KR102084154B1 - Resin composite and led package comprising esd protection layer using the same - Google Patents

Abstract

The resin composition according to an embodiment of the present invention includes a resin and a curing agent of 30 to 40 vol%, an inorganic filler of 60 to 70 vol%, and the inorganic filler includes silver coated tin oxide (Ag-coated SnO, ACS).

Description

LED package comprising a resin composition and ESD protective layer using the same {RESIN COMPOSITE AND LED PACKAGE COMPRISING ESD PROTECTION LAYER USING THE SAME}

The present invention relates to a resin composition, and more particularly, to a resin composition used as an ESD protective layer of an LED package.

LED (Light Emitting Diode) is widely used as a light source of various electronic products. With the development of LED technology, LED packages are becoming smaller, thinner, and more efficient.

However, miniaturized, thinned, and highly efficient LED packages are vulnerable to electrostatic discharge (ESD). ESD has a problem of degrading the performance and reliability of the LED package.

To reduce ESD, Zener Diodes, Varistors, and Transient Voltage Suppressor (TVS) Diodes can be mounted inside the LED package. However, due to this, there is a limit in miniaturization and thinning of the LED package, an additional process is required when mounting, and luminous efficiency may be deteriorated.

Accordingly, it is necessary to develop a material that can simplify the packaging process while satisfying the required level of electrical characteristics.

The present invention is to provide an LED package comprising a resin composition and an ESD protection layer using the same.

The resin composition according to an embodiment of the present invention includes a resin and a curing agent of 30 to 40 vol%, an inorganic filler of 60 to 70 vol%, and the inorganic filler includes silver coated tin oxide (Ag-coated SnO, ACS).

The silver coating tin oxide may be contained in 10 to 20vol% of the resin composition.

The inorganic filler may further include at least one of silicon dioxide and alumina oxide.

The resin may include an epoxy resin, and the curing agent may include dicyandiamide.

The epoxy resin may comprise 1,1,1-tris- (p-hydroxyphenyl) ethane glycidyl ether.

An LED package according to an embodiment of the present invention is an LED wafer, an insulating layer formed on one side of the LED wafer, an electrode portion formed on both sides of the insulating layer, and an electrode passing through the insulating layer and electrically connecting the electrode portion. And a breakdown voltage (V _B ) of the insulating layer is 200V to 500V.

The breakdown voltage of the insulating layer may be 300V to 400V.

The insulating layer may include a resin and a curing agent 30 to 40 vol%, an inorganic filler 60 to 70 vol%, and the inorganic filler may be made of a resin composition including silver coated tin oxide (Ag-coated SnO, ACS).

The insulating layer includes a resin and a curing agent of 30 to 40 vol%, an inorganic filler of 60 to 70 vol%, and the inorganic filler is made of a resin composition including a silver-coated tin oxide (Ag-coated SnO, ACS). ) May include a protective layer.

According to the embodiment of the present invention, a resin composition having excellent heat resistance and electrical characteristics can be obtained. In particular, it is possible to obtain a resin composition having a lower breakdown voltage, which can be applied for ESD protection of the LED package. Accordingly, the performance and reliability of the LED package can be improved.

1 is an example of a cross-sectional view of an LED package.
2 is another example of a cross-sectional view of an LED package.
3 shows a lighting device including an LED package according to an embodiment of the present invention.
4 illustrates a backlight unit including an LED package according to an embodiment of the present invention.

As the invention allows for various changes and numerous embodiments, particular embodiments will be illustrated and described in the drawings. However, this is not intended to limit the present invention to specific embodiments, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention.

Terms including ordinal numbers, such as second and first, may be used to describe various components, but the components are not limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the second component may be referred to as the first component, and similarly, the first component may also be referred to as the second component. The term and / or includes a combination of a plurality of related items or any item of a plurality of related items.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, components, or a combination thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art, and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

When a part of a layer, film, region, plate, etc. is said to be "on top" of another part, this includes not only when the other part is "right on" but also another part in the middle. On the contrary, when a part is "just above" another part, there is no other part in the middle.

Hereinafter, exemplary embodiments will be described in detail with reference to the accompanying drawings, and the same or corresponding components will be given the same reference numerals regardless of the reference numerals, and redundant description thereof will be omitted.

In this specification, wt% may be replaced by parts by weight.

