KR102026469B1 - Method of manufacturing stretchable device and Stretchable device manufactured by the same - Google Patents

Abstract

The present invention relates to a method for manufacturing a stretchable device, comprising a coating step, a first curing step, an embedding step, a second curing step, an extension step, and a wiring connection step. The coating step forms a coating layer of elastic elastomer material on the base substrate. The first curing step cures the coating layer to have a first elastic modulus so that the module can be embedded in the coating layer. The embedding step embeds the module in the coating layer such that the step between the top surface of the module and the top surface of the coating layer is less than or equal to a predetermined threshold step. In the second curing step, the coating layer is cured in a state in which the coating layer has a second elastic modulus higher than the first elastic modulus so that the module is fixed to the coating layer. The stretching step stretches the base substrate and the coating layer while the module is embedded in the coating layer. In the wiring connection step, the wiring is connected to the terminals of the module while the base substrate and the coating layer are extended.

Description

Method of manufacturing a stretchable device and a stretchable device manufactured thereby Method of manufacturing stretchable device and Stretchable device manufactured by the same

BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to a method for manufacturing a stretchable device and to a stretchable device manufactured thereby, to a stretchable device manufacturing method and a stretchable device manufactured thereby for manufacturing a device that can be bent as well as flexible. .

BACKGROUND With the development of electronic technology, various display devices such as TVs, notebook PCs, tablet PCs, mobile phones, and the like have become common.

Recently, there has been a growing interest in flexing electronic devices, that is, flexible electronic devices. Flexible electronics (flexible electronics) is a technology that implements an electronic circuit / device that can bend or fold by mounting an electronic device on a flexible substrate such as plastic. In particular, flexible electronics are attracting attention as a next generation technology in the display field.

Along with flexible electronics, there is a need for an increasing number of electronic devices, that is, stretchable electronic devices. A flexible electronic device is a device that bends while maintaining its entire length, while a flexible electronic device is a device that not only bends but also increases in length.

Stretchable electronics are expected to enable new applications in electronics. Potential applications include electronic skins and skin sensors for moving robotic devices, wearable electronics, and bio-integrated devices. In addition, the stretchable device may be usefully used in various fields including a display or a sensor array.

A manufacturing method for mass production of such a flexible device has not been developed yet.

Korean Laid-Open Patent Publication No. 2016-0088489 (published Jul. 26, 2016, title of Invention: stretchable display device and manufacturing method thereof)

Accordingly, the problem to be solved by the present invention is to solve such a conventional problem, by dividing the curing step of the coating layer in two stages before and after embedding the module, by performing the wiring connection in the stretched state of the embedded module SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing a stretchable device capable of mass producing a stretchable device, and a stretchable device manufactured thereby.

The stretchable device manufacturing method of the present invention to achieve the above object, the coating step of forming a coating layer of the elastic elastomer material on the base substrate; A first curing step of curing the coating layer with a first elastic modulus so that a module can be embedded in the coating layer; An embedding step of embedding the module in the coating layer such that the step between the top surface of the module and the top surface of the coating layer is equal to or less than a predetermined critical step; A second curing step of curing the coating layer in a state having a second elastic modulus higher than the first elastic modulus so that the module is fixed to the coating layer; Stretching the base substrate and the coating layer while the module is embedded in the coating layer; A wire connection step of connecting wires to terminals of the module while the base substrate and the coating layer are extended; And a coating layer etching step performed after any one of the second curing step, the stretching step, and the wiring connection step to etch a part of the coating layer in order to improve elasticity of the coating layer. do.

In the flexible device manufacturing method according to the invention, the module is a light emitting element, the embedding step, the module on the coating layer such that the upper surface of the module protrudes within the critical step or less than the upper surface of the coating layer. Can be embedded

In the method of manufacturing a stretchable device according to the present invention, the module is a light emitting device, and in the embedding step, the module is placed on the coating layer such that the upper surface of the module is recessed within the critical step or less than the upper surface of the coating layer. Can be embedded

In the method of manufacturing a stretchable device according to the present invention, the module is a light emitting element, and after the stretching step, a portion of the coating layer in contact with the side surface of the module is formed to improve the linearity of light emitted from the module to form a light blocking film. A light blocking film forming step may be further included.

A method of manufacturing a stretchable device according to the present invention, wherein the module is a light emitting device, and after the stretching step, a coating layer removing step of removing a portion of the coating layer in contact with the side of the module so that at least a portion of the side of the module is exposed; It may further include.

