KR102100725B1 - The apparatus and method of contact heat dissipation by using graphene contact pads, diagonal stripe heat pipes, dot-type heat sink contact - Google Patents

Abstract

In the present invention, the conventional heat dissipation case has a structure in which the heat sink is opened back and forth, and foreign matter is introduced into the smartphone through the heat sink, causing problems with equipment, and only the heat sink centering on the incision has a heat dissipation effect. There is no separate heat dissipation method for the head and rim parts other than the incision, so the smartphone still gets hot, and when using it for navigation while the smartphone is mounted on a vehicle, block or block sunlight. There is no device to give, the sunlight is reflected on the smartphone as it is, and the smartphone becomes hot, improving the problem that cannot be used for navigation, and the case body 100, the graphene contact pad part 200, and the diagonal stem type heat radiation Since the pipe 300 and the dot-type heat sink 400 are configured, without a hole or opening on the surface of the case body, the smart device It can be attached and detached and installed in an auxiliary form, including the center of the surface, providing excellent installation and product molding, excellent compatibility, and reducing the malfunction of equipment due to the introduction of foreign substances by 70%. Since it can radiate heat through the pin contact pad part, the secondary diagonal stem type heat dissipation pipe, and the tertiary dot type heat sink, it can provide 80% improved heat dissipation effect on the case for smartphones. Through the heat dissipation pipe, it reacts with the CPU heat of the smart device and can conduct heat dissipation by receiving the heat of the smart device through a continuous phase change of evaporation, heat insulation, and condensation. Due to the heat dissipation problem, the graphene contact pad unit and diagonal line can improve the thrusting or throttling phenomenon of the device driving by 80% compared to the previous one. To provide a third-effect type smartphones case contact heat dissipating device and a method through a once-type heat pipe, dot-like heat sink it is an object.

Description

THE APPARATUS AND METHOD OF CONTACT HEAT DISSIPATION BY USING GRAPHENE CONTACT PADS, DIAGONAL STRIPE HEAT PIPES, DOT through a graphene contact pad part, a diagonal stem type heat radiation pipe, and a dot type heat sink -TYPE HEAT SINK CONTACT}

In the present invention, after forming the case body in the form of a concave groove case including the center of the back of the smart device, primary heat dissipation through the graphene contact pad portion formed on the bottom surface of the inner space of the case body, and the graphene contact pad portion Secondary heat dissipation is provided through a diagonal stem-type heat radiation pipe formed in a diagonal stem shape in the diagonal direction of the lower surface, and a third dot heat sink can be radiated through a dot heat sink in a plurality of dot shapes on the bottom surface of the case body. The purpose of the present invention is to provide a case contact heat dissipation device and method for a third-effect smartphone through a graphene contact pad part, a diagonal stem type heat radiation pipe, and a dot type heat sink.

Since the smartphone has a high CPU processing speed and performs a variety of tasks, the amount of CPU work is high and the heat of the CPU is large.

Moreover, due to the slim structure of the smartphone, it is not easy to install an effective heat dissipation means in the smartphone.

Therefore, a large amount of heat is generated in the smartphone, and excessive heat generated in the smartphone causes discomfort and anxiety to the user.

That is, since an explosion has been reported due to a bad battery, etc., the user may be in great anxiety when the smartphone becomes too hot.

Even if it is set aside, it is desirable to dissipate heat as quickly as possible because the heat generated by the smartphone may cause an error in the operation of the smartphone.

In order to solve this problem, in Korean Patent Registration No. 10-1197251, there is an inner surface and an outer wall surface surrounding an edge and a rear surface of a mobile phone, and the inner surface has a case body formed with a cut-out of a pierced structure; And a plate structure made of a metal material, which is inserted into the incision of the case body, coupled to the case body, and a heat sink that is coupled such that the front and rear surfaces are exposed to the front and rear of the incision of the case body, and the heat sink Silver has a heat dissipation case that is formed at a position where at least a portion of the entire area is in close contact with a portion having a relatively large amount of heat from the back of the mobile phone.

This is a structure in which the heat sink is opened back and forth, and foreign matter flows into the smartphone through the heat sink, causing a malfunction of the device, and only the heat sink area centering on the incision has a heat dissipation effect, and the rest of the heat sink There is no separate heat dissipation means on the head and the edge, so there is a problem that the smartphone is still hot.

In addition, when the smartphone is mounted on a vehicle and used for navigation, there is no device to block or block sunlight, and sunlight is reflected back to the smartphone as it is, and the smartphone becomes hot and cannot be used for navigation. There was.

