KR102013384B1 - Chip on film package and organic light emitting display device having the same - Google Patents

Abstract

The COF package includes a base film, a plurality of signal wires disposed on the base film, a drive integrated circuit mounted on the base film, and at least one or more disposed on the base film and passing through a lower end of the drive integrated circuit. Including central power wiring.

Description

COF package and organic light emitting display device having the same {CHIP ON FILM PACKAGE AND ORGANIC LIGHT EMITTING DISPLAY DEVICE HAVING THE SAME}

The present invention relates to an organic light emitting display device. More specifically, the present invention relates to an organic light emitting display device capable of displaying an image of uniform brightness by including a COF package having an improved power wiring structure.

The organic light emitting diode display is a self-emission display device that displays an image by including an organic light emitting diode (OLED) that emits light by itself. Unlike the liquid crystal display, the organic light emitting diode display does not require a separate light source, and thus, the thickness and weight may be relatively reduced. In addition, the organic light emitting diode display has high quality characteristics such as low power consumption, high luminance, and fast response speed.

In general, the organic light emitting diode display includes a display panel including a plurality of pixels, a driver supplying a driving signal to the display panel, and a power supply unit supplying pixel power to the display panel. In this case, the driving unit may be connected to the display panel using a tape carrier package (TCP) mounting method, a chip on film (COF) mounting method, a chip on glass (COG) mounting method, or the like.

At this time, when the driving unit is connected to the display panel based on the COF mounting method, since the power wiring for supplying pixel power to the display panel is disposed only outside the film, in this case, current may be concentrated in a specific portion of the display panel. Can be. As a result, the display panel may deteriorate, and thus a lifespan of the organic light emitting diode display may decrease.

One object of the present invention is to provide a COF package with improved power wiring structure.

Another object of the present invention is to provide an organic light emitting display device which includes a COF package having an improved power wiring structure, thereby minimizing current concentration and voltage drop of the display panel.

However, the problems to be solved by the present invention are not limited by the above-described problems, and may be variously expanded within a range without departing from the spirit and scope of the present invention.

In order to achieve the object of the present invention, a chip on film (COF) package according to embodiments of the present invention is a base film, a plurality of signal wires disposed on the base film, a drive mounted on the base film And at least one central power line disposed on the base film and passing through a lower end of the driving integrated circuit.

In example embodiments, the COF package may further include at least one external power wiring disposed on the base film and passing through the outside of the base film.

In example embodiments, the driving integrated circuit may be a scan driving circuit generating a scan signal or a data driving circuit generating a data signal.

In order to achieve the object of the present invention, a COF package according to embodiments of the present invention is a base film having a first layer and a second layer, a plurality of signal wires disposed on the first layer, The driving integrated circuit may be mounted on one layer, and at least one central power line may be disposed on the second layer.

In example embodiments, the COF package may further include at least one outer power supply wire passing through the outside of the second layer.

In example embodiments, the driving integrated circuit may be a scan driving circuit generating a scan signal or a data driving circuit generating a data signal.

In example embodiments, the driving integrated circuit may include a plurality of electrode pads on a bottom surface thereof, and the electrode pads may be connected on the first layer by conductive bumps.

In order to achieve another object of the present invention, an organic light emitting diode display according to the embodiments of the present invention is a display panel having a plurality of pixels, a drive integrated circuit for driving the display panel on a base film, A COF package disposed on the base film, the COF package having at least one central power supply line passing through a lower end of the driving integrated circuit, a power board providing pixel power supplies to the pixels, and a timing controller board controlling the driving integrated circuit. It may include.

In example embodiments, the COF package may further include at least one external power wiring disposed on the base film and passing through the outside of the base film.

In example embodiments, the COF package may be positioned at an edge of the display panel.

The COF package according to the embodiments of the present invention includes at least one central power wiring disposed to pass through the bottom of the driving integrated circuit and at least one outer power wiring arranged to pass outside of the base film, thereby providing a power wiring structure. The pixel power can be uniformly applied to the display panel.

The organic light emitting diode display according to the exemplary embodiments of the present invention may display the image having a uniform brightness and output a high quality image by including the COF package.

1A to 1D are diagrams illustrating a COF package according to embodiments of the present invention.
2A and 2B are diagrams illustrating a COF package according to embodiments of the present invention.
3 is a diagram illustrating an organic light emitting display device according to example embodiments.
4 is a block diagram illustrating an organic light emitting display device according to example embodiments.

