KR102042480B1 - Light emitting device, and lighting system - Google Patents

Abstract

Embodiments relate to a light emitting device package and an illumination system.
The light emitting device package according to the embodiment includes a body; First and second electrodes spaced apart from each other on the body; A light emitting device electrically connected to the first electrode and the second electrode; And a current-carrying variable portion disposed between the first electrode and the second electrode, wherein the current-carrying variable portion includes a coupling member and conductive current-variable particles dispersed in the coupling member. .

Description

Light emitting device package and lighting system {LIGHT EMITTING DEVICE, AND LIGHTING SYSTEM}

Embodiments relate to a light emitting device package, a method for manufacturing the same, and an illumination system.

Light Emitting Device is a pn junction diode that converts electrical energy into light energy. It can be produced by compound semiconductors such as Group III and Group V on the periodic table, and various colors can be realized by adjusting the composition ratio of compound semiconductors. It is possible.

When the forward voltage is applied, the n-layer electrons and the p-layer holes combine to emit energy corresponding to the bandgap energy of the conduction band and the valence band. Is mainly emitted in the form of heat or light, and emits light in the form of light emitting elements.

For example, nitride semiconductors are receiving great attention in the field of optical devices and high power electronic devices due to their high thermal stability and wide bandgap energy. In particular, blue light emitting devices, green light emitting devices, and ultraviolet light emitting devices using nitride semiconductors are commercially used and widely used.

On the other hand, in the case of the light emitting device package, in order to prevent the destruction of the light emitting device due to electrostatic discharge (ESD), an EDS prevention device, for example, a Zener diode or a varistor or the like is mounted.

However, the ESD protection device of the related art has a problem in that a process is added by using die bonding and wire bonding, a mounting area is required, and light loss occurs due to light absorption of the ESD protection device.

Embodiments provide a light emitting device package and a lighting system which can manufacture a compact package by reducing the mounting area of an ESD protection device and increase design freedom.

In addition, the embodiment provides a light emitting device package and a lighting system that can increase the light efficiency by preventing the light loss by the ESD protection device.

In addition, the embodiment is to provide a light emitting device package and lighting system capable of reducing the process time and process cost.

The light emitting device package according to the embodiment includes a body; First and second electrodes spaced apart from each other on the body; A light emitting device electrically connected to the first electrode and the second electrode; And a current-carrying variable portion disposed between the first electrode and the second electrode, wherein the current-carrying variable portion includes a coupling member and conductive current-variable particles dispersed in the coupling member. .

In addition, the light emitting device package according to the embodiment body; First and second electrodes spaced apart from each other on the body; A light emitting device electrically connected to the first electrode and the second electrode; A molding member on the light emitting device; An electrically conductive variable portion disposed between the first electrode and the second electrode may be included, and the first electrode and the second electrode may include protruding electrodes on surfaces facing each other.

In addition, the lighting system according to the embodiment may include a light emitting unit having the light emitting device package.

According to the embodiment, a compact package can be manufactured by eliminating the ESD protection device mounting process and disposing a current-carrying variable portion between the lead frames to reduce the mounting area of the ESD protection device. It is possible to provide a light emitting device package and a lighting system that can be increased.

In addition, according to the embodiment, it is possible to provide a light emitting device package and a lighting system that can increase the light efficiency by preventing the light loss by the ESD protection device by eliminating the ESD protection device mounting process.

In addition, the embodiment omits a separate ESD protection device mounting process and can be omitted in the prior art Zener diode die bonding, wire bonding process by arranging the conduction variable between the lead frame, the light emitting device can reduce the process time and process cost Packages and lighting systems can be provided.

