KR102040263B1 - Surface protecting adhesive film for semiconductor wafer - Google Patents
Surface protecting adhesive film for semiconductor wafer Download PDFInfo
- Publication number
- KR102040263B1 KR102040263B1 KR1020160033462A KR20160033462A KR102040263B1 KR 102040263 B1 KR102040263 B1 KR 102040263B1 KR 1020160033462 A KR1020160033462 A KR 1020160033462A KR 20160033462 A KR20160033462 A KR 20160033462A KR 102040263 B1 KR102040263 B1 KR 102040263B1
- Authority
- KR
- South Korea
- Prior art keywords
- meth
- acrylate
- monomer
- semiconductor wafer
- alkyl
- Prior art date
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 89
- 239000002313 adhesive film Substances 0.000 title claims abstract description 65
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 171
- 239000010410 layer Substances 0.000 claims abstract description 157
- 239000000178 monomer Substances 0.000 claims abstract description 114
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 79
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 61
- 239000012790 adhesive layer Substances 0.000 claims abstract description 58
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims abstract description 43
- 239000000203 mixture Substances 0.000 claims abstract description 37
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 32
- 229920000642 polymer Polymers 0.000 claims abstract description 31
- 230000009477 glass transition Effects 0.000 claims abstract description 23
- 238000003860 storage Methods 0.000 claims abstract description 22
- 125000000524 functional group Chemical group 0.000 claims abstract description 19
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 17
- 238000000016 photochemical curing Methods 0.000 claims abstract description 16
- 125000002723 alicyclic group Chemical group 0.000 claims abstract description 15
- 239000011254 layer-forming composition Substances 0.000 claims abstract description 13
- 125000004178 (C1-C4) alkyl group Chemical group 0.000 claims abstract description 10
- 239000012948 isocyanate Substances 0.000 claims abstract description 8
- 150000002513 isocyanates Chemical class 0.000 claims abstract description 8
- 229920005989 resin Polymers 0.000 claims abstract description 7
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- 239000011229 interlayer Substances 0.000 claims abstract description 5
- -1 acryloxy ethyl isocyanurate Chemical compound 0.000 claims description 45
- 238000000034 method Methods 0.000 claims description 41
- 230000008569 process Effects 0.000 claims description 25
- 238000000227 grinding Methods 0.000 claims description 17
- 239000003999 initiator Substances 0.000 claims description 9
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- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 claims description 6
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 claims description 5
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 4
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 claims description 4
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical compound C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 claims description 4
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 claims description 4
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- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 claims description 4
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- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 4
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims description 4
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 claims description 4
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 claims description 3
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 3
- OTLDLKLSNZMTTA-UHFFFAOYSA-N octahydro-1h-4,7-methanoindene-1,5-diyldimethanol Chemical compound C1C2C3C(CO)CCC3C1C(CO)C2 OTLDLKLSNZMTTA-UHFFFAOYSA-N 0.000 claims description 3
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- ZXHZWRZAWJVPIC-UHFFFAOYSA-N 1,2-diisocyanatonaphthalene Chemical compound C1=CC=CC2=C(N=C=O)C(N=C=O)=CC=C21 ZXHZWRZAWJVPIC-UHFFFAOYSA-N 0.000 claims description 2
- YCPMSWJCWKUXRH-UHFFFAOYSA-N 2-[4-[9-[4-(2-prop-2-enoyloxyethoxy)phenyl]fluoren-9-yl]phenoxy]ethyl prop-2-enoate Chemical compound C1=CC(OCCOC(=O)C=C)=CC=C1C1(C=2C=CC(OCCOC(=O)C=C)=CC=2)C2=CC=CC=C2C2=CC=CC=C21 YCPMSWJCWKUXRH-UHFFFAOYSA-N 0.000 claims description 2
- RDFQSFOGKVZWKF-UHFFFAOYSA-N 3-hydroxy-2,2-dimethylpropanoic acid Chemical compound OCC(C)(C)C(O)=O RDFQSFOGKVZWKF-UHFFFAOYSA-N 0.000 claims description 2
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 claims description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 claims description 2
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- IIGAAOXXRKTFAM-UHFFFAOYSA-N N=C=O.N=C=O.CC1=C(C)C(C)=C(C)C(C)=C1C Chemical compound N=C=O.N=C=O.CC1=C(C)C(C)=C(C)C(C)=C1C IIGAAOXXRKTFAM-UHFFFAOYSA-N 0.000 claims description 2
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- 102000001708 Protein Isoforms Human genes 0.000 claims description 2
- 108010029485 Protein Isoforms Proteins 0.000 claims description 2
- 244000028419 Styrax benzoin Species 0.000 claims description 2
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- 235000008411 Sumatra benzointree Nutrition 0.000 claims description 2
- 239000007983 Tris buffer Substances 0.000 claims description 2
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- 229960002130 benzoin Drugs 0.000 claims description 2
- GPLRAVKSCUXZTP-UHFFFAOYSA-N diglycerol Chemical compound OCC(O)COCC(O)CO GPLRAVKSCUXZTP-UHFFFAOYSA-N 0.000 claims description 2
- 125000005442 diisocyanate group Chemical group 0.000 claims description 2
- 235000019382 gum benzoic Nutrition 0.000 claims description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 claims description 2
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 claims description 2
- 229920001223 polyethylene glycol Polymers 0.000 claims description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 2
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 2
- 229920000098 polyolefin Polymers 0.000 claims description 2
- 235000019260 propionic acid Nutrition 0.000 claims description 2
- 239000000376 reactant Substances 0.000 claims description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 claims description 2
- 239000008096 xylene Substances 0.000 claims description 2
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 claims description 2
- BXGYYDRIMBPOMN-UHFFFAOYSA-N 2-(hydroxymethoxy)ethoxymethanol Chemical compound OCOCCOCO BXGYYDRIMBPOMN-UHFFFAOYSA-N 0.000 claims 1
- WNLRTRBMVRJNCN-UHFFFAOYSA-L adipate(2-) Chemical compound [O-]C(=O)CCCCC([O-])=O WNLRTRBMVRJNCN-UHFFFAOYSA-L 0.000 claims 1
- 229940105990 diglycerin Drugs 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 29
- 238000002360 preparation method Methods 0.000 description 23
- 230000000052 comparative effect Effects 0.000 description 18
- 238000010521 absorption reaction Methods 0.000 description 13
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- 238000001723 curing Methods 0.000 description 7
