KR101971827B1 - Vacuum apparatus, vacuum system, device manufacturing apparatus, device manufacturing system and device manufacturing method - Google Patents

Abstract

A vacuum apparatus of the present invention, which exhausts a plurality of processing spaces, includes: a plurality of pump units respectively exhausting any one of the plurality of processing spaces; and a plurality of pump operating units respectively connected to at least one of the plurality of pump units and operating the pump, wherein at least one of the plurality of pump units is connected to two or more pump operating units different from each other, and at least one of the pump operating units different from each other is connected to two or more pump units different from each other.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum apparatus, a vacuum system, a device manufacturing apparatus, a device manufacturing system,

The present invention relates to a vacuum device including a pump and a pump operating part.

Recently, an organic EL display device has been spotlighted as a flat panel display device. The organic EL display device is a self-luminous display, and its characteristics such as response speed, viewing angle, and thinness are superior to liquid crystal panel display, and thus various types of portable terminals typified by monitors, televisions, and smart phones are rapidly replacing existing liquid crystal panel displays . In addition, automotive displays are expanding their applications.

The element of the organic EL display device has a basic structure in which an organic material layer causing light emission is formed between two opposing electrodes (cathode electrode, anode electrode). The organic layer and the electrode metal layer of the organic EL display device are manufactured by depositing a deposition material on a substrate through a mask in which pixel patterns are formed in a vacuum chamber.

In the manufacturing line of the organic EL display device, in addition to the deposition chamber in which the organic layer and the electrode metal layer are deposited, a pump is used to maintain the internal space of the chamber such as the buffer chamber, the vortex chamber, the transport chamber, and the mask stock chamber in a vacuum state . Particularly, in order to maintain a high vacuum state, a cryostump portion is used.

The cryo pump includes a refrigerator for holding a cryogenic surface, as a pump for discharging gas by condensing or adsorbing gas molecules in the chamber on a cryogenic surface. A compressor for compressing the refrigerant is connected to the refrigerator of the cryopump.

Patent Document 1 (Japanese Unexamined Patent Publication (Kokai) No. 2000-9036) discloses a technique in which a plurality of cryo pumps are connected to a single compressor. However, when a compressor fails, all of the cryo pumps do not function, There is a problem that the exhaust in the chamber can not be performed.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a vacuum apparatus, a vacuum system, a device manufacturing apparatus, a device manufacturing system, and a device manufacturing method for stably exhausting a processing space.

A vacuum apparatus according to a first aspect of the present invention is a vacuum apparatus for evacuating a plurality of processing spaces, each of which includes a plurality of pump units for exhausting any one of the plurality of processing spaces, Wherein at least one of the plurality of pump units is connected to at least two pump operating units, and at least one of the two or more pump operating units is connected to at least one of the pump operating units, At least one of which is connected to two or more different pump units.

A vacuum apparatus according to a second aspect of the present invention is a vacuum apparatus for evacuating a plurality of processing spaces, comprising: a plurality of pumps, each of which exhausts any one of the plurality of processing spaces; Wherein the pump for discharging the first processing space among the plurality of processing spaces includes a first pump and a second pump, and the first pump and the second pump are connected to each other, Wherein one of the first and second pumps is connected to a first pump operating portion of the plurality of pump operating portions, the other one of the first pump and the second pump is connected to a second pump operating portion, The pump for exhausting the second processing space out of the processing space includes a third pump, and the third pump is connected to the second pump operating portion.

A vacuum apparatus according to a third aspect of the present invention is a vacuum apparatus for evacuating a plurality of processing spaces, comprising: a plurality of pumps each for exhausting any one of the plurality of processing spaces; Wherein the pump for discharging the first processing space among the plurality of processing spaces includes a first pump and a second pump, and the first pump and the second pump are connected to each other, Wherein one of the first and second pumps is connected to a first pump operating portion of the plurality of pump operating portions, the other one of the first pump and the second pump is connected to a second pump operating portion, Wherein one of the third pump and the fourth pump is connected to the second pump operating portion, the third pump and the fourth pump are connected to each other, And And the other of the fourth pump is connected to the third pump operating portion.

A vacuum system according to a fourth aspect of the present invention is a vacuum system for evacuating a plurality of processing spaces, including a vacuum apparatus according to the first to third aspects of the present invention and a control unit for controlling the vacuum apparatus do.

A device manufacturing apparatus according to a fifth aspect of the present invention includes a plurality of chambers, a plurality of pump units, each of which is provided in any one of the chambers, and a plurality of pump units, each of which is connected to at least one of the plurality of pump units, Wherein at least one of the plurality of pump units is connected to two or more pump operation units that are different from each other, and at least one of the two or more pump operation units is different from the other pump operation units Or more pump sections.

A device manufacturing apparatus according to a sixth aspect of the present invention comprises a plurality of chambers, a plurality of pumps each provided in any one of the plurality of chambers, and a plurality of pumps each connected to at least one of the plurality of pumps, Wherein a pump installed in a first chamber of the plurality of chambers includes a first pump and a second pump, wherein any one of the first pump and the second pump includes a plurality of And the other of the first pump and the second pump is connected to the second pump operating portion, and the pump installed in the second chamber of the plurality of chambers is connected to the third pump operating portion of the pump operating portion, And the third pump is connected to the second pump operating portion.

