CN208798114U - Projective module group, imaging device and electronic device - Google Patents
Projective module group, imaging device and electronic device Download PDFInfo
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- CN208798114U CN208798114U CN201821670458.8U CN201821670458U CN208798114U CN 208798114 U CN208798114 U CN 208798114U CN 201821670458 U CN201821670458 U CN 201821670458U CN 208798114 U CN208798114 U CN 208798114U
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Abstract
The utility model discloses a kind of projective module group, imaging device and electronic devices.Projective module group includes first circuit board, light source and first support, and light source and first support are arranged in first circuit board, and the surface that first support is bonded with first circuit board is formed with the first groove, and the first groove is for dispensing to bond first support and first circuit board.In the projective module group of the utility model embodiment, the surface that first support is bonded with first circuit board is formed with the first groove, in projective module assembling timing, first groove is filled with adhesive glue to bond first support and first circuit board, adhesive glue can inject the first groove by mode for dispensing glue, increase the contact area of adhesive glue and first support, to increase the adhesion of first circuit board and first support, is conducive to the reliability and product yield that improve projective module group.
Description
Technical field
The utility model relates to image acquisition technology, in particular to a kind of projective module group, imaging device and electronics dress
It sets.
Background technique
In the related technology, the imaging device with three-dimensional information acquisition function can be by a projective module group to scene environment
Middle projection ray, and the light that object reflects is received by a receiving module, thus according to the information of light, for example, ray plot
Case distributed intelligence, light pattern change information or light flight-time information etc., obtain the three-dimensional information of object.Projective module group exists
Usually circuit board and bracket are bonded by adhesive glue in assembling process, however, circuit board and bracket are combined by plane,
When carrying out drop test, it is easy to appear and is bonded bad situation, influence the yield of projective module group.
Utility model content
The embodiments of the present invention provides a kind of projective module group, imaging device and electronic device.
The projective module group of the utility model embodiment includes first circuit board, light source and first support, the light source and
The first support is arranged in the first circuit board, and the surface that the first support is bonded with the first circuit board is formed with
First groove, first groove is for dispensing to bond the first support and the first circuit board.
In the projective module group of the utility model embodiment, the surface that first support is bonded with first circuit board is formed with
One groove, in projective module assembling timing, the first groove is filled with adhesive glue to bond first support and first circuit board, adhesive glue
The first groove can be injected by mode for dispensing glue, increases the contact area of adhesive glue and first support, to increase by the first circuit
The adhesion of plate and first support is conducive to the reliability and product yield that improve projective module group.
In some embodiments, the cross sectional shape of first groove is V-shaped, U-shaped, rectangular, arc or trapezoidal.Such as
This, the first groove can increase the contact area of adhesive glue and first support, increase the glutinous of first circuit board and first support
Put forth effort.
In some embodiments, the first support offer the first accommodating space be connected to first accommodating space
Light hole, the light source is located at first accommodating space, and the light that the light source issues is emitted from the light hole.Such as
This, first support can protect light source, reduce the interference of external environment, improve the reliability of projective module group, the light that light source issues
Line can be emitted in space environment from light hole.
In some embodiments, first groove surrounds shown first accommodating space in a ring.In this way, can make
After first groove is filled with adhesive glue to bond first support and first circuit board, the adhesive glue in the first groove can be with annular
Shape bonding first support and first circuit board, the adhesion of first circuit board and first support can be further increased, favorably
In the reliability and product yield that improve projective module group.
In some embodiments, the projective module group includes translucent element, and the translucent element is located at described first and receives
Hold space, the light that the light source issues is emitted through the translucent element from the light hole.In this way, the light warp that light source issues
Desired drop shadow effect or projection quality can be reached after translucent element.
In some embodiments, the translucent element includes collimation lens, diffuser, diffractive-optical element or light shield.
It is appreciated that different translucent elements can reach different drop shadow effect or projection quality, projective module group be can choose accordingly
Translucent element to adapt to different usage scenarios.
