KR102029726B1 - Coil type unit for wireless power transmission and manufacturing method of coil type unit for wireless power transmission - Google Patents

Abstract

The present invention relates to a method for manufacturing a coil-type unit for wireless power transmission and a coil-type unit for wireless power transmission, the coil substrate having a coil pattern formed to minimize the thickness, slim, and increase the radio power transmission efficiency; A magnetic layer disposed on a lower surface of the coil substrate, the magnetic layer being divided into a first magnetic layer and a second magnetic layer, wherein the second magnetic layer is a sintered body in which at least one magnetic sheet is laminated, and the first magnetic layer is the second magnetic layer. The present invention relates to a coil type unit for wireless power transmission and a coil type unit for wireless power transmission interposed between a magnetic layer and the coil substrate, the coil type unit comprising a sintered magnetic body integral with the second magnetic layer.

Description

Manufacturing method of coil type unit for wireless power transmission and coil type unit for wireless power transmission {COIL TYPE UNIT FOR WIRELESS POWER TRANSMISSION AND MANUFACTURING METHOD OF COIL TYPE UNIT FOR WIRELESS POWER TRANSMISSION}

The present invention relates to a coiled unit for wireless power transmission and a coiled unit for wireless power transmission.

Recently, in order to charge a secondary battery embedded in a portable terminal, a system for wirelessly transmitting power has been studied.

In general, a wireless power transmitter includes a wireless power transmitter for transmitting power and a wireless power receiver for receiving and storing power.

The wireless power transmitter transmits and receives power using electromagnetic induction. To this end, a coil is formed inside each of the wireless power transmitters and a magnetic material is formed to efficiently form a magnetic path generated by the coil.

At this time, if the coil is made in the form of winding and placed on the surface of the magnetic body, the thickness becomes thick, so instead of manufacturing the coil in the form of winding, in recent years, the coil sheet patterning the coil on the upper or lower surface of the flexible printed circuit board (FPCB) To manufacture a wireless power transmitter.

The coil sheet is fixedly attached to one surface of the magnetic body, and generally uses an adhesive film or an adhesive tape for firm adhesion between the coil sheet and the magnetic body. However, when the coil sheet is attached to the magnetic body with an adhesive film or adhesive tape, the thickness of the wireless power transmitter becomes thick overall due to the thickness of the adhesive film or tape, and the cover film on both sides of the bonding tape is removed during the bonding. The additional process such as to increase the process cost and becomes inconvenient to manufacture.

Therefore, in order to cope with the recent trend of favoring thin devices, there is a need to develop a coil type unit for a thinner wireless power transmitter and a wireless power transmitter and electronic device having the same.

One object of the present invention is to provide a coil-type unit for wireless power transmission and a method of manufacturing the same that can be slimmed down to a minimum thickness.

Another object of the present invention is to provide a coil type unit for a wireless power transmitter and a method of manufacturing the same, which can reduce the process cost and facilitate the manufacture thereof.

Still another object of the present invention is to provide a coil type unit for a wireless power transmitter and a method of manufacturing the same, which can improve radio power transmission efficiency.

The above object of the coil-type unit for wireless power transmission according to the present invention, the coil substrate is formed with a coil pattern; A magnetic layer disposed on a lower surface of the coil substrate, the magnetic layer being divided into a first magnetic layer and a second magnetic layer, wherein the second magnetic layer is a sintered body in which at least one magnetic sheet is laminated, and the first magnetic layer is the second magnetic layer. It is achieved by providing a coil-type unit for wireless power transmission interposed between a magnetic layer and the coil substrate and composed of a sintered magnetic body integral with the second magnetic layer.

Another object of the coil-type unit for wireless power transmission according to the present invention is achieved by providing a coil-type unit for wireless power transmission including a coil substrate having an insulating layer formed by dispersing a magnetic powder in an insulating resin.

The above object of the method for manufacturing a coil type unit for wireless power transmission according to the present invention comprises the steps of: preparing a coil substrate having a coil pattern; Preparing a second magnetic layer composed of a sintered laminate; Stacking a first magnetic layer in a semi-cured state on the second magnetic layer; Stacking the coil substrate on the first magnetic layer; It is achieved by providing a method of manufacturing a coil-type unit for wireless power transmission, including the step of firing and curing the first magnetic layer and the second magnetic layer.