Korean Registered Patent Publication No. 10-1197251

In order to solve the above problems, in the present invention, without a hole or an opening on the surface of the case body, including the center of the back of the smart device, it can be attached and detached and installed in an auxiliary form, and the primary graphene contact pad part. , 2nd diagonal stem type heat radiation pipe, 3rd dot type heat sink can radiate heat, and smart device through continuous phase change of evaporation, heat insulation, and condensation by reacting with CPU heat of smart device through diagonal line type heat sink The purpose of the present invention is to provide a case contact heat dissipation device and method for a third-effect smartphone through a graphene contact pad unit, a diagonal stem type heat radiation pipe, and a dot type heat sink that can conduct heat dissipation.

In order to achieve the above object, the case contact heat dissipation device for a third-effect smartphone through a graphene contact pad part, a diagonal stem type heat radiation pipe, and a dot type heat sink,

It is formed in a case shape of the groove, and is enclosed around the back of the smart device, and is detachably installed in an auxiliary form to protect and support each device from external pressure.

It is formed in the shape of a pad of graphene material on the bottom surface of the inner space of the case body, and makes a surface contact with the entire rear surface of the smart device, conducting heat from the smart device to conduct primary heat dissipation, and the graphene contact pad part 200,

The graphene contact pad is formed in a diagonal stem shape in the diagonal direction of the lower surface, and is located on the same line as the CPU and electronic parts of the smart device, and heat from the CPU and electronic parts of the smart device, or A heat radiation pipe 300 that radiates heat from the graphene pad portion and conducts secondary heat dissipation by conducting heat from the remaining smart devices,

It is formed by forming a plurality of dots on the bottom surface in the outer direction of the case body, and is made of a dot type heat sink 400 that radiates heat from a diagonal stem type heat dissipation pipe and conducts heat from the remaining smart devices to heat radiation.

As explained above,

First, without a hole or opening on the surface of the case body, it can be attached and detached and installed in an auxiliary form, including the center of the back of the smart device, so it has excellent installability, product molding, compatibility, and foreign matter inflow. This can reduce the malfunction of the equipment by 70%.

Second, it can radiate heat through the primary graphene contact pad part, the secondary diagonal stem type heat dissipation pipe, and the tertiary dot type heat sink, thereby providing 80% improved heat dissipation effect on the case for smartphones.

Third, in particular, it reacts with the CPU heat of the smart device through a diagonal stem-type heat dissipation pipe, and conducts and dissipates heat from the smart device through continuous phase changes of evaporation, heat insulation, and condensation. The heat dissipation can thereby be improved, and the thrusting or throttling phenomenon of the device driving according to the heat dissipation problem can be improved by 80%.

1 is a block diagram showing the components of the case contact heat dissipation device (1) for a third-effect smart phone through a graphene contact pad portion, a diagonal stem type heat radiation pipe, and a dot type heat sink according to the present invention,
Figure 2 is a perspective view showing the components of the case contact heat dissipation device for a third-effect smart phone through a graphene contact pad portion, a diagonal stem type heat radiation pipe, and a dot type heat sink according to the present invention,
Figure 3 is an exploded perspective view showing the components of the case contact heat dissipation device for a third-effect smart phone through a graphene contact pad portion, a diagonal stem type heat radiation pipe, and a dot type heat sink according to the present invention,
4 is in contact with the back of the smart device from the main conductor of the coin-shaped diagonal stem heat radiation pipe 310 to the first diagonal stem according to the present invention, reacts with the heat of the smart device to continuously change phase of evaporation, heat insulation, and condensation. One embodiment showing heat dissipation through,
Figure 5 is an embodiment showing that a significant temperature difference across the contact surface is generated through the contact heat resistance according to the present invention,
Figure 6 is a perspective view showing the components of the coin-shaped oblique stem heat radiation pipe according to the present invention,
Figure 7 is a perspective view showing the components of a heat-radiating pipe of a non-coated diagonal stem according to the present invention,
8 is a graphene contact pad portion is formed on the bottom surface of the inner space of the case body formed in the case shape of the groove according to the present invention, making surface contact with the entire rear surface of the smart device, conducting heat from the smart device to conduct contact heat resistance One embodiment showing that the primary heat radiation through,
9 is a diagonal stalk-type heat dissipation pipe according to the present invention is made of a coin-shaped diagonal stalk heat dissipation pipe 310, the coin-shaped diagonal stalk heat dissipation pipe 310 in a diagonal direction to one side based on the coin-shaped main conductor 311 Three to five first diagonal stems 312 are formed, and are in contact with the rear of the smart device from the main conductor to the first diagonal stem, reacting with the heat of the smart device, through continuous phase changes of evaporation, heat insulation, and condensation. One embodiment showing heat dissipation,
Figure 10 is a graphene contact pad according to the present invention, a diagonal line-type heat radiation pipe, a third-effect smartphone case through the heat sink through the case contact heat dissipation device of the diagonal line-type heat-dissipating pipe of the diagonal line type (no) copper-type diagonal line heat radiation An exploded perspective view showing the construction of a pipe,
11 is a graphene contact pad according to the present invention, a diagonal line type heat radiation pipe, a third effect type case through a heat sink, a contactless heat dissipation device for a smartphone of a third effect type of a diagonal line type heat radiation pipe of a diagonal line type (no) A plan view showing the direction in which the pipes are joined,
12 is a graphene contact pad according to the present invention, a diagonal line-type heat dissipation pipe, and a dot-type heat sink through a third-effect smartphone case contact heat dissipation device of the diagonal line-type heat dissipation pipe of the diagonal (no) copper type diagonal line heat radiation Plane perspective view showing a pipe combined in a plan view,
13 is an embodiment showing that the dot-type heat sink according to the present invention is formed in a plurality of dot shapes around the outer bottom surface and side surfaces of the case body,
14 is a graphene contact pad according to the present invention, heat generated during operation on a smart device (Samsung Galaxy) that is not equipped with a case contact heat dissipation device for a third-effect smartphone through a diagonal stem type heat dissipation pipe and dot type heat sink In one embodiment taken with a thermal imaging camera,
15 is a graphene contact pad according to the present invention, the heat generated during operation in a smart device (Samsung Galaxy) equipped with a case contact heat dissipation device for a third-effect smart phone through a diagonal stem type heat dissipation pipe, dot type heat sink An embodiment taken with a thermal imaging camera,
Figure 16 is a flow chart showing a specific process of the contact contact heat dissipation method for a third-effect smart phone through a graphene contact pad portion, a diagonal stem type heat radiation pipe, and a dot type heat sink according to the present invention.

