KR101987146B1 - Focusing module, LED Light Source Device having Focusing module, and vision inspection apparatus - Google Patents

Abstract

The present invention relates to an LED light source device, and more particularly, to a light collecting module, an LED light source device, and a vision inspection device that collect light emitted from an LED chip.
The present invention provides a light emitting device comprising: at least one LED chip; a plurality of LED substrates provided with a lens member for concentrating light emitted from the LED chip; And a plurality of LED substrates mounted on the LED chip, wherein the plurality of LED substrates together with the lens member are disposed at a converging point having a predetermined distance from the LED chip, And the light-converging points are all disposed in the light-collecting region having a constant diameter.

Description

[0001] The present invention relates to a focusing module, an LED light source device, and a vision inspection device,

The present invention relates to an LED light source device, and more particularly, to a light collecting module, an LED light source device, and a vision inspection device that collect light emitted from an LED chip.

An illumination device is a mechanism that fixes or protects a light source by reflecting, refracting, or transmitting light from the light source. It is a device that fixes or protects a light source by reflecting, refracting, or transmitting light from a light source.

Examples of the light source of the lighting device include incandescent lamps and fluorescent lamps used in the interior, and halogen lamps used in outdoor such as parks and street lamps.

On the other hand, LED (Lighting Emitting Diode) is a semiconductor that emits light. It has low power consumption (1/6 of incandescent lamp), long life (8 times of incandescent lamp) and environment- Light source, interior light, street light, illumination light, automobile, and so on.

Particularly, the application range of the LED exceeds the general illumination device, and as disclosed in Korean Patent Laid-Open Publication No. 2011-009335, the substrate is irradiated with light, an image of the substrate irradiated with light is obtained, It is expanding to vision inspection equipment to inspect.

However, in applying the LED to the vision inspection system of the substrate, it is necessary to present the optimal structure for replacing the LED with the light source because it is not applicable immediately to the configuration optimized for the existing halide lamp.

An object of the present invention is to provide a light-collecting module, an LED light source device, and a vision inspection device which can minimize the loss of light generated in one or more LED chips and collect as much light as possible.

The present invention has been made in order to accomplish the above-mentioned object of the present invention, and it is an object of the present invention to provide a liquid crystal display device, comprising: at least one LED chip; a plurality of LED substrates provided with a lens member for concentrating light emitted from the LED chip; And a plurality of LED substrates mounted on the LED chip, wherein the plurality of LED substrates together with the lens member are disposed at a converging point having a predetermined distance from the LED chip, And the light-converging points are all disposed in the light-collecting region having a constant diameter.

The diameter of the light converging region is preferably 4 mm to 10 mm.

Each of the LED substrates may be mounted on the support member such that an optical axis of light emitted from the LED chip is directed to the light-converging region.

The plurality of LED substrates may include a central LED substrate connected in a straight line to the center of the condensing region, at least one outer LED substrate group in which a plurality of LED substrates are circular or polygonal, .

The plurality of outer LED substrate groups may be arranged such that the distance from the central LED substrate increases sequentially.

The support member may be formed of one or more members.

The plurality of LED substrates may include a central LED substrate connected in a straight line to the center of the condensing region, at least one outer LED substrate group in which a plurality of LED substrates are circular or polygonal, The support member may include a support plate for supporting the center LED substrate and at least one outer support member coupled to the support plate and supporting one or more LED substrates constituting the outer LED substrate group.

Wherein the plurality of outer LED substrate groups are arranged such that a distance therefrom increases sequentially from the central LED substrate, and the support plate is provided with LED substrates of the LED substrate group closest to the center LED substrate, And the LED substrates of the remaining outer LED substrate group may be installed.

The outer supporting member for supporting the LED substrate of the outermost outer LED substrate group among the outer LED substrate groups may have a plurality of fins for heat dissipation.

