KR102050462B1 - Bonded substrate for display panel - Google Patents

Abstract

The bonded substrates for display panels, which enable the bonding panels of the bonded substrates to be improved while producing a display panel having an even cut surface while preventing the sealant spreading defect, are brought into contact with each other along at least one of the first and second directions perpendicular to each other. A first mother substrate having a plurality of panel regions disposed thereon; A second mother substrate including a black mattress defining each of the plurality of panel regions; A sealant guide member formed on the first mother substrate or the second mother substrate to be shared between the panel regions in contact with each other; And a sealant formed on the sealant guide member and surrounding the first and second mother substrates to surround each of the plurality of panel regions, wherein the sealant guide member includes a sealant filling region in which the sealant is filled and the sealant. It is characterized in that it comprises an unfilled sealant unfilled region.

Description

Bonding substrate for display panel {BONDED SUBSTRATE FOR DISPLAY PANEL}

The present invention relates to a bonded substrate for a display panel.

In recent years, the importance of flat panel display devices has increased with the development of multimedia. In response to this, liquid crystal display devices, plasma display devices, organic light emitting display devices, electrophoretic display devices, and the like are commercially available. Such flat panel display devices are manufactured through various manufacturing processes.

For example, the liquid crystal display device may be manufactured through a manufacturing process such as a cell process, a polarizer attaching process, a circuit attaching process, a cell inspection process, a backlight assembly process, and a case assembly process. The cell process includes a thin film transistor array substrate manufacturing process, a color filter array substrate process, a bonding process, a cutting process, an inspection process, and the like.

Among the cell processes, each of the thin film transistor array substrate manufacturing process and the color filter array substrate process are performed on each of the first and second mother substrates divided into a plurality of panel regions to reduce the process time and improve the production yield.

In the cell process, the bonding process is a sealant forming step of forming a sealant on the first or second mother substrate to surround each of the plurality of panel areas, and a liquid crystal dropping step of dropping a liquid crystal into each of the plurality of panel areas. And a yarn curing step of curing the sealant after the first and second mother substrates are opposed to each other, and a cutting process of cutting the bonded first and second mother substrates into a plurality of panel regions to separate the plurality of display panels. Is done.

On the other hand, Patent Application Publication No. 10-2012-0076708 (hereinafter referred to as "prior art document") published by the present applicant discloses a mother substrate for a display panel and a display panel manufacturing method.

The prior art document evenly cuts the surface by forming sealants for partitioning unit substrates disposed adjacent to each other, and forming a blocking member for blocking the cured light along a cutting line for separating the unit substrates. It is possible to manufacture a display panel having, and to reduce the overall size of the mother substrate for the display panel or to manufacture a larger number of unit substrates in the mother substrate for the display panel.

However, in the prior art document, when the first and second mother substrates are bonded, sealant spreading failure may occur due to spreading of the sealant, and the sealant portion corresponding to the cutting schedule line is not cured by blocking the cured light of the blocking member. Bonding force (or adhesive force) of the bonded substrate may be lowered.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is a technical object of the present invention to provide a bonding panel for a display panel which enables to manufacture a display panel having improved bonding strength and an even cut surface while preventing a sealant spreading defect. do.

In addition to the technical task of the present invention mentioned above, other features and advantages of the present invention will be described below, or from such description and description will be clearly understood by those skilled in the art.

According to an aspect of the present invention, a bonded substrate for a display panel includes a first mother substrate having a plurality of panel regions disposed to be in contact with each other in at least one of first and second directions perpendicular to each other; A second mother substrate including a black mattress defining each of the plurality of panel regions; A sealant guide member formed on the first mother substrate or the second mother substrate to be shared between the panel regions in contact with each other; And a sealant formed on the sealant guide member and surrounding the first and second mother substrates to surround each of the plurality of panel regions, wherein the sealant guide member includes a sealant filling region in which the sealant is filled and the sealant. It is characterized in that it comprises an unfilled sealant unfilled region.

The sealant unfilled area may be overlapped with a cutting schedule line for separating the panel area into a display panel.

The sealant guide member may include: an outer dam blocking the sealant from spreading into the panel region; An inner dam spaced apart from the outer dam to provide the sealant unfilled area; And an intermediate dam providing the sealant filling region between the outer dam and the inner dam.

