KR102050866B1 - Apparatus and Method for Manufacturing Micro LED Package - Google Patents

Abstract

Disclosed are an apparatus and method for producing a fine LED package.
According to an aspect of the present embodiment, there is provided an apparatus and method for producing a chip-size package including a driver for controlling each LED together with a fine size LED.

Description

Apparatus and Method for Manufacturing Micro LED Package

The present invention relates to an apparatus and a method for producing a micro-sized LED package, such as micro LEDs.

The contents described in this section merely provide background information on the present embodiment and do not constitute a prior art.

One of the emerging display technologies is micro LEDs. As a display panel manufactured by using a small size RGB LED, it has received much attention because of its small size, high response speed, high brightness, and low power consumption.

In the method of producing such a micro LED, a conventional COB (Chip on Board) method has been used. In the COB method, each RGB LED is directly disposed on a substrate such as a PCB and wire bonding is performed. Due to its relatively simple production method, it is widely used because of its excellent characteristics in terms of time and cost.

However, as described above, the micro LED technology using the micro-sized LED is emerging, a problem in the COB method is revealed. Firstly, each of the RGB LEDs must be selectively transferred, but as the size becomes smaller, it is difficult to accurately transfer each LED to a desired position. In addition, when a failure occurs in any of a large number of LED devices disposed on the substrate, a process of removing the failed device and replacing it with a new device should be made. However, since each RGB LED device is disposed directly on the substrate, it is difficult to remove only the device. Since the size of each device is small and closely arranged, there is a difficulty in selectively removing only a specific device.

In addition, the conventional micro LED had to arrange each RGB LED element on the TFT layer for controlling each RGB LED element. However, the TFT layer and each RGB LED element having a small size are difficult to combine in terms of thermal and mechanical aspects, and thus there is a difficulty in producing a micro LED.

One embodiment of the present invention is to provide an apparatus and method for producing a fine size LED in a chip size package.

In addition, an embodiment of the present invention is to provide an apparatus and method for producing a chip-size package including a driver for controlling each LED with a fine size LED.

According to an aspect of the present invention, in the fine LED package production apparatus, the laser irradiation unit for irradiating the laser to the outside and the laser irradiated from the laser irradiation unit is arranged R LED, G LED, B LED and driver elements respectively The micro LED package or the R LED, G LED by using a laser scanning unit for controlling the irradiation to a predetermined position of the film, and a substrate transfer unit and a sheet for disposing and moving a counter substrate to which the micro LED package is transferred. And the sheet conveying unit for temporarily placing or rotating the B LED and the driver, the molding unit for molding the R LED, the G LED, the B LED and the driver, and the R LED for the molded R LED, G LED, B LED and the driver. A dicing unit for dicing each of the G LED, the B LED, and the driver to be included in at least one of the micro LED package, and each configuration in the micro LED package production apparatus. For example, the micro LED package including at least one of each of the R LEDs, the G LEDs, the B LEDs, and the drivers may be generated from the film on which the R LEDs, the G LEDs, the B LEDs, and the drivers are disposed, and transferred to the counter substrate. It provides a fine LED package production apparatus including a control unit for controlling.

According to an aspect of the invention, the sheet transfer unit is characterized in that for moving the fine LED package on the second substrate.

According to an aspect of the invention, the sheet transfer unit is characterized in that for transferring the second micro LED package including the micro LED package and the second substrate to the counter substrate.

According to one aspect of the invention, the counter substrate comprises a solder (Solder) on the surface on which the fine LED package is to be placed.

According to an aspect of the present invention, the transfer of the transfer of the R LED, G LED, B LED and the driver element to the temporary sheet (Sheet) from the film in which the R LED, G LED, B LED and driver elements are disposed respectively Process and molding the R LED, G LED, B LED and driver elements transferred onto the temporary sheet and the R LED, G LED, B LED for the molded R LED, G LED, B LED and driver elements And generating a micro LED package by dicing the driver elements to include at least one driver element, and moving the micro LED packages generated in the process to the counter substrate, respectively. Provide the production method.

According to one aspect of the invention, the method of producing a fine LED package is characterized in that it further comprises a second moving process for moving the fine LED package on a second substrate.

According to an aspect of the present invention, the method of producing a fine LED package further includes a third moving process of moving a second fine LED package including the fine LED package and the second substrate to the counter substrate. do.

As described above, according to an aspect of the present invention, by producing a micro-sized LED in a chip size package, there is an advantage in terms of production and management of micro LED.

In addition, according to an aspect of the present invention, by producing a chip size package including a driver for controlling each LED with a micro size LED, there is an advantage that can produce a micro LED panel without using a TFT.