In the flexible device manufacturing method according to the present invention, the wiring connected to the terminal of the module in the wiring connection step may be formed of a flexible material.

In the flexible device manufacturing method according to the present invention, after the wiring connection step, in order to improve the bonding strength of the wiring to the coating layer, the interface modification step of modifying the interface between the coating layer and the wiring; have.

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Further, in order to achieve the above object, the stretchable device of the present invention is characterized by being manufactured by a stretchable device manufacturing method.

According to the stretchable device manufacturing method of the present invention and the stretchable device manufactured thereby, the stretchable device can be produced in large quantities.

Further, according to the method for manufacturing a stretchable device of the present invention and the stretchable device manufactured thereby, it is possible to manufacture a product having high linearity or light diffusivity of light as needed.

Further, according to the method of manufacturing the stretchable device of the present invention and the stretchable device manufactured thereby, the bonding force of the wiring to the coating layer can be improved.

Furthermore, according to the method of manufacturing the stretchable device of the present invention and the stretchable device produced thereby, the stretchability of the coating layer can be improved.

1 is a flow chart of a method of manufacturing a stretchable device according to a first embodiment of the present invention,
FIG. 2 is a schematic view illustrating the method of manufacturing the stretchable device of FIG. 1;
3 is a diagram illustrating an example of an embedding step of the method of manufacturing the flexible device of FIG. 1;
4 is a view showing another example of the embedding step of the flexible device manufacturing method of FIG.
5 is a view for explaining a wiring reforming step of the method of manufacturing a flexible device of FIG.
6 is a view for explaining a coating layer etching step of the method of manufacturing a flexible device of FIG.
7 is a flowchart of a method of manufacturing a stretchable device according to a second embodiment of the present invention;
FIG. 8 is a view for explaining a light blocking film forming step of the stretchable device manufacturing method of FIG. 7;
9 is a flow chart of a method of manufacturing a stretchable device according to a third embodiment of the present invention;
FIG. 10 is a view for explaining a coating layer removing step of the stretchable device manufacturing method of FIG. 9.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a stretchable device manufacturing method and a stretchable device manufactured thereby according to the present invention will be described in detail with reference to the accompanying drawings.

1 is a flow chart of a method of manufacturing a stretchable device according to a first embodiment of the present invention, FIG. 2 is a view schematically showing the method of manufacturing the stretchable device of FIG. 1, and FIG. 3 is a manufacture of the stretchable device of FIG. 4 shows an example of an embedding step of the method, and FIG. 4 shows another example of the embedding step of the flexible device manufacturing method of FIG. 1, and FIG. 5 is a wiring reforming step of the flexible device manufacturing method of FIG. 6 is a view for explaining a coating layer etching step of the stretchable device manufacturing method of FIG.

1 to 6, the method for manufacturing a stretchable device according to the present embodiment is not only to bend, but also to manufacture a device having a stretchable length, and a coating step S10 and a first curing step S20. And an embedding step S30, a second curing step S40, an extension step S50, a wiring connection step S60, an interface modification step S70, and a coating layer etching step S80. .

Devices herein may include display devices, electronic skins, sensor arrays, and the like.

The coating step (S10) forms a coating layer 20 of the elastic elastomer material on the base substrate 10.

The stretchable elastomeric coating layer 20 is formed to be about 20% stretchable after the second curing step S40, which will be described later, and a method of spin coating, bar coating, and blade coating on the base substrate 10. It can be formed by.

In the first curing step S20, the coating layer 20 is cured in a state in which the coating layer 20 has a first elastic modulus so that the module 30 may be embedded in the coating layer 20.

Since the coating layer 20 formed by the coating step (S10) is close to a liquid state with a relatively low viscosity, the state of the coating layer 20 after the coating step (S10) is not suitable for embedding the module 30.

That is, when the module 30 is transferred to the coating layer 20 having a substantially low viscosity, the adhesive force of the coating layer 20 is low, so that the module 30 may not be properly transferred to the coating layer 20, and even the module may be. Even if the 30 is transferred to the coating layer 20, the low viscosity of the coating layer 20 supporting the module 30 causes the position of the module 30 to change during the process, thereby causing a problem in that the precision of the product is lowered.

Therefore, in the first curing step (S20) by supplying heat or light (H1) to the coating layer 20 by curing the coating layer 20 in a state having a first elastic modulus, the module 30 to the coating layer 20 Provides enough viscosity to be embedded.