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- 239000006188 syrup Substances 0.000 description 7
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- 238000012545 processing Methods 0.000 description 6
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- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 4
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- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 3
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 3
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 3
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- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 2
- 125000004400 (C1-C12) alkyl group Chemical group 0.000 description 2
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 description 2
- STFXXRRQKFUYEU-UHFFFAOYSA-N 16-methylheptadecyl prop-2-enoate Chemical compound CC(C)CCCCCCCCCCCCCCCOC(=O)C=C STFXXRRQKFUYEU-UHFFFAOYSA-N 0.000 description 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 2
- 125000006176 2-ethylbutyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(C([H])([H])*)C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 2
- JYSWMLAADBQAQX-UHFFFAOYSA-N 2-prop-2-enoyloxyacetic acid Chemical compound OC(=O)COC(=O)C=C JYSWMLAADBQAQX-UHFFFAOYSA-N 0.000 description 2
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- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- VIBDJEWPNNCFQO-UHFFFAOYSA-N ethane-1,1,2-triol Chemical compound OCC(O)O VIBDJEWPNNCFQO-UHFFFAOYSA-N 0.000 description 2
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- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
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- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
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- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
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- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/10—Homopolymers or copolymers of methacrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/10—Homopolymers or copolymers of methacrylic acid esters
- C09J133/12—Homopolymers or copolymers of methyl methacrylate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- Chemical & Material Sciences (AREA)
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Abstract
Including a base layer, an intermediate layer, and an adhesive layer,
The intermediate layer includes a C1-C14 alkyl group-containing first alkyl (meth) acrylate monomer, a C15-C25 alkyl group-containing second alkyl (meth) acrylate monomer, a first functional group-containing (meth) acrylic monomer and an alicyclic (meth) acrylate A photocured product of the composition for forming an interlayer comprising a first acrylic photocurable polymer of a first monomer component comprising a monomer, a photoinitiator, and a photocuring agent,
The storage modulus of the intermediate layer is 30,000 Pa to 50,000 Pa at 25 ° C.,
The glass transition temperature of the intermediate layer is -35 to -25 ℃,
The adhesive layer is a second monomer component comprising a C1-C4 alkyl group-containing third alkyl (meth) acrylate monomer, a C5-C14 alkyl group-containing fourth alkyl (meth) acrylate monomer and a second functional group-containing (meth) acrylic monomer Pressure-sensitive adhesive formed from a pressure-sensitive adhesive layer-forming composition containing a second acrylic photocurable resin, an isocyanate-based thermosetting agent and a photoinitiator,
The pressure-sensitive adhesive has a peeling force before light irradiation is greater than the peeling force after light irradiation,
The storage modulus of the adhesive layer is 90,000 Pa to 130,000 Pa at 25 ° C.,
The glass transition temperature of the adhesive layer is -40 to -30 ℃
Provided is an adhesive film for protecting a semiconductor wafer surface.
Description
The present invention relates to an adhesive film which serves to protect the surface by attaching to the surface of the semiconductor wafer when it is necessary to protect the surface in processing the semiconductor wafer.
Recently, miniaturization and weight reduction of electronic products have been rapidly progressed, and accordingly, demands for leadlessness, thinning, and high integration of semiconductor packages are increasing. In response to this demand, the demand for large diameter and thinning of the wafer included in the semiconductor package is also increasing.
However, as the diameter increases, wafer damage such as wafer contamination and cracking occurs frequently during the backgrinding process. Accordingly, the role of the adhesive film for protecting the semiconductor wafer surface becomes more important.
The adhesive film for protecting the semiconductor wafer surface may have a multilayer structure, and generally includes a substrate layer serving as a basic support role. This base layer plays an important role in ensuring the stability of the film during the processing of the semiconductor wafer, and the adhesive film is structurally designed so that the adhesive film can be adhered flatly by an appropriate external force and, if necessary, can be peeled off without residue by an appropriate external force. It serves to give suitable rigidity and stretching performance.
One embodiment of the present invention provides a pressure-sensitive adhesive film for protecting the surface of the semiconductor wafer excellent in the step difference absorption ability, there is no residue during peeling.
In one embodiment of the invention,
Including a base layer, an intermediate layer, and an adhesive layer,
The intermediate layer includes a C1-C14 alkyl group-containing first alkyl (meth) acrylate monomer, a C15-C25 alkyl group-containing second alkyl (meth) acrylate monomer, a first functional group-containing (meth) acrylic monomer and an alicyclic (meth) acrylate A photocured product of the composition for forming an interlayer comprising a first acrylic photocurable polymer of a first monomer component comprising a monomer, a photoinitiator, and a photocuring agent,
The storage modulus of the intermediate layer is 30,000 Pa to 50,000 Pa at 25 ° C.,
The glass transition temperature of the intermediate layer is -35 to -25 ℃,
The adhesive layer is a second monomer component comprising a C1-C4 alkyl group-containing third alkyl (meth) acrylate monomer, a C5-C14 alkyl group-containing fourth alkyl (meth) acrylate monomer and a second functional group-containing (meth) acrylic monomer Pressure-sensitive adhesive formed from a pressure-sensitive adhesive layer-forming composition containing a second acrylic photocurable resin, an isocyanate-based thermosetting agent and a photoinitiator,
The pressure-sensitive adhesive has a peeling force before light irradiation is greater than the peeling force after light irradiation,
The storage modulus of the adhesive layer is 90,000 Pa to 130,000 Pa at 25 ° C.,
The glass transition temperature of the adhesive layer is -40 to -30 ℃
Provided is an adhesive film for protecting a semiconductor wafer surface.