As described above, the coil-type unit for wireless power transmission, the method for manufacturing the same, and the wireless power transmission apparatus according to the present invention include a first magnetic layer made of a magnetic sheet in a semi-cured state interposed between the coil substrate and the second magnetic layer. By including, the thickness of the coil can be minimized.

In addition, the coil-type unit for wireless power transmission according to the present invention includes a coil substrate having an insulating layer formed by dispersing magnetic powder in an insulating resin, thereby increasing the radio power transmission efficiency.

In addition, the coil-type unit for wireless power transmission and a method of manufacturing the same according to the present invention comprises the steps of preparing a coil substrate having a coil pattern; Preparing a second magnetic layer composed of a sintered laminate; Stacking a first magnetic layer in a semi-cured state on the second magnetic layer; Stacking the coil substrate on the first magnetic layer; And curing the first magnetic layer and the second magnetic layer by sintering them, thereby eliminating the need for an additional process such as attaching a bonding tape or applying a bonding agent, thereby reducing the process cost as well. There is an advantage that can facilitate the manufacture.

1 is an exploded perspective view of a coil type unit for wireless power transmission according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view taken along line II ′ of FIG. 1.
3 is a flowchart illustrating one embodiment of a method for manufacturing a coil type unit for wireless power transmission according to the present invention;
Figure 4 is a flow chart of one embodiment of the coil substrate preparation step according to the present invention.
5 is a flow chart of another embodiment of the coil substrate preparation step according to the present invention.
6 is a flowchart illustrating a coil substrate preparation step according to an embodiment of the present invention.
7 is a process chart for explaining one process of the coil substrate preparation step according to another embodiment of the present invention

Advantages and features of the present invention, techniques for achieving them, and the like will become apparent with reference to the embodiments described below in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below but may be implemented in various different forms. The present embodiment may be provided to make the disclosure of the present invention complete, and to completely inform the scope of the invention to those skilled in the art.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. In this specification, the singular also includes the plural unless specifically stated otherwise in the phrase. As used herein, 'comprise' and / or 'comprising' refers to a component, step, operation and / or element that is mentioned in the presence of one or more other components, steps, operations and / or elements. Or does not exclude additions.

Coil Unit for Wireless Power Transmitter

Hereinafter, with reference to the accompanying drawings will be described in detail the configuration and effect of the present invention.

1 is an exploded perspective view of a coil-type unit 100 for wireless power transmission according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along line II ′ of FIG. 1. In addition, the components of the drawings are not necessarily drawn to scale, and for example, the size of some of the components of the drawings may be exaggerated relative to other components to facilitate understanding of the present invention.

1 and 2, the coil type unit 100 for wireless power transmission according to the present embodiment may include a coil substrate 110 and a magnetic layer 120.

The coil substrate 110 may include an insulation layer 111 and a coil pattern 115, a circuit unit 117, and an antenna unit 116 formed on both surfaces or one surface of the insulation layer 111.

The coil substrate 110 is composed of an insulated substrate, for example, a printed circuit board (PCB), a ceramic substrate, a pre-molded substrate, or a direct bonded copper (DBC) substrate, It may be an insulated metal substrate (IMS).

In particular, as the coil substrate 110 according to the present embodiment, a flexible PCB having a thin thickness and a wiring pattern such as a film or a thin printed circuit board may be used.

In this case, as shown in FIG. 2, the insulating layer 111 of the coil substrate 110 may include the magnetic powder 113 to form the magnetic path of the magnetic field formed by the coil pattern 115. It can be made by dispersing in.

The insulation resin 112 may be epoxy or resin having excellent insulation performance, but is not limited thereto, and any insulation material may be used.

The magnetic powder 113 may use a ferrite-based composition, and may be Fe, Fe-Si, Fe-Al-Si, Fe-Ni, Fe-Co, or the like, but is not necessarily limited thereto. Any insulating material is possible.

That is, in the coil type unit 100 for wireless power transmission according to the present embodiment, the insulating layer 111 of the coil substrate 110 includes a magnetic powder 113 instead of a nonmagnetic filler such as silica material, thereby providing a coil pattern. By efficiently forming the magnetic path of the magnetic field formed by the 115, the transmission efficiency of the radio power can be improved.

The coil pattern 115 may be formed in the form of a wiring pattern on at least one surface of the coil substrate 110. The coil pattern 115 according to the present embodiment is formed in a spiral shape on both surfaces or one surface formed by the coil substrate 110, and both ends thereof are electrically connected to the circuit unit 117.