The sealant may be filled in the sealant filling region provided between the internal dam and the intermediate dam to oppose the first and second mother substrates.

Each of the outer dam, the inner dam, and the intermediate dam maintains a cell gap between the first and second mother substrates which are opposed to each other.

The intermediate dam is formed at a lower height than the internal dam.

The sealant guide member may be formed to surround each of the plurality of panel regions.

The second mother substrate is formed with a color filter in the light transmission area defined by the black mattress, a column spacer for maintaining a cell gap between the opposingly bonded first and second mother substrate, The sealant guide member may protrude from the second mother substrate toward the first mother substrate by a stack structure of the black mattress, the color filter, and the column spacer.

And a liquid crystal layer formed between the first and second mother substrates.

According to the means for solving the above problems, the bonded substrate for display panel according to the present invention has the following effects.

First, the sealant spread failure can be prevented and an increase in the bezel width due to the spread of the sealant can be prevented.

Second, the cutting process of separating the bonded substrate into the display panel along the cutting schedule line may be facilitated, and the cut surface of the display panel may be even.

Third, the panel regions are disposed to be in contact with each other so that the sealant forming region is reduced, thereby enabling extreme chamfering, and reducing the overall size of the mother substrate or increasing the number of panel regions formed on the mother substrate.

1 is a plan view illustrating a bonded substrate for a display panel according to an exemplary embodiment of the present invention.
FIG. 2 is a cross-sectional view illustrating one pixel structure formed in the panel region illustrated in FIG. 1.
3 is a cross-sectional view for describing an exemplary embodiment of the sealant guide member illustrated in FIG. 1.
4 is a cross-sectional view for describing a sealant applied to the sealant guide member shown in FIG. 1.
FIG. 5 is a cross-sectional view illustrating a cross-sectional structure of the line II ′ shown in FIG. 1 and cutting of the bonded substrate. FIG.
FIG. 6 is a view for explaining various shapes of the syringe nozzle for forming the sealant shown in FIG. 4.
7 is a view for explaining a modified example of the bonding substrate for a display panel according to an embodiment of the present invention.
8 is a cross-sectional view for describing another example of the sealant guide member illustrated in FIG. 1.

The meaning of the terms described herein will be understood as follows.

Singular expressions should be understood to include plural expressions unless the context clearly indicates otherwise, and the terms “first”, “second”, and the like are intended to distinguish one component from another. The scope of the rights shall not be limited by these terms.

It is to be understood that the term "comprises" or "having" does not preclude the existence or addition of one or more other features or numbers, steps, operations, components, parts or combinations thereof.

The term "at least one" should be understood to include all combinations which can be presented from one or more related items. For example, the meaning of "at least one of a first item, a second item, and a third item" means two items of the first item, the second item, and the third item, as well as two of the first item, the second item, and the third item, respectively. A combination of all items that can be presented from more than one.

The term " on " means to include not only when a configuration is formed directly on top of another configuration but also when a third configuration is interposed between these configurations.

Hereinafter, with reference to the accompanying drawings a preferred embodiment of the display panel bonded substrate and a display panel manufacturing method according to the present invention will be described in detail.

1 is a plan view illustrating a bonded substrate for a display panel according to an exemplary embodiment of the present invention, and FIG. 2 is a cross-sectional view illustrating one pixel structure formed in the panel region illustrated in FIG. 1.

1 and 2, the bonding substrate for a display panel according to an exemplary embodiment of the present invention includes first and second mother substrates 100 and 200, a sealant guide member 300, and a sealant 400. It is composed.

First, the bonded substrate according to the present invention is for manufacturing a flat panel display panel including a liquid crystal display panel, a plasma display panel, an organic light emitting display panel, an electrophoretic display panel and the like. Accordingly, in the following description, it is assumed that the bonded substrate according to the present invention is for manufacturing a liquid crystal display panel.

The first mother substrate 100 may be a first substrate of a liquid crystal display panel, more specifically, a thin film transistor array substrate. The first mother substrate 100 includes a plurality of panel areas PA formed to have the same area or different areas.

Each of the panel areas PA may be disposed on the first mother substrate 100 in a lattice form. In this case, the panel areas PA adjacent to each other in the first direction X of the first mother substrate 100 are disposed to be in contact with each other. The panel areas PA adjacent to each other in the second direction Y of the first mother substrate 100 perpendicular to the first direction X are spaced apart from each other by a predetermined distance.

