KR102007915B1 - Conductive tape using metal fiber - Google Patents

Abstract

The present disclosure relates to a conductive tape using metal fibers, and more particularly, to a substrate layer formed by weaving metal fibers and a conductive adhesive layer formed on an upper surface of the substrate layer.
The conductive tape produced through the above process is applied to the metal fiber woven fabric as a base layer exhibits excellent adhesion, electrical conductivity and mechanical properties.

Description

Conductive Tape Using Metal Fiber {CONDUCTIVE TAPE USING METAL FIBER}

The present disclosure relates to a conductive tape using a metal fiber, and more particularly, to a conductive tape using a metal fiber exhibiting excellent adhesion, electrical conductivity and mechanical properties by applying a metal fiber woven fabric as a base layer.

Conductive adhesive tapes are classified into conductive adhesive tapes having conductivity only in the longitudinal direction and conductive adhesive tapes having conductivity in both the length and thickness directions. For example, a conductive adhesive tape made of a conductive adhesive in which a metal foil made of copper and a metal powder such as nickel is mixed has thermal and electrical conductivity in both length and thickness directions. However, a conductive adhesive tape made of a conductive adhesive in which a metal foil and an oxidized ceramic powder, for example, an oxidized alumina powder is mixed, has thermal conductivity in both length and thickness directions but does not have electrical conductivity in the thickness direction.

The conductive adhesive tape is used for the purpose of electric transfer or electromagnetic shielding, and the conductive adhesive tape having conductivity in the length and thickness directions is more expensive than the price of the conductive adhesive tape having conductivity only in the longitudinal direction.

These conductive adhesive tapes are usually composed of a conductive base and an adhesive, and a conductive film is mainly used as a material in which a metal thin film such as aluminum or copper is plated or deposited, and the adhesive is an electrically conductive adhesive. Mainly used.

However, when applying the base layer formed by weaving metal fibers, the electrical conductivity of the conductive tape is significantly improved and the mechanical properties are also improved, rather than applying the base layer on which a metal thin film such as aluminum or copper is formed. It was.

Korean Patent Registration No. 10-0774441 (2007.11.01) Korea Patent Registration No. 10-1679336 (2016.11.18)

Disclosed is to provide a conductive tape using a metal fiber exhibiting excellent adhesion, electrical conductivity and mechanical properties by applying a metal fiber woven fabric as a substrate layer.

As one embodiment of the present disclosure describes a conductive tape using a metal fiber, characterized in that consisting of a substrate layer formed by weaving a metal fiber and a conductive adhesive layer formed on the upper surface of the base layer; have.

Preferably, the conductive adhesive layer may be further formed on the lower surface of the base layer.

More preferably, the base layer may be formed by using a weft or warp, or a weft and warp using a metal fiber composed of one selected from the group consisting of nickel, copper, stainless steel, silver and gold.

More preferably, the conductive adhesive layer may be made by mixing 10 to 15 parts by weight of the conductive metal powder to 100 parts by weight of the acrylic adhesive mixture.

Still more preferably, the acrylic adhesive mixture may include 100 parts by weight of an acrylic adhesive, 1 to 1.5 parts by weight of a phenolic tackifier, 0.1 to 0.3 parts by weight of a curing agent, 0.3 to 0.5 parts by weight of a thixotropic agent, 40 to 50 parts by weight of a solvent, and The epoxy silane may be 0.2 to 0.3 parts by weight.

Even more preferably, the conductive metal powder has a particle size of 1 to 5㎛, may be made of one or more selected from the group consisting of nickel, copper, aluminum, gold and silver.

Even more preferably, the nickel may be formed by mixing a sphere having a particle size of 2.2 to 2.6 μm and a needle having a particle size of 3.5 to 4 μm in a 1: 1 weight part.

The conductive tape using the metal fiber as described above has an excellent effect of providing a conductive tape exhibiting excellent adhesion, electrical conductivity and mechanical properties by applying a metal fiber woven fabric to the base layer.

1 is an exploded perspective view showing a conductive tape using a metal fiber according to an embodiment of the present disclosure.
Figure 2 is an exploded perspective view showing a conductive tape using a metal fiber according to another embodiment disclosed.
3 is a manual showing an apparatus and method for measuring the resistance of a conductive tape using the disclosed metal fibers.

In the following, preferred embodiments of the present invention and the physical properties of each component will be described in detail, which is intended to explain in detail enough to be able to easily carry out the invention by one of ordinary skill in the art, This does not mean that the technical spirit and scope of the present invention is limited.

The conductive tape using the disclosed metal fibers consists of a base layer 10 formed by weaving metal fibers and a conductive adhesive layer 20 formed on an upper surface of the base layer 10.

