KR101985754B1 - Air conditioner and apparatus for treating substrate the same - Google Patents

Abstract

The present invention provides an air conditioning apparatus. The air conditioner of the present invention includes: a case having an inlet through which air flows, an inner space through which air introduced through the inlet flows, and openings through which the air flowing into the inner space flows down; A damper installed at the inlet to regulate a flow rate of air; And an airflow regulating member installed in the inner space and independently controlling the airflow flowing down from each of the openings.

Description

TECHNICAL FIELD [0001] The present invention relates to an air conditioner,

The present invention relates to an apparatus for processing a substrate.

In general, various processes such as cleaning, deposition, photolithography, etching, and ion implantation are performed to manufacture semiconductor devices. The photolithography process performed to form the pattern plays an important role in achieving the high integration of the semiconductor device.

The photolithography process is performed to form a photoresist pattern on a semiconductor substrate made of silicon. The photolithography process includes a coating and a soft bake process for forming a photoresist film on a substrate, an exposure and development process for forming a photoresist pattern from the photoresist film, an edge bead for removing edge portions of the photoresist film or pattern, An edge bead removal (EBR) process, an edge exposure (EEW) process, a hard bake process for stabilizing and densifying the photoresist pattern, and the like.

A multi-unit arrangement system in which a plurality of processing units are arranged in one chamber is used as a substrate processing apparatus for performing such a photolithography process. A substrate processing apparatus of the multi-unit arrangement system includes a fan filter unit (FFU) Is installed in the upper part of the chamber, and the substrate processing is performed in a state of downflow of air from the air conditioner.

However, as shown in FIG. 1, the air conditioning apparatus 2 applied to the conventional multi-unit arrangement type substrate processing apparatus 1 provides a down flow in a wide area, and thus provides a uniform air flow inside the chamber 3 I can not. That is, in the air conditioning system 2, the wind speed deviation phenomenon in which the flow of molten gas into the duct of the processing apparatus 2 becomes stronger as the distance from the supply end 2a into which the air flows is increased, .

As a result, a process deviation occurs between the substrate processed in the left processing unit 4a and the substrate processed in the right processing unit 4b.

An object of the present invention is to provide an air conditioner capable of uniformly controlling the wind speed.

An object of the present invention is to provide an air conditioner capable of controlling an air flow for each zone.

An object of the present invention is to provide a substrate processing apparatus capable of providing a uniform airflow to a process chamber in which a plurality of substrate processing units are disposed.

An object of the present invention is to provide a substrate processing apparatus capable of independently controlling a wind speed supplied to each substrate processing unit.

 The problems to be solved by the present invention are not limited thereto, and other matters not mentioned can be clearly understood by those skilled in the art from the following description.

According to an aspect of the present invention, there is provided an air conditioner comprising: a casing having an inlet through which air flows, an inner space through which air introduced through the inlet is diffused, and openings through which the air introduced into the inner space flows down; A damper installed at the inlet to regulate a flow rate of air; And an airflow adjusting member provided in the inner space and independently controlling airflow flowing down from each of the openings.

Further, the airflow regulating member may forcibly exhaust the air above the opening to control the airflow that flows down through the opening.

Further, the airflow regulating member may include an intake unit installed on each of the openings and having a plurality of intake holes; An exhaust line connected to the intake unit to provide a suction force to the intake unit; And a flow control valve installed in the exhaust line.

The airflow regulating member may include a wind speed measuring unit for measuring a wind speed to flow down through the opening; And a control unit for controlling the flow rate control valve according to the wind speed measured by the wind speed measurement unit.

Also, the airflow adjusting member may include a pressure measuring unit installed in the inner space adjacent to the opening to measure the inner pressure; And a control unit for controlling the flow rate control valve according to the pressure measured by the pressure measurement unit.

Further, the case may be provided between the openings, and may further include an airflow control partition wall in which airflows in the inner space collide.

Further, it may further include a filter provided in the opening.

