KR102068315B1 - Thermal diffusion module and manufacturing method for thereof - Google Patents

Abstract

The present invention relates to a heat diffusion module and to a manufacturing method thereof. More specifically, provided are the heat diffusion module disposed adjacent to a heat generating body and effectively dissipating heat transferred from the heat generating body, and the manufacturing method thereof. The heat diffusion module includes a carrier and a heat dissipation layer.

Description

Heat diffusion module and its manufacturing method {THERMAL DIFFUSION MODULE AND MANUFACTURING METHOD FOR THEREOF}

The present invention relates to a heat spreading module and a method of manufacturing the same, and more particularly, a heat spreading module which is provided inside an electronic device to effectively dissipate heat transferred from an electronic component such as an antenna, a battery, a display element, a PCB, and the like. It relates to a manufacturing method thereof.

Portable terminals such as mobile phones, tablet PCs, notebook PCs, and PDAs are equipped with antennas for realizing near field communication (NFC) functions, wireless charging functions, or other functions. In addition, an electric vehicle and a portable terminal are provided with a battery for power supply, and display elements are installed in display panels of TVs, laptops, monitors, and the like. In addition, a printed circuit board (PCB) is provided inside the electronic device to electrically connect the electronic component.

Components such as antennas, batteries, display elements, and PCBs generate heat during operation, and the corresponding components (hereinafter, heating elements) such as antennas, batteries, display elements, and PCBs are overheated or generated heat is transferred to other electronic components. In this case, there is a problem that the reliability of the product may be degraded by degrading the performance of the part or causing the failure of the part.

Thus, graphite sheets are used to diffuse heat generated from the heating element to radiate heat to the outside. Graphite sheets are easily broken and cracked due to the characteristics of exfoliated particles, so that the surface of the graphite sheet is easily damaged. There has been a problem of electrically affecting (shorting) electronic components. Therefore, in order to prevent cracking, breakage, powder blowing, etc. of the graphite sheet, a protective film was attached to one surface of the graphite sheet, but the thickness of the graphite sheet was thick due to such a structure.

Korea Patent Publication No. 10-2017-0109981 (2017.10.10)

Therefore, the technical problem of the present invention is conceived in this respect, the object of the present invention is to provide a heat diffusion module and a method of manufacturing the same that can effectively dissipate heat generated in the electronic component.

In addition, an object of the present invention to minimize the thickness by applying a heat dissipation composition directly to the carrier to produce a heat diffusion module, to provide a heat diffusion module and a method for manufacturing the same can solve the problem caused by the damage of graphite.

According to an embodiment for realizing the above object of the present invention, a carrier; And a heat dissipation layer formed by applying a heat dissipation composition to one surface of the carrier.

An antenna radiator may be formed on one surface of the carrier, and the heat radiating layer may be formed by applying a heat radiating composition to at least one surface of the carrier and the antenna radiator.

The heat dissipating composition may include a filler, a binder, and a solvent including a thermally conductive material and a thermally radioactive material.

The heat dissipating composition may include 20 to 30 wt% of the filler, 5 to 50 wt% of the binder, and the remainder of the solvent.

The thermally conductive material may comprise one or more materials selected from the group consisting of alumina, aluminum and copper.

The thermally radioactive material may be boron.

On the other hand, according to another embodiment for realizing the object of the present invention; Applying a heat dissipating composition comprising a filler, a binder, and a solvent comprising a thermally conductive material and a thermally radioactive material on one surface of the carrier; And drying the carrier to which the heat dissipating composition is applied.

The drying conditions may be dried for 15 to 20 minutes under a temperature of 150 ~ 200 ℃.

The thermally conductive material is at least one material selected from the group consisting of alumina, aluminum, and copper, and the thermally radioactive material may be boron.

Forming an antenna pattern on one surface of the carrier before applying the heat dissipating composition to one surface of the carrier; And plating the antenna pattern to form an antenna radiator.

After forming the antenna radiator, the method may further include masking at least one surface of at least one of the carrier and the antenna radiator.

According to embodiments of the present invention, the present invention can effectively dissipate heat generated from electronic components inside the electronic device.

In addition, the present invention can minimize the thickness by applying the heat dissipation composition directly to the carrier to produce a heat diffusion module, it is possible to solve the problem caused by the damage of the graphite.

The effects of the invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

1 is a schematic diagram illustrating a heat diffusion module according to an embodiment of the present invention.
2 is a reference view for explaining a method of manufacturing a heat diffusion module according to an embodiment of the present invention.
3 and 4 are reference diagrams for explaining a method of manufacturing a heat diffusion module according to a modification of the embodiment of the present invention.
5 is a schematic view for explaining a heat diffusion module according to a modification of the embodiment of the present invention.
6 is a reference diagram for explaining a method of manufacturing a heat diffusion module according to another modified example of the embodiment of the present invention.