In some embodiments, the light source includes vertical cavity surface emitting laser arrays, the vertical-cavity surface-emitting
Laser array includes multiple vertical cavity surface emitting lasers in array distribution.In this way, using vertical cavity surface emitting laser
Array can satisfy the demand of light source small size as light source, and forming array distribution by multiple vertical cavity surface emitting lasers can
To guarantee the continuity of ray cast.
The imaging device of the utility model embodiment includes projection described in receiving module and any of the above-described embodiment
Mould group.
In the imaging device of the embodiments of the present invention, what the first support of projective module group was bonded with first circuit board
Surface is formed with the first groove, and in projective module assembling timing, the first groove is filled with adhesive glue to bond first support and first
Circuit board, adhesive glue can inject the first groove by mode for dispensing glue, increase the contact area of adhesive glue and first support, thus
The adhesion for increasing first circuit board and first support is conducive to improve projective module group and the reliability and product of imaging device is good
Rate.
In some embodiments, the receiving module includes second circuit board and second support, and the second support is set
It sets in the second circuit board, the surface that the second support is bonded with the second circuit board is formed with the second groove, described
Second groove is for dispensing to bond the second circuit board and the second support.Correspondingly, it when receiving module is assembled, glues
Gum deposit can be filled in the second groove, increase adhesive glue and second support contact area, thus increase second circuit board and
The adhesion of second support is conducive to the reliability and product yield that improve receiving module.
In some embodiments, the second support offers the second accommodating space, and the receiving module includes being located at
Imaging len, optical filter and the imaging sensor of second accommodating space, described image sensor are located at the imaging len
Image side, the optical filter is between the imaging len and described image sensor.In this way, imaging len can be by light
Imaging sensor is converged to, is conducive to receiving module and receives projective module group to project to the light of object back reflection, optical filter can be with
Other light except the light of projective module group projection are filtered out, the interference of other light is avoided, so that imaging sensor acquires light
The image information that line is formed is more accurate.
The electronic device of the embodiments of the present invention includes the dress of imaging described in shell and any of the above-described embodiment
It sets, the imaging device is mounted on the shell.
In the electronic device of the utility model embodiment, the projective module group first support and first circuit board of imaging device
The surface of fitting is formed with the first groove, and in projective module assembling timing, the first groove is filled with adhesive glue to bond first support
And first circuit board, adhesive glue can inject the first groove by mode for dispensing glue, increase the contact surface of adhesive glue and first support
Product, to increase the adhesion of first circuit board and first support, is conducive to the reliability for mentioning electronic device and product yield.
The additional aspect and advantage of the utility model will be set forth in part in the description, partially will be from following description
In become obvious, or recognized by the practice of the utility model.
Detailed description of the invention
In description of the above-mentioned and/or additional aspect and advantage of the utility model from combination following accompanying drawings to embodiment
It will be apparent and be readily appreciated that, in which:
Fig. 1 is the stereoscopic schematic diagram of the projective module group of the utility model embodiment.
Fig. 2 is the top view of the projective module group of the utility model embodiment.
Fig. 3 is diagrammatic cross-section of the projective module group along III-III line of Fig. 2.
Fig. 4 is enlarged diagram of the projective module group in the region IV of Fig. 3.
Fig. 5 is the part amplification profile schematic diagram of the projective module group of the utility model embodiment.
Fig. 6 is another part amplification profile schematic diagram of the projective module group of the utility model embodiment.
Fig. 7 is another part amplification profile schematic diagram of the projective module group of the utility model embodiment.
Fig. 8 is the bottom view of the first support of the utility model embodiment.
Fig. 9 is the stereoscopic schematic diagram of the imaging device of the utility model embodiment.
Figure 10 is the top view of the imaging device of the utility model embodiment.
Figure 11 is diagrammatic cross-section of the imaging device along XI-XI line of Figure 10.
Figure 12 is the structural schematic diagram of the electronic device of the utility model embodiment.