When the coil pattern 115 is formed on both sides of the coil substrate 110, each coil pattern 115 is electrically connected at both ends to form a parallel circuit as a whole, or one end of the center is connected to form a series circuit. Can be formed. To this end, a conductive via (not shown) for electrically connecting the coil patterns 115 may be formed in the coil substrate 110.

Meanwhile, in the present embodiment, the coil pattern 115 is formed in the form of a rectangular swirl as a whole, but the present invention is not limited thereto, and various applications are possible, such as forming a circular or polygonal swirl. Do.

In addition, an insulating protective layer (eg, a resin insulating layer, not shown) may be further formed on the coil pattern 115 to protect the coil pattern from the outside as necessary.

The circuit unit 117 may be formed on one side of the coil substrate 110 to be electrically connected to the coil pattern 115. In addition, various passive elements or active elements may be mounted in the circuit unit 117, and may be electrically connected to a battery storing power to transmit power applied from the coil pattern 115 to the battery.

The antenna unit 116 may be formed around the coil pattern 115. In detail, the antenna unit 116 may be formed along the edge of the coil substrate 110, and the coil pattern 115 may be disposed in the antenna unit 116.

The antenna unit 116 may be formed in the form of a wiring pattern like the coil pattern 115. The antenna unit 116 according to the present embodiment may be used for Near Field Communication (NFC), but is not limited thereto.

Meanwhile, in the present embodiment, the case in which the antenna unit 116 is formed outside the coil pattern 115 has been described as an example, but the present invention is not limited thereto. That is, the antenna unit 116 may be configured to be disposed inside the coil pattern 115, and different applications may be disposed on the inner side and the outer side of the coil pattern 115 according to various applications as necessary. This is possible.

The magnetic layer 120 has a flat plate shape (or sheet shape), and the coil substrate 110 is attached to one surface thereof. The magnetic layer 120 is provided to efficiently form a magnetic path of the magnetic field generated by the coil pattern 115. To this end, the magnetic layer 120 is preferably formed of a material that can be easily formed, for example, may be formed by stacking a magnetic sheet such as a ferrite sheet (ferrite sheet).

However, the magnetic layer 120 is not limited to a ferrite sheet as a magnetic sheet, and employs at least one of a ferrite sheet, a metal sheet, and a hybrid type sheet in which a metal and a ferrite are applied in combination. Can be.

At this time, the magnetic layer 120 is located on the lower surface of the coil substrate 110, as shown in Figure 1, divided into a first magnetic layer 121 and a second magnetic layer 122, the uppermost of the second magnetic layer 122 The first magnetic layer 121 is stacked.

The first magnetic layer 121 and the second magnetic layer 122 may be made of the same material, but the present embodiment is not limited thereto.

The second magnetic layer 122 may include at least one magnetic sheet. Preferably, the second magnetic layer 122 may be formed of a magnetic body integrally sintered by stacking and firing a plurality of magnetic sheets. At this time, in order to reduce the thickness of the entire coil-shaped unit 100 for wireless power transmission, the thickness of the second magnetic layer 122 is preferably 60 ~ 100um.

The first magnetic layer 121 is composed of a magnetic sheet in a semi-cured (B-stage) state. This semi-cured magnetic sheet is maintained in the B-stage state before complete curing, that is, the firing process, so that the bonding performance can be maintained, and the adhesion to the extent that the adhesive can be temporarily fixed by the normal temperature or the heating process can be maintained. Can be exercised. That is, the first magnetic layer 121 temporarily fixes the coil substrate 110 stacked on the upper portion in a semi-cured state, and is hardened integrally with the second magnetic layer through a baking process. It may serve to bond the second magnetic layer 122.

The thicker the first magnetic layer 121 may firmly bond the second magnetic layer 122 and the coil substrate 110 to each other, but the first magnetic layer 121 may be thinner for the entire coil type unit 100 for wireless power transmission. ), The thickness is preferably 5 to 30um.

That is, the coil-type unit 100 for wireless power transmission according to the present embodiment is configured by forming the first magnetic layer 121 as a semi-cured magnetic sheet without attaching a bonding tape or a bonding film or applying a separate adhesive. The magnetic layer 120 and the coil substrate 110 may be integrally bonded to each other.

In general, the protective film is formed on both sides of the laminated film in order to prevent contamination by foreign matter. Therefore, the process of removing the protective film is required when the bonding film is attached, compared with the prior art using the bonding film, this embodiment can reduce the number of processes because the process of attaching the bonding film and the removal of the protective film can be omitted. have.

