KR102095225B1 - Chip type fuse using hybrid intergrated circuit technology - Google Patents

Abstract

The present invention relates to a chip type fuse using a hybrid integrated circuit technology, which is capable of improving precision. The chip type fuse comprises: a ceramic substrate having a through hole; a fuse unit designed to be cut off by being heated when current equal to or greater than a predetermined value flows therethrough; and a terminal pad unit electrically connected to the fuse unit.

Description

Chip fuse using hybrid integrated circuit technology {CHIP TYPE FUSE USING HYBRID INTERGRATED CIRCUIT TECHNOLOGY}

The present invention relates to a chip-type fuse using a hybrid integrated circuit technology, and more specifically, to form a chip (Chip) by forming a conductor pattern with a conductive paste using a hybrid integrated circuit technology having a thick film printing method on a ceramic substrate having excellent thermal conductivity Manufactured with, but when a certain current flows over a certain thickness, the thinly formed part of the conductor pattern is melted by heating, so that it can be melted and cut off so that it can exhibit the characteristics of a fuse that cuts off the current, and the generated heat can be quickly released through the ceramic substrate. It relates to a chip-type fuse using an integrated circuit technology.

In general, the conventional chip-type fuse uses a characteristic material (a soluble metal conductor) that breaks when it flows over a certain current, and uses two or more substrates to form it.

Accordingly, the conventional chip-type fuse has a disadvantage in that the manufacturing process is complicated and the process time is large due to the execution of multiple processes.

As a technique already disclosed for such a chip-shaped fuse, in Japanese Patent Application Laid-Open No. 11-96886, a silicone resin film is formed on an upper surface of an inorganic substrate, and a fuse film is formed on the silicone resin film. It is disclosed that a protective film is formed of a silicone resin on a fuse film and a silicone resin film on the upper surface of the substrate is formed to a thickness of 10 µm.

In addition, in Korean Patent No. 10-1050243, a first heat storage layer made of a film material having low thermal conductivity is formed on an insulating substrate, and a fuse film is formed so as not to contact the insulating substrate on the first heat storage layer, The fuse film has a fuse element portion between surface electrode portions disposed at both ends, and a second heat storage layer made of a film material having low thermal conductivity is formed on the fuse element portion, and the first heat storage layer is the second heat storage. It is disclosed that the first heat storage layer and the second heat storage layer made of a film material formed thicker than the layer and having low thermal conductivity are formed of a B-stage sheet-like material containing a photosensitive device.

This chip-type fuse is required to have precision to quickly cut it off when it flows over a certain current.

On the other hand, the chip-type fuse has a surface mountable configuration, and has been widely applied to smartphones, video game consoles, CD / DVD / HDD drives, and LCD monitors.

Japanese Patent Application Publication No. Hei 11-96886 Republic of Korea Registered Patent Publication No. 10-1050243

The present invention has been devised in view of the above-mentioned problems and solving the above-described problems, and by forming a conductor pattern with a conductive paste using a hybrid integrated circuit technology having a thick film printing method on a ceramic substrate having excellent thermal conductivity, in the form of a chip. It is manufactured, but when a certain current flows over a certain current, the part formed thinly on the conductor pattern melts and breaks as it heats, so that it can exhibit the characteristics of a fuse that cuts off the current, and the generated heat can be quickly released through the ceramic substrate. The purpose is to provide a chip-type fuse using circuit technology.

An object of the present invention is to provide a chip-type fuse using a hybrid integrated circuit technology so that it can be quickly and accurately cut off when it flows over a certain current and improves precision.

