KR102024586B1 - Apparatus for supplying voltage for generating plasma using pulse - Google Patents

Abstract

A voltage supply device for generating plasma using pulse control is disclosed.
According to an embodiment of the present invention, a plasma generator having a positive electrode portion on one side and a ground electrode portion on the other side; A power supply unit supplying a current having a predetermined voltage to the plasma generator; A high voltage line connecting the power supply unit and the positive electrode unit; A ground line connecting the power supply unit and the ground electrode unit; A discharge line connecting the high voltage line and the ground line; A first switch unit installed in the high voltage line and intermittently regulating the current supplied from the power supply unit to the positive electrode unit; A second switch unit disposed in the discharge line and intermittently discharging a current discharged from the high voltage line to the ground line; And a pulse controller configured to provide a pulse signal to the first switch unit and the second switch unit to independently control the first switch unit and the second switch unit, respectively. May be provided.

Description

Voltage supply device for plasma generation using pulse control {APPARATUS FOR SUPPLYING VOLTAGE FOR GENERATING PLASMA USING PULSE}

The present invention relates to a voltage supply device for generating plasma using pulse control.

In general, efforts are made to minimize harmful substances emitted from each facility by installing environmental pollution prevention facilities such as sewage and wastewater treatment plants, air pollution prevention facilities, and noise prevention facilities in various discharge facilities that pollute the environment.

Although there are frequent complaints regarding odor among the harmful substances, the standards are not clear because odor measuring techniques and legal regulations are not properly established, but recently, regulations on odor causing substances have been gradually strengthened. .

Odor is a sensory pollutant that causes unpleasant feelings and serious damages to the mental health of people's living. However, the existing odor prevention law does not improve effective odors, so it has been a chronic environment due to odor problems. Conflict and damage are repeated.

Odor removal technology is mainly used for VOCs removal technology. Commercial or developed control technologies include direct incineration, catalytic incineration, adsorption, condensation, biofilm, membrane separation, UV and photocatalytic reactions, and plasma reactions. As a tailor-made odor removal technology that can effectively respond to the material has shown a limit to the application.

In particular, the plasma reaction technology is effective for hardly decomposable materials, and various application methods vary depending on the object. However, the plasma reaction technology has a problem in terms of practicality due to the poor performance of other various technologies.

However, a method of removing volatile organic compounds or odorous substances by using plasma is a technique that has recently attracted attention because there is no generation of waste or waste water, compared to conventional adsorption filters or wet scrubbers.

Plasma refers to a state of a gas having a charge, and can be obtained through electric discharge generated by applying a high voltage to two electrodes that are artificially separated from each other.

When a high voltage is applied to the electrode, active electrons are generated by electric discharge, and the active electrons react with the surrounding gas to generate many radicals. These radicals react with volatile organic compounds or odorous substances to remove harmful substances.

Therefore, in order to obtain an efficient plasma, it is preferable that electric energy applied to the electrode is consumed only to generate active electrons. Important here is the rising time of the voltage and the discharge time of the voltage.

If the rising time of the voltage is long, that is, the time to reach the discharge voltage of the high voltage is long, the generation efficiency of the active electrons with high energy is low, and when the discharge time of the voltage is long, the transition from the electrode to the arc discharge is reduced. In this case, since the discharge energy is converted into thermal energy rather than generation of active electrons, the plasma generation efficiency may be drastically lowered.

Therefore, in order to efficiently generate plasma, it is important to minimize the boost time of the voltage reaching the target voltage and to minimize the discharge time after reaching the target voltage, but it is difficult to control the boost time and the discharge time. have.

Korean Registered Patent No. 10-0194975 (Announced on June 15, 1999)

According to an embodiment of the present invention, a voltage supply capable of generating a plasma having high efficiency while suppressing generation of unnecessary thermal energy by minimizing a boosting time and a discharge time reaching a target voltage for high efficiency plasma generation using pulse control, respectively. To provide a device.

