JP2017220641A - Printed wiring board and electronic apparatus - Google Patents
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- JP2017220641A JP2017220641A JP2016116308A JP2016116308A JP2017220641A JP 2017220641 A JP2017220641 A JP 2017220641A JP 2016116308 A JP2016116308 A JP 2016116308A JP 2016116308 A JP2016116308 A JP 2016116308A JP 2017220641 A JP2017220641 A JP 2017220641A
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Landscapes
- Structure Of Printed Boards (AREA)
Abstract
Description
本発明は、金属補強板を備えたプリント配線板およびそのプリント配線板を備えた電子機器に関する。 The present invention relates to a printed wiring board including a metal reinforcing plate and an electronic apparatus including the printed wiring board.
携帯電話、およびスマートフォン等の電子機器は、内部に実装された電子部品が発する電磁波ノイズまたは外部から侵入する電磁波ノイズを原因とした誤作動を防止するために電磁波シールド層を設けることが一般的である。また、電子機器の内部に搭載されるプリント配線板、特にフレキシブルプリント配線板は、柔軟であるためその表面に電子部品を実装する場合、フレキシブルプリント配線板の電子部品実装面に対向した他面に接着剤層で金属板を貼り付けて補強することが行なわれている。そこで特許文献１では、前記接着剤層に導電性接着剤層を使用して電磁波シールド性を付与したプリント配線板が開示されている。 Electronic devices such as mobile phones and smartphones are generally provided with an electromagnetic shielding layer to prevent malfunction caused by electromagnetic noise generated by electronic components mounted inside or electromagnetic noise entering from the outside. is there. Also, printed wiring boards mounted inside electronic devices, especially flexible printed wiring boards, are flexible, so when mounting electronic components on the surface, be sure to place them on the other side of the flexible printed wiring board facing the electronic component mounting surface. It has been practiced to reinforce by attaching a metal plate with an adhesive layer. Therefore, Patent Document 1 discloses a printed wiring board in which an electromagnetic wave shielding property is imparted to the adhesive layer by using a conductive adhesive layer.
また、特許文献２では、電子部品に対する電磁波の効率的な除去のため、金属板の表面に金メッキを施し、導電性を改善したプリント配線板が開示されている。 Further, Patent Document 2 discloses a printed wiring board in which the surface of a metal plate is plated with gold in order to efficiently remove electromagnetic waves from an electronic component to improve conductivity.
しかし、特許文献１に記載されたプリント配線板は、導電性接着剤層を使用することで、通常の接着力は向上したが、プリント配線板の作製過程におけるリフロー工程（例えば２３０〜２８０℃）で、導電性接着剤層と金属補強板の界面に気泡が生じ、金属補強板が剥離し易いという問題があった。
また、特許公報２に記載されたプリント配線板は、金属板と貴金属等により形成されるメッキの界面の密着力が弱く、界面でクラックが生じ、抵抗値が増大する問題があった。
さらに、貴金属等により形成されるメッキを施した金属板は、導電性接着剤層との接着力が低い問題があった。
However, the printed wiring board described in Patent Document 1 uses a conductive adhesive layer to improve the normal adhesive force, but the reflow process (for example, 230 to 280 ° C.) in the manufacturing process of the printed wiring board. Therefore, there is a problem that bubbles are generated at the interface between the conductive adhesive layer and the metal reinforcing plate, and the metal reinforcing plate is easily peeled off.
In addition, the printed wiring board described in Patent Document 2 has a problem that the adhesion force at the interface of the plating formed by the metal plate and the noble metal is weak, cracks are generated at the interface, and the resistance value increases.
Furthermore, the plated metal plate formed of noble metal or the like has a problem of low adhesive force with the conductive adhesive layer.
本発明は、リフロー工程を経た後にも気泡が生じ難く、導電性接着剤層と金属板とが良好な接着力を有し、グランド回路と金属板との導電性が良好なプリント配線板の提供を目的とする。 The present invention provides a printed wiring board in which bubbles are not easily generated even after the reflow process, the conductive adhesive layer and the metal plate have good adhesion, and the electrical conductivity between the ground circuit and the metal plate is good. With the goal.
本発明のプリント配線板は、配線回路基板、導電性接着剤層、および金属補強板を備え、前記導電性接着剤層は、前記配線回路基板および金属補強板に対してそれぞれ接着し、前記金属補強板は、金属板の表面に中間層と表面保護層とを有してなり、前記中間層は、厚みが０．１〜３μｍのニッケル層であり、前記表面保護層は、厚みが０．０５〜０．５μｍの貴金属層であることを特徴とする。 The printed wiring board of the present invention includes a wiring circuit board, a conductive adhesive layer, and a metal reinforcing plate, and the conductive adhesive layer is bonded to the wiring circuit board and the metal reinforcing plate, respectively, and the metal The reinforcing plate has an intermediate layer and a surface protective layer on the surface of the metal plate, the intermediate layer is a nickel layer having a thickness of 0.1 to 3 μm, and the surface protective layer has a thickness of 0. It is a noble metal layer of 05 to 0.5 μm.
本発明によれば、金属補強板が、金属板の表面に中間層であるニッケル層を介して、貴金属により形成されてなる表面保護層を有していることにより、金属板の表面に直接、貴金属層である表面保護層を設ける場合よりも接着性に優れ、表面保護層が、中間層を介して金属板に対して十分な密着力で一体化する。 According to the present invention, the metal reinforcing plate has a surface protective layer formed of a noble metal via a nickel layer as an intermediate layer on the surface of the metal plate, thereby directly on the surface of the metal plate, Adhesiveness is superior to the case where a surface protective layer which is a noble metal layer is provided, and the surface protective layer is integrated with the metal plate with sufficient adhesion via the intermediate layer.
また、表面保護層は、プリント配線板の柔軟性を確保するために極めて薄く形成されることが多く、全面に多数の微小穴が生じているが、導電性接着剤層による接着時に微小穴に導電性接着剤が侵入して全面一様な導電性面となる。この結果、表示保護層と導電性接着剤層との接着力が強固になるとともに、表示保護層の導電性も増大する。また、貴金属により形成されてなる表面保護層は、酸化することが少なく、長期にわたって安定した導電性を維持することができ、機械的強度および導電性に優れたプリント配線板を得ることができる。 In addition, the surface protective layer is often formed extremely thin to ensure the flexibility of the printed wiring board, and a large number of micro holes are formed on the entire surface. The conductive adhesive penetrates to form a uniform conductive surface on the entire surface. As a result, the adhesive force between the display protective layer and the conductive adhesive layer is strengthened, and the conductivity of the display protective layer is also increased. In addition, the surface protective layer formed of a noble metal is less oxidized, can maintain stable conductivity over a long period of time, and can obtain a printed wiring board excellent in mechanical strength and conductivity.
以下、本発明のプリント配線板について、添付図面に示す好適な実施形態に基づいて詳細に説明する。 Hereinafter, the printed wiring board of the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.
図１は、本発明のプリント配線板の構成を示す断面図である。なお、以下では、説明の都合上、図１中の上側を「上」、下側を「下」とする。 FIG. 1 is a cross-sectional view showing the configuration of the printed wiring board of the present invention. In the following, for convenience of explanation, the upper side in FIG. 1 is “upper” and the lower side is “lower”.
《プリント配線板》
本発明のプリント配線板１は、図１に示す通り、配線基板６と、金属補強板２とを接着する導電性接着剤層３を備えている。金属補強板２は、ステンレス等の金属板２ａの表面に中間層２ｂを介して表面保護層２ｃを有している。
そして、前記中間層２ｂは、厚みが０．１〜３μｍのニッケル層であり、前記表面保護層２ｃは、厚みが０．０５〜０．５μｍの貴金属層であることを特徴とする。
また、表面保護層２ｃに対する前記中間層２ｂの露出率が０．５〜２０％であることが好ましい。
<Printed wiring board>
As shown in FIG. 1, the printed wiring board 1 of the present invention includes a conductive adhesive layer 3 that bonds a wiring board 6 and a metal reinforcing plate 2. The metal reinforcing plate 2 has a surface protective layer 2c on the surface of a metal plate 2a such as stainless steel via an intermediate layer 2b.
The intermediate layer 2b is a nickel layer having a thickness of 0.1 to 3 μm, and the surface protective layer 2c is a noble metal layer having a thickness of 0.05 to 0.5 μm.