As the inventive concept allows for various changes and numerous modifications, the embodiments will be described in detail in the text. However, this is not intended to limit the present invention to a specific disclosure form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. In describing the drawings, similar reference numerals are used for similar elements. Terms such as first and second may be used to describe various components, but the components should not be limited by the terms.

The terms are used only for the purpose of distinguishing one component from another. The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise.

In this application, the terms "comprise" or "consist of" are intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described on the specification, but one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art, and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the drawings.

1 is a schematic diagram illustrating a heat diffusion module according to an embodiment of the present invention. Referring to FIG. 1, a heat diffusion module according to an embodiment of the present invention may include a carrier 100 and a heat dissipation layer 400. It may include.

The carrier 100 is located inside an electronic device such as a wireless communication terminal, and may be formed by injection molding of an insulating material. At this time, the insulating material may be a synthetic resin material such as polyester resin, polycarbonate (PC). However, the carrier 100 is not limited thereto, and may be a film, wherein the film may be a PI (Polyimide) film having strong chemical resistance, abrasion resistance, and heat resistance.

The heat dissipation layer 400 may be formed on one surface of the carrier 100. In this embodiment, "one side" may be "top side" in the drawing.

The heat dissipation layer 400 is for dissipating heat transferred from an external heat generator, to prevent overheating of the heat generator, or to prevent heat generated from being transferred to other electronic components. The heat dissipation layer 400 may be a thermally conductive material and It may comprise a thermally radioactive material. The heat conductive material included in the heat dissipation layer 400 may quickly conduct heat transferred from the heating element, and the heat spreading module may diffuse the heat rapidly by the heat radiating material included in the heat dissipation layer 400 increasing the emissivity. It is.

In this case, the thermally conductive material may include one or more materials selected from the group consisting of alumina, aluminum, and copper. In addition, the thermally radioactive material may be boron (B).

The heat dissipation layer 400 may be formed by applying the heat dissipation composition to one surface of the carrier 100, and the coating method may be performed by various methods such as spraying and transferring. The heat dissipation composition may be applied to one surface of the carrier 100 and dried to form the heat dissipation layer 400.

The heat dissipating composition may comprise a filler, a binder and a solvent comprising a thermally conductive material and a thermally radioactive material.

Alumina, aluminum, and copper, which are thermally conductive materials, have high thermal conductivity, while boron, which is a thermally radioactive material, has a thermal radiation property, but has a very low thermal conductivity. Thus, a heat radiation is performed by combining a thermally conductive material such as alumina with boron. By constituting the layer 400, the heat dissipation layer 400 has thermal conductivity and heat radiation, thereby improving heat dissipation rate.

On the other hand, the solvent constituting the heat dissipation composition may be methanol, ethanol, the binder is well dissolved in methanol and ethanol, adhesion and bonding strength epoxy resin, acrylic resin, hydrocarbon resin, polyester resin, vinyl-based Resin, urethane-based resin.

The heat dissipating composition may include 20 to 30 wt% of the filler, 5 to 50 wt% of the binder, and the balance of the solvent.

In addition, the filler may be made of 10 to 90% by weight of the thermally conductive material, 10 to 90% by weight of the thermally radioactive material. This assumes that 20 to 30% by weight of the filler is 100%, of which 10 to 90% by weight of the thermally conductive material and the balance is composed of the thermally radioactive material.

According to this embodiment, since the heat-dissipating composition in the form of an ink is applied to the carrier 100 to form a heat-dissipating layer 400, the filler is adhered to the carrier 100 so that the filler may not be cracked or powder blowing may occur. And a protective film such as PET film becomes unnecessary. Therefore, the heat dissipation layer 400 may be disposed immediately adjacent to the heating element. Specifically, in the conventional graphite sheet, since the protective film (PET FILM) should be adhered to the upper surface of the graphite through the adhesive material (ADHENSIVE) in order to prevent this due to the cracking or powder blowing of the graphite, the heat transferred from the heating element to the PET film => As the adhesive material is transferred in the order of graphite, the heat release rate decreases. On the other hand, according to the present embodiment, since the protective film for protecting the filler is not necessary, the heat dissipation layer 400 including the thermally conductive material and the thermally radioactive material may receive heat directly, and thus the heat transferred from the heating element. As it is directly transmitted to the heat dissipation layer 400, the emissivity is higher than in the prior art.

FIG. 2 is a reference diagram for describing a method of manufacturing a heat diffusion module according to an embodiment of the present invention, and a method of manufacturing a heat diffusion module will be described with reference to FIG. 2.

The method of manufacturing a heat diffusion module according to the present embodiment includes disposing a carrier 100 (S100); Applying a heat dissipating composition including a filler, a binder, and a solvent including a thermally conductive material and a thermally radioactive material to one surface of the carrier 100 (S200); And drying the carrier 100 to which the heat dissipating composition is applied (S300).

