KR102069800B1 - Chip for microfluidic device, microfluidic device using the same and method for manufacturing microfluidic device and microfluidic device using the same - Google Patents

Abstract

The microfluidic device chip according to an embodiment of the present invention includes a housing part which includes a microfluidic device for flowing a small amount of fluid in a predetermined direction, the housing part providing an arrangement space having a predetermined space therein. A microfluidic device chip having at least a portion thereof disposed in a space, the chip comprising: a main body portion disposed in the placement space to form a flow path that is a passage through which the fluid flows together with the housing portion; A conductive part connected to the main body part and configured to flow a current through the fluid so that the fluid is electrolyzed to generate gas; And an insulating part covering at least a part of the conductive part so that at least a part of the conductive part is insulated from the fluid.

Description

Chips for microfluidic devices, microfluidic devices and microfluidic devices using the same, and methods for manufacturing microfluidic devices using the same {CHIP FOR MICROFLUIDIC DEVICE

The present invention relates to a microfluidic device for flowing a small amount of fluid in a predetermined direction, a chip for a microfluidic device disposed in the microfluidic device, and a method for manufacturing the microfluidic device and the chip for the microfluidic device.

Recently, the interest and development of microfluidic system is increasing internationally. Such microfluidic systems are actively used in the fields of clinical diagnosis, biological research such as DNA or peptides, chemical analysis for drug development, inkjet printing, small cooling systems, and small fuel cells. Here, the microfluidic device is the most important configuration in the microfluidic system because it enables the flow of the fluid.

Conventional microfluidic devices have utilized pneumatic pumps for the flow of fluids. However, the pneumatic pump has a problem that it is unsuitable for the microfluidic system because of its large volume and power consumption. To solve this, electrolysis pumps have been developed. The electrolysis pump generated a flow of fluid by pressurization of hydrogen and oxygen gas generated by electrolysis.

However, in the conventional electrolysis pump, due to oxidation by an electrolyte, an electrode for flowing a current into a fluid has been oxidized, which causes a short problem of use.

SUMMARY OF THE INVENTION In order to solve the above problems, an object of the present invention is to provide a chip for a microfluidic device, a microfluidic device and a microfluidic device chip using the same, and a method of manufacturing the microfluidic device using the same.

However, the problem to be solved by the present invention is not limited to the above-described problem, and the problems not mentioned may be clearly understood by those skilled in the art from the present specification and the accompanying drawings. There will be.

The microfluidic device chip according to an embodiment of the present invention includes a housing part which includes a microfluidic device for flowing a small amount of fluid in a predetermined direction, the housing part providing an arrangement space having a predetermined space therein. A microfluidic device chip having at least a portion thereof disposed in a space, the chip comprising: a main body portion disposed in the placement space to form a flow path that is a passage through which the fluid flows together with the housing portion; A conductive part connected to the main body part and configured to flow a current through the fluid so that the fluid is electrolyzed to generate gas; And an insulating part covering at least a part of the conductive part so that at least a part of the conductive part is insulated from the fluid.

In addition, the conductive portion is electrically connected to the power supply unit for supplying power to the power applying unit is applied power, the electrolysis electrode unit for flowing a current in the fluid so that the fluid is electrolyzed to generate gas and the A connecting portion connecting the power supply portion and the electrolysis electrode portion to each other so that the power supply portion and the electrolysis electrode portion are electrically connected to each other, and the insulation portion covers at least a portion of the connection portion so that at least a portion of the connection portion is insulated from the fluid. can do.

In addition, the insulation portion is a space that is adjacent to the electrolysis electrode portion and the space in which the fluid can be accommodated so as to cover at least a portion of the connecting portion and the fluid easily receives current from the electrolysis electrode portion. Can be provided.

The insulator may be adjacent to the power applying unit and cover the at least a portion of the connection unit and prevent the power supply unit from being separated from the power supply unit while the power supply unit is connected to the power supply unit. It is possible to provide a seating space that is a space that can be seated.

The insulation part may cover one surface of the main body part.

A microfluidic device according to an embodiment of the present invention includes a microfluidic device for flowing a small amount of fluid in a predetermined direction, the microfluidic device comprising: a housing part configured to provide an arrangement space having a predetermined space therein; And a microfluidic device chip at least partially disposed in the placement space, wherein the microfluidic device chip is disposed in the placement space to form a flow path that is a passage through which the fluid flows together with the housing part. A main body portion, connected to the main body portion, and covering at least a portion of the conductive portion so as to insulate the fluid from the fluid and the conductive portion for flowing a current to the fluid so that the fluid is electrolyzed to generate gas It can be provided with an insulating part.

In addition, the conductive portion is electrically connected to the power supply unit for supplying power to the power applying unit is applied power, the electrolysis electrode unit for flowing a current in the fluid so that the fluid is electrolyzed to generate gas and the A connecting portion connecting the power supply portion and the electrolysis electrode portion to each other so that the power supply portion and the electrolysis electrode portion are electrically connected to each other, and the insulation portion covers at least a portion of the connection portion so that at least a portion of the connection portion is insulated from the fluid. can do.

The microfluidic device chip may include at least a portion of the microfluidic device chip disposed in the placement space such that the power supply unit is located outside the housing unit so that the power supply unit is easily connected to the power supply unit. It can be placed outside.

The microfluidic device may further include a power consumption part consuming power, wherein the conductive part further includes a power consumption electrode part electrically connected to the power consumption part, and the connection part is connected to the power supply part. In order to electrically connect the power dissipation electrode unit, the power supply unit and the power dissipation electrode unit are connected to each other, and the power dissipation unit is electrically connected to the power dissipation electrode unit in a first position, It may be electrically separated from the power consumption electrode.

Chip manufacturing method for a microfluidic device according to an embodiment of the present invention to produce a chip for a microfluidic device including a microfluidic device for flowing a small amount of fluid in a predetermined direction, in a chip manufacturing method for a microfluidic device A main body portion providing step is provided; A conductive portion forming step of forming a conductive portion on the main body portion for flowing a current to the fluid so that the fluid is electrolyzed on the main body portion to generate gas; And an insulating part forming step of forming the insulating part so that at least a part of the conductive part is covered by the insulating part so that at least a part of the conductive part is insulated from the fluid.

In addition, the conductive portion is electrically connected to the power supply unit for supplying power to the power applying unit is applied power, the electrolysis electrode unit for flowing a current in the fluid so that the fluid is electrolyzed to generate gas and the A connecting portion connecting the power supply portion and the electrolysis electrode portion to each other so that the power supply portion and the electrolysis electrode portion are electrically connected to each other, and the forming of the insulation portion includes: insulating the at least a portion of the connection portion to be covered by the insulation portion; An addition can be formed.

The forming of the insulating part may include: applying a first material to the conductive material formed on the main body part; applying a first material; and a preliminary insulating part on which the first material is cured to form a preliminary insulating part on the conductive part. Forming the preliminary insulation portion so that at least a portion of the preliminary insulation portion is chemically changed; irradiating the preliminary insulation portion at least a portion of the preliminary insulation portion exposed to light; And a preliminary insulating part developing step of forming the insulating part.