Moreover, it is preferable that the exposure rate of the said intermediate | middle layer 2b with respect to the surface protective layer 2c is 0.5 to 20%.
プリント配線板１の実施態様をさらに説明する。配線基板６は、絶縁基材９と接する面であって金属補強板２と対向する面に電子部品１０を実装することで、プリント配線板１に必要な強度が得られる。金属補強板２を備えることで、プリント配線板１に曲げ等の力が加わった際の半田接着部位ないし電子部品１０に対するダメージを防止できる。また、導電性接着剤層３は、プリント配線板の上方向から下方向に対する電磁波をシールドすることができる。 The embodiment of the printed wiring board 1 will be further described. The wiring board 6 has a strength required for the printed wiring board 1 by mounting the electronic component 10 on a surface that is in contact with the insulating base material 9 and that is opposed to the metal reinforcing plate 2. By providing the metal reinforcing plate 2, it is possible to prevent damage to the solder bonding site or the electronic component 10 when a force such as bending is applied to the printed wiring board 1. Moreover, the conductive adhesive layer 3 can shield electromagnetic waves from the upper direction to the lower direction of the printed wiring board.
＜金属補強板＞
本発明の金属補強板は、金属板を備え、該金属板の表面に中間層と表面保護層とを有するものである。
すなわち、金属補強板２は、ステンレス等の金属板２ａの表面に中間層２ｂを介して表面保護層２ｃを有している。
<Metal reinforcement plate>
The metal reinforcing plate of the present invention includes a metal plate, and has an intermediate layer and a surface protective layer on the surface of the metal plate.
That is, the metal reinforcing plate 2 has a surface protective layer 2c on the surface of a metal plate 2a such as stainless steel via an intermediate layer 2b.
［金属板］
金属補強板２の金属板２ａは、例えば金、銀、銅、鉄およびステンレス等の導電性金属が挙げられる。これらの中で金属補強板としての強度、コストおよび化学的安定性の面でステンレスが好ましい。金属補強板２ａの厚みは、一般的に０．０４〜１ｍｍ程度である。
[Metal plate]
Examples of the metal plate 2a of the metal reinforcing plate 2 include conductive metals such as gold, silver, copper, iron, and stainless steel. Among these, stainless steel is preferable in terms of strength, cost and chemical stability as a metal reinforcing plate. The thickness of the metal reinforcing plate 2a is generally about 0.04 to 1 mm.
［中間層］
本発明の中間層は、ニッケルを有する層であり、ニッケル、およびニッケル合金の少なくともいずれかにより形成されてなる層である。中間層２ｂは、金属補強板２の金属板２ａに対し、全表面に形成されている。
中間層の厚みは、０．１〜３μｍであり、０．５〜２μｍがより好ましい。中間層２ｂの厚みを３μｍ以下にすることで、金属補強板の表面凹凸を最表面に投影できるため、剥離強度が向上する。また、中間層２ｂの厚みを０．１μｍ以上とすることで、接続抵抗値を良化することができる。
[Middle layer]
The intermediate layer of the present invention is a layer containing nickel, and is a layer formed of at least one of nickel and a nickel alloy. The intermediate layer 2 b is formed on the entire surface with respect to the metal plate 2 a of the metal reinforcing plate 2.
The thickness of the intermediate layer is 0.1 to 3 μm, and more preferably 0.5 to 2 μm. By setting the thickness of the intermediate layer 2b to 3 μm or less, the surface unevenness of the metal reinforcing plate can be projected on the outermost surface, so that the peel strength is improved. Moreover, a connection resistance value can be improved by the thickness of the intermediate | middle layer 2b being 0.1 micrometer or more.
中間層２ｂは、電解ニッケルメッキ法および無電解ニッケルメッキ法で形成することができるが、無電解ニッケルメッキ法が好ましい。無電解ニッケルメッキはメッキの硬度が高く、表面保護層の密着性が高いためハンダフロート試験が良好となる。 The intermediate layer 2b can be formed by an electrolytic nickel plating method and an electroless nickel plating method, but an electroless nickel plating method is preferred. Since the electroless nickel plating has high plating hardness and high adhesion of the surface protective layer, the solder float test is good.
また、中間層２ｂはリンを含有することが好ましく、中間層のリン原子（Ｐ）濃度が、中間層全体（１００重量％）中、２〜２０重量％であることが好ましく、５〜１５重量％がより好ましい。中間層にリンを２〜２０重量％含有することで、中間層と表面保護層の密着力を向上させ、ハンダフロート試験が向上する。
上記リン原子濃度は、中間層２ｂの全原子におけるリン原子の重量％である。
リン原子濃度は蛍光Ｘ線分析によって測定することができる。中間層及び表面保護層を有する金属補強板を蛍光Ｘ線を用いて定量分析を行い、得られたニッケル原子とリン原子の合計を１００としたときのリン原子濃度である。
Moreover, it is preferable that the intermediate | middle layer 2b contains phosphorus, and it is preferable that the phosphorus atom (P) density | concentration of an intermediate | middle layer is 2-20 weight% in the whole intermediate | middle layer (100 weight%), 5-15 weight% % Is more preferable. By containing 2 to 20% by weight of phosphorus in the intermediate layer, the adhesion between the intermediate layer and the surface protective layer is improved, and the solder float test is improved.
The phosphorus atom concentration is the weight percent of phosphorus atoms in all atoms of the intermediate layer 2b.
The phosphorus atom concentration can be measured by fluorescent X-ray analysis. This is the phosphorus atom concentration when the metal reinforcing plate having the intermediate layer and the surface protective layer is quantitatively analyzed using fluorescent X-rays and the total of the obtained nickel atoms and phosphorus atoms is 100.
上段で説明した中間層２ｂを有する金属補強板２は、中間層形成後の金属板２ａをサンプリングして、これらの数値範囲を満たす中間層を有する金属補強板２を適宜選択して使用すれば良い。 The metal reinforcing plate 2 having the intermediate layer 2b described in the upper part is obtained by sampling the metal plate 2a after forming the intermediate layer, and appropriately selecting and using the metal reinforcing plate 2 having the intermediate layer satisfying these numerical ranges. good.
［表面保護層］
表面保護層２ｃは、中間層２ｂを介して金属補強板２の最表面に形成される貴金属層である。本発明の表面保護層は、貴金属を有する層であり、貴金属およびその合金の少なくともいずれかにより形成されてなる。
表面保護層の厚みは、０．０５〜０．５μｍであり、０．０７〜０．３μｍが好ましい。表面保護層の厚みを０．０５〜０．５μｍにすることで、剥離強度とハンダフロート試験とが良好となる。
[Surface protective layer]
The surface protective layer 2c is a noble metal layer formed on the outermost surface of the metal reinforcing plate 2 via the intermediate layer 2b. The surface protective layer of the present invention is a layer having a noble metal, and is formed of at least one of a noble metal and an alloy thereof.
The thickness of the surface protective layer is 0.05 to 0.5 μm, preferably 0.07 to 0.3 μm. By setting the thickness of the surface protective layer to 0.05 to 0.5 μm, the peel strength and the solder float test are improved.
表面保護層２ｃの材料として使用可能な貴金属としては、例えば、金（Ａｕ）、銀（Ａｇ）、白金（Ｐｔ）、パラジウム（Ｐｄ）、イリジウム（Ｉｒ）、ルテニウム（Ｒｕ）、オスミウム（０ｓ）等があり、本例では金を使用して説明している。また、貴金属を主成分とする合金を材料として表面保護層２ｃを形成することができる。
また、表面保護層２ｃは、その表面粗さＲａが０．２μｍ以上であることが好ましく、０．３μｍ以上がより好ましく、０．４μｍ以上がさらに好ましい。表面粗さＲａの数値が大きいと、表面保護層２ｃの表面が粗面となるため、金属補強板２と導電性接着剤層３を熱圧着する際、導電性接着剤層３が表面保護層２ｃの表面の窪みに侵入して両者の接着力を強固にする。
Examples of the noble metal that can be used as the material for the surface protective layer 2c include gold (Au), silver (Ag), platinum (Pt), palladium (Pd), iridium (Ir), ruthenium (Ru), and osmium (0s). In this example, gold is used for explanation. Further, the surface protective layer 2c can be formed using an alloy containing a precious metal as a main component.
