KR102071367B1 - Coating apparatus - Google Patents

Abstract

The present invention relates to a liquid composition coating apparatus for composite dielectric for an embedded electronic element of a circuit board. In order to apply a liquid composition for composite dielectric on a ground electrode in a circuit board including a ground electrode formed on an insulation substrate, a thin film which is a composite dielectric formed by applying a liquid composition for composite dielectric on the ground electrode, and a wiring layer formed on a surface or the inside of the thin film, the liquid composition coating apparatus comprises: a lower support having an insulation substrate seated therein; an upper support disposed at an upper side of the lower support to be descended; an injection unit installed on the upper support, having a structure in which a liquid composition for composite dielectric pushed by pressure due to expansion of liquid for generating pressure is sprayed onto the ground electrode from the insulation substrate in a state that an upper side is filled with the liquid for generating pressure and a lower side is filled with the liquid composition for composite dielectric; and a cover unit descended with the injection unit when the upper support is descended, and blocking the insulation substrate from the outside when the liquid composition for composite dielectric is sprayed by the injection unit. Therefore, the predetermined amount of the liquid composition for composite dielectric can be sprayed and applied, and an application process is peformed in a clean state by blocking the insulation substrate from the outside, thereby manufacturing a circuit board of excellent quality.

Description

Liquid composition coating device for composite dielectrics for embedded electronic devices on circuit boards {COATING APPARATUS}

The present invention relates to a liquid composition coating apparatus for a composite dielectric for enabling the application of a liquid composition for a composite dielectric for an embedded electronic device of a circuit board onto a ground electrode of an insulating substrate.

With the progress of the information society, there is an increasing demand for high speed information transmission and high frequency information signals. In order to cope with this problem, high-performance and high-density mounting of circuit boards used in electronics products is desired. To solve this problem, EPD (Embedded Passive Device Technology), a technology for making electronic devices such as resistor capacitor inductors and antennas into circuit boards, I'm getting attention.

As such technology, Korean Patent Registration No. 10-0923542 (registered on October 19, 2009, hereinafter referred to as 'Document 1') `` Embedded semiconductor package device using a release material and a method of manufacturing the same '' has been proposed. Includes an insulator substrate having a wiring circuit having a predetermined pattern, a semiconductor chip embedded in the insulator substrate with at least a part of an outer surface thereof surrounded by a release material cover, and a bump electrically connecting the semiconductor chip and the wiring circuit. Accordingly, the present invention relates to an embedded semiconductor package device using a release material and a method of manufacturing the same, which can provide an embedded semiconductor package device that is easily recycled since the semiconductor chip is embedded in an insulator substrate in a state surrounded by a release material cover.

As another technique, Korean Patent Registration No. 10-1075645 (registered on October 14, 2011, hereinafter referred to as 'Document 2') `` Method of manufacturing an embedded circuit board '' is proposed, and Document 2 discloses an external electrode terminal. Preparing a circuit board having a chip mounting cavity having a front surface and a back surface opposite to the front surface and having an open top and bottom portions, the method comprising the steps of: preparing an electrical element having a; Attaching a release film to the front of the circuit board so that the open top of the chip mounting cavity is sealed, placing the electrical element within the chip mounting cavity so that the protective film adheres to the release film, and the chip through the open bottom of the chip mounting cavity Forming an insulating film covering the back surface of the circuit board while filling the free space of the mounting cavity, when separating the release film from the circuit board. Removing the protective film so that the external electrode terminals are exposed; and forming a metal circuit structure electrically connected to the external electrode terminals on the circuit board. The present invention relates to a method for manufacturing an embedded circuit board which can prevent a bad connection.

As another technology, Korean Patent Registration No. 10-1602318 (registered on March 4, 2016, hereinafter referred to as 'Document 3') `` Method of manufacturing an embedded flexible circuit board using AFC '' is proposed. Figure 3 shows through-holes in the circuit pattern to be electrically connected to the flip chip terminal pad before mounting the flip chip, and then secures the flip chip by welding the ACF to the substrate, then multi-layering a protective layer such as a carrier film or another substrate. After the entire upper surface of the substrate is protected by external insulation, hot pressing is performed to make the ACF thermal curing contact and electrical connection between the flip chip terminal pad and the circuit pattern, and then through the through hole and the terminal pad of the flip chip. As a method of electrical connection, copper film is formed by chemical copper plating to form a via hole connecting the thermally cured ACF and an inner wall, and filling the via hole with electroplating. The bottom plate is plated to complete the circuit board mounting of the flip chip, and then the circuit pattern of the bottom surface of the substrate is formed, and the sequential step process of completing the manufacture of the embedded flexible circuit board product is performed. And a method for manufacturing an embedded flexible circuit board using an ACF which can achieve the process simplification and reliability improvement of the embedded FPCB by enabling the electrical connection with the flip chip attachment using a combination of the and the ACF.

