KR20140050831A - Chip on film package and organic light emitting display device having the same - Google Patents

Abstract

A chip on film (COF) package comprises: a base film; a plurality of signal lines disposed on the base film; a driving integrated circuit mounted on the base film; and at least one central power line which is disposed on the base film and passes the power part of the driving integrated circuit.

Description

TECHNICAL FIELD [0001] The present invention relates to a COF package and an organic light emitting diode (OLED)

The present invention relates to an organic light emitting display. More particularly, the present invention relates to an organic light emitting display device capable of displaying an image of uniform luminance by including a COF package in which a power wiring structure is improved.

The organic light emitting display device is a self-emission type display device that displays an image by providing an organic light emitting diode (OLED) that emits light by itself. Unlike a liquid crystal display device, such an organic light emitting display device does not require a separate light source, so that the thickness and weight can be relatively reduced. Further, the organic light emitting display device exhibits high-quality characteristics such as low power consumption, high luminance, and fast response speed.

Generally, an organic light emitting display includes a display panel including a plurality of pixels, a driver for supplying a driving signal to the display panel, and a power supply for supplying power to the display panel. At this time, the driver may be connected to the display panel by a tape carrier package (TCP) mounting method, a chip on film (COF) mounting method, or a COG (chip on glass) mounting method.

At this time, when the driving unit is connected to the display panel based on the COF mounting method, since the power supply wiring for supplying the pixel power to the display panel is disposed only on the outer side of the film, in this case, . As a result, the display panel may be deteriorated and the lifetime of the organic light emitting display device may be deteriorated.

It is an object of the present invention to provide a COF package in which a power wiring structure is improved.

Another object of the present invention is to provide an organic light emitting display device which minimizes current concentration phenomenon and voltage drop (IR-drop) of a display panel by including a COF package in which a power wiring structure is improved.

However, the problems to be solved by the present invention are not limited by the above-mentioned problems, but may be variously expanded without departing from the spirit and scope of the present invention.

In order to accomplish one object of the present invention, a COF (chip on film) package according to embodiments of the present invention includes a base film, a plurality of signal wirings disposed on the base film, An integrated circuit, and at least one central power line disposed on the base film and passing through a lower end of the driving integrated circuit.

According to an embodiment, the COF package may further include at least one outer power line disposed on the base film and passing through the outer side of the base film.

According to an embodiment, the driving integrated circuit may be a scan driving circuit for generating a scan signal or a data driving circuit for generating a data signal.

In order to accomplish one object of the present invention, a COF package according to embodiments of the present invention includes a base film having a first layer and a second layer, a plurality of signal wirings disposed on the first layer, A drive integrated circuit mounted on one layer, and at least one central power supply wiring disposed on the second layer.

According to an embodiment, the COF package may further include at least one outer power supply wiring extending outside the second layer.

According to an embodiment, the driving integrated circuit may be a scan driving circuit for generating a scan signal or a data driving circuit for generating a data signal.

According to one embodiment, the driving integrated circuit includes a plurality of electrode pads on a bottom surface, and the electrode pads may be connected on the first layer by conductive bumps.

According to another aspect of the present invention, there is provided an OLED display including a display panel having a plurality of pixels, a driver IC for driving the display panel mounted on a base film, A COF package disposed on the base film and having at least one central power supply line passing through a lower end of the driving integrated circuit, a power board providing pixel power supplies to the pixels, and a timing controller board . ≪ / RTI >

According to an embodiment, the COF package may further include at least one outer power line disposed on the base film and passing through the outer side of the base film.

According to an embodiment, the COF package may be located in an edge region of the display panel.

The COF package according to the embodiments of the present invention includes at least one central power supply wiring arranged to pass over the lower end of the driving integrated circuit and at least one outer power supply wiring arranged to pass over the outside of the base film, It is possible to uniformly apply the pixel power to the display panel.

The organic light emitting diode display according to embodiments of the present invention includes the COF package, thereby displaying images of uniform luminance and outputting high quality images.

1A to 1D are views showing a COF package according to embodiments of the present invention.
2A and 2B are views showing a COF package according to embodiments of the present invention.
3 is a view illustrating an organic light emitting display according to embodiments of the present invention.
4 is a block diagram illustrating an organic light emitting display according to embodiments of the present invention.