1 is a block diagram of a micro LED package production apparatus according to an embodiment of the present invention.
FIG. 2 is a view showing films in which RGB LEDs according to a first embodiment of the present invention are disposed.
3 is a diagram illustrating a process of transferring each RGB LED disposed on a film according to the first embodiment of the present invention to a first temporary sheet.
4 is a diagram illustrating a process of molding a second temporary sheet according to a first embodiment of the present invention.
5 is a diagram illustrating a process of dicing a molded second temporary sheet according to a first embodiment of the present invention.
FIG. 6 is a view showing a process of transferring a fine LED package to a counter substrate according to the first embodiment of the present invention.
FIG. 7 is a diagram illustrating a film in which RGB LEDs and driver elements are respectively disposed according to a second embodiment of the present invention.
8 is a diagram illustrating a process of transferring an RGB LED and a driver element disposed in a film according to a second embodiment of the present invention to a first temporary sheet.
FIG. 9 is a diagram illustrating each process of transferring a fine LED package generated by molding and dicing a second temporary sheet according to a second embodiment of the present invention to a counter substrate.
FIG. 10 illustrates a first temporary sheet and a second temporary sheet on which RGB LEDs according to a third exemplary embodiment of the present invention are disposed.
FIG. 11 is a view illustrating a process of molding a second temporary sheet on which RGB LEDs according to a third embodiment of the present invention are disposed, and transferring the driver element to the second temporary substrate.
FIG. 12 is a diagram illustrating each process of remolding a second temporary sheet and dicing a fine LED package according to a third exemplary embodiment of the present invention to a counter substrate.
FIG. 13 is a view illustrating films in which RGB LEDs and sensors are disposed according to a fourth embodiment of the present invention.
14 is a view illustrating a process of transferring an RGB LED and a sensor disposed on a film according to a fourth embodiment of the present invention to a first temporary sheet.
FIG. 15 illustrates a process of molding a second temporary sheet on which RGB LEDs according to a fourth embodiment of the present invention are disposed, and transferring the driver element to the second temporary sheet.
FIG. 16 illustrates a film in which RGB LEDs, a driver element, and a sensor are disposed according to the fifth embodiment of the present invention.
FIG. 17 is a view illustrating a process of transferring an RGB LED, a driver element, and a sensor disposed on a film according to a fifth embodiment of the present invention to a first temporary sheet.
FIG. 18 is a diagram illustrating each process of transferring a fine LED package generated by molding and dicing a second temporary sheet according to a fifth exemplary embodiment of the present invention to a counter substrate.
FIG. 19 illustrates a first temporary sheet and a second temporary sheet on which RGB LEDs and a sensor according to a sixth embodiment of the present invention are disposed.
FIG. 20 is a view illustrating a process of molding a second temporary sheet on which RGB LEDs and a sensor are disposed, and transferring a driver element to the second temporary sheet according to the sixth embodiment of the present invention.
FIG. 21 illustrates each process of remolding a second temporary sheet according to a sixth embodiment of the present invention and transferring a fine LED package generated by dicing to a counter substrate.
FIG. 22 illustrates a process of transferring a fine LED package to a counter substrate according to a seventh embodiment of the present invention.
FIG. 23 is a diagram illustrating a method of manufacturing a fine LED package according to a first embodiment of the present invention.
24 is a diagram illustrating a method of producing a fine LED package according to a second embodiment of the present invention.
25 is a diagram illustrating a method of manufacturing a fine LED package according to a third embodiment of the present invention.

As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the written description. However, this is not intended to limit the present invention to specific embodiments, it should be understood to include all changes, equivalents, and substitutes included in the spirit and scope of the present invention. In describing the drawings, similar reference numerals are used for similar elements.

Terms such as first, second, A, and B may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component. The term and / or includes a combination of a plurality of related items or any item of a plurality of related items.

When a component is referred to as being "connected" or "connected" to another component, it may be directly connected to or connected to that other component, but it may be understood that other components may be present in between. Should be. On the other hand, when a component is said to be "directly connected" or "directly connected" to another component, it should be understood that there is no other component in between.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. It is to be understood that the term "comprises" or "having" in the present application does not exclude in advance the possibility of the presence or addition of features, numbers, steps, operations, components, parts or combinations thereof described in the specification. .

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art.

Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

1 is a block diagram of a micro LED package production apparatus according to an embodiment of the present invention.

Referring to FIG. 1, the micro LED package production apparatus 100 according to an exemplary embodiment of the present invention may include a laser irradiator 110, a laser scanning unit 120, a substrate transfer unit 130, a sheet transfer unit 140, and a molding unit. 150, the dicing unit 160 and the control unit 170.

The laser irradiation unit 110 includes a light source to irradiate the laser to the outside. The laser irradiation unit 110 irradiates a laser so that each RGB LED, driver element, or sensor can be transferred from the film 125 to the first temporary sheet (not shown) or the second temporary sheet (not shown). The laser irradiator 110 may irradiate the laser directly to the laser scanning unit 120, but in order to prevent the overall size of the laser scanning transfer apparatus 100 from becoming too large, the laser irradiator 110 may indirectly irradiate the laser through the mirror unit 115. Irradiation may be performed by the laser scanning unit 120. The laser irradiator 110 may irradiate a laser having a frequency of the kHz band to the MHz band, and may transfer the transfer object at high speed.

The laser scanning unit 120 controls the laser to be properly irradiated to an appropriate position of the film 125 on which the transfer object (each RGB LED, driver element or sensor) is disposed. The laser scanning unit 120 changes the point to which the laser is irradiated by controlling the direction of the laser so that the transfer object to be actually transferred can be transferred by the laser among all the transfer objects disposed on the film 125. . The laser scanning unit 120 controls the laser direction so that only the transfer object to be actually transferred is transferred to the first temporary sheet (not shown) or the second temporary sheet (not shown).

Here, the film 125 is attached to the lower portion of the laser scanning unit 120, the transfer of the transfer object in the film 125 by the laser proceeds. At this time, the transfer is completed film can be manually replaced by the user or administrator of the fine LED package production apparatus 100, or may be automatically replaced by an external device.

The film 125 may be transmitted through a laser, and may be implemented as long as the material may adhere and transfer the transfer object.

The substrate transfer unit 130 arranges or moves the counter substrate 135 to which the fine LED package is to be transferred to an appropriate position. The substrate transfer unit 130 is disposed while appropriately moving the counter substrate 135 so that the micro LED package can be properly transferred to the position to be transferred. The substrate transfer unit 130 properly positions and moves the counter substrate 135 so that the micro LED package is accurately transferred to the position to be transferred.

In addition, when all of the fine LED package to be transferred to the counter substrate 135 is transferred, the substrate transfer unit 130 is the counter substrate 135, the transfer is all performed for replacement with another counter substrate to be newly transferred; Move to the outside and place the other mating substrate back to the proper position.

The sheet conveying unit 140 allows the respective RGB LEDs, driver elements or sensors to be temporarily disposed or rotated using the first and second temporary sheets. The sheet conveying unit 140 may temporarily transfer each RGB LED, the driver element or the sensor disposed on the film to the first temporary sheet in producing each RGB LED, the driver element or the sensor in a fine LED package. In addition, the first temporary substrate on which each device (each RGB LED, driver device or sensor) is disposed may be rotated and then transferred to the second temporary substrate in order to change the direction of the electrode or to arrange the driver device at the bottom.