Wherein the support member is formed with a plurality of support surfaces for supporting each of the plurality of LED substrates by surface contact, and a part of the plurality of support surfaces is supported on a support surface located further inward about the center LED substrate And a projection area to be projected onto the plate surface of the support plate are overlapped with each other.

The support member may have a metal material so that heat can be released by surface contact with the LED substrate to be coupled.

At least some of the support members may be formed with a plurality of fins for heat dissipation.

The lens member may be formed with a receiving groove for receiving an LED chip mounted on the LED substrate.

The lens member may have an insertion protrusion inserted into an insertion groove formed in the LED substrate.

The lens member may have a synthetic resin material such as PC, PMMA resin (methacrylic acid metal resin).

The present invention also relates to a light condensing module installed in the main body; And an optical cable fixing unit installed in the main body and fixing the optical cable so that the light-collecting area of the light-condensing module is positioned on the light-receiving surface of the optical cable.

The main body may further include a power supply unit for supplying power to the LED unit.

The angle formed between the normal line of the light receiving surface of the optical cable and the traveling path of the light generated from the LED chip is preferably larger than 60 ° and smaller than 90 °.

The present invention also provides a light emitting device, comprising: a light irradiating unit installed to irradiate light onto a substrate; A camera unit for acquiring an image of the substrate relative to the light irradiating unit; A substrate inspection unit for analyzing an image obtained by the camera unit to inspect a substrate; And an LED light source device connected to the light irradiation part by an optical cable to generate light to be transmitted to the light irradiation part.

The light condensing module, the LED light source device, and the vision inspection device according to the present invention include a plurality of LED chips and a lens member for condensing light provided corresponding to each LED chip, And the light is condensed in one condensing area, which is advantageous in that the LED can be used in the condensing module.

Further, the light-collecting module, the LED light source device, and the vision inspection device according to the present invention can maximize the light amount in the light-collecting area by allowing a larger number of LED chips to collect light on a small- There is an advantage.

1 is a conceptual diagram showing an LED light source device according to the present invention.
2 is a side view showing a part of the LED light source device of FIG.
3 is a perspective view showing a light collecting module of the LED light source device of FIG.
4 is a plan view of the condensing module of Fig.
5 is a cross-sectional view taken along the line V-V in Fig.
Fig. 6 is a perspective view of the lens of the condensing module of Fig. 3;
7 is a circuit diagram showing an example of an LED chip used in the LED light source device of FIG.
FIG. 8 is a conceptual diagram showing the concept of a vision inspection apparatus in which the LED light source device of FIG. 1 is used.
9 is a side view showing the concept of the vision inspection apparatus of FIG.

Hereinafter, the condensing module, the LED light source device, and the vision inspection device according to the present invention will be described in detail with reference to the accompanying drawings.

As shown in FIGS. 1 to 5, the LED light source device 20 according to the present invention includes a main body 23; A condensing module 100 installed in the main body 23; And an optical cable fixing part 22 provided on the main body 23 and on which the optical fiber 30 is fixed so that the light collecting area of the light collecting module 100 is positioned on the light receiving surface 33 of the optical cable 30. [

The main body 23 may have any structure as long as the optical condensing module 100 and the optical fiber fixing part 22 are provided and the optical fiber 30 is coupled and the condensing module 100 can be installed.

The main body 23 has various structures such as a frame structure in which the light collecting module 100 or the like is exposed to the outside or a housing structure in which a through hole (not shown) is formed so that the optical cable 30 is connected to the outside, .

The main body 23 may be provided with various members such as a power supply unit 21 for supplying power to the light collecting module 100.

The supporting bracket 24 may be additionally provided for the installation of the condensing module 100 in connection with the installation of the condensing module 100.

The support bracket 24 may have any structure as long as the light collecting module 100 is installed and can support the light collecting module 100. The supporting bracket 24 may serve as a jig so that the light collecting area of the light collecting module 100 is precisely positioned on the light receiving surface of the optical cable 30.