Document 1. Republic of Korea Patent Registration No. 10-0923542 (October 19, 2009) Document 2. Republic of Korea Patent Registration No. 10-1075645 (October 14, 2011) Document 3. Republic of Korea Patent Registration No. 10-1602318 (2016.03.04.Registration)

The present invention provides a circuit board comprising a ground electrode formed on an insulating substrate, a thin film of a composite dielectric formed by applying a liquid composition for a composite dielectric on the ground electrode, and a wiring layer formed on or in the thin film. When applying the liquid dielectric composition for the composite dielectric on the ground electrode, the insulating substrate is cut off from the outside, and the composition is applied in a clean state, and the composite for the embedded electronic device of the circuit board to spray and apply a predetermined amount of the composition. It is an object to provide a liquid composition coating apparatus for dielectrics.

Furthermore, an object of the present invention is to provide a liquid composition coating apparatus for a composite dielectric for an embedded electronic device of a circuit board so that the composition can be automatically refilled by the amount injected after a certain amount of composition injection.

In order to solve the above problems, the liquid composition coating apparatus for a composite dielectric for an embedded electronic device of a circuit board according to the present invention, the ground electrode is formed on an insulating substrate, the liquid composition for a composite dielectric on the ground electrode A lower support body on which the insulating substrate is seated, in order to apply the liquid composition for the composite dielectric on the ground electrode in a circuit board formed of a thin film which is a composite dielectric formed on the surface and a wiring layer formed on or in the thin film; An upper support disposed on the upper side of the lower support and descending; The liquid composition for the composite dielectric, which is installed on the upper support, is filled by the pressure generating liquid at the upper side and the liquid composition for the composite dielectric at the lower side, is pushed by the pressure due to the expansion of the pressure generating liquid, and is grounded on the insulating substrate. An injection unit having a structure sprayed on the electrode; And a cover unit which descends together with the injection unit when the upper support descends and blocks the insulating substrate from the outside when the liquid composition for composite dielectric is injected by the injection unit.

The liquid composition coating apparatus for a composite dielectric for an embedded electronic device of a circuit board according to the present invention may be spray-coated with a predetermined amount of the liquid composition for a composite dielectric, and the liquid composition for the composite dielectric may be automatically refilled after being sprayed. As the process is performed in a clean state by blocking the insulating substrate from the outside during the coating process, there is the greatest effect that can produce a circuit board of excellent quality.

1 is a front configuration diagram showing a liquid composition coating apparatus for a composite dielectric for an embedded electronic device of a circuit board according to the present invention;
Figure 2 is a cross-sectional configuration diagram showing the injection unit and the cover unit,
3 is a plan view of the non-return valve,
Figure 4 is a cross-sectional configuration for showing the injection unit and the cover unit descending,
5 is a partial cross-sectional view of a state of use for showing the movement of the rod and the cover member connected to the liquid composition for the composite dielectric is injected in accordance with the pressure transmission flow,
6 is a partial cross-sectional view for showing a guide of the cover unit,
7 and 8 are partial cross-sectional view of a state of use for showing that the guide of the cover unit is operated by the displacement means.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Prior to this, terms or words used in the present specification and claims should not be construed as having a conventional or dictionary meaning, and the inventors should properly explain the concept of terms in order to best explain their own invention. It should be interpreted as meaning and concept corresponding to the technical idea of the present invention based on the principle that it can be defined. Therefore, the embodiments described in the specification and the configuration shown in the drawings are only the most preferred embodiment of the present invention and do not represent all of the technical idea of the present invention, various equivalents that may be substituted for them at the time of the present application It should be understood that there may be water and variations.

The direction of the lower support side will be specified as the lower or lower side and the upper support side as the upper or upper side based on FIG. 1.