Each of the panel areas PA includes a display area DA and a non-display area NDA surrounding the display area DA.

The display area DA includes a plurality of gate lines (not shown), a plurality of data lines (not shown) defining a plurality of pixel areas, and a plurality of pixels P formed in each of the plurality of pixel areas. .

Each of the plurality of pixels P may include a thin film transistor TFT, a pixel electrode (not shown), and a common electrode (not shown).

The thin film transistor TFT includes a gate electrode GE formed on the first mother substrate 100 together with the gate line, a gate insulating layer 101 covering the gate line and the gate electrode GE, and the gate electrode. An active layer AL formed on the gate insulating layer 101 so as to overlap the GE, a source electrode SE and a drain electrode DE formed together with the data line so as to be spaced apart from each other on the active layer AL, and an active layer ( And a passivation layer 103 covering the AL, the source electrode SE, and the drain electrode DE. The active layer AL may be formed of a semiconductor material such as a-Si, poly-Si, oxide, or organic.

The pixel electrode is formed on the passivation layer 103 of the opening region, and is electrically connected to the drain electrode DE of the thin film transistor TFT through a contact hole (not shown) formed in the passivation layer 103. . The pixel electrode may be formed in plural to have a straight or curved shape, and may have a single layer or a multilayer structure made of a transparent conductive material or an opaque conductive material.

The common electrode may be formed on the same layer as the gate electrode GE or the pixel electrode PE. Here, when the common electrode is formed on the same layer as the gate electrode GE, the common electrode may be formed in plurality between the plurality of pixel electrodes, or may be formed in a channel to have an area corresponding to the opening area. And may overlap all of the plurality of pixel electrodes. The common electrode is formed on the first mother substrate 100 or the second mother substrate 200 according to the liquid crystal driving mode of the liquid crystal display panel.

The non-display area NDA includes a data pad part PP (not shown) connected to each of the plurality of data lines, and a gate driving circuit (not shown) for supplying a gate signal to each of the plurality of gate lines. Can be.

The data pad part PP includes a plurality of data pads formed in the non-display area NDA on the first side of each panel area PA and connected to each of the plurality of data lines.

The gate driving circuit is formed on the first mother substrate 100 so as to be disposed on one side or both sides of the non-display area NDA of each panel area PA together with the thin film transistor TFT to sequentially process the gate signals. The shift register may be output.

A planarization layer 105 covering the pixel electrode and the passivation layer 103 and a lower alignment layer (not shown) covering the planarization layer 105 are added to the first mother substrate 100 according to the structure of the liquid crystal display panel. The lower alignment layer covering the pixel electrode and the passivation layer 103 may be further formed.

The second mother substrate 200 may be a second substrate of a liquid crystal display panel, more specifically, a color filter array substrate. The second mother substrate 200 includes a black matrix 201, a color filter 203, and an overcoat layer 205.

The black matrix 201 is formed on the second mother substrate 200 to define each of the panel regions PA formed on the first mother substrate 100, and at the same time, each of the plurality of pixels P Define the pixel area. That is, the black matrix 201 is formed to overlap the non-display area NDA, the gate line, the data line, and the thin film transistor TFT of each panel area PA formed on the first mother substrate 100. To define a light transmission area where the color filter is to be formed. The black matrix 201 prevents light leakage in the remaining areas except the light transmission area and absorbs external light.

The color filter 203 is formed in the light transmission area defined by the black matrix 201, and may include red, green, and blue color filter layers corresponding to the color of each pixel P. have.

The overcoat layer 205 is formed to cover the black matrix 201 and the color filter 203 to planarize an opposing surface of the first mother substrate 200 facing the first mother substrate 100.

The second mother substrate 200 may further include a column spacer (not shown) formed at a predetermined height in the overcoat layer 205 overlapping the black matrix 201 to maintain a constant cell gap of the bonded substrate. Can be. In addition, an upper alignment layer (not shown) covering the column spacer and the overcoat layer 205 may be further formed on the second mother substrate 200.