The forming of the insulating part may include forming a preliminary insulating part in which a preliminary insulating part is formed to cover the conductive part formed on the main body part, and at least one of the power applying part and the electrolytic electrode part being formed from the preliminary insulating part. The preliminary insulating part may be provided to process the preliminary insulating part so that the insulating part is formed so as not to be covered.

In the forming of the preliminary insulating portion, the preliminary insulating portion may be formed to cover one surface of the main body portion to which the conductive portion is connected and the conductive portion.

In a method of manufacturing a microfluidic device according to an embodiment of the present invention, a method of manufacturing a microfluidic device for manufacturing a microfluidic device for flowing a small amount of fluid in a predetermined direction, wherein the microfluidic device is provided with a predetermined space therein Providing a housing part in which a housing part is provided; And providing a chip for the microfluidic device, in which the chip for the microfluidic device is provided. And a chip disposing step for the microfluidic device, in which at least a part of the microfluidic device chip is disposed in the placement space, wherein the chip providing step for the microfluidic device is disposed in the placement space together with the housing part. Providing a body portion providing a body portion forming a flow path that is a passage through which the fluid flows, the conductive portion is formed on the body portion for conducting a current to the fluid so that the fluid is electrolyzed to generate gas And an insulating part forming step in which the insulating part is formed so that at least a part of the conductive part is covered by the insulating part so that at least part of the conductive part and the conductive part are insulated from the fluid.

The microfluidic device chip disposing step may include a chip of the microfluidic device such that a portion of the microfluidic device chip is disposed in the placement space and a portion of the microfluidic device chip is disposed outside the housing part. Can be placed.

According to the microfluidic device chip of the present invention, the microfluidic device and the microfluidic device chip using the same, and the manufacturing method of the microfluidic device using the same, the service life can be extended.

In addition, it is possible to increase the flow rate of the fluid flowing.

In addition, manufacturing cost can be saved.

In addition, the production efficiency can be increased.

However, the effects of the present invention are not limited to the above-described effects, and effects that are not mentioned will be clearly understood by those skilled in the art from the present specification and the accompanying drawings.

1 is an overall perspective view of a microfluidic device according to an embodiment of the present invention;
2 is an exploded perspective view of a microfluidic device according to an embodiment of the present invention;
3 is a view for explaining the upper housing portion provided in the microfluidic device according to an embodiment of the present invention;
4 is a cross-sectional view taken along line X-X 'of FIG.
5 is a perspective view of a microfluidic device chip provided in the microfluidic device according to an embodiment of the present invention;
6 is a view for explaining a process of manufacturing the conductive portion of the chip for the microfluidic device of FIG.
7 is a view for explaining a process of manufacturing the insulating portion of the chip for the microfluidic device of FIG.
8 is a perspective view of a microfluidic device chip provided in the microfluidic device according to another embodiment of the present invention.
9 is a view for explaining a process of forming the conductive portion of the chip for the microfluidic device of FIG.
FIG. 10 is a view for explaining a process of forming an insulating part of the chip for the microfluidic device of FIG. 8; FIG.
11 is a perspective view of a microfluidic device chip provided in the microfluidic device according to another embodiment of the present invention.

Hereinafter, with reference to the drawings will be described in detail a specific embodiment of the present invention. However, the spirit of the present invention is not limited to the embodiments presented, and those skilled in the art who understand the spirit of the present invention may further degenerate other inventions or the present invention by adding, changing, or deleting other elements within the scope of the same idea. Other embodiments that fall within the scope of the inventive concept may be easily proposed, but they will also be included within the scope of the inventive concept.

In addition, the components with the same functions within the scope of the same idea shown in the drawings of each embodiment will be described using the same reference numerals.

In the present specification, when it is determined that a detailed description of a known configuration or function related to the present invention may obscure the gist of the present invention, a detailed description thereof will be omitted.

1 is an overall perspective view of a microfluidic device according to an embodiment of the present invention, Figure 2 is an exploded perspective view of the microfluidic device according to an embodiment of the present invention.

Referring to FIG. 1, the microfluidic device 100 according to an embodiment of the present invention is a microfluidic device 100 for flowing a small amount of fluid in a predetermined direction, and has a predetermined space therein. 4, the housing 110 for providing a microfluidic device chip 120 having at least a portion of the housing space 110 disposed in the placement space S10.

Here, the predetermined direction may mean a direction in which the user wants to flow the fluid.

Here, the fluid may be an electrolyte solution.

In addition, the fluid may be a mixed solution of an electrolyte solution and a sample to be tested.

However, the present invention is not limited thereto, and the fluid may be a concept including all fluids and mixtures thereof.

Referring to FIG. 2, the housing part 110 is an upper housing part 111 and the microfluidic device disposed on an upper surface of the microfluidic device chip 120 based on the microfluidic device chip 120. The lower housing part 112 may be provided on the lower surface of the microfluidic device chip 120 based on the chip 120.

The microfluidic device chip 120 may be disposed between the upper housing part 111 and the lower housing part 112.

The lower housing part 112 may be connected to and / or coupled to the lower surface of the upper housing part 111.

To this end, a plurality of fastening holes h10 may be formed in the lower housing part 112.

After the lower housing part 112 and the upper housing part 111 are connected to each other, a fastening means in the fastening hole h10 of the upper housing part 111 and the fastening hole h10 of the lower housing part 112. In this case, the lower housing part 112 and the upper housing part 111 may be coupled to each other.

The lower housing part 112 may be combined with the upper housing part 111 to form the layout space S10 (see FIG. 4).

3 is a view for explaining the upper housing portion provided in the microfluidic device according to an embodiment of the present invention.

Specifically, Figure 3 (a) is a perspective view in the lower direction of the upper housing portion, Figure 3 (b) is a cross-sectional view taken along line X-X 'in Figure 3 (a).

The upper housing part 111 includes a disposition part 111a on which the microfluidic device chip 120 (see FIG. 2) is disposed, a first inflow part 111b through which the fluid is introduced, and a second inflow through which the fluid is introduced. A part 111c, a discharge part 111d through which the fluid is discharged, a space connected with the first inlet part 111b and the second inlet part 111c, and in which the fluid can flow after the fluid is received. It may be provided with a flow path portion 111e for providing a passage portion 111f connected to the flow path portion 111e and the discharge portion 111d.

In addition, the upper housing part 111 may further include a seating part 111g formed to be recessed from a lower surface of the upper housing part 111 so that a power source to be described later may be easily seated.

In addition, the upper housing part 111 may be formed with a plurality of fastening holes h10 for inserting fastening means for fastening the upper housing part 111 and the lower housing part 112.

The disposition part 111a may be formed by recessing a portion of the lower surface of the upper housing part 111.

The placement unit 111a may include the microfluidic device chip 120.