Hereinafter, an organic light emitting diode display according to exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the exemplary embodiments described herein, but is not limited thereto. Those skilled in the art will be able to implement the present invention in various other forms without departing from the spirit of the present invention.

In this specification, specific structural to functional descriptions are merely illustrated for the purpose of describing exemplary embodiments of the present invention, and embodiments of the present invention may be embodied in various forms and are described herein. It should not be construed as limited to the above, but should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. When a component is described as being "connected" or "contacted" to another component, it is to be understood that it may be directly connected to or in contact with another component, but there may be another component in between. something to do. In addition, when a component is described as being "directly connected" or "directly contacted" with another component, it may be understood that there is no other component in between. Other expressions describing the relationship between the components, such as "between" and "directly between" or "adjacent to" and "directly adjacent to", may be interpreted as well.

The terminology used herein is for the purpose of describing exemplary embodiments only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. As used herein, the terms "comprise", "comprise" or "have" are intended to designate that there is a feature, number, step, action, component, part, or combination thereof that is practiced, and that one or the same. It is to be understood that the present invention does not exclude in advance the possibility of the presence or addition of other features, numbers, steps, operations, components, parts, or combinations thereof. Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Does not.

Terms such as first, second, third, and fourth may be used to describe various components, but such components are not limited by the terms. The terms are used to distinguish one component from another component. For example, without departing from the scope of the present invention, the first component may be referred to as the second, third or fourth component, and the like, and similarly the second, third or fourth component may be alternating. Can be named.

1A to 1D are diagrams illustrating a COF package according to embodiments of the present invention.

1A through 1D, at least one central power supply line 160 disposed on the base film 110 to pass through a lower end of the driving integrated circuit 130, and the base film 110 on the base film 110. COF packages 100a, 100b, 100c, 100d are shown having at least one outer power supply wiring 170 arranged to pass outside.

In the present embodiment, the COF packages 100a, 100b, 100c, and 100d may include the base film 110, the plurality of signal wires 120, the driving integrated circuit 130, and at least one central power wire 160. It may include. In this case, the COF packages 100a, 100b, 100c, and 100d may further include at least one outer power wiring disposed on the base film 110 to pass outside of the base film 110.

Referring to FIG. 1A, the COF package 100a includes a base film 110, signal wires 120, a drive integrated circuit 130, and a central power line 160 passing through the bottom of the drive integrated circuit 130. can do.

The base film 110 may be formed of a polyimide resin, an epoxy resin, or another known material, and may have flexibility. In detail, the signal lines 120, the driving integrated circuit 130, and the central power line 160 may be formed on the base film 110.

The signal wires 120 may be disposed on the base film 110. In addition, each of the signal wires 120 may include an external lead 150 extending to the side end of the base film 110. Here, the external lead 150 may be connected to an external circuit such as a printed circuit board and a display panel.

The driving integrated circuit 130 may be mounted on the base film 110. In detail, the driving integrated circuit 130 may be a scan driving circuit generating a scan signal or a data driving circuit generating a data signal. Accordingly, the driving integrated circuit 130 may receive a control signal from the signal wires 120 to generate a scan signal or a data signal. The scan signal or the data signal may be transmitted to a plurality of pixels through the signal wires 120 disposed on the base film 110.

The central power line 160 may be disposed on the base film 110 to pass through the lower end of the driving integrated circuit 130. However, the present invention is not limited thereto, and as shown in FIG. 1B, the central power line 160 may be further disposed on the base film 110.

In this embodiment, the pin of the driving integrated circuit 130 at the portion where the central power line 160 passes is not connected to the base film 110. That is, according to this structure, the central power line 160 may be disposed to pass through a portion where pins are not connected (that is, the lower end of the driving integrated circuit 130).

The driving integrated circuit 130 may include a plurality of electrode pads 140a and 140b on a bottom surface thereof. In detail, the plurality of electrode pads 140a and 140b may be terminals for controlling power of an external circuit (not shown) and input / output of a signal. For example, the electrode pads 140a and 140b are input units, and signal input pads 140b for receiving data and control signals input from an external circuit and signal output pads 140a for transmitting signals to the pixel portion. Can include them. The plurality of electrode pads 140a and 140b may be connected to the base film 110 by conductive bumps (not shown). Specifically, the conductive bumps may be formed in the pad portion of the driving integrated circuit 130 to electrically connect the base film 110 and the driving integrated circuit 130.

Referring to FIG. 1B, a plurality of central power wires 160 may be disposed on the base film 110. Therefore, the pixel power may be uniformly applied to the plurality of pixels through the plurality of central power wires 160. Accordingly, the organic light emitting diode display may output an image having a uniform brightness and a high quality image.