The sealant guide member 300 is formed in the second mother substrate 200 so as to surround each of the panel areas PA to provide a sealant formation area SA. That is, the sealant guide member 300 is formed on the second mother substrate 200 so as to overlap an edge portion (or non-display area) of each of the panel areas PA defined in the first mother substrate 100. And the sealant forming area SA surrounding each of the plurality of panel areas PA. The sealant guide member 300 may be formed to be shared between the adjacent panel areas PA in the first direction X. FIG.

As shown in FIGS. 3 and 4, the sealant guide member 300 according to an exemplary embodiment may include a sealant filled with the sealant 400 for bonding the first and second mother substrates 100 and 200 to each other. The sealant unfilled region overlapping the filling region A1 and the cutting schedule line SL for cutting the opposing bonded first and second mother substrates 100 and 200 into the display panel, and the sealant 400 is not filled. It comprises (A2). To this end, the sealant guide member 300 according to an embodiment may include first and second outer dams 310a and 310b, first and second internal dams 320a and 320b, and first and second intermediate dams 330a. 330b).

Each of the first and second outer dams 310a and 310b is formed to have a predetermined height on the second mother substrate 200 overlapping the non-display area NDA of the panel area PA. Surround area PA. Each of the first and second outer dams 310a and 310b is formed in a closed loop shape to have a trapezoidal cross section to define an outermost line of the sealant forming area SA. Each of the first and second outer dams 310a and 310b prevents the spread of the sealant 400 applied to the sealant forming area SA when the first and second mother substrates 200 are bonded together. It is possible to prevent the sealant spread failure due to the spread of the 400 to the inside of the adjacent panel area PA, and together with the cell gap between the first and second mother substrates 200 bonded together with the liquid crystal layer LC therebetween. It also serves to keep it constant. Furthermore, each of the first and second outer dams 310a and 310b prevents the bezel width of the display panel from being increased as the sealant 400 spreads.

Each of the first and second internal dams 320a and 320b is formed side by side on the second mother substrate 200 between the first and second outer dams 310a and 310b so as to be spaced apart from each other. The sealant unfilled area A2 is provided in SA. In other words, each of the first and second internal dams 320a and 320b is formed at a predetermined height on the second mother substrate 200 so as to overlap an edge portion of the panel area PA. It is formed to have a trapezoidal cross section having the same height as (310a, 310b). The center of each of the first and second internal dams 320a and 320b overlaps the cutting schedule line SL for cutting the opposing first and second mother substrates 100 and 200 into the display panel. .

Each of the first and second intermediate dams 330a and 330b is formed on the second mother substrate 200 between the outer dams 310a and 310b and the internal dams 320a and 320b to form the sealant forming region ( Said sealant filling area A1 is provided in SA). In other words, the first intermediate dam 330a is formed on the second mother substrate 200 between the first outer dam 310a and the first inner dam 320a to seal the sealant filling area A1. To prepare. The second intermediate dam 330b is formed on the second mother substrate 200 between the second outer dam 310b and the second internal dam 320b to provide the sealant filling region A1. do.

Each of the first and second intermediate dams 330a and 330b may have the outer dams 310a and 310b and the internal dams 320a and 320b to maintain a constant cell gap between the first and second mother substrates 200. Or a trapezoid having a height lower than the internal dams 320a and 320b in order to prevent the sealant 400 from filling into the sealant unfilled area A2. It may be formed to have a cross section in the form. In addition, each of the first and second intermediate dams 330a and 330b may be formed in plural to have a predetermined interval.

The sealant filling area A1 is provided between the first internal dam 320a and the first intermediate dam 330a and is provided between the second internal dam 320b and the second intermediate dam 330b. do. Here, the area between the outer dams 310a and 310b and the intermediate dams 330a and 330b may be the sealant filling area A1 or the amount of the sealant 400 applied on the sealant guide member 300. The sealant may be an unfilled area A2.

As described above, each of the dams 310a, 310b, 320a, 320b, 330a, and 330b of the sealant guide member 300 has a color filter layer 203, a column spacer of red, green, and blue on the black matrix 201. , And may be formed to protrude from the second mother substrate 200 toward the first mother substrate 100 by at least two stacked structures of the overcoat layer 205. For example, each of the dams 310a, 310b, 320a, 320b, 330a, and 330b may include at least one color filter layer of the black matrix 201, a color filter layer 203 of red, green, and blue, and a column spacer. Laminated structure; The stack structure of the black matrix 201 and the column space and the stack structure of the black matrix 201 and the overcoat layer 205 may be formed. Here, the patterning process of the column spacer and the overcoat layer 205 may be formed by a diffraction exposure process and an etching process, wherein the diffraction exposure process has a half-tone mask having a light shielding portion and a diffraction exposure portion. Can be used.