The carrier 100 may be an insulating material or film formed through injection.

After disposing the carrier 100 (S100), a heat dissipating composition including a filler, a binder, and a solvent including a thermally conductive material and a thermally radioactive material is applied to one surface of the carrier 100 (S200). The heat dissipating composition may be applied to one surface of the carrier 100 by spray spraying.

In this case, the thermally conductive material may be at least one material selected from the group consisting of alumina, aluminum, and copper, and the thermally radioactive material may be boron.

The thicker the heat dissipation layer 400, the higher the thermal emissivity and the lower the thermal conductivity. Therefore, the thickness of the heat dissipation layer 400 using the characteristics of the heat dissipation layer 400 may be set in various ways depending on the distribution of heat transmitted from the external heating element, the thickness of the heat dissipation layer 400 is applied to the heat dissipation composition Can be adjusted according to the degree. For example, when the heat transferred from the outside is concentrated in a specific portion of the heat diffusion module, the thickness of the heat dissipation layer 400 of the hot spot where the heat is concentrated may be thinner than other portions. As such, when the thickness of the heat dissipation layer 400 is reduced to the hot spot part, the heat conduction is increased at the hot spot part, so that the heat conduction is quickly performed to another part having a thick thickness of the heat dissipation layer 400, Since the part has a high thermal emissivity, heat can be radiated quickly to the outside, thereby improving heat dissipation of the heat diffusion module.

Next, the carrier 100 to which the heat dissipating composition is applied is dried (S300). Specifically, the film to which the heat dissipating composition is applied may be dried for 15 to 20 minutes under a temperature of 150 to 200 ° C. When the heat dissipating composition is dried, a filler including a thermally conductive material and a thermally radioactive material is bonded to one surface of the carrier 100, so that the filler does not have a risk of cracking or powder blowing, thereby eliminating the need for a protective film such as a PET film. . Therefore, in the heat diffusion module manufactured according to the present embodiment, the heat dissipation layer 400 including the filler may be disposed immediately adjacent to the heating element, and thus the heat dissipation rate is higher than that of the graphite sheet according to the prior art.

In addition, when the carrier 100 is a film, a pressure-sensitive adhesive for adhering the protective film and the protective film to graphite is not required, and thus the thickness of the heat diffusion module may be thinner than that of the conventional graphite sheet.

3 and 4 are reference views for explaining a method of manufacturing a heat diffusion module according to a modification of the embodiment of the present invention, Figure 5 is a schematic diagram for explaining a heat diffusion module according to a modification of the embodiment of the present invention. 3 to 5, the heat spreading module according to the present embodiment may further include an antenna radiator 300.

Specifically, the antenna radiator 300 is formed on one surface of the carrier 100, and the heat radiating composition may be applied to at least one surface of the carrier 100 and the antenna radiator 300 to form the heat radiating layer 400. have. The antenna radiator 300 may be made of a conductive metal material and transmit and receive signals of a wireless communication terminal.

As such, when the antenna radiator 300 is formed on the carrier 100, and the antenna radiator 300 and the carrier 100 heat radiation layer 400 are formed, the heat spreading module functions as an antenna by the antenna radiator 300. At the same time, the heat radiation layer 400 can also function as a heat radiation means.

3 and 4, a method of manufacturing the heat diffusion module according to the present embodiment will be described.

The carrier 100 is an insulating material formed through injection, and the carrier 100 may be manufactured by injecting a synthetic resin including a laser activatable additive into an injection mold to perform an injection process.

The antenna radiator 300 may be an antenna formed by a laser direct structure (LDS) method. LDS method is a chemical bonding of the carrier 100 by forming a structure from a material containing a non-conductive, chemically stable heavy metal complex, and exposing a portion of the structure to a laser such as UV (ultra violet) laser, excimer laser After dismantling to expose the metal seed, the metallization of the structure (metal) means a method of forming a conductive material on the laser exposed portion of the structure.

In this embodiment, the antenna pattern 200 may be formed on one surface of the carrier 100 (S130, FIG. 3A), and the antenna radiator 300 may be formed by plating the antenna pattern 200 (S150). Specifically, the antenna pattern 200 is formed by irradiating a laser to one surface of the carrier 100 (S130). Laser processing is performed on the surface of the carrier 100 and the antenna pattern 200 is formed by activating the laser processing. A portion where the laser processing is activated is roughened, and a plating layer is formed on the activated portion.

Next, an antenna layer is formed along the antenna pattern 200 to form the antenna radiator 300 (S150, FIG. 3B). In this case, the antenna radiator 300 may be formed by an electroless plating process. Since the antenna pattern 200 having minute roughness is formed on the surface of the carrier 100 by laser irradiation, the plating layer is formed on the portion (activated portion) where the antenna pattern 200 of the carrier 100 is formed when the plating process is performed. The antenna radiator 300 is formed.

