KR102089843B1 - 혼합된 합금 충전재를 함유하는 전도성 조성물 - Google Patents

혼합된 합금 충전재를 함유하는 전도성 조성물 Download PDF

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Publication number
KR102089843B1
KR102089843B1 KR1020177013835A KR20177013835A KR102089843B1 KR 102089843 B1 KR102089843 B1 KR 102089843B1 KR 1020177013835 A KR1020177013835 A KR 1020177013835A KR 20177013835 A KR20177013835 A KR 20177013835A KR 102089843 B1 KR102089843 B1 KR 102089843B1
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South Korea
Prior art keywords
metal
composition
melting point
particles
alloy
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Korean (ko)
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KR20170059019A (ko
Inventor
캐서린 시어러
케니스 씨. 홀콤
지. 델버트 프리젠
마이클 씨. 매튜스
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오르멧 서키츠 인코퍼레이티드
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/062—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
    • B22F7/064—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts using an intermediate powder layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B22F1/0059—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/09—Mixtures of metallic powders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0221—Insulating particles having an electrically conductive coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dispersion Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Composite Materials (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
KR1020177013835A 2009-04-02 2010-03-31 혼합된 합금 충전재를 함유하는 전도성 조성물 Active KR102089843B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16601509P 2009-04-02 2009-04-02
US61/166,015 2009-04-02
PCT/US2010/029330 WO2010114874A2 (en) 2009-04-02 2010-03-31 Conductive compositions containing blended alloy fillers

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020117024999A Division KR20120032463A (ko) 2009-04-02 2010-03-31 혼합된 합금 충전재를 함유하는 전도성 조성물

Publications (2)

Publication Number Publication Date
KR20170059019A KR20170059019A (ko) 2017-05-29
KR102089843B1 true KR102089843B1 (ko) 2020-03-17

Family

ID=42825368

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020177013835A Active KR102089843B1 (ko) 2009-04-02 2010-03-31 혼합된 합금 충전재를 함유하는 전도성 조성물
KR1020117024999A Ceased KR20120032463A (ko) 2009-04-02 2010-03-31 혼합된 합금 충전재를 함유하는 전도성 조성물

Family Applications After (1)

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KR1020117024999A Ceased KR20120032463A (ko) 2009-04-02 2010-03-31 혼합된 합금 충전재를 함유하는 전도성 조성물

Country Status (5)

Country Link
US (1) US8221518B2 (enExample)
JP (4) JP2012523091A (enExample)
KR (2) KR102089843B1 (enExample)
TW (1) TWI555032B (enExample)
WO (1) WO2010114874A2 (enExample)

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Publication number Publication date
JP2017039167A (ja) 2017-02-23
WO2010114874A3 (en) 2011-03-03
TWI555032B (zh) 2016-10-21
KR20120032463A (ko) 2012-04-05
JP2012523091A (ja) 2012-09-27
JP2021178366A (ja) 2021-11-18
JP2014167915A (ja) 2014-09-11
KR20170059019A (ko) 2017-05-29
TW201108248A (en) 2011-03-01
JP6976028B2 (ja) 2021-12-01
WO2010114874A2 (en) 2010-10-07
US20100252616A1 (en) 2010-10-07
US8221518B2 (en) 2012-07-17

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