On the other hand, the sheet transfer unit 140 transfers the micro LED package produced through the dicing process on the second temporary substrate to the counter substrate 135 on the substrate transfer unit 130.

In addition, the sheet transfer unit 140 may transfer the fine LED package produced through the dicing process to the second substrate (not shown). The second substrate is a substrate for reducing the density of a large number of wirings (electrodes of each element including the RGB LEDs, electrodes for data flow in and out) included in the micro LED package, and is disposed under the micro LED package and paired with a counterpart substrate. This requires only the connection of the electrodes and the electrodes for data flow in and out. Accordingly, the wiring density can be significantly lowered to reduce the cost. The sheet transfer unit 140 may transfer the second micro LED package including the micro LED package and the second substrate to the counter substrate 135.

The molding part 150 molds each device disposed on the second temporary substrate. The molding unit 150 molds each device by using a mold resin. At this time, the powder may be contained in the mold resin. The powder is to prevent the elements located inside the molding from being visible from the outside, and also to prevent the light emitted from the outside from being reflected by each element located inside the molding, for example, carbon black powder. It can be implemented as.

The dicing unit 160 generates the fine LED package by dicing the molded second temporary substrate for each device. For example, when only one RGB LED in the micro LED package is to be included, the dicing unit 160 dices the molded second temporary substrate so that only one RGB LED in each package is included in the micro LED package. Create

The controller 170 controls each component such that the micro LED package including each device or the second micro LED package including each device and the second substrate is generated and transferred to the counter substrate 135. The controller 140 controls the laser irradiator 110 to irradiate a laser to the film 125, and controls the transfer object transfer unit 120 to arrange the film 125 on which each element is disposed as a point to which the laser is irradiated. The substrate transfer unit 130 is controlled so that the micro LED package can be transferred to a position on the counterpart substrate 135 to be transferred. The controller 140 temporarily stores each element by using the first and second temporary sheets. The sheet conveying unit 140 is controlled to be disposed or rotated, the molding unit 150 is controlled to mold each device disposed on the temporary substrate, and the molded temporary substrate is diced for each device to produce a fine LED package. The dicing unit 160 is controlled to generate.

FIG. 2 is a view showing films in which RGB LEDs according to a first embodiment of the present invention are disposed.

Films 125a, 125b, and 125c on which each element (RGB LED, 210, 220, 230) to be included in the fine LED package are disposed are prepared. In the first embodiment, as the RGB LEDs 210, 220, and 230 are included in the micro LED package, the films 125a, 125b, and 125c on which the RGB LEDs are disposed are prepared.

Each of the RGB LEDs 210, 220, 230 is disposed so that each electrode 215, 225, 235 in the LED faces the film 125a, 125b, 125c. Minimizing the exposure of the electrodes 215, 225, and 235 to the outside may reduce the impact that may occur on the electrodes 215, 225, and 235 even during the transfer process.

Each of the RGB LEDs 210, 220, and 230 may be implemented in the form of a flip chip, and each electrode 215, 225, and 235 may be implemented in the form of a pad.

Here, the films 125a, 125b, and 125c may be configured as follows. The films 125a, 125b, and 125c may include a transmissive film and an adhesive layer.

The transmission film may transfer the irradiated laser to the adhesive layer. Transmissive film is implemented in a transparent material or a material that transmits the laser, it can be transmitted to the adhesive layer by transmitting the laser.

The adhesive layer adheres each element (each RGB LED) to have a constant adhesive force, and may expand in volume when heat is generated by laser irradiation or the like. The adhesive layer is positioned on one surface of the transmissive film and has a constant adhesive force so that each device can be disposed on the films 125a, 125b, and 125c. In addition, the adhesive layer has an adhesive force, and may be implemented as a material that expands in volume when heat is generated. When irradiated with a laser beam transmitted through the transmission film, the adhesive layer generates heat by the laser and expands in volume, and maintains the expanded state after the laser is irradiated or shrinks to a certain level in volume. Since the laser has a Gaussian distribution, when the laser is irradiated, only the specific portion is convexly expanded in the form of a Gaussian distribution. The adhesive layer can be expanded in volume by irradiation of a laser so that each element can be transferred to the temporary sheet by narrowing the distance between each element and the temporary sheet. Since the adhesive layer expands in volume and induces transfer, there is no fear of damage to each element as in the prior art. Since the adhesive layer only expands and is not removed by the laser, there is no fear of debris. In addition, conventionally, since a film or the like in which each element is in contact with a laser is removed by using a laser or the adhesion of the film is lowered to induce the transfer, each element is free-falled on the counter substrate so that the transfer proceeds. However, the smaller the size of each element is, the more susceptible it is to free-falling impacts, and there is a risk of damage due to such impacts. On the other hand, since the adhesive layer according to an embodiment of the present invention has a volume expansion, each device is transferred at a minimum distance from the temporary sheet. Accordingly, there is an advantage that can minimize the impact that can occur on each device during the transfer process.

3 is a diagram illustrating a process of transferring each RGB LED disposed on a film according to the first embodiment of the present invention to a first temporary sheet.

The laser scanning unit 120 controls the direction of the laser so that each of the RGB LEDs 210, 220, and 230 disposed on the films 125a, 125b, and 125c is transferred to the first temporary sheet 310. As described above, since the RGB LEDs 210, 220, and 230 in the micro LED package should be included, the laser scanning unit 120 first transfers the R LEDs 210 to the first temporary sheet 310. The direction of the laser is controlled to be transferred at a predetermined interval on the image.

Thereafter, the laser scanning unit 120 controls the direction of the laser so that the G LED 220 is transferred onto the first temporary sheet 310 of the side of the R LED 210, and the B LED 230 is a G LED ( The direction of the laser is controlled to be transferred onto the first temporary sheet 310 on the side of 220. Here, the order in which each of the above-described RGB LEDs are transferred and the order in which they are arranged are merely examples, and the present invention is not limited thereto.