The surface protective layer 2c preferably has a surface roughness Ra of 0.2 μm or more, more preferably 0.3 μm or more, and further preferably 0.4 μm or more. When the numerical value of the surface roughness Ra is large, the surface of the surface protective layer 2c becomes rough. Therefore, when the metal reinforcing plate 2 and the conductive adhesive layer 3 are thermocompression bonded, the conductive adhesive layer 3 becomes the surface protective layer. It penetrates into the depression on the surface of 2c and strengthens the adhesive force between them.
なお、表面粗さＲａは、表面保護層２ｃの表面を接触式表面粗さ計を使用してＪＩＳ Ｂ ０６０１−２００１に準拠して測定した数値である。 In addition, surface roughness Ra is the numerical value which measured the surface of the surface protective layer 2c based on JISB0601-2001 using the contact-type surface roughness meter.
また、本発明の金属補強板は、表面保護層を一定の厚みまで薄く形成した場合にピンホールが形成する場合がある。さらに、表面保護層を形成する際にマスキング等の工程をいれることで、表面保護層を薄くしなくとも、意図的にピンホールを形成することも可能である。上記ピンホールを有する表面保護層の表面をＸ線光電子分光分析（ＸＰＳ）により測定すると、中間層のニッケルが確認される。本発明では、ここで確認された、表面保護層における中間層の検出量を、露出率として、定義した。
この中間層の露出率は、表面保護層に対して０．５〜２０％であることが好ましい。前記露出率は１〜１５％がより好ましく、２〜１０％がさらに好ましい。表面保護層に対する前記中間層の露出率が０．５〜２０％であることで、剥離強度とハンダフロート試験耐性が良化する。
露出率は、表面保護層の元素濃度に対する中間層の元素濃度の割合により、Ｘ線光電子分光分析（ＸＰＳ）を用いて求めることができる。
In the metal reinforcing plate of the present invention, pinholes may be formed when the surface protective layer is thinly formed to a certain thickness. Furthermore, it is possible to intentionally form a pinhole without making the surface protective layer thin by inserting a process such as masking when forming the surface protective layer. When the surface of the surface protective layer having the pinhole is measured by X-ray photoelectron spectroscopy (XPS), nickel in the intermediate layer is confirmed. In the present invention, the detected amount of the intermediate layer in the surface protective layer confirmed here is defined as the exposure rate.
The exposure rate of the intermediate layer is preferably 0.5 to 20% with respect to the surface protective layer. The exposure rate is more preferably 1 to 15%, further preferably 2 to 10%. When the exposure rate of the intermediate layer with respect to the surface protective layer is 0.5 to 20%, the peel strength and the solder float test resistance are improved.
The exposure rate can be determined using X-ray photoelectron spectroscopy (XPS) based on the ratio of the element concentration of the intermediate layer to the element concentration of the surface protective layer.
表面保護層２ｃに対する中間層２ｂの厚みの比は、表面保護層２ｃの厚みを１００としたときに、２〜３０であることが好ましく、３〜２０がより好ましい。前記厚みの比を２〜３０とすることで、剥離強度と接続抵抗値をより向上できる。 The ratio of the thickness of the intermediate layer 2b to the surface protective layer 2c is preferably 2 to 30 and more preferably 3 to 20 when the thickness of the surface protective layer 2c is 100. By setting the thickness ratio to 2 to 30, the peel strength and the connection resistance value can be further improved.
＜導電性接着剤層＞
導電性接着剤層３は、配線回路基板および金属補強板に対してそれぞれ接着している。また、熱硬化性樹脂および導電性成分を含む、等方導電性接着剤または異方導電性接着剤を使用して形成する。ここで等方導電性とは、Ｘ軸（図１における左右方向）、Ｙ軸（図１における奥行き方）およびＺ軸（図１における上下方向）の３次元方向に導電する性質である。また異方導電性とはＺ軸にのみ導電する性質である。これらの導電性はプリント配線板の使用態様に応じて適宜選択できる。
<Conductive adhesive layer>
The conductive adhesive layer 3 is bonded to the printed circuit board and the metal reinforcing plate, respectively. Further, it is formed using an isotropic conductive adhesive or an anisotropic conductive adhesive containing a thermosetting resin and a conductive component. Here, the isotropic conductivity is a property of conducting in the three-dimensional direction of the X axis (left and right direction in FIG. 1), Y axis (depth direction in FIG. 1), and Z axis (up and down direction in FIG. 1). The anisotropic conductivity is a property of conducting only in the Z axis. These electrical conductivity can be suitably selected according to the usage mode of a printed wiring board.
熱硬化性樹脂は、水酸基およびカルボキシル基のうち少なくともいずれか一方を有することが好ましい。具体的には、例えば、アクリル樹脂、エポキシ樹脂、ポリエステル樹脂、ウレタン樹脂、ウレタンウレア樹脂、シリコーン樹脂、アミド樹脂、イミド樹脂、アミドイミド樹脂、エラストマー樹脂およびゴム樹脂等が挙げられる。上記樹脂は、単独または２種類以上を併用できる。 The thermosetting resin preferably has at least one of a hydroxyl group and a carboxyl group. Specific examples include acrylic resins, epoxy resins, polyester resins, urethane resins, urethane urea resins, silicone resins, amide resins, imide resins, amideimide resins, elastomer resins, and rubber resins. The above resins can be used alone or in combination of two or more.
熱硬化性樹脂は、硬化剤を使用して硬化することが好ましい。前記硬化剤は、熱硬化性樹脂の架橋性官能基と反応できる官能基を１つ以上有する化合物であれば良く、限定されない。架橋性官能基がカルボキシル基の場合、硬化剤は、エポキシ化合物、アリジリン化合物、イソシアネート化合物、ポリオール化合物、アミン化合物、メラミン化合物、シラン系、カルボジイミド系化合物、金属キレート化合物等が好ましい。
また、架橋性官能基が水酸基の場合、硬化剤は、イソシアネート化合物、エポキシ化合物、アジリジン化合物、カルボジイミド化合物、金属キレート化合物が好ましい。また、架橋性官能基がアミノ基の場合、硬化剤は、イソシアネート化合物、エポキシ化合物、アジリジン化合物、カルボジイミド化合物、金属キレート化合物が好ましい。これらの硬化剤は、１ 種または２ 種以上使用できる。
The thermosetting resin is preferably cured using a curing agent. The curing agent is not limited as long as it is a compound having at least one functional group capable of reacting with the crosslinkable functional group of the thermosetting resin. When the crosslinkable functional group is a carboxyl group, the curing agent is preferably an epoxy compound, an alidiline compound, an isocyanate compound, a polyol compound, an amine compound, a melamine compound, a silane-based, carbodiimide-based compound, a metal chelate compound, or the like.
When the crosslinkable functional group is a hydroxyl group, the curing agent is preferably an isocyanate compound, an epoxy compound, an aziridine compound, a carbodiimide compound, or a metal chelate compound. When the crosslinkable functional group is an amino group, the curing agent is preferably an isocyanate compound, an epoxy compound, an aziridine compound, a carbodiimide compound, or a metal chelate compound. These curing agents can be used alone or in combination of two or more.
導電性成分は、導電性微粒子、導電性繊維、およびカーボンナノチューブ等から適宜選択して使用できる。導電性微粒子は、金、銀、銅、鉄、ニッケル、およびアルミニウム等の金属、ないしその合金、ないしカーボンブラック、フラーレン、および黒鉛等の無機材料等が挙げられる。また、銅粒子の表面を銀で被覆した銀被覆銅微粒子も挙げられる。 The conductive component can be appropriately selected from conductive fine particles, conductive fibers, carbon nanotubes, and the like. Examples of the conductive fine particles include metals such as gold, silver, copper, iron, nickel, and aluminum, alloys thereof, and inorganic materials such as carbon black, fullerene, and graphite. Moreover, the silver coating copper fine particle which coat | covered the surface of the copper particle with silver is also mentioned.
導電性接着剤層３は、さらに、粘着付与樹脂、イオン捕集剤、無機フィラー、金属不活性化剤、難燃剤、光重合開始剤、帯電防止剤、および酸化防止剤等を適宜選択して含むことができる。導電性接着剤層３の厚みは、通常３０〜８０μｍ程度である。 The conductive adhesive layer 3 is further appropriately selected from a tackifier resin, an ion scavenger, an inorganic filler, a metal deactivator, a flame retardant, a photopolymerization initiator, an antistatic agent, an antioxidant, and the like. Can be included. The thickness of the conductive adhesive layer 3 is usually about 30 to 80 μm.
