KR102034849B1 - In circuit tester device structure for improved safty - Google Patents

In circuit tester device structure for improved safty Download PDF

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Publication number
KR102034849B1
KR102034849B1 KR1020180121030A KR20180121030A KR102034849B1 KR 102034849 B1 KR102034849 B1 KR 102034849B1 KR 1020180121030 A KR1020180121030 A KR 1020180121030A KR 20180121030 A KR20180121030 A KR 20180121030A KR 102034849 B1 KR102034849 B1 KR 102034849B1
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South Korea
Prior art keywords
damper
equipment
buffer damper
buffer
circuit board
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KR1020180121030A
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Korean (ko)
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고경민
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고경민
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
    • F16F15/00—Suppression of vibrations in systems; Means or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion
    • F16F15/02—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems
    • F16F15/04—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
    • G01R31/2836—Fault-finding or characterising
    • G01R31/2843—In-circuit-testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31915—In-circuit Testers

Abstract

The present invention relates to an ICT device having improved safety, which can absorb and block an impact caused by the occurrence of an earthquake or the delivery of vibrations and delivered to the device in a process of testing a printed circuit board, thereby increasing test reliability of the device. To this end, the ICT device of the present invention has a board seating portion (20) provided on an upper surface of a device body (10) to seat a circuit board, has a lifting stand (40) provided on an upper portion of the device body (10) to be raised or lowered by the operation of a drive cylinder (30), has a plurality of guide rods (41) provided on the lifting stand (40) to provide guidance to raising or lowering, has guide grooves (21) formed on the board seating portion (20) and corresponding to the guide rods (41), has a plurality of probe pins (50) provided on the bottom surface of the lifting stand (40) to test the circuit board, and has moving wheels (60) provided below the device body (10). The device body (10) and the moving wheels (60) have therebetween buffer dampers (100) made of an elastic material and for absorbing shocks. Each of the buffer dampers (100) has a plurality of elastic springs (110) embedded therein. The elastic springs (110) are connected by a support wire mesh (120).

Description

안전성이 개선된 아이씨티 장비{IN CIRCUIT TESTER DEVICE STRUCTURE FOR IMPROVED SAFTY} INCIRCUIT TESTER DEVICE STRUCTURE FOR IMPROVED SAFTY}

본 발명은 ICT장비에 관한 것으로서, 더욱 상세하게는 지진 등과 같은 진동 발생시 충격력을 신속하게 저감시켜 장비 손상을 방지하기 위한 안전성이 개선된 아이씨티 장비에 관한 것이다.The present invention relates to an ICT device, and more particularly, to an IC device having improved safety for preventing damage to equipment by rapidly reducing impact force when a vibration such as an earthquake occurs.

일반적으로, ICT(In Circuit Tester)는 전자제품 제조공정에 있어서 부품이 실장된 인쇄회로기판의 불량 유무를 판별하는 자동측정장치로써, 불량 보드의 조기 판별을 통하여 생산성 향상에 기여하는 측정장치이다. In general, an ICT (In Circuit Tester) is an automatic measuring device for determining whether a printed circuit board on which a component is mounted is defective in an electronic product manufacturing process, and is a measuring device that contributes to productivity improvement through early identification of a defective board.

한편, ICT의 측정원리는 인쇄회로기판에 실장된 각각의 수동소자들의 값을 측정하기 위하여 탐침(Probe)을 접촉시켜서 직류 또는 교류 측정을 한 후 각 소자값을 측정하는 것이며, 이를 통하여 측정하는 PCB 인쇄회로기판의 불량 유무를 판별하게 된다.On the other hand, the measuring principle of ICT is to measure the value of each device after measuring direct current or alternating current by contacting a probe to measure the value of each passive device mounted on the printed circuit board. The presence of a defective printed circuit board is determined.

한편, 이러한 ICT 장비는 탐침의 접촉위치에 따른 정밀성을 필요로하기 때문에 충격이나 진동 발생시 측정에 오류가 발생되어지게 된다.On the other hand, since the ICT equipment requires precision according to the contact position of the probe, an error occurs in the measurement when a shock or vibration occurs.

따라서, 지진 발생에 따른 건물에 충격이 전달되었을 때, 장비 본체로 전달되는 진동을 신속하게 감쇄시키기 위한 개선된 완충 진동 제어기술을 필요로 하는 실정이다.Therefore, there is a need for an improved damping vibration control technique for rapidly attenuating the vibration transmitted to the equipment main body when an impact is transmitted to the building caused by the earthquake.