Assuming that only one RGB element is included in the micro LED package, the laser scanning unit 120 controls the direction of the laser so that the R LED adjacent to the B LED 230 is disposed to have a predetermined distance. That is, the laser scanning unit 120 controls the direction of the laser to be transferred at regular intervals between the RGB elements constituting one fine LED package. Accordingly, in later production, by molding and dicing the fine LED package, it is possible to more easily dice and move each fine LED package.

4 is a diagram illustrating a process of molding a second temporary sheet according to a first embodiment of the present invention.

Prior to the molding process, the sheet conveying unit 140 may be configured to change the direction of the electrodes 215, 225, and 235 of the elements 210, 220, and 230 disposed on the first temporary sheet 310. The vertical direction of the sheet 310 is switched. Thereafter, the first temporary sheet 310 and the second temporary sheet 410 are moved so that each element 210, 220, 230 on the first temporary sheet 310 moves on the second temporary sheet 410. The sheet conveying unit 140 adjusts the positions of the first temporary sheet 310 and the second temporary sheet 410 so that the elements 210, 220, and 230 are each seconded by the laser irradiated from the laser irradiation unit 110. Move to the temporary sheet 410. As such, by changing the directions of the electrodes 215, 225, and 235, the electrodes 215, 225, and 235 of the elements 210, 220, and 230 in the micro LED package may be connected to the counter substrate 135.

Thereafter, the molding part 150 molds each of the elements 210, 220, and 230 disposed on the second temporary sheet 410. The molding unit 150 may mold each of the elements 210, 220, and 230 by using a mold resin.

The powder 420 may be included in the mold resin 430. The powder 420 is to prevent the elements located inside the molding 430 from being visible from the outside, and also to prevent the light emitted from the outside from being reflected by each element located inside the molding 430. It may be implemented as carbon black powder.

5 is a diagram illustrating a process of dicing a molded second temporary sheet according to a first embodiment of the present invention.

The dicing unit 160 dicing each of the elements 210, 220, and 230 to be molded into each of the micro LED packages 510, 514, and 518. The RGB devices constituting the one minute LED package by the laser scanning unit 120 have a constant distance from each other. The dicing unit 160 generates each fine LED package 510, 514, 518 by dicing between the RGB elements constituting each of the fine LED packages 510, 514, and 518.

The micro LED package according to an embodiment of the present invention does not include a separate housing, and by molding each device, it does not require a separate accessory member or a secondary process of disposing a housing to be used as the housing. Accordingly, there is an advantage that can easily produce a fine LED package. In addition, even if one LED element fails, since the entire micro LED package needs to be replaced, there is an advantage of easy replacement and management.

FIG. 6 is a view showing a process of transferring a fine LED package to a counter substrate according to the first embodiment of the present invention.

The sheet transfer unit 140 moves the micro LED package 510 produced through the dicing process to the counter substrate 135a.

The counter substrate 135a includes solder 610 on the surface thereof.

The solder 610 is an alloy used for soldering, etc., and serves as an electrode that is connected to the electrodes of the micro LED package 510 to supply power. At the same time, the solder 610 may have a higher adhesive force than that of the film or the temporary sheet. When the micro LED package 510 approaches or contacts the solder 610, the micro LED package 510 may be separated from the film or the temporary sheet to be transferred to the solder 610.

The solder 610 is disposed on the counter substrate 135 at each position where the micro LED package 510 is to be transferred. Typically, since the plurality of fine LED packages 510 are transferred to the counter substrate 135 at regular intervals, the corresponding solder 610 is also disposed on the counter substrate 135 at regular intervals. In addition, the solder 610 is disposed as many as to be connected to the electrodes of each RGB LED included in the fine LED package 510.

The counter substrate 135a is implemented as a control substrate such as a TFT so as to control the micro LED package 510 connected through the solder 610.

As described above, since each of the RGB LED elements is not transferred onto the counter substrate 135a, the fine LED package 510 is configured to transfer the fine LED package 510, thereby eliminating the inconvenience of selectively transferring. Can be. In addition, when a failure occurs in the LED device, it is necessary to remove and transfer the entire fine LED package including the device, without having to selectively remove the device and transfer again, there is an advantage that the ease of management increases.

FIG. 7 is a diagram illustrating a film in which RGB LEDs and driver elements are respectively disposed according to a second embodiment of the present invention.

Films 125a, 125b, 125c, and 125d on which RGB LEDs 210, 220, 230 and driver elements 710 to be included in the fine LED package are disposed are prepared. In the second embodiment, as the driver elements 710 are included together with the RGB LEDs 210, 220, and 230 in the micro LED package, the films 125a, 125b, and 125c on which the RGB LEDs and the driver elements 710 are disposed, respectively. 125d) is prepared.

As in the first embodiment, each RGB LED 210, 220, 230 and driver element 710 are arranged such that the electrodes 215, 225, 235, 715 face the films 125a, 125b, 125c, 125d. do.

8 is a diagram illustrating a process of transferring an RGB LED and a driver element disposed in a film according to a second embodiment of the present invention to a first temporary sheet.

The laser scanning unit 120 irradiates each film such that the RGB LEDs 210, 220, 230 and the driver elements 710 disposed on the films 125a, 125b, 125c, and 125d are transferred to the first temporary sheet 310. Control the direction of the laser to be. As described above, since each of the RGB LEDs 210, 220, 230 and the driver device 710 in the fine LED package should be included, the laser scanning unit 120 first transfers the R LEDs 210. 1 The direction of the laser is controlled to be transferred at a predetermined interval on the temporary sheet 310.

Thereafter, the laser scanning unit 120 controls the direction of the laser so that the G LED 220 is transferred onto the first temporary sheet 310 of the side of the R LED 210, and the B LED 230 is a G LED ( The direction of the laser is controlled to be transferred onto the first temporary sheet 310 on the side of 220. In addition, the flim transport unit 120 controls the direction of the laser so that the driver element 710 is transferred onto the first temporary sheet 310 of the side surface of the B LED 230. Accordingly, the RGB LEDs 210, 220, 230 and the driver element 710 are transferred onto the first temporary sheet 310 by a laser. Here, the order in which each of the above-described RGB LEDs are transferred and the order in which they are arranged are merely examples, and the present invention is not limited thereto.