Chip-type fuse using a hybrid integrated circuit technology in accordance with the present invention for achieving the above object, the thermal conductivity of _{Al 2 O 3, SiO 2,} BaTiO 3, SrTiO 3, PbTiO 3, Pb (Zr, Ti) having excellent properties O ₃ , a ceramic substrate made of at least one of carbon nanotubes and boron nitride nanotubes, and having a through hole for electrically connecting a fuse portion and a terminal pad portion; A fuse unit designed to exert a function as a fuse by printing a conductive paste on an upper surface of the ceramic substrate to form a conductor pattern of a predetermined shape, and designed to be blown off when a certain current or more flows; It is formed by printing a conductive paste on the lower surface of the ceramic substrate, and is designed to function as an external contact terminal while enabling chip-type fuse mounting on the PCB substrate, and a terminal pad that is electrically connected to the fuse unit through a through hole on the side of the ceramic substrate. Including, but, the fuse portion, the electrode pattern of a pair of structures formed in a spaced and symmetrical structure in a state facing each other on the left and right sides of the upper surface of the ceramic substrate; It includes a connection medium that electrically connects and connects the electrode patterns of the paired structure, and a fusing pattern designed to be cut off while being heated when a certain current or more flows. Including, the electrode pattern is located in the inner direction from the outer direction of the ceramic substrate The formation width is reduced toward the fusing pattern, and the fusing pattern is formed to have a smaller formation width than the minimum formation width portion of the electrode pattern, so that when a certain current or more flows, current concentration occurs at the fusing pattern side. It is characterized in that it is configured to melt and break while increasing heat generation.

Here, when the formation width of the portion located at the outermost side of the current pattern side is “D”, the formation width d of the fusing pattern may be configured to satisfy the conditions of 1 / 5D to 1 / 4D. .

Here, the fuse portion and the terminal conductive paste used in the pad portion is CaRuO _3, BaRuO _3, SrRuO _3, Bi2Ru ₂ O _7, RuO _2, ITO, ZTO, PdAg, Ag, Cu, at least one selected from Al The main material is made of a mixed composition containing a binder by epoxy or acrylate; The main material can increase the contact area of the conductive paste, reduce usage, and optimize the rheology characteristics of the conductive paste to induce smooth printing and to form in excellent patterns. A flake-type powder having a particle size range of µm and a density range of 3.8 to 4.5 g / cc is used, and the conductive paste maintains a viscosity of 10000 to 13000 cPs in consideration of adhesiveness on the side of the ceramic substrate and dischargeability during printing. It can be configured to.

Here, formed by printing a ceramic paste to protect the parts of the fuse cover the upper surface of the ceramic _{substrate, Al 2 O 3, SiO 2} , BaTiO 3, SrTiO 3, PbTiO 3, Pb (Zr, Ti) O 3, Bi ₂ O ₃ -SiO ₂ -B ₂ O ₃ , ZnO-SiO ₂ -B ₂ O ₃ , Na ₂ OK ₂ 0-Al ₂ O ₃ -SiO ₂ , at least one of carbon nanotubes and boron nitride nanotubes It may further include a protective film made.

Here, the fuse unit may be formed in a thickness of 5 to 30㎛ so that the breakage phenomenon due to heat generation is easily performed when a certain current or more flows while preventing the normal current flow.

According to the present invention, a chip-type fuse can be easily manufactured in a very simple manner by forming a conductor pattern and forming a fuse unit using thick film printing, which is a hybrid integrated circuit technology, on a ceramic substrate having excellent thermal conductivity. Since it is utilized, it is possible to provide a chip-type fuse that can easily adjust the length, width, and thickness of the fuse part and precisely form it, thereby increasing precision.

According to the present invention, when a certain current flows over a certain current, the portion formed thinly on the side of the conductor pattern melts and breaks as it heats up, so that it can exhibit the characteristics of a fuse that cuts off the current and heat generated by the fuse is rapidly released through the ceramic substrate and the protective film. It is possible to provide a chip-type fuse that can be used.

According to the present invention, when it flows over a certain current it can be quickly and accurately cut off, it can provide a useful effect to lower the contact resistance when mounted on a PCB substrate.

1 is a perspective view showing a chip-type fuse using a hybrid integrated circuit technology according to an embodiment of the present invention.
2 is an exploded perspective view showing a chip-type fuse using a hybrid integrated circuit technology according to an embodiment of the present invention.
3 is a cross-sectional view showing a chip-type fuse using a hybrid integrated circuit technology according to an embodiment of the present invention.
4 is a plan view showing a fuse formed by a conductive paste in a chip-type fuse using a hybrid integrated circuit technology according to an embodiment of the present invention.