1 is a cross-sectional view of a light emitting device package according to the embodiment.
2 is a partially enlarged view of a light emitting device package according to the first embodiment;
3 is an exemplary manufacturing process of a light emitting device package according to the embodiment.
4 is a surface resistance change amount according to the addition of the electrically conductive variable particles in the light emitting device package according to the embodiment.
5 is a partially enlarged view of a light emitting device package according to a second embodiment;
6 is a partially enlarged view of a light emitting device package according to the third embodiment;
7 is a partially enlarged view of a light emitting device package according to the fourth embodiment;
8 is a partially enlarged view of a light emitting device package according to a fifth embodiment;
9 is a partially enlarged view of a light emitting device package according to a sixth embodiment;
10 is a partially enlarged view of a light emitting device package according to the seventh embodiment;
11 is a partially enlarged view of a light emitting device package according to an eighth embodiment;
12 is a cross-sectional view of a light emitting device package according to another embodiment.
13 is an exemplary view of a lighting apparatus according to the embodiment.

In the description of an embodiment, each layer, region, pattern, or structure is “on / over” or “under” the substrate, each layer, layer, pad, or pattern. In the case where it is described as being formed at, "on / over" and "under" include both "directly" or "indirectly" formed. do. In addition, the criteria for the above / above or below of each layer will be described based on the drawings.

In the drawings, the thickness or size of each layer is exaggerated, omitted, or schematically illustrated for convenience and clarity of description. In addition, the size of each component does not necessarily reflect the actual size.

(Example)

1 is a cross-sectional view of a light emitting device package 200 according to an embodiment.

The light emitting device package 200 according to the embodiment includes a body 205, a first electrode 213 and a second electrode 214 spaced apart from the body 205, and the first electrode 213. And a light emitting device 100 electrically connected to the second electrode 214, a molding member 230 on the light emitting device 100, between the first electrode 213 and the second electrode 214. It may include a current-carrying variable (250) disposed in the.

In detail, the body 205 may be formed of a silicon material, a synthetic resin material, or a metal material. An inclined surface may be formed around the light emitting device 100 to increase light reflectance, but is not limited thereto. .

The first electrode 213 and the second electrode 214 are electrically separated from each other, and serve to provide power to the light emitting device 100. In addition, the first electrode 213 and the second electrode 214 may serve to increase light efficiency by reflecting the light generated from the light emitting device 100, and generated from the light emitting device 100. It may also serve to release heat to the outside.

The first electrode 213 and the second electrode 214 may surround side surfaces of the body 205, and ends thereof may extend to the bottom of the body 205.

The light emitting device 100 may be installed on the body 205 or may be installed on the first electrode 213 or the second electrode 214.

The light emitting device 100 may be a light emitting device of a horizontal type, but is not limited thereto. The light emitting device 100 may be applied to a vertical light emitting device, and may also be applied to a case in which the horizontal light emitting device is mounted in a flip chip form.

The light emitting device 100 may be electrically connected to the first electrode 213 and / or the second electrode 214 by any one of a wire method, a flip chip method, or a die bonding method.

In the embodiment, the light emitting device 100 is illustrated as being electrically connected to the first electrode 213, the second electrode 214, and the wire 240, but is not limited thereto.

The molding member 230 may surround the light emitting device 100 to protect the light emitting device 100. In addition, the molding member 240 may include a phosphor 232 to change the wavelength of the light emitted from the light emitting device 100.

Embodiments provide a light emitting device package and a lighting system capable of manufacturing a compact package by reducing the mounting area of an ESD protection device and increasing design freedom.

In addition, the embodiment provides a light emitting device package and a lighting system that can increase the light efficiency by preventing the light loss by the ESD protection device.

In addition, the embodiment is to provide a light emitting device package and lighting system capable of reducing the process time and process cost.

2 is an enlarged view of a portion A of the light emitting device package according to the first embodiment.

In an embodiment, the energizing variable part 250 may include a coupling member 252 and a conductive variable particle 258 dispersed in the coupling member 252.

The energizable variable particle 258 may include a conductive core 254 and an insulating layer 256 surrounding the conductive core 254.

3 is a diagram illustrating a manufacturing process of the energizing variable particles 258 during the manufacturing process of the light emitting device package according to the embodiment.