In the present invention, the liquid composition for an organic-inorganic composite dielectric having excellent dispersibility of an inorganic dielectric with respect to an organic polymer and exhibiting a high dielectric constant in the case of an organic-inorganic composite dielectric contains an inorganic dielectric and a fluorinated aromatic polymer.

When the fluorinated aromatic polymer is used as the organic polymer, since the fluorinated aromatic polymer is excellent in dispersibility of the inorganic dielectric material, the inorganic dielectric material can be highly blended in the composition, and a high dielectric constant can be obtained as the composite dielectric.

The composite dielectric formed by the liquid composition for the composite dielectric is suitable for use as an electronic device such as a capacitor constituting an electric circuit board, among applications where the composite dielectric is used.

In order to obtain a high dielectric constant composite dielectric, the composition preferably has an inorganic dielectric in the range of 100 to 2,000 parts by mass with respect to 100 parts by mass of the fluorinated aromatic polymer.

The present invention also includes an electric circuit board comprising a composite dielectric or a composite dielectric formed by using a liquid composition for a composite dielectric as a constituent portion.

In this case, the composite dielectric means that the liquid composition in which the inorganic dielectric is dispersed is molded into a predetermined shape, and refers to a molded body and a molded film in which the inorganic dielectric is highly dispersed in the organic polymer.

By containing a fluorinated aromatic polymer as a glass polymer in the liquid composition for the organic-inorganic composite dielectric in which the inorganic dielectric is dispersed in the organic polymer, the compounding amount of the inorganic dielectric in the composition can be increased, and the dielectric constant in the high frequency region of the composite dielectric can be greatly improved. Can be.

In the liquid composition for composite dielectrics of the present invention, the content of the inorganic dielectric material and the fluorinated aromatic polymer is preferably in the range of 100 to 2,000 parts by weight of the inorganic dielectric with respect to 100 parts by weight of the fluorinated aromatic polymer.

If the content of the inorganic dielectric material is less than 100 parts by mass, the dielectric constant of the composite dielectric made of the liquid composition may be lowered. If the content of the inorganic dielectric material is more than 2,000 parts by mass, the viscosity of the composition may be high and the handleability may be deteriorated.

After all, the lower limit of the inorganic dielectric content is more preferably 500 parts by mass or 700 parts by mass or more based on 100 parts by mass of the fluorinated aromatic polymer. In addition, the more preferable condition of the inorganic dielectric content is most preferably 1,500 parts by mass or 1,000 parts by mass or less with respect to 100 parts by mass of the fluorinated aromatic polymer.

The fluorinated aromatic polymer of the present invention has a repeating unit comprising an aromatic ring having at least one fluorine group and at least one bond selected from the group consisting of an ether bond, a ketone bond, a sulfone bond, an amide bond, an imide bond, and an ester bond. And a polyimide having a fluorine atom, polyether, polyetherimide, polyether ketone, polyether sulfone, polyamide ether, polyamide, polyether nitrile, polyester and the like.

It is preferable that the fluorinated aromatic polymer of this invention is polyester which has a fluorine atom. The interaction with the inorganic dielectric material is appropriately suppressed, and the phenomenon causing trouble in the preparation of the liquid composition for the composite dielectric, that is, significant thickening, gelation, loss of fluidity, and aggregation are reduced. As a result, it is possible to produce a liquid composition for a composite dielectric containing more inorganic dielectrics, which can exhibit a higher dielectric constant as a composite dielectric and can lower the viscosity, thereby making it easier to form a composite dielectric into a thin film.

As a method for synthesizing the fluorinated aromatic polymer of the present invention, general polymerization reactions such as condensation polymerization, addition polymerization, solution polymerization, suspension polymerization and emulsion polymerization are used.

As the organic solvent used in the synthesis method, a polar solvent such as N-methyl-2-pyrrolidone (NMP), N, N-dimethylacetamide or methanol, or an aromatic solvent such as toluene is selected. Examples of the basic compound to be used are potassium carbonate, lithium carbonate, potassium hydroxide and the like.

In addition, in the synthesis method, a fluorinated aromatic polymer is obtained by removing a solvent from a reaction solution after completion | finish of reaction and washing a distillate as needed. The reaction solution may also be obtained by adding a reaction solution in a solvent having low solubility of the fluorinated aromatic polymer to precipitate the polymer and separating the precipitate by filtration.