According to another aspect of the present invention, there is provided a process chamber comprising: a chamber having a processing space; Substrate processing units arranged in a line in a processing space of the chamber; An air conditioning apparatus installed at an upper portion of the chamber, the air conditioning apparatus providing a downward current to the processing space of the chamber; The air conditioning apparatus may be provided with a substrate processing apparatus for independently controlling the airflow provided to each of the substrate processing units.

The air conditioner further includes: an inlet port through which air flows, an inner space through which the air introduced through the inlet port is diffused, and openings through which the air introduced into the inner space flows down to each of the substrate processing units; A damper installed at the inlet to regulate a flow rate of air; And an airflow regulating member installed in the inner space and independently controlling the airflow flowing down from each of the openings.

Further, the opening may be arranged to face the substrate processing unit.

Further, the airflow regulating member may forcibly exhaust air from the inner space to the outside to control the airflow that flows down through the opening.

Further, the airflow regulating member may include an intake unit installed on each of the openings and having a plurality of intake holes; An exhaust line connected to the intake unit to provide a suction force to the intake unit; And a flow control valve installed in the exhaust line.

The airflow regulating member may include a wind speed measuring unit for measuring a wind speed to flow down through the opening; And a control unit for controlling the flow rate control valve according to the wind speed measured by the wind speed measurement unit.

Also, the airflow adjusting member may include a pressure measuring unit installed in the inner space adjacent to the opening to measure the inner pressure; And a control unit for controlling the flow rate control valve according to the pressure measured by the pressure measurement unit.

Further, the case may be provided between the openings, and may further include an airflow control partition wall in which airflows in the inner space collide.

Further, it may further include a filter provided in the opening.

Further, the substrate processing unit can apply the photoresist on the substrate.

According to the embodiment of the present invention, when the deviation of the airflow flowing down to each of the openings is generated, the air above the opening is forcibly evacuated, so that the deviation of the airflow flowing down from the openings can be reduced.

The effects of the present invention are not limited to the above-mentioned effects, and the effects not mentioned can be clearly understood by those skilled in the art from the present specification and the accompanying drawings.

FIG. 1 is a view showing an uneven wind velocity in a conventional multi-unit arrangement type substrate processing apparatus.
2 is a top view of a substrate processing apparatus according to an embodiment of the present invention.
3 is a view of the apparatus of FIG.
Fig. 4 is a view of the substrate processing apparatus of Fig. 1 viewed from the BB direction. Fig.
5 is a perspective view showing the air conditioning apparatus shown in FIG.
6 is a plan sectional view of the air conditioning apparatus shown in Fig.
7 is a side sectional view of the air conditioning apparatus shown in Fig.
8 is a partially cutaway perspective view of the air conditioner shown in Fig.
9 is a diagram showing a uniform wind speed in the spin processing unit.

BRIEF DESCRIPTION OF THE DRAWINGS The present invention is capable of various modifications and various embodiments, and specific embodiments are illustrated in the drawings and will be described in detail in the detailed description. It is to be understood, however, that the invention is not to be limited to the specific embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the terms "comprises" or "having" and the like are used to specify that there is a feature, a number, a step, an operation, an element, a component or a combination thereof described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the like elements throughout the specification and claims. The description will be omitted.

2 is a schematic view of a substrate processing apparatus 1 according to an embodiment of the present invention. FIG. 2 is a top view of the substrate processing apparatus 1, and FIG. 3 is a cross- FIG. 4 is a view of the substrate processing apparatus 1 of FIG. 2 viewed from the BB direction.

2 to 4, the substrate processing apparatus 1 includes an index unit 100, a buffer unit 300, a process processing unit 400, and an interface unit 700.

 The index unit 100, the buffer unit 300, the processing unit 400, and the interface unit 700 are sequentially arranged in one direction in one direction.

The direction in which the index unit 100, the buffer unit 300, the processing unit 400 and the interface unit 700 are disposed is referred to as a first direction 12. A direction perpendicular to the first direction 12 is referred to as a second direction 14 and a direction perpendicular to the first direction 12 and the second direction 14 is referred to as a third direction 16, Quot;

The wafer W is moved in a state accommodated in the cassette 20. The cassette 20 has a structure that can be sealed from the outside. For example, as the cassette 20, a front open unified pod (FOUP) having a door at the front can be used.