According to an embodiment, the conductive core material 254a and the dopant material 256a may be mixed and synthesized. In this case, a solvent and a dispersant may be used for viscosity control and even dispersion. The solvent may be water, ethanol, or the like, and the dispersant may be a surfactant, an acrylic polymer, etc., but is not limited thereto.

For example, a transition metal oxide such as ZnO or SiC may be employed as the conductive core material 254a, and Bi ₂ O ₃ , Co ₃ O ₄ , Mn ₃ O ₄ , Al ₂ O as the dopant material 256a. One or more of _three may be employed, but is not limited thereto.

By mixing the conductive core material 254a and the dopant material 256a by a ball mill, bead mill, or the like, the conductive core material is doped with a dopant material to impart conductivity, thereby forming the conductive core 254, and a part of the dopant material. The residue may be an insulating layer 256 surrounding the conductive core 254.

Through this, the conductive core material may be doped with a dopant material to impart conductivity to become a conductive core, and form an ESD path structure when ESD is applied.

In the embodiment, the electrically conductive variable particle 258 functions as an insulator as a whole by the insulating layer 256 surrounding the conductive core 254, and when the ESD occurs, the insulating layer 256 is destroyed and functions as a conductor to perform ESD protection. have.

The particle size of the energizing variable particle 258 is about 2㎛ ~ 10㎛, Vb (Break down Voltage) can be lowered by decreasing the boundary (Boundary) per unit length as the particle size, Vb through the particle size control Can be controlled.

In an embodiment to control the particle size of the energizing variable particle 258 can be employed to control the particle size, such as Sb ₂ O _3.

4 is a change in surface resistance according to the addition of the electrically conductive variable particles in the light emitting device package according to the embodiment.

In an embodiment, the energizing variable particle 258 may be dispersed in the weight range of about 20 wt% to 50 wt% in the energizing variable part 250 to control the breakdown voltage of the energizing variable part. As shown in FIG. 4, when the addition amount of the energizing variable particle 258 is 20 wt% or more, the change in surface resistance decrease is remarkable, and when the amount of addition of the energizing variable particle 258 exceeds 50 wt%, the amount of addition of the energizing variable particle 254 increases. The critical range is in the case of the weight range of about 20wt% to 50wt% in the energizing variable portion 250.

Thereafter, the energizing variable part 258 and the coupling member 252 are disposed on the first electrode 213 and the second electrode 214 and cured by a spin method, paste printing method, or the like. Can be formed. In this case, a polymer material such as PPE, PPO, PPI, or the like may be added for low temperature curing at about 600 ° C. or lower.

The coupling member 252 may use a material having high heat resistance and a glass transition temperature (Tg) higher than about 150 ° C. (TMA, Thermomechanical Analysis). The coupling member 252 may use a resin, for example, an epoxy resin, and the coupling member may control the breakdown voltage by occupying about 20% wt or less of the energizing variable portion.

The electrical conductivity of the coupling member 252 may be 10 ⁻⁶ to 10 ² S / cm, the conductivity of which tunneling is possible for ESD prevention purposes.

For example, the coupling member 252 serves as a non-conductor in a normal state, but in the overvoltage state, the overcurrent does not flow to the light emitting device 100 due to the tunneling effect, and the first electrode 213 and the first Static electricity may be emitted along a portion of the two electrodes 214 that is grounded (not shown).

In the embodiment, the overvoltage may refer to a range of about 200V to about 500V, but is not limited thereto. The overvoltage is based on the amount or material of the energizing variable particle 258 or the coupling member 252 in the energizing variable part 250. Can vary.

5 is a partially enlarged view A2 of the light emitting device package according to the second embodiment.

The second embodiment can employ the features of the first embodiment.

In some embodiments, the energization variable part 250 may further include an oxide 253 or a conductive material 255 dispersed in the coupling member 252.

For example, a metal oxide 253 such as SiO ₂ , Al ₂ O _3, or the like may be further used for controlling the thermal expansion coefficient of the conduction variable part 250, but embodiments are not limited thereto.