Here, the state in which the coating layer 20 has the first elastic modulus is that the adhesive force of the coating layer 20 is generated so that the module 30 can be transferred to the coating layer 20, and the module 30 is the coating layer 20. It has a modulus of elasticity that can be embedded in the elastic modulus, and has a modulus of elasticity that can support the position of the module 30 to some extent so that the positional variation of the module 30 transferred to the coating layer 20 does not occur. Branch means state.

In the embedding step S30, the module 30 is embedded in the coating layer 20 such that the steps t1 and t2 of the upper surface 31 of the module and the upper surface 21 of the coating layer are less than or equal to a predetermined critical step.

As a method of connecting the wires to the terminals of the module 30 transferred to the coating layer 20, various methods such as using a conventional semiconductor fab line including a direct imaging method, a lift-off method, exposure, development, etching, etc. There is this.

In the process of transferring the module 30 to the coating layer 20, when the step difference between the upper surface 31 of the module and the upper surface 21 of the coating layer is large, it is difficult to use a method using a conventional semiconductor fab line, The direct imaging method or the lift-off method should be used. In this case, there is a problem in that productivity is lowered.

When the steps t1 and t2 of the upper surface 31 of the module and the upper surface 21 of the coating layer are less than or equal to the critical step, the upper surface 31 of the module and the upper surface 21 of the coating layer are almost horizontal, so that the coating layer 20 When connecting the wire to the terminal of the transferred module 30 can be used a method using a conventional semiconductor fab line, thereby improving the mass production of the manufacturing method of the present invention.

Embedding step (S30) of the present embodiment is characterized in that the transfer of the module 30 to the coating layer 20 so that the step (t1, t2) of the upper surface 31 of the module and the upper surface 21 of the coating layer is less than the critical step. And the term "embedding" was used to differentiate from normal transcription.

For example, the critical step of this embodiment may be about 5 μm.

When the module 30 embedded in the coating layer 20 is a light emitting device, it may be necessary to diffuse light L emitted from the light emitting device, and the light L emitted from the light emitting device may be straightened depending on the purpose. It may be necessary. According to this need, the module 30 may be variously disposed with respect to the coating layer 20.

Referring to FIG. 3, as an example of the embedding step, the module 30 may be embedded in the coating layer 20 such that the upper surface 31 of the module protrudes within a critical step or less than the upper surface 21 of the coating layer.

In this case, while the side of the module 30 is exposed to the upper side of the coating layer 20, the light L irradiated from the module 30 is irradiated not only in the upper side but also in the left and right directions, and thus the diffusivity of the light L may be improved. have.

Referring to FIG. 4, as another example of the embedding step, the module 30 may be embedded in the coating layer 20 such that the upper surface 31 of the module is recessed within a critical step or less than the upper surface 21 of the coating layer. .

In this case, the side of the module 30 is buried in the coating layer 20 is not exposed to the outside at all, the light (L) irradiated from the module 30 is irradiated only to the upper side to improve the straightness of the light (L). Can be.

In the second curing step S40, the coating layer 20 is cured in a state in which the coating layer 20 has a second elastic modulus higher than the first elastic modulus so that the module 30 is fixed to the coating layer 20.

When the coating layer 20 is stretched by the stretching step (S50) to be described later, a certain degree of bonding force is required between the module 30 and the coating layer 20. The coating layer 20 cured by the first curing step S20 has a first elastic modulus enough to support the module 30, but the coating layer 20 having the first elastic modulus is the module 30. Insufficient bonding strength with the module may cause a problem that the module 30 is separated from the coating layer 20 in the process of extending the coating layer 20.

Therefore, in the second curing step (S40) by supplying heat or light (H2) to the coating layer 20 by curing the coating layer 20 in a state having a second elastic modulus higher than the first elastic modulus, the module 30 And bond strength between the coating layer 20. Here, the state in which the coating layer 20 has the second elastic modulus means that the module 30 is not separated from the coating layer 20 when the coating layer 20 is extended, and the module 30 and the coating layer 20 are bonded to each other. It means a state having an elastic modulus enough to maintain the state.

In the stretching step S50, the base substrate 10 and the coating layer 20 are stretched in a state in which the module 30 is embedded in the coating layer 20.

The base substrate 10 and the coating layer 20 can be extended by applying a tensile force F1 at the sides of the base substrate 10 and the coating layer 20. For example, the stretching step S50 may be performed by installing structures each capable of gripping the sides of the base substrate 10 and the coating layer 20 and applying a tensile force F1 to the structures. have.