The optical cable fixing part 22 may be configured to fix the optical cable 30 so that the light generated from the light condensing module 100 is condensed on the light receiving surface 33 of the optical cable 30.

The optical cable fixing part 22 includes at least one coupling screw (not shown) for finely adjusting the coupling state of the optical cable 30 so that the light converging area of the condensing module 100 is accurately positioned on the light receiving surface of the optical cable 30 Can be installed.

Meanwhile, the main body 23 may further include a fan 25 for generating an air flow for cooling the condensing module 100, which will be described later.

Here, the main body 23 may be formed with various types of air flow paths to facilitate the cooling of the light collecting module 100 by the air flow generated by the fan 25.

At least one opening (not shown) is formed in the main body 23 so that the air can be discharged from the outside through the condensing module 100, and a filter for introducing foreign matter And so on.

The condensing module 100 is configured to condense the light generated from the plurality of LED chips 110 to a specific position such as the light receiving surface 33 of the optical cable 30 in order to condense light having a higher light amount. Various configurations are possible.

For example, the light-collecting module 100 may include at least one LED chip 110, a plurality of LED substrates 120 provided with a lens member 130 for concentrating the light generated from the LED chip 110, And a support member 150 on which a plurality of LED substrates 120 are mounted.

Here, the LED chip 110 may use a variety of LED chips such as white light, R, G, and B according to required optical characteristics.

In addition, the LED chip 110 needs to have a larger light quantity when the LED unit 130 is used as a light source. As shown in FIG. 7, a plurality of LED elements 111 are packaged An array type LED or a power LED.

The LED substrate 120 may have various configurations such as PCB, metal PCB, and the like for fixing the LED chip 110, supplying power, and dissipating heat.

On the other hand, the plurality of LED substrates 120 may be variously arranged so that light of a sufficient amount of light required in the light-converging region is condensed.

3 and 4, the plurality of LED substrates include a central LED substrate 120 connected in a straight line to the center of the light-converging region, The plurality of LED substrates 120 may be arranged in a circle or a polygonal shape, and the plurality of LED substrates 120 may be arranged in a plurality of groups.

In this case, the outer LED substrate groups are arranged in a plurality so that the distance from the central LED substrate 120 sequentially increases. In the embodiment of the present invention, the outer LED substrate groups are arranged in one LED substrate 120 at the center, As shown in FIG.

For example, as shown in FIG. 4, the plurality of LED substrates 120 are provided with one LED substrate 120 at the center, six LED substrates (not shown) around the centered LED substrate 120 120 are arranged at regular intervals in the first circumferential direction and six LED substrates 120 are arranged on the LED substrate 120 centered in the second circumferential direction with a larger diameter than the first circumferential direction Six LED substrates 120 are installed at regular intervals around the LED substrate 120 positioned at the center in the third circumferential direction with a larger diameter than the second circumferential direction, Twelve LED substrates 120 may be arranged at regular intervals around the LED substrate 120 positioned at the center in the fourth circumferential direction with a diameter larger than the circumferential direction.

Here, the LED substrates 120 installed in the first circumferential direction, the second circumferential direction, and the fourth circumferential direction may be disposed so as not to be linearly formed in the radial direction with the LED substrate 120 installed in the inner circumferential direction.

In addition, the angle of inclination of the LED substrate 120 disposed in the circumferential direction toward the front of the support surface of the LED substrate 120 positioned at the center of the support surface supported by the support member 150 have.

The lens member 130 is coupled to the LED substrate 150 on which the LED chip 110 is mounted so that the light generated by the LED chip 110 can be transmitted to the lens member 130 along with the arrangement of the LED substrate 120 on the support member 150 Any configuration can be used as far as it can be condensed to the condensing region.

For example, the lens member 130 may have various shapes, such as a substantially conical shape or a truncated conical shape, as shown in FIGS. 1 to 6.