Main element symbol description:
Projective module group 10, first circuit board 12, the upper surface 122 of first circuit board, light source 14, first support 16, first
Groove 162, the lower surface 164 of first support, the first accommodating space 166, light hole 168, translucent element 18；
Imaging device 100, receiving module 20, second circuit board 21, the upper surface 212 of second circuit board, second support 22,
Second groove 222, the second accommodating space 226, imaging len 23, imaging sensor 24, filters at the lower surface 224 of second support
Piece 25；
Electronic device 1000, shell 200.
Specific embodiment
The embodiments of the present invention is described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein
Same or similar label indicates same or similar element or element with the same or similar functions from beginning to end.Lead to below
It crosses the embodiment being described with reference to the drawings to be exemplary, is only used for explaining the utility model, and should not be understood as practical to this
Novel limitation.
The meaning of " plurality " is two or more in the description of the present invention, unless otherwise clearly specific
It limits.
Following disclosure provides many different embodiments or example is used to realize the different structure of the utility model.
In order to simplify the disclosure of the utility model, hereinafter the component of specific examples and setting are described.Certainly, they are only
Example, and purpose does not lie in limitation the utility model.In addition, the utility model can in different examples repeat reference numerals
And/or reference letter, this repetition are for purposes of simplicity and clarity, itself not indicate discussed various embodiments
And/or the relationship between setting.In addition, the example of various specific techniques and material that the utility model provides, but this
Field those of ordinary skill can be appreciated that the application of other techniques and/or the use of other materials.
Also referring to Fig. 1 to Fig. 3, the projective module group 10 of the utility model embodiment includes first circuit board 12, light
Source 14 and first support 16, light source 14 and first support 16 are arranged in first circuit board 12, first support 16 and first circuit board
The surface of 12 fittings is formed with the first groove 162, and the first groove 162 is for dispensing to bond first support 16 and first circuit board
12。
In the projective module group 10 of the utility model embodiment, surface shape that first support 16 is bonded with first circuit board 12
At there is the first groove 162, when projective module group 10 is assembled, the first groove 162 is filled with adhesive glue to bond 16 He of first support
First circuit board 12, adhesive glue can inject the first groove 162 by mode for dispensing glue, and increase adhesive glue connects with first support 16
Contacting surface product is conducive to the reliability for improving projective module group 10 to increase the adhesion of first circuit board 12 and first support 16
And product yield.Wherein, first circuit board 12 can provide support for light source 14 and first support 16, and may be implemented to light source
14 power supply and control.
It, can be with it should be noted that the surface that first support 16 is bonded with first circuit board 12 is formed with the first groove 162
It is that the lower surface 164 of the first support opposite with first circuit board 12 is formed with the first groove 162, is also possible to and first
The upper surface 122 of the opposite first circuit board of frame 16 is formed with the first groove 162, it is also possible that opposite with first circuit board 12
The lower surface 164 of first support be formed with the upper surface of the first groove 162 and the first circuit board opposite with first support 16
122 are formed with the first groove 162.In the illustrated embodiment, the lower surface 164 of the first support opposite with first circuit board 12
It is formed with the first groove 162.
Specifically, when projective module group 10 is assembled, first light source 14 is installed to first circuit board 12, then at first
Adhesive glue on the surface point that frame 16 is bonded with first circuit board 12 so that adhesive glue is filled into the first groove 162, then passes through actively
Contraposition (Active Alignment) is adjusted contraposition to first support 16 and light source 14, after the completion of adjustment, solidifies adhesive glue
Complete the assembly of projective module group 10.
Further, in one example, adhesive glue can be uv-curable glue.In this way, can be irradiated by ultraviolet light
Adhesive glue is solidified, curing mode is simple, convenient for operation.In other examples, adhesive glue is not limited to reality discussed above
Mode is applied, and hot-setting adhesive, anaerobic adhesive or other glue can be used, is not specifically limited herein.
In one example, projective module group 10 carries out thrust test experiments, and adhesion can increase 3kg.In this way, projective module group
10 can pass through drop test, and reliability is more preferably.