The adhesive film for protecting the semiconductor wafer surface may have an excellent step absorption ability and may improve workability when peeling.
1 is a schematic cross-sectional view of an adhesive film for protecting a semiconductor wafer surface according to an embodiment of the present invention.
2 is a schematic cross-sectional view of applying an adhesive film for protecting a semiconductor wafer surface according to another embodiment of the present invention to a semiconductor wafer having bumps formed on one surface thereof.
3 is a schematic cross-sectional view of a semiconductor wafer formed with a predetermined thickness by grinding the back surface after applying the adhesive film for protecting the semiconductor wafer surface to a semiconductor wafer having bumps formed on one surface thereof.
Hereinafter, embodiments of the present invention will be described in detail. However, this is presented as an example, by which the present invention is not limited and the present invention is defined only by the scope of the claims to be described later.
In the drawings of the present specification, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity. In the drawings, the thicknesses of layers and regions are exaggerated for clarity.
Hereinafter, any configuration is formed on the "top (or bottom)" of the substrate or "top (or bottom)" of the substrate means that any configuration is formed in contact with the top (or bottom) of the substrate. However, it is not limited to not including other configurations between the substrate and any configuration formed on (or under) the substrate.
In one embodiment of the invention:
Including a base layer, an intermediate layer, and an adhesive layer,
The intermediate layer includes a C1-C12 alkyl group-containing first alkyl (meth) acrylate monomer, a C15-C25 alkyl group-containing second alkyl (meth) acrylate monomer, a first functional group-containing (meth) acrylic monomer and an alicyclic (meth) acrylate A photocured product of the composition for forming an intermediate layer comprising a first acrylic photocurable polymer of a monomer component comprising a monomer, a photoinitiator and a photocuring agent,
The storage modulus of the intermediate layer is 30,000 Pa to 50,000 Pa at 25 ° C.,
The glass transition temperature of the intermediate layer is -35 to -25 ℃,
The adhesive layer is a second monomer component comprising a C1-C4 alkyl group-containing third alkyl (meth) acrylate monomer, a C5-C14 alkyl group-containing fourth alkyl (meth) acrylate monomer and a second functional group-containing (meth) acrylic monomer Pressure-sensitive adhesive formed from a pressure-sensitive adhesive layer-forming composition containing a second acrylic photocurable resin, an isocyanate-based thermosetting agent and a photoinitiator,
The pressure-sensitive adhesive has a peeling force before light irradiation is greater than the peeling force after light irradiation,
The storage modulus of the adhesive layer is 90,000 Pa to 130,000 Pa at 25 ° C.,
The glass transition temperature of the adhesive layer is -40 to -30 ℃
Provided is an adhesive film for protecting a semiconductor wafer surface.
1 is a schematic cross-sectional view of a pressure-sensitive
In FIG. 1, the
The
In one embodiment, the
In order to perform a back grinding process, a wafer having bumps such as electrodes and circuits formed on one surface thereof is first adhered to the
The
The
Since the thickness of the
The
For example, an acrylic film can be obtained through ultraviolet curing, an ethylene-vinyl acetate copolymer film can be produced by an extrusion process, and a polyurethane film can be produced by a thermosetting process, and furthermore, a polyvinyl chloride film Silver may be formed by a casting process or a calendering process.
The
The
Specifically, the first monomer component includes a C1-C12 alkyl group-containing first alkyl (meth) acrylate monomer, a C15-C25 alkyl group-containing second alkyl (meth) acrylate monomer, a first functional group-containing (meth) acrylic monomer, and It may include an alicyclic (meth) acrylate monomer.
For example, first, the first monomer component is thermally polymerized to obtain a first acrylic photocurable polymer. The obtained first acrylic photocurable polymer may be in the form of oligomers and / or prepolymers according to the degree of polymerization, and unreacted monomers may be mixed together and included in the composition for forming the intermediate layer.
The C1-C14 alkyl group-containing first alkyl (meth) acrylate monomer is, for example, linear or branched C1-C14 alkyl group-containing alkyl (meth) acrylate, specifically, branched C5-C10 alkyl group-containing alkyl (meth) ) Acrylate.
The said 1st alkyl (meth) acrylate monomer is methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, n-butyl, for example. (Meth) acrylate, t-butyl (meth) acrylate, sec-butyl (meth) acrylate, pentyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, 2-ethylbutyl (meth) acrylate , n-octyl (meth) acrylate, isooctyl (meth) acrylate, isononyl (meth) acrylate, lauryl (meth) acrylate, tetradecyl (meth) acrylate and combinations thereof It may include at least one selected.
The C15-C25 alkyl group-containing second alkyl (meth) acrylate monomer is, for example, linear or branched C15-C25 alkyl group-containing alkyl (meth) acrylate, specifically, linear C15-C20 alkyl group-containing alkyl (meth) It may be an acrylate.
The C15-C25 alkyl group-containing second alkyl (meth) acrylate monomer may be, for example, isostearyl acrylate.
The functional group-containing first (meth) acrylic monomer may include one selected from the group consisting of a hydroxy group-containing (meth) acrylic monomer, a carboxyl group-containing (meth) acrylic monomer, a nitrogen-containing (meth) acrylic monomer, and a combination thereof.
As for the said functional group containing 1st (meth) acrylic-type monomer, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6 -Hydroxyhexyl (meth) acrylate, 8-hydroxyoctyl (meth) acrylate, 2-hydroxyethylene glycol (meth) acrylate, 2-hydroxypropylene glycol (meth) acrylate, acrylic acid, methacrylic acid , 2- (meth) acryloyloxy acetic acid, 3- (meth) acryloyloxy propyl acid, 4- (meth) acryloyloxy butyl acid, acrylic acid duplex, itaconic acid, maleic acid, 2-isocy Anatoethyl (meth) acrylate, 3-isocyanatopropyl (meth) acrylate, 4-isocyanatobutyl (meth) acrylate, (meth) acrylamide, N-vinyl pyrrolidone, N- Vinyl caprolactam and one selected from the group consisting of Can.