Hereinafter, a preferred embodiment according to the present invention will be described with reference to the accompanying drawings.

Figure 1 relates to a configuration diagram showing the components of the case contact heat dissipation device for a third-effect smartphone through a graphene contact pad portion, a diagonal stem type heat radiation pipe, a dot type heat sink according to the present invention, 2 is a perspective view showing the components of the case contact heat dissipation device for a third-effect smart phone through a graphene contact pad part, a diagonal stem type heat radiation pipe, and a dot type heat sink according to the present invention, which is the case body (100), a graphene contact pad part 200, a diagonal stem type heat dissipation pipe 300, and a dot type heat sink 400.

First, the case body 100 according to the present invention will be described.

The case body 100 is formed in a case shape of a recess, and is enclosed around the back side of a smart device, and is detachably installed in an auxiliary form to protect and support each device from external pressure.

3, a graphene contact pad portion is formed on the bottom surface of the inner space of the case body, and a diagonal stem type heat radiation pipe is formed in a diagonal stem shape in the diagonal direction of the lower surface of the graphene contact pad portion. It is composed of a dot-type heat sink formed in a plurality of dot shapes on the bottom surface in the outer direction of the case body.

In addition, the case body 100 is made of an aluminum alloy material excellent in heat dissipation and durability, and is formed in a case shape of a groove.

Next, the graphene contact pad unit 200 according to the present invention will be described.

The graphene contact pad part 200 is formed in the shape of a pad of graphene material on the bottom surface of the inner space of the case body to make surface contact with the entire rear surface of the smart device, conducting heat from the smart device and conducting primary heat dissipation. Plays a role.

Here, graphene (GRAPHENE) is a material having an atomic size honeycomb structure made of carbon atoms, and is made using graphite as a raw material.

And, its thickness is as thin as 0.2 nm, so it has high transparency, and can transmit 100 times more current than copper at room temperature, 100 times faster than silicon, more than 2 times higher than the diamond with the highest thermal conductivity, and mechanical strength is 200 times higher than steel. It is strangely strong, but has good elasticity and does not lose its electrical conductivity even when stretched or folded.

Graphene contact pad portion according to the present invention is composed of a rectangular pad having a size of 40mm ~ 80mm × 10mm ~ 15mm × 1mm ~ 5mm (width × length × height).

Next, the oblique stem type heat radiation pipe 300 according to the present invention will be described.

The diagonal stem-type heat dissipation pipe 300 is formed in a diagonal stem shape in a diagonal direction of the lower surface of the graphene contact pad portion, and is located on the same line as the location of the CPU and electronic components of the smart device and the bottom of the smart device. The heat from the CPU and electronic components, or the heat from the graphene pad part, conducts the secondary heat dissipation by conducting heat from the remaining smart devices.