1 is an example of a cross-sectional view of an LED package.

Referring to FIG. 1, the LED package 100 includes an LED wafer 110 and an insulating layer 120 formed on one surface of the LED wafer 110.

The LED wafer 110 includes electrodes 115a and 115b, and electrode portions 130a, 130b, 140a and 140b are formed on both surfaces of the insulating layer 120, respectively. In addition, electrode connecting parts 150a and 150b electrically connecting the electrode parts 130a, 130b, 140a and 140b penetrate the insulating layer 120.

Specifically, the electrode portion formed on one surface of the insulating layer 120 includes a first anode 130a and a first cathode 130b, and the electrode portion formed on the other surface of the insulating layer 120 is second An anode 140a and a second cathode 140b are included. The electrode connection part includes a positive electrode connection part 150a connecting the first positive electrode 130a and the second positive electrode 140a and a negative electrode connection part 150b connecting the first negative electrode 130b and the second negative electrode 140b. do. The positive connection unit 150a and the negative connection unit 160b may be vias including Cu.

The anode 125a of the LED wafer 120 is electrically connected to the first anode 130a, and the first anode 130a is electrically connected to the second anode 140a through the anode connection part 150a. In addition, the cathode 125b of the LED wafer 120 is electrically connected to the first cathode 130b, and the first cathode 130b is electrically connected to the second cathode 140b through the cathode connector 150b. .

2 is another example of a cross-sectional view of an LED package. Descriptions overlapping with FIG. 1 will be omitted.

Referring to FIG. 2, the LED package 100 includes an insulating layer 120 and an LED chip 160 formed on one surface of the insulating layer 120.

Electrode portions 130a, 130b, 140a, and 140b are formed on both surfaces of the insulating layer 120, respectively. In addition, electrode connecting parts 150a and 150b electrically connecting the electrode parts 130a, 130b, 140a and 140b penetrate the insulating layer 120.

The anode of the LED chip 160 is connected to the first anode 130a and the wire 160a, and the first anode 130a is electrically connected to the second anode 140a through the anode connection part 150a. In addition, the cathode of the LED chip 160 is connected to the first cathode 130b and the wire 160b, and the first cathode 130b is electrically connected to the second cathode 140b through the cathode connection portion 150b. do.

In general, a zener diode, a varistor, a transient voltage suppressor (TVS) diode, or the like, may be mounted inside or outside the insulating layer 120 to prevent ESD. However, this complicates the manufacturing process of the LED package and has a problem of lowering luminous efficiency.

Accordingly, development of materials for replacing components such as zener diodes, varistors, and TVS diodes has been attempted. A resin composition comprising a resin, a curing agent, an inorganic filler, and aluminum-doped zinc oxide (Al-dopped ZnO, AZO) has been proposed as an ESD protection composition, but there are limitations in stability and electrical properties.

According to an embodiment of the present invention, to provide a resin composition that can prevent the EDS of the LED package, and obtain the desired level of stability and electrical properties.

The resin composition according to an embodiment of the present invention includes a resin, a curing agent, and an inorganic filler, and the inorganic filler includes silver coated tin oxide (Ag-coated SnO, ACS).

The resin composition according to the embodiment of the present invention contains 30 to 40 vol%, preferably 33 to 37 vol% of the resin and the curing agent, and 60 to 70 vol%, preferably 63 to 67 vol% of the inorganic resin. Fillers.

According to an embodiment of the present invention, the curing agent may include 5 to 15 parts by weight based on 85 to 95 parts by weight of the resin. When less than 5 to 15 parts by weight of the curing agent is contained with respect to 85 to 95 parts by weight of the resin does not occur hardening, when more than 5 to 15 parts by weight of the resin content is lowered, the strength of the resin composition may be weakened.

The resin may be selected from polymeric resins that are cured at room temperature to 600 ° C. The resin is, for example, a polyacrylate resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, an unsaturated polyester resin, a poly Phenylene ether (PPE) resin, polyphenylene oxide (PPO) resin, polyphenylenesulfide resin, cyanate ester resin, benzocyclobutene (BCB) resin , Polyamidoamine dendrimer (PAMAM), polypropyleneimine dendrimer (PPI) resin, PAMAM-OS resin which is a dendrimer having a PAMAM internal structure and an organo-silicon outer surface, and a mixture thereof. .