In detail, the placement unit 111a may include an arrangement space in which the microfluidic device chip 120 may be disposed when the upper housing unit 111 and the lower housing unit 112 are coupled to each other. S10) may be provided.

The placement unit 111a may be formed in the same shape as a cross section of the chip 120 for the microfluidic device.

For example, if the microfluidic device chip 120 is a rectangular cross section, the placement unit 111a may also be formed in a rectangular shape.

The disposition portion 111a is the upper housing portion 111 in order to easily detach the chip 120 for the microfluidic device while the upper housing portion 111 and the lower housing portion 112 are coupled to each other. It may be formed by opening in one direction of the).

For example, the placement portion 111a may be formed by opening the mounting portion 111g in a direction in which the seating portion 111g is formed.

The flow path portion 111e may be formed by being recessed from one surface of the placement portion 111a.

For example, the flow path part 111e may be formed by being recessed from one surface of the placement part 111a to the stop part of the upper housing part 111.

The fluid may be accommodated in the flow path part 111e.

Specifically, in the flow path part 111e, the upper housing part 111 and the lower housing part 112 are coupled to each other, and the microfluidic device chip 120 is disposed in the placement space S10. In this case, a space for accommodating the fluid may be provided together with one surface of the chip 120 for the microfluidic device.

The flow path part 111e may be connected to the first inflow part 111b, the second inflow part 111c, and the passage part 111f.

The first inlet 111b may be formed by penetrating the upper housing 111 from the upper surface of the upper housing 111 to the flow path 111e.

The fluid may flow into the first inlet 111b.

Although not shown, a first inlet control valve may be disposed in the first inlet 111b.

The first inlet control valve may control whether the fluid flows through the first inlet 111b.

The second inlet part 111c may be formed by penetrating the upper housing part 111 from an upper surface of the upper housing part 111 to the flow path part 111e.

The first inlet 111b may be connected to one end of the flow path 111e, and the second inlet 111c may be connected to the other end of the flow path 111e.

As a specific example, the second inflow portion 111c may be connected to the flow passage portion 111e in the direction of a portion where the flow passage portion 111e and the passage portion 111f are connected.

The fluid may flow into the second inlet 111c.

Although not shown, a second inlet control valve may be disposed in the second inlet 111c.

The second inflow control valve may control whether the fluid flows through the second inflow portion 111c.

The discharge part 111d may be formed through the upper housing part 111 from the upper surface of the upper housing part 111 to the passage part 111f.

The fluid may be discharged from the discharge part 111d.

Although not shown, a discharge control valve may be disposed in the discharge part 111d.

The discharge control valve may control whether the fluid flows through the discharge part 111d.

The passage part 111f may be formed by being recessed from one surface of the placement part 111a.

The extent to which the passage portion 111f is recessed from one surface of the placement portion 111a may be smaller than the extent to which the flow passage portion 111e is recessed from one surface of the placement portion 111a.

Thus, the fluid can be easily flowed into the passage portion 111f through the flow passage portion 111e.

The passage part 111f may be connected to the discharge part 111d and the flow path part 111e.

The seating part 111g may be formed by recessing a part of the lower surface of the upper housing part 111.

The mounting portion 111g may be recessed from the lower surface of the upper housing portion 111 to be larger than the recessing portion 111a from the lower surface of the upper housing portion 111.

For example, the seating portion 111g and the back portion may be connected to each other.

When the upper housing part 111 and the lower housing part 112 are coupled to each other, the seating part 111g may provide an insertion space S20 (see FIG. 4) in which the power source part may be disposed.

In addition, when the upper housing part 111 and the lower housing part 112 are coupled to each other, the microfluidic device chip 120 is inserted through the insertion space S20 provided by the seating part 111g. It may be inserted into the arrangement space (S10).

In addition, when the upper housing part 111 and the lower housing part 112 are coupled to each other, a part of the microfluidic device chip 120 may be disposed in the insertion space S20.

For example, the microfluidic device chip 120 may include the power applying unit 122a so as to be easily connected to a power applying unit 122a (see FIG. 5) by a power supply unit (not shown). At least a part may be disposed in the layout space S10 and a part of the remaining part may be disposed outside the housing part 110 so as to be positioned outside of the housing part 110.

Hereinafter, the operation method of the microfluidic device 100 will be described in detail.

4 is a cross-sectional view taken along line X-X 'of FIG.

Referring to FIG. 4, the microfluidic device chip 120 through the insertion space S20 of the seating portion 111g in a state where the upper housing portion 111 and the lower housing portion 112 are coupled to each other. ) May be inserted into the arrangement space S10.

Thereafter, the fluid may be introduced through the first inlet 111b and the second inlet 111c.

To this end, the first inlet 111b and the second inlet 111c may be open.

However, the discharge part 111d may be closed.

For this reason, the fluid may be accommodated only in the flow portion, and may not flow to the discharge portion 111d.

When power is applied to the microfluidic device 100, the fluid current may flow.

Electrolysis may occur in the fluid, which may result in gas evolution.

By pressurization of the gas generated in the electrolysis, the fluid accommodated in the flow path part 111e may flow to the discharge part 111d through the passage part 111f.

In this case, the first inlet 111b and the second inlet 111c may be closed.

However, the discharge portion 111d may be open for discharging the fluid.

The first inflow regulating valve, the second inflow regulating valve, and the first inlet 111b, the second inlet 111c, and the outlet 111d to control whether the first inlet is closed or closed. The discharge control valve can be controlled.

Hereinafter, the technical features and the manufacturing method of the microfluidic device chip 120 will be described in detail.

5 is a perspective view of a microfluidic device chip provided in the microfluidic device according to an embodiment of the present invention.

Referring to FIG. 5, the chip 120 for a microfluidic device according to an embodiment of the present invention includes a housing part 110 included in the microfluidic device 100 (see FIG. 1) for flowing a small amount of fluid in a predetermined direction. (See FIG. 1)-the housing part 110 provides a layout space S10 (see FIG. 4) which is a predetermined space therein. 120, the main body 121 and a main body 121 that are formed in the placement space S10 to form a flow path, which is a passage through which the fluid flows together with the housing part 110, are connected to the main body 121. At least a portion of the conductive portion 122 may be insulated from the fluid so that at least a portion of the conductive portion 122 and the conductive portion 122 which flow a current through the fluid may be electrolyzed to generate a gas. It may include an insulating portion 123 to cover.

The body part 121 may provide an area to which the conductive part 122 and the insulating part 123 may be connected.

When the main body 121 is disposed inside the housing 110, the main body 121 may be configured to leak the fluid received or flowed into the flow path 111e from the housing 110. Can be effectively prevented.

For example, the body portion 121 may be made of glass, fiberglass-reinforced epoxy laminate material (FR-4) or polymethylmethacrylate (PMMA).

However, the material of the main body 121 is not limited thereto and may be variously modified at a level apparent to those skilled in the art.

The conductive part 122 may be made of a conductive material through which current can flow.

For example, the conductive portion 122 may be made of a material such as gold or copper.