Hereinafter, the index unit 100, the buffer unit 300, the processing unit 400, and the interface unit 700 will be described.

(Index portion)

The index unit 100 includes a table 120 on which a cassette 20 accommodating wafers W is placed. A plurality of mounts 120 are provided, and the mounts 120 are arranged in a line along the second direction 14. In Fig. 3, four placement tables 120 are provided.

The index unit 100 transfers the wafer W between the cassette 20 placed on the table 120 and the buffer unit 300. The index unit 100 includes a frame 210, an index robot 220, and a guide rail 230.

The frame 210 is provided generally in the shape of an inner rectangular parallelepiped and is disposed between the table 120 and the buffer unit 300. The frame 210 of the index unit 100 may be provided at a lower height than the frame 310 of the buffer unit 300 described later. The index robot 220 and the guide rail 230 are disposed within the frame 210. The index robot 220 is a four-axis drive system in which the hand 221 directly handling the wafer W is movable in the first direction 12, the second direction 14 and the third direction 16, This is a possible structure. The index robot 220 includes a hand 221, an arm 222, a support 223, and a pedestal 224. The hand 221 is fixed to the arm 222. The arm 222 is provided with a stretchable structure and a rotatable structure. The support base 223 is disposed along the third direction 16 in the longitudinal direction. The arm 222 is coupled to the support 223 to be movable along the support 223. The support 223 is fixedly coupled to the pedestal 224. The guide rails 230 are provided so that their longitudinal direction is arranged along the second direction 14. The pedestal 224 is coupled to the guide rail 230 so as to be linearly movable along the guide rail 230. Further, although not shown, the frame 210 is further provided with a door opener for opening and closing the door of the cassette 20.

(Buffer section)

The buffer unit 300 may include a frame 310, a first buffer unit 300a, a second buffer unit 300b, and a cooling chamber 390. The frame 302 is provided in the shape of an inner rectangular parallelepiped and disposed between the index portion 100 and the processing portion 400. The first buffer unit 300a, the second buffer unit 300b, and the cooling chamber 390 are located in the frame 302. The cooling chamber 390, the second buffer unit 300b, and the first buffer unit 300a may be sequentially arranged in the third direction 16 from below. The second buffer unit 300b and the cooling chamber 390 are positioned at a height corresponding to the coating processing unit 401 of the process processing unit 400 to be described later and the processing unit 400, The development processing unit 402 of FIG.

The first buffer unit 300a and the second buffer unit 300b may temporarily store a plurality of wafers W, respectively.

The first buffer unit 300a and the second buffer unit 300b have the same configuration. In the present embodiment, the description of the processing unit for the first buffer unit will be described in detail.

(Interface)

The interface unit 700 transfers the wafer W. The interface unit 700 includes a frame 710, a first buffer 720, a second buffer 730, and an interface robot 740. The first buffer 720, the second buffer 730, and the interface robot 740 are located within the frame 710. The first buffer 720 and the second buffer 730 are spaced apart from each other by a predetermined distance and are stacked on each other. The first buffer 720 is disposed higher than the second buffer 730.

The interface robot 740 is spaced apart from the first buffer 720 and the second buffer 730 in the second direction 14. The interface robot 740 carries the wafer W between the first buffer 720, the second buffer 730 and the exposure apparatus 900.

The first buffer 720 temporarily stores the processed wafers W before they are transferred to the exposure apparatus 900. The second buffer 730 temporarily stores the processed wafers W in the exposure apparatus 900 before they are moved. The first buffer 720 has a housing 721 and a plurality of supports 722. The supports 722 are disposed within the housing 721 and are provided spaced apart from each other in the third direction 16. One wafer W is placed on each support 722. The housing 721 has an opening in the direction in which the interface robot 740 is provided so that the interface robot 740 can bring the wafer W into or out of the support 722 into the housing 721. The second buffer 730 has a structure similar to that of the first buffer 720. Only the buffers and robots can be provided as described above without providing a chamber for performing a predetermined process on the wafer.