The base layer 10 is made by weaving a metal fiber to a thickness of 10 to 1000㎛, using a metal fiber made of one selected from the group consisting of nickel, copper, stainless steel, silver and gold as weft or warp, or weft and warp It is preferable to use.

In the case of forming the base layer using a weft or warp metal fiber composed of one selected from the group consisting of nickel, copper, stainless steel, silver and gold, non-metal fiber such as polyethylene terephthalate, polyethylene and polycarbonate can be used as warp or weft yarn. have.

More specifically, a conductive metal such as nickel, copper, stainless steel, silver and gold is prepared in the form of a yarn having a thickness of 1 to 100 μm, and polyethylene terephthalate, polyethylene and polycarbonate are 1 to 100 μm in thickness. After being manufactured in the form of a yarn having a weaving by applying a weft or warp, the method of weaving may be a method of weaving plain or twill weave.

The substrate layer 10 manufactured by the above method is preferably subjected to a rinse to remove arcs, and to perform calendering at least once at a temperature of 150 ° C. or higher and a pressure of 30 kg / cm ² or higher.

At this time, the temperature and pressure and the number of calendering is variable according to the type and thickness of the metal fiber applied as the material of the substrate layer, it is preferable to perform the calendering to the thickness according to the required fabric thickness.

The conductive adhesive layer 20 is formed to a thickness of 5 to 500㎛ on the upper surface, the upper surface and the lower surface of the base layer 10, mixed with 10 to 15 parts by weight of the conductive metal powder to 100 parts by weight of the acrylic adhesive mixture. It is made to, to give the adhesive performance to the conductive tape using the disclosed metal fibers and exhibits conductivity.

The acrylic adhesive mixture may contain 100 parts by weight of an acrylic adhesive, 1 to 1.5 parts by weight of a phenol tackifier, 0.1 to 0.3 parts by weight of a curing agent, 0.3 to 0.5 parts by weight of a thixotropic agent, 40 to 50 parts by weight of a solvent, and 0.2 to 0.3 weight of an epoxy silane. Although the hardener is preferably a mixture of an isocyanate hardener and an epoxy hardener at 4: 1 parts by weight, the thixotropic agent and the solvent are not particularly limited as long as they are components used in an acrylic adhesive, and any one can be used.

The conductive metal powder contains 10 to 15 parts by weight, and comprises at least one selected from the group consisting of nickel, copper, aluminum, gold, and silver having a particle size of 1 to 5 μm, which provides conductivity to the conductive adhesive layer. Play a role.

When the content of the conductive metal powder is less than 10 parts by weight, the electrical conductivity of the conductive adhesive layer 20 is lowered. When the content of the conductive metal powder exceeds 15 parts by weight, the electrical conductivity of the conductive adhesive layer 30 is greatly improved. Without increasing the manufacturing cost and lowering the adhesive performance of the conductive adhesive layer.

In this case, it is preferable to use the nickel is composed of a sphere having a particle size of 2.2 to 2.6 ㎛ and a particle size of 3.5 to 4 ㎛ needle type mixed in a weight part of 1: 1, by using a sphere and a needle together In addition, when the needle type alone is used, the formation of a network between the conductive particles is easier and the electrical conductivity is improved, so that the horizontal and vertical resistance of the conductive adhesive layer is lowered.

In addition, in addition to nickel, other conductive metal powders, including copper, may also be used by mixing different types of particles to improve electrical conductivity in the conductive adhesive layer 20.

As described above, the conductive tape using the metal fiber composed of the base layer 10 and the conductive adhesive layer 20 is run while unwinding the release film (or the base material) using an unwinder, and is released through a guide roll. Applying a conductive adhesive component to the film (or substrate) to a thickness according to the coater, in order to remove the solvent contained in the conductive adhesive component to pass through the drying duct considering the drying temperature and time, the substrate layer to be laminated (20) ) Is run while unwinding using an unwinder, and a release film (or substrate) coated with a conductive adhesive component and a substrate layer 20 are laminated using a lamination (or hot lamination), and a rewinder is used. It is produced through the process of rewinding the laminated laminate.

Hereinafter, a method of manufacturing a conductive tape using the disclosed metal fiber and the physical properties of the conductive tape manufactured by the manufacturing method will be described with reference to Examples.

Production Example 1 Preparation of Substrate Layer

The base layer was prepared by weaving a 10 μm-thick copper fiber with a weft, and a 10 μm-thick polyethylene terephthalate fiber as a warp, but weaving by a plain weave method having a distance of 1 mm of copper fiber, and providing a base material to the prepared base layer. In order to remove, rinsing was performed, and calendering was performed twice at a temperature of 160 ° C. and a pressure of 40 kg / cm ² to prepare a base layer.