대한민국 특허등록 제815244호(2008.03.13.등록)Republic of Korea Patent Registration No. 815244 (registered on March 13, 2008) 대한민국 특허등록 제1511330호(2015.04.06.등록)Republic of Korea Patent Registration No. 1511330 (2015.04.06.Registration) 대한민국 특허등록 제270519호(2000.08.03.등록)Republic of Korea Patent Registration No. 270519 (registered on Aug. 03, 2000)

본 발명은 상기한 종래 기술에서의 문제점을 개선하기 위해 제안된 것으로서, 지진 발생시 바닥면을 통해 전달되는 진동을 신속하게 감쇄시킬 수 있는 개선된 완충 구조를 제공함으로서 ICT 장비의 안전성을 향상시키도록 하는데 목적이 있다.The present invention has been proposed to improve the above problems in the prior art, and to improve the safety of the ICT equipment by providing an improved buffer structure that can quickly attenuate the vibration transmitted through the floor during the earthquake. There is a purpose.

상기 목적을 이루기 위한 본 발명은, 장비본체의 상면에는 회로기판이 안착되는 기판안착부가 구비되고, 상기 장비본체의 상부에는 구동실린더 동작에 의해 승하강 구동이 이루어지는 승강대가 구성되며, 상기 승강대에는 승하강 구동을 가이드하기 위한 다수의 가이드봉이 구성되고, 상기 가이드봉과 대응되는 기판안착부에는 안내홈이 형성되며, 상기 승강대 저면에는 회로기판의 검사를 위한 다수의 프로브핀이 구비되고, 상기 장비본체의 하부에는 이동용 바퀴가 구성된 아이씨티 장비에 있어서, 상기 장비본체와 이동용 바퀴 사이에는 충격 흡수를 위한 탄성재질의 완충댐퍼가 구성되되, 상기 완충댐퍼 내부에는 다수의 탄성스프링이 매립 구비되고, 상기 탄성스프링은 상호간에 중단부에서 지지철망에 의해 연결 구성된 것을 특징으로 한다.The present invention for achieving the above object, the upper surface of the equipment main body is provided with a circuit board is mounted on the seat, the upper part of the equipment main body is configured to the lifting and lowering driving is driven by a drive cylinder operation, the lifting platform A plurality of guide rods for guiding the lowering drive is configured, and guide grooves are formed in the substrate seating portion corresponding to the guide rods, and a plurality of probe pins are provided on the bottom of the platform to inspect the circuit board. In an IC device having a wheel for movement in the lower portion, between the body and the wheel for movement is composed of a shock absorber of an elastic material for shock absorption, a plurality of elastic springs are embedded in the buffer damper, the elastic spring Is characterized in that the connection is configured by a supporting wire mesh at the interruption portion.

이러한 본 발명의 ICT장비는, 인쇄회로기판의 검사과정에서 지진발생이나 진동전달에 따른 충격이 장비로 전달되는 것이 완충댐퍼에 흡수 및 차단되어짐으로서 장비의 손상 발생을 방지함과 함께 장비의 검사 신뢰성을 향상시키는 효과를 나타낸다.In the ICT device of the present invention, the shock transmitted by the earthquake or vibration transmission during the inspection of the printed circuit board is absorbed and blocked by the buffer damper to prevent the damage of the equipment and the inspection reliability of the equipment It shows the effect of improving.

도 1은 본 발명의 제1 실시 예에 따른 ICT장비 외관 사시도.
도 2는 본 발명의 ICT장비 정면 구조도.
도 3은 본 발명의 ICT장비 측면 구조도.
도 4는 본 발명에서 이동용 바퀴 완충부 확대도.
도 5는 도 4의 A부 상세 단면 구조도.
도 6은 본 발명의 제2 실시 예에 따른 완충댐퍼 설치부 분리상태 단면도.
도 7은 본 발명의 제2 실시 예에 따른 완충댐퍼 설치부 결합상태 단면도.
도 8은 본 발명의 제3 실시 예에 따른 완충댐퍼 단면 구조도.1 is an external perspective view of the ICT equipment according to the first embodiment of the present invention.
Figure 2 is a front view of the ICT equipment of the present invention.
Figure 3 is a side structure of the ICT equipment of the present invention.
Figure 4 is an enlarged view of the wheel cushion for movement in the present invention.
FIG. 5 is a detailed cross-sectional view of a portion A of FIG. 4; FIG.
Figure 6 is a cross-sectional view of the buffer damper installation portion separated state according to the second embodiment of the present invention.
Figure 7 is a cross-sectional view of the shock absorber installation unit coupled state according to a second embodiment of the present invention.
8 is a cross-sectional structural view of a buffer damper according to a third embodiment of the present invention.