8 illustrates that the driver device 710 is transferred onto the side surfaces of the RGB LEDs 210, 220, and 230 on the first temporary sheet 310 (in the -x or + x direction in the X axis), but is not limited thereto. The present invention is not limited thereto and may be transferred to the front side (+ y direction) of the RGB LEDs 210, 220 and 230 or the rear side (-y direction) of the RGB LEDs 210, 220 and 230.

FIG. 9 is a diagram illustrating each process of transferring a fine LED package generated by molding and dicing a second temporary sheet according to a second embodiment of the present invention to a counter substrate.

Referring to FIG. 4 and as described above, in order to change the direction of the electrodes 215, 225, 235, and 715 of the elements 210, 220, 230, and 710, the sheet conveying unit 140 may include the first temporary sheet 310. The first temporary sheet 310 and the second temporary sheet 410 are moved so that each element 210, 220, 230, and 710 on the Ny moves on the second temporary sheet 410.

The molding part 150 molds each of the elements 210, 220, 230, and 710 disposed on the second temporary sheet 410. Since the micro LED package according to the second embodiment includes driver elements in addition to the RGB LEDs, all the elements disposed on the second temporary sheet 410 are molded.

The dicing unit 160 dicing each of the devices 210, 220, 230, and 710 to be molded so that each device is included in each of the fine LED packages 910, 914, and 918. Each element constituting one fine LED package by the laser scanning unit 120 has a constant distance from each other. The dicing unit 160 generates each fine LED package 910, 914, 918 by dicing between the RGB elements constituting each of the fine LED packages 910, 914, and 918.

The sheet conveying unit 140 moves each of the fine LED packages 910 produced through the dicing process to the counter substrate 135b. The counter substrate 135b may include a solder 610, and the solder 610 is disposed at each position where the micro LED package 910 is to be transferred onto the counter substrate 135b. Since the fine LED package 910 also includes a driver element 710 in addition to the RGB LEDs 210, 220, and 230, the solder 610 is formed by the electrode and driver elements of each RGB LED included in the fine LED package 910. It is arranged as many as connected to the electrode.

Meanwhile, the counter substrate 135b to which the fine LED package 910 is to be transferred is different from the counter substrate 135a illustrated in FIG. 6. Unlike the fine LED package 510, the fine LED package 910 also includes a driver device 710 in the package 910. Accordingly, the fine LED package 910 does not need to be transferred onto a control board such as a TFT to separately control the RGB LED elements.

As described above, the micro LED has a problem that it is difficult to thermally and mechanically combine with the TFT. Since the fine LED package 910 includes a driver element 710 in the package and does not need to be transferred to a control substrate such as a TFT, a non-TFT substrate may be used as the counter substrate 135b. The fine LED package 910 has an advantage that can easily solve the problem of coupling between the TFT and the micro LED. In addition, since the conventional micro LED had to be transferred onto the TFT, it had a considerable dependence on the TFT production technique, and when a failure occurred in the TFT, there was a problem that it was difficult to repair only the failed TFT by the transferred micro LED. However, since the fine LED package 910 according to an embodiment of the present invention does not need to be transferred onto a control substrate such as a TFT substrate, it has an advantage of solving the above-described problem.

FIG. 10 illustrates a first temporary sheet and a second temporary sheet on which RGB LEDs according to a third exemplary embodiment of the present invention are disposed.

In the third embodiment, a driver element 710 is also included along with each of the RGB LEDs 210, 220, and 230 in the micro LED package. However, in the third embodiment, only the RGB LEDs 210, 220, and 230 are transferred onto the first temporary sheet 310.

Thereafter, the RGB LEDs 210, 220, and 230 are switched by the sheet conveying unit 140 and are moved from the first temporary sheet 310 to the second temporary sheet 1010.

In this case, the second temporary sheet 1010 includes a protrusion 1020 on a surface opposite to the surface where the RGB LEDs 210, 220, and 230 are disposed. The protrusion 1020 protrudes from a position on the opposite surface corresponding to the spacing between which each component to be included in the micro LED package is disposed, whereby the second temporary sheet 1010 corresponds to the opposite of each component to be included in the micro LED package. A groove 1015 is provided on the surface. The protrusion 1020 includes vias 1025 on the surface.

FIG. 11 is a view illustrating a process of molding a second temporary sheet on which RGB LEDs according to a third embodiment of the present invention are disposed, and transferring the driver element to the second temporary substrate.

The molding part 150 molds the RGB LEDs 210, 220, and 230 disposed on one surface of the second temporary sheet 1010.

After the molding process is performed, the sheet conveying unit 140 rotates the second temporary sheet 1010 to be upside down. The sheet conveying unit 140 may rotate the second temporary sheet 1010 to transfer the driver element 710 to the groove 1015 provided in the second temporary sheet 1010. The laser scanning unit 120 controls the direction of the laser so that the driver element 710 can be transferred to the groove 1015 of the second temporary sheet 1010 by the laser. Accordingly, molded RGB LEDs 210, 220, and 230 exist on one surface of the second temporary sheet 1010, and a driver device 710 transferred to the groove 1015 exists on the other surface. The driver element 710 is connected to the RGB LEDs 210, 220, and 230 by the second temporary sheet 1010.

FIG. 12 is a diagram illustrating each process of remolding a second temporary sheet and dicing a fine LED package according to a third exemplary embodiment of the present invention to a counter substrate.

The molding part 150 molds the driver element 710 transferred onto the other surface of the second temporary sheet 1010.

The sheet conveying unit 140 rotates the second temporary sheet 1010, and the dicing unit 160 includes the respective micro LED packages 1210 and 1214 for each of the molded elements 210, 220, 230, and 710. 1218) to be included one by one.