The alicyclic (meth) acrylate monomer may be a (meth) acrylate containing a C3-C15 alicyclic group.
In one embodiment, the alicyclic (meth) acrylate monomer may be an alicyclic condensed ring-containing acrylate.
The alicyclic (meth) acrylate monomer is, for example, at least one selected from the group consisting of cyclopentyl (meth) acrylate, cyclohexyl (meth) acrylate, isobornyl (meth) acrylate and combinations thereof It may include.
In one embodiment, the first monomer component is 10 to 85% by weight of the first alkyl (meth) acrylate monomer, 1 to 30% by weight of the C15-C25 alkyl group-containing second alkyl (meth) acrylate monomer, first 5 to 25% by weight of the functional group-containing (meth) acrylic monomer and 9 to 35% by weight of the alicyclic (meth) acrylate monomer.
On the other hand, the glass transition temperature increased by the alicyclic (meth) acrylate monomer or the structural unit resulting therefrom is improved by including the alicyclic (meth) acrylate monomer or the structural unit resulting therefrom. To the unwanted level, including the C1-C14 alkyl group-containing first alkyl (meth) acrylate monomers and the C15-C25 alkyl group-containing second alkyl (meth) acrylate monomers or structural units derived therefrom The storage modulus can be controlled by lowering the glass transition temperature. Therefore, the
The C15-C25 alkyl group-containing second alkyl (meth) acrylate monomer contributes to improving interfacial adhesion, and has a relatively low glass transition temperature, thereby providing softness.
The storage modulus is a value corresponding to the initial slope of the tensile curve in the tensile test, the
The storage modulus can be measured using a rheometer.
The glass transition temperature (Tg) can be measured using calorimetry (DSC, differential scanning calorimetry).
By forming the
The degree of polymerization of the first acrylic photocurable polymer may be appropriately selected according to the physical properties of the
The photoinitiator may include, for example, one selected from the group consisting of a benzoin initiator, a hydroxy ketone initiator, an amino ketone initiator, a caprolactam initiator, and a combination thereof.
Commercially available Irgacure # 184 (hydroxycyclohexyl phenylketone) from Ciba Geigy, Irgacure # 907 (2-methyl-1 [4] as a photoinitiator. -(Methylthio) phenyl] -2-morpholino-propan-1-one (2-methyl-1 [4- (methythio) phenyl] -2-morpholino-propan-1-on), Irgacure ) # 500 (hydroxy-ketones and benzo phoenone), Irgacure # 651 (benzildimethyl-ketone), Darocure # 1173 (2-hydroxy 2-hydroxy-2-methyl-1-phenyl-propan-1-one), Darocure # 116, CGI # 1800 (bisacylphosph) Bisacylphosphineoxide) or CGI # 1700 (bisacylphosphine oxide and hydroxy ketone) may be used.
The content of the photoinitiator may be 0.001 to 0.5 parts by weight based on 100 parts by weight of the first acrylic photocurable polymer. By using the photoinitiator in the content ratio of the above range, by forming the
The photocuring agent may adjust the adhesive properties of the pressure-sensitive adhesive composition according to the amount of use, and in some cases may serve to give a crosslinked structure. The photocuring agent may be, for example, a polar monomer such as polyfunctional acrylate, and specifically, 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, neo Pentyl glycol di (meth) acrylate, 1,2-ethylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, 1,12-dodecanediol di (meth) acrylate, neopentyl glycol adipate Di (meth) acrylate, hydroxypivalic acid neopentylglycol di (meth) acrylate, dicyclopentanyl di (meth) acrylate, caprolactone modified dicyclopentenyl di (meth) acrylate, ethylene oxide modified di (Meth) acrylate, di (meth) acryloxy ethyl isocyanurate, allylated cyclohexyl di (meth) acrylate, tricyclodecanedimethanol (meth) acrylate, dimethylol dicyclopentane di (meth) arc Ethylene oxide modified hexahydrophthalic acid di (meth) acrylate, tricyclodecane dimethanol (meth) acrylate, neopentylglycol modified trimethylpropane di (meth) acrylate, adamantane di (meth) acrylate, 9,9-bis [4- (2-acryloyloxyethoxy) phenyl] fluorene, trimethylolpropane tri (meth) acrylate, dipentaerythritol tri (meth) acrylate, propionic acid modified dipenta Risthritol tri (meth) acrylate, pentaerythritol tri (meth) acrylate, propylene oxide modified trimethylolpropane tri (meth) acrylate, tris (meth) acryloxyethyl isocyanurate, diglycerine tetra ( Meta) acrylate, pentaerythritol tetra (meth) acrylate, propionic acid-modified dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylic One selected from the group consisting of latex, caprolactone modified dipentaerythritol hexa (meth) acrylate and urethane (meth) acrylate, which is a reactant of an isocyanate monomer with trimethylolpropane tri (meth) acrylate, and combinations thereof can do.
The content of the photocuring agent may be 0.001 to 0.5 parts by weight based on 100 parts by weight of the first acrylic photocurable polymer. By using the photocuring agent in the content ratio of the above range, by forming the
The
In order to manufacture the
The acrylic syrup formed by partial polymerization of the first monomer component may have a solid content of about 4% to about 40%. Solids may refer to the concentration of the polymer. The acrylic syrup can maintain the stability of the acrylic photocurable polymer obtained by adjusting the degree of polymerization of the solid content concentration to the above range level, and can secure a range of storage modulus with easy step absorption.
Additives added to the composition for forming the intermediate layer, as needed, additives commonly used, such as anti-aging agents, fillers, pigments, colorants, flame retardants, antistatic agents, ultraviolet absorbers and the like function of the adhesive film for protecting the semiconductor wafer surface It can add in the range which does not inhibit. These additives may be used in conventional amounts depending on the kind thereof.