The inorganic dielectric of the present invention may be formed in the shape of particulate, fibrous, flaky, conical or the like.

The average particle diameter of the inorganic dielectric material is appropriately selected in consideration of the thickness of the composite dielectric formed by using the liquid composition. However, when used as a thin film, the average particle diameter is preferably in the range of 0.01 to 10 μm, but preferably in the range of 0.5 to 3 μm. Do.

The specific surface area per volume of the inorganic dielectric material is preferably in the range of 1 m 2 / g to 10 m 2 / g, but most preferably in the range of 2 m 2 / g to 5 m 2 / g.

A liquid composition for a composite dielectric of the present invention may be blended with a solvent for the purpose of improving moldability and film formation properties and adjusting viscosity. Examples of the solvent include toluene, xylene, nitrobenzene, and benzonitrile. Ketone solvents such as aromatic solvents, acetone, methyl ethyl ketone, cyclohexanone, cyclopentanone, and isobutyl ketone, methanol, ethanol, N-methyl-2-pyrrolidone (NMP), N, N-dimethylacet Amides, acetonitrile and the like can be selected.

The liquid composition for a composite dielectric of the present invention may contain other compounds or subsidiary materials as necessary. Other compounds or subsidiary materials may include polyamide resins, polyamideimide resins, epoxy resins, phenol resins, resins such as fluorine resins, and silica. Inorganic fillers such as alumina, aluminum hydroxide, glass, graphite, silane coupling agents, titanium coupling agents, flame retardants, antioxidants, plasticizers, leveling agents, antistatic agents, dispersants, and the like may be selected.

The shaping | molding method of the composite dielectric which uses the liquid composition for composite dielectrics of this invention is suitably selected according to the shape of the composite dielectric desired.

For example, when using a composite dielectric as a thin layer (thin film), casting a liquid composition on a film, a board | substrate, or a metal foil, dipping coat, spin coat, roll coat, spray coat, bar coat, screen printing, flexographic printing, etc. After apply | coating by a method and forming a coating film, a solvent is dried and a thin layer is formed.

Such composite dielectric applications and functions include bypass capacitors, charging devices, differential devices, termination load devices, filters, antennas, noise cuts, and the like.

In the electric circuit board 1 including the composite dielectric of the present invention as a constituent part, a ground electrode is formed on an insulating substrate, and a thin film of composite dielectric is formed on the ground electrode, and then a wiring layer is formed on the surface or inside of the thin film. It can manufacture by arrange | positioning.

In addition, the composite dielectric of the present invention can be applied to a conductive material such as metal foil, in close contact with the conductive material, or sandwiched with a conductive material for production.

In this case, the circuit board 1 includes a ground electrode formed on an insulating substrate, a thin film of a composite dielectric formed by coating a liquid composition for a composite dielectric on the ground electrode, and a wiring layer formed on or in the thin film. In order to apply the liquid composition for a composite dielectric on the ground electrode, the liquid composition coating apparatus for a composite dielectric for an embedded electronic device of a circuit board according to the present invention,

It is composed of the lower support 10, the upper support 20, the injection unit 30 and the cover unit 40.

Looking at each configuration, as shown in Figure 1, the lower support 10, the base 11, the jig 12, which is disposed in the upper central region of the base 11 and the insulating substrate is seated and supported, the base And two or more posts 13 which are erected at both ends of the upper side of the upper side, and a fixing plate 14 interconnecting the upper ends of the respective posts 13.

As shown in FIG. 1, the upper support 20 is disposed at an upper side of the jig 12 in the lower support 10 and has an upper bracket 21 having a lower opening-type accommodation space 211 therein. And a support plate 22 accommodated in the accommodation space 211 of the upper bracket 21 and supported at both ends of the accommodation space 211.

In this case, the support plate 22 may be fixedly coupled to both ends of the accommodation space 211 by a bolt or the like.

The upper support 20 can be moved up and down by the lifting means 23, the lifting means 23 is the end portion passing through the fixing plate 14, the upper surface of the upper bracket 21 A cylinder body 232 having a lifting piston 231 connected to the cylinder body 232 to be selectively operated by pneumatic or hydraulic pressure and mounted on an upper side of the fixing plate 14 of the lower support 10; The lower end is connected to both ends of the upper surface of the upper bracket 21, the upper end is made of a lifting guide 233 is inserted and supported so as to enter and exit the fixing plate 14 of the lower support (10) up and down. The lifting means 23 is an example and may be variously modified and changed within a range that satisfies the conditions for raising and lowering the upper support 20.