It is configured by selecting any one of a coin-shaped diagonal stem heat-radiating pipe 310 and a non-coiled-type diagonal heat-radiating pipe 320.

As shown in FIG. 6, the coin-shaped diagonal stem heat radiation pipe 310 is formed with 3 to 5 first diagonal stems 312 in one diagonal direction based on the coin-shaped main conductor 311, From the main conductor to the first oblique stem, it is in contact with the back of the smart device, and reacts with the heat of the smart device to serve to dissipate heat through continuous phase changes of evaporation, heat insulation, and condensation.

4 is in contact with the back of the smart device from the main conductor of the coin-shaped diagonal stem heat radiation pipe 310 to the first diagonal stem according to the present invention, reacts with the heat of the smart device to continuously change phase of evaporation, heat insulation, and condensation. It relates to an embodiment diagram showing heat dissipation through.

As shown in FIG. 7, the non-copper-type oblique stem heat radiation pipe 320 is formed with three to five second oblique stems 321 in a diagonal direction, without a coin-shaped main conductor. 2 The diagonal stem is in contact with the back of the smart device, and reacts with the heat of the smart device to dissipate heat through continuous phase changes of evaporation, heat insulation, and condensation.

Figure 10 is a graphene contact pad according to the present invention, a diagonal line type heat radiation pipe, a third effect type through the heat sink of the case for the third-effect smartphone case contact heat dissipation device of the diagonal line type heat radiation pipe (no) copper type diagonal line heat radiation It relates to an exploded perspective view showing that the pipe is configured, Figure 11 is a graphene contact pad according to the present invention, a diagonal stem type heat dissipation pipe, a dot effect heat sink through a third-effect smartphone case contact heat dissipation device of the diagonal line Regarding a plan view showing a heat-radiating pipe in which the non-copper-type inclined stem heat-radiating pipe is combined in a plan view direction, FIG. 12 is a graphene contact pad portion, a diagonal stem-type heat-radiating pipe, dot-type heat sink according to the present invention Among the case-contact heat-dissipation devices for third-effect smartphones through the flat perspective It relates to a plane perspective view showing in a direction.

Since the non-copper-type diagonal stem heat dissipation pipe 320 according to the present invention is configured, it is easy to install and can be installed in various positions according to a direction in contact with the rear surface of the smart device.

In addition, the slash-type heat radiation pipe 300 made of one of the coin-shaped slash-type heat radiation pipe 310 and the non-coin type slash-type heat radiation pipe 320 is 2 mm to 10 mm wide x 1 mm to 4 mm high. It is preferably made of a width of 6mm x height of 2mm.

The diagonal stem heat dissipation pipe has thermal conductivity using a composite fluid made of an aluminum alloy having an outer surface, aluminum, zinc, copper, iron (Fe), silicon (Si), scandium (Sc), and manganese (Mn). It is made of a material that improves.

And, the working fluid filled in the interior space and radiating heat through continuous phase change of evaporation, heat insulation, and condensation is C ₁₄ H ₃ , C ₁₆ H ₃₄ , C ₁₈ H ₃₈ , C ₁₉ H ₄₀ , C ₂₀ H ₄₂ , C ₂₁ H ₄₄ , C ₂₂ H ₄₆ , Polyglycol E400, Ethylene diamine, Acetic acid, Glycerol, di-acetic acid, cyanamide ( cyanamide), wax, polyglycol E6000, FeBr ₃ · 6H ₂ O, CaCl ₂ · 6H ₂ O, LiNO ₂ · 3H ₂ O, Na ₂ SO ₄ · 10H ₂ O, NaCO ₃ · 10H ₂ O, Na ₂ HPO ₄ · 12H ₂ O, Zn (NO ₃ ) ₂ · 6H ₂ O, CaBr ₂ · 6H ₂ O, ZnSO ₄ · 7H ₂ O, Na ₂ S ₂ O ₂ · 5H ₂ O, Ni ( NO ₃ ) ₂ · 6H ₂ O, NaCH ₂ S ₂ O ₂ · 5H ₂ O, water (H ₂ O) One or more basic fluids selected from 99.2 ~ 99.9 vol% of carbon nanotube particles 0.1 ~ 0.8 vol% It is composed of a complex fluid added.

In addition, instead of the carbon nanotube particles, carbon powder (graphite powder), boron nitride, silicon nitride, boron oxide, aluminum oxide, aluminum hydroxide (Al (OH) 3), titanium dioxide (TiO2), mica, mica, feldspar , Titanium oxide, zirconia oxide, nano diamond, silica (SiO2), kaolin, talc, barite, pyrite, wollastonite, zeolite, and consists of one or more selected from the group consisting of diatomite.