However, the material of the conductive portion 122 is not limited thereto and may be variously modified at a level apparent to those skilled in the art.

The conductive part 122 may protrude from one surface of the main body part 121.

The conductive portion 122 is electrically connected to a power supply unit for supplying power to the power applying unit 122a to which power is applied, and electrolysis for flowing a current through the fluid so that the fluid is electrolyzed to generate gas. An electrode part 122b and a connection part 122c may be provided to connect the power supply part and the electrolysis electrode part 122b to each other so that the power supply part and the electrolysis electrode part 122b are electrically connected to each other.

The power applying unit 122a may be connected to the power supply unit.

Power applied from the power supply unit may flow to the connection unit 122c and the electrolysis electrode unit 122b through the power supply unit.

For example, the power applying unit 122a may include a first power applying unit 122a-1 connected to the (+) pole of the power supply unit and a second power applying unit 122a− connected to the (−) pole of the power supply unit. 2) can be provided.

Here, the first power applying unit 122a-1 and the second power applying unit 122a-2 may be spaced apart from each other in position.

However, the present invention is not limited thereto, and the number of the power applying units 122a may be variously modified at a level apparent to those skilled in the art.

The connection part 122c may be connected to the power applying unit 122a.

The connection part 122c may transfer power transferred from the power applying unit 122a to the electrolysis electrode part 122b.

For example, the connection part 122c may include a first connection part 122c-1 connected to the first power applicator 122a-1 and a second connection part connected to the second power applicator 122a-2. 122c-2) can be provided.

Here, one end of the first connection portion 122c-1 may be connected to the first electrolysis electrode portion 122b-1 to be described later, and the other end of the first connection portion 122c-1 may be applied with the first power. It may be connected to the unit 122a-1.

In addition, one end of the second connection portion 122c-2 may be connected to the second electrolysis electrode portion 122b-2, which will be described later, and the other end of the second connection portion 122c-2 is the second power. It may be connected to the unit 122a-2.

Here, the first connecting portion 122c-1 and the second connecting portion 122c-2 may be spaced apart from each other in position.

However, the present invention is not limited thereto, and the number of the connection parts 122c may be variously modified at a level apparent to those skilled in the art.

The electrolysis electrode part 122b may be connected to the connection part 122c.

The electrolysis electrode part 122b may receive power from the connection part 122c.

For example, the electrolysis electrode part 122b is connected to the first electrolysis electrode part 122b-1 and the second connection part 122c-2 connected to the first connection part 122c-1. The electrolysis electrode part 122b-2 may be provided.

Here, the first electrolysis electrode part 122b-1 and the second electrolysis electrode part 122b-2 may be spaced apart from each other in position.

The first electrolysis electrode part 122b-1 includes a plurality of rods, and the second connection part 122c-from the first connection part 122c-1 from one end of the first connection part 122c-1. It may be formed extending in the 2) direction.

In addition, the second electrolysis electrode part 122b-2 may also include a plurality of rods, so that the first connection part is formed at the second connection part 122c-2 from one end of the second connection part 122c-2. 122c-1) may extend in the direction.

Here, the plurality of rods of the first electrolysis electrode portion 122b-1 and the plurality of rods of the second electrolysis electrode portion 122b-2 may cross each other.

However, the first electrolysis electrode part 122b-1 and the second electrolysis electrode part 122b-2 may be spaced apart from each other without being connected to each other.

For example, the first electrolysis electrode part 122b-1 may be charged to the positive electrode, and the second electrolysis electrode part 122b-2 may be charged to the negative electrode.

When charge is transferred to the electrolysis electrode part 122b, charge may be transferred from the electrolysis electrode part 122b to the fluid accommodated in the flow path part 111e.

As a result, the fluid may be electrolyzed to generate gas.

The power applying unit 122a, the electrolysis electrode unit 122b, and the connection unit 122c may be manufactured at the same time.

Detailed description of the manufacturing method thereof will be described later.

The insulation unit 123 may be made of an insulating material in which electricity does not flow.

For example, the insulation part 123 may be made of SU-8 or a shoulder resist.

However, the material of the insulation unit 123 is not limited thereto and may be variously modified at a level apparent to those skilled in the art.

The insulation part 123 may cover at least a part of the connection part 122c such that at least a part of the connection part 122c is insulated from the fluid.

For example, the insulation part 123 may cover the entirety of the connection part 122c.

However, the present invention is not limited thereto, and the insulation part 123 may cover only a part of the connection part 122c.

Here, the meaning that the insulation portion 123 covers the connection portion 122c may mean that the insulation portion 123 is formed on the upper surface of the connection portion 122c.

Alternatively, the insulator 123 covers the connection part 122c, and the insulator part 123 of the connection part 122c protruding from the upper surface of the connection part 122c and the main body part 121. It may mean that it is formed on the side.

For example, the insulation part 123 may cover only the connection part 122c, and may not cover the upper surface of the main body part 121, the power applying part 122a, and the electrolysis electrode part 122b. Can be.

However, the present invention is not limited thereto, and the part covered by the insulating part 123 may be variously modified at a level apparent to those skilled in the art.

For example, the insulating part 123 may cover the top surface of the main body part 121.

As the insulating part 123 covers the connection part 122c, the connection part 122c may be effectively prevented from being oxidized in the above-described electrolysis process.

For this reason, due to the disconnection of the connection portion 122c, it is possible to effectively prevent the power is not delivered to the electrolysis electrode portion 122b.

Therefore, the life of the microfluidic device chip 120 can be effectively increased.

According to a method of manufacturing a microfluidic device chip according to an embodiment of the present invention, a microfluidic device 100 for manufacturing a microfluidic device 100 including a microfluidic device 100 for flowing a small amount of fluid in a predetermined direction is provided. In the method of manufacturing a chip 120 for a microfluidic device, the main body portion providing step of providing a main body portion 121, the fluid so that the fluid is electrolyzed on the main body portion 121 to generate a gas, In the conductive portion forming step of forming a conductive portion 122 for flowing a current to the body portion 121 and at least a portion of the conductive portion 122 is insulated from the fluid, the conductive portion 122 of the conductive portion 122 It may include an insulating part forming step in which the insulating part 123 is formed so that at least part thereof is covered by the insulating part 123.

Hereinafter, the manufacturing method of the electroconductive part of the microfluidic device chip | tip, and the insulating part of the microfluidic device chip | tip which concerns on one Example of this invention is explained in full detail.

FIG. 6 is a view for explaining a process of manufacturing a conductive part of the chip for the microfluidic device of FIG. 5.

Specifically, FIG. 6 is a view for explaining a process of manufacturing a conductive part of the chip for the microfluidic device based on the cross-sectional portion of X-X 'of FIG. 5.