＜配線回路基板＞
配線回路基板６は、絶縁層４ａおよび４ｂ、接着剤層５ａおよび５ｂ、ならびにグランド配線回路７、ならびに配線回路８、ならびに絶縁基板９を備えている。また配線回路基板６は、グランド配線回路７上にビア１１（Ｖｉａ）といわれる円柱状ないしすり鉢状の穴を備えている。
<Wiring circuit board>
The printed circuit board 6 includes insulating layers 4a and 4b, adhesive layers 5a and 5b, a ground wiring circuit 7, a wiring circuit 8, and an insulating substrate 9. The printed circuit board 6 has a cylindrical or mortar-shaped hole called a via 11 (Via) on the ground wiring circuit 7.
絶縁層４ａおよび４ｂは、カバーレイフィルムともいい、少なくとも樹脂を含む。樹脂は、例えばアクリル樹脂、エポキシ樹脂、ポリエステル樹脂、ウレタン樹脂、イレタンウレア樹脂、シリコーン樹脂、ポリアミド樹脂、ポリイミド樹脂、アミドイミド樹脂およびフェノール樹脂等が挙げられる。また、樹脂は、熱可塑性樹脂、熱硬化性樹脂および紫外線硬化性樹脂から適宜選択して使用できるが、耐熱性の面で熱硬化性樹脂が好ましい。これらの樹脂は、単独または２種類以上を併用できる。絶縁層４ａおよび４ｂの厚みは、通常５〜５０μｍ程度である。 The insulating layers 4a and 4b are also called cover lay films and contain at least a resin. Examples of the resin include acrylic resins, epoxy resins, polyester resins, urethane resins, ethane urethane resins, silicone resins, polyamide resins, polyimide resins, amideimide resins, and phenol resins. The resin can be appropriately selected from a thermoplastic resin, a thermosetting resin, and an ultraviolet curable resin, and is preferably a thermosetting resin in terms of heat resistance. These resins can be used alone or in combination of two or more. The thickness of the insulating layers 4a and 4b is usually about 5 to 50 μm.
接着剤層５ａおよび５ｂは、例えばアクリル樹脂、エポキシ樹脂、ポリエステル樹脂、ウレタン樹脂、シリコーン樹脂、およびアミド樹脂等の熱硬化性樹脂が挙げられる。熱硬化樹脂に使用する硬化剤は、エポキシ硬化剤、イソシアネート硬化剤、およびアリジリン硬化剤等が挙げられる。接着剤層５ａおよび５ｂは、絶縁層４ａおよび４ｂと、グランド配線回路７および配線回路８を備えた絶縁基板９とを接着するために使用し、絶縁性を有する。接着剤層５ａおよび５ｂの厚みは、通常１〜２０μｍ程度である。 Examples of the adhesive layers 5a and 5b include thermosetting resins such as acrylic resins, epoxy resins, polyester resins, urethane resins, silicone resins, and amide resins. Examples of the curing agent used for the thermosetting resin include an epoxy curing agent, an isocyanate curing agent, and an alidiline curing agent. The adhesive layers 5a and 5b are used for bonding the insulating layers 4a and 4b to the insulating substrate 9 including the ground wiring circuit 7 and the wiring circuit 8, and have insulating properties. The thickness of the adhesive layers 5a and 5b is usually about 1 to 20 μm.
グランド配線回路７および配線回路８は、銅等の導電性金属層をエッチングして形成する方法、ないし導電性ペーストを印刷することで形成する方法が一般的である。図示はしないが配線回路基板６は、グランド配線回路７および配線回路８を複数有することができる。グランド配線回路７は、グランド電位を保つ回路であり、配線回路８は、電子部品等に電気信号を送信する回路である。グランド配線回路７および配線回路８の厚みは、それぞれ通常５〜５０μｍ程度である。 The ground wiring circuit 7 and the wiring circuit 8 are generally formed by etching a conductive metal layer such as copper or by printing a conductive paste. Although not shown, the printed circuit board 6 can have a plurality of ground wiring circuits 7 and wiring circuits 8. The ground wiring circuit 7 is a circuit that maintains a ground potential, and the wiring circuit 8 is a circuit that transmits an electrical signal to an electronic component or the like. The thicknesses of the ground wiring circuit 7 and the wiring circuit 8 are usually about 5 to 50 μm, respectively.
絶縁基板９は、例えば、ポリイミド、ポリアミドイミド、ポリフェレンサルファイド、ポリエチレンテレフタレート、および、ポリエチレンナフタレート等の絶縁性を有するフィルムであり、配線回路基板６のベース材である。絶縁基板９は、リフロー工程を行なう場合、ポリフェレンサルファイドおよびポリイミドが好ましく、リフロー工程を行なわない場合、ポリエチレンテレフタレートが好ましい。絶縁基板９の厚みは、通常５〜１００μｍ程度である。 The insulating substrate 9 is a film having insulating properties such as polyimide, polyamideimide, polyferene sulfide, polyethylene terephthalate, and polyethylene naphthalate, and is a base material for the printed circuit board 6. The insulating substrate 9 is preferably polyferene sulfide and polyimide when the reflow process is performed, and is preferably polyethylene terephthalate when the reflow process is not performed. The thickness of the insulating substrate 9 is usually about 5 to 100 μm.
ビア１１は、グランド配線回路７および配線回路８から適宜選択した回路パターンの一部を露出するためにエッチングやレーザー等により形成される。図１によるとビア１１によりグランド配線回路７の一部が露出しており導電接着剤層３を介してグランド配線回路７と金属補強板２とが電気的に接続されている。ビア１１の直径は、通常０．５〜２μｍ程度である。 The via 11 is formed by etching, laser, or the like in order to expose a part of the circuit pattern appropriately selected from the ground wiring circuit 7 and the wiring circuit 8. According to FIG. 1, a part of the ground wiring circuit 7 is exposed by the via 11, and the ground wiring circuit 7 and the metal reinforcing plate 2 are electrically connected through the conductive adhesive layer 3. The diameter of the via 11 is usually about 0.5 to 2 μm.
プリント配線板１は、通常、電磁波シールドシートを備える。電磁波シールドシートは、絶縁層１０１、金属膜１０２、および導電性接着剤層１０３を備えるのが一般的であり、配線回路８を流れる電気信号が高周波である場合は、特に好ましい。一方、図示しないが、配線回路８を流れる電気信号が比較的低周波である場合、電磁波シールドシートは、少なくとも絶縁層１０１および導電性接着剤層１０３を備えていれば良い。 The printed wiring board 1 usually includes an electromagnetic wave shield sheet. The electromagnetic wave shielding sheet generally includes an insulating layer 101, a metal film 102, and a conductive adhesive layer 103, and is particularly preferable when an electrical signal flowing through the wiring circuit 8 is a high frequency. On the other hand, although not shown, when the electric signal flowing through the wiring circuit 8 has a relatively low frequency, the electromagnetic wave shielding sheet only needs to include at least the insulating layer 101 and the conductive adhesive layer 103.
絶縁層１０１は、絶縁基板９で説明した絶縁性を有するフィルムを使用する他に、アクリル樹脂、エポキシ樹脂、ポリエステル樹脂、ウレタン樹脂、シリコーン樹脂、およびアミド樹脂等の熱硬化性樹脂を適宜選択して形成することもできる。絶縁層１０１の厚みは、通常２〜２０μｍ程度が好ましい For the insulating layer 101, in addition to using the insulating film described in the insulating substrate 9, a thermosetting resin such as an acrylic resin, an epoxy resin, a polyester resin, a urethane resin, a silicone resin, and an amide resin is appropriately selected. It can also be formed. The thickness of the insulating layer 101 is usually preferably about 2 to 20 μm.