Next, the dot type heat sink 400 according to the present invention will be described.

The dot heat sink 400 is formed in a plurality of dot shapes around the outer bottom and side surfaces of the case body to radiate heat from the diagonal stem-type heat dissipation pipe and conduct the third heat dissipation by conducting heat from the remaining smart devices. do.

It is formed by selecting any one of a triangular shape, a quadrangular shape, a pentagonal shape, a hexagonal shape, a circular shape, and a rhombus shape, and is made of an aluminum alloy material that is light, excellent in wear resistance, heat dissipation, and moldability.

As shown in FIG. 13, the dot-type heat sink 400 according to the present invention is formed by being formed in a plurality of dot shapes around the bottom and side surfaces in the outer direction of the case body.

Hereinafter, a specific process of the case contact heat dissipation method for a third-effect smartphone through a graphene contact pad portion, a diagonal stem type heat radiation pipe, and a dot type heat sink according to the present invention will be described.

16 is a flow chart showing a specific process of the case contact heat dissipation method for a third-effect smart phone through a graphene contact pad part, a diagonal stem type heat radiation pipe, and a dot type heat sink according to the present invention.

First, as shown in FIG. 8, a graphene contact pad portion is formed on the bottom surface of the inner space of the case body formed in the case shape of the groove, making surface contact with the entire rear surface of the smart device, and receiving heat from the smart device. Primary heat dissipation through contact heat resistance (S10).

Here, the graphene contact pad portion is composed of a rectangular pad having a size of 6 cm × 12 cm × 0.3 cm (width × length × height), and primarily radiates heat through heat conduction.

When the contact heat resistance is a perfect contact between the back surface of the smart device and the two surfaces of the graphene contact pad part in the thermal conduction analysis through a multi-layered solid, there is no temperature drop at the contact surface, but when the contact surface is enlarged with a microscope, The contact surface is significantly different from the apparent contact area seen by the eye due to the numerous pitches of acid and acid.

If it is not a perfect contact surface, the contact surface includes air layers of various sizes, and the low thermal conductivity of air acts as a heat insulating material, thus acting as a kind of heat resistance.

This is called contact heat resistance, and a significant temperature difference across the contact surface occurs, as shown in FIG. 5.

The contact heat resistance R _c is expressed by Equation (1).

Here, h _c is the contact heat transfer coefficient, and the contact heat resistance R _c per unit area is as follows.

The graphene contact pad portion according to the present invention has a contact heat resistance (R _c ) value per unit area between 0.00001 and 0.001 (m 2 · K / W).

Next, a diagonal stem-type heat dissipation pipe is formed on the lower surface of the graphene contact pad, and is located on the same line as the CPU and electronic parts of the smart device, and heat from the CPU and electronic parts of the smart device. Alternatively, heat is radiated from the graphene pad portion and the heat of the remaining smart devices is conducted to radiate secondary heat (S20).

Here, the diagonal stem type heat radiation pipe is more specifically, the diagonal line type heat radiation pipe 300 is to improve the thermal conductivity using a complex fluid,

Aluminum with 99.9% purity 92.0 to 96.0 wt%, zinc (Zn) 2.0 to 6.0 wt%, copper (Cu) 1.0 to 2.0 wt%, iron (Fe) 0.1 to 0.4 wt%, silicon (Si) Groove Wick type cylindrical heat dissipation pipe made of aluminum alloy with composition of 0.05 ~ 0.2 wt%, scandium (Sc) 0.05 ~ 0.2 wt%, and manganese (Mn) 0.01 ~ 0.04 wt% Is washed first with distilled water for 5 to 10 minutes, washed with nitric acid for 5 to 10 minutes and washed with alcohol for 3 to 5 to 10 minutes to wash and heat the inside of the heat dissipation pipe. Course,

After the washing and drying process is completed, the inside of the heat dissipation pipe is vacuumed until the internal vacuum reaches 10 ^-6 Torr using a vacuum pump connected to a vacuum valve, and then C ₁₄ H ₃ , C ₁₆ H ₃₄ , C ₁₈ H ₃₈ , C ₁₉ H ₄₀ , C ₂₀ H ₄₂ , C ₂₁ H ₄₄ , C ₂₂ H ₄₆ , Polyglycol E400, Ethylene diamine, Acetic acid, Glycerol, Di- Acetic acid (d-Lactic acid), cyanamide, wax, polyglycol E6000, FeBr ₃ · 6H ₂ O, CaCl ₂ · 6H ₂ O, LiNO ₂ · 3H ₂ O, Na ₂ SO ₄ · 10H ₂ O, NaCO ₃ · 10H ₂ O, Na ₂ HPO ₄ · 12H ₂ O, Zn (NO ₃ ) ₂ · 6H ₂ O, CaBr ₂ · 6H ₂ O, ZnSO ₄ · 7H ₂ O, Na ₂ S ₂ O ₂ · 5H ₂ O, Ni (NO ₃ ) ₂ · 6H ₂ O, NaCH ₂ S ₂ O ₂ · 5H ₂ O, any one or more basic fluids selected from water (H ₂ O) 99.2 ~ 99.9 vol % Is used after the process of injecting a composite fluid with 0.1 to 0.8 vol% of carbon nanotube particles added. At this time, the more preferable blending ratio of the composite fluid is to be composed of a blend of the basic fluid 99.5 vol% and carbon nanotube particles 0.5 vol%.