Referring to FIG. 6, in the forming of the conductive portion of the chip for the microfluidic device according to the embodiment of the present invention, the intermediate layer forming step in which the intermediate layer L10 is formed on the main body portion 121 may be performed. A conductive layer forming step in which the conductive layer L20 is fixed to the main body portion 121 by the medium of the intermediate layer L10, and the photoresist R10 chemically changed by light is the conductive layer L20. Attaching a photoresist attached to one surface of the photoresist; irradiating at least a portion of the photoresist R10 to light so that at least a portion of the photoresist R10 is chemically changed; The conductive layer may include a conductive part removing step such that the intermediate layer L10, the conductive layer L20, and the photoresist R10 are removed.

Hereinafter, each step will be described in detail.

Referring to FIG. 6A, the main body 121 may be provided.

Here, the body portion 121 may be provided is cut to the size of the chip for the microfluidic device.

However, the present invention is not limited thereto, and the main body 121 may be provided in a size in which a plurality of chips for the microfluidic device may be manufactured.

In this case, the main body 121 may be cut to the size of one microfluidic device chip after the plurality of the conductive parts and the plurality of the insulating parts are all manufactured on the main body 121.

Referring to FIG. 6B, in the forming of the intermediate layer, the intermediate layer L10 may be formed on an upper surface of the main body 121.

The intermediate layer L10 may function to connect and / or fix the conductive layer L20 to the main body 121.

For example, the intermediate layer L10 may be an adhesive made of titanium.

However, the present invention is not limited thereto, and the material of the intermediate layer L10 may be variously modified at a level apparent to those skilled in the art.

For example, the intermediate layer L10 may be 20 nm.

However, the present invention is not limited thereto, and the thickness of the intermediate layer L10 may be variously modified at a level apparent to those skilled in the art.

For example, the thickness of the intermediate layer L10 may be 30 nm.

In the forming of the conductive layer L20, the conductive layer L20 may be disposed on an upper surface of the intermediate layer L10.

For example, the conductive layer L20 may be made of gold.

However, the material of the conductive layer L20 is not limited thereto and may be variously modified at a level apparent to those skilled in the art.

For example, the thickness of the conductive layer L20 may be 200 nm.

However, the present invention is not limited thereto, and the thickness of the conductive layer L20 may be variously modified at a level apparent to those skilled in the art.

For example, the thickness of the conductive layer L20 may be 300 nm.

In the attaching of the photoresist R10, the photoresist R10 may be attached to an upper surface of the conductive layer L20.

Here, the photoresist R10 may mean a film that is chemically changed when exposed to light.

In the present invention, the photoresist R10 is described based on the negative type, but is not limited thereto. The photoresist R10 may be a positive type.

Referring to FIG. 6 (c), in the photoresist irradiation step, the mask M is disposed to be spaced apart from the main body 121 in an upward direction of the main body part 121, and light is emitted to the main body part 121. You can investigate.

For example, the mask M may be formed to penetrate through only the photoresist R10 formed on the conductive layer L20 corresponding to the shape of the conductive part 122 so that light is irradiated.

Through this process, only a portion of the photoresist R10 corresponding to the shape of the conductive portion 122 may be chemically changed.

Referring to FIG. 6 (d), after the development process, portions other than the chemically changed photoresist R10 may be removed.

Referring to FIG. 6E, the conductive part implementing step may remove portions other than the conductive layer L20 corresponding to the shape of the conductive portion 122 through an etching process.

For example, to remove a portion of the conductive layer L20, TFA etchant (8 wt% iodine, 21 wt% potassium iodide, 71 wt% water, Transene Company Inc., MA, USA) may be used, but Without being limited, the etchant for removing the conductive layer L20 may be variously modified at a level apparent to those skilled in the art.

In addition, the conductive part implementation step may remove portions other than the intermediate layer L10 corresponding to the shape of the conductive portion 122 through an etching process.

For example, to remove a portion of the intermediate layer (L10), TFTN etchant (HCl based, Transene Company Inc.) may be used, but is not limited thereto, the etching solution for removing the intermediate layer (L10) Various modifications can be made to those skilled in the art.

The photoresist R10 may be removed while a part of the conductive layer L20 and a part of the intermediate layer L10 are removed.

For example, acetone may be used to remove the photoresist R10, but is not limited thereto. The solution for removing the photoresist R10 may be variously modified at a level apparent to those skilled in the art. .

FIG. 7 is a view for explaining a process of manufacturing an insulating part of the chip for the microfluidic device of FIG. 5.

In detail, FIG. 7 is a view for explaining a process of manufacturing the insulating part of the chip for the microfluidic device based on the cross-sectional portion of Y-Y 'of FIG. 5.

Referring to FIG. 7, in the insulating forming step of the microfluidic device chip 120 according to the exemplary embodiment, a first material is coated on the conductive part 122 formed on the main body part 121. At least a portion of the preliminary insulation portion may be formed by applying a material, forming a preliminary insulation portion in which a first material is cured to form a preliminary insulation portion on the conductive portion 122, and at least a portion of the preliminary insulation portion is chemically changed. The preliminary insulation development step, wherein the preliminary insulation portion is developed so that the at least part of the connection portion 122c is covered by the insulation portion 123 so that the insulation portion 123 is formed. It may be provided.

In the forming of the insulating part, the insulating part 123 may be formed so that at least a part of the connection part 122c is covered by the insulating part 123.

Hereinafter, each step of the insulating portion forming step will be described in detail.

Referring to FIGS. 7A and 7B, in the applying of the first material, the first material may be coated on the main body 121 and the conductive part 122.

Here, the first material may be Nano SU-8, but is not limited thereto, and the first material may include any material that may have an insulating property.

Next, the first material may be cured to generate a preliminary insulation portion L30 on the main body 121 and the conductive portion 122.

Here, the method of curing the first material may be a method of applying a predetermined heat, but is not limited thereto, and the method of curing may be variously modified at a level apparent to those skilled in the art.

For example, in the applying of the first material and forming the preliminary insulation portion, the preliminary insulation portion L30 may be formed by attaching a film made of a first material to the main body portion 121 and the conductive portion 122. It may be.

Referring to FIG. 7C, in the irradiation of the preliminary insulation portion, light may be exposed only to a part of the preliminary insulation portion L30 using the mask M. Referring to FIG.

For this reason, only the preliminary insulation portion L30 exposed to light may be chemically changed.

For example, light may be exposed only to the preliminary insulation portion L30 corresponding to at least a portion of the connection portion 122c (in other words, the preliminary insulation portion L30 formed on at least a portion of the connection portion 122c). have.

Referring to FIG. 7D, in the developing of the preliminary insulation portion, the preliminary insulation portion L30 other than the preliminary insulation portion L30 corresponding to at least a portion of the connection portion 122c may be removed through the development process. The insulating part 123 may be formed.

As such, since the insulating part 123 is formed at a portion corresponding to the connection part 122c, the life of the microfluidic device chip 120 may be effectively extended, and the microfluidic device 100 may flow. Can increase the flow rate effectively.