金属膜１０２は、金、銀、銅、アルミニウム、および鉄等の導電性金属、ならびにこれらの合金から形成した被膜が好ましく、コスト面から銅がより好ましい。また金属膜１０２は、圧延金属箔、電解金属箔、スパッタ膜ならびに蒸着膜から適宜選択できるが、コスト面から圧延金属箔が好ましく、圧延銅箔がより好ましい。金属膜１０２の厚さは、金属箔の場合、０．１〜２０μｍ程度が好ましく、スパッタ膜の場合、０．０５〜５．０μｍ程度が好ましく、蒸着膜の場合、１０〜５００ｎｍ程度が好ましい。なお、スパッタ膜を形成する場合は、ＩＴＯ（酸化インジウムスズ）またはＡＴＯ（三酸化アンチモン）を使用することが好ましく、蒸着膜を形成する場合は、金、銀、銅、アルミニウムまたはニッケルを使用することが好ましい。 The metal film 102 is preferably a film formed of a conductive metal such as gold, silver, copper, aluminum, and iron, and an alloy thereof, and copper is more preferable from the viewpoint of cost. The metal film 102 can be appropriately selected from a rolled metal foil, an electrolytic metal foil, a sputtered film, and a deposited film, but a rolled metal foil is preferable and a rolled copper foil is more preferable from the viewpoint of cost. The thickness of the metal film 102 is preferably about 0.1 to 20 μm in the case of a metal foil, about 0.05 to 5.0 μm in the case of a sputtered film, and preferably about 10 to 500 nm in the case of a deposited film. In addition, when forming a sputtered film, it is preferable to use ITO (indium tin oxide) or ATO (antimony trioxide), and when forming a vapor deposition film, gold, silver, copper, aluminum, or nickel is used. It is preferable.
導電性接着剤層１０３は、導電性接着剤層３で説明した原料を含むことが好ましい。導電性接着剤層１０３の厚みは、２〜２０μｍ程度が好ましい。 The conductive adhesive layer 103 preferably includes the raw materials described in the conductive adhesive layer 3. The thickness of the conductive adhesive layer 103 is preferably about 2 to 20 μm.
本発明のプリント配線板の製造方法は、少なくとも配線回路基板６、導電性接着剤層３、および金属補強板２を圧着する工程を備えていることが必要である。圧着は、例えば、配線回路基板６と電磁波シールドシートと圧着した後、導電性接着剤層３および金属補強板２を重ね圧着を行い、次いで電子部品を実装する方法が挙げられるが、圧着の順序は限定されない。本発明では配線回路基板６、導電性接着剤層３、および金属補強板２を圧着する工程を備えていれば良く、他の工程は、プリント配線板の構成ないし使用態様に応じて適宜変更できる。
前記圧着は、導電性接着剤層３が熱硬化型樹脂を含む場合、硬化促進の観点から同時に加熱することが特に好ましい。一方、導電性接着剤層３が熱可塑性樹脂を含む場合であっても密着が強固になり易いため加熱することが好ましい。加熱は１５０〜１８０℃程度が好ましく、圧着は、３〜３０ｋｇ／ｃｍ２程度が好ましい。圧着装置は、平板圧着機またはロール圧着機を使用できるが、平板圧着機を使用する場合、一定の圧力を一定の時間かけることができるため好ましい。圧着時間は、配線回路基板６、導電性接着剤層３、および金属補強板２が十分密着すればよいので特に限定されないが、通常３０分〜２時間程度である。
The method for producing a printed wiring board of the present invention needs to include a step of crimping at least the printed circuit board 6, the conductive adhesive layer 3, and the metal reinforcing plate 2. Examples of the crimping include a method in which after the printed circuit board 6 and the electromagnetic wave shielding sheet are crimped, the conductive adhesive layer 3 and the metal reinforcing plate 2 are laminated and crimped, and then an electronic component is mounted. Is not limited. In this invention, what is necessary is just to provide the process of crimping | bonding the wiring circuit board 6, the conductive adhesive layer 3, and the metal reinforcement board 2, and another process can be suitably changed according to the structure thru | or use aspect of a printed wiring board. .
In the case where the conductive adhesive layer 3 contains a thermosetting resin, the pressure bonding is particularly preferably performed simultaneously from the viewpoint of acceleration of curing. On the other hand, even when the conductive adhesive layer 3 includes a thermoplastic resin, it is preferable to heat the adhesive adhesive layer 3 because adhesion is likely to be strong. The heating is preferably about 150 to 180 ° C., and the pressure bonding is preferably about 3 to 30 kg / cm 2 . As the crimping apparatus, a flat plate crimping machine or a roll crimping machine can be used. However, when a flat plate crimping machine is used, it is preferable because a certain pressure can be applied for a certain time. The crimping time is not particularly limited as long as the printed circuit board 6, the conductive adhesive layer 3, and the metal reinforcing plate 2 are sufficiently adhered to each other, but is usually about 30 minutes to 2 hours.
本発明のプリント配線板は、例えば、携帯電話、スマートフォン、ノートＰＣ、デジタルカメラ、液晶ディスプレイ等の電子機器に搭載する（備える）ことはもとより、自動車、電車、船舶、航空機等の輸送機器にも好適に搭載できる（備える）ことができる。 The printed wiring board of the present invention is mounted (provided) on an electronic device such as a mobile phone, a smartphone, a notebook PC, a digital camera, and a liquid crystal display, and also on a transportation device such as an automobile, a train, a ship, and an aircraft. It can be suitably mounted (equipped).
以下、実施例を示して本発明を更に具体的に説明するが、本発明はこれらによって限定されるものではない。 EXAMPLES Hereinafter, the present invention will be described more specifically with reference to examples, but the present invention is not limited thereto.
評価に使用した部材は、下記の通りである。 The members used for the evaluation are as follows.
＜導電性接着シートＡ＞
熱硬化性ポリアミド樹脂（酸価＝１０ｍｇＫＯＨ／ｇ、トーヨーケム社製）を１００部、導電性微粒子（核体に銅、被覆層に銀を使用した樹枝状粒子Ｄ５０ 平均粒子径＝１２μｍ、福田金属箔粉工業社製） を４００部容器に仕込み、不揮発分濃度が４０重量％になるようトルエン： イソプロピルアルコール（重量比＝２：１）の混合溶剤を加えて混合した。次いでビスフェノールＡ型エポキシ樹脂（「ＪＥＲ８２８」（エポキシ当量＝１８９ｇ／ｅｑ）三菱化学社製）を４０部、およびアミン系エポキシ硬化剤（「ＹＮ１００」三菱化学社製）１５部を加えディスパーで１０分攪拌して導電性樹脂組成物を作製した。得られた導電性樹脂組成物を、ドクターブレードを使用して、乾燥後の厚みが６０μｍになるように剥離性フィルムの離形処理された面上に塗工し、１００℃の電気オーブンで２分間乾燥することで導電性接着シートＡを得た。
<Conductive adhesive sheet A>
100 parts of thermosetting polyamide resin (acid value = 10 mg KOH / g, manufactured by Toyochem Co.), conductive fine particles (dendritic particles D50 using copper as the core and silver as the coating layer, average particle size = 12 μm, Fukuda Metal Foil) (Made by Kogyo Kogyo Co., Ltd.) was added to a 400-part container, and a mixed solvent of toluene: isopropyl alcohol (weight ratio = 2: 1) was added and mixed so that the nonvolatile content concentration was 40% by weight. Next, 40 parts of bisphenol A type epoxy resin (“JER828” (epoxy equivalent = 189 g / eq), manufactured by Mitsubishi Chemical Corporation) and 15 parts of amine type epoxy curing agent (“YN100” manufactured by Mitsubishi Chemical Corporation) were added, and 10 minutes with a disper. The conductive resin composition was produced by stirring. The obtained conductive resin composition was applied on the release-treated surface of the peelable film using a doctor blade so that the thickness after drying was 60 μm. The conductive adhesive sheet A was obtained by drying for minutes.
＜導電性接着シートＢ＞
熱硬化性ポリアミド樹脂（酸価＝１０ｍｇＫＯＨ／ｇ、トーヨーケム社製）を１００部、導電性微粒子（核体に銅、被覆層に銀を使用した樹枝状粒子Ｄ５０ 平均粒子径＝１２μｍ、福田金属箔粉工業社製） を４００部容器に仕込み、不揮発分濃度が４０重量％になるようトルエン： イソプロピルアルコール（重量比＝２：１）の混合溶剤を加えて混合した。次いでビスフェノールＡ型エポキシ樹脂（「ＪＥＲ８２８」（エポキシ当量＝１８９ｇ／ｅｑ）三菱化学社製）を４０部、およびイミダゾール系エポキシ硬化剤（「ＥＭＩ２４」三菱化学社製）１５部を加えディスパーで１０分攪拌して導電性樹脂組成物を作製した。得られた導電性樹脂組成物を、ドクターブレードを使用して、乾燥後の厚みが６０μｍになるように剥離性フィルムの離形処理された面上に塗工し、１００℃の電気オーブンで２分間乾燥することで導電性接着シートＢを得た。
<Conductive adhesive sheet B>
100 parts of thermosetting polyamide resin (acid value = 10 mg KOH / g, manufactured by Toyochem Co.), conductive fine particles (dendritic particles D50 using copper as the core and silver as the coating layer, average particle size = 12 μm, Fukuda Metal Foil) (Made by Kogyo Kogyo Co., Ltd.) was added to a 400-part container, and a mixed solvent of toluene: isopropyl alcohol (weight ratio = 2: 1) was added and mixed so that the nonvolatile content concentration was 40 wt%. Next, 40 parts of bisphenol A type epoxy resin (“JER828” (epoxy equivalent = 189 g / eq), manufactured by Mitsubishi Chemical Corporation) and 15 parts of imidazole epoxy curing agent (“EMI24” manufactured by Mitsubishi Chemical Corporation) were added, and 10 minutes with a disper. The conductive resin composition was produced by stirring. The obtained conductive resin composition was applied on the release-treated surface of the peelable film using a doctor blade so that the thickness after drying was 60 μm. The conductive adhesive sheet B was obtained by drying for minutes.