2 to 8, the injection unit 30 is installed on the support plate 22 of the upper support 20, the pressure generating liquid is filled on the upper side and the liquid composition for the composite dielectric on the lower side The liquid composition for the composite dielectric, which is pushed by the pressure due to the expansion of the pressure-generating liquid in the filled state, is composed of a structure in which the insulating substrate is sprayed onto the ground electrode. More specifically, the pressure partition 311 surrounding the side surface The upper housing 31 having a cylindrical shape and having a transmissive lens 312 in the upper side sealing area, the liquid partition wall 321 surrounding the side and the pressure partition 311 is formed extending from the liquid composition for the composite dielectric An injection passage 322 includes an injection nozzle 323 disposed on the lower side, the lower housing 32 connected to or extended with the upper housing 31, and the upper housing 31 and the lower housing. The space is provided between the (32) and the space for filling the liquid for pressure generation on the upper housing 31 side, and the space for filling the liquid composition for the composite dielectric on the lower housing 32 side, the pressure generating liquid is filled The compartment comprises a compartment 33 for transmitting the pressure acting on the space to the space filled with the liquid composition for the composite dielectric.

And the injection unit 30 is formed of an elastic material and provided on the lower side inside the lower housing 32 so that the upper side is in close contact with the lower housing 32, the circular inlet 341 is formed in the upper side, the lower side As the cross section is gradually narrowed from circular to linear, a slit 342 through which the liquid composition for the composite dielectric passes is formed at the lower end thereof so that the liquid composition for the composite dielectric can move only toward the injection nozzle 323. It further comprises a guide check valve (34).

Here, the slit 342 of the non-return valve 34 maintains a closed state while the liquid composition for the composite dielectric is filled in the lower housing 31, and the compartment part is expanded by the expansion of the pressure generating liquid. When 33) transmits the pressure to the side filled with the liquid composition for the composite dielectric, the slit 342 is opened by the pressure and is injected through the injection passage 322, the slit 342 by the restoring force upon release of the pressure transmission Is closed.

Meanwhile, although the light transmitting lens 312 of the upper housing 31 is a convex lens, an example in which the light transmitting lens 312 blocks an upper portion of the pressure barrier 311 is illustrated, but the present invention is not limited thereto. If the light-transmitting lens 312 is planar, concave-type, and the like, it is possible to apply various types, and of course, it is also possible to block the entire image side of the pressure barrier 311 with only the light-transmitting lens 312.

As the pressure generating liquid, general water may be used, and various liquid materials such as polymer sol and gel such as alcohol or polyethylene glycol may be used. In addition, it is preferable to use a degassed liquid as the pressure generating liquid in order to minimize residual bubbles in the generation of bubbles. In addition, when an electrolyte (salt, etc.) is added to the pure water as the pressure generating liquid, the molecules are ionized to reduce the energy required to break down the molecular structure of the liquid, thereby forming bubbles with better efficiency. Do.

The upper housing 31 and the lower housing 32 may be formed integrally, or may be formed to be separated and coupled.

In addition, the injection nozzle 323 may be provided to be detachable to the lower housing (32). When the injection nozzle 323 is provided to be detachable from the lower housing 32, when the injection nozzle 323 is damaged, contaminated or blocked, the injection nozzle without replacing the entire lower housing 32 The replacement of the 323 can be easily solved, which is advantageous in terms of cost.

The lower part of the lower housing 32 including the injection nozzle 323 and the side of the lower housing 32 are provided as long as there is no problem in achieving the functions of the present invention, such as stellite, aluminum alloy, and zirconium-based ceramics. Various materials may be selected, and only a lower portion of the lower housing 32 in which the injection passage 322 is formed may be manufactured of a zirconium-based ceramic material through insert injection.

Among the zirconium-based ceramic materials, zirconium oxide (zirconia) has a low thermal conductivity to prevent deterioration of the liquid composition for the composite dielectric due to heat transfer during laser irradiation, and has high burst toughness and very high resistance to crack propagation. Therefore, the lower housing 32, the injection nozzle 323 or the injection passage 322 and the like may be prevented from being damaged or deformed when the end of the injection passage 322 or the like is injected during the injection of the liquid composition for the composite dielectric. It is preferable to form with zirconium oxide (zirconia) among the ceramic materials.