According to the microfluidic device manufacturing method according to an embodiment of the present invention, in the microfluidic device manufacturing method for manufacturing a microfluidic device that flows a small amount of fluid in a predetermined direction, the arrangement space which is a predetermined space therein Providing a housing portion provided with a housing portion to provide and providing a chip for the microfluidic device provided with a chip for the microfluidic device and chip arrangement step for the microfluidic device at least a portion of the chip for the microfluidic device is disposed in the placement space It may include.

Here, the step of providing a chip for the microfluidic device may include providing a main body part disposed in the placement space to form a flow path, which is a passage through which the fluid flows together with the housing part, wherein the fluid is electrolyzed and gas is supplied. In order to be generated, at least a portion of the conductive portion is covered by an insulating portion so that a conductive portion for flowing a current to the fluid is formed on the body portion and at least a portion of the conductive portion is insulated from the fluid. In an embodiment, an insulating part forming step of forming the insulating part may be provided.

Here, the chip arrangement step for the microfluidic device is a chip for the microfluidic device so that a portion of the microfluidic device chip is disposed in the placement space and the remaining portion of the microfluidic device chip is disposed outside the housing portion. Can be placed.

8 is a perspective view of a microfluidic device chip provided in the microfluidic device according to another embodiment of the present invention.

Detailed description of the microfluidic device chip provided in the microfluidic device according to another embodiment of the present invention may be omitted in the overlapping description.

Referring to FIG. 8, the insulation portion 1123 may cover at least a portion of the connection portion 1122c such that at least a portion of the connection portion 1122c is insulated from the fluid.

In addition, the insulating part 1123 may cover an entire surface of the main body part 121 where the conductive part 1122 is formed.

In addition, the insulation part 1123 covers at least a portion of the connection part 1122c and is adjacent to the electrolysis electrode part 1122b so that the fluid easily receives current from the electrolysis electrode part 1122b. And it may provide an accommodation space (S30) which is a space that can accommodate the fluid.

In addition, the insulation unit 1123 covers at least a portion of the connection part 1122c and prevents the power supply unit from being separated from the power supply unit 1122a while the power supply unit is connected to the power supply unit 1122a. In order to be adjacent to the power applying unit 1122a, the power supply unit may be provided with a seating space S40.

Specifically, the insulating part 1123 may be formed of one layer stacked on one surface of the main body part 121.

For this reason, the conductive portion 1122 may be located inside the insulating portion 1123.

The insulating part 1123 penetrates from an upper surface of the insulating part 1123 to an upper surface of the main body part 121 to provide the accommodation space S30.

Here, the accommodation space S30 may be provided through the insulating portion 1123 corresponding to the electrolysis electrode portion 1122b.

A portion of the fluid may flow in a predetermined direction on the flow path portion 111e, and a portion of the fluid may be accommodated in the accommodation space S30.

As a result, since the electrolysis electrode part 1122b can easily transfer electricity to the fluid, electrolysis can be more effectively performed.

In addition, the seating space S40 may be provided by penetrating the insulator 1123 from an upper surface of the insulator 1123 to an upper surface of the main body 121.

Here, the seating space S40 may be provided through the insulating portion 1123 corresponding to the power applying unit 1122a.

A portion of the power supply unit may be disposed in the seating space S40, and the power supply unit connected to the power applying unit 1122a may be disposed due to a step difference between the insulation units 1123 providing the seating space S40. The separation from the power applying unit 1122a can be prevented.

Hereinafter, the manufacturing method of the electrically conductive part of the microfluidic device chip | tip and the insulating part of the microfluidic device chip which concerns on another Example of this invention is explained in full detail.

FIG. 9 is a view for explaining a process of forming a conductive part of the chip for the microfluidic device of FIG. 8.

Specifically, FIG. 9 is a view for explaining a process of forming the conductive portion of the chip for the microfluidic device based on the cross-sectional portion taken along the line X-X 'of FIG. 8.

Referring to FIG. 9, in the forming of the conductive portion of the chip for a microfluidic device according to another embodiment of the present invention, the conductive layer forming step of coating a conductive layer L120 through which a current flows may be performed on the body portion 121. And a photoresist attaching the photoresist R110 chemically changed by light to one surface of the conductive layer L120, so that at least a portion of the photoresist R110 is chemically changed. Irradiating at least a portion of the photoresist to light, removing the conductive layer L120 except for the conductive layer L120 corresponding to the shape of the conductive part 1122, and removing the conductive layer L120. An electrically conductive part may be formed by plating a plating material P10 on the nonconductive layer L120 to form a conductive part 1122.

Hereinafter, each step will be described in detail.

Referring to FIG. 9A, the main body 121 may be provided.

Referring to FIG. 9B, in the conductive layer forming step, the conductive layer L120 may be formed on an upper surface of the main body 121.

For example, the conductive layer L120 may be made of copper.

However, the material of the conductive layer L120 is not limited thereto and may be variously modified at a level apparent to those skilled in the art.

For example, the thickness of the conductive layer L120 may be 16.87 μm.

However, the present invention is not limited thereto, and the thickness of the conductive layer L120 may be variously modified at a level apparent to those skilled in the art.

Referring to FIG. 9C, the photoresist R110 may be attached to an upper surface of the conductive layer L120 in the photoresist attaching step.

Here, the photoresist R110 may mean a film that is chemically changed when exposed to light.

In the present invention, the photoresist R110 is described based on the negative type, but is not limited thereto. The photoresist R110 may be a positive type.

Referring to FIG. 9 (d), in the photoresist irradiation step, the mask M is disposed to be spaced apart from the main body 121 in an upward direction of the main body part 121, and light is emitted to the main body part 121. You can investigate.

For example, the mask M may be formed to penetrate through only the photoresist R110 formed on the conductive layer L120 corresponding to the shape of the conductive portion 1122.

Through this process, only a portion of the photoresist R110 corresponding to the shape of the conductive portion 1122 may be chemically changed.

Referring to FIG. 9E, the conductive layer removing step may remove portions other than the conductive layer L120 corresponding to the shape of the conductive portion 1122 through an etching process.

In other words, the conductive layer L120 other than the conductive layer L120 positioned below the chemically changed photoresist R110 may be removed.

Detailed descriptions may be omitted in the overlapping description with respect to the etching solution.

Referring to FIG. 9F, after a portion of the conductive layer L120 is removed, the photoresist R110 may be removed.

Referring to FIG. 9G, in the implementing of the conductive portion, the conductive portion 1122 may be formed by plating the plating material P10 on the conductive layer L120 that is not removed.

Here, the plating material P10 may be made in plural.

For example, the plating material P10 may be formed of nickel and gold, and a nickel layer may be formed on an upper surface of the conductive layer L120, and a gold layer may be formed on an upper surface of the nickel layer.

Plating may include both electroless plating or electrolytic plating.

FIG. 10 is a diagram for describing a process of forming an insulating part of the chip for the microfluidic device of FIG. 8.

Specifically, FIG. 10 is a view for explaining a process of forming an insulating part of a chip for a microfluidic device based on the cross-sectional portion of Y-Y 'of FIG. 7.