In addition, since the magnetic layer 120 and the coil substrate 110 can be attached without a bonding film and a bonding tape having poor heat resistance in general, a coil unit for wireless power transmission having high durability even with heat generated from the coil pattern 115 ( 100) can be produced.

In addition, since the magnetic layer 120 and the coil substrate 110 may be attached without a bonding film and a bonding tape having a thickness of 20 to 30 μm, the coil unit 100 for wireless power transmission may be manufactured as a whole.

Manufacturing method of coil type unit for wireless power transmitter

3 is a flowchart illustrating a method of manufacturing a coil-type unit for wireless power transmission according to an embodiment of the present invention.

Referring to FIG. 3, in the method of manufacturing a coil-type unit for wireless power transmission according to an embodiment of the present invention, preparing a coil substrate having a coil pattern (S100), and preparing a second magnetic layer made of a sintered laminate. Step S200, stacking the first magnetic layer in a semi-cured state on the second magnetic layer (S300), stacking the coil substrate on the first magnetic layer (S400) and the first magnetic layer and the second It may include the step (S500) by firing the magnetic layer.

The preparing of the coil substrate (S100) is a step of manufacturing the coil substrate having the coil pattern formed on both surfaces or one surface of the insulating layer.

In this case, the coil substrate may be manufactured by various methods. Referring to FIG. 4, a step of manufacturing an insulating layer using an insulating resin containing magnetic powder (S101), and laminating a copper thin film on the upper and lower surfaces of the insulating layer. And a pressing step (S102), a coil pattern forming step (S103) and a via hole forming step (S104) for patterning the coil on the copper thin film.

The manufacturing of the insulating layer using the insulating resin containing the magnetic powder (S101) is a step of manufacturing the insulating layer of the coil substrate capable of efficiently forming the magnetic path of the magnetic field.

First, the magnetic powder is formed into a flake form using a milling machine, and then dispersed in an insulating resin to form a sheet. Next, the molded sheet is dried at room temperature for 2 hours, dried at 80 ° C. for 1 hour in a dryer such as a vacuum oven, and then dried again at 110 ° C. for 1 hour to form a semi-cured state.

In this case, the insulation resin may be epoxy or resin having excellent insulation performance, but is not limited thereto. In addition, the magnetic powder may be a ferrite-based composition, and may be Fe, Fe-Si, Fe-Al-Si, Fe-Ni, Fe-Co, and the like, but is not limited thereto, and if the magnetic insulating material Anything is possible.

Stacking and compressing the copper thin film on the upper and lower surfaces of the insulating layer (S102), as shown in Figures 6a and 6b is thin on the upper and lower surfaces of the insulating layer 111 made in the insulating layer manufacturing step (S101). The copper thin film 114 is laminated and completely hardened using a vacuum press. The maximum temperature at this time is 230 ℃, the maximum pressure is 2 MPa.

In the coil pattern forming step S103 and the via hole forming step S104 for patterning the coil, a coil pattern is formed on the upper and lower surfaces of the cured coil substrate, and coil patterns formed on the upper and lower surfaces are electrically In order to form a parallel circuit as a whole or to form a series circuit, a conductive via hole for connecting one end of both ends or the center is formed. The coil pattern according to the present exemplary embodiment may be patterned in a spiral shape having various shapes such as quadrangular, circular, and polygonal shapes.

In addition, the method of manufacturing a coil-type unit for wireless power transmission according to the present embodiment may further include patterning an antenna unit on the outer side of the coil pattern or forming a circuit unit formed on a part of the coil substrate.

On the other hand, referring to Figure 5, the coil substrate preparation step (S100) is a first RCC manufacturing step (S110) comprising an insulating resin containing a magnetic powder, a second RCC manufacturing step comprising an insulating resin containing a magnetic powder In operation S120, pressing the first RCC and the second RCC may be performed (S130), a coil pattern forming step S140 of patterning a coil, and a via hole forming step S150.

The first RCC manufacturing step (S110) and the second RCC manufacturing step (S120) is a step of coating an insulating resin of 0 ~ 80um thickness to the copper thin film (COPPER FOIL). In this case, the insulating resin may contain magnetic powder to efficiently form a magnetic path of the magnetic field.