Hereinafter, an organic light emitting display according to exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings, but the present invention is not limited by the exemplary embodiments described herein, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

In the present specification, specific structural or functional descriptions are merely illustrative and are for the purpose of describing exemplary embodiments of the present invention, and it is to be understood that the embodiments of the present invention may be embodied in various forms, And is intended to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the present invention. It is to be understood that when an element is described as being "connected" or "in contact" with another element, it may be directly connected or contacted with another element, but it is understood that there may be another element in between something to do. In addition, when it is described that an element is "directly connected" or "directly contacted " to another element, it can be understood that there is no other element in between. Other expressions that describe the relationship between components, for example, "between" and "directly between" or "adjacent to" and "directly adjacent to", and the like may also be interpreted.

The terminology used herein is for the purpose of describing exemplary embodiments only and is not intended to be limiting of the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In this specification, the terms "comprising," "comprising" or "having ", and the like, specify that there are performed features, numbers, steps, operations, elements, It should be understood that the foregoing does not preclude the presence or addition of other features, numbers, steps, operations, elements, parts, or combinations thereof. Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application .

The terms first, second, third, fourth, etc. may be used to describe various components, but such components are not limited by these terms. The terms are used for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second, third, or fourth component, and similarly, the second, third, . ≪ / RTI >

1A to 1D are views showing a COF package according to embodiments of the present invention.

1A to 1D, at least one central power supply line 160 is disposed on a base film 110 so as to pass through a lower end of a driving integrated circuit 130, The COF packages 100a, 100b, 100c, and 100d having at least one external power supply wiring line 170 disposed so as to pass through the outside of the power supply wiring lines 100a, 100b, 100c, and 100d.

In this embodiment, the COF packages 100a, 100b, 100c, and 100d include a base film 110, a plurality of signal wirings 120, a drive integrated circuit 130, at least one central power supply wiring 160 . At this time, the COF packages 100a, 100b, 100c, and 100d may further include at least one external power supply wiring arranged to pass over the outside of the base film 110 on the base film 110. [

1A, a COF package 100a includes a central power supply wiring 160 passing through the bottom of the base film 110, the signal wiring 120, the driving integrated circuit 130 and the driving integrated circuit 130 can do.

The base film 110 may be formed of a polyimide resin or an epoxy resin or other known material so as to have flexibility. Specifically, the signal lines 120, the driving integrated circuit 130, and the central power line 160 may be formed on the base film 110.

Signal wirings 120 may be disposed on the base film 110. In addition, each of the signal wirings 120 may include an external lead 150 extending to the side end portion of the base film 110. Here, the external lead 150 may be connected to an external circuit such as a printed circuit board and a display panel.

The driving integrated circuit 130 may be mounted on the base film 110. [ Specifically, the driving integrated circuit 130 may be a scan driving circuit for generating a scan signal or a data driving circuit for generating a data signal. Accordingly, the driving integrated circuit 130 may receive a control signal from the signal lines 120 to generate a scan signal or a data signal. The scan signal or the data signal may be transmitted to the plurality of pixels through signal lines 120 disposed on the base film 110.

The central power supply wiring 160 may be disposed on the base film 110 so as to pass through the lower end of the driving integrated circuit 130. However, the present invention is not limited thereto, and as shown in FIG. 1B, the central power supply line 160 may be additionally disposed on the base film 110.

In this embodiment, the pins of the driving integrated circuit 130 passing through the central power supply wiring 160 are not connected to the base film 110. That is, by this structure, the central power supply wiring 160 can be arranged to pass through the portion where the pins are not connected (that is, the lower end of the driving integrated circuit 130).

The driving integrated circuit 130 may include a plurality of electrode pads 140a and 140b on a bottom surface thereof. Specifically, the plurality of electrode pads 140a and 140b may be terminals for power control of an external circuit (not shown) and input / output of a signal. For example, the electrode pads 140a and 140b include an input part, a signal input pad 140b for receiving data and control signals input from an external circuit, and a signal output pad 140a for transmitting a signal to the pixel part, Lt; / RTI > The plurality of electrode pads 140a and 140b may be connected to the base film 110 by conductive bumps (not shown). Specifically, the conductive bump may be formed on the pad portion of the driving integrated circuit 130 to electrically connect the base film 110 and the driving integrated circuit 130.

Referring to FIG. 1B, a plurality of central power lines 160 may be disposed on the base film 110. Therefore, the pixel power can be uniformly applied to the plurality of pixels through the plurality of central power supply wirings 160. Accordingly, the organic light emitting display device can output images of uniform luminance and high quality images.