When an epoxy resin is used, the resin composition according to the embodiment of the present invention has high thermal stability and may have a high glass transition temperature. The epoxy resin can be, for example, a polyfunctional epoxy resin containing an aromatic functional group. The polyfunctional epoxy resin containing an aromatic functional group is, for example, 1,1,1-tris- (p-hydroxyphenyl) ethane glycidyl ether (1,1,1-tris- (p-hydroxyphenyl) ethane glycidyl ether).

The curing agent may be one of an anhydride curing agent, an amine curing agent, an amide curing agent, and a mixture thereof. The amine curing agent may be, for example, aliphatic amines, polyetherpolyamines, alicyclic amines, aromatic amines, dicyandiamide, and the like, and as aliphatic amines, ethylenediamine, 1,3-diaminopropane, 1, 4-diaminopropane, hexamethylenediamine, 2,5-dimethylhexamethylenediamine, trimethylhexamethylenediamine, diethylenetriamine, iminobispropylamine, bis (hexamethylene) triamine, triethylenetetramine, tetraethylenepenta Min, pentaethylene hexamine, N-hydroxyethyl ethylenediamine, tetra (hydroxyethyl) ethylenediamine, etc. are mentioned. The polyether polyamines may be one of triethylene glycol diamine, tetraethylene glycol diamine, diethylene glycol bis (propylamine), polyoxypropylene diamine, polyoxypropylene triamine, and a mixture thereof. Examples of the alicyclic amines include isophoronediamine, metacenediamine, N-aminoethylpiperazine, bis (4-amino-3-methyldicyclohexyl) methane, bis (aminomethyl) cyclohexane, 3,9-bis (3 -Aminopropyl) 2,4,8,10-tetraoxaspiro (5,5) undecane, norbornenediamine, etc. are mentioned. Examples of aromatic amines include tetrachloro-p-xylenediamine, m-xylenediamine, p-xylenediamine, m-phenylenediamine, o-phenylenediamine, p-phenylenediamine, 2,4-diaminoanisole, 2 , 4-toluenediamine, 2,4-diaminodiphenylmethane, 4,4'-diaminodiphenylmethane, 4,4'-diamino-1,2-diphenylethane, 2,4-diaminodi Phenylsulfone, m-aminophenol, m-aminobenzylamine, benzyldimethylamine, 2-dimethylaminomethyl) phenol, triethanolamine, methylbenzylamine, α- (m-aminophenyl) ethylamine, α- (p-amino Phenyl) ethylamine, diaminodiethyldimethyldiphenylmethane, α, α'-bis (4-aminophenyl) -p-diisopropylbenzene, and mixtures thereof.

The acid anhydride-based curing agent is, for example, dodecenyl anhydrous succinic acid, polyadipic anhydride, polyazelate anhydride, polycebacic anhydride, poly (ethyloctadecane diacid) anhydride, poly (phenylhexadecane diacid) anhydride, methyltetrahydro Phthalic anhydride, methyl hexahydrophthalic anhydride, hexahydrophthalic anhydride, methyl himic acid, tetrahydrophthalic anhydride, trialkyltetrahydrophthalic anhydride, methylcyclohexene dicarboxylic anhydride, methylcyclohexene tetracarboxylic anhydride, phthalic anhydride, Trimellitic anhydride, pyromellitic anhydride, benzophenone tetracarboxylic anhydride, ethylene glycol bistrimellitate, hept anhydride, nadic anhydride, methylnadic anhydride, 5- (2,5-dioxotetrahydro-3 -Furanyl) -3-methyl-3-cyclohexane-1,2-dicarboxylic acid anhydride, 3,4-dicarboxy-1,2,3,4-tetrahydro-1-naphthalenesuccinic dianhydride, 1- Methyl-dicarboxy-1 , 2,3,4-tetrahydro-1-naphthalenesuccinic dianhydride and mixtures thereof.

According to an embodiment of the invention, the inorganic filler comprises silver coated tin oxide (Ag-coated SnO, ACS). ACS may be formed by electroless plating Ag on SnO powder. ACS may be in powder form. Silver (Ag) of ACS has higher electrical conductivity than aluminum (Al) of AZO (Al-dopped ZnO). Accordingly, a tunneling effect occurs at a lower voltage to prevent electrostatic discharge.