After applying the composition for forming the intermediate layer on the
Specifically, the
The pressure-
The
The pressure-
The second acrylic photocurable resin is obtained by thermal polymerization of the second monomer component. The obtained second acrylic photocurable polymer may be in the form of oligomers and / or prepolymers according to the degree of polymerization, and unreacted monomers may be mixed together and included in the composition for forming the pressure-sensitive adhesive layer.
The C1-C4 alkyl group-containing third alkyl (meth) acrylate monomer may be, for example, linear or branched C1-C4 alkyl group-containing alkyl (meth) acrylate.
The C1-C4 alkyl group-containing third alkyl (meth) acrylate monomer is, for example, methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acryl At least one selected from the group consisting of latex, n-butyl (meth) acrylate, t-butyl (meth) acrylate, sec-butyl (meth) acrylate, and combinations thereof.
The C5-C14 alkyl group-containing fourth alkyl (meth) acrylate monomer may be, for example, a branched C5-C10 alkyl group-containing alkyl (meth) acrylate.
The C5-C14 alkyl group-containing fourth alkyl (meth) acrylate monomer is, for example, pentyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, 2-ethylbutyl (meth) acrylate, n- At least one selected from the group comprising octyl (meth) acrylate, isooctyl (meth) acrylate, isononyl (meth) acrylate, lauryl (meth) acrylate, tetradecyl (meth) acrylate, and combinations thereof It may include.
The functional group-containing second (meth) acrylic monomer may include one selected from the group consisting of a hydroxy group-containing (meth) acrylic monomer, a carboxyl group-containing (meth) acrylic monomer, a nitrogen-containing (meth) acrylic monomer, and a combination thereof.
The functional group-containing second (meth) acrylic monomer is, for example, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6 -Hydroxyhexyl (meth) acrylate, 8-hydroxyoctyl (meth) acrylate, 2-hydroxyethylene glycol (meth) acrylate, 2-hydroxypropylene glycol (meth) acrylate, acrylic acid, methacrylic acid , 2- (meth) acryloyloxy acetic acid, 3- (meth) acryloyloxy propyl acid, 4- (meth) acryloyloxy butyl acid, acrylic acid duplex, itaconic acid, maleic acid, 2-isocy Anatoethyl (meth) acrylate, 3-isocyanatopropyl (meth) acrylate, 4-isocyanatobutyl (meth) acrylate, (meth) acrylamide, N-vinyl pyrrolidone, N- Vinyl caprolactam and one selected from the group consisting of Can.
In one embodiment, the second monomer component is 5 to 20% by weight of the C1-C4 alkyl group-containing third alkyl (meth) acrylate monomer, and 55 to 85 weight by weight of the C5-C14 alkyl group-containing fourth alkyl (meth) acrylate monomer. % And 10 to 25% by weight of the second functional group-containing (meth) acrylic monomer.
The pressure-sensitive adhesive forming composition may be implemented by mixing the second acrylic photocurable resin such that the storage modulus is 90,000 Pa to 130,000 Pa at 25 ° C., and the glass transition temperature is −40 to −30 ° C. Specifically, the C5-C14 alkyl group-containing fourth alkyl (meth) acrylate monomers have a relatively low glass transition temperature, but the C1-C4 alkyl group-containing third alkyl (meth) acrylate monomers may be mixed to implement the above range, The second functional group-containing (meth) acrylic monomer may be blended together in the above range to form an
The degree of polymerization of the second acrylic photocurable polymer may be appropriately selected according to the physical properties of the
The isocyanate-based thermosetting agent is selected from the group consisting of tolylene diisocyanate, xylene diisocyanate, diphenylmethane diisocyanate, hexamethylene diisocyanate, isoform diisocyanate, tetramethylxylene diisocyanate and naphthalene diisocyanate, for example. It may comprise at least one or more.
The content of the thermosetting agent may be 0.1 to 10 parts by weight, specifically, 0.5 to 5 parts by weight, and more specifically 1 to 2 parts by weight, based on 100 parts by weight of the second acrylic photocurable polymer. By using the thermosetting agent in the content ratio of the above range, by forming the pressure-
The photoinitiator included in the adhesive layer-forming composition is the same as the photoinitiator included in the composition for forming the intermediate layer.
The
2 is a schematic cross-sectional view of applying the semiconductor wafer surface protection
3 is a schematic cross-sectional view of the
In the semiconductor wafer surface protection
As described above, the
In one embodiment, the
Hereinafter, examples and comparative examples of the present invention are described. Such following examples are only examples of the present invention, and the present invention is not limited to the following examples.
( EXAMPLE )
Production Example One
Heat was added to the first monomer component obtained by mixing 50 parts by weight of ethylhexyl acrylate, 15 parts by weight of isobornyl acrylate, 15 parts by weight of 2-hydroxyethyl acrylate and 20 parts by weight of isostearyl acrylate as a composition for forming an intermediate layer. A first acrylic photocurable polymer (a weight average molecular weight of 3 million and a syrup solution having a glass transition temperature of −35 ° C.) was prepared by partial polymerization. Then, 100 parts by weight of the first acrylic photocurable polymer was irradiated with Irgacure 651 as a photoinitiator. 0.3 parts by weight of a urethane acrylate curing agent was added as parts by weight and a photocuring agent to prepare a composition for forming an intermediate layer.
Production Example 2
A first acrylic sight obtained by partial polymerization by applying heat to a first monomer component obtained by mixing 50 parts by weight of ethylhexyl acrylate, 30 parts by weight of isobornyl acrylate and 20 parts by weight of 2-hydroxyethyl acrylate as a composition for forming an intermediate layer. A syrup solution of a chemical polymer (weight average molecular weight 970,000, glass transition temperature -25 ° C) was prepared. Subsequently, 0.3 parts by weight of Irgacure 651 as a photoinitiator and 0.3 parts by weight of a urethane acrylate curing agent as a photocuring agent were added to 100 parts by weight of the first acrylic photocurable polymer to prepare a composition for forming an intermediate layer.