In addition, the embodiment further comprises a conductive material 255 dispersed in the coupling member, lowering the potential barrier of the coupling member 252, the tunneling occurs more smoothly when the ESD is applied to reduce the response time to ESD Can increase.

To this end, the embodiment may be dispersed in the coupling member using a metal material such as Ti, W, or a material such as nano Ag, nano ITO, or CNT as the conductive material 255, but is not limited thereto.

The conductive material 255 may be dispersed in a range of 0.2 wt% to 4.0 wt% to increase a response speed by lowering a response time to ESD.

6 is a partially enlarged view A3 of the light emitting device package according to the third embodiment.

The third embodiment can employ the features of the first to second embodiments.

For example, the light emitting device package according to the third embodiment may include a body 205, a first electrode 213 and a second electrode 214 spaced apart from the body 205, and the first electrode. 213 and a light emitting device 100 electrically connected to the second electrode 214, a molding member 230 on the light emitting device 100, the first electrode 213 and the second electrode ( And a conduction variable part 250 disposed between 214, and the first electrode 213 and the second electrode 214 may include a protruding electrode 215 in a surface facing each other.

For example, as the protruding electrode 215 is provided, the distance between the first electrode 213 and the second electrode 214 may be the shortest distance between the center of each protruding electrode.

According to an embodiment, as shown in FIG. 6, the first electrode 213 and the second electrode 214 include a protruding electrode 215 on a surface facing each other, and the first electrode 213 and the second electrode 213. The distance between the electrodes 214 may be the shortest in the protruding electrode 215 region.

As a result, an electric field concentration phenomenon occurs when the ESD is generated through the first protruding electrode portion 213a of the first electrode and the second protruding electrode portion 214a of the second electrode disposed in the region having the shortest mutual distance. An overcurrent does not flow, and static electricity may be more effectively discharged through the energization variable part 250.

In addition, in an embodiment, the cross section of the protruding electrode 215 may include a triangular cross section, and an electric field concentration phenomenon is effectively induced in the corner region of the triangular facing protruding electrode through the conduction variable part 250. Electrostatic discharge can be maximized.

7 is a partially enlarged view A4 of the light emitting device package according to the fourth embodiment.

The fourth embodiment can employ the features of the first to third embodiments.

In the fourth exemplary embodiment, the energizing variable part 250 is disposed in the protruding electrode 215 region, whereby the energizing variable part 250 is disposed in an area in which an electrostatic discharge function is mainly provided. 258 may be disposed to exhibit optimal efficiency.

In addition, in the embodiment, the energizing variable part 250 includes a reflecting layer (not shown) disposed above the energizing variable particle 258, and the reflecting particles 259 are disposed on the reflecting layer, and the reflecting particles 259. ) Can increase light reflection efficiency, including TiO ₂ , to increase light efficiency.

8 is a partially enlarged view A5 of the light emitting device package according to the fifth embodiment.

The fifth embodiment can employ the features of the first to fourth embodiments.

In the embodiment, the shortest distance between the first electrode 213 and the second electrode 214 is designed so that the distance between each bottom surface is the shortest distance, so that static electricity is discharged as far as possible from the light emitting device 100. You can get out.

9 is a partially enlarged view A6 of the light emitting device package according to the sixth embodiment.

The sixth embodiment can employ the features of the first to fifth embodiments.

In the embodiment, the energizing variable particle 258 of the energizing variable part 250 is mainly disposed in the shortest distance area between the electrodes to obtain optimum efficiency, and at the same time, such as TiO ₂ disposed on the energizing variable particle 258. Including a reflective layer including the reflective particles 259 may increase the light reflection efficiency to increase the light efficiency.

10 is an enlarged view of a portion A7 of the light emitting device package according to the seventh embodiment.

The seventh embodiment can employ the features of the first to sixth embodiments.

In the seventh exemplary embodiment, the energizing variable part 250 contacts the upper surface of the first electrode 213 and the upper surface of the second electrode 214, respectively, and the first electrode 213 and the second electrode 214 are in contact with each other. It may be arranged higher than the upper surface of.