A device manufacturing apparatus according to a seventh aspect of the present invention is a device manufacturing apparatus comprising: a plurality of chambers; a plurality of pumps, each of which is provided in any one of the plurality of chambers; and each of the chambers is connected to at least one of the plurality of pumps, Wherein a pump installed in a first chamber of the plurality of chambers includes a first pump and a second pump, wherein any one of the first pump and the second pump includes a plurality of And the other of the first pump and the second pump is connected to the second pump operating portion and the pump installed in the second chamber of the plurality of chambers is connected to the third pump operating portion of the pump operating portion, Wherein one of the third pump and the fourth pump is connected to the second pump operating portion and the other one of the third pump and the fourth pump is connected to the third pump operating portion, Respectively.

A device manufacturing system according to an eighth aspect of the present invention includes a device manufacturing apparatus according to any one of the fifth to seventh aspects of the present invention and a control section for controlling the device manufacturing apparatus.

A manufacturing method of a device according to a ninth aspect of the present invention includes the steps of preparing a device manufacturing system according to the eighth aspect of the present invention, a step of preparing a plurality of pumps provided in any one of a plurality of chambers included in the device manufacturing system Comprising the steps of: supplying high-pressure refrigerant from two different pump actuating parts to a plurality of pumps, expanding the high-pressure refrigerant in the plurality of pumps to evacuate the one chamber, measuring the pressure in the one chamber, Measuring a pressure of the refrigerant supplied from the two pump operating portions to the plurality of pumps; and, when the pressure of the refrigerant supplied from one of the two pump operating portions is out of a predetermined range, By adjusting the output of the other pump operation part of the two different pump operation parts, And a step of controlling so as to maintain the pressure in the inherited one chamber within a predetermined range.

According to the present invention, the exhaust in the processing space can be stably performed.

1 is a schematic view of a part of a manufacturing line of an organic EL display device
2 is a schematic diagram of a vacuum apparatus according to the present invention.
3 is a view showing the connection relationship of the vacuum system according to the first embodiment of the present invention.
4 is a view showing a connection relationship of a vacuum system according to a second embodiment of the present invention.
5 is a view showing a connection relationship of a vacuum system according to a third embodiment of the present invention.
6 is a diagram showing a device manufacturing system according to a fourth embodiment of the present invention.

Hereinafter, preferred embodiments and examples of the present invention will be described with reference to the drawings. However, the following embodiments and examples are illustrative of preferred configurations of the present invention, and the scope of the present invention is not limited to these configurations. In the following description, the hardware configuration, the software configuration, the process flow, the manufacturing conditions, the size, the material, the shape, and the like of the apparatus are intended to limit the scope of the present invention unless otherwise specified no.

<Electronic Device Manufacturing Line>

1 is a plan view schematically showing a part of the configuration of a manufacturing line of an electronic device.

The manufacturing line of Fig. 1 is used, for example, in the manufacture of a display panel of an organic EL display device for a smart phone. In the case of a display panel for a smart phone, for example, organic EL is formed on a substrate of a full size (about 1500 mm x about 1850 mm) or a half-cut size (about 1500 mm x about 925 mm) Are cut out to produce a plurality of panels of small size.

As shown in Fig. 1, the film-forming cluster 1 of the production line of the organic EL display device generally comprises a plurality of film-forming chambers 11 in which processing (for example, film-forming) A plurality of mask stock chambers 12 in which front and rear masks are accommodated, and a transport chamber 13 disposed at the center thereof.

A transfer robot 14 for transferring a substrate 10 between a plurality of film deposition chambers 11 and transferring a mask between the deposition chamber 11 and the mask stock chamber 12 is provided in the transfer chamber 13. [ The carrying robot 14 may be, for example, a robot having a structure in which a robot hand for holding a substrate 10 is mounted on a multi-joint arm.

Each deposition chamber 11 is provided with a deposition apparatus (also referred to as a deposition apparatus). In the film forming apparatus, the evaporation material stored in the evaporation source is heated and evaporated by the heater, and is deposited on the substrate through the mask. A series of films such as transfer and reception of the substrate 10 with the transfer robot 14, alignment of the relative positions of the substrate 10 and the mask, fixing of the substrate 10 onto the mask, The process is automatically performed by the film forming apparatus. The deposition apparatus may be a dual stage type having two stages. In the film deposition apparatus of the dual stage type, alignment is performed with respect to another substrate 10 brought into another stage while the film formation progresses on the substrate 10 carried in one stage.

In the mask stock chamber 12, a new mask and a used mask to be used in the film forming process in the film forming chamber 11 are stored in two cassettes. The transfer robot 14 transfers the used mask from the film formation chamber 11 to the cassette of the mask stock chamber 12 and transfers a new mask stored in another cassette of the mask stock chamber 12 to the deposition chamber 11, .

The film formation cluster 1 of the production line of the organic EL display device is provided with a pass room 15 for transferring the substrate 10 from the upstream side in the flow direction of the substrate 10 to the film formation cluster 1, 1 is connected to the buffer chamber 16 for transferring the substrate 10 on which the film formation process has been completed to another film formation cluster on the downstream side. The transfer robot 14 of the transfer chamber 13 receives the