According to an embodiment of the present invention, a plasma generator having a positive electrode portion on one side and a ground electrode portion on the other side; A power supply unit supplying a current having a predetermined voltage to the plasma generator; A high voltage line connecting the power supply unit and the positive electrode unit; A ground line connecting the power supply unit and the ground electrode unit; A discharge line connecting the high voltage line and the ground line; A first switch unit installed in the high voltage line and intermittently regulating the current supplied from the power supply unit to the positive electrode unit; A second switch unit disposed in the discharge line and intermittently discharging a current discharged from the high voltage line to the ground line; A voltage supply device for generating plasma using pulse control, comprising: a pulse controller configured to provide a pulse signal to the first switch unit and the second switch unit to independently control the first switch unit and the second switch unit. Can be provided.

In addition, the discharge line may further include a resistor unit installed in front of the second switch unit.

The first voltage sensor is installed between the power supply unit and the first switch unit in the high voltage line, and measures the voltage flowing through the high voltage line and provides the voltage to the pulse controller. And a second voltage sensor disposed between the resistor unit and the second switch unit in the discharge line and measuring the voltage flowing through the discharge line and providing the measured voltage to the pulse controller.

Here, the pulse control unit turns on the first switch unit and turns off the first switch unit when the voltage measured by the first voltage sensor reaches a target voltage, and then turns on the second switch unit and the second voltage sensor. When the voltage measured in the above becomes the ground voltage, the second switch unit may be turned off.

The plasma generator may be spaced apart from each other so that the ground electrode parts face each other, and the two electrode parts may be installed to be spaced apart from the ground electrode part.

In addition, the plasma generator is provided with a plurality of ground electrode parts and the positive electrode parts, respectively, the ground electrode part and the positive electrode parts are alternately and repeatedly installed, and the ground electrode part is disposed on the outermost side of the plasma generator. Can be.

In addition, the plasma generator is configured such that harmful substances pass through a discharge space between the positive electrode portion and the ground electrode portion, and harmful components of the harmful substances may be removed by the plasma generated in the discharge space.

According to the embodiment of the present invention, by minimizing each of the boosting time and the discharge time reaching the target voltage for the high efficiency plasma generation using pulse control, it is possible to generate an excellent plasma while suppressing the generation of unnecessary thermal energy. .

1 is a configuration diagram schematically showing a voltage supply device for generating plasma using pulse control according to a first embodiment of the present invention.
2 is a configuration diagram schematically showing a voltage supply device for generating plasma using pulse control according to a second embodiment of the present invention.
3 is a configuration diagram schematically illustrating a voltage supply device for generating plasma using pulse control according to a third embodiment of the present invention.
4 is a waveform graph illustrating a voltage waveform of a plasma generator and pulse waveforms of a first switch unit and a second switch unit using one embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings will be described in detail the configuration and operation according to the embodiment of the present invention. The following description is one of several aspects of the invention that can be claimed, and the following description may form part of the detailed description of the invention.

However, in describing the present invention, a detailed description of known configurations or functions may be omitted to clarify the present invention.

As the invention allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail. However, this is not intended to limit the present invention to specific embodiments, it should be understood to include all changes, equivalents, and substitutes included in the spirit and scope of the present invention.

Terms including ordinal numbers such as first and second may be used to describe various components, but the components are not limited by the terms. These terms are only used to distinguish one component from another.

When a component is said to be 'connected' or 'connected' to another component, it may be directly connected to or connected to that other component, but it may be understood that another component may exist in between Should be.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise.

Hereinafter, with reference to the accompanying drawings will be described embodiments of the present invention.

1 is a configuration diagram schematically illustrating a voltage supply device for generating plasma using pulse control according to a first embodiment of the present invention. Referring to FIG. 1, plasma generation using pulse control according to an embodiment of the present invention is described first. The voltage supply device for the plasma generator 100, the power supply unit 200, the high voltage line 300, the ground line 310, the discharge line 320, the first switch unit 400, the second switch unit 500 and It may include a pulse controller 600.

Plasma generator 100 is configured to generate a plasma by receiving a high voltage current from the outside and electric discharge thereof, the one side of the plasma generator 100 is provided with both electrode portion 110 and the other side the ground electrode portion ( 120 may be provided.