When describing a preferred embodiment with reference to the accompanying drawings for the present invention is as follows, through this detailed description will be able to better understand the object and configuration of the present invention and features accordingly.

Chip-type fuse 100 using the hybrid integrated circuit technology according to an embodiment of the present invention, as shown in Figures 1 to 4, the ceramic substrate 110, the fuse unit 120, the terminal pad unit 130 and the protective film ( 140).

The ceramic substrate 110 is configured to function as a base material for forming the fuse unit 120 and discharge heat generated from the fuse unit 20 to the outside.

The ceramic substrate 110 is _{Al 2 O 3, SiO 2,} BaTiO 3, SrTiO 3, PbTiO 3, Pb (Zr, Ti) O 3, carbon nanotube, selected from the group consisting of boron nitride nanotubes, one having excellent thermal conductivity properties The species may be used or a mixture of two or more species may be used, and may be provided by molding and sintering using the above-described ceramic material.

As an example, any one selected from materials of Al ₂ O ₃ , SiO ₂ , BaTiO ₃ , SrTiO ₃ , PbTiO ₃ , and Pb (Zr, Ti) O ₃ can be used by mixing carbon nanotubes or boron nitride nanotubes. There are _two or more of Al ₂ O ₃ , SiO ₂ , BaTiO ₃ , SrTiO ₃ , PbTiO ₃ , and Pb (Zr, Ti) O ₃ materials.

Here, the ceramic substrate 110 may be processed such that the through holes 111 for use in electrically connecting the fuse portion 120 and the terminal pad portion 130 formed on the upper and lower surfaces are located on both right and left sides. .

The fuse unit 120 is provided to exert a function as a fuse by printing a conductive paste on an upper surface of the ceramic substrate 110 by inkjet printing or screen printing to form a conductor pattern having a predetermined shape, and having a constant current or higher. It is designed to melt and break when it heats.

The fuse unit 120 is located on both right and left sides of the upper and lower surfaces of the ceramic substrate 110, and a pair of electrode patterns 121 formed of spaced apart and symmetrical structures and electrode patterns of the pair structure ( 121) is a connection medium that electrically connects and connects the liver, and includes a fusing pattern 122 formed to melt and break when it is heated when a certain current or more flows.

At this time, the electrode pattern 121 is formed so that the forming width is reduced toward the fusing pattern 122 located in the inner direction from the outer direction of the ceramic substrate 110, the fusing pattern 122 is the electrode pattern 121 ) Is formed to have a smaller formation width than the minimum formation width portion, so that when a certain current or more flows, the fusing pattern 122 is configured to be melted and disconnected by increasing heat generation by the current concentration phenomenon, thereby rapidly blocking the current. It is desirable to configure it.

Here, as shown in FIG. 4, when the formation width of the portion positioned on the outermost side of the current pattern 121 is “D”, the formation width d of the fusing pattern 122 is 1 / 5D It is preferable to configure to satisfy the condition of ~ 1 / 4D.

Here, the fuse unit 120 may be formed to a thickness of 5 to 30㎛ so that a phenomenon in which melting occurs and is broken by heat generation when a certain current or more flows is easily performed while preventing a normal current flow.

In addition, the conductive paste is _{CaRuO 3, BaRuO 3, SrRuO 3} , Bi2Ru 2 O 7, RuO 2, at least one or more host material selected from the group consisting of ITO, ZTO, PdAg, Ag, Cu, Al that is used for the fuse 120 It may be made of a mixed composition containing a binder by epoxy or acrylate.

At this time, it is preferable to compose 25 to 40 parts by weight of binder with respect to 100 parts by weight of the main material, and organic additives such as glass frit or carbon may be further added, and paste may be pasted through stirring and mixing for a second time. .

Here, it is preferable that the conductive paste is manufactured and used to maintain a high viscosity of 10000 to 13000 cPs in consideration of adhesiveness on the side of the ceramic substrate and ejection during printing.

The main material can increase the contact area of the conductive paste, reduce usage, and optimize the rheology characteristics of the conductive paste to induce smooth printing and to form in excellent patterns. It is preferred to use flake powder having a particle size range of µm and a density range of 3.8 to 4.5 g / cc.