＜導電性接着シートＣ＞
熱硬化性ポリウレタンウレア樹脂（酸価＝５ｍｇＫＯＨ／ｇ、トーヨーケム社製）を１００部、導電性微粒子（核体に銅、被覆層に銀を使用した樹枝状粒子Ｄ５０ 平均粒子径＝１２μｍ、福田金属箔粉工業社製） を４００部容器に仕込み、不揮発分濃度が４０重量％になるようトルエン： イソプロピルアルコール（重量比＝２：１）の混合溶剤を加えて混合した。次いでビスフェノールＡ型エポキシ樹脂（「ＪＥＲ８２８」（エポキシ当量＝１８９ｇ／ｅｑ）三菱化学社製）を４０部、およびアミン系エポキシ硬化剤（「ＹＮ１００」三菱化学社製）１５部を加えディスパーで１０分攪拌して導電性樹脂組成物を作製した。得られた導電性樹脂組成物を、ドクターブレードを使用して、乾燥後の厚みが６０μｍになるように剥離性フィルムの離形処理された面上に塗工し、１００℃の電気オーブンで２分間乾燥することで導電性接着シートＣを得た。
<Conductive adhesive sheet C>
100 parts of thermosetting polyurethane urea resin (acid value = 5 mg KOH / g, manufactured by Toyochem Co.), conductive fine particles (dendritic particles D50 using copper as a core and silver as a coating layer, average particle diameter = 12 μm, Fukuda Metal) Foil Powder Industry Co., Ltd.) was charged into a 400-part container, and a mixed solvent of toluene: isopropyl alcohol (weight ratio = 2: 1) was added and mixed so that the nonvolatile content concentration was 40% by weight. Next, 40 parts of bisphenol A type epoxy resin (“JER828” (epoxy equivalent = 189 g / eq), manufactured by Mitsubishi Chemical Corporation) and 15 parts of amine type epoxy curing agent (“YN100” manufactured by Mitsubishi Chemical Corporation) were added, and 10 minutes with a disper. The conductive resin composition was produced by stirring. The obtained conductive resin composition was applied on the release-treated surface of the peelable film using a doctor blade so that the thickness after drying was 60 μm. The conductive adhesive sheet C was obtained by drying for minutes.
＜配線回路基板＞
銅張積層板；エスパーフレックス（厚さ８μｍ銅箔／厚さ３８μｍポリイミド 住友金属鉱山社製）
<Wiring circuit board>
Copper-clad laminate; Esperflex (8 μm thick copper foil / 38 μm thick polyimide manufactured by Sumitomo Metal Mining Co., Ltd.)
＜金属補強板＞
市販ステンレス板に対して、それぞれ無電解メッキを行なうことでステンレス板表面にニッケルからなる中間層を形成した後、電解メッキによって貴金属からなる表面保護層を形成した。無電解メッキの条件を公知の方法で調整してサンプリングを行ない中間層及び表面保護層の厚みと、露出率および表面粗さＲａがそれぞれ異なる中間層と表面保護層を有するステンレス板（以下、単にＳＵＳ板という）１〜８、１１、１２（ＳＵＳ１〜８、１１、１２）を得た。ステンレス板表面に無電解メッキを行わずに、直接貴金属層を形成することで、ステンレス板９（ＳＵＳ９）を得た。また、ステンレス板表面に無電解メッキのみを行うことで、ニッケル層のみ有するステンレス板１０（ＳＵＳ１０）を得た。そして各ＳＵＳ板を、厚さ０．２ｍｍ・幅３０ｍｍ・長さ１５０ｍｍの試験板Ａ、および厚さ０．２ｍｍ・幅３０ｍｍ・長さ５０ｍｍの大きさの試験板Ｂに準備した。なお分析用試験板は別途準備した。
<Metal reinforcement plate>
A commercially available stainless steel plate was electrolessly plated to form an intermediate layer made of nickel on the stainless steel plate surface, and then a surface protective layer made of a noble metal was formed by electrolytic plating. A stainless steel plate having an intermediate layer and a surface protective layer having different thicknesses, exposure rates, and surface roughnesses Ra (hereinafter referred to simply as “intermediate layer” and “surface protective layer”). SUS plates) 1 to 8, 11, and 12 (SUS1 to 8, 11, and 12) were obtained. Stainless steel plate 9 (SUS9) was obtained by directly forming a noble metal layer on the stainless steel plate surface without electroless plating. Moreover, the stainless steel plate 10 (SUS10) which has only a nickel layer was obtained by performing only electroless plating on the stainless steel plate surface. Each SUS plate was prepared as a test plate A having a thickness of 0.2 mm, a width of 30 mm, and a length of 150 mm, and a test plate B having a thickness of 0.2 mm, a width of 30 mm, and a length of 50 mm. An analytical test plate was prepared separately.
得られたＳＵＳ板（ＳＵＳ１〜１２）について、それぞれ下記に示す方法により分析を行った。結果は、表１、および表２に記した。 About the obtained SUS board (SUS1-12), it analyzed by the method shown below, respectively. The results are shown in Table 1 and Table 2.
＜リン原子濃度（Ｐ濃度）＞
リン原子濃度はセイコーインスツル株式会社製の蛍光Ｘ線分析装置「ＳＩＩ ＳＥＡ５１２０」によって測定した。測定条件は、真空とし、コリメーター径１．８ｍｍとした。バルクＦＰアプリケーションによる定量分析を行い、得られた定量結果のニッケル原子とリン原子の合計を１００としたときのリン原子の重量％をリン原子濃度とした。
<Phosphorus atom concentration (P concentration)>
The phosphorus atom concentration was measured by a fluorescent X-ray analyzer “SII SEA5120” manufactured by Seiko Instruments Inc. The measurement conditions were vacuum and the collimator diameter was 1.8 mm. Quantitative analysis was performed using a bulk FP application, and the phosphorus atom concentration was defined as the weight percentage of phosphorus atoms when the total of nickel atoms and phosphorus atoms in the obtained quantitative results was taken as 100.
＜中間層／表面保護層厚み比率＞
それぞれの膜厚値より、表面保護層の厚みを１００としたときの、中間層の厚みの比率を求めた。
<Intermediate layer / surface protective layer thickness ratio>
From each film thickness value, the ratio of the thickness of the intermediate layer when the thickness of the surface protective layer was 100 was determined.
＜露出率＞
露出率は、得られた試験板表面についてＸＰＳ分析を次の条件で行ない、算出した。
<Exposure rate>
The exposure rate was calculated by performing XPS analysis on the obtained test plate surface under the following conditions.
専用台座に両面粘着テープを貼り、ＳＵＳ板を固定したものを測定試料とした。測定試料を下記条件で、３箇所場所を変えて測定した。
装置：ＡＸＩＳ−ＨＳ（島津製作所社製／Ｋｒａｔｏｓ）
試料チャンバー内真空度：１×１０−８Ｔｏｒｒ以下
Ｘ線源：Ｄｕａｌ（Ａｌ）１５ｋＶ，５ｍＡ Ｐａｓｓ ｅｎｅｒｇｙ ８０ｅＶ
Ｓｔｅｐ：０．１ ｅＶ／Ｓｔｅｐ
Ｓｐｅｅｄ：１２０秒／元素
Ｄｅｌｌ：３００、積算回数：５
光電子取り出し角：試料表面に対して９０度
結合エネルギー：Ｃ１ｓ主ピークを２８４．６ｅＶとしてシフト補正
Ａｕ（４ｆ）ピーク領域：８０〜９２ｅＶ
Ｎｉ（２ｐ）ピーク領域：８８０〜８４５ｅＶ
Ａｇ（３ｄ）ピーク領域：３７６〜３６２ｅＶ
Ｐｄ（３ｄ）ピーク領域：３３０〜３５０ｅＶ
A measurement sample was obtained by attaching a double-sided adhesive tape to a dedicated pedestal and fixing a SUS plate. The measurement sample was measured under the following conditions at three locations.