The wiring connection step (S60) connects the wiring 40 to the terminals of the module 30 in a state where the base substrate 10 and the coating layer 20 are extended.

After the wiring connection step S60 is completed, since the base substrate 10 and the coating layer 20 are contracted back to their original lengths, the wiring 40 connected to the terminal of the module 30 in the wiring connection step S60 is It is preferably formed of a stretchable material.

As described above, in the embedding step (S30), the module 30 is embedded in the coating layer 20 so that the steps t1 and t2 of the upper surface 31 of the module and the upper surface 21 of the coating layer are less than or equal to the critical step. In the wiring connection step (S60), it is preferable to use a method of utilizing an existing semiconductor fab line, through which the mass production of the manufacturing method of the present invention can be improved.

The interface modification step (S70) is to modify the interface between the coating layer 20 and the wiring 40 in order to improve the bonding force of the wiring 40 to the coating layer 20, it is performed after the wiring connection step (S60).

The wiring 40 formed by the wiring connection step S60 has a risk of falling away from the coating layer 20 due to external impact, repeated stretching and the like.

Therefore, as shown in FIG. 5, it is preferable to improve the bonding force of the wiring 40 to the coating layer 20 by irradiating a laser beam L2 or plasma at the interface between the coating layer 20 and the wiring 40. Do. As the interface energy of the interface between the coating layer 20 and the wiring 40 irradiated with the laser beam L2 or the plasma is improved, the bonding force of the wiring 40 to the coating layer 20 may be improved.

The coating layer etching step (S80) to form a hollow hole 26 in the coating layer 20 by etching a portion of the coating layer 20 to improve the elasticity of the coating layer 20, the second curing step (S40), elongation It may be performed after any one of the step S50 and the wiring connection step S60.

Referring to FIG. 6, a portion of the coating layer 20 may be etched by irradiating the coating layer 20 with the laser beam L2 to form a plurality of hollow holes 26 spaced apart from the coating layer 20. In contrast to the coating layer in which the hollow holes are not formed, the coating layer 20 in which the plurality of hollow holes 26 are formed has an advantage in that elasticity can be improved when an extension force is applied from the side.

In FIG. 6, a plurality of hollow holes 26 are formed on the surface of the coating layer 20, but a plurality of hollow holes 26 may be formed in the coating layer 20.

In addition, in FIG. 1, the coating layer etching step S80 is performed after the wiring connection step S60, but the coating layer etching step S80 may be performed after the second curing step S40, and the stretching step S50. It may then be performed.

FIG. 7 is a flowchart illustrating a method of manufacturing a stretchable device according to a second embodiment of the present invention, and FIG. 8 is a view for explaining a light blocking film forming step of the method of manufacturing the stretchable device of FIG. 7.

The stretchable device manufacturing method of this embodiment includes a coating step (S10), a first curing step (S20), an embedding step (S30), a second curing step (S40), an stretching step (S50), and a light blocking film. Forming step (S52), wiring connection step (S60), interfacial reforming step (S70), and coating layer etching step (S80), and further comprises a light blocking film forming step (S52) after the stretching step (S50). It is characterized by.

As described above, when the module 30 embedded in the coating layer 20 is a light emitting device, it is necessary to diffuse the light (L) emitted from the light emitting device according to the purpose, the light (L) emitted from the light emitting device You may need to go straight). According to this need, the module 30 may be variously disposed with respect to the coating layer 20.

Referring to FIG. 8, the light blocking film forming step S52 may be performed by processing a portion of the coating layer contacting the side surface 32 of the module 30 to improve the straightness of the light L emitted from the module 30. To form (22).

By irradiating the laser beam (B) to the coating layer portion in contact with the side surface 32 of the module 30, the coating layer portion in contact with the side surface 32 of the module 30 may be burned to a certain degree. In this case, while the side of the module 30 is completely covered by the light blocking film 22, the light L irradiated from the module 30 is irradiated only upwards, so that the straightness of the light L may be improved.

9 is a flow chart of a method of manufacturing a stretchable device according to a third embodiment of the present invention, and FIG. 10 is a view for explaining a coating layer removing step of the method of manufacturing the stretchable device of FIG.