Preparation Example 2 Preparation of Conductive Adhesive

100 parts by weight of acrylic adhesive, 1.25 parts by weight of phenol tackifier, 0.15 part by weight of epoxy curing agent, 0.6 part by weight of isocyanate curing agent, 0.4 part by weight of thixotropic agent (palm oil), 23.65 parts by weight of solvent (ethyl acetate), solvent (toluene ) 23.65 parts by weight, 0.25 parts by weight of epoxy silane, 0.042 parts by weight of silver powder (particle size 5 μm), 4.74 parts by weight of spherical nickel powder (particle size 2.4 μm) and 4.74 parts by weight of acicular nickel powder (particle size 3.8 μm) To prepare a conductive adhesive.

<Example 1>

A process of forming a conductive adhesive layer by forming a substrate layer prepared in Preparation Example 1 to a thickness of 10㎛, and applying a conductive adhesive prepared in Preparation Example 2 to a thickness of 10㎛ on one surface of the substrate layer. Through to prepare a conductive tape using a metal fiber.

<Examples 2 to 11>

Proceed in the same manner as in Example 1, to form a base layer to a thickness of 20 to 500㎛ to prepare a conductive tape using a metal fiber.

Comparative Example 1

Electroless plating was performed on the polyethylene terephthalate fiber in the order of nickel, copper, and nickel to prepare a base material layer having a thickness of 50 μm, and the conductive adhesive prepared in Preparation Example 2 on one side of the base layer was 10 μm in thickness. Application was made to the conductive tape.

Comparative Example 2

Forming a substrate layer prepared in Preparation Example 1 to a thickness of 50㎛, 100 parts by weight of an acrylic adhesive, 1.25 parts by weight of a phenol tackifier, 0.15 parts by weight of an epoxy curing agent, an isocyanate curing agent 0.6 on one surface of the substrate layer Parts by weight, 0.4 parts by weight of thixotropic agent (palm oil), 23.65 parts by weight of solvent (ethyl acetate), 23.65 parts by weight of solvent (toluene), 0.25 parts by weight of epoxy silane, 0.042 parts by weight of silver powder (particle size 5 μm), needle type A conductive tape was prepared by mixing 9.48 parts by weight of nickel powder (particle size 3.8 μm) and applying a conductive adhesive to a thickness of 10 μm.

The adhesion, surface resistance and vertical resistance of the conductive tape using the metal fibers prepared through Examples 1 to 11 were measured and shown in Table 1 below.

(However, the adhesive force was measured using a tackek Lab-Q G20, the surface resistance and the vertical resistance was measured using the measurement method shown in Figure 3 below using ASTM D257.)

TABLE 1

As shown in Table 1 above, it can be seen that the conductive tapes produced through the disclosed Examples 1 to 11 have excellent adhesion and electrical conductivity.

In addition, the adhesive force, surface resistance and vertical resistance of the conductive tapes prepared through Example 4 and Comparative Examples 1 to 2 were measured and shown in Table 2 below.

TABLE 2

As shown in Table 2 above, the conductive tape produced through the disclosed Example 4 is superior to the conductive tapes prepared through Comparative Examples 1 to 2, but the surface resistance and the vertical resistance was found to exhibit excellent electrical conductivity is low Can be.

Therefore, the conductive tape using the disclosed metal fiber is applied to the metal fiber woven fabric as a base layer to exhibit excellent adhesion, electrical conductivity and mechanical properties.

10; Substrate layer
20; Conductive Adhesive Layer

Claims (7)

A base layer formed by weaving metal fibers; And
Conductive adhesive layer formed on the upper surface of the base layer;
The conductive adhesive layer is made by mixing 10 to 15 parts by weight of the conductive metal powder to 100 parts by weight of the acrylic adhesive mixture,
The conductive metal powder is a conductive tape using a metal fiber, characterized in that the spherical nickel having a particle size of 2.2 to 2.6㎛ and 3.5 to 4㎛ needle-shaped nickel is mixed in a 1: 1 weight part.
delete The method according to claim 1,
The base layer is a conductive tape using a metal fiber, characterized in that formed using a weft or warp, or a weft and warp, a metal fiber made of one selected from the group consisting of nickel, copper, stainless steel, silver and gold.
delete The method according to claim 1,
The acrylic adhesive mixture may contain 100 parts by weight of an acrylic adhesive, 1 to 1.5 parts by weight of a phenol tackifier, 0.1 to 0.3 parts by weight of a curing agent, 0.3 to 0.5 parts by weight of a thixotropic agent, 40 to 50 parts by weight of a solvent, and 0.2 to 0.3 weight of an epoxy silane. Conductive tape using a metal fiber, characterized in that consisting of. delete delete

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