As the material of the lens member 130, synthetic resin, glass, or the like can be used, and synthetic resin such as PC (polycarbonate) PMMA resin (methacrylic acid metal resin) can be manufactured by injection or the like.

Meanwhile, the lens member 130 may be formed with a receiving groove 131 in which one or more LED chips 110 are received to increase efficiency of light reception.

The receiving groove 131 sufficiently covers one or more LED chips 110 to effectively receive light generated from the LED chip 110.

In addition, the receiving groove 131 may be formed to be convex toward the LED chip 110 in order to increase light receiving efficiency in the vicinity of the optical axis.

The lens member 130 may be coupled to at least one of the LED substrate 120 and the support member 150 and may be inserted into one or more insertion grooves 124 formed in the LED substrate 120, (134) may be formed and fit together.

4 and 5, the light collecting module 100 concentrates the light generated from the LED chip 110 on a member having a very small size such as the light receiving surface 33 of the optical cable 30 A plurality of LED substrates 120 are mounted on a support member 150 (not shown) to concentrate the light generated from the LED chip 110 at a light converging point having a certain distance from the LED chip 110 together with the lens member 130 , And is arranged on the support member (150) so that the light-converging points are all located in the light-converging region having a constant diameter (D).

The diameter D of the condensing region varies depending on the diameter of the optical cable 30, and is preferably 4 mm to 10 mm in consideration of the light-condensing efficiency.

If the diameter D of the light-collecting area is too small, the precision of the lens member 130 may be limited and the manufacturing cost may increase. If the diameter D of the light-collecting area is too large, Which is larger than the range of the light receiving surface 33, and the light receiving effect is deteriorated.

The light emitted from each LED chip 110 is incident on the optical cable 30 through the optical axis of the incident angle-optical cable 30, the normal line of the light receiving surface 33 of the optical cable 30, The angle? Of the light traveling path is preferably greater than 60 ° and less than 90 °, more preferably greater than 62 ° and less than 90 °.

The support member 150 supports the LED substrate 120 so that the light emitted from the LED chip 110 is condensed on the light collecting area of each LED substrate 120, And the optical axis of the light emitted from the light source is directed to the condensing region.

The supporting member 150 may have any configuration as long as it can support a plurality of LED substrates 120 in a properly arranged state, and may have a variety of configurations including one or a plurality of members.

As an example of the structure of the support member 150, a plurality of LED substrates 120 are connected in a straight line to the center of the light-converging region in order to increase the light quantity in the light-collecting region, as shown in Figs. 4 and 5 When a plurality of LED substrates 120 are arranged around a central LED substrate 120 and are arranged in a plurality of circular or polygonal shapes, 150 includes a support plate 151 for supporting the central LED substrate 120 and at least one outer support member 150 for supporting at least one LED substrate 120 which is coupled to the support plate 151 and constitutes a group of outer LED substrates 152, 153).

The supporting plate 151 is provided with a center LED substrate 120 at a position corresponding to the center of the light receiving surface 33 of the optical cable 30 and supports the outer supporting members 152 and 153, (23), and various configurations are possible.

In addition to the central LED substrate 120, the support plate 151 may include a plurality of LED substrates 120, for example, an outer LED substrate group, each of which sequentially increases in distance from the central LED substrate 120 The LED substrates 120 of the outer LED substrate group closest to the center LED substrate 120 can be installed.

The supporting members 152 and 153 are configured to support at least one LED substrate 120 constituting a group of outer LED substrates. Depending on the position of each LED substrate 120, the supporting surfaces thereof receive the light of the optical cable 30 Can be formed at a predetermined angle with the optical axis of the surface (33).

The LED substrate 120 provided on the support surface of the support member 150 is preferably incident on the light receiving surface 30 of the optical cable 30 at a maximum angle.

Therefore, it is preferable that the plurality of LED substrates 120 are installed as close as possible to the LED substrate 120 installed at the center.