When a high voltage of approximately 20,000 to 30,000 V is applied to both electrode parts 110, plasma may be generated through electrical discharge with the ground electrode part 120 spaced apart from both electrode parts 110.

That is, active electrons are generated by the electric discharge of the high electrode between the positive electrode unit 110 and the ground electrode unit 120, and the active electrons react with the surrounding gas to generate a large amount of radicals. In the case of hazardous substances (G), such as compounds or odorous substances, radicals may react with the hazardous substances (G) to remove harmful components.

The plasma generator 100 may be configured to allow the harmful substance G to pass through the discharge space 130 formed between the positive electrode part 110 and the ground electrode part 120, and in the discharge space 130. Hazardous components of the hazardous substances can be removed by the generated plasma.

In detail, the plasma generator 100 may be spaced apart from each other so that the two ground electrode parts 120 face each other, and the two electrode parts 110 may be disposed between the ground electrode parts 120 and the ground electrode part 120. It may be spaced apart to maintain a predetermined distance.

The plasma generator 100 may be composed of one ground electrode unit 120 and one positive electrode unit 110 as basic units, but in order to generate a large amount of plasma, the basic units are stacked as illustrated in FIG. 1. It may be composed of a multi-layer structure.

For example, the plasma generator 100 is provided with a plurality of ground electrode portions 120 and the positive electrode portion 110, the ground electrode portion 120 and the positive electrode portion 110 are alternately arranged alternately, The ground electrode part 120 may be disposed on the outermost side of the plasma generator 100. Therefore, the two electrode parts 110 may be disposed between the two ground electrode parts 120. In addition, the positive electrode 110 and the ground electrode 120 may have a flat plate structure, and the surface may be coated with a dielectric such as ceramic.

On the other hand, the power supply unit 200 may supply a current of a predetermined voltage (for example, 20,000 ~ 30,000V) to the plasma generator 100. The preset voltage may be a target voltage required for generating plasma in the plasma generator 100.

The power supply unit 200 may be charged with a direct current (DC) at a predetermined voltage. However, the power supply unit 200 may be implemented in any other form as long as it is not limited to the above as long as it can supply a current of a predetermined voltage.

In addition, the high voltage line 300 may be configured to connect the power supply unit 200 and the positive electrode unit 110. The high voltage line 300 electrically connects the power supply unit 200 and the positive electrode unit 110 to apply the high voltage of the power supply unit 200 to the positive electrode unit 110 of the plasma generator 100 in the plasma generator 100. Plasma may be generated by electrical discharge.

In addition, the ground line 310 may be configured to connect the power supply unit 200 and the ground electrode unit 120. The ground line 310 may electrically connect the power supply unit 200 and the ground electrode unit 120 directly, but may be indirectly connected through another grounding body (eg, another structure). In the drawing, for convenience, the power supply unit 200 and the ground electrode unit 120 are represented as directly connected.

The discharge line 320 may be configured to connect the high voltage line 300 and the ground line 310. The discharge line 320 discharges electric charge (electrical energy) remaining in the positive electrode part 110 toward the ground line 310 after the electrical discharge occurs in the positive electrode part 110 to generate a plasma. By allowing the potential of 110 to be the same as that of the ground electrode 120, a high-voltage discharge for plasma generation may occur again in the both electrode 110.

The first switch unit 400 may be installed in the high voltage line 300, and may interrupt (that is, disconnect or connect) the current supplied from the power supply unit 200 to the two electrode units 110.

Therefore, when the first switch unit 400 is connected (ON), the predetermined voltage of the power supply unit 200 may be applied to the positive electrode unit 110, and when the first switch unit 400 is disconnected (OFF), Application of the voltage supplied to the electrode unit 110 may be stopped.

The second switch unit 500 may be installed in the discharge line 320, and may control the current discharged from the high voltage line 300 to the ground line 310 through the discharge line 320.

Therefore, when the second switch unit 500 is connected (ON), the remaining charges of the both electrode unit 110 may be discharged to the ground electrode unit 120, when the second switch unit 500 is disconnected (OFF) The discharge line 320 is broken so that no current can flow.