ACS may be included in 10 to 20vol% of the total resin composition. When ACS is contained less than 10 vol% of the total resin composition, the breakdown voltage becomes high, which makes it impossible to obtain a tunneling effect at a desired voltage (i.e., around 330 V) and lowers the ESD protection effect. When the ACS is contained in an amount greater than 20 vol% of the entire resin composition, the resin composition has the characteristics of the conductor, and a current flows as soon as a voltage is applied.

According to an embodiment of the present invention, the inorganic filler may further include an insulating filler such as silicon dioxide or aluminum oxide. The insulating filler may be contained at 50 to 60 vol% of the total resin composition. If the inorganic filler including ACS and silicon dioxide or aluminum oxide is contained less than 60 vol% of the total resin composition, the dispersion of the inorganic filler is difficult and cannot have the desired level of electrical properties. When the inorganic filler contains more than 70 vol% of the total resin composition, the resin composition has the characteristics of the conductor, and a current flows as soon as a voltage is applied.

The resin composition according to the embodiment of the present invention may further include a catalyst, an additive, and a solvent. The catalyst may comprise, for example, 2MI (2-methylimidazole). And the additive may contain DS-205 which improves dispersion performance, for example. The solvent may include, for example, BCE.

The resin composition according to the embodiment of the present invention may be applied to at least a portion of the insulating layer of the LED package. That is, the resin composition according to the embodiment of the present invention may constitute the insulating layer 120 of FIG. 1. Alternatively, the resin composition according to the embodiment of the present invention may constitute a separate ESD protection layer in the insulating layer 120 of FIG. 1. When the resin composition constitutes a separate ESD protection layer, the ESD protection layer may be connected to at least some of the electrode parts 130a, 130b, 140a and 140b and the electrode connection parts 150a and 150b.

In the present specification, the ESD protection layer may refer to both an insulation layer including a resin composition according to an embodiment of the present invention or an ESD protection layer separately formed in an insulation layer with the resin composition according to an embodiment of the present invention.

When the resin composition according to the embodiment of the present invention is applied in the insulating layer, a tunneling effect occurs at a specific voltage (for example, around 330V), thereby preventing ESD in the LED package.

The LED package according to the embodiment of the present invention is various in various lighting devices, backlight unit (Back Light Unit, BLU) of the display device, Ultra High Definition (UHD) TV, laptop computer, tablet PC, camera, portable terminal, etc. Can be applied.

3 shows a lighting device including an LED package according to an embodiment of the present invention.

Referring to FIG. 3, the lighting device 200 includes a light emitting module 210, a case 220, and a connection terminal 230.

The light emitting module 210 is accommodated in the case 220. In addition, the connection terminal 230 is connected to the case 220 and supplies an external power source (not shown) to the light emitting module 210. The connection terminal 230 is illustrated as being connected to an external power source in a socket manner, but is not limited thereto.

The light emitting module 210 includes a substrate 212 and at least one LED package 214, wherein at least one LED package 214 is mounted on the substrate 212. The LED package 214 may include an insulating layer including a resin composition according to an embodiment of the present invention. Although not shown, the lighting apparatus 200 may further include a heat sink accommodated in the case 220 and connected to the light emitting module 210.

4 illustrates a backlight unit including an LED package according to an embodiment of the present invention.

Referring to FIG. 4, the backlight unit 300 includes a light guide plate 310, a light emitting module 320, a reflective member 330, and a bottom cover 340.

The light guide plate 310 diffuses light to make a surface light source. The light emitting module 320 is a light source of a display device in which a backlight unit is installed, and provides light to the light guide plate 310. The light emitting module 320 may include a substrate 322 and at least one LED package 324, and the LED package 324 may be mounted on the substrate 322. The LED package 324 may include an insulating layer including a resin composition according to an embodiment of the present invention.

The reflective member 330 is formed under the light guide plate 310, and reflects light incident to the bottom surface of the light guide plate 310 to face upward, thereby improving luminance of the backlight unit.

The bottom cover 340 collects the light guide plate 310, the light emitting module 320, and the reflective member 330. To this end, the bottom cover 340 may be a box shape with an upper surface opened, but is not limited thereto.

Hereinafter, it demonstrates more concretely using an Example and a comparative example.