In addition, the inside of the lower housing 32 or the injection nozzle 323 has a larger horizontal cross-sectional area toward the upper side in a part or the entire section, the inclination of the inner wall is constant for each predetermined section, but the inclination of the inner wall toward the upper direction is small Losing may include multiple sections.

In addition, the inside of the lower housing 32 or the injection nozzle 323 may be provided in a trumpet shape that extends in a curved shape toward the partition portion 33 from the injection passage 322 side in part or the entire section. .

The shape of the lower housing 32 or the injection nozzle 323 may be more concentrated in pushing the liquid composition for the composite dielectric into the injection passage 322 by the pressure transmitted from the partition 33. As a result, the liquid composition for the composite dielectric injected into the injection passage 322 may obtain a larger injection speed.

The partition 33 is provided between the upper housing 31 and the lower housing 32, it may be formed of an elastic material for partitioning the upper housing 31 and the lower housing (32).

In this case, the partition 33 may be made of silicone rubber or the like.

Since the partition 33 may be damaged first due to rapid expansion, the edge 33 and the vicinity of the center 33 may be reinforced by the rapid expansion.

Although the partition 33 is an example of a membrane formed of an elastic material, the present invention is not limited thereto, and the plate-shaped disk is configured to reciprocate up and down. If the pressure can be transferred to the space filled with the liquid composition for the composite dielectric is, of course, various implementations are possible.

As shown in FIG. 3, the non-return valve 34 allows the flow of fluid (liquid, gas, etc.) to flow in only one direction, and the shape of the part or the whole is closed like a duck's beak or a flute spout. It can be formed as.

In addition, the non-return valve 34 may be sprayed to the outside through the injection passage 322, the liquid composition for the composite dielectric filled in the lower housing 32, the outside air to the injection passage 322 By preventing the inflow through, by preventing the outside air and the like mixed with the liquid composition for the composite dielectric filled in the lower housing 32, it is possible to prevent contamination of the liquid composition for the composite dielectric.

At this time, the slit 342 of the non-return valve 34 has a closed linear shape and may be applied in various forms such as a straight line or a curved line or an intersection line.

The injection passage 322 of the lower housing 32 may be formed of a plurality of injection holes, and each injection hole may be formed in a taper shape in which the horizontal cross-sectional area gradually decreases from the upper side to the lower side.

In addition, the inner wall of the injection passage 322 may be formed of a (zirconium-based) ceramic (zirconia) material, it is preferably formed of zirconium oxide (zirconia). As described above, since zirconium oxide has high burst toughness and very high resistance to crack propagation, it is possible to prevent the end of the injection passage 322 from being broken or deformed when the liquid composition for composite dielectric is injected.

In addition, when the injection passage 322 of the liquid composition for a composite dielectric is formed with a diameter of 250 μm or less, even if the liquid composition for the composite dielectric is filled in a space where the liquid composition for the composite dielectric is filled, the pressure for the composite dielectric does not work. The liquid composition does not escape into the injection passage 322.

On the other hand, the injection unit 30 further includes an energy concentrator 35 for concentrating energy toward a specific point of the sealed space filled with the pressure generating liquid,

The energy intensive device 35 is made of a device that can concentrate energy using a microwave, a laser or the like.

That is, the energy concentrator 35 concentrates energy such as a laser in the pressure generating liquid (the liquid composition for the composite dielectric by instantaneous volume expansion (increase in pressure) and shock waves due to evaporation of the pressure generating liquid). It is pushed to the injection passage (322).

Meanwhile, the lower housing 32 penetrates through the liquid partition wall 321 to form a supplementary port 325 in which a supply passage of a liquid composition for a composite dielectric is formed, and is connected to the lower housing through the supplementary port 325. 32) The supply unit 326 for supplying a liquid composition for the composite dielectric in the side space may be further provided.

As a result, the supply unit 326 may replenish the liquid composition for the composite dielectric at a predetermined pressure at which the liquid composition for the composite dielectric does not escape the injection passage 322. This is to fill the liquid composition for the composite dielectric without additional control.

That is, if there is no liquid composition for the composite dielectric in the space to fill the liquid composition for the composite dielectric, the liquid composition for the composite dielectric is filled, but if the liquid composition for the composite dielectric in the space for filling the liquid composition for the composite dielectric liquid composition for the composite dielectric It may fill the liquid composition for the composite dielectric at a level that can not be pushed to the injection passage (322).