Referring to FIG. 10, in the forming of the insulating part of the chip for a microfluidic device according to another embodiment of the present invention, a first material is coated with a first material on the conductive part 1122 formed on the main body part 121. At least one of the preliminary insulator forming step and the power applying unit 1122a and the electrolysis electrode unit 1122b, wherein the preliminary insulator L130 is formed on the conductive portion 1122 by curing the first material. In order to prevent one from being covered by the preliminary insulation portion L130, the preliminary insulation portion L130 may be processed to form a preliminary insulation portion processing step of forming the insulation portion 1123.

Detailed descriptions related thereto may be omitted in the overlapping description.

Referring to FIGS. 10A and 10B, in the step of applying a first material, the first material may be coated on the main body 121 and the conductive part 1122.

Here, the first material may be a shoulder resist, but is not limited thereto, and the first material may include any material that may have an insulating property.

In the forming of the preliminary insulation portion, the preliminary insulation portion L130 may be formed on the conductive portion 1122 and the main body portion 121 by curing the first material.

In other words, in the forming of the preliminary insulation portion L130, the preliminary insulation portion L130 may be formed to cover the conductive portion 1122 formed on the main body portion 121.

In the forming of the preliminary insulating portion, the preliminary insulating portion L130 may be formed to cover one surface of the main body portion 121 to which the conductive portion 1122 is connected and the conductive portion 1122.

In addition, one surface of the preliminary insulation portion L130, that is, a surface opposite to the surface connected to the main body portion 121 may form a uniform surface.

In addition, the preliminary insulation portion L130 may surround all one surface of the main body portion 121.

The preliminary insulation portion processing step may include irradiating the preliminary insulation portion at which a portion of the preliminary insulation portion L130 is exposed to light and the power applying unit 1122a so that at least a portion of the preliminary insulation portion L130 is chemically changed. And a preliminary insulation portion development step in which the preliminary insulation portion L130 is developed to form the insulation portion 1123 such that at least one of the electrolytic electrode portions 1122b is not covered by the preliminary insulation portion L130. It may consist of steps.

Referring to FIG. 10C, in the preliminary insulation part irradiation step, light may be exposed to only a part of the preliminary insulation part L130 by using a mask M.

For this reason, only the preliminary insulation portion L130 exposed to light may be chemically changed.

Light may be exposed only to the preliminary insulation portion L130 corresponding to at least one of the power applying unit 1122a and the electrolysis electrode portion 1122b.

For example, light may be exposed only to a portion corresponding to the power applying unit 1122a and the electrolysis electrode unit 1122b. Thus, the accommodation space S30 and the seating space S40 may be formed.

Referring to FIG. 10 (d), in the developing of the preliminary insulation portion, the insulation portion 1123 may be formed by removing the chemically changed preliminary insulation portion L130 through a development process.

11 is a perspective view of a microfluidic device chip provided in the microfluidic device according to another embodiment of the present invention.

Detailed description of the chip for the microfluidic device provided in the microfluidic device according to another embodiment of the present invention may be omitted in the overlapping with the above description.

Referring to FIG. 11, the microfluidic device according to another embodiment of the present invention may further include a power consumption unit 2130 consuming power.

For example, the power consumption unit 2130 may be a valve.

For example, the power consumption part 2130 is disposed between the flow path part 111e (see FIG. 3) and the passage part 111f (see FIG. 3), and the passage part 111f is disposed in the flow path part 111e. It is possible to control the flow of the fluid flowing to the.

However, the present invention is not limited thereto, and the power consumption unit 2130 may include all the electronic devices required to drive the microfluidic device 100.

In the conductive portion 1122 of the microfluidic device chip 2120 according to another embodiment of the present invention, the conductive portion 1122 may be electrically connected to the power consumption portion 2130. ) May be further provided.

For example, the power consumption electrode part 2122d may be manufactured at the same time as the power applying unit 1122a, the electrolysis electrode part 1122b, and the connection part 1122c.

The connection unit 1122c may connect a power supply unit (not shown) and the power consumption electrode unit 2122d to each other such that the power supply unit and the power consumption electrode unit 2122d are electrically connected to each other.

When the power consumption unit 2130 is in the first position, the power consumption unit 2130 may be electrically connected to the power consumption electrode unit 2122d.

In addition, when the power consumption unit 2130 is in the second position, the power consumption unit 2130 may be electrically separated from the power consumption electrode unit 2122d.

To this end, the insulation portion 2123 may provide a detachment space S50 such that the power consumption portion 2130 may be detached from the power consumption electrode portion 2122d.

Specifically, the insulation part 2123 penetrates from an upper surface of the insulation portion 2123 to an upper surface of the body portion 121 to provide the detachable space S50.

Here, the detachable space S50 may be formed by penetrating the insulating portion 2123 corresponding to the power consumption electrode portion 2122d.

The method of forming the detachable space S50 may be the same as the method of forming the seating space S40 and / or the accommodation space S30, and a detailed description thereof will be omitted in the overlapping manner. Can be.

Due to the formation of the detachable space S50, the power consumption portion 2130 connected to the power consumption electrode portion 2122d may be effectively prevented from being separated from the power consumption electrode portion 2122d.

In addition, since the power consumption unit 2130 is removable from the power consumption electrode unit 2122d, the user may connect or disconnect the power consumption unit 2130 to the main body unit 121 as necessary.

In FIG. 11, the power consumption unit 2130 and the power consumption electrode unit 2122d are illustrated as one, but are not limited thereto. The power consumption unit 2130 and / or the power consumption electrode unit 2122d may be provided in plural numbers. Can be formed.

In the above-described example, the portion of the insulating portion 1123 and 2123 has been described as being embedded to form the accommodation space S30, the seating space S40, and the detachment space S50, but the present invention is not limited thereto. .

For example, the electrolysis electrode part may be located in the accommodation space S30.

Here, the upper surface of the electrolytic electrode portion and the insulating portion may form a uniform surface.

For example, the electrolysis electrode part may be positioned in the accommodation space S30, and the top surface of the electrolysis electrode part may be higher than the top surface of the insulating part 1123.

Such a feature may be applicable to both the seating space S40 and the detachable space S50.

The above-described power supply unit (not shown) may include any configuration capable of supplying power.

For example, the power supply unit may include a battery, an electric wire, and the like.

In order to more clearly express the technical spirit of the present invention, the accompanying drawings are briefly expressed or omitted for the components that are not relevant or inferior to the technical spirit of the present invention.

In the above description of the configuration and features of the present invention based on the embodiment according to the present invention, the present invention is not limited thereto, and various changes or modifications can be made within the spirit and scope of the present invention. As will be apparent to those skilled in the art, such changes or modifications are intended to fall within the scope of the appended claims.