As shown in FIG. 9, the diagonal stem type heat radiation pipe is made of a coin type diagonal line heat radiation pipe 310, and the coin type diagonal line heat radiation pipe 310 is one side based on the coin-shaped main conductor 311. Three to five first diagonal stems 312 are formed in a diagonal direction, and are in contact with the rear of the smart device from the main conductor to the first diagonal stem, and react with the heat of the smart device to continuously evaporate, heat, and condense. Heat is radiated through change.

Finally, a dot type heat sink is formed on the bottom surface of the case body to radiate heat from the diagonal stem type heat dissipation pipe and conduct heat of the remaining smart device for third heat dissipation (S30).

Here, the dot-type heat sink is more specifically, made of an aluminum alloy on which graphene is deposited.

The aluminum alloy on which the graphene is deposited is 92.0 to 96.0 wt% of aluminum with 99.9% purity, zinc (Zn) 2.0 to 6.0 wt%, copper (Cu) 1.0 to 2.0 wt%, and iron (Fe) 0.1 to Aluminum alloy having a composition of 0.4 wt%, 0.05 to 0.2 wt% of silicon (Si), 0.05 to 0.2 wt% of scandium (Sc), and 0.01 to 0.04 wt% of manganese (Mn) 60 Mpa , Injection speed (Injection velocity) 0.3 m / s, mold temperature (Mold temperature) process of manufacturing a dot-type heat sink 400 by injection molding under the conditions of 230 ℃,

The process of removing the contamination layer on the surface of the dot-type heat sink 400 using # 600 ~ # 2000 sand paper (sand paper),

And the process of drying after the ultrasonic cleaning for 5 to 10 minutes in an acetone solvent dot-type heat sink 400 with the contaminant layer removed,

After mixing the graphene and a dispersant of MTEOS (Methyltrethoxysilane) in a 1: 1 weight ratio to form a mixture, the dot-type heat sink (400) was prepared using a graphene dispersion solution prepared by dispersing in an ultrasonic bath for 20 to 30 hours. ) The surface of graphene is deposited,

While maintaining the temperature of the dot-type heat sink 400 at 100 ° C, using a spray coating device, an injection rate of 150 to 220 µl / min, an injection amount of 0.25 to 1 ml / cm 2, the Coating is performed with the distance between the surface of the dot heat sink 400 and the spray nozzle of the spray coating device maintained at 28 to 32 cm, and after coating, heat treatment is performed at 480 to 520 ° C for 3 to 6 minutes. By completing the process of removing impurities from the surface of the dot-type heat sink 400.

Specific examples of the compounding of the aluminum alloy include aluminum 92.285 wt%, zinc (Zn) 5.5 wt%, copper (Cu) 1.7 wt%, iron (Fe) 0.3 wt%, and silicon (Si) 0.1 wt% And, scandium (Sc) 0.1 wt% and manganese (Mn) 0.015 wt%.

The aluminum alloy has high durability by adding scandium (Sc), and has a high heat dissipation function by graphene-depositing the surface of the aluminum alloy having such properties.

Heat is the energy transferred from one system to another due to the temperature difference, while heat transfer is the amount of heat transferred and changes over time, and at some point the process for temperature distribution and heat transfer in the system lasts to some extent. Say things.

The basic requirements for the generation of heat transfer are that the voltage difference generates current and the pressure difference is the driving force of the fluid flow, so that the heat transfer does not freeze between two objects of the same temperature, the temperature difference between the two objects and the temperature from the second law of thermodynamics Move from high to low.

That is, heat is transferred from a smart device that is a high-temperature object to a dot type heat sink that is a low-temperature object.

The heat conduction mechanism in a solid is thermally driven by two effects: a lattice vibration wave generated by vibrations of molecules located in a well-arranged lattice, and a heat conduction in a solid due to movement of energy by free electron flow in the solid. Takes place.