The first buffer 720 and the second buffer 730 of the interface unit 700 may have the same configuration as the first buffer unit 300a described below.

(Process processing section)

The process processing unit 400 may proceed with a process of applying a photoresist on the wafer W and an process of developing the substrate W after the exposure process before the exposure process.

The processing unit 400 has a substantially rectangular parallelepiped shape. The process processing unit 400 may include a coating processing unit 401 and a development processing unit 402. The application processor 401 and the development processor 402 may be arranged so as to be partitioned into layers with each other. According to one example, the coating processing unit 401 can be positioned above the development processing unit 402.

The coating unit 401 may include a process of applying a photosensitive liquid such as a photoresist to the wafer W and a heat treatment process such as heating and cooling of the wafer W before and after the resist coating process.

For example, the coating processing unit 401 may include a central passage 490, a main transport robot 5000, and processing units for performing a process of the corresponding processing unit. Here, the processing units may include thermal processing units 420 and 430 and spin processing units 410.

The thermal processing unit may include a cooling unit 420, a bake unit 430, and the spin processing units may include application units 410a for the application process. As described above, the coating processing unit 401 and the development processing unit 402 can be provided with units corresponding to respective process characteristics.

2 to 4, the spin processing unit 410 has a multi-unit arrangement structure in which a plurality of application units 410a are arranged in one chamber CH. The spin processing unit 410 of the multi-unit arrangement type is provided with an air conditioner 900 above the chamber CH and performs the process in the air down flow state from the air conditioner 900.

For example, the spin processing unit 410 is provided with three coating units 410a along the first direction, but it is needless to say that two or four or more coating units may be disposed. Each of the application units 410a may have the same structure. However, the types of the photoresist used in each of the coating units 410a may be different from each other.

As an example, a chemical amplification resist may be used as the photoresist. The application unit 410a applies photoresist on the wafer W. [ The application unit 410a has a pawl 411, a support plate 412, and a nozzle 413. The pawl 411 has a cup shape with an open top. The support plate 412 is positioned in the pawl 411 and supports the wafer W. [ The support plate 412 is rotatably provided. The nozzle 413 supplies the photoresist onto the wafer W placed on the support plate 412. The nozzle 413 has a circular tube shape and can supply photoresist to the center of the wafer W. [ Alternatively, the nozzle 413 may have a length corresponding to the diameter of the wafer W, and the discharge port of the nozzle 413 may be provided as a slit. In addition, the coating unit 410 may further be provided with a nozzle for supplying a cleaning liquid such as deionized water to clean the surface of the wafer W coated with the photoresist.

The bake unit 430 heat-treats the wafer W. For example, the bake units 430 may include a prebake step of heating the wafer W to a predetermined temperature to remove organic matter and moisture on the surface of the wafer W before the photoresist is applied, A soft bake process is performed after coating the wafer W on the wafer W, and a cooling process for cooling the wafer W after each heating process is performed.

The bake unit 430 has a heating plate 421 and a cooling plate 422. Cooling plate 422 is provided with cooling means 424, such as cooling water or a thermoelectric element.

The cooling unit 420 performs a cooling process for cooling the substrate before applying the photoresist. The cooling unit 420 may include a housing and a cooling plate. The cooling plate may include an upper surface on which the wafer W is placed and a cooling means for cooling the wafer W. [ As the cooling means, various methods such as cooling with cooling water and cooling using a thermoelectric element can be used.

The conveying robot 5000 is located in the central passage 490. The transfer unit 5000 transfers the substrate between processing units for processing the substrate.