The body 205 material may be filled between the first electrode 213 and the side surface of the second electrode 214, and the energizing variable part 250 may protrude to the bottom of the molding part 230.

11 is an enlarged view of a portion A8 of the light emitting device package according to the eighth embodiment.

The eighth embodiment can employ the features of the first to sixth embodiments.

In an eighth embodiment, the energization variable part 250 is disposed between the side surface of the first electrode 213 and the side surface of the second electrode 214, and the bottom surface of the first electrode 213 and the second electrode. By including an area protruding into the body 205 to contact the bottom of the (214), it is possible to efficiently discharge the static electricity through the bottom as well as between the first electrode 213 and the second electrode (214) during the ESD event Can be.

12 is a cross-sectional view of a light emitting device package 202 according to another embodiment.

In another embodiment, the body 205 may include the energizing variable material so that the body 205 may serve as the energizing variable.

For example, the body 205 is a protrusion disposed between the lower body portion 205b and the first electrode 213 and the second electrode 214 surrounded by the first electrode 213 and the second electrode 214. The body portion 205c and the side may include an upper body portion 205a inclined, and the material of the lower body portion 205b and the protruding body portion 205c may include a conductive variable material.

According to the embodiment, a compact package can be manufactured by eliminating the ESD protection device mounting process and disposing a current-carrying variable portion between the lead frames to reduce the mounting area of the ESD protection device. It is possible to provide a light emitting device package and a lighting system that can be increased.

In addition, according to the embodiment, it is possible to provide a light emitting device package and a lighting system that can increase the light efficiency by preventing the light loss by the ESD protection device by eliminating the ESD protection device mounting process.

In addition, the embodiment omits a separate ESD protection device mounting process and can be omitted in the prior art Zener diode die bonding, wire bonding process by arranging the conduction variable between the lead frame, the light emitting device can reduce the process time and process cost Packages and lighting systems can be provided.

A plurality of light emitting devices or light emitting device packages according to the embodiment may be arranged on a substrate, and an optical member such as a lens, a light guide plate, a prism sheet, and a diffusion sheet may be disposed on the light path of the light emitting device package. The light emitting device package, the substrate, and the optical member may function as a light unit. The light unit may be implemented in a top view or a side view type, and may be provided in a display device such as a portable terminal and a notebook computer, or may be variously applied to an illumination device and a pointing device. Yet another embodiment may be implemented as a lighting device including the light emitting device or the light emitting device package described in the above embodiments. For example, the lighting device may include a lamp, a street lamp, a signboard, a headlamp.

13 is an exploded perspective view of the lighting apparatus according to the embodiment.

Referring to FIG. 13, the lighting apparatus according to the embodiment may include a cover 2100, a light source module 2200, a heat radiator 2400, a power supply unit 2600, an inner case 2700, and a socket 2800. Can be. In addition, the lighting apparatus according to the embodiment may further include any one or more of the member 2300 and the holder 2500. The light source module 2200 may include a light emitting device package according to an embodiment.

For example, the cover 2100 may have a shape of a bulb or hemisphere, may be hollow, and may be provided in an open shape. The cover 2100 may be optically coupled to the light source module 2200. For example, the cover 2100 may diffuse, scatter or excite the light provided from the light source module 2200. The cover 2100 may be a kind of optical member. The cover 2100 may be coupled to the heat sink 2400. The cover 2100 may have a coupling part coupled to the heat sink 2400.

An inner surface of the cover 2100 may be coated with a milky paint. The milky paint may include a diffuser to diffuse light. The surface roughness of the inner surface of the cover 2100 may be greater than the surface roughness of the outer surface of the cover 2100. This is for the light from the light source module 2200 to be sufficiently scattered and diffused to be emitted to the outside.