The sheet conveying unit 140 moves each of the fine LED packages 1210, 1214, 1218 produced through the dicing process to the counter substrate 135b. The counter substrate 135b may include a solder 610, and the solder 610 is disposed on the counter substrate 135b at each position where the micro LED package 1210 is to be transferred.

In this case, the counter substrate 135b is connected to the driver device 710 included in the micro LED package using the via 1025. Since the RGB LEDs 210, 220, 230 in the fine LED package are connected to the driver element 710 in the second temporary sheet 1010, the RGB LEDs 210, 220, 230 are separately connected to the counter substrate 135b. It does not have to be connected with. Therefore, only the driver device 710 is connected to the counter substrate 135b through the via 1025 of the micro LED package 1210.

FIG. 13 is a view illustrating films in which RGB LEDs and sensors are disposed according to a fourth embodiment of the present invention.

Films 125a, 125b, 125c, and 125d on which RGB LEDs 210, 220, and 230 and sensors 1310 to be included in the fine LED package are disposed are prepared. In the fourth embodiment, as the sensors 1310 are included together with the RGB LEDs 210, 220, and 230 in the micro LED package, the films 125a, 125b, 125c, respectively, in which the RGB LEDs and the driver elements 710 are disposed, respectively. 125d) is ready.

As in the first embodiment, each of the RGB LEDs 210, 220, 230 and the sensor 1310 are arranged so that the electrodes 215, 225, 235, 715 face the films 125a, 125b, 125c, 125d. .

Here, the sensor 1310 is a sensor that can sense the contact with the LED package such as a finger to detect the coordinates of the contacted area, and includes an optical sensor, a touch sensor, and the like. For example, the sensor 1310 may be implemented as a PD sensor (Photo Diode Sensor) of the optical sensor, and detects whether the light to be irradiated is blocked by the contact area such as a finger, and detects the output degradation due to blocking Get the coordinates of the part. As such, the sensor 1310 may detect the contact to detect the coordinate of the contacted part.

14 is a view illustrating a process of transferring an RGB LED and a sensor disposed on a film according to a fourth embodiment of the present invention to a first temporary sheet.

The laser scanning unit 120 controls the direction of the laser so that the RGB LEDs 210, 220, 230 and the sensors 1310 disposed on the films 125a, 125b, 125c, and 125e are transferred to the first temporary sheet 310. do. Accordingly, the RGB LEDs 210, 220, 230 and the sensor 1310 are transferred to the first temporary sheet 310.

FIG. 15 illustrates a process of molding a second temporary sheet on which RGB LEDs according to a fourth embodiment of the present invention are disposed, and transferring the driver element to the second temporary sheet.

 By the sheet conveying unit 140, the RGB LEDs 210, 220, 230 and the sensor 1310 are changed in direction and are moved from the first temporary sheet 310 to the second temporary sheet 410.

The molding part 150 molds each of the elements 210, 220, 230, and 1310 disposed on the second temporary sheet 410.

The dicing unit 160 dicing each of the devices 210, 220, 230, and 1310 to be molded so that each device is included in each of the fine LED packages 1510, 1514, and 1518.

The sheet conveying unit 140 moves each of the fine LED packages 1510 produced through the dicing process to the counter substrate 135a. Since the driver device is not included in the fine LED package 1510, the counter substrate 135a is implemented as a control substrate such as a TFT substrate.

As such, the sensor includes a sensor for detecting coordinates of a contact and a contact with the RGB LEDs in the micro LED package, and thus, in implementing a display for detecting a touch such as a touch screen using a micro LED, It can solve the spatial and temporal inconvenience of having to go through the process of arranging or arranging sensors.

FIG. 16 illustrates a film in which RGB LEDs, a driver element, and a sensor are disposed according to the fifth embodiment of the present invention.

Films 125a, 125b, 125c, 125d, and 125e on which the RGB LEDs 210, 220, 230, the driver element 710, and the sensor 1310 to be included in the fine LED package are disposed are prepared. In the fifth embodiment, as each of the RGB LEDs 210, 220, 230, the driver element 710, and the sensor 1310 are included in the micro LED package, each element 210, 220, 230, 710, 1310 is included. Each of the placed films 125a, 125b, 125c, 125d, and 125e is prepared.

As in the aforementioned embodiments, each element 210, 220, 230, 710, 1310 is characterized in that each electrode 215, 225, 235, 715, 1315 has a film 125a, 125b, 125c, 125d, 125e. To face.

FIG. 17 is a view illustrating a process of transferring an RGB LED, a driver element, and a sensor disposed on a film according to a fifth embodiment of the present invention to a first temporary sheet.

The laser scanning unit 120 includes all of the RGB LEDs 210, 220, and 230, the driver device 710, and the sensor 1310 disposed on the films 125a, 125b, 125c, 125d, and 125e. The direction of the laser is controlled so as to be transferred.

As described above, the driver element 710 may not necessarily be disposed on the side of the RGB LEDs 210, 2220, and 230.

FIG. 18 is a diagram illustrating each process of transferring a fine LED package generated by molding and dicing a second temporary sheet according to a fifth exemplary embodiment of the present invention to a counter substrate.

 By the sheet conveying unit 140, the RGB LEDs 210, 220, 230, the driver element 710, and the sensor 1310 are redirected and are moved from the first temporary sheet 310 to the second temporary sheet 410. .

The molding part 150 molds each of the elements 210, 220, 230, 710, and 1310 disposed on the second temporary sheet 410.

The dicing unit 160 dicing each of the devices 210, 220, 230, 710, and 1310 to be molded into each of the micro LED packages 1810 and 1815.

The sheet transfer unit 140 moves each of the fine LED packages 1810 produced through the dicing process to the counter substrate 135b. Since the micro LED package 1510 includes the driver device 710, the counter substrate 135b may be implemented as a non-TFT substrate.