A spin processing unit 410, a bake unit 430, and a change buffer module 450. The cooling unit 420, the spin processing unit 410, the bake unit 430, and the change buffer module 450 are provided in the processing unit 401, . ≪ / RTI >

FIG. 5 is a perspective view showing the air conditioning apparatus shown in FIG. 2, FIG. 6 is a plan sectional view of the air conditioning apparatus shown in FIG. 5, and FIG. 7 is a side sectional view of the air conditioning apparatus shown in FIG. And FIG. 8 is a partially cutaway perspective view of the air conditioner shown in FIG.

5 to 8, the air conditioning apparatus 900 may include a case 910, a damper 920, and an airflow regulating member 930. [

The case 910 is formed with an internal space 914 through which air injected into the case 910 can be diffused. For example, the case 910 may have a duct shape that includes sidewalls extending from the opposite ends of the bottom portion and the bottom portion to a first height perpendicular to the bottom portion, and a cover covering the sidewalls. The area of the case 910 may be equal to or wider than the area occupied by the three application units 410a disposed along the first direction of the spin processing unit 410. [ The case 910 may be disposed above the chamber of the spin processing unit.

In one embodiment of the present invention, one side of the case 910 has an inlet 912 through which air flows. The air introduced through the inlet 912 of the case 910 forms a horizontal airflow in the inner space 914 of the case 912. [ The bottom of the case 910 has openings 916 through which the air flowing into the inner space flows down. The opening 916 may be arranged to face the spin processing unit 410a. At the opening 916, filters 990 are installed.

In the case 910, airflow control partitions 980 are installed. The airflow control partitions 980 extend in the second direction. The airflow control partitions 980 may be installed inside the lid of the case 910 with a predetermined height. The airflow control partitions 980 may be located between the openings 916. A portion of the air introduced through the inlet 912 may be downflowed through the opening 916 after hitting the airflow control partition 980. [ That is, the air introduced into the inner space of the case 910 can be classified by the airflow control partitions 980.

The damper 920 may be installed at the inlet 912 of the case 910 to control the amount of air flowing into the space 914 of the case 910.

The airflow regulating member 930 independently controls the airflow that flows down from each of the openings 916. The airflow regulating member 930 forcibly discharges the air above the opening 916 to the outside to control the airflow that flows down into the chamber CH through the opening 916. [

The airflow regulating member 930 may include an intake unit 932, an exhaust line 938, a flow control valve 940, a measuring unit 950, and a controller 960 .

The intake portion 932 may be installed at the upper portion of each of the openings 916. The intake portion 932 may be provided in the form of a pipe including a plurality of intake holes 933. Here, as an example, a pipe-shaped intake portion 932 is illustrated, but the intake portion 932 is not limited thereto, and may be variously modified to be capable of sucking air over the opening portion 916. [

The exhaust line 934 is connected to the intake portion 932. Although not shown, the exhaust line 934 can be connected to the main exhaust line of the substrate processing apparatus. The exhaust line 934 provides an exhaust pressure (suction pressure) to the intake portion 932.

The flow control valve 940 is installed in the exhaust line 934. The flow rate regulating valve 940 is controlled by the controller 960.

9 is a diagram showing a uniform wind speed in the spin processing unit.

Each measurement unit 950 measures the wind speed to be flowed down through the corresponding opening 916. The measured information is supplied to the controller 960. The controller 960 compares the information provided from the measuring units 950 with predetermined information to control the opening and closing amount of the flow control valve 940. [ For example, when the measured information (wind speed) is relatively higher than the predetermined information, the control unit 960 increases the opening and closing amount of the flow control valve 940, 932 is increased, the wind speed downstream from the opening 916 is reduced.

In this way, the air conditioning system 900 can independently control the airflow that flows down from each of the openings.

As another example, the measuring unit 950 may be a pressure measuring means installed in the inner space 914 adjacent to the opening 916 to measure the internal pressure. The control unit 960 can control the flow rate control valve according to the pressure value measured by the measurement unit.

The foregoing description is merely illustrative of the technical idea of the present invention, and various changes and modifications may be made by those skilled in the art without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents should be construed as falling within the scope of the present invention.