<Example 1>

35 vol% of resin-hardener (10 parts by weight of SIGMA-ALDRICH) was mixed with 90 parts by weight of 1,1,1-tris- (p-hydroxyphenyl) ethane glycidyl ether (Emerald performance materials) After that, 15 vol% of ACS and 50 vol% of silicon dioxide were further added, followed by dispersion treatment with 3 roll mill.

Comparative Example 1

35 vol% of resin-hardener (10 parts by weight of SIGMA-ALDRICH) was mixed with 90 parts by weight of 1,1,1-tris- (p-hydroxyphenyl) ethane glycidyl ether (Emerald performance materials) Afterwards, 65 vol% of ACS was further added and dispersed into a 3 roll mill.

Comparative Example 2

20 vol% of resin-curing agent (10 parts by weight of SIGMA-ALDRICH) to 90 parts by weight of 1,1,1-tris- (p-hydroxyphenyl) ethane glycidyl ether (Emerald performance materials) After that, 20 vol% of ACS and 60 vol% of silicon dioxide were further added, followed by dispersion treatment with a 3 roll mill.

Comparative Example 3

35 vol% of resin-hardener (10 parts by weight of SIGMA-ALDRICH) was mixed with 90 parts by weight of 1,1,1-tris- (p-hydroxyphenyl) ethane glycidyl ether (Emerald performance materials) After that, 15 vol% of AZO (Al-dopped ZnO) and 50 vol% of silicon dioxide were further added, followed by dispersion treatment with 3 roll mill.

<Comparative Example 4>

35 vol% of resin-curing agent (10 parts by weight of SIGMA-ALDRICH) is mixed with 90 parts by weight of 1,1,1-tris- (p-hydroxyphenyl) ethane glycidyl ether (Emerald performance materials) Thereafter, 65 vol% of AZO was further added and dispersed into a 3 roll mill.

Experimental Example

After curing the compositions obtained in Example 1 and Comparative Examples 1 to 4, the breakdown voltage (V _B ) was measured using a Keithley (2657A) IV measuring instrument.

Table 1 shows the results.

Experiment number V _B (@ 330㎛ gap) Example 1 330 V Comparative Example 1 0 Comparative Example 2 0 Comparative Example 3 555 V Comparative Example 4 0

Comparing Example 1 with Comparative Examples 3 and 4, ACS was used as part of the inorganic filler in Example 1, but Al-dopped ZnO (AZO) was used in Comparative Examples 3 and 4. Accordingly, V _B of the resin composition according to Example 1 is 330V, the tunneling effect occurs at 330V to prevent ESD properly, V _B of the resin composition according to Comparative Examples 3 and 4 is 550V or more, V _B is too high and ESD protection is low.

On the other hand, when comparing Example 1 and Comparative Example 1, in Example 1, ACS was used within 20vol% of the total resin composition, but in Comparative Example 1 was used exceeding 20vol%. Accordingly, the resin composition of Comparative Example 1 is jinige the properties of the conductor V _B was displayed as zero.

Comparing Example 1 with Comparative Example 2, the inorganic filler was contained at 65 vol% of the entire resin composition in Example 1, but was used at 80 vol% in Comparative Example 2. Accordingly, the resin composition of Comparative Example 2 is jinige the properties of the conductor V _B was displayed as zero.

Although described above with reference to a preferred embodiment of the present invention, those skilled in the art will be variously modified and changed within the scope of the invention without departing from the spirit and scope of the invention described in the claims below I can understand that you can.

100: LED package
110: LED wafer
120: insulation layer
130, 140: electrode portion
150: electrode connection

Claims (9)

Insulation Layer,
Electrode parts formed on both surfaces of the insulating layer,
LED formed on one side of the insulation layer, and
An electrode connecting part penetrating the insulating layer and electrically connecting electrode parts formed on both surfaces of the insulating layer,
The insulating layer,
Resin and curing agent 30-40 vol%, and
Consists of a resin composition containing 60 to 70vol% of inorganic fillers,
The resin comprises an epoxy resin, the curing agent comprises dicyandiamide,
The inorganic filler includes silver coated tin oxide (Ag-coated SnO, ACS) and silicon dioxide,
The silver coating tin oxide LED package containing 10 to 20vol% of the resin composition. delete The method of claim 1,
Breakdown voltage (V _B ) of the insulating layer is a 200V to 500V LED package. The method of claim 3,
LED breakdown voltage of the insulating layer is 300V to 400V. delete delete delete delete delete

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