In the above description, the sealant guide member 300 is described as being formed to surround each panel area PA. However, the sealant guide member 300 is not limited thereto, and may be formed only in an area overlapping the panel area PA which is in contact with each other. . In this case, the periphery of each panel area PA in which the sealant guide member 300 is not formed is surrounded by the sealant 400. In this case, the sealant 400 is formed at the periphery of each panel area PA in which the sealant guide member 300 is not formed to maintain a cell gap between the first and second mother substrates 100 and 200 to be bonded. A gap retaining member (not shown) may be mixed therein. The gap retaining member may be a metallic ball.

The sealant 400 is coated on the sealant guide member 300 to surround each panel area PA so as to have a dual shape by a seal dispenser device (not shown), so that the first and second mosquitoes The plates 100 and 200 are bonded to each other. Here, the sealant 400 is temporarily cured by photocuring and then completely cured by thermal curing.

Specifically, the sealant 400, as shown in FIGS. 4 and 5, the mountain portions 410a and 410b filled in the sealant filling region A1 of the sealant guide member 300, and the sealant guide. It is applied so as to have a dual shape consisting of the bone portion 420 that is not filled in the sealant unfilled region A2 of the member 300. The sealant 400 having such a dual shape is spread by the pressing force when opposing bonding between the first and second mother substrates 100 and 200 occurs. In this case, each of the dams 310a, The dual shape applied by 310b, 320a, 320b, 330a, and 330b is maintained.

The sealant 400 is discharged from a syringe nozzle (not shown) of the seal dispenser device and coated on the sealant guide member 300, and the double shape according to the shape of the syringe nozzle and / or the number of application of the sealant nozzle. It is applied to have. Accordingly, the acid portions 410a and 410b of the sealant 400 are overfilled and convexly applied to the sealant filling region A1 to be completely cured by the sealant curing process, and thus the first and second mother substrates 100, 200) are bonded to each other. On the other hand, the valley portion 420 of the sealant 400 is concavely applied between the acid portions 410a and 410b so as to be unfilled in the sealant filling area A1 so that the first and second mother substrates are opposed to each other. An empty space is provided between (100, 200) to facilitate the cutting process of separating the bonded substrate into the display panel (DP) along the cutting schedule line (SL), and evenly cut the surface of the display panel (DP).

The mountain portions 410a and 410b of the sealant 400 overfilled and convexly applied to the sealant filling region A1 may be pressed by the pressing force when they are opposed to each other between the first and second mother substrates 100 and 200. It overflows to the filling area A2. As a result, when the sealant 400 overflowing in the sealant filling region A1 is saturated in the unfilled region A2, the double shape of the sealant 400 may not be obtained. Therefore, the coating amount and the width of each of the hill portions 410a and 410b and the valley portion 420 of the sealant 400 are applied to the sealant 400 in which the unfilled area A2 overflows from the sealant filled area A1. Is set so as not to saturate.

The double shape of the sealant 400 according to an exemplary embodiment may include a sealant filling region provided between the first internal dam 320a and the first intermediate dam 330a of the sealant guide member 300 using one syringe nozzle. After first applying the sealant 300 on (A1), the sealant filling region A1 is provided between the second internal dam 320b and the second intermediate dam 330b of the sealant guide member 300. It can be formed by applying the sealant 300 to the secondary. In this case, the valley portion 420 of the sealant 400 may be formed by a part of the sealant 400 that is applied to the sealant filling area A1 first and second.

The double shape of the sealant 400 according to another embodiment may be formed according to the shape of the syringe nozzle 500, as shown in FIG. 6.