Production Example 3
A second acrylic sight obtained by partial polymerization by applying heat to a second monomer component obtained by mixing 54 parts by weight of ethylhexyl acrylate, 23 parts by weight of 2-hydroxyethyl acrylate and 23 parts by weight of methyl acrylate as a composition for forming an adhesive layer. A syrup solution of a chemical polymer (weight average molecular weight 970,000, glass transition temperature -35 ° C) was prepared. Subsequently, 10 parts by weight of Irgacure 651 as a photoinitiator and 1.5 parts by weight of a 6-functional NCO curing agent as a thermosetting agent were added to 100 parts by weight of the second acrylic photocurable polymer to prepare a composition for forming an adhesive layer.
Production Example 4
A pressure-sensitive adhesive layer-forming composition was prepared in the same manner as in Preparation Example 3, except that 3 parts by weight of a 6-functional NCO curing agent was added as the thermosetting agent in Preparation Example 3.
Production Example 5
A pressure-sensitive adhesive layer-forming composition was prepared in the same manner as in Preparation Example 3, except that 5 parts by weight of a 6-functional NCO curing agent was added as the thermosetting agent in Preparation Example 3.
EXAMPLE One
A 120 μm-thick polyethylene (PE) film was prepared as a substrate layer, and the composition for forming an intermediate layer prepared in Preparation Example 1 was applied on the substrate layer.
After coating the composition for forming the intermediate layer of Preparation Example 1 between the release PET film and cured by a black light UV lamp of 5W, the dominant wavelength is 365nm to form an intermediate layer having a thickness of 100㎛, transferred to the base layer, Substrate-interlayer plywood.
Subsequently, after coating the composition for pressure-sensitive adhesive layer prepared in Preparation Example 3 to a release film and left in an oven at 90 ° C. for 3 minutes to form a film to form a pressure-sensitive adhesive layer having a thickness of 10 ㎛, the substrate by laminating with the intermediate layer An adhesive film for protecting a semiconductor wafer surface including a layer, an intermediate layer, and an adhesive layer was prepared.
Comparative example One
A 120 μm-thick polyethylene (PE) film was prepared as a substrate layer, and the composition for forming an intermediate layer prepared in Preparation Example 1 was applied on the substrate layer.
After coating the composition for forming the intermediate layer of Preparation Example 1 between the release PET film and cured by a black light UV lamp of 5W, the dominant wavelength is 365nm to form an intermediate layer having a thickness of 100㎛, transferred to the base layer, Substrate-interlayer plywood.
Subsequently, the composition for adhesion layer formation prepared in Preparation Example 4 was coated on a release film, and then left in an oven at 90 ° C. for 3 minutes to form a film to form an adhesion layer having a thickness of 10 μm, and then laminated with the intermediate layer. An adhesive film for protecting a semiconductor wafer surface including a layer, an intermediate layer, and an adhesive layer was prepared.
Comparative example 2
A 120 μm-thick polyethylene (PE) film was prepared as a substrate layer, and the composition for forming an intermediate layer prepared in Preparation Example 1 was applied on the substrate layer.
The intermediate layer forming composition was coated between a release PET film and then cured by a black light UV lamp having a wavelength of 5 nm and a dominant wavelength of 365 nm to form an intermediate layer having a thickness of 100 μm, which was transferred to the substrate layer, and the substrate-middle layer plywood. It was.
Subsequently, after coating the composition for pressure-sensitive adhesive layer formed in Preparation Example 5 on a release film and left in an oven at 90 ° C. for 3 minutes to form a film to form a pressure-sensitive adhesive layer having a thickness of 10 μm, the substrate by laminating with the intermediate layer An adhesive film for protecting a semiconductor wafer surface including a layer, an intermediate layer, and an adhesive layer was prepared.
Comparative example 3
A 120 μm-thick polyethylene (PE) film was prepared as a substrate layer, and the composition for forming an intermediate layer prepared in Preparation Example 2 was applied on the substrate layer.
The intermediate layer forming composition was coated between a release PET film and then cured by a black light UV lamp having a wavelength of 5 nm and a dominant wavelength of 365 nm to form an intermediate layer having a thickness of 100 μm, which was transferred to the substrate layer, and the substrate-middle layer plywood. It was.
Subsequently, after coating the composition for pressure-sensitive adhesive layer prepared in Preparation Example 3 to a release film and left in an oven at 90 ° C. for 3 minutes to form a film to form a pressure-sensitive adhesive layer having a thickness of 10 ㎛, the substrate by laminating with the intermediate layer An adhesive film for protecting a semiconductor wafer surface including a layer, an intermediate layer, and an adhesive layer was prepared.
Comparative example 4
A 120 μm-thick polyethylene (PE) film was prepared as a substrate layer, and the composition for forming an intermediate layer prepared in Preparation Example 2 was applied on the substrate layer.
The intermediate layer forming composition was coated between a release PET film and then cured by a black light UV lamp having a wavelength of 5 nm and a dominant wavelength of 365 nm to form an intermediate layer having a thickness of 100 μm, which was transferred to the substrate layer, and the substrate-middle layer plywood. It was.
Subsequently, the composition for adhesion layer formation prepared in Preparation Example 4 was coated on a release film, and then left in an oven at 90 ° C. for 3 minutes to form a film to form an adhesion layer having a thickness of 10 μm, and then laminated with the intermediate layer. An adhesive film for protecting a semiconductor wafer surface including a layer, an intermediate layer, and an adhesive layer was prepared.
Comparative example 5
A 120 μm-thick polyethylene (PE) film was prepared as a substrate layer, and the composition for forming an intermediate layer prepared in Preparation Example 2 was applied on the substrate layer.