100: fine flow pump 110: housing portion
111: upper housing portion 112: lower housing portion
120: microfluidic chip 121: main body
122: conductive portion 123: insulating portion

Claims (16)

A microfluidic device chip including at least a portion of a housing part included in a microfluidic device for flowing a small amount of fluid in a predetermined direction, the housing part providing an arrangement space which is a predetermined space therein. ,
A main body part disposed in the placement space to form a flow path that is a passage through which the fluid flows together with the housing part;
A conductive part connected to the main body part and configured to flow a current through the fluid so that the fluid is electrolyzed to generate gas; And
And an insulating part covering at least a part of the conductive part so that at least a part of the conductive part is insulated from the fluid,
The conductive portion,
A power applying unit electrically connected to a power supply unit for supplying electric power, an electrolysis electrode unit for flowing a current to the fluid so that the fluid is electrolyzed and gas is generated, and the power supply unit and the electrolysis electrode A connection part for connecting the power supply part and the electrolysis electrode part to each other so as to be electrically connected;
The insulation portion,
Covering at least a portion of the connection portion such that at least a portion of the connection portion is insulated from the fluid,
Chips for Microfluidic Devices.
delete The method of claim 1,
The insulation portion,
Covering at least a portion of the connecting portion and at the same time to provide a receiving space that is spaced adjacent to the electrolysis electrode portion and the fluid can be accommodated, so that the fluid easily receives current from the electrolysis electrode portion,
Chips for Microfluidic Devices.
The method of claim 1,
The insulation portion,
A space in which the power supply unit is located and adjacent to the power supply unit to cover at least a portion of the connection unit and prevent the power supply unit from being separated from the power supply unit while the power supply unit is connected to the power supply unit. To provide a seating space,
Chips for Microfluidic Devices.
The method of claim 1,
The insulation portion,
Covering one surface of the main body,
Chips for Microfluidic Devices.
In a microfluidic device for flowing a small amount of fluid in a predetermined direction,
A housing part providing an arrangement space which is a predetermined space therein; And
And a microfluidic device chip disposed at least partially in the placement space.
The microfluidic device chip,
A main body part disposed in the placement space to form a flow path which is a passage through which the fluid flows together with the housing part, and connected to the main body part so that a current is flowed into the fluid so that the fluid is electrolyzed to generate gas A conductive portion to cover at least a portion of the conductive portion so that at least a portion of the conductive portion and the conductive portion are insulated from the fluid,
The conductive portion,
A power applying unit electrically connected to a power supply unit for supplying electric power, an electrolysis electrode unit for flowing a current to the fluid so that the fluid is electrolyzed and gas is generated, and the power supply unit and the electrolysis electrode A connection part for connecting the power supply part and the electrolysis electrode part to each other so as to be electrically connected;
The insulation portion,
Covering at least a portion of the connection portion such that at least a portion of the connection portion is insulated from the fluid,
Microfluidic devices.
delete The method of claim 6,
The microfluidic device chip,
At least a part is disposed in the placement space and the other part is disposed outside the housing part such that the power applying part is located outside the housing part so that the power supply part is easily connected to the power applying part.
Microfluidic devices.
The method of claim 6,
The microfluidic device,
Further comprising: a power consumption unit for consuming power,
The conductive portion,
Further provided with a power consumption electrode that can be electrically connected to the power consumption,
The connecting portion,
The power supply unit and the power consumption electrode unit are connected to each other so that the power supply unit and the power consumption electrode unit are electrically connected.
The power consumption unit,
In the first position, the power consumption is electrically connected to the electrode portion,
In the second position, electrically separated from the power consumption electrode,
Microfluidic devices.
In the microfluidic device chip manufacturing method for manufacturing the microfluidic device chip included in the microfluidic device for flowing a small amount of fluid in a predetermined direction,
A main body providing step of providing a main body;
A conductive portion forming step of forming a conductive portion on the main body portion for flowing a current to the fluid so that the fluid is electrolyzed on the main body portion to generate gas; And
And an insulating part forming step of forming the insulating part so that at least a part of the conductive part is covered by the insulating part so that at least a part of the conductive part is insulated from the fluid.
The conductive portion,
A power applying unit electrically connected to a power supply unit for supplying electric power, an electrolysis electrode unit for flowing a current to the fluid so that the fluid is electrolyzed and gas is generated, and the power supply unit and the electrolysis electrode A connection part for connecting the power supply part and the electrolysis electrode part to each other so as to be electrically connected;
The insulating portion forming step,
Wherein the insulation is formed such that at least a portion of the connection is covered by an insulation;
Chip manufacturing method for microfluidic devices.
delete The method of claim 10,
The insulating portion forming step,
Applying a first material to the conductive part formed on the main body part; applying a first material; forming a preliminary insulating part in which a first material is cured to form a preliminary insulating part on the conductive part; Irradiating at least a portion of the preliminary insulation portion to light, and preliminary step in which the preliminary insulation portion is developed to form the insulation portion so that at least a portion of the connection portion is covered by the insulation portion so that the chemical change is performed. With an insulation development step,
Chip manufacturing method for microfluidic devices.
The method of claim 10,
The insulating portion forming step,
Forming a preliminary insulation portion in which a preliminary insulation portion is formed so as to cover the conductive portion formed on the main body portion, and the preliminary insulation portion is processed so that at least one of the power applying portion and the electrolysis electrode portion is not covered by the preliminary insulation portion. And a preliminary insulator processing step in which the insulator is formed,
Chip manufacturing method for microfluidic devices.
The method of claim 13,
Forming the preliminary insulation portion,
The preliminary insulation portion is formed to cover one surface of the main body portion to which the conductive portion is connected and the conductive portion,
Chip manufacturing method for microfluidic devices.
In the microfluidic device manufacturing method for producing a microfluidic device for flowing a small amount of fluid in a predetermined direction,
A housing part providing step of providing a housing part which provides an arrangement space which is a predetermined space therein; And
Providing a chip for a microfluidic device, wherein a chip for the microfluidic device is provided; And
And a chip disposing step of the microfluidic device, wherein at least a portion of the microfluidic device chip is disposed in the placement space.
The chip providing step for the microfluidic device,
Providing a main body portion provided in the placement space to form a flow path which is a passage through which the fluid flows along with the housing portion, providing a body portion, the current flows to the fluid so that the fluid is electrolyzed to generate gas A conductive portion forming step of forming a conductive portion on the main body portion and an insulating portion forming step of forming the insulating portion so that at least a portion of the conductive portion is covered by the insulating portion so that at least a portion of the conductive portion is insulated from the fluid. With;
The conductive portion,
A power applying unit electrically connected to a power supply unit for supplying electric power, an electrolysis electrode unit for flowing a current to the fluid so that the fluid is electrolyzed to generate gas, and the power supply unit and the electrolysis electrode A connection part for connecting the power supply part and the electrolysis electrode part to each other so as to be electrically connected;
The insulating portion forming step,
The insulation is formed such that at least a portion of the connection is covered by an insulation;
Microfluidic device manufacturing method.
The method of claim 15,
The chip arrangement step for the microfluidic device,
Disposing the chip for the microfluidic device so that a part of the chip for the microfluidic device is disposed in the placement space and the remaining part of the microfluidic device chip is disposed outside the housing part;
Microfluidic device manufacturing method.

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