The syringe nozzle 500 according to an embodiment may include a discharge port 510 and a discharge blocking member 520. The discharge port 510 is formed in a tubular shape of a circle or polygonal cross section to discharge the sealant 400 on the sealant filling region A1. In addition, the discharge blocking member 520 is installed at the center of the discharge port 510 to block the sealant 400 from being discharged from the central area of the discharge hole 510. As shown in (a) of FIG. 6, the discharge blocking member 520 is formed to have a circular or polygonal column shape and is installed in the central region of the discharge port 510, or (b) and As shown in (c), it may be installed in the discharge port 510 to have a "┃", or "╋" shape. As such, the syringe nozzle 500 according to the exemplary embodiment is applied to the sealant guide member 300 by discharging a larger amount of the sealant 400 than the center portion in the remaining region except the center portion of the discharge port 510. The sealant 400 has a dual shape including the hill portions 410a and 410b and the valley portion 420. In this case, the valley portion 420 of the sealant 400 is formed by the discharge blocking member 520, and is part of the sealant 400 discharged from the discharge port 510 to the sealant filling region A1. Can be formed.

The syringe nozzle 500 according to another embodiment may include first and second discharge ports 510a and 510b and a communicating part 510c, as shown in FIG. 6D. Each of the first and second discharge ports 510a and 510b is formed to be in contact with each other to have a tubular shape of a circle or a polygonal cross section. The communication part 510c is formed at a bonding surface between the first and second discharge ports 510a and 510b to communicate the first and second discharge ports 510a and 510b with each other. As such, the syringe nozzle 500 according to another embodiment discharges a larger amount of the sealant 400 from the first and second discharge ports 510a and 510b than the communicating portion 510c, thereby providing the sealant guide member. The sealant 400 to be applied to the 300 has a dual shape consisting of the hill portions 410a and 410b and the valley portion 420. In this case, the valley portion 420 of the sealant 400 is a sealant filling area A1 in each of the sealant 400 and the first and second discharge ports 510a and 510b discharged through the communicating portion 510c. It may be formed by a part of the sealant 400 is discharged.

Although not shown, the syringe nozzle 500 according to another embodiment may include a pair of discharge holes formed to have a tubular shape of a circle or a polygonal cross section. As such, the syringe nozzle 500 according to another embodiment may discharge the sealant 400 through each of the pair of discharge ports, and thus the sealant 400 applied to the sealant guide member 300 may have a portion 410a, 410b) and the valley portion 420 to have a dual shape. In this case, the valley portion 420 of the sealant 400 may be formed by a portion of the sealant 400 discharged from each of the pair of discharge ports to the sealant filling region A1.

Referring back to FIG. 1, the cutting schedule line SL is set to overlap the sealant unfilled area A2 of the sealant guide member 300. In the case of the second mother substrate 200 described above, the cutting schedule line SL overlaps the sealant unfilled area A2 of the sealant guide member 300 formed to surround each panel area PA. The first to fourth cutting schedule lines SL1, SL2, SL3, and SL4 may be formed. On the other hand, in the case of the first mother substrate 100 described above, the cutting schedule line SL is the second to fourth cutting schedule lines SL2, SL3, SL4 set on the second mother substrate 200. Second to fourth cutting schedule lines SL2, SL3, SL4 overlapping each other, and a fifth cutting schedule line set to one end of each panel area PA in which the data pad part PP described above is formed. It may be made of (SL5).

FIG. 7 illustrates a modified example of the bonding substrate for a display panel according to an exemplary embodiment of the present invention, which is configured by changing an arrangement structure of panel regions formed on each of the first and second mother substrates. Accordingly, in the following description, only the arrangement structure of the panel region will be described.

First, in the bonded substrate for display panel according to the exemplary embodiment of the present invention illustrated in FIG. 1, each of the plurality of panel regions PA is disposed to be in contact with each other in the first direction X, but in the second direction Y. Are arranged to be spaced at regular intervals. This is because the data pads PP formed on the upper sides of the panel areas PA adjacent to each other in the second direction Y are all disposed in the same direction, so that the panel areas PA adjacent to the second direction Y are mutually different. Spaced at regular intervals.