Here, the first switch unit 400 and the second switch unit 500 may include a power switch such as an insulated gate bipolar transistor (IGBT) or a metal oxide semiconductor field effect transistor (MOSFET), which are semiconductor devices that can be used for high voltage switching. Can be used.

In addition, the pulse controller 600 may provide a pulse signal to the first switch unit 400 and the second switch unit 500, respectively, to independently control the first switch unit 400 and the second switch unit 500. can do.

When the pulse controller 600 provides a pulse signal to the first switch unit 400 and the second switch unit 500, the first switch unit 400 and the second switch unit 500 are intermittent according to the pulse signal. Current can flow or break.

In order to generate high-efficiency plasma in the plasma generator 100, it is preferable that electrical energy applied from the power supply unit 200 is consumed only to generate plasma.

Therefore, stopping the voltage application as soon as the electrical energy applied to the both electrode portions 110 reaches the target voltage required to generate the plasma can prevent the electrical energy from being converted into unnecessary thermal energy. The time at which the applied voltage of N) reaches the target voltage may be defined as a boosting time. Here, the smaller the boosting time is, the better the voltage of both electrode parts 110 reaches the target voltage.

In addition, when voltage application is stopped after plasma generation, the remaining charges of both electrode parts 110 must be discharged quickly so that the plasma can be regenerated through the rapid application of a high voltage. It can be defined as. In addition, the remaining charge voltage (ground voltage) can be regarded as being discharged when it is 0 to 100V. The smaller the discharge time is, the better since the next plasma can be generated quickly.

In consideration of the boosting time and the discharging time, the pulse controller 600 controls the first switch unit 400 and the second switch unit 500 in a state where the second switch unit 500 is turned off. The unit 400 is turned on to apply the high voltage of the power supply unit 200 to the positive electrode unit 110, and the first switch unit 400 is turned off immediately after the plasma is generated by the electrical discharge of the positive electrode unit 110. Afterwards, the second switch unit 500 may be turned on to discharge the remaining charge of the positive electrode unit 110.

Here, the pulse controller 600 experimentally obtains a relationship between the time that the voltage applied from the positive electrode unit 110 reaches a target voltage (for example, 20,000 to 30,000 V), and the boosting time and the discharge time. The value and the discharge time value can be input (stored) in advance. Accordingly, the pulse controller 600 may control the first switch unit 400 and the second switch unit 500, respectively, according to a preset boosting time value and a discharge time value.

Meanwhile, referring to FIG. 2, the second embodiment of the present invention may further include a resistor unit 700 installed in front of the second switch unit 500 in the discharge line 320.

As described above, when the residual charge of the positive electrode 110 is grounded through the discharge line 320 according to the ON of the second switch unit 500 after the plasma generation, heat is applied to the circuit flowing through the discharge line 320. As may occur, the resistance unit 700 may be installed in the discharge line 320 to protect the circuit during discharge of the remaining charge through the discharge line 320.

The resistor unit 700 may have a resistance value of 1 to 10 kΩ so that a large resistance does not occur when residual charge flows through the discharge line 320.

Meanwhile, referring to FIG. 3, the third embodiment of the present invention may further include a first voltage sensor 800 and a second voltage sensor 900.

According to the third embodiment of the present invention, the boost voltage value and the discharge time value are not input to the pulse controller 600 in advance, but the target voltage and the ground are provided through the first voltage sensor 800 and the second voltage sensor 900. By directly measuring the voltage, the first switch unit 400 and the second switch unit 500 can be efficiently and precisely controlled.

The first voltage sensor 800 is a configuration installed between the power supply unit 200 and the first switch unit 400 in the high voltage line 300, by measuring the voltage of the current flowing through the high voltage line 300 pulse control unit 600 ) Can be provided.

In addition, the second voltage sensor 900 is installed between the resistor unit 700 and the second switch unit 500 in the discharge line 320 and measures the voltage flowing through the discharge line 320 to control the pulse controller ( 600).