Table 1 shows the thermal conductivity of materials made at room temperature.

matter Thermal conductivity (k)
[W / M · K (℃)] matter Thermal conductivity (k)
[W / M · K (℃)] Graphene Diamond × 2 Water 1.613 Diamond 2,300 Human skin 0.37 Silver 429 Wood (oak) 0.17 Copper 401 Helium 0.152 Gold 317 Soft rubber 0.13 Aluminum 234 Refrigerant-12 0.072 Iron 80.2 Glass fiber 0.043 Mercury 8.54 Air 0.026 Glass 0.78 Urethane, rigid foam 0.026 Brick 0.72

Thus, the dot-type heat sink according to the present invention, as shown in Table 1, is made of an aluminum alloy with high thermal conductivity graphene deposited.

14 is a graphene contact pad according to the present invention, heat generated during operation on a smart device (Samsung Galaxy) that is not equipped with a case contact heat dissipation device for a third-effect smartphone through a diagonal stem type heat dissipation pipe and dot type heat sink It relates to an embodiment taken with a thermal imaging camera,

15 is a graphene contact pad according to the present invention, the heat generated during operation in a smart device (Samsung Galaxy) equipped with a case contact heat dissipation device for a third-effect smart phone through a diagonal stem type heat dissipation pipe, dot type heat sink It relates to an embodiment diagram taken with a thermal imaging camera.

1: Case contact radiator for third-effect smartphones
100: case body
200: graphene contact pad part
300: diagonal stem type heat radiation pipe
400: dot type heat sink

Claims (6)