Next, the heat dissipation composition is applied to one surface of the carrier 100 (S200, FIG. 3C), and the carrier 100 to which the heat dissipation composition is applied is dried (S300). The composition, drying conditions, and the like of the heat dissipating composition are as described above. In this case, the thickness of the heat dissipation layer 400 may be adjusted by adjusting the degree of application of the heat dissipation composition.

As such, by forming the heat dissipation layer 400 on the carrier 100 in which the antenna radiator 300 is formed, the antenna function and the heat dissipation function can be simultaneously performed. In addition, since the heat radiation layer 400 covers the antenna radiator 300, the strength of the antenna radiator 300 is reinforced, thereby preventing the antenna radiator 300 pattern from being lost and minimizing cracks due to external impact. The antenna yield can be improved.

Specifically, referring to FIG. 5, in the present exemplary embodiment, a heat diffusion module in which an antenna radiator 300 is formed adjacent to a printed circuit board (PCB) 500 is disposed. In this embodiment, the heating element is the PCB (500).

In the heat spreading module according to the present embodiment, the antenna radiator 300 is formed and functions as an antenna, and the heat radiating layer 400 formed on the antenna radiator 300 and the carrier 100 transmits heat generated by the PCB 500. ) Can be radiated to the outside. Therefore, the antenna performance may be prevented from being affected by the antenna due to heat generated from the PCB 500. In addition, heat generated from the antenna radiator 300 may be radiated to the outside through the heat dissipation layer 400, and performance degradation due to the antenna overheating may be prevented. In addition, the heat dissipation layer 400 may cover the antenna radiator 300 to reinforce the strength of the antenna radiator 300.

Meanwhile, referring to FIG. 6, the method for manufacturing a heat spreading module according to the present embodiment may further include masking a step S170.

After forming the antenna radiator 300 (S150), masking at least one surface of at least one of the carrier 100 and the antenna radiator 300 may be further performed (S170). It may include.

In some cases, it may be necessary to form the heat dissipation layer 400 only on the antenna radiator 300 or to form the heat dissipation layer 400 only on one surface of the carrier 100 except for the antenna radiator 300. In this case, in order to form the heat dissipation layer 400 only in a specific part, the heat dissipation layer 400 may be formed only in a desired specific part by masking a part that does not require the application of the heat dissipation composition, and applying the heat dissipation composition only in other parts.

As described above, according to the present invention, the heat dissipation rate may be improved by directly receiving and radiating heat generated from the heating element through the heat dissipation layer 400. In addition, since the protective film for protecting the heat dissipation layer 400 is not required, the thickness of the heat diffusion module may be slim, and a problem such as a short circuit due to graphite damage may be solved.

Although described above with reference to the embodiments, a person of ordinary skill in the art can variously modify and change the present invention without departing from the spirit and scope of the present invention described in the claims below. I can understand that.

100: carrier
200: antenna pattern
300: antenna radiator
400: heat dissipation layer
500: PCB (Printed Circuit Board)

Claims (11)

carrier; And
A heat dissipation layer formed by applying a heat dissipation composition to one surface of the carrier,
An antenna radiator is formed on one surface of the carrier,
The heat dissipation layer is characterized in that the heat dissipation composition is applied to one surface of the antenna radiator, it is formed by drying for 15 to 20 minutes at a temperature of 150 ~ 200 ℃, heat diffusion module.
delete The method of claim 1,
The heat dissipation composition,
A heat spreading module, characterized in that it comprises a filler, a binder and a solvent comprising a thermally conductive material and a thermally radioactive material.
The method of claim 3, wherein
The heat dissipation composition,
And 20 to 30 wt% of the filler, 5 to 50 wt% of the binder, and the balance of the solvent.
The method of claim 3, wherein
Thermally conductive materials,
And at least one material selected from the group consisting of alumina, aluminum and copper.
The method of claim 3, wherein
Thermal radioactive material,
And boron.
Placing a carrier;
Forming an antenna pattern on one surface of the carrier;
Plating the antenna pattern to form an antenna radiator;
Applying a heat dissipating composition comprising a filler, a binder, and a solvent including a thermally conductive material and a thermally radioactive material to one surface of the antenna radiator; And
Drying the carrier to which the heat dissipating composition is applied,
The drying conditions, characterized in that for 15 to 20 minutes to dry under a temperature of 150 ~ 200 ℃, heat diffusion module manufacturing method.
delete The method of claim 7, wherein
The thermally conductive material,
At least one material selected from the group consisting of alumina, aluminum and copper,
The thermally radioactive material,
Boron, characterized in that the heat diffusion module manufacturing method.
delete The method of claim 7, wherein
After forming the antenna radiator,
And masking at least one surface of at least one of the carrier and the antenna radiator.

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