Referring to FIG. 1C, the central power line 160 may be disposed on the base film 110, and at least one outer power line 170 passing through the outside of the base film 110 may be further disposed. 1C, the outer power wiring 170 is disposed on both outer sides of the base film 110, but the outer power wiring 170 may be disposed only on one outer side of the base film 110.

Referring to FIG. 1D, a plurality of central power lines 160 may be disposed on the base film 110, and at least one outer power line 170 passing outside the base film 110 may be further disposed. . Similarly, in FIG. 1D, the outer power wiring 170 is disposed on both outer sides of the base film 110, but the outer power wiring 170 may be disposed only on one outer side of the base film 110.

As a result, the first and second pixel power sources ELVDD and ELVSS generated from the power board are at least one or more central power wirings 160 included in the COF packages 100a, 100b, 100c and 100d and at least one or more of them. The plurality of pixels is transferred to the plurality of pixels through the outer power line 170. In this case, the at least one central power line 160 is disposed to pass through the lower end of the driving integrated circuit 130, and the at least one outer power line 170 is additionally disposed along the outer side of the base film 110. Current concentration in the display panel and voltage drop in the pixel power supply can be minimized. Accordingly, the organic light emitting diode display may display an image having a uniform brightness.

2A and 2B are diagrams illustrating a COF package according to embodiments of the present invention.

2A and 2B, COF packages 200a and 200b are shown that include a base film 210 composed of a first layer 210a and a second layer 210b. However, this is only one example, and the number of layers constituting the base film 210 is not limited thereto. For example, the base film 210 may include three or more layers.

In the present embodiment, the COF packages 200a and 200b may include the base film 210, the signal wires 220, the driver integrated circuit 230, at least one central power supply wire 260, and / or at least one outer side. The power line 270 may be included. In this case, the at least one outer power source wire 270 may be disposed to pass outside the second layer 210b of the base film 210.

However, components other than the base film 210 and at least one or more central power wirings 260 are the same as the COF packages 100a, 100b, 100c, and 100d shown in FIGS. The description will be omitted.

Referring to FIG. 2A, the COF package 200a may include a base film 210, signal wires 220, a driving integrated circuit 230, and a central power supply including a first layer 210a and a second layer 210b. The wiring 260 may be included.

The base film 210 may be formed of a polyimide resin or an epoxy resin or another known material to have flexibility. In the present embodiment, the base film 210 is composed of the first layer 210a and the second layer 210b, but the number of layers constituting the base film 210 is not limited thereto.

The driving integrated circuit 230 may be mounted on the first layer 210a, and at least one central power line 260 may be disposed on the second layer 210b.

As shown in FIG. 2A, the first layer 210a of the base film 210 may include signal wires 220 and a driving integrated circuit 230. In this case, the driving integrated circuit 230 may include a plurality of electrode pads 240a and 240b on a bottom surface thereof. The electrode pads 240a and 240b may be connected on the first layer 210a of the base film 210 by conductive bumps.

At least one central power line 260 may be disposed on the second layer 210b of the base film 210. In this case, the at least one central power line 260 may be freely disposed at any position on the second layer 210b of the base film 210.

Referring to FIG. 2B, at least one outer power wire 270 may be further disposed on the second layer 210b of the base film 210. 2B, the outer power wiring 270 is disposed on both outer sides of the second layer 210b of the base film 210, but one outer side of the second layer 210b of the base film 210 is disposed. Only the outer power wiring 270 may be disposed. As described above, the present invention can effectively prevent the power lines 260 and 270 from being concentrated at a specific site. Thus, manufacturing cost can be reduced, and the structure of the module can be simplified.

3 is a diagram illustrating an organic light emitting display device according to example embodiments.

Referring to FIG. 3, the organic light emitting diode display 300 may include a display panel 310, a COF package 320, a power board (not shown), and a timing controller board (not shown).

The display panel 210 may include a plurality of pixels. In detail, the pixels may be formed in an area partitioned by scan lines and data lines. In this case, the pixels include driving signals supplied from the COF package 320, first and second pixels supplied through at least one central power line and at least one external power line included in the COF package 320. An image is displayed in correspondence with the power sources ELVDD and ELVSS.

The COF package 320 may be formed at an edge area of the display panel 310. In detail, the COF package 320 may include a driving integrated circuit 350 for driving the display panel 310, and the driving integrated circuit 350 may be mounted on the base film. In this case, the driving integrated circuit 350 may be a scan driving circuit generating a scan signal for the pixels or a data driving circuit generating a data signal for the pixels.