On the other hand, in the bonded substrate for display panel according to the modification of the present invention illustrated in FIG. 7, each of the plurality of panel areas PA is disposed to be in contact with each other in the first direction X, and the second direction Y Adjacent panel areas PA are arranged to be in contact with each other. This is because the data pads PP formed on the upper sides of the panel areas PA adjacent to each other in the second direction Y are disposed in opposite directions to each other. It can be placed in contact. In other words, two panel areas PA adjacent to each other in the second direction Y are arranged to be symmetrical with respect to the center of the first direction X. FIG. Accordingly, the two panel areas PA that are in contact with each other in the first direction X share the third cutting schedule line SL3 described above, and the two panel areas PA that are in contact with each other in the second direction Y. Is to share the above-described second cutting schedule line SL2.

In the above description, the sealant guide member 300 is described as being formed on the second mother substrate 200. However, the present disclosure is not limited thereto, and the sealant guide member 300 may be formed on the first mother substrate 100. It may be. In this case, each of the dams 310a, 310b, 320a, 320b, 330a, and 330b of the sealant guide member 300 may be subjected to the diffraction exposure process and etching of the planarization layer 105 described above as illustrated in FIG. 8. It can be formed by a process. In this case, the diffraction exposure process may use a half-tone mask having a light blocking portion and a diffraction exposure portion.

As described above, the bonded substrate for display panel according to the present invention provides a sealant unfilled area A2 overlapping the cutting schedule line SL, and unfills the sealant 400 in the sealant unfilled area A2. By making it harden | cure by making it harden | cure, the cutting process which isolate | separates a bonding board along the said cut | disconnection scheduled line SL by the display panel DP can be made easy, and the cut surface of a display panel can be made even.

On the other hand, the above description of the present invention has been described on the assumption that the display panel bonding substrate is for manufacturing a liquid crystal display panel, but is not limited thereto, the display panel bonding substrate according to the present invention is an organic light emitting display panel, plasma display It may be for manufacturing a flat panel display panel including a panel, and an electrophoretic display panel. In this case, the configuration of the first and second mother substrates 100 and 200 and the formation method of the sealant guide member 300 may be changed according to the configuration and structure of the flat panel display panel.

The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and it is common in the art that various substitutions, modifications, and changes can be made without departing from the technical matters of the present invention. It will be evident to those who have knowledge of.

100: first mother substrate 200: second mother substrate
300: sealant guide member 310a, 310b: outer dam
320a, 320b: internal dam 330a, 330b: intermediate dam
400: sealant

Claims (9)

A first mother substrate having a plurality of panel regions disposed in contact with each other in at least one of first and second directions perpendicular to each other;
A second mother substrate including a black mattress defining each of the plurality of panel regions;
A sealant guide member formed on the first mother substrate or the second mother substrate to be shared between the panel regions in contact with each other; And
A sealant formed on the sealant guide member while surrounding each of the plurality of panel regions, the sealant facing and bonding the first and second mother substrates to each other;
The sealant guide member may include a sealant filling region in which the sealant is filled, an unfilled sealant region in which the sealant is not filled, an outer dam that prevents the sealant from spreading into the panel region, and is spaced apart from the outer dam. An inner dam providing a filling area, and an intermediate dam providing the sealant filling area between the outer dam and the inner dam,
The sealant unfilled area and a portion of the sealant filled area overlap a cut line for separating the panel area into a display panel,
The intermediate dam is formed at a lower height than the internal dam,
And the outer dam is formed to have a height higher than that of the intermediate dam so as to block the spread of the sealant that flooded the intermediate dam. The method of claim 1,
And the sealant has a double shape including a peak portion filled in the sealant filling region of the sealant guide member and a valley portion not filled in the sealant unfilled region of the sealant guide member. delete The method of claim 1,
And the sealant is filled in the sealant filling region provided between the internal dam and the intermediate dam to oppose the first and second mother substrates. The method of claim 1,
And the outer dam, the inner dam, and the intermediate dam each maintain a cell gap between the opposing first and second mother substrates. delete The method according to any one of claims 1, 2, 4, and 5,
And the sealant guide member is formed to surround each of the plurality of panel regions. The method according to any one of claims 1, 2, 4, and 5,
The second mother substrate is formed with a color filter in the light transmission area defined by the black mattress, a column spacer for maintaining a cell gap between the opposingly bonded first and second mother substrate,
The sealant guide member protrudes from the second mother substrate toward the first mother substrate by a stack structure of the black mattress, the color filter, and the column spacer. The method according to any one of claims 1, 2, 4, and 5,
And a liquid crystal layer formed between the first and second mother substrates.

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