The binder increases the properties of the conductive paste, facilitates formation of a fine pattern, and can provide excellent rheological properties for the conductive paste.

Here, the fuse unit 120 may be formed through a process of printing, drying, and firing using a conductive paste made of a mixed composition of the above-listed materials, and repeating this process 3 to 5 times to achieve high quality. The conductive pattern can be processed to form.

Incidentally, in order to form a conductive pattern with excellent quality for the fuse part 120, after printing the conductive paste, drying is performed for 10-15 minutes at a temperature condition of 145-160 ° C, and a temperature of 750-900 ° C It is preferable to perform calcination for 10 to 15 minutes under conditions.

On the other hand, in the configuration of the fuse unit 120, for example, in order to have an allowable current of 100 mA, the length of the conductor pattern is 50 mm, the maximum formation width of the conductor pattern is 5 mm, and The thickness can be designed to be 7.5 μm.

Therefore, the fusing pattern 122 on the side of the fuse unit 120 is melted and blown as it heats up when a current of 100 mA or more flows, thereby blocking the current.

As described above, for the fuse unit 120, the allowable current can be limited and adjusted by adjusting the length, width, and thickness of the conductor pattern, and since printing technology is utilized, the adjustment can be easily and simply performed. Can provide.

The terminal pad portion 130 is formed by printing a conductive paste on the lower surface of the ceramic substrate 110 by inkjet printing or screen printing, and enables external mounting of the chip-type fuse 100 on the PCB substrate 1 It is designed to function as a contact terminal, and is configured to be electrically connected to the fuse unit 120 by filling the through hole with a conductive paste through the through hole 111 on the ceramic substrate 110 side.

The terminal pad portion 130 is formed by printing a conductive paste together with the fuse portion 120. As described above, the terminal pad portion 130 may be formed using a conductive paste having the same composition as the fuse portion 120.

Here, the terminal pad unit 130 performs a process of drying and firing after printing, which can also be performed under the same conditions as forming the fuse unit 120.

In addition, the terminal pad 130 may be configured with a composition having a different type, flake-type silver powder having a particle size range of 1 to 3 μm and a density range of 3.8 to 4.5 g / cc. After forming and printing with 25 to 40 parts by weight of a binder by epoxy or acrylate in 100 parts by weight, it can be formed in a form of drying and firing.

Here, when the terminal pad portion 130 is connected to a terminal on the PCB substrate 1 side, it can lower contact resistance, provide excellent rheology characteristics, and enable low-temperature drying and firing. Can provide energy savings.

Incidentally, after printing when using the flake-type silver powder, drying may be performed for 30 to 60 minutes at a temperature condition of 140 to 150 ° C, and may be calcined for 10 to 15 minutes at a temperature condition of 250 to 300 ° C.

The protective layer 140 is provided to cover and protect the fuse unit 120 formed on the upper surface of the ceramic substrate 110, and has a function of dissipating heat generated by the fuse unit 120 to the outside.

The protective film 140 is formed by printing a ceramic paste to the ink-jet printing or screen printing _{method, Al 2 O 3, SiO 2} , BaTiO 3, SrTiO 3, PbTiO 3, Pb (Zr, Ti) O 3, Bi 2 O ₃ -SiO ₂ -B ₂ O ₃ , ZnO-SiO ₂ -B ₂ O ₃ , Na ₂ OK ₂ 0-Al ₂ O ₃ -SiO ₂ , any one or two selected from carbon nanotubes and boron nitride nanotubes It can be used in a mixed state.

Here, the protective film 50 is also required to print, dry and fire using the ceramic pastes listed above, and can usually be closed once.

At this time, in order to form the protective film 50 with excellent quality, after printing the ceramic paste, drying is performed for 10-15 minutes at a temperature condition of 145-155 ° C, and 10-15 at a temperature condition of 450-550 ° C. It is preferred to fire for a minute.