In this case, the insulating resin may be epoxy or resin having excellent insulating performance, but is not limited thereto. In addition, the magnetic powder may be a ferrite-based composition and may be Fe, Fe-Si, Fe-Al-Si, Fe-Ni, Fe-Co and the like. However, the present invention is not limited thereto, and any magnetic material may be used.

The pressing of the first RCC and the second RCC (S130) may include pressing the first RCC and the second RCC to manufacture a coil substrate that is a double-sided board.

In this case, as shown in FIG. 7, the first RCC and the second RCC may be supplied to a roll press laminator and laminated through a roll compression method, and then the first RCC and the second RCC may be hardened by hardening.

In the coil pattern forming step (S140) and the via hole forming step (S150) of patterning the coil, a coil pattern is formed on the upper and lower surfaces of the cured coil substrate, and coil patterns formed on the upper and lower surfaces are electrically connected to form a parallel circuit as a whole. Comprising, or forming a conductive via hole for connecting one end of both ends or the center so as to form a series circuit. The coil pattern according to the present exemplary embodiment may be patterned in a spiral shape having various shapes such as quadrangular, circular, and polygonal shapes.

That is, the method of manufacturing a coil-type unit for wireless power transmission according to the present invention includes preparing a coil substrate such that the insulating layer includes magnetic powder having magnetic properties instead of the nonmagnetic filler made of silica (S100). By doing so, it is possible to manufacture a coil unit for a wireless power transmission which can efficiently form a magnetic path of the magnetic field formed by the coil pattern to improve the transmission efficiency of the wireless power.

The preparing of the second magnetic layer formed of the sintered laminate (S200) may include stacking a plurality of magnetic sheets and firing the magnetic sheets by pressing and heating the magnetic sheets.

The magnetic sheet may use at least one of a ferrite sheet, a metal sheet, and a hybrid type sheet in which a metal and a ferrite are applied in combination.

In this case, in consideration of the efficiency of the magnetic path formation and the thinning of the coil-type unit for wireless power transmission, it is preferable to form 60 to 100um by laminating 4 to 20 layers of magnetic sheets having a thickness of 5 to 15um. It is not.

The step (S300) of laminating a first magnetic layer in a semi-cured state on the second magnetic layer may include applying an insulating resin containing magnetic powder on the second magnetic layer; And drying or heating the first magnetic layer at room temperature to form a semi-cured state.

First, a mixed resin containing a magnetic powder or a metal powder in a resin such as epoxy is prepared, and then coated in a thin film form. At this time, in consideration of the thickness of the first magnetic layer is preferably applied to 20 ~ 30um. Next, the first magnetic layer may be dried at room temperature or heated to form a semi-cured state. For example, the first magnetic layer may be dried at 100 ° C. to 120 ° C. for 1 minute to 3 minutes to manufacture a semi-cured magnetic sheet. However, depending on the type of insulating resin used, the weight of the magnetic powder or metal powder contained, and the thickness of the coating, the temperature or time of thermal drying may be adjusted.

The step of stacking the coil substrate on the first magnetic layer (S400) and the step of firing and curing the first magnetic layer and the second magnetic layer (S500), laminating the coil substrate to be attached to one surface of the magnetic layer. to be.

The first magnetic layer in the semi-cured state is maintained in the B-stage state before complete curing, that is, the firing process, so that the bonding performance can be maintained, and the adhesive strength to the extent that the adhesive can be temporarily fixed by the normal temperature or the heating process can be maintained. Can be exercised.

That is, the first magnetic layer may serve to bond the coil substrate and the second magnetic layer by temporarily fixing the coil substrate stacked on the upper portion in a semi-cured state and being cured integrally with the second magnetic layer through a firing process. At this time, the maximum temperature may be 230 ℃ and the maximum pressure may be 2 MPa.

That is, the method of manufacturing a coil-type unit for wireless power transmission according to the present embodiment includes preparing a second magnetic layer made of a sintered laminate without attaching a bonding tape or a bonding film or applying a bonding agent (S200). Stacking the first magnetic layer in a semi-cured state on the second magnetic layer (S300), laminating the coil substrate on the first magnetic layer (S400), and baking and curing the first magnetic layer and the second magnetic layer. By including (S500) it can be made to be attached to the coil substrate on one surface of the magnetic layer.

In general, the protective film is formed on both sides of the laminated film in order to prevent contamination by foreign matter. Therefore, the process of removing the protective film is additionally required when the bonding film is attached, and compared to the prior art using the bonding film, the present embodiment can omit the process of attaching the bonding film and removing the protective film. Can be reduced.