이하, 본 발명의 구체적인 실시 예를 첨부 도면을 참조하여 상세히 살펴보기로 한다.Hereinafter, specific embodiments of the present invention will be described in detail with reference to the accompanying drawings.

먼저, 본 발명의 제1 실시 예에 따른 안전성이 개선된 아이씨티 장비의 구조를 도 1 내지 도 5를 통해 살펴보면 다음과 같다.First, the structure of the IC device with improved safety according to the first embodiment of the present invention will be described with reference to FIGS. 1 to 5.

본 실시 예에서의 ICT장비는 장비본체(10)의 상면에 회로기판이 안착되는 기판안착부(20)가 구비되고, 상기 장비본체(10)의 상부에는 구동실린더(30) 동작에 의해 승하강 구동이 이루어지는 승강대(40)가 구성되며, 상기 승강대(40)에는 승하강 구동을 가이드하기 위한 다수의 가이드봉(41)이 구성되고, 상기 가이드봉(41)과 대응되는 기판안착부(20)에는 안내홈(21)이 형성되며, 상기 승강대(40) 저면에는 회로기판의 검사를 위한 다수의 프로브핀(50)이 구비되고, 상기 장비본체(10)의 하부에는 이동용 바퀴(60)가 구성된다.In the present embodiment, the ICT equipment is provided with a substrate seating portion 20 on which a circuit board is mounted on an upper surface of the equipment body 10, and is lowered by an operation of the driving cylinder 30 on the upper portion of the equipment body 10. Drive platform 40 is configured, the platform 40 is configured with a plurality of guide rods 41 for guiding the lifting and lowering drive, the substrate mounting portion 20 corresponding to the guide rod 41 A guide groove 21 is formed in the lower surface of the platform 40, and a plurality of probe pins 50 for inspecting a circuit board are provided. do.

특히, 본 발명에서는 도 4에서 나타내어지는 바와 같이 상기 장비본체(10)와 이동용 바퀴(60) 사이에는 충격 흡수를 위한 고무 등과 같은 탄성재질의 완충댐퍼(100)가 구성되는데, 상기 완충댐퍼(100) 내부에는 도 5에서와 같이 다수의 탄성스프링(110)이 일정 간격으로 매립 구비되고, 상기 탄성스프링(110)은 상호간에 지지철망(120)에 의해 중단부가 연결된 구성을 이루게 된다.In particular, in the present invention, as shown in Figure 4 between the equipment body 10 and the wheel for movement 60 is configured a damping damper 100 of an elastic material such as rubber for shock absorption, the damping damper 100 5) A plurality of elastic springs 110 are embedded at regular intervals, as shown in FIG.

또한, 탄성스프링(110)의 하부에는 구 형상의 지지볼(130)이 연결 구성됨으로서, 하부의 이동용 바퀴(60)를 통해 전달되는 진동이 균일하게 각 탄성스프링(110)으로 전달되어질 수 있도록 하였다.In addition, since the spherical support ball 130 is configured to be connected to the lower portion of the elastic spring 110, the vibration transmitted through the wheel 60 for movement in the lower portion can be uniformly transmitted to each elastic spring 110. .

도면 중 미설명 부호 11은 안전센서(Safty Sensor)이고, 70은 검사결과의 확인을 위한 모니터를 각각 나타낸다.In the figure, reference numeral 11 denotes a safety sensor, and 70 denotes a monitor for checking the inspection result.

이와 같은 구성을 이루는 본 발명 ICT장비의 설치에 따른 작용효과를 살펴보기로 한다.The effect of the installation of the present invention ICT equipment constituting such a configuration will be described.