In one embodiment, the COF package 320 may include at least one central power line for providing first and second pixel power sources ELVDD and ELVSS to the pixels on the base film. In addition, the COF package 320 may further include at least one outer power wire passing through the outside of the base film on the base film.

In another embodiment, the COF package 320 may include a base film having two or more layers. In this case, the driving integrated circuit 350 may be mounted on one of the layers, and at least one central power line may be disposed on the other of the layers. Specifically, at least one central power supply wiring may be freely disposed at any position on the other layer. Also, according to an embodiment, at least one or more outer power wirings may be disposed in another of the layers. In this case, at least one or more outer power lines may be disposed to pass outside of one of the layers. In this case, at least one central power line and at least one outer power line may provide first and second pixel power sources ELVDD and ELVSS to the pixels. Thus, the COF package 320 may have an improved power wiring structure. In addition, the current concentration phenomenon, deterioration, etc. of the display panel 310 may be prevented by the COF package 320 including the power wiring structure, and thus the lifespan of the organic light emitting diode display 300 may be prevented.

Both ends of the COF package 320 may be connected to the display panel 310 and the printed circuit board 250 through an anisotropic conductive film or anisotropic conductive paste, which is a conductive adhesive material. It is not limited to this. In the present exemplary embodiment, the FPC 340 may include single or multiple wirings (not shown) for supplying the first and second pixel power sources ELVDD and ELVSS to the pixels.

As described above, the organic light emitting diode display 300 includes at least one central power line and at least one outer power line disposed to pass through the bottom of the driving integrated circuit 350, thereby improving the power line structure. The first and second pixel power sources ELVDD and ELVSS may be uniformly applied to the display panel 310 through the COF package 320. As a result, current concentration phenomenon, deterioration, and the like of the display panel 310 may be prevented, and thus the lifespan of the organic light emitting diode display 300 may be prevented. Accordingly, the present invention can improve the utilization of the organic light emitting diode display 300, such as being applied to various display devices such as TVs and electronic displays.

The power board may provide pixel powers ELVSS and ELVDD to the pixels through at least one central power line and at least one outer power line included in the COF package 320.

The timing controller board may provide control signals for controlling the driving integrated circuit 350.

In detail, the power board and the timing controller board may be electrically connected to the printed circuit board 330 to transmit the first and second pixel power sources ELVDD and ELVSS and control signals to the printed circuit board 330. The printed circuit board 330 may be connected to a portion of the display panel 310 by the FPC 340. In this case, the first and second pixel powers ELVDD and ELVSS delivered to the printed circuit board 330 are displayed through at least one central power line and at least one outer power line provided in the COF package 320. It may be applied to the panel 310.

Meanwhile, in FIG. 3, the printed circuit board 330 is illustrated as being connected to the edge region of the display panel 310, but this is only an example and the present invention is not limited thereto. That is, although the printed circuit board 330 may be connected to the edge region of the display panel 310, it may be connected to only one side of the display panel 310.

4 is a block diagram illustrating an organic light emitting display device according to example embodiments.

Referring to FIG. 4, the organic light emitting diode display 400 may include a display panel 410, a scan driver 420, a data driver 430, a power supply 440, and a timing controller 450. Here, the power supply unit 430 and the timing controller 440 may correspond to a power board and a timing controller board, respectively.

The display panel 410 may include a plurality of pixels 460. In detail, the display panel 410 includes a plurality of pixels 460 formed in an area partitioned by scan lines S1, Sn, and data lines D1, Dm. can do. In this case, the display panel 410 displays an image based on the scan signal supplied from the scan driver 420 and the data signal supplied from the data driver 430.

The scan driver 420 may provide a scan signal to the pixels 460. In detail, the scan driver 420 generates a scan signal in response to the scan driving control signal SCS supplied from the timing controller 450. The scan signals generated by the scan driver 420 are sequentially supplied to the scan lines S1,..., Sn.

The data driver 430 may provide a data signal to the pixels 460. In detail, the data driver 430 generates a data signal in response to the data driving control signal DCS supplied from the timing controller 440. The data signal generated by the data driver 430 is supplied to the data lines D1,..., Dm in synchronization with the scan signal.

In the present embodiment, the power supply unit 440 corresponding to the power board may generate the first and second pixel power sources ELVDD and ELVSS using an external power source supplied from an external power supply device. In detail, the first and second pixel power sources ELVDD and ELVSS generated by the power supply unit 440 are provided to the pixels 460 through power lines included in the COF package. In this case, the power lines may be disposed to pass through a lower end of a scan driving circuit or a data driving circuit mounted in the COF package.