1C, a central power line 160 is disposed on the base film 110, and at least one outer power line 170 passing through the outside of the base film 110 may be further disposed. 1C, external power supply wiring 170 is disposed on both sides of the base film 110. However, the external power supply wiring 170 may be disposed only on one side of the base film 110. FIG.

1D, a plurality of central power supply wires 160 are disposed on the base film 110, and at least one outer power supply wire 170 passing through the outer side of the base film 110 may be additionally disposed . Similarly, although the outer power supply wiring 170 is shown on both sides of the base film 110, the outer power supply wiring 170 may be disposed only on one side of the base film 110. [

As a result, the first and second pixel power sources ELVDD and ELVSS generated from the power board are connected to at least one central power supply line 160 included in the COF packages 100a, 100b, 100c, and 100d, And is transmitted to the plurality of pixels through the external power supply wiring 170. At least one central power supply line 160 is disposed so as to pass through the lower end of the driving integrated circuit 130 and at least one outer power supply line 170 is additionally disposed along the outside of the base film 110, The current concentration phenomenon of the display panel and the voltage drop of the pixel power supply can be minimized. Thus, the organic light emitting display device can display images of uniform luminance.

2A and 2B are views showing a COF package according to embodiments of the present invention.

Referring to FIGS. 2A and 2B, COF packages 200a and 200b including a base film 210 composed of a first layer 210a and a second layer 210b are illustrated. However, this is only one example, and the number of layers constituting the base film 210 is not limited thereto. For example, the base film 210 may comprise three or more layers.

In this embodiment, the COF packages 200a and 200b include a base film 210, signal lines 220, a driving integrated circuit 230, at least one central power supply line 260, and / And power supply wiring 270. At this time, the at least one outer power supply wiring 270 may be arranged to pass outside the second layer 210b of the base film 210. [

However, the remaining components except for the base film 210 and at least one central power supply line 260 are the same as the COF packages 100a, 100b, 100c, and 100d shown in FIGS. 1A to 1D, The description will be omitted.

2A, the COF package 200a includes a base film 210, signal lines 220, a driving integrated circuit 230, and a central power source 220. The base film 210 includes a first layer 210a and a second layer 210b. And may include a wiring 260.

The base film 210 may be formed of a polyimide resin, an epoxy resin, or another known material so as to have flexibility. In this embodiment, the base film 210 is composed of the first layer 210a and the second layer 210b, but the number of the layers constituting the base film 210 is not limited thereto.

The driving integrated circuit 230 may be mounted on the first layer 210a and at least one central power supply wiring 260 may be disposed in the second layer 210b.

As shown in FIG. 2A, the first layer 210a of the base film 210 may include signal lines 220 and a driving integrated circuit 230. FIG. At this time, the driving integrated circuit 230 may include a plurality of electrode pads 240a and 240b on the bottom surface. The electrode pads 240a and 240b may be connected to the first layer 210a of the base film 210 by conductive bumps.

At least one central power supply line 260 may be disposed on the second layer 210b of the base film 210. [ At this time, at least one central power supply line 260 may be freely disposed at any position on the second layer 210b of the base film 210. [

Referring to FIG. 2B, at least one outer power supply line 270 may be additionally disposed on the second layer 210b of the base film 210. FIG. 2B illustrates that the outer power supply wiring 270 is disposed on both sides of the second layer 210b of the base film 210. The outer power supply wiring 270 may be formed on the outer side of the second layer 210b of the base film 210, Only the external power supply wiring 270 may be disposed. As described above, the present invention can effectively prevent the power supply lines 260 and 270 from being concentrated on a specific region. Thus, the manufacturing cost can be reduced, and the structure of the module can be simplified.

3 is a view illustrating an organic light emitting display according to embodiments of the present invention.

3, the OLED display 300 may include a display panel 310, a COF package 320, a power board (not shown), and a timing controller board (not shown).

The display panel 210 may include a plurality of pixels. Specifically, the pixels may be formed in an area defined by the scan lines and the data lines. At this time, the pixels are driven by the driving signals supplied from the COF package 320, the first and second pixels supplied through the at least one central power supply line included in the COF package 320, And displays an image corresponding to the power supplies ELVDD and ELVSS.