Referring to Figure 4 together to Fig. 7, in some embodiments, the cross sectional shape of the first groove 162 can V-shaped, U
Shape, rectangular, arc or trapezoidal etc..In this way, the first groove 162 can increase the contact area of adhesive glue Yu first support 16,
Increase the adhesion of first circuit board 12 and first support 16.Wherein, arc can be arc-shaped,
In some embodiments, first support 16 offer the first accommodating space 166 be connected to the first accommodating space 166
Light hole 168, light source 14 is located at the first accommodating space 166, and the light that light source 14 issues is emitted from light hole 168.
In this way, first support 16 can protect light source 14, the interference of external environment is reduced, improves the reliable of projective module group 10
Property, the light that light source 14 issues can be emitted in space environment from light hole 168.
Referring to Fig. 8, in the illustrated embodiment, the quantity of the first groove 162 is 1, and the first groove 162 encloses in a ring
Around the first accommodating space 166 and positioned at the bottom surface of first support 16.
In this way, after the first groove can be made to fill out 162 filled with adhesive glue to bond first support 16 and first circuit board 12,
Adhesive glue in first groove 162 can further can be increased with the shape bonding first support 16 and first circuit board 12 of annular
Add the adhesion of first circuit board 12 and first support 16, meanwhile, the airtightness 166 of the first accommodating space can be kept, favorably
In the reliability and product yield that improve projective module group 10.
In other embodiments, the quantity of the first groove 162 can be not limited to 1, and can according to need and become
It changes.
In some embodiments, projective module group 10 includes translucent element 18, and translucent element 18 is located at the first accommodating space
166, the light that light source 14 issues is emitted through translucent element 18 from light hole 168.In this way, the light that light source 14 issues is through light transmission member
Desired drop shadow effect or projection quality can be reached after part 18.For example, the light that light source 14 issues can after translucent element 18
To reach desired light distribution, optical density, the uniformity and light pattern, or reach the corresponding depth of field (Depth of Focus,
) and field angle (Field of View, FOV) etc. DOF
In some embodiments, translucent element 18 may include collimation lens (collimator), diffuser
(diffuser), diffractive-optical element (Diffractive Optical Elements, DOE) or light shield (mask) etc..
It is appreciated that different translucent elements 18 can reach different drop shadow effect or projection quality, projective module group 10
Corresponding translucent element 18 be can choose to adapt to different usage scenarios.
When translucent element 18 is collimation lens, the light that can be issued to light source 14 is collimated, and is formed collimated light beam, is subtracted
Few divergence of beam is conducive to improve projection quality.Wherein, collimation lens includes at least one optical lens, in one example,
Collimation lens can be an optical lens.In another example, collimation lens can be the combination of multiple optical lenses.Such as
This, the effect of ray cast can be improved by collimation lens for projective module group 10.Preferably, collimation lens includes 1-3 optics
Lens.The material of optical lens can be the optical materials such as plastics or glass.
When translucent element 18 is diffuser, the optics that light source 14 issues can be diffuseed to form uniform light by diffuser,
Even light refers to the light with certain light distribution, density and the uniformity, and in other words, diffuser can expand light
Dissipate the light for being formed and there is certain light distribution, density and the uniformity.Particularly, in flight time ranging mould group, projection
After the sending uniform light of mould group 10 is irradiated to object, be conducive to the light that receiving module 20 receives object reflection, when improving flight
Between ranging mould group detection effect.
In one example, diffuser can be made by increasing scattering material in material layer, or by superficial layer
It does scattering properties to be made, or is made by designing diffraction micro structural on surface, or by designing microlens array on surface
((Micro Lens Array, MLA) refraction micro-structure is made.Specifically, diffuser can be according to different purposes and optics need
It asks and selects different designs, can satisfy more scene demands.
When translucent element 18 is diffractive-optical element, the light that light source 14 issues can be formed through diffractive-optical element diffraction
Pattern light when pattern light is projected to space, is formed by speckle difference in different spatial positions.In this way, projection
Mould group 10 is applied in pattern optical mode group, can be obtained by the distribution and shape of speckle in the light of detection object reflection
The three-dimensional information of object.