In addition, since the magnetic layer and the coil substrate can be attached without the bonding film and the tape having poor heat resistance, it is possible to manufacture a coil-type unit for wireless power transmission having high durability even in the heat generated from the coil pattern.

In addition, the method of manufacturing a coil-type unit for wireless power transmission according to the present embodiment may manufacture a coil-type unit for wireless power transmission without a laminated film and a bonding tape having a thickness of 20 to 30 μm, thereby allowing thinning as a whole. A coil type unit for wireless power transmission can be provided.

The foregoing detailed description illustrates the present invention. In addition, the foregoing description merely shows and describes preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. That is, changes or modifications may be made within the scope of the concept of the invention disclosed in this specification, the scope equivalent to the disclosed contents, and / or the skill or knowledge in the art. The above-described embodiments are for explaining the best state in carrying out the present invention, the use of other inventions such as the present invention in other state known in the art, and the specific fields of application and uses of the invention are required. Various changes are also possible. Accordingly, the detailed description of the invention is not intended to limit the invention to the disclosed embodiments. Also, the appended claims should be construed to include other embodiments.

100: coil type unit for wireless power transmission
110: coil substrate
111: insulation layer
112: insulating resin
113: magnetic powder
114: copper thin film
115: coil pattern
116: antenna unit
117: circuit part
120: magnetic layer
121: first magnetic layer
122: second magnetic layer

Claims (13)

A coil substrate having a coil pattern formed thereon;
It includes; a magnetic layer located on the lower surface of the coil substrate, divided into a first magnetic layer and a second magnetic layer,
The second magnetic layer is a sintered body in which at least one magnetic sheet is laminated,
Wherein the first magnetic layer is a cured layer of an insulating resin containing magnetic powder and is interposed between the second magnetic layer and the coil substrate and is in direct contact with the coil substrate.
delete The method of claim 1,
The coil substrate,
A coil type unit for wireless power transmission comprising an insulating layer formed by dispersing a magnetic powder into an insulating resin.
The method of claim 1,
The coil pattern,
A coil type unit for wireless power transmission formed on at least one surface of the coil substrate in the form of a wiring pattern.
The method of claim 1,
The coil substrate,
The coil type unit for wireless power transmission further comprising an antenna unit formed around the coil pattern.
The method of claim 1,
The magnetic sheet is a coil type unit for wireless power transmission using at least one of a ferrite sheet, a metal sheet and a hybrid type sheet in which metal and ferrite are applied in combination.
The method of claim 1,
The first magnetic layer is,
Coil-type unit for wireless power transmission having a thickness of 5um to 30um.
The method of claim 1,
The second magnetic layer is,
Coil type unit for wireless power transmission with a thickness of 60um to 100um.
Preparing a coil substrate having a coil pattern formed thereon;
Preparing a second magnetic layer composed of a sintered laminate;
Stacking a first magnetic layer in a semi-cured state on the second magnetic layer;
Stacking the coil substrate on the first magnetic layer; And
Including firing and curing the first magnetic layer.
Wherein the first magnetic layer is a cured layer of an insulating resin containing magnetic powder and is in direct contact with the coil substrate.
The method of claim 9,
Preparing the second magnetic layer,
Stacking a plurality of magnetic sheets;
Firing by pressing and heating the magnetic sheet and a method of manufacturing a coil type unit for wireless power transmission comprising a.
The method of claim 9,
In the step of laminating a first magnetic layer on the second magnetic layer,
The first magnetic layer is applied to the insulating resin containing the magnetic powder on the second magnetic layer; And
Drying or heating the first magnetic layer at room temperature to form a semi-cured state; manufacturing method of a coil-type unit for wireless power transmission comprising a.
The method of claim 9,
The coil substrate preparation step,
Preparing an insulating layer using an insulating resin containing magnetic powder;
Stacking and compressing a copper thin film on the upper and lower surfaces of the insulating layer;
A coil pattern forming step of patterning a coil on the copper thin film; And
Via-hole forming step; manufacturing method of the coil type unit for wireless power transmission comprising a.
The method of claim 9,
The coil substrate preparation step,
A first RCC manufacturing step comprising a resin containing a magnetic powder;
A second RCC manufacturing step comprising a resin containing magnetic powder;
Pressing the first RCC and the second RCC;
A coil pattern forming step of patterning a coil; And
Method of manufacturing a coil-type unit for wireless power transmission comprising a via hole forming step.

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