The COF package 320 may be formed on an edge region of the display panel 310. [ Specifically, the COF package 320 includes a driving integrated circuit 350 for driving the display panel 310, and the driving integrated circuit 350 can be mounted on the base film. In this case, the driving integrated circuit 350 may be a scan driving circuit for generating a scan signal for the pixels or a data driving circuit for generating a data signal for the pixels.

In one embodiment, the COF package 320 may include at least one central power supply line that provides first and second pixel powers (ELVDD, ELVSS) to the pixels on the base film. In addition, the COF package 320 may further include at least one outer power supply line passing through the base film on the outer side of the base film.

In another embodiment, the COF package 320 may comprise a base film having two or more layers. At this time, the driving integrated circuit 350 may be mounted on one of the layers, and at least one central power supply wiring may be disposed in the other one of the layers. Specifically, at least one central power supply line can be freely disposed at any position on the other layer. Further, according to the embodiment, at least one outer power supply line may be disposed in the other of the layers. At this time, at least one external power supply wiring may be arranged to pass outside the other one of the layers. At least one central power supply line and at least one external power supply line may provide the first and second pixel power supplies ELVDD and ELVSS to the pixels. Thus, the COF package 320 may have an improved power wiring structure. Also, the current concentration phenomenon and deterioration of the display panel 310 can be prevented by the COF package 320 including the power supply wiring structure, and the lifetime of the organic light emitting display 300 can be prevented from decreasing.

Both ends of the COF package 320 may be connected to the display panel 310 and the printed circuit board 250 through an anisotropic conductive film or an anisotropic conductive paste which is a conductive adhesive material. However, this is only an example, But the present invention is not limited thereto. In this embodiment, the FPC 340 may have single-layer or multi-layer wiring (not shown) for supplying the first and second pixel power sources ELVDD and ELVSS to the pixels.

As described above, the organic light emitting diode display 300 includes at least one central power supply line and at least one outer power supply line arranged to pass through the lower end of the driving integrated circuit 350, The first and second pixel power sources ELVDD and ELVSS can be uniformly applied to the display panel 310 through the COF package 320. [ As a result, the current concentration phenomenon and deterioration of the display panel 310 can be prevented, and the lifetime of the OLED display 300 can be prevented from decreasing. Accordingly, the present invention can be applied to various display devices such as TVs and electric sign boards, and the utilization of the OLED display 300 can be enhanced.

The power board may provide pixel power sources (ELVSS, ELVDD) to the pixels through at least one central power supply line included in the COF package 320 and at least one outside power line.

The timing controller board may provide control signals for controlling the driving integrated circuit 350. [

Specifically, the power board and the timing controller board may be electrically connected to the printed circuit board 330 to transmit the first and second pixel power sources ELVDD, ELVSS, and control signals to the printed circuit board 330. Here, the printed circuit board 330 may be connected to a part of the display panel 310 by the FPC 340. At this time, the first and second pixel power sources ELVDD and ELVSS transmitted to the printed circuit board 330 are displayed through at least one central power supply line provided in the COF package 320 and at least one outer power line May be applied to the panel 310.

3, the printed circuit board 330 is connected to the edge region of the display panel 310. However, the present invention is not limited thereto. That is, the printed circuit board 330 may be connected to the edge region of the display panel 310, but may be connected to only one side of the display panel 310.

4 is a block diagram illustrating an organic light emitting display according to embodiments of the present invention.

4, the organic light emitting diode display 400 may include a display panel 410, a scan driver 420, a data driver 430, a power supply 440, and a timing controller 450. Here, the power supply unit 430 and the timing control unit 440 may correspond to the power board and the timing controller board, respectively.

The display panel 410 may include a plurality of pixels 460. More specifically, the display panel 410 includes a plurality of pixels 460 formed in a region partitioned by the scan lines S1, ..., Sn and the data lines D1, ..., Dm. can do. At this time, the display panel 410 displays an image based on the scan signal supplied from the scan driver 420 and the data signal supplied from the data driver 430.

The scan driver 420 may provide a scan signal to the pixels 460. Specifically, the scan driver 420 generates a scan signal in response to the scan driver control signal SCS supplied from the timing controller 450. [ The scan signals generated in the scan driver 420 are sequentially supplied to the scan lines S1, ..., Sn.

The data driver 430 may provide a data signal to the pixels 460. Specifically, the data driver 430 generates a data signal corresponding to the data driving control signal DCS supplied from the timing controller 440. The data signal generated in the data driver 430 is supplied to the data lines D1, ..., Dm in synchronization with the scan signal.