본 발명에서의 ICT장비는 생산된 인쇄회로기판(PCB)을 기판안착부(20)에 안착시킨 상태에서 구동실린더(30) 구동에 의해 승강대(40)를 하강시킴에 따라 프로브핀(50)이 기판면에 접촉되도록 하여 인쇄회로기판의 불량 유무를 판별하게 되는 것으로서, 이때 가이드봉(41)은 안내홈(21)을 따라 안내되어짐으로서 프로브핀(50)의 유동 발생이 방지되어 정밀한 위치 접촉이 이루어질 수 있게 된다.In the present invention, the ICT device is a probe pin (50) by lowering the platform 40 by driving the drive cylinder 30 in a state in which the printed circuit board (PCB) is seated on the substrate seating portion 20 By contacting the substrate surface to determine whether there is a defect of the printed circuit board, the guide rod 41 is guided along the guide groove 21 to prevent the flow of the probe pin 50 to prevent the precise position contact It can be done.

한편, 지진 발생에 따른 건축물 바닥면의 유동이 발생되었을 때 본 발명에서는 완충댐퍼(100)의 구성으로 인해 ICT장비로 충격력이 전달되는 것을 최소화할 수 있게 된다.On the other hand, when the flow of the building floor surface caused by the earthquake occurs in the present invention it is possible to minimize the transmission of the impact force to the ICT equipment due to the configuration of the buffer damper (100).

즉, 이때에는 바닥면으로 부터 이동용 바퀴(60)를 통해 전달된 유동력이 탄성재질의 완충댐퍼(100)에 의해 흡수되어짐으로서 완충효과를 나타낼 수 있게 되는데, 이때 댐퍼 내부에 일정 간격으로 구비된 다수의 탄성스프링(110)에서 신속하게 충격 흡수가 이루어질 수 있게 된다. 이때 각각의 탄성스프링(110)은 지지철망(120)에 의해 중단부가 상호간에 연결된 구조를 이루고 있기 때문에 보다 안정적인 지지가 이루어짐과 함께 충격 흡수가 이루어질 수 있게 된다.That is, at this time, the flow force transmitted from the bottom surface through the wheel 60 for movement is absorbed by the buffer damper 100 of the elastic material, thereby exhibiting a buffering effect. Shock absorption can be made quickly in the plurality of elastic springs 110. At this time, since each of the elastic springs 110 has a structure in which the stop parts are connected to each other by the support wire mesh 120, more stable support is made and shock absorption can be made.

또한, 각각의 탄성스프링(110)은 하부에 지지볼(130)이 구성되어 있기 때문에 무게중심을 하부로 위치시킴으로서 전체적으로 안정적인 완충효과를 나타낼 수 있게 된다.In addition, since each of the elastic spring 110 has a support ball 130 is formed at the bottom, by placing the center of gravity to the bottom it can exhibit a stable buffer effect as a whole.

따라서, 본 발명에서는 ICT장비의 유동발생이 방지되어질 수 있게 되어 장비 손상을 감소시킴과 함께 보다 정밀한 인쇄회로기판 불량유무 판별이 이루어질 수 있게 됨을 알 수 있다.Therefore, in the present invention, it is possible to prevent the occurrence of flow of the ICT equipment, thereby reducing the damage of the equipment, and it can be seen that more accurate determination of the defect of the printed circuit board can be made.

한편, 도 6 및 도 7은 본 발명의 제2 실시 예에 따른 구성을 나타낸 것으로서, 이동용 바퀴(60)의 상부에는 완충댐퍼(100)와의 면접촉을 위한 판스프링(61)이 연속되는 요철형상을 이루어 용접 구성되고, 장비본체(10)의 하부에는 완충댐퍼(100) 및 판스프링(61)의 지지를 위한 댐퍼 지지홈(12)이 형성되며, 상기 댐퍼 지지홈(12) 중심에는 가이드홈(12a)이 형성되고, 상기 가이드홈(12a)과 대응되는 완충댐퍼(100)의 상면에는 가이드돌기(150)가 돌출 구비된다.On the other hand, Figure 6 and Figure 7 shows a configuration according to a second embodiment of the present invention, the upper surface of the wheel 60 for movement uneven shape continuous plate spring 61 for the surface contact with the damper damper 100 It is made of welding, and the lower portion of the equipment body 10 is formed with a damper support groove 12 for the support of the damper damper 100 and the leaf spring 61, the guide groove in the center of the damper support groove 12 12a is formed, and a guide protrusion 150 protrudes from an upper surface of the buffer damper 100 corresponding to the guide groove 12a.