Therefore, as shown in FIG. 4, the pulse controller 600 turns off the first switch unit 400 when the voltage measured by the first voltage sensor 800 reaches a target voltage (for example, 20,000 to 30,000 V). The charge of the positive electrode unit 110 can be discharged by immediately turning on the second switch unit 500.

 When the charge is discharged and the voltage measured by the second voltage sensor 900 becomes the ground voltage (for example, 0 to 100V), the pulse controller 600 has a potential of the positive electrode unit 110 at the ground electrode unit 120. The second switch unit 500 may be turned off and determined to be the same as the potential to prepare for the next generation of plasma in succession.

That is, the pulse controller 600 maintains the OFF state of the second switch unit 500 again when the potential of both electrode units 110 is equal to the potential of the ground electrode unit 120. By turning ON, a high voltage may be applied to both electrode parts 110, and the above-described series of processes may be repeated to continuously generate plasma. (See the waveform of the positive electrode portion of Figure 4)

As the boosting time and the discharge time are minimized, the electrical energy of the power supply unit 200 is used only to generate plasma without generating unnecessary heat energy, thereby maximizing plasma generation efficiency and generating plasma within a limited time. The frequency can be increased to generate a large amount of plasma.

As mentioned above, although this invention was demonstrated using the preferable embodiment, the scope of the present invention is not limited to the specific embodiment described, The person of ordinary skill in the art is not limited within the scope of this invention. Substitution and modification of the components are possible, which also belongs to the rights of the present invention.

100: plasma generator 110: positive electrode
120: ground electrode portion 130: discharge space
200: power supply unit 300: high voltage line
310: ground line 320: discharge line
400: first switch unit 500: second switch unit
600: pulse control unit 700: resistance unit
800: first voltage sensor 900: second voltage sensor

Claims (7)

A plasma generator having one electrode part at one side and a ground electrode part at the other side;
A power supply unit supplying current to the plasma generator;
A high voltage line connecting the power supply unit and the positive electrode unit;
A ground line connecting the power supply unit and the ground electrode unit;
A discharge line connecting the high voltage line and the ground line;
A first switch unit installed in the high voltage line and intermittently regulating the current supplied from the power supply unit to the positive electrode unit;
A second switch unit disposed in the discharge line and intermittently discharging a current discharged from the high voltage line to the ground line;
A pulse controller configured to provide a pulse signal to the first switch unit and the second switch unit to control the first switch unit and the second switch unit;
A first voltage sensor measuring a voltage flowing through the high voltage line and providing the voltage to the pulse controller; And
And a second voltage sensor which measures a voltage flowing through the discharge line and provides the voltage to the pulse controller.
The pulse control unit,
When the first switch is turned on and the voltage measured by the first voltage sensor reaches a target voltage, the first switch is turned off and then the second switch is turned on, and the voltage measured by the second voltage sensor is ground voltage. The voltage supply device for plasma generation using pulse control to turn off the second switch. The method of claim 1,
And a resistor unit disposed in front of the second switch unit in the discharge line. The voltage supply device for plasma generation using pulse control. The method of claim 2,
The first voltage sensor is installed between the power supply unit and the first switch unit in the high voltage line,
And the second voltage sensor is provided between the resistor portion and the second switch portion in the discharge line. delete The method of claim 1,
The plasma generator,
A plurality of ground electrode parts are provided to be spaced apart from each other to face each other, and the two electrode parts are provided to be spaced apart from the ground electrode part between the ground electrode portion, the voltage supply device for plasma generation using pulse control. The method of claim 5,
The plasma generator,
The ground electrode part and the positive electrode part are provided in plural, respectively, the ground electrode part and the positive electrode part are alternately and repeatedly provided, and the ground electrode part is disposed on the outermost side of the plasma generator, the plasma using pulse control. Generating voltage supply. The method of claim 5,
The plasma generator is configured such that noxious substances pass through the discharge space between the positive electrode portion and the ground electrode portion, and the noxious components of the noxious substances are removed by the plasma generated in the discharge space. Generating voltage supply.

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