Accordingly, through the chip-type fuse 100 using the hybrid integrated circuit technology according to the present invention having the above-described configuration, a conductor pattern is formed and fused using a thick film printing, which is a hybrid integrated circuit technology, on a ceramic substrate 110 having excellent thermal conductivity. By configuring the unit 120, a chip-type fuse can be easily manufactured in a very simple manner, and since the printing technology is utilized, the length, width, and thickness of the fuse unit 120 can be easily adjusted. It is possible to provide a chip-type fuse that can be precisely formed and can increase precision.

The embodiments described above are merely for explaining preferred embodiments of the present invention, and are not limited to these embodiments, and various modifications and modifications by those skilled in the art within the technical spirit and claims of the present invention. It will be said that this can be made, which will fall within the technical scope of the present invention.

100: chip-type fuse 110: ceramic substrate
120: fuse unit 121: electrode pattern
122: fusing pattern 130: terminal pad portion
140: protective film

Claims (5)

Made of at least one of BaTiO ₃ , SrTiO ₃ , PbTiO ₃ , Pb (Zr, Ti) O ₃ , and boron nitride nanotubes having excellent thermal conductivity properties, through-hole for electrically connecting the fuse portion and the terminal pad portion This processed ceramic substrate;
A fuse unit designed to exert a function as a fuse by printing a conductive paste on an upper surface of the ceramic substrate to form a conductor pattern of a predetermined shape, and designed to be blown off when a certain current or more flows;
It is formed by printing a conductive paste on the lower surface of the ceramic substrate, and is designed to function as an external contact terminal while enabling chip-type fuse mounting on the PCB substrate, and a terminal pad that is electrically connected to the fuse unit through a through hole on the side of the ceramic substrate. part; Including,
The fuse unit,
An electrode pattern having a pair of structures, which are located on both left and right sides of the top surface of the ceramic substrate and are spaced apart from each other and formed in a symmetrical structure; A connecting medium that electrically connects and connects the electrode patterns of the paired structure, and a fusing pattern designed to be cut off by heating when a certain current or more flows; It includes,
The electrode pattern is formed such that the forming width is reduced toward the fusing pattern located in the inner direction from the outer direction of the ceramic substrate, and the fusing pattern is formed to have a smaller forming width than the minimum forming width portion of the electrode pattern, When more than a certain current flows, the fusing pattern is configured to melt and break as the heat increases due to the current concentration phenomenon.
Conductive paste used in the fuse unit and the terminal pad portion comprises the binder according to the _{CaRuO 3, BaRuO 3, SrRuO 3} , Bi2Ru 2 O 7, RuO 2, ITO, an epoxy or an acrylate to the above at least one kind of host material selected from the ZTO It consists of a mixed composition;
The main material can increase the contact area of the conductive paste, reduce usage, and optimize the rheology characteristics of the conductive paste to induce smooth printing and to form in excellent patterns. A flake-type powder having a particle size range of µm and a density range of 3.8 to 4.5 g / cc is used,
The conductive paste is a chip-type fuse using a hybrid integrated circuit technology, characterized in that it is configured to maintain a viscosity of 10000 to 13000 cPs in consideration of adhesiveness on the side of a ceramic substrate and ejectability during printing. According to claim 1,
When the formation width of the portion located on the outermost side of the electrode pattern is referred to as "D", the formation width (d) of the fusing pattern is configured to satisfy the conditions of 1 / 5D to 1 / 4D. Chip fuse using integrated circuit technology. delete According to claim 1,
Is formed by printing a ceramic paste to protect the parts of the fuse cover the upper surface of the ceramic _{substrate, BaTiO 3, SrTiO 3, PbTiO} 3, Pb (Zr, Ti) O 3, Bi 2 O 3 -SiO 2 -B 2 O 3 , ZnO-SiO ₂ -B ₂ O ₃ , Na ₂ OK ₂ 0-Al ₂ O ₃ -SiO ₂ , a protective film consisting of at least one or more of boron nitride nanotubes; Chip-type fuse using a hybrid integrated circuit technology further comprising a. According to claim 1,
The fuse unit is a chip-type fuse using a hybrid integrated circuit technology, characterized in that it is formed in a thickness of 5 to 30 µm so that a breakage phenomenon due to heat generation is easily performed when a certain current or more flows while preventing a normal current flow.

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