The support member 150 is formed with a plurality of support surfaces for supporting the plurality of LED substrates 120 by surface contact, and a part of the plurality of support surfaces is formed around the center LED substrate 120 It is preferable that the support surface positioned further inside is overlapped with the projection area projected on the plate surface of the support plate 151. [

As described above, a part of the plurality of support surfaces of the support member 150 is overlapped with the support surface positioned further inside with respect to the center LED substrate 120 and the projection area projected onto the plate surface of the support plate 151 The LED substrate 120 can be made incident on the light receiving surface 30 of the optical cable 30 at a maximum angle by arranging the same number of LED substrates 120 closer to the center.

Here, some of the plurality of support surfaces of the support member 150 are formed so as to overlap the support surface, which is located further inward with respect to the center LED substrate 120, and the projection area that is projected onto the plate surface of the support plate 151 5, the support surface of the outer support member 152 is positioned higher than the support plate 151 while being moved from the center to the outer periphery, and the lower side of the support surface located at the outermost position is cut, The support surface located at the outer side can be positioned closer to the center.

Meanwhile, the support member 150 may have a metal material such as aluminum, an aluminum alloy, or the like so as to emit heat by surface contact with the LED substrate 120 to be coupled thereto.

The support member 150 may be variously coupled to the support plate 151 and the outer support members 152 and 153 by bolts or the like by welding or the like.

At least a part of the support members 150 may be formed by the outer support members 152 and 153 for supporting the LED substrate 120 of the outermost LED substrate group out of the outer LED substrate groups, A plurality of pins 154 may be formed.

5, the support members 150 may be formed such that the support surfaces for supporting the plurality of LED substrates 120 are formed to be concave toward the light-collecting region as a whole, as shown in FIG. 5 in the arrangement of the plurality of LED substrates 120 have.

5, the support member 150 may be provided to support a plurality of, for example, two LED substrates 120, or may be provided to support each of the LED substrates 120, And a support plate to which the members are coupled.

Meanwhile, the LED light source device 20 having the above-described configuration can be applied to various devices requiring light irradiation by generating light and transmitting light by the optical cable 30.

As an example, the LED light source device 20 according to the present invention may include a light irradiation unit 40 installed to irradiate the substrate 10 with light, as shown in Figs. 8 and 9; A camera unit (50) for acquiring an image of the substrate (10) moving relative to the irradiation unit (40); A substrate inspection unit (not shown) for analyzing the image obtained by the camera unit 40 and inspecting the substrate 10; And an LED light source device 20 connected to the light irradiation unit 40 by the optical cable 30 to generate light to be transmitted to the light irradiation unit 40.

The substrate 10 may be any substrate that requires vision inspection, and may be a semiconductor substrate, an LCD panel substrate, a solar cell substrate, or the like.

Here, the substrate 10 is installed so as to be able to move relative to the light irradiation unit 40 and the camera unit 50 for the efficient inspection of the surface thereof, and various structures such as a guide rail and a tray for transporting the substrate 10 are additionally provided .

The light irradiating unit 40 is a device for irradiating the substrate 10 with light transmitted through the optical cable 30, the both ends of which are connected to the optical cable 30.

The light irradiating unit 40 may be, for example, a quartz rod coated with a reflective material on its upper surface.

The camera unit 50 may have various configurations such as a CCD camera, a line scanner, and the like for acquiring an image of the substrate 10 irradiated by the light irradiating unit 40 and delivering the image to a substrate inspecting unit to be described later.

The substrate inspection unit analyzes the image obtained by the camera unit 50 and performs inspection of the appearance of the substrate 10. The substrate inspection unit may have various configurations as a circuit configuration rather than a physical configuration.

Meanwhile, the optical cable 30 is configured to transmit light generated from the LED light source device 20 to a light emitting device for irradiating light, and various specifications can be selected according to design and design.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined in the appended claims. It is to be understood that both the technical idea and the technical spirit of the invention are included in the scope of the present invention.