이와 같은 구성을 이루게 되면, 완충댐퍼(100)와 함께 하부의 요철형 판스프링(61)에 의해 2중의 완충 효과를 나타낼 수 있게 되며, 이와 함께 가이드홈(12a)에 의한 완충댐퍼(100)의 착탈형 구조를 이룸으로서 완충댐퍼(100)의 교체 장착이 가능한 이점을 나타낸다.When such a configuration is achieved, the double damping effect can be exhibited by the bottom uneven plate spring 61 together with the buffer damper 100, and the buffer damper 100 by the guide groove 12a can be obtained. By having a removable structure shows the advantage that the replacement mounting of the buffer damper 100 is possible.

특히, 판스프링(61)이 연속되는 웨이브 형태의 요철 구조를 이루고 있기 때문에 완충댐퍼(100) 저면과의 접촉면적이 극대화 됨과 함께 완충효율이 향상되어질 수 있게 된다.In particular, since the leaf spring 61 forms a continuous wave-shaped uneven structure, the contact area with the bottom surface of the buffer damper 100 can be maximized and the buffering efficiency can be improved.

또한, 가이드돌기(150) 및 가이드홈(12a)의 구조로 인해 완충댐퍼(100)의 중심위치가 안정적으로 지지되어짐으로서 수평 유동력으로 인한 위치 이탈현상을 방지할 수 있게 된다.In addition, due to the structure of the guide protrusion 150 and the guide groove 12a, the center position of the buffer damper 100 is stably supported, thereby preventing the positional deviation caused by the horizontal flow force.

또한, 도 8은 본 발명의 제3 실시 예에 따른 구성을 나타낸 것으로서, 완충댐퍼(100)의 표면, 구체적으로 완충댐퍼(100)의 좌측면 및 우측면에는 내구성을 증대시킴과 함께 내부 응력 집중에 따른 크랙발생을 방지하기 위해 우레탄수지를 주재료로 하는 보강코팅층(140)이 박막으로 형성된다.In addition, FIG. 8 illustrates a configuration according to a third embodiment of the present invention, which increases the durability on the surface of the buffer damper 100, specifically, the left and right surfaces of the buffer damper 100, and concentrates on internal stress concentration. In order to prevent cracking, a reinforcement coating layer 140 having a urethane resin as a main material is formed as a thin film.

즉, 상기 보강코팅층(140)은 우레탄수지 40~60중량%, 맥반석분말 10~30중량%, 테프론분말 10~20중량%, 탄산염 1~10중량%의 비율로 혼합 조성을 이룸이 바람직하다.That is, the reinforcing coating layer 140 is a mixture composition of the urethane resin 40 ~ 60% by weight, elvan rock powder 10 ~ 30% by weight, teflon powder 10 ~ 20% by weight, carbonate 1 ~ 10% by weight.

이와 같은 구성을 이루게 되면, 응력 발생으로 인한 완충댐퍼(100)의 표면 크랙발생 현상이 보강코팅층(140)에 의해 방지되어질 수 있게 된다When such a configuration is achieved, surface cracking of the buffer damper 100 due to stress generation can be prevented by the reinforcing coating layer 140.

특히, 보강코팅층(140)에는 맥반석분말이 혼합됨으로서 내구성이 향상되어질 수 있게 되며, 테프론분말은 윤활성 향상에 따른 이물질 흡착이 방지되고, 탄산염은 맥반석분말의 산화현상을 방지하여 변색 발생을 방지하는 효과를 나타내게 된다.In particular, the reinforcement coating layer 140 is mixed with the elvan rock powder, so that the durability can be improved, the Teflon powder is prevented from adsorbing foreign substances according to the improved lubricity, and the carbonate prevents the occurrence of discoloration by preventing oxidation of the elvan rock powder. Will be displayed.

또한, 응용 예로는 보강코팅층(140)에 액체왁스, 하이드록시수소화붕소칼륨이 추가로 첨가되어질 수 있게 되는데, 이때에는 우레탄수지 30~50중량%, 맥반석분말 10~30중량%, 테프론분말 10~20중량%, 탄산염 1~10중량%, 액체왁스 5~10중량%, 수소화붕소나트륨 1~10중량%의 비율로 혼합이 이루어짐이 바람직하다.In addition, as an application example, the liquid wax and the hydroxy potassium borohydride may be additionally added to the reinforcing coating layer 140, in which case the urethane resin 30 to 50% by weight, ganthele powder 10 to 30% by weight, teflon powder 10 ~ It is preferable that the mixing is carried out at a ratio of 20% by weight, 1 to 10% by weight of carbonate, 5 to 10% by weight of liquid wax, and 1 to 10% by weight of sodium borohydride.