Apparatus: AXIS-HS (manufactured by Shimadzu Corporation / Kratos)
Vacuum degree in sample chamber: 1 × 10 −8 Torr or less X-ray source: Dual (Al) 15 kV, 5 mA Pass energy 80 eV
Step: 0.1 eV / Step
Speed: 120 seconds / element Dell: 300, integration number: 5
Photoelectron extraction angle: 90 degrees with respect to the sample surface Binding energy: C1s main peak is 284.6 eV, shift correction Au (4f) peak region: 80-92 eV
Ni (2p) peak area: 880-845 eV
Ag (3d) peak area: 376 to 362 eV
Pd (3d) peak area: 330 to 350 eV
上記ピーク領域に出現したピークをスムージング処理し、直線法にてベースラインを引き、ニッケルと貴金属の原子濃度「Ａｔｏｍｉｃ Ｃｏｎｃ」を求めた。
得られた金原子濃度およびニッケル原子濃度の合計１００％中のニッケル原子濃度について、３箇所の値の平均値を求め、露出率とした。
ニッケル、または貴金属がその合金である場合には合金のピークも加味して原子濃度を求め、中間層の露出率を算出した。
A peak appearing in the peak region was smoothed, and a baseline was drawn by a linear method to obtain an atomic concentration “Atomic Conc” of nickel and noble metal.
With respect to the nickel atom concentration in the total of 100% of the obtained gold atom concentration and nickel atom concentration, the average value of three values was obtained and used as the exposure rate.
When nickel or a noble metal was an alloy thereof, the atomic concentration was calculated taking into account the peak of the alloy, and the exposure rate of the intermediate layer was calculated.
＜表面粗さ（Ｒａ）＞
表面粗さＲａは、ＪＩＳＢ０６０１‘２００１に準じて、次の条件で測定した。
Ｒａは算術平均粗さＲａを指し、規定された中心線平均粗さであり、その基準粗さを１ｍｍとした場合の中心線平均粗さを言う。上記のＳＵＳ板を、接触式表面粗さ計（「ＳＵＲＦＣＯＭ４８０Ａ」東京精密社製）を使用し、測定速度０．０３ｍｍ／ｓ、測定長さ２ｍｍ、カットオフ値０．８ｍｍの条件で表面粗さＲａを測定した。測定場所を変えて得られた５ か所のＲａの平均値をＲａとした。
<Surface roughness (Ra)>
The surface roughness Ra was measured under the following conditions in accordance with JIS B0601'2001.
Ra refers to the arithmetic average roughness Ra, is a defined centerline average roughness, and refers to the centerline average roughness when the reference roughness is 1 mm. Using the contact type surface roughness meter ("SURFCOM 480A" manufactured by Tokyo Seimitsu Co., Ltd.), the above SUS plate was subjected to surface roughness under the conditions of a measurement speed of 0.03 mm / s, a measurement length of 2 mm, and a cutoff value of 0.8 mm. Ra was measured. Ra was an average value of 5 Ras obtained by changing the measurement location.
「実施例１〜１０、および比較例１〜４」
＜試験用積層体の作製＞
導電性接着シートを幅２５ｍｍ・長さ１００ｍｍの大きさに準備した。次いで一方の剥離性シートを剥がし露出した導電性接着剤層を表１に示す金属補強板から得られた試験板Ａの上に載せ、ロールラミネーター（ＳＡ−１０１０ 小型卓上テストラミネーター テスター産業株式会社）９０℃、３ｋｇｆ／ｃｍ２、１ｍ／ｍｉｎで仮止めした。そして、他の剥離性シートを剥がして、露出した導電性接着剤層にエスパーフレックスのポリイミド面が導電性接着剤層と接するように載せ、上記同様のロールラミネート条件で仮止した。そして、これらを１７０℃、２ＭＰａ、５分の条件で圧着をした後、１６０℃の電気オーブンで６０分間加熱を行なうことで積層体を得た。
"Examples 1 to 10 and Comparative Examples 1 to 4"
<Preparation of test laminate>
A conductive adhesive sheet was prepared to have a width of 25 mm and a length of 100 mm. Next, one of the peelable sheets was peeled off and the exposed conductive adhesive layer was placed on the test plate A obtained from the metal reinforcing plate shown in Table 1, and a roll laminator (SA-1010 small tabletop test laminator Tester Sangyo Co., Ltd.). Temporarily fixed at 90 ° C., 3 kgf / cm 2 , and 1 m / min. Then, the other peelable sheet was peeled off, placed on the exposed conductive adhesive layer so that the polyimide surface of Esperflex was in contact with the conductive adhesive layer, and temporarily fixed under the same roll laminating conditions as described above. And after crimping | bonding these on 170 degreeC, 2 Mpa, and the conditions for 5 minutes, the laminated body was obtained by heating for 60 minutes with a 160 degreeC electric oven.
＜剥離強度＞
得られた積層体について、導電性接着剤層と試験板との剥離強度を測定するために２３℃相対湿度５０％の雰囲気下で、引っ張り速度５０ｍｍ／ｍｉｎでＴピール剥離試験をおこない、常温（２３℃）の剥離強度（Ｎ／ｃｍ）を測定した。試験機は小型卓上試験機（ＥＺ−ＴＥＳＴ 島津製作所社製）を用いた。なお、剥離強度は、接着力ともいう。
<Peel strength>
In order to measure the peel strength between the conductive adhesive layer and the test plate, the obtained laminate was subjected to a T-peel peel test at 23 ° C. and 50% relative humidity at a pulling rate of 50 mm / min. 23 ° C.) peel strength (N / cm) was measured. A small desktop testing machine (EZ-TEST, manufactured by Shimadzu Corporation) was used as the testing machine. Note that the peel strength is also referred to as adhesive strength.
リフロー後の剥離強度を測定するために得られた積層体を小型リフロー機（ＳＯＬＳＹＳ−６２５０１ＲＴＰ アントム社製）を使用してピーク温度を２６０℃にしてリフロー処理を行なった。前記積層体を２３℃相対湿度５０％の雰囲気下で１時間放置した後、同雰囲気下、上記同様の方法でリフロー後の剥離強度（Ｎ／ｃｍ）を測定した。なお、剥離強度は以下の基準で評価した。
○：剥離強度が８Ｎ／ｃｍ以上
△：剥離強度が３Ｎ／ｃｍ以上、８Ｎ／ｃｍ未満
×：剥離強度が３Ｎ／ｃｍ未満
The laminate obtained for measuring the peel strength after reflow was subjected to a reflow treatment using a small reflow machine (SOLSYS-62501RTP manufactured by Antom Co., Ltd.) at a peak temperature of 260 ° C. The laminate was allowed to stand for 1 hour in an atmosphere of 23 ° C. and 50% relative humidity, and then the peel strength (N / cm) after reflow was measured in the same manner as described above. The peel strength was evaluated according to the following criteria.
○: Peel strength is 8 N / cm or more Δ: Peel strength is 3 N / cm or more and less than 8 N / cm ×: Peel strength is less than 3 N / cm
＜ハンダフロート試験＞
得られた積層体について金属補強板を下にして２６０℃の溶融ハンダに１分浮かべた。次いで、溶融ハンダから取り出した直後の積層体について、積層体の側面から導電性接着剤層の外観を目視で確認し、次の基準で評価した。なお、評価には角型ハンダ槽（ＰＯＴ１００Ｃ 太洋電機産業社製）を使用した。評価は、１サンプルあたり５回評価した。
○：５評価中、全てのサンプルに異常が見られなかった。優れている
△：５評価中、１または２評価に気泡が発生した。実用可
×：５評価中、３評価以上に気泡が発生した。実用不可
<Solder float test>
The obtained laminate was floated on molten solder at 260 ° C. for 1 minute with the metal reinforcing plate down. Subsequently, about the laminated body immediately after taking out from molten solder, the external appearance of the electroconductive adhesive layer was confirmed visually from the side surface of the laminated body, and the following reference | standard evaluated. In addition, a square solder tank (POT100C manufactured by Taiyo Electric Industry Co., Ltd.) was used for the evaluation. Evaluation was performed 5 times per sample.