In this embodiment, the power supply unit 440 corresponding to the power board may generate the first and second pixel power sources ELVDD and ELVSS using external power supplied from an external power supply. Specifically, the first and second pixel power sources ELVDD and ELVSS generated in the power supply unit 440 are provided to the pixels 460 through the power supply lines included in the COF package. At this time, the power supply wirings may be arranged to pass through the lower end of the scan drive circuit or the data drive circuit mounted in the COF package.

In this embodiment, the timing controller 450 corresponding to the timing controller board can control the scan driver 410 and the data driver 430. Specifically, the timing controller 450 generates a scan driving control signal SCS and a data driving control signal DCS in response to externally supplied synchronizing signals. The scan driving control signal SCS generated by the timing control unit 450 is supplied to the scan driving unit 420 and the data driving control signal DCS is supplied to the data driving unit 430. In addition, the timing controller 450 transmits data supplied from the outside to the data driver 430.

In the OLED display 400, the scan driver 420 and the data driver 430 may be mounted in a COF package in the form of an integrated circuit (or a chip) and electrically connected to the display panel 410.

The power supply lines for supplying the first and second pixel power supplies ELVDD and ELVSS to the display panel 410 may be at least one central power supply wiring that passes the lower end of the driving integrated circuit in the COF package. In addition, the power supply lines may be at least one outer power line passing through the outside of the COF package.

In another embodiment, the power supply lines for supplying the first and second pixel power sources ELVDD and ELVSS to the display panel 410 may be included in a COF package including a base film having two or more layers. In this case, the power supply lines may be a central power supply line that can be freely disposed at any position on one of the two or more layers of the base film. Further, the power supply lines may be at least one outer power line passing through the outer side of one of the two or more layers of the base film.

Here, the power supply unit 430 and the timing controller 440 correspond to the power board and the timing controller board, respectively. The power board and the timing controller board are electrically connected to the printed circuit board and electrically connected to the first and second pixel power sources ELVDD and ELVSS via at least one central power supply line provided in the COF package and at least one external power line, And supplies the signals to the display panel 410. At this time, the printed circuit board may be connected to the edge region of the display panel 410, and may be connected to only one side of the display panel 410.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, and that various changes and modifications may be made without departing from the scope of the appended claims, It is natural to belong to the scope.

100a, 100b, 100c, 100d, 200a, 200b, 320: COF package
110, 210: base film
120, 220: signal wiring
130, 230: drive integrated circuit
140a, 240a: signal output pad
140b, 240b: signal input pad
150, 250: External lead
160, 260: Central power supply wiring
170, 270: external power supply wiring
210a: first layer of base film
210b: second layer of base film
300, 400: organic light emitting display
310, 410: display panel
330: printed circuit board
340: FPC
420: scan driver
430:
440: Power supply
450:
460: pixel

Claims (10)

A base film;
A plurality of signal lines arranged on the base film;
A driving integrated circuit mounted on the base film; And
And at least one central power line disposed on the base film and passing through a lower end of the drive integrated circuit. The method according to claim 1,
Further comprising at least one outer power line disposed on the base film and passing through an outer side of the base film. The COF package according to claim 1, wherein the drive integrated circuit is a scan drive circuit for generating a scan signal or a data drive circuit for generating a data signal. A base film having a first layer and a second layer;
A plurality of signal lines disposed on the first layer;
A driver integrated circuit mounted on the first layer; And
And at least one central power line disposed on the second layer. 5. The method of claim 4,
Further comprising at least one outer power supply wiring extending outside the second layer. The COF package according to claim 4, wherein the drive integrated circuit is a scan drive circuit for generating a scan signal or a data drive circuit for generating a data signal. 5. The COF package according to claim 4, wherein the drive integrated circuit includes a plurality of electrode pads on a bottom surface, and the electrode pads are connected on the first layer by conductive bumps. A display panel having a plurality of pixels;
A COF package mounted on a base film for driving the display panel and having at least one central power supply line disposed on the base film and passing through a lower end of the drive integrated circuit;
A power board for providing pixel power sources to the pixels; And
And a timing controller board for controlling the driving integrated circuit. The package according to claim 8, wherein the COF package
And at least one external power supply line disposed on the base film and passing through the outside of the base film. The organic light emitting diode display according to claim 8, wherein the COF package is located at an edge region of the display panel.

Images