이와 같이 액체왁스 및 하이드록시수소화붕소칼륨이 보강코팅층(140)에 추가로 첨가되어지게 되면, 동절기 테프론 분말의 고형화에 따른 뭉침현상 발생이 액체왁스와의 융합작용에 의해 방지되어질 수 있게 되어 코팅층의 전체적인 두께가 균일하게 유지되어질 수 있게 되며, 수소화붕소나트륨은 흡습효능의 특징이 있기 때문에 완충댐퍼(100) 표면의 습도조절 기능을 수행하여 안정적인 탄성기능이 유지되어질 수 있게 된다When the liquid wax and potassium hydroxyborohydride are added to the reinforcing coating layer 140 as described above, the aggregation phenomenon due to the solidification of the winter Teflon powder can be prevented by the fusion action with the liquid wax so that the coating layer Since the overall thickness can be maintained uniformly, since sodium borohydride has a feature of hygroscopic effect, it is possible to maintain a stable elastic function by performing the humidity control function of the surface of the buffer damper (100).

그리고, 상기에서 본 발명의 특정한 실시 예가 설명 및 도시되었지만 본 발명의 ICT장비 개선구조가 당업자에 의해 다양하게 변형되어 실시될 수 있음은 자명한 일이다. In addition, although specific embodiments of the present invention have been described and illustrated above, it will be apparent that the ICT equipment improvement structure of the present invention may be variously modified and implemented by those skilled in the art.

그러나, 이와 같은 변형된 실시예들은 본 발명의 기술적 사상이나 범위로부터 개별적으로 이해되어져서는 안되며, 이와 같은 변형된 실시 예들은 본 발명의 첨부된 특허청구범위 내에 포함된다 해야 할 것이다.However, such modified embodiments should not be understood individually from the spirit or scope of the present invention, such modified embodiments will be included within the appended claims of the present invention.

10 : 장비본체 11 : 안전센서
20 : 기판안착부 21 : 안내홈
30 : 구동실린더 31 : 실린더로드
40 : 승강대 41 : 가이드봉
50 : 프로브핀 60 : 이동용 바퀴
100 : 완충댐퍼 110 : 탄성스프링
120 : 지지철망 130 : 지지볼
140 : 보강 코팅층10: equipment main body 11: safety sensor
20: substrate mounting portion 21: guide groove
30: driving cylinder 31: cylinder rod
40: platform 41: guide rod
50: probe pin 60: wheel for movement
100: buffer damper 110: elastic spring
120: support wire mesh 130: support ball
140: reinforcing coating layer

Claims (6)