When translucent element 18 is light shield, light shield includes transparent area and shading region, and transparent area can form structured pattern, light
The light that source 14 issues can project to form the coded structured light with corresponding structured pattern through light shield, and coded structured light is thrown
When being incident upon space, the change in depth of projection can make structured pattern generate variation.In this way, projective module group 10 is applied to coding knot
In structure optical mode group, the structured pattern for the light that can be reflected by detection object changes to obtain the three-dimensional information of object.
Wherein, structured pattern includes but is not limited to grid pattern, dot pattern or line image etc..
In some embodiments, light source 14 includes vertical cavity surface emitting laser arrays, vertical cavity surface emitting laser
Array includes multiple vertical cavity surface emitting lasers in array distribution.
It is appreciated that vertical cavity surface emitting laser is a kind of semiconductor laser of small size, it can be with higher defeated
Power forms array distribution out, for establishing efficient laser light source 14.In this way, vertical-cavity surface-emitting can be used in emitting mould train
Laser array can satisfy the demand of 14 small size of light source as light source 14, and the angle of divergence of vertical cavity surface emitting laser
Degree is smaller, and light continuity and projected area can be guaranteed by forming array distribution by multiple vertical cavity surface emitting lasers.
The imaging device 100 of the utility model embodiment includes the projection of receiving module 20 and any of the above-described embodiment
Mould group 10.
The imaging device 100 of the utility model embodiment can be used for acquiring the three-dimensional information of object, imaging device 100
To receive the light that object reflects by a projection ray into scene environment of projective module group 10, and by a receiving module 20,
Thus according to the information of light, for example, light pattern distributed intelligence, light pattern change information or light flight-time information
Deng obtaining the three-dimensional information of object.
In imaging device 100, the surface that the first support 16 of projective module group 10 is bonded with first circuit board 12 is formed with
First groove 162, when projective module group 10 is assembled, the first groove 162 is filled with adhesive glue to bond first support 16 and first
Circuit board 12, adhesive glue can inject the first groove 162 by mode for dispensing glue, increase the contact surface of adhesive glue and first support 16
Product is conducive to improve projective module group 10 and imaging device 100 to increase the adhesion of first circuit board 12 and first support 16
Reliability and product yield.
In some embodiments, receiving module 20 and projective module group 10 are arranged side by side.In this way, being conducive to projective module group 10
Projection ray is into space and by the light of the object reflection in 20 reception space of receiving module.
In some embodiments, receiving module 20 includes second circuit board 21 and second support 22, and second support 22 is set
It sets in second circuit board 21, the surface that second support 22 is bonded with second circuit board 21 is formed with the second groove 222, the second groove
222 are used for dispensing to bond second circuit board 21 and second support 22.
Correspondingly, when receiving module 20 is assembled, the second groove 222 bonds second support 22 and the filled with adhesive glue
Two circuit boards 21, adhesive glue can inject the second groove 222 by mode for dispensing glue, increase the contact of adhesive glue and second support 22
Area, to increase the adhesion of second circuit board 21 and second support 22, be conducive to the reliability for improving receiving module 20 and
Product yield.Wherein, the assembly method of receiving module 20 can be similar with the assembly method of projective module group 10.
It, can be with it should be noted that the surface that second support 22 is bonded with second circuit board 21 is formed with the second groove 222
It is that the lower surface 224 of the second support opposite with second circuit board 21 is formed with the second groove 222, is also possible to and second
The upper surface 212 of the opposite second circuit board of frame 22 is formed with the second groove 222, it is also possible that opposite with second circuit board
The lower surface 224 of second support is formed with the upper surface 212 of the second groove 222 and the second circuit board opposite with second support 22
It is formed with the second groove 222.In the illustrated embodiment, the lower surface 224 of the second support opposite with second circuit board is formed
There is the second groove 222.