It is formed in a case shape of the groove, and is enclosed around the back of the smart device, and is detachably installed in an auxiliary form to protect and support each device from external pressure.
It is formed in the shape of a pad of graphene material on the bottom surface of the inner space of the case body, and makes a surface contact with the entire back of the smart device, conducting heat from the smart device to conduct heat and primary heat dissipation, and
The graphene contact pad is formed in a diagonal stem shape in the diagonal direction of the lower surface, and is located on the same line as the CPU and electronic parts of the smart device, and heat from the CPU and electronic parts of the smart device, or A heat radiation pipe 300 that radiates heat from the graphene pad portion and conducts secondary heat dissipation by conducting heat from the remaining smart devices,
Graphene contact pad formed of a dot-shaped heat sink 400 that is formed in a plurality of dot shapes on the bottom surface of the case body to dissipate heat from the diagonal stem-type heat-dissipating pipe and conduct heat 3 times by conducting heat from the remaining smart devices. In the case contact heat dissipation device for a third-effect smartphone through a secondary, diagonal stem type heat radiation pipe, dot type heat sink,
The diagonal stem heat radiation pipe 300 is
Based on the coin-shaped main conductor, three to five oblique stems are formed diagonally to one side, and it is in contact with the back of the smart device from the main conductor to the oblique stem, and reacts with the heat of the smart device to continuously evaporate, heat, and condense. Coin-shaped diagonal stem heat dissipation pipe 310 to radiate heat through the phase change,
Without a coin-shaped main conductor, three to five diagonal stems are formed diagonally, and the diagonal stems are in contact with the back of the smart device, reacting with the heat of the smart device through continuous phase changes of evaporation, heat insulation, and condensation. Graphene contact pad part, diagonal stem type heat radiation pipe, and third effect smartphone through dot heat sink, characterized in that any one of the radiating non-coiled diagonal wire heat radiation pipe 320 is selected and configured Case contact radiator.
delete A graphene contact pad portion is formed on the bottom surface of the inner space of the case body formed in the case shape of the groove, making surface contact with the entire rear surface of the smart device, conducting heat from the smart device to conduct primary heat dissipation (S10),
A graphene contact type heat radiation pipe is formed on the lower surface of the graphene contact pad, and is located on the same line as the CPU and electronic parts of the smart device, and heat from the CPU and electronic parts of the smart device, or Heat dissipating from the pin pad portion and conducting secondary heat dissipation by conducting the heat of the remaining smart device (S20),
A graphene contact pad unit and a diagonal stem consisting of a step (S30) in which a dot type heat sink is formed on the bottom surface of the case body to dissipate heat from the diagonal stem type heat dissipation pipe and conduct the third heat radiation by conducting heat from the remaining smart devices. In the case contact heat dissipation method for a third-effect smartphone through a heat radiation pipe, a dot heat sink,
The diagonal stem heat radiation pipe
Aluminum with 99.9% purity 92.0 to 96.0 wt%, zinc (Zn) 2.0 to 6.0 wt%, copper (Cu) 1.0 to 2.0 wt%, iron (Fe) 0.1 to 0.4 wt%, silicon (Si) Groove Wick type cylindrical heat dissipation pipe made of aluminum alloy with composition of 0.05 ~ 0.2 wt%, scandium (Sc) 0.05 ~ 0.2 wt%, and manganese (Mn) 0.01 ~ 0.04 wt% Is washed first with distilled water for 5 to 10 minutes, washed with nitric acid for 5 to 10 minutes and washed with alcohol for 3 to 5 to 10 minutes to wash and heat the inside of the heat dissipation pipe. Course,
After the washing and drying process is completed, the inside of the heat dissipation pipe is vacuumed until the internal vacuum reaches 10 ^-6 Torr using a vacuum pump connected to a vacuum valve, and then C ₁₄ H ₃ , C ₁₆ H ₃₄ , C ₁₈ H ₃₈ , C ₁₉ H ₄₀ , C ₂₀ H ₄₂ , C ₂₁ H ₄₄ , C ₂₂ H ₄₆ , Polyglycol E400, Ethylene diamine, Acetic acid, Glycerol, Di- Acetic acid (d-Lactic acid), cyanamide, wax, polyglycol E6000, FeBr ₃ · 6H ₂ O, CaCl ₂ · 6H ₂ O, LiNO ₂ · 3H ₂ O, Na ₂ SO ₄ · 10H ₂ O, NaCO ₃ · 10H ₂ O, Na ₂ HPO ₄ · 12H ₂ O, Zn (NO ₃ ) ₂ · 6H ₂ O, CaBr ₂ · 6H ₂ O, ZnSO ₄ · 7H ₂ O, Na ₂ S ₂ O ₂ · 5H ₂ O, Ni (NO ₃ ) ₂ · 6H ₂ O, NaCH ₂ S ₂ O ₂ · 5H ₂ O, any one or more basic fluids selected from water (H ₂ O) 99.2 ~ 99.9 vol It characterized by consisting of a composition prepared through the process of injecting a composite fluid with 0.1 ~ 0.8 vol% of carbon nanotube particles added to The graphene contact pad part, the diagonal contact type heat dissipation pipe, and the case-contact heat dissipation method for a third-effect smartphone through a dot-type heat sink.
delete The method of claim 3, wherein the diagonal stem heat radiation pipe
The coin-shaped diagonal stem is made of heat-dissipating pipe, and three to five diagonal stems formed diagonally in the coin-shaped main conductor are in contact with the back of the smart device, reacting with the heat of the smart device to continuously evaporate, heat, and condense. Case contact heat dissipation method for a third-effect smartphone through a graphene contact pad part, a diagonal stem type heat dissipation pipe, and a dot type heat sink, characterized by radiating heat through change.
The method of claim 3, wherein the dot-type heat sink 400
Aluminum with 99.9% purity 92.0 to 96.0 wt%, zinc (Zn) 2.0 to 6.0 wt%, copper (Cu) 1.0 to 2.0 wt%, iron (Fe) 0.1 to 0.4 wt%, silicon (Si) Aluminum alloy having a composition of 0.05 to 0.2 wt%, scandium (Sc) 0.05 to 0.2 wt%, and manganese (Mn) 0.01 to 0.04 wt%, injection pressure 60 Mpa, injection velocity 0.3 m / s, the process of manufacturing a dot-type heatsink 400 by injection molding at a mold temperature of 230 ° C,
The process of removing the contamination layer on the surface of the dot-type heat sink 400 using # 600 ~ # 2000 sand paper (sand paper),
And the process of drying after the ultrasonic cleaning for 5 to 10 minutes in an acetone solvent dot-type heat sink 400 with the contaminant layer removed,
The dot-type heat sink (400) was prepared by using a graphene dispersion solution prepared by mixing graphene and a dispersant of MTEOS (Methyltrethoxysilane) in a 1: 1 weight ratio, and then dispersing it in an ultrasonic bath for 20 to 30 hours. ) The surface of graphene is deposited,
While maintaining the temperature of the dot-type heat sink 400 at 100 ° C, using a spray coating device, an injection rate of 150 to 220 µl / min, an injection amount of 0.25 to 1 ml / cm 2, the Coating is performed with the distance between the surface of the dot heat sink 400 and the spray nozzle of the spray coating device maintained at 28 to 32 cm, and after coating, heat treatment is performed at 480 to 520 ° C for 3 to 6 minutes. Graphene contact pad portion, diagonal stem type heat radiation pipe, dot type heat, characterized in that the finished graphene is made of an aluminum alloy deposited through the process of removing impurities from the surface of the dot type heat sink 400 Method of contact heat dissipation for a third-effect smartphone through a sink.

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