The intermediate layer forming composition was coated between a release PET film and then cured by a black light UV lamp having a wavelength of 5 nm and a dominant wavelength of 365 nm to form an intermediate layer having a thickness of 100 μm, which was transferred to the substrate layer, and the substrate-middle layer plywood. It was.
Subsequently, after coating the composition for pressure-sensitive adhesive layer formed in Preparation Example 5 on a release film and left in an oven at 90 ° C. for 3 minutes to form a film to form a pressure-sensitive adhesive layer having a thickness of 10 μm, the substrate by laminating with the intermediate layer An adhesive film for protecting a semiconductor wafer surface including a layer, an intermediate layer, and an adhesive layer was prepared.
<Measurement of physical properties>
The glass transition temperatures for the intermediate and adhesive layers prepared in Example 1 and Comparative Examples 1-5 were measured by DSC (mettler toledo, TGA / DSC 1), and the results are shown in Table 1 below.
The 25 ° C., 45 ° C. and 60 ° C. storage modulus of the intermediate and adhesive layers prepared in Example 1 and Comparative Examples 1-5 were measured by rheometer (TA instruments, ARES-G2), and the results are shown in Table 2 below. It is described in.
Experimental Example One: Step Absorption evaluation
Each of the adhesive films for protecting the semiconductor wafer surface of Example 1 and Comparative Example 1-5 were allowed to adhere the adhesive layer on the patterned wafer with a bump height of 50 μm and a width of 50 μm, and the pressure: 0.3 MPa, a speed of 10 mm / min conditions were attached.
Bubble area was calculated by observing bubbles around the bumps under a microscope.
The results observed according to the following evaluation criteria are shown in Table 3 below.
<Evaluation Criteria>
◎: step difference absorption 90% or more (
○: step difference absorption less than 70 ~ 90% (bubble area more than 10% ~ 30% or less)
△: step difference absorption less than 50 to 70% (bubble area is more than 30% ~ 50% or less)
X: step difference absorption less than 50% (bubble area is more than 50%)
In Table 3, Example 1 was excellent in all the step absorption capacity of 25 ℃, 40 ℃ and 60 ℃, Comparative Example 1-5 it was confirmed that the step absorption capacity compared to Example 1 at all temperatures.
Although the preferred embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements of those skilled in the art using the basic concepts of the present invention defined in the following claims are also provided. It belongs to the scope of the invention.
10: base material layer
20: middle layer
30: adhesive layer
40: bump
50: semiconductor wafer
100: adhesive film for semiconductor wafer surface protection
Claims (17)
The intermediate layer includes a C1-C14 alkyl group-containing first alkyl (meth) acrylate monomer, a C15-C25 alkyl group-containing second alkyl (meth) acrylate monomer, a first functional group-containing (meth) acrylic monomer and an alicyclic (meth) acrylate A photocured product of the composition for forming an interlayer comprising a first acrylic photocurable polymer of a first monomer component comprising a monomer, a photoinitiator, and a photocuring agent,
The storage modulus of the intermediate layer is 30,000 Pa to 50,000 Pa at 25 ° C.,
The glass transition temperature of the intermediate layer is -35 to -25 ℃,
The adhesive layer is a second monomer component comprising a C1-C4 alkyl group-containing third alkyl (meth) acrylate monomer, a C5-C14 alkyl group-containing fourth alkyl (meth) acrylate monomer and a second functional group-containing (meth) acrylic monomer Pressure-sensitive adhesive formed from a pressure-sensitive adhesive layer-forming composition containing a second acrylic photocurable resin, an isocyanate-based thermosetting agent and a photoinitiator,
The pressure-sensitive adhesive has a peeling force before light irradiation is greater than the peeling force after light irradiation,
The storage modulus of the adhesive layer is 90,000 Pa to 130,000 Pa at 25 ° C.,
The glass transition temperature of the adhesive layer is -40 to -30 ℃
Adhesive film for semiconductor wafer surface protection.
The first monomer component is the first monomer component is 10 to 85% by weight of the first alkyl (meth) acrylate monomer, 1 to 30% by weight of the C15-C25 alkyl group-containing second alkyl (meth) acrylate monomer, 5 to 25% by weight of a monofunctional group-containing (meth) acrylic monomer and 9 to 35% by weight of the alicyclic (meth) acrylate monomer
Adhesive film for semiconductor wafer surface protection.
The functional group-containing first (meth) acrylic monomer includes one selected from the group consisting of a hydroxy group-containing (meth) acrylic monomer, a carboxyl group-containing (meth) acrylic monomer, a nitrogen-containing (meth) acrylic monomer, and a combination thereof.
Adhesive film for semiconductor wafer surface protection.
The weight average molecular weight of the first acrylic photocurable polymer is 500,000 to 5,000,000 g / mol
Adhesive film for semiconductor wafer surface protection.
The photoinitiator includes one selected from the group consisting of a benzoin initiator, a hydroxy ketone initiator, an amino ketone initiator, a caprolactam initiator, and a combination thereof, and the content of the photoinitiator is 100 wt% of the first acrylic photocurable polymer. 0.001 to 0.5 parts by weight
Adhesive film for semiconductor wafer surface protection.