FIG. 19 illustrates a first temporary sheet and a second temporary sheet on which RGB LEDs and a sensor according to a sixth embodiment of the present invention are disposed.

In the sixth embodiment, each of the RGB LEDs 210, 220, 230, the driver element 710, and the sensor 1310 in the fine LED package is included. However, in the sixth embodiment, only the RGB LEDs 210, 220, and 230 and the sensor 1310 are transferred onto the first temporary sheet 310.

Thereafter, the RGB LEDs 210, 220, 230 and the sensor 1310 are switched by the sheet conveying unit 140 and are moved from the first temporary sheet 310 to the second temporary sheet 1010.

The second temporary sheet 1010 has protrusions 1020, vias 1025 on the surface of the protrusions 1020 and grooves 1015 between each protrusion.

FIG. 20 is a view illustrating a process of molding a second temporary sheet on which RGB LEDs and a sensor are disposed, and transferring a driver element to the second temporary sheet according to the sixth embodiment of the present invention.

The molding part 150 molds the RGB LEDs 210, 220, and 230 and the sensor 1310 disposed on one surface of the second temporary sheet 1010.

After the molding process is performed, the sheet conveying unit 140 rotates the second temporary sheet 1010 to be upside down. The sheet conveying unit 140 may rotate the second temporary sheet 1010 to transfer the driver element 710 to the groove 1015 provided in the second temporary sheet 1010. The laser scanning unit 120 controls the direction of the laser so that the driver element 710 can be transferred to the groove 1015 of the second temporary sheet 1010 by the laser. Accordingly, molded RGB LEDs 210, 220, and 230 and a sensor 1310 exist on one surface of the second temporary sheet 1010, and a driver element 710 transferred to the groove 1015 exists on the other surface. Done. The driver element 710 is connected to the RGB LEDs 210, 220, 230 and the sensor 1310 by the second temporary sheet 1010.

FIG. 21 illustrates each process of remolding a second temporary sheet according to a sixth embodiment of the present invention and transferring a fine LED package generated by dicing to a counter substrate.

The molding part 150 molds the driver element 710 transferred onto the other surface of the second temporary sheet 1010.

The sheet conveying unit 140 rotates the second temporary sheet 1010, and the dicing unit 160 includes the respective micro LED packages 2110 for each of the molded elements 210, 220, 230, 710, and 1310. 2114 and 2118 to be included one by one.

The sheet conveying unit 140 moves each of the fine LED packages 2110, 2114, and 2118 produced through the dicing process to the counter substrate 135b. In this case, the counter substrate 135b is connected to the driver device 710 included in the micro LED package using the via 1025.

FIG. 22 illustrates a process of transferring a fine LED package to a counter substrate according to a seventh embodiment of the present invention.

The sheet transfer unit 140 may move the fine LED package directly to the counter substrate 135a or 135b. However, the sheet conveying unit 140 may move the fine LED package to the second substrate 2210 according to the seventh embodiment of the present invention and then move to the counter substrate 135a or 135b.

The sheet conveying unit 140 may include the fine LED package 510 according to the first embodiment, the fine LED package 910 according to the second embodiment, the fine LED package 1510 according to the fourth embodiment, or the dicing process is completed. The fine LED package 1810 according to the fifth embodiment is moved to the second substrate 2210. There are many electrodes in the micro LED package. When there is no electrode and a driver element for supplying power to each element, there is an outflow electrode of a data signal to control the operation of each element. As a result, the partner substrate must have a large number of wirings such as solder, so that the wiring density becomes high.

To solve this problem, the sheet transfer unit 140 moves each of the fine LED packages 510, 910, 1510, and 1810 to the second substrate 2210. The second substrate 2210 is a substrate for lowering the above-described wiring density, and each element included in the fine LED package is connected to the second substrate 2210, so that the fine LED package including the second substrate 2210 is formed. It is connected only to the counter substrate 135a or 135b, a pair of power supply electrodes, and a data flow-in / out electrode. Accordingly, the counter substrate 135a or 135b to which the fine LED package including the second substrate 2210 is transferred may have a relatively low wiring density. Referring to FIG. 22, it can be seen that only four solders 610 are provided on the counter substrate 135a or 135b.

The dicing unit 1610 dicing the second substrate 2210 in each of the fine LED packages 510, 910, 1510, and 1810.

The sheet transfer unit 1410 transfers the fine LED package that has undergone the dicing process to the counter substrate 135a or 135b.

FIG. 23 is a diagram illustrating a method of manufacturing a fine LED package according to a first embodiment of the present invention. Since the method of producing the fine LED package according to the first embodiment of the present invention has been described in detail with reference to FIGS. 2 to 6, detailed description thereof will be omitted.

The fine LED package production apparatus 100 transfers the R LEDs, the G LEDs, and the B LEDs to a temporary sheet from the film in which the R LEDs, the G LEDs, and the B LEDs are disposed, respectively (S2310).

The fine LED package production apparatus 100 molds the R LED, the G LED, and the B LED transferred on the temporary sheet (S2320).

The fine LED package production apparatus 100 dices so that each of the R LED, the G LED, and the B LED is included in the molded R LED, the G LED, and the B LED (S2330).

The fine LED package production apparatus 100 moves each diced fine LED package to the counter substrate (S2340).

24 is a diagram illustrating a method of producing a fine LED package according to a second embodiment of the present invention. Since the method for producing the fine LED package according to the second embodiment of the present invention has been described in detail with reference to FIGS. 7 to 9, a detailed description thereof will be omitted.

The fine LED package production apparatus 100 transfers the R LEDs, the G LEDs, the B LEDs, and the drivers to the temporary sheet from the films in which the R LEDs, the G LEDs, the B LEDs, and the drivers are respectively disposed (S2410).

The fine LED package production apparatus 100 molds 2 LEDs, R LEDs, G LEDs, B LEDs, and drivers transferred on the temporary sheet (2420).

The fine LED package production apparatus 100 dices the molded R LED, the G LED, the B LED, and the driver so that at least one of each of the R LED, the G LED, the B LED, and the driver is included (S2430).

