 양친매성 화합물(a1)은 경화성 관능기로서 아크릴레이트기 또는 에폭시기를 갖는 전도성 필름의 제조방법.
- 제17항에 있어서, 상기 부분 경화는 교반, 열 조사 또는 광 조사 중 어느 하나에 의해 이루어지는 전도성 필름의 제조방법.
- 제17항에 있어서, 상기 완전 경화는 교반, 열 조사 또는 광 조사 중 어느 하나에 의해 이루어지는 전도성 필름의 제조방법.
- 제14항에 있어서, 마이셀의 헤드를 완전 경화한 후, 서로 혼합된 상기 제1 및 제2 조성물을 하부 전도성 기재 상에 도포하여 헤드가 완전 경화된 마이셀을 하부 전도성 기재 상에 위치시키는 단계;
를 더 포함하는 전도성 필름의 제조방법.
- 제20항에 있어서, 하부 전도성 기재 상에 마이셀을 위치시킨 후, 건조를 수행하는 전도성 필름의 제조방법.
- 제20항에 있어서, 하부 전도성 기재와 대향하도록, 상부 전도성 기재를 마이셀이 형성하는 층 상에 마련하는 단계;
를 더 포함하는 전도성 필름의 제조방법.
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