The cover 2100 may be made of glass, plastic, polypropylene (PP), polyethylene (PE), polycarbonate (PC), or the like. Here, polycarbonate is excellent in light resistance, heat resistance, and strength. The cover 2100 may be transparent and opaque so that the light source module 2200 is visible from the outside. The cover 2100 may be formed through blow molding.

The light source module 2200 may be disposed on one surface of the heat sink 2400. Thus, heat from the light source module 2200 is conducted to the heat sink 2400. The light source module 2200 may include a light source unit 2210, a connection plate 2230, and a connector 2250.

The member 2300 is disposed on an upper surface of the heat dissipator 2400, and has a plurality of light source parts 2210 and guide grooves 2310 into which the connector 2250 is inserted. The guide groove 2310 corresponds to the board and the connector 2250 of the light source unit 2210.

The surface of the member 2300 may be coated or coated with a light reflective material. For example, the surface of the member 2300 may be coated or coated with a white paint. The member 2300 is reflected on the inner surface of the cover 2100 to reflect the light returned to the light source module 2200 side again toward the cover 2100. Therefore, it is possible to improve the light efficiency of the lighting apparatus according to the embodiment.

The member 2300 may be made of an insulating material, for example. The connection plate 2230 of the light source module 2200 may include an electrically conductive material. Therefore, electrical contact may be made between the radiator 2400 and the connection plate 2230. The member 2300 may be formed of an insulating material to block an electrical short between the connection plate 2230 and the radiator 2400. The radiator 2400 receives heat from the light source module 2200 and heat from the power supply unit 2600 to radiate heat.

The holder 2500 may block the accommodating groove 2719 of the insulating portion 2710 of the inner case 2700. Therefore, the power supply unit 2600 accommodated in the insulating unit 2710 of the inner case 2700 is sealed. The holder 2500 has a guide protrusion 2510. The guide protrusion 2510 has a hole through which the protrusion 2610 of the power supply unit 2600 passes.

The power supply unit 2600 processes or converts an electrical signal provided from the outside to provide the light source module 2200. The power supply unit 2600 is accommodated in the accommodating groove 2725 of the inner case 2700, and is sealed in the inner case 2700 by the holder 2500.

The power supply unit 2600 may include a protrusion 2610, a guide unit 2630, a base 2650, and an extension unit 2670.

The guide part 2630 has a shape protruding outward from one side of the base 2650. The guide part 2630 may be inserted into the holder 2500. A plurality of parts may be disposed on one surface of the base 2650. The plurality of components may include, for example, a DC converter for converting AC power provided from an external power source into DC power, a driving chip for controlling the driving of the light source module 2200, and an ESD for protecting the light source module 2200. (ElectroStatic discharge) protection element and the like, but may not be limited thereto.

The extension part 2670 has a shape protruding outward from the other side of the base 2650. The extension part 2670 is inserted into the connection part 2750 of the inner case 2700 and receives an electrical signal from the outside. For example, the extension part 2670 may be provided to be equal to or smaller than the width of the connection part 2750 of the inner case 2700. Each end of the "+ wire" and the "-wire" may be electrically connected to the extension 2670, and the other end of the "+ wire" and the "-wire" may be electrically connected to the socket 2800. .

The inner case 2700 may include a molding unit together with the power supply unit 2600 therein. The molding part is a part where the molding liquid is hardened, so that the power supply part 2600 can be fixed inside the inner case 2700.

According to the embodiment, a compact package can be manufactured by eliminating the ESD protection device mounting process and disposing an electrically conductive variable part between the lead frames to reduce the mounting area of the ESD protection device. It is possible to provide a light emitting device package and a lighting system that can be increased.

In addition, according to the embodiment, it is possible to provide a light emitting device package and a lighting system that can increase the light efficiency by preventing the light loss by the ESD protection device by eliminating the ESD protection device mounting process.

In addition, the embodiment omits a separate ESD protection device mounting process and can be omitted in the prior art Zener diode die bonding, wire bonding process by arranging the conduction variable between the lead frame, the light emitting device can reduce the process time and cost Packages and lighting systems can be provided.