In other embodiments, projective module group 10 and receiving module 20 can share a circuit board, for example, projective module
Group 20 can be set on first circuit board 12.In this way, the structure of imaging device 100 can be made more compact, be conducive into
As the Miniaturization Design of device 100.
In some embodiments, second support 22 offers the second accommodating space 226, and receiving module 20 includes being located at the
The imaging len 23 and imaging sensor 24 of two accommodating spaces 226, imaging sensor 24 are located at the image side of imaging len 23, imaging
Lens 23 are used to incident light converging to imaging sensor 24.
In this way, imaging sensor 24 can acquire the light of object reflection, light can be converged to figure by imaging len 23
As sensor 24, be conducive to the light that receiving module 20 receives the projection of projective module group 10 to object back reflection.
In some embodiments, imaging len 23 includes at least one optical lens.In one example, imaging len
23 can be an optical lens.In another example, imaging len 23 can be the combination of multiple optical lenses.In this way,
The imaging effect of imaging sensor 24 can be improved by imaging len 23 for receiving module 20.
In some embodiments, receiving module 20 includes the optical filter 25 positioned at the second accommodating space 226, optical filter 25
Between imaging len 23 and imaging sensor 24.
In this way, optical filter 25 can make the light of respective wavelength pass through, other light are filtered out, are conducive to improve camera shooting
The accuracy of head mould group detection.
In one example, optical filter 25 can filter out other light except the light of emitting mould train sending, avoid it
The interference of his light, so that the image information that imaging sensor 24 acquires light formation is more accurate.Specifically, emitting mould train can
To emit infrared ray, optical filter 25 can be infrared fileter 25, in this way, infrared fileter 25 can filter out non-infrared light, keep away
Exempt from the interference that non-infrared light acquires image to imaging sensor 24.
The electronic device 1000 of the embodiments of the present invention includes the imaging of shell 200 and any of the above-described embodiment
Device 100, imaging device 100 are mounted on shell 200.
The electronic device 1000 of the utility model embodiment uses the imaging device 100 of the utility model embodiment,
In other words, the imaging device 100 of the utility model embodiment can be applied to the electronics dress of the utility model embodiment
Set 1000.Electronic device 1000 can obtain the three-D profile information of object by imaging device 100, to realize more function
Energy.For example, the three-D profile information of the available face of electronic device 1000, thus realize recognition of face, the function such as face unlock
Energy.
In the electronic device 1000 of the utility model embodiment, the first support 16 and first circuit board of projective module group 10
The surface of 12 fittings is formed with the first groove 162, and when projective module group 10 is assembled, the first groove 162 is filled with adhesive glue with viscous
Close first support 16 and first circuit board 12, adhesive glue can inject the first groove 162 by mode for dispensing glue, increase adhesive glue with
The contact area of first support 16 is conducive to mention electronics dress to increase the adhesion of first circuit board 12 and first support 16
Set 1000 reliability and product yield.
Wherein, shell 200 can protect other electronic components of imaging device 100 and electronic device 1000, reduce extraneous
The interference of environment.
In some embodiments, electronic device 1000 includes but is not limited to mobile phone, tablet computer, laptop, intelligence
The electronic devices such as energy wearable device, door lock, car-mounted terminal, unmanned plane.In the example shown in Figure 12, electronic device 1000 is hand
Machine.
In the description of this specification, reference term " embodiment ", " some embodiments ", " schematically implementation
The description of mode ", " example ", " specific example " or " some examples " etc. means embodiment or example is combined to describe specific
Feature, structure, material or feature are contained at least one embodiment or example of the utility model.In this specification
In, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, the specific spy of description
Sign, structure, material or feature can be combined in any suitable manner in any one or more embodiments or example.
While there has been shown and described that the embodiments of the present invention, those skilled in the art can manage
Solution: a variety of to the progress of these embodiments can change in the case where not departing from the principles of the present invention and objective, modify,
Replacement and variant, the scope of the utility model are defined by the claims and their equivalents.