As shown in FIGS. 2 to 6, the cover unit 40 descends together with the injection unit 30 when the upper support 20 descends, and the liquid composition for the composite dielectric is injected by the injection unit 30. When the insulating substrate is to be cut off from the outside, the chamber 41 is connected to both sides of the liquid partition wall 321 of the lower housing 32, is formed in the chamber 41 is filled with the liquid composition for the composite dielectric Is in communication with the space and the lower opening (開口) the inner space 42, the rod 43 is arranged to slide up and down in the inner space 42, coupled to the end of the rod 43, the upper and side Spaced in the interconnection area between the cylindrical cover member 44, the lower opening and the liquid composition for the composite dielectric, and the inner space portion 42, which are blocked and partitioned and filled with the pressure generating liquid. Action When the pressure is delivered to the sub-compartment portion 45, and the pressure transmitted to the sub-compartment portion 45 through the liquid composition for the composite dielectric to be released to the rod 43 And return means 46 for returning to the original position.

Here, as shown in FIG. 2, the chamber 41 may be integrally connected to the lower housing 32 or manufactured separately and then coupled and separated, and on opposite sides of the liquid partition wall 321 facing each other. A pair is provided to be connected.

In addition, the space area in which the rod 43 is disposed in the inner space portion 42 is preferably a cylindrical space structure, and thus, the rod 43 is also preferably a cylindrical three-dimensional structure.

In addition, the sub-compartment part 45 may be formed of an elastic material similarly to the above-described partition part 33, and may be made of, for example, silicone rubber. In addition, since the edge and the vicinity of the center may be damaged first due to rapid expansion, the sub-compartment 45 may preferably reinforce the edge and the vicinity of the center due to the rapid expansion.

And, as shown in Figure 5, the return means 46 is a stepped space portion 461 formed in the recessed portion along the outer periphery of the rod 43, and in the inner periphery of the inner space portion 42 A stopper 462 protruding with a narrow upper and lower width in an area corresponding to the stepped space part 461 and disposed in the stepped space part 461, an upper surface of the stepped space part 461, and the stopper 462. It consists of a return spring 463 interposed between the upper end of (). As a result, when the return spring 463 is compressed and the pressure transmission to the inner space 42 is released when the rod 43 descends, the rod 43 returns to its original position by the restoring force of the return spring 463. .

Therefore, as shown in FIG. 6, the cover unit 40 descends together with the injection unit 30 when the upper support 20 descends, and the partition 33 is deformed by the expansion of the pressure generating liquid. In this case, the sub-compartment part 45 is also deformed by the liquid composition for the composite dielectric under pressure, and the rod 43 is lowered by the pressure transmitted to the air filled in the inner space part 42. After the cover member 44 connected to the rod 43 covers and seals the insulating substrate, the liquid composition for the composite dielectric is injected by the injection unit 30 to the ground electrode side of the insulating substrate.

As shown in FIG. 6, the cover unit 40 is disposed in the inner space 42 and guides 47 to guide the pressure transmitted to the sub-compartment 45 to be concentrated on the top of the rod 43. ),

The guide 47 has the inner space 42 so that the sealed air filled in the inner space 42 is concentrated toward the end of the rod 43 by the pressure transmitted from the sub-compartment 45. It is arranged in the corner region where the redirection is made, and has an arcuate surface structure which is recessed inward.

As shown in FIGS. 7 and 8, the cover unit 40 advances and retracts the guide 47 from the inner space 42 to the sub-compartment 45 to the inner space 42. Displacement means 48 for transmitting the pressure to the rod 43 to adjust the position of the up and down further,

The displacement means 48 penetrates through the chamber 41 and has an end portion connected to the guide 47, and a part of the advancing piston 481 is selectively embedded by pneumatic or hydraulic pressure. It consists of a cylinder body 482 of pneumatic or hydraulic pressure to operate the forward and backward piston 481.

As a result, as shown in FIG. 8, when the retreating piston 481 operated by the cylinder body 482 of the displacement means 48 moves forward, the guide 47 also moves forward while pressure is applied to the inner space 42. And the rod 43 is lowered by the pressure transmitted to the sub-compartment 45 in a state where the position of the rod 43 is moved to the lower side and displaced from the initial position. The lowering position of the rod 43 and the cover member 44 connected thereto may be adjusted.