900: air conditioner 910: case
920: damper 930: air flow regulating member
932: intake part 938: exhaust line
940: Flow control valve 950: Measuring section
960:

Claims (17)

A case having an inlet through which air flows, an inner space through which air introduced through the inlet is diffused, and openings through which the air flowing into the inner space flows down;
A damper installed at the inlet to regulate a flow rate of air; And
And an air flow regulating member provided in the inner space and independently controlling an air flow to be downflowed from each of the openings;
The airflow regulating member
And forcibly discharging the air above the opening portion to the outside to control the airflow flowing down through the opening portion. delete A case having an inlet through which air flows, an inner space through which air introduced through the inlet is diffused, and openings through which the air flowing into the inner space flows down;
A damper installed at the inlet to regulate a flow rate of air; And
And an air flow regulating member provided in the inner space and independently controlling an air flow to be downflowed from each of the openings;
The airflow regulating member
An intake unit installed on each of the openings and having a plurality of intake holes;
An exhaust line connected to the intake unit to provide a suction force to the intake unit; And
And a flow control valve installed in the exhaust line. The method of claim 3,
The airflow regulating member
A wind speed measuring unit for measuring a wind speed to flow down through the opening; And
And a control unit for controlling the flow rate control valve according to the wind speed measured by the wind speed measurement unit. The method of claim 3,
The airflow regulating member
A pressure measuring unit installed in the inner space adjacent to the opening to measure the inner pressure; And
And a control unit for controlling the flow rate control valve in accordance with the pressure measured by the pressure measurement unit. The method according to claim 1,
Wherein the case is provided between the openings and further comprises an airflow control partition wall arranged to collide with the airflow flowing in the inner space. The method according to claim 1,
And a filter installed in the opening. A chamber having a processing space;
Substrate processing units arranged in a line in a processing space of the chamber;
An air conditioning apparatus installed at an upper portion of the chamber, the air conditioning apparatus providing a downward current to the processing space of the chamber;
The air-
A case having an inlet through which air flows, an inner space through which air introduced through the inlet is diffused, and openings through which the air introduced into the inner space flows down to each of the substrate processing units;
A damper installed at the inlet to regulate a flow rate of air; And
And an airflow regulating member provided in the inner space and forcibly exhausting the air in the inner space to the outside to independently control the airflow that flows down from each of the openings. delete 9. The method of claim 8,
Wherein the opening is disposed to face the substrate processing unit. 9. The method of claim 8,
The airflow regulating member
And forcibly discharging the air in the inner space to the outside, thereby controlling the airflow that flows down through the opening. A chamber having a processing space;
Substrate processing units arranged in a line in a processing space of the chamber;
An air conditioning apparatus installed at an upper portion of the chamber, the air conditioning apparatus providing a downward current to the processing space of the chamber;
The air-
A case having an inlet through which air flows, an inner space through which air introduced through the inlet is diffused, and openings through which the air introduced into the inner space flows down to each of the substrate processing units;
A damper installed at the inlet to regulate a flow rate of air; And
And an air flow regulating member provided in the inner space and independently controlling an air flow that flows down from each of the openings,
The airflow regulating member
An intake unit installed on each of the openings and having a plurality of intake holes;
An exhaust line connected to the intake unit to provide a suction force to the intake unit; And
And a flow control valve installed in the exhaust line. 13. The method of claim 12,
The airflow regulating member
A wind speed measuring unit for measuring a wind speed to flow down through the opening; And
And a control unit for controlling the flow rate control valve according to the wind speed measured by the wind speed measurement unit. 13. The method of claim 12,
The airflow regulating member
A pressure measuring unit installed in the inner space adjacent to the opening to measure the inner pressure; And
And a control unit for controlling the flow rate control valve in accordance with the pressure measured by the pressure measurement unit. 9. The method of claim 8,
Wherein the case is provided between the openings and further comprises an airflow control partition wall arranged to collide with the airflow flowing in the inner space. 9. The method of claim 8,
And a filter provided in the opening. 9. The method of claim 8,
Wherein the substrate processing unit applies photoresist on the substrate.

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