Claims (11)
1. a kind of projective module group, which is characterized in that including first circuit board, light source and first support, the light source and described
One bracket is arranged in the first circuit board, and it is recessed that the surface that the first support is bonded with the first circuit board is formed with first
Slot, first groove is for dispensing to bond the first support and the first circuit board.
2. projective module group as described in claim 1, which is characterized in that the cross sectional shape of first groove is V-shaped, U-shaped, side
Shape, arc or trapezoidal.
3. projective module group as described in claim 1, which is characterized in that the first support offers the first accommodating space and company
Lead to the light hole of first accommodating space, the light source is located at first accommodating space, and the light that the light source issues is certainly
The light hole outgoing.
4. projective module group as claimed in claim 3, which is characterized in that first groove surrounds first receiving in a ring
Space.
5. projective module group as claimed in claim 3, which is characterized in that the projective module group includes translucent element, the light transmission
Element is located at first accommodating space, and the light that the light source issues is emitted through the translucent element from the light hole.
6. projective module group as claimed in claim 5, which is characterized in that the translucent element includes collimation lens, diffuser, light
Learn diffraction element or light shield.
7. projective module group as described in claim 1, which is characterized in that the light source includes vertical cavity surface emitting laser battle array
Column, the vertical cavity surface emitting laser arrays include multiple vertical cavity surface emitting lasers in array distribution.
8. a kind of imaging device, which is characterized in that including receiving module and the described in any item projective module groups of claim 1-7.
9. imaging device as claimed in claim 8, which is characterized in that the receiving module includes second circuit board and second
Frame, the second support are arranged in the second circuit board, the surface shape that the second support is bonded with the second circuit board
At there is the second groove, second groove is for dispensing to bond the second circuit board and the second support.
10. imaging device as claimed in claim 9, which is characterized in that the second support offers the second accommodating space, institute
Stating receiving module includes imaging len, optical filter and the imaging sensor positioned at second accommodating space, described image sensing
Device is located at the image side of the imaging len, and the optical filter is between the imaging len and described image sensor.
11. a kind of electronic device, which is characterized in that including shell and the described in any item imaging devices of claim 8-10, institute
It states imaging device and is mounted on the shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821670458.8U CN208798114U (en) | 2018-10-15 | 2018-10-15 | Projective module group, imaging device and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821670458.8U CN208798114U (en) | 2018-10-15 | 2018-10-15 | Projective module group, imaging device and electronic device |
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| Publication Number | Publication Date |
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| CN208798114U true CN208798114U (en) | 2019-04-26 |
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| CN201821670458.8U Expired - Fee Related CN208798114U (en) | 2018-10-15 | 2018-10-15 | Projective module group, imaging device and electronic device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111443497A (en) * | 2020-05-13 | 2020-07-24 | 浙江水晶光电科技股份有限公司 | Laser projection module, depth imaging device and conversion lens selection method |
| CN111659588A (en) * | 2020-06-12 | 2020-09-15 | 台州盛林光电科技有限公司 | Assembling method of micro module, micro module and FPC module |
| CN111953875A (en) * | 2020-08-12 | 2020-11-17 | Oppo广东移动通信有限公司 | Depth detection assembly and electronic equipment |
-
2018
- 2018-10-15 CN CN201821670458.8U patent/CN208798114U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111443497A (en) * | 2020-05-13 | 2020-07-24 | 浙江水晶光电科技股份有限公司 | Laser projection module, depth imaging device and conversion lens selection method |
| CN111443497B (en) * | 2020-05-13 | 2023-11-28 | 东莞埃科思科技有限公司 | Laser projection module, depth imaging device and method for selecting conversion lens |
| CN111659588A (en) * | 2020-06-12 | 2020-09-15 | 台州盛林光电科技有限公司 | Assembling method of micro module, micro module and FPC module |
| CN111953875A (en) * | 2020-08-12 | 2020-11-17 | Oppo广东移动通信有限公司 | Depth detection assembly and electronic equipment |
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