Features, structures, effects, etc. described in the above embodiments are included in at least one embodiment, but are not necessarily limited to one embodiment. Furthermore, the features, structures, effects, and the like illustrated in the embodiments may be combined or modified with respect to other embodiments by those skilled in the art to which the embodiments belong. Therefore, it should be interpreted that the contents related to this combination and modification are included in the scope of the embodiments.

Although the embodiments have been described above, the embodiments are only examples, and are not intended to limit the embodiments. Those skilled in the art to which the embodiments belong will not necessarily deviate from the essential features of the embodiments. It will be appreciated that eggplant modifications and applications are possible. For example, each component specifically shown in the embodiment can be modified. And differences relating to these modifications and applications will have to be construed as being included in the scope of the embodiments set forth in the appended claims.

Body 205, first electrode 213 and second electrode 214,
Light emitting device 100, molding member 230,
Energized variable part 250, coupling member 252
Conducting variable particle 258, conductive core 254, insulating layer 256,
Protruding electrode 215

Claims (14)

Body;
First and second electrodes spaced apart from each other on the body;
A light emitting device electrically connected to the first electrode and the second electrode; And
And a current-carrying variable portion disposed between the first electrode and the second electrode.
The energizing variable part includes a coupling member, and an electrically conductive variable particle dispersed in the coupling member.
The energizing variable particles,
Conductive cores; And
Light emitting device package comprising a; insulating layer surrounding the conductive core. Body;
First and second electrodes spaced apart from each other on the body;
A light emitting device electrically connected to the first electrode and the second electrode; And
And a current-carrying variable portion disposed between the first electrode and the second electrode.
The energizing variable part includes a coupling member, and the energizing variable particles dispersed in the coupling member,
The energizing variable part further comprises a reflective layer disposed above the energizing variable particle. According to claim 1,
The conductive core is
A light emitting device package in which a dopant of any one of Bi ₂ O ₃ , Co ₃ O ₄ , Mn ₃ O ₄ , and Al ₂ O ₃ is doped in a conductive core material made of transition metal oxide or SiC. The method according to claim 1 or 2,
The energizing variable part
Light emitting device package further comprises an oxide or conductive material dispersed in the coupling member. The method according to claim 1 or 2,
The first electrode and the second electrode includes a protruding electrode on the surface facing each other,
The light emitting device package having the shortest distance between the first electrode and the second electrode between the protruding electrode of the first electrode and the second electrode. The method according to claim 1 or 2,
A light emitting device in which the distance between the first electrode and the second electrode disposed on both sides of the conduction variable part becomes longer from the bottom surface of the first electrode and the second electrode toward the top surface of the first electrode and the second electrode. package. The method according to claim 1 or 2,
The energizing variable part
The light emitting device package disposed above the upper surface of the first electrode and the second electrode while being in contact with the upper surface of the first electrode and the upper surface of the second electrode. The method according to claim 1 or 2,
The energizing variable part
It is disposed between the side of the first electrode and the side of the second electrode,
And a region protruding into the body so as to contact the bottom surface of the first electrode and the bottom surface of the second electrode. The method according to claim 1 or 2,
The body is
A light emitting device package comprising the conductive variable part material. Body;
First and second electrodes spaced apart from each other on the body;
A light emitting device electrically connected to the first electrode and the second electrode;
A molding member on the light emitting device;
And a current-carrying variable portion disposed between the first electrode and the second electrode.
The first electrode and the second electrode is a light emitting device package including a protruding electrode on the surface facing each other. The method of claim 10,
The distance between the first electrode and the second electrode is
The shortest light emitting device package in the protruding electrode region. The method according to any one of claims 10 to 11,
The energizing variable part is a light emitting device package including a coupling member, and the conductive variable particles dispersed in the coupling member. The method of claim 12,
The energizing variable particles,
Conductive cores; And
Light emitting device package comprising a; insulating layer surrounding the conductive core. An illumination system comprising a light emitting unit comprising the light emitting device package according to claim 1.

Images