The fine LED package producing apparatus 100 moves each diced fine LED package to the counter substrate (S2440).

25 is a diagram illustrating a method of manufacturing a fine LED package according to a third embodiment of the present invention. Since the method for producing the fine LED package according to the third embodiment of the present invention has been described in detail with reference to FIGS. 10 to 12, a detailed description thereof will be omitted.

The fine LED package production apparatus 100 transfers the R LEDs, the G LEDs, and the B LEDs to one surface of the temporary sheet from the films in which the R LEDs, the G LEDs, and the B LEDs are disposed, respectively (S25210).

The fine LED package production apparatus 100 molds the R LED, the G LED, and the B LED transferred to one surface of the temporary sheet (S2520).

Fine LED package production apparatus 100 rotates the temporary sheet so that the temporary sheet is upside down (S2530).

The fine LED package production apparatus 100 transfers the driver to the other side of the temporary sheet (S2540).

The fine LED package production apparatus 100 molds the driver transferred to the other surface of the temporary sheet (S2550).

The fine LED package production apparatus 100 dices the molded R LED, the G LED, the B LED, and the driver so that each of the R LED, the G LED, the B LED, and the driver is included at least one (S2560).

The fine LED package production apparatus 100 moves each diced fine LED package to the counter substrate (S2570).

23 to 25 are described as sequentially executing each process, but this is merely illustrative of the technical idea of an embodiment of the present invention. In other words, a person of ordinary skill in the art to which an embodiment of the present invention belongs may execute the process described in each drawing by changing the order of one or more of the processes without departing from the essential characteristics of the embodiment of the present invention. 23 and 25 are not limited to the time series since the processes may be variously modified and modified to be executed in parallel.

Meanwhile, the processes illustrated in FIGS. 23 to 25 may be embodied as computer readable codes on a computer readable recording medium. The computer-readable recording medium includes all kinds of recording devices in which data that can be read by a computer system is stored. That is, the computer-readable recording medium may be a magnetic storage medium (for example, ROM, floppy disk, hard disk, etc.), an optical reading medium (for example, CD-ROM, DVD, etc.) and a carrier wave (for example, the Internet Storage medium). The computer readable recording medium can also be distributed over network coupled computer systems so that the computer readable code is stored and executed in a distributed fashion.

The above description is merely illustrative of the technical idea of the present embodiment, and those skilled in the art to which the present embodiment belongs may make various modifications and changes without departing from the essential characteristics of the present embodiment. Therefore, the present embodiments are not intended to limit the technical idea of the present embodiment but to describe the present invention, and the scope of the technical idea of the present embodiment is not limited by these embodiments. The scope of protection of the present embodiment should be interpreted by the following claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present embodiment.

100: fine LED package production equipment
110: laser irradiation unit
115: mirror portion
120: film transfer unit
125: film
130: substrate transfer unit
135: counter substrate
140: sheet conveying part
150: molding part
160: dicing part
170: control unit
210: R LED
215, 225, 235, 715, 1315: electrode
220: G LED
230: B LED
310: first temporary sheet
410, 1010: second temporary sheet
420: powder
430: molding
510, 514, 518, 910, 914, 918, 1210, 1214, 1218, 1510, 1514, 1518, 1810, 1815, 2110, 2114, 2118: fine LED package
610: solder
710: driver element
1015: home
1020: protrusion
1025: Via
1310: sensor
2210: second substrate

Claims (7)

In the micro LED package production apparatus,
A laser irradiation unit for irradiating a laser to the outside;
A laser scanning unit for controlling the laser irradiated from the laser irradiation unit to be irradiated to a predetermined position of each film in which the R LED, the G LED, the B LED, and the driver elements are respectively disposed;
A sheet conveying unit for temporarily placing or rotating the fine LED package or the R LED, G LED, B LED and a driver by using a sheet;
A molding part molding the R LED, the G LED, the B LED, and a driver;
A dicing unit for dicing a molded R LED, a G LED, a B LED, and a driver so that each of the R LED, G LED, B LED, and the driver is included in at least one of the micro LED package;
A substrate transfer unit for placing and moving a counter substrate to which the fine LED package is to be transferred; And
The micro LED package is produced such that each of the R LEDs, G LEDs, B LEDs, and drivers is transferred from the film to the sheet, and each of the R LEDs, G LEDs, B LEDs, and drivers is included on the sheet. A control unit for controlling each component in the micro LED package production apparatus so that the micro LED package is transferred from the sheet to the counter substrate;
Each of the R LED, G LED, B LED and the driver element is disposed, each film is fine LED package production apparatus, characterized in that the volume expands when heat is generated. The method of claim 1,
The laser irradiation unit,
Fine LED package production apparatus, characterized in that for controlling the transfer to the fine LED package on the second substrate. The method of claim 2,
The laser irradiation unit,
And controlling a second fine LED package including the fine LED package and the second substrate to be transferred to the counter substrate. The method of claim 1,
The counter substrate,
Micro LED package production apparatus characterized in that it comprises a solder (Solder) on the surface on which the micro LED package is to be placed. A transfer process of transferring the R LED, the G LED, the B LED, and the driver device to a temporary sheet from each film in which the R LED, the G LED, the B LED, and the driver device are disposed;
A molding process of molding the R LED, the G LED, the B LED, and the driver elements transferred onto the temporary sheet;
Generating a fine LED package by dicing a molded R LED, a G LED, a B LED, and a driver device to each include at least one of the R LED, G LED, B LED, and a driver device; And
And moving each of the minute LED packages generated in the generation process to the counter substrate, respectively.
The method of producing a fine LED package, characterized in that each of the films, each of which is disposed R, G, B LED and driver elements are expanded in volume when heat is generated. The method of claim 5,
The method of producing a fine LED package, characterized in that it further comprises a transfer process for transferring the fine LED package on a second substrate. The method of claim 6,
And a second transfer process of transferring a second fine LED package including the fine LED package and the second substrate to the counter substrate.

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