In the above description of the present invention, the liquid crystal coating apparatus for a composite dielectric for an embedded electronic device having a specific shape and structure has been described with reference to the accompanying drawings, but the present invention has been modified and modified by those skilled in the art. Modifications are possible and such modifications and variations should be construed as falling within the protection scope of the present invention.

1: circuit board
10: lower support
11: base
12: jig
13: post
14: fixed plate
20: upper support
21: upper bracket
211: accommodation space
22: Support Plate
23: lifting means
231: lifting piston
232: cylinder body
233: lifting guide
30: injection unit
31: upper housing
311: pressure partition
312 floodlight lens
32: lower housing
321: liquid bulkhead
322: injection passage
323: injection nozzle
325: supplement
326: supply unit
33: compartment
34: check valve
341: entrance
342 slit
35: energy intensive device
40: cover unit
41: chamber
42: interior space
43: loading
44: cover member
45: sub compartment
46: return means
461: step space
462: Stopper
463: return spring
47: Guide
48: displacement means
481: Jindo Piston
482: cylinder body

Claims (4)

In the circuit board (1) consisting of a ground electrode formed on an insulating substrate, a thin film of a composite dielectric formed by applying a liquid composition for a composite dielectric on the ground electrode, and a wiring layer formed on or in the thin film; In order to apply the liquid composition for the composite dielectric on the ground electrode,
A lower support 10 on which the insulating substrate is seated;
An upper support 20 which is disposed on an upper side of the lower support 10 and descends;
The insulating composition is installed on the upper support 20, the liquid composition for the composite dielectric is pushed by the pressure due to the expansion of the pressure-generating liquid in the state that the pressure generating liquid is filled on the upper side and the liquid composition for the composite dielectric on the lower side is the insulation An injection unit 30 having a structure sprayed on the ground electrode from the substrate; And
A cover unit 40 which lowers together with the injection unit 30 when the upper support 20 descends and blocks the insulating substrate from the outside when the liquid composition for composite dielectric is injected by the injection unit 30; Done,
The injection unit 30,
An upper housing 31 having a cylindrical shape by a pressure partition 311 surrounding the side and having a light transmitting lens 312 in the upper side sealing region;
A liquid crystal partition 321 surrounding the side and the pressure partition 311 is formed extending from the injection passage 322 of the liquid composition for the composite dielectric is disposed on the lower side, the upper housing 31 A lower housing 32 connected to or extending from each other)
The space between the upper housing 31 and the lower housing 32 is filled with the liquid for pressure generation on the upper housing 31 side, and the space where the liquid composition for the composite dielectric on the lower housing 32 side is filled. Compartment, but for the composite dielectric for the embedded electronic device of the circuit board, characterized in that consisting of a partition portion 33 for transmitting the pressure acting on the space filled with the liquid for pressure generation to the space filled with the liquid composition for the composite dielectric Liquid composition coating device.
delete The method of claim 1,
The cover unit 40 is
A chamber 41 connected to both sides of the liquid partition wall 321 of the lower housing 32;
An internal space portion 42 formed in the chamber 41 and communicating downwardly with the space in which the liquid composition for the composite dielectric is filled, and having a lower opening;
A rod 43 disposed to be slid up and down in the internal space 42;
A cylindrical cover member 44 which is coupled to an end of the rod 43 and has a top and a side blocked and opened downward;
The internal space is placed in the interconnection area between the space where the liquid composition for the composite dielectric is filled and the space between the inner space part 42 and acts on the space where the liquid for pressure generation is filled. A sub compartment 45 to be delivered to the unit 42,
Liquid composition coating for a composite dielectric for an embedded electronic device of a circuit board, characterized in that consisting of a return means 46 for returning the rod 43 to its original position when the pressure transmitted to the sub-compartment 45 is released. Device.
The method according to any one of claims 1 to 3,
The composite dielectric contains an inorganic dielectric and a fluorinated aromatic polymer,
The fluorinated aromatic polymer is a circuit board comprising at least one polymer selected from polyimide, polyether, polyetherimide, polyether ketone, polyether sulfone, polyamide ether, polyamide, polyethernitrile and polyester. Liquid composition coating apparatus for a composite dielectric for an embedded electronic device.

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