10: substrate 20: LED light source device
100: condensing module
110: second condenser lens 120: second condenser lens

Claims (20)

A plurality of LED substrates provided with at least one LED chip, and a lens member for concentrating light emitted from the LED chip; And a support member on which the plurality of LED substrates are mounted,
Wherein the plurality of LED substrates are provided on the support member so as to concentrate light generated from the LED chip at a light converging point having a predetermined distance from the LED chip together with the lens member, Wherein the support member is disposed on the support member so as to be located within the region,
Wherein the LED substrates are mounted on the support member such that an optical axis of light emitted from the LED chip is directed to the light-
Wherein the plurality of LED substrates
A central LED substrate connected in a straight line to the center of the condensing region,
And a plurality of LED substrates arranged in a circular or polygonal manner with the center LED substrate as a center,
Wherein the support member is formed with a plurality of support surfaces for supporting each of the plurality of LED substrates by surface contact,
Wherein the plurality of support surfaces have an inclination angle formed toward a front side with respect to a support surface for supporting an LED substrate positioned at the center,
Wherein the support member has an aluminum material so as to emit heat by surface contact with the LED substrate to be coupled,
Wherein at least some of the support members are formed with a plurality of fins for heat dissipation,
Wherein the support member includes a support plate for supporting the center LED substrate and at least one outer support member for supporting at least one LED substrate that is coupled to the support plate and constitutes the outer LED substrate group. . The method according to claim 1,
And the diameter of the light converging region is 4 mm to 6 mm. delete delete The method according to claim 1,
Wherein a plurality of the outer LED substrate groups are arranged so that distances from the central LED substrate are sequentially increased, respectively. The method according to claim 1,
Wherein the support member is formed of at least one member. delete The method according to claim 1,
The plurality of outer LED substrate groups are arranged so that the distances from the central LED substrate are sequentially increased,
Wherein the support plate is provided with LED substrates of a group of LED substrates closest to the center LED substrate, and the outer support members are provided with LED substrates of the remaining group of outer LED substrates. The method according to claim 1,
Wherein the outer supporting member for supporting the LED substrate of the outermost outer LED substrate group among the outer LED substrate groups has a plurality of fins for heat dissipation. The method according to claim 1,
Wherein some of the plurality of support surfaces are formed so that a support surface positioned further inward with respect to the center LED substrate and a projection area projected onto the plate surface of the support plate are overlapped. delete delete The method according to claim 1,
Wherein the lens member has a receiving groove for receiving an LED chip mounted on the LED substrate. 14. The method of claim 13,
Wherein the lens member is formed with an insertion protrusion inserted into an insertion groove formed in the LED substrate. The method according to claim 1,
Wherein the lens member is a synthetic resin. The method according to claim 1,
Wherein the lens member is PC or PMMA resin (methacrylic acid metal resin). A body;
A light condensing module according to any one of claims 1, 2, 5 to 6, 8 to 10, and 13 to 16 installed in the main body;
And an optical cable fixing unit installed on the main body and fixing the optical cable so that the light-collecting area of the light-collecting module is positioned on the light-receiving surface of the optical cable. 18. The method of claim 17,
Wherein the main body further comprises a power supply unit for supplying power to the light collecting module. 18. The method of claim 17,
Wherein an angle formed between a normal line of the light receiving surface of the optical cable and an advancing path of light generated from the LED chip is greater than 60 degrees and smaller than 90 degrees. A light irradiation unit installed to irradiate the substrate with light;
A camera unit for acquiring an image of the substrate relative to the light irradiating unit;
A substrate inspection unit for analyzing an image obtained by the camera unit to inspect a substrate;
And an LED light source device according to claim 17 for generating light to be transmitted to the light irradiation part by being connected to the light irradiation part by an optical cable.

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