The photocuring agent is 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, neopentylglycol di (meth) acrylate, 1,2-ethylene glycol di (meth) acrylic Latene, polyethylene glycol di (meth) acrylate, 1,12-dodecanediol di (meth) acrylate, neopentylglycol adipate di (meth) acrylate, hydroxypivalate neopentylglycol di (meth) acrylate , Dicyclopentanyl di (meth) acrylate, caprolactone modified dicyclopentenyl di (meth) acrylate, ethylene oxide modified di (meth) acrylate, di (meth) acryloxy ethyl isocyanurate, allylated Cyclohexyl di (meth) acrylate, tricyclodecanedimethanol (meth) acrylate, dimethylol dicyclopentane di (meth) acrylate, ethylene oxide modified hexahydrophthalic acid di (meth) acrylate, trisicle Rodecane dimethanol (meth) acrylate, neopentyl glycol modified trimethylpropane di (meth) acrylate, adamantane di (meth) acrylate, 9,9-bis [4- (2-acryloyloxyethoxy ) Phenyl] fluorene, trimethylolpropane tri (meth) acrylate, dipentaerythritol tri (meth) acrylate, propionic acid-modified dipentaerythritol tri (meth) acrylate, pentaerythritol tri (meth) Acrylate, propylene oxide modified trimethylolpropane tri (meth) acrylate, tris (meth) acryloxyethyl isocyanurate, diglycerin tetra (meth) acrylate, pentaerythritol tetra (meth) acrylate, propionic acid Modified dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, caprolactone modified dipentaerythritol hexa (meth) acrylate and isosi Urethane (meth) acrylate, which is a reactant of a nate monomer and trimethylolpropane tri (meth) acrylate, and a combination thereof, and the content of the photocuring agent is 100% by weight of the first acrylic photocurable polymer. 0.001 to 0.5 parts by weight
Adhesive film for semiconductor wafer surface protection.
The second monomer component is 5 to 20 wt% of the C1-C4 alkyl group-containing third alkyl (meth) acrylate monomer, 55 to 85 wt% of the C5-C14 alkyl group-containing fourth alkyl (meth) acrylate monomer, and the second 10 to 20% by weight of functional group-containing (meth) acrylic monomer
Adhesive film for semiconductor wafer surface protection.
The functional group-containing second (meth) acrylic monomer includes one selected from the group consisting of a hydroxy group-containing (meth) acrylic monomer, a carboxyl group-containing (meth) acrylic monomer, a nitrogen-containing (meth) acrylic monomer, and a combination thereof.
Adhesive film for semiconductor wafer surface protection.
The weight average molecular weight of the second acrylic photocurable polymer is 500,000 to 4,000,000 g / mol
Adhesive film for semiconductor wafer surface protection.
The isocyanate-based thermosetting agent includes at least one selected from the group consisting of tolylene diisocyanate, xylene diisocyanate, diphenylmethane diisocyanate, hexamethylene diisocyanate, isoform diisocyanate, tetramethylxylene diisocyanate and naphthalene diisocyanate.
Adhesive film for semiconductor wafer surface protection.
The content of the thermosetting agent is 0.1 to 10 parts by weight relative to 100 parts by weight of the second acrylic photocurable polymer.
Adhesive film for semiconductor wafer surface protection.
The base layer includes at least one selected from the group consisting of polyethylene terephthalate film, polyolefin film, polyvinyl chloride film, polyurethane film, ethylene-vinyl acetate copolymer film, ethylene-alkyl acrylate copolymer film, and combinations thereof doing
Adhesive film for semiconductor wafer surface protection.
The base layer has a thickness of 50 μm to 200 μm
Adhesive film for semiconductor wafer surface protection.
The thickness of the intermediate layer is 50㎛ to 200㎛
Adhesive film for semiconductor wafer surface protection.
The adhesive layer has a thickness of 10 μm to 40 μm
Adhesive film for semiconductor wafer surface protection.
It is applied to the back surface grinding process of the wafer on which bumps are formed on one surface, and the adhesive layer is attached to one surface of the wafer on which bumps are formed.
Adhesive film for semiconductor wafer surface protection.
The bump has a height of 50 μm to 200 μm
Adhesive film for semiconductor wafer surface protection.
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| KR101983743B1 (en) * | 2017-10-27 | 2019-05-29 | 동우 화인켐 주식회사 | Adhesive layer, optical member and display device using the same |
| KR102203869B1 (en) * | 2018-03-28 | 2021-01-18 | 주식회사 엘지화학 | Adhesieve sheet for temporary-attamchment and methode for producing semiconductor device using the same |
| KR102203870B1 (en) * | 2018-04-12 | 2021-01-18 | 주식회사 엘지화학 | Adhesieve sheet for temporary-attamchment and methode for producing semiconductor device using the same |
| WO2019199085A1 (en) * | 2018-04-12 | 2019-10-17 | 주식회사 엘지화학 | Adhesive sheet for temporary attachment and semiconductor device producing method using same |
| KR102239210B1 (en) * | 2018-06-04 | 2021-04-09 | 주식회사 엘지화학 | Back grinding tape |
| CN110211886B (en) * | 2019-06-06 | 2021-09-21 | 盛合晶微半导体(江阴)有限公司 | Semiconductor manufacturing method |
| KR102654342B1 (en) * | 2019-09-19 | 2024-04-02 | 주식회사 엘지화학 | Adhesieve composition and adhesieve sheet for temporary-attachment using the same |
| KR102411362B1 (en) * | 2021-07-09 | 2022-06-22 | 구동필 | Adhesion film for wafer back grinding and its manufacturing method |
| KR102571694B1 (en) * | 2022-12-20 | 2023-08-29 | 율촌화학 주식회사 | Thermosetting adhesive composition and surface protection film comprising the same |
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| JP2011187832A (en) | 2010-03-10 | 2011-09-22 | Hitachi Maxell Ltd | Adhesive sheet for grinding wafer back face, method of manufacturing the same, and method of using the same |
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| KR20090121254A (en) * | 2008-05-20 | 2009-11-25 | 주식회사 엘지화학 | Pressure-sensitive adhesive film, dicing die bonding film and semiconductor wafer |
| KR101372564B1 (en) * | 2011-11-22 | 2014-03-14 | 니타 가부시키가이샤 | Acrylate based adhesive composition for optical use, acrylate based adhesive sheet for optical use and method for separating optical component using the same |
| KR101589340B1 (en) * | 2013-02-22 | 2016-01-27 | (주)엘지하우시스 | Surface protecting adhesive film for semiconductor wafer |
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| JP2011187832A (en) | 2010-03-10 | 2011-09-22 | Hitachi Maxell Ltd | Adhesive sheet for grinding wafer back face, method of manufacturing the same, and method of using the same |
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