장비본체(10)의 상면에는 회로기판이 안착되는 기판안착부(20)가 구비되고, 상기 장비본체(10)의 상부에는 구동실린더(30) 동작에 의해 승하강 구동이 이루어지는 승강대(40)가 구성되며, 상기 승강대(40)에는 승하강 구동을 가이드하기 위한 다수의 가이드봉(41)이 구성되고, 상기 가이드봉(41)과 대응되는 기판안착부(20)에는 안내홈(21)이 형성되며, 상기 승강대(40) 저면에는 회로기판의 검사를 위한 다수의 프로브핀(50)이 구비되고, 상기 장비본체(10)의 하부에는 이동용 바퀴(60)가 구성된 아이씨티 장비에 있어서,
상기 장비본체(10)와 이동용 바퀴(60) 사이에는 충격 흡수를 위한 탄성재질의 완충댐퍼(100)가 구성되되, 상기 완충댐퍼(100) 내부에는 다수의 탄성스프링(110)이 매립 구비되고, 상기 탄성스프링(110)은 상호간에 중단부에서 지지철망(120)에 의해 연결 구성되며, 상기 탄성스프링(110)의 하부에는 구 형상의 지지볼(130)이 연결 구성되고, 상기 완충댐퍼(100)의 좌측면 및 우측면에는 내구성을 증대시킴과 함께 응력으로 인한 크랙발생을 방지하기 위해 우레탄수지를 주재료로 하는 보강코팅층(140)이 박막으로 형성되며,
상기 이동용 바퀴(60)의 상부와 상기 완충댐퍼(100)의 하부면 사이에는 상기 완충댐퍼(100)와의 면접촉을 위해 연속되는 요철형상을 이루는 판스프링(61)이 용접 구성되고, 상기 장비본체(10)의 하부에는 상기 완충댐퍼(100) 및 상기 판스프링(61)의 지지를 위한 댐퍼 지지홈(12)이 형성되며, 상기 댐퍼 지지홈(12) 중심에는 가이드홈(12a)이 형성되고, 상기 가이드홈(12a)과 대응되는 상기 완충댐퍼(100)의 상면에는 가이드돌기(150)가 돌출 구비되며,
상기 댐퍼 지지홈(12)은, 상기 완충댐퍼(100)의 좌측면 및 우측면을 감싸도록 하향으로 돌출되는 제1돌출부와, 상기 완충댐퍼(100)의 하부면의 가장자리가 안착되도록 내측으로 돌출되는 제2돌출부와, 상기 제1돌출부 및 상기 제2돌출부의 사이에 형성되어 상기 판스프링(61)의 가장자리가 삽입되는 삽입홈으로 구성되고,
상기 댐퍼 지지홈(12)에 대해 상기 완충댐퍼(100)를 착탈식으로 교체가 가능하도록 구성된 것을 특징으로 하는 안전성이 개선된 아이씨티 장비.The upper surface of the equipment main body 10 is provided with a substrate seating portion 20 on which the circuit board is mounted, and the upper and lower portions of the equipment main body 10 are lifted and lowered by a driving cylinder 30 to lift and lower driving 40. It is configured, the platform 40 is formed with a plurality of guide rods 41 for guiding the lifting and lowering drive, guide grooves 21 are formed in the substrate seating portion 20 corresponding to the guide rod 41 In the bottom of the platform 40 is provided with a plurality of probe pins 50 for the inspection of the circuit board, the lower part of the equipment body 10 in the ICT equipment consisting of a wheel 60 for movement,
Between the equipment body 10 and the wheel for movement 60 is configured a shock absorber 100 of elastic material for shock absorption, a plurality of elastic springs 110 are embedded in the buffer damper 100, The elastic spring 110 is configured to be connected to each other by the support wire mesh 120 at the stop, the lower portion of the elastic spring 110 is connected to the support ball 130 of the spherical shape, the buffer damper 100 In order to increase durability and prevent cracking due to stress, the reinforcement coating layer 140 including urethane resin as a main material is formed on the left and right sides of the thin film,
Between the upper portion of the wheel 60 for movement and the lower surface of the buffer damper 100, a plate spring 61 is formed by welding a continuous concave-convex shape for the surface contact with the buffer damper 100, the equipment body A damper support groove 12 for supporting the buffer damper 100 and the leaf spring 61 is formed at a lower portion of the 10, and a guide groove 12a is formed at the center of the damper support groove 12. The guide protrusion 150 protrudes from an upper surface of the buffer damper 100 corresponding to the guide groove 12a.
The damper support groove 12 protrudes inwardly so that the first protrusion protrudes downward to surround the left and right surfaces of the buffer damper 100 and the edge of the lower surface of the buffer damper 100 is seated. It is formed between the second projection and the first projection and the second projection portion is composed of the insertion groove into which the edge of the leaf spring 61 is inserted,
Safety-improved IC equipment, characterized in that the damper support groove 12 is configured to be removable to replace the buffer damper (100). 삭제delete 삭제delete 청구항 1에 있어서,
상기 보강코팅층(140)은 우레탄수지, 맥반석분말, 테프론분말, 탄산염의 혼합 조성을 이루는 것을 특징으로 하는 안전성이 개선된 아이씨티 장비.The method according to claim 1,
The reinforcement coating layer 140 is improved safety equipment, characterized in that the urethane resin, elvan stone powder, Teflon powder, carbonate mixed composition. 청구항 4에 있어서,
상기 보강코팅층(140)에는 액체왁스, 수소화붕소나트륨이 추가로 첨가된 것을 특징으로 하는 안전성이 개선된 아이씨티 장비.The method according to claim 4,
Safety-improved ICT equipment, characterized in that the liquid wax, sodium borohydride is additionally added to the reinforcement coating layer 140. 삭제delete
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