In the present embodiment, the timing controller 450 corresponding to the timing controller board may control the scan driver 410 and the data driver 430. In detail, the timing controller 450 generates the scan driving control signal SCS and the data driving control signal DCS in response to the synchronization signals supplied from the outside. The scan driving control signal SCS generated by the timing controller 450 is supplied to the scan driver 420, and the data driving control signal DCS is supplied to the data driver 430. In addition, the timing controller 450 transfers data supplied from the outside to the data driver 430.

In the organic light emitting diode display 400, the scan driver 420 and the data driver 430 may be mounted in a COF package in the form of an integrated circuit (or a chip) and electrically connected to the display panel 410.

In an exemplary embodiment, the power lines for supplying the first and second pixel power sources ELVDD and ELVSS to the display panel 410 may be at least one central power line passing through a lower end of a driving integrated circuit in the COF package. In addition, the power lines may be at least one outer power line passing through the outside of the COF package.

In another embodiment, the power lines for supplying the first and second pixel power sources ELVDD and ELVSS to the display panel 410 may be included in a COF package including a base film having two or more layers. At this time, the power lines may be a central power line that can be freely disposed at any position on one of the two or more layers of the base film. In addition, the power lines may be at least one outer power line passing through the outside of one of the two or more layers of the base film.

Here, the power supply unit 430 and the timing controller 440 correspond to the power board and the timing controller board, respectively. The power board and the timing controller board are electrically connected to the printed circuit board to drive and drive the first and second pixel power sources ELVDD and ELVSS through at least one central power wiring and at least one outer power wiring provided in the COF package. Signals are supplied to the display panel 410. In this case, the printed circuit board may be connected to an edge region of the display panel 410, or may be connected to only one side of the display panel 410.

As mentioned above, although preferred embodiment of this invention was described, this invention is not limited to this, It can be variously modified and implemented within the range of a claim and a detailed description of an invention, and an accompanying drawing, and this also of the invention Naturally, it belongs to the range.

100a, 100b, 100c, 100d, 200a, 200b, 320: COF package
110, 210: base film
120, 220: signal wiring
130, 230: drive integrated circuit
140a, 240a: signal output pad
140b, 240b: signal input pad
150, 250: external lead
160, 260: central power wiring
170, 270: external power wiring
210a: first layer of base film
210b: second layer of base film
300, 400: organic light emitting display device
310, 410: display panel
330: printed circuit board
340: FPC
420: scan driver
430: data driver
440: power supply
450: timing controller
460 pixels

Claims (10)

Base film;
A plurality of signal wires disposed on the base film;
A drive integrated circuit mounted on the base film; And
At least one central power supply wiring disposed on the base film and passing through a lower end of the driving integrated circuit;
The driving integrated circuit is a scan driving circuit for generating a scan signal or a data driving circuit for generating a data signal,
And the at least one central power supply wiring is not electrically connected to the driving integrated circuit. The method of claim 1,
And at least one outer power wiring disposed on the base film and passing outside of the base film. delete A base film having a first layer and a second layer;
A plurality of signal wires disposed on the first layer;
A drive integrated circuit mounted on the first layer; And
At least one central power wiring disposed on the second layer,
The driving integrated circuit is a scan driving circuit for generating a scan signal or a data driving circuit for generating a data signal,
And the at least one central power supply wiring is not electrically connected to the driving integrated circuit. The method of claim 4, wherein
And at least one outer power supply wiring passing outside of the second layer. delete 5. The COF package of claim 4, wherein the drive integrated circuit comprises a plurality of electrode pads on a bottom surface, the electrode pads being connected on the first layer by conductive bumps. A display panel having a plurality of pixels;
A COF package mounted on a base film with a driving integrated circuit for driving the display panel, the COF package having at least one central power wiring disposed on the base film and passing through a lower end of the driving integrated circuit;
A power board for providing pixel power supplies to the pixels; And
A timing controller board for controlling the drive integrated circuit;
The driving integrated circuit is a scan driving circuit for generating a scan signal or a data driving circuit for generating a data signal,
And at least one central power line is not electrically connected to the driving integrated circuit. 9. The package of claim 8, wherein the COF package is
And at least one outer power wire disposed on the base film and passing outside of the base film. The organic light emitting diode display of claim 8, wherein the COF package is positioned at an edge of the display panel.

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