○: During 5 evaluations, no abnormality was observed in all samples. Excellent Δ: During 5 evaluations, bubbles were generated in 1 or 2 evaluations. Practical use ×: During 5 evaluations, bubbles were generated more than 3 evaluations. Impractical
＜接続抵抗値＞
上記＜試験用積層体の作製＞で使用した導電性接着シートの大きさを幅１０ｍｍ・長さ５０ｍｍの大きさに換え、試験板Ａを試験板Ｂに換えた以外は、＜試験用積層体の作製＞と同様に行うことで積層体を得た。得られた積層体について得られた積層体について、抵抗率計（ロレスターＧＰ ＭＣＰ−Ｔ６００ 三菱化学社製）を用い、２端子法で接続抵 抗値を測定した。なお、接続抵抗値は以下の基準で評価した。
○：接続抵抗値が２０ｍΩ／□未満
△：接続抵抗値が２０ｍΩ／□以上、４０ｍΩ／□未満
×：接続抵抗値が４０ｍΩ／□以上
<Connection resistance value>
Except that the size of the conductive adhesive sheet used in <Preparation of test laminate> is changed to a size of 10 mm in width and 50 mm in length, and test plate A is changed to test plate B. The laminate was obtained in the same manner as described above. About the laminated body obtained about the obtained laminated body, the connection resistance value was measured by a two-terminal method using a resistivity meter (Lorestar GP MCP-T600, manufactured by Mitsubishi Chemical Corporation). The connection resistance value was evaluated according to the following criteria.
○: Connection resistance value is less than 20 mΩ / □ Δ: Connection resistance value is 20 mΩ / □ or more, less than 40 mΩ / □ ×: Connection resistance value is 40 mΩ / □ or more
表１、２の結果から、実施例１〜１０の、配線回路基板、導電性接着剤層、および金属補強板を備えるプリント配線基板は、リフロー工程を経た後にも気泡が生じ難く、導電性接着剤層と金属板とが良好な接着力を有し、グランド回路と金属板との導電性が良好であった。
これに対し、比較例のプリント配線基板は、グランド回路と金属板との導電性、剥離強度、およびハンダフロート性のすべてを満足することはできなかった。
From the results of Tables 1 and 2, the printed circuit board including the printed circuit board, the conductive adhesive layer, and the metal reinforcing plate of Examples 1 to 10 is less likely to generate air bubbles even after the reflow process. The agent layer and the metal plate had good adhesion, and the electrical conductivity between the ground circuit and the metal plate was good.
On the other hand, the printed wiring board of the comparative example could not satisfy all of the electrical conductivity, peel strength, and solder floatability between the ground circuit and the metal plate.
そのため、本発明の、機械的強度および導電性に優れるプリント配線板を備える電子機器は、内部に実装された電子部品が発する電磁波ノイズまたは外部から侵入する電磁波ノイズを原因とした誤作動を、長期にかつ安定に防止することが可能である。
また、上記プリント配線板は導電性接着剤層と金属板とが良好な接着力を有しているため、これを使用した電子機器は、振動や落下に強く、長期にわたって安定した動作を保つことができる。
For this reason, the electronic device including the printed wiring board having excellent mechanical strength and conductivity according to the present invention has a long-term malfunction caused by electromagnetic noise generated by an electronic component mounted inside or electromagnetic noise entering from the outside. It is possible to prevent it stably and stably.
In addition, since the printed wiring board has a good adhesive strength between the conductive adhesive layer and the metal plate, electronic devices using the printed wiring board are resistant to vibration and dropping, and maintain stable operation over a long period of time. Can do.
１ プリント配線板
２ 金属補強板
２ａ 金属板
２ｂ 中間層
２ｃ 表面保護層
３ 導電性接着剤層
４ａ 絶縁層
４ｂ 絶縁層
５ａ 接着剤層
５ｂ 接着剤層
６ 配線回路基板
７ グランド配線回路
８ 配線回路
９ 絶縁基材
１０ 電子部品
１１ ビア
１０１ 絶縁層
１０２ 金属膜
１０３ 導電性接着剤層
DESCRIPTION OF SYMBOLS 1 Printed wiring board 2 Metal reinforcement board 2a Metal board 2b Intermediate layer 2c Surface protective layer 3 Conductive adhesive layer 4a Insulating layer 4b Insulating layer 5a Adhesive layer 5b Adhesive layer 6 Wiring circuit board 7 Ground wiring circuit 8 Wiring circuit 9 Insulating substrate 10 Electronic component 11 Via 101 Insulating layer 102 Metal film 103 Conductive adhesive layer
Claims (6)
前記中間層は、厚みが０．１〜３μｍのニッケル層であり、
前記表面保護層は、厚みが０．０５〜０．５μｍの貴金属層であることを特徴とするプリント配線板。 A wiring circuit board, a conductive adhesive layer, and a metal reinforcing plate are provided, and the conductive adhesive layer is bonded to the wiring circuit board and the metal reinforcing plate, respectively, and the metal reinforcing plate is a surface of the metal plate. Having an intermediate layer and a surface protective layer,
The intermediate layer is a nickel layer having a thickness of 0.1 to 3 μm,
The printed wiring board, wherein the surface protective layer is a noble metal layer having a thickness of 0.05 to 0.5 μm.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP6371460B1 (en) * | 2017-12-06 | 2018-08-08 | タツタ電線株式会社 | Reinforcing board for wiring board |
| KR20190106187A (en) * | 2018-03-08 | 2019-09-18 | 삼성전자주식회사 | Circuit board including conductive structures electrically connecting lines and electronic device including the same |
| CN112492768A (en) * | 2021-01-29 | 2021-03-12 | 四川英创力电子科技股份有限公司 | Manufacturing method of PCB with two surface treatments |
| CN115767938A (en) * | 2022-11-25 | 2023-03-07 | 福莱盈电子股份有限公司 | Gold plating method applied to reinforced steel sheet |
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| JP2011238860A (en) * | 2010-05-12 | 2011-11-24 | Nhk Spring Co Ltd | Electrical connection structure of piezoelectric element, and head suspension |
| WO2016032006A1 (en) * | 2014-08-29 | 2016-03-03 | タツタ電線株式会社 | Reinforcing member for flexible printed wiring board, and flexible printed wiring board provided with same |
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| JP2000286299A (en) * | 1999-03-30 | 2000-10-13 | Matsushita Electric Ind Co Ltd | Method for connecting semiconductor device |
| JP2011238860A (en) * | 2010-05-12 | 2011-11-24 | Nhk Spring Co Ltd | Electrical connection structure of piezoelectric element, and head suspension |
| WO2016032006A1 (en) * | 2014-08-29 | 2016-03-03 | タツタ電線株式会社 | Reinforcing member for flexible printed wiring board, and flexible printed wiring board provided with same |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6371460B1 (en) * | 2017-12-06 | 2018-08-08 | タツタ電線株式会社 | Reinforcing board for wiring board |
| KR20190067112A (en) * | 2017-12-06 | 2019-06-14 | 타츠타 전선 주식회사 | Reinforcing member for printed wiring board |
| KR102419510B1 (en) | 2017-12-06 | 2022-07-08 | 타츠타 전선 주식회사 | Reinforcing member for printed wiring board |
| KR20190106187A (en) * | 2018-03-08 | 2019-09-18 | 삼성전자주식회사 | Circuit board including conductive structures electrically connecting lines and electronic device including the same |
| KR102659093B1 (en) | 2018-03-08 | 2024-04-22 | 삼성전자주식회사 | Circuit board including conductive structures electrically connecting lines and electronic device including the same |
| CN112492768A (en) * | 2021-01-29 | 2021-03-12 | 四川英创力电子科技股份有限公司 | Manufacturing method of PCB with two surface treatments |
| CN112492768B (en) * | 2021-01-29 | 2021-04-30 | 四川英创力电子科技股份有限公司 | Manufacturing method of PCB with two surface treatments |
| CN115767938A (en) * | 2022-11-25 | 2023-03-07 | 福莱盈电子股份有限公司 | Gold plating method applied to reinforced steel sheet |
| CN115767938B (en) * | 2022-11-25 | 2024-05-28 | 福莱盈电子股份有限公司 | Gold selection and plating method applied to reinforced steel sheet |
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