Stretchable device manufacturing method of the present embodiment is a coating step (S10), the first curing step (S20), the embedding step (S30), the second curing step (S40), the stretching step (S50), the coating layer is removed It includes a step (S54), the wiring connection step (S60), the interface modification step (S70), the coating layer etching step (S80), and further comprising a coating layer removal step (S54) after the stretching step (S50). It is done.

Referring to FIG. 10, the coating layer removing step S54 removes a portion 24 of the coating layer contacting the side surface 32 of the module so that at least a portion of the side surface 32 of the module 30 is exposed.

A part 24 of the coating layer may be abbreviated using a laser beam or the like on a part 24 of the coating layer which contacts the side surface of the module 30. In this case, while part of the side of the module 30 is exposed to the outside, the light L irradiated from the module 30 is irradiated not only in the upper side but also in the left and right directions, so that the diffusivity of the light L may be improved.

Meanwhile, a stretchable device may be manufactured by the method of manufacturing a stretchable device of the present invention, and the stretchable device may include a display device, electronic skins, a sensor array, and the like.

The stretchable device manufacturing method and the stretchable device of the present invention configured as described above are performed by dividing the curing step of the coating layer into two stages before and after embedding the module, and the wiring connection in the state in which the embedded module is extended. By doing so, it is possible to obtain the effect of mass production of the stretchable device.

In addition, the method for manufacturing a stretchable device of the present invention configured as described above, and the stretchable device manufactured by the present invention, process the embedding depth of the module when the module is a light emitting element, a part of the coating layer to which the module is contacted, The effect which can manufacture the product with high linearity or the high diffusivity of light can be acquired.

In addition, the method for manufacturing a stretchable device of the present invention configured as described above and the stretchable device manufactured thereby can obtain the effect of improving the bonding strength of the wiring to the coating layer by modifying the interface between the coating layer and the wiring. .

In addition, the method for manufacturing a stretchable device of the present invention configured as described above and the stretchable device manufactured thereby obtain an effect of improving the stretchability of the coating layer by etching part of the coating layer to form hollow holes in the coating layer. Can be.

The scope of the present invention is not limited to the above-described embodiments and modifications, but may be embodied in various forms of embodiments within the scope of the appended claims. Without departing from the gist of the invention claimed in the claims, it is intended that any person skilled in the art to which the present invention pertains falls within the scope of the claims described in the present invention to various extents which can be modified.

10: base substrate
20: coating layer
30: module
40: wiring
S10: Coating Step
S20: first curing step
S30: embedding step
S40: second curing step
S50: kidney stage
S60: Wiring connection step

Claims (9)

A coating step of forming a coating layer of elastic elastomer material on the base substrate;
A first curing step of curing the coating layer with a first elastic modulus so that a module can be embedded in the coating layer;
An embedding step of embedding the module in the coating layer such that the step between the top surface of the module and the top surface of the coating layer is equal to or less than a predetermined critical step;
A second curing step of curing the coating layer in a state having a second elastic modulus higher than the first elastic modulus so that the module is fixed to the coating layer;
Stretching the base substrate and the coating layer while the module is embedded in the coating layer;
A wire connection step of connecting wires to terminals of the module while the base substrate and the coating layer are extended; And
And a coating layer etching step performed after any one of the second curing step, the stretching step, and the wiring connection step to etch a part of the coating layer in order to improve elasticity of the coating layer. Flexible device manufacturing method. The method of claim 1,
The module is a light emitting device,
The embedding step may include embedding the module in the coating layer such that the upper surface of the module protrudes within the critical step or less than the upper surface of the coating layer. The method of claim 1,
The module is a light emitting device,
And the embedding step embeds the module in the coating layer such that the top surface of the module is recessed within the critical step or less than the top surface of the coating layer. The method of claim 1,
The module is a light emitting device,
And a light blocking film forming step of forming a light blocking film by processing a portion of the coating layer in contact with the side surface of the module to improve the straightness of the light irradiated from the module after the stretching step. . The method of claim 1,
The module is a light emitting device,
And a coating layer removing step of removing a portion of the coating layer in contact with the side surface of the module such that at least a portion of the side surface of the module is exposed after the stretching step. The method of claim 1,
The wiring connected to the terminal of the module in the wiring connection step is characterized in that the flexible device is formed of a stretchable material. The method of claim 1,
After the wiring connection step,
And an interface reforming step of modifying an interface between the coating layer and the wiring line to improve the bonding force of the wiring line to the coating layer. delete A stretchable device manufactured by the stretchable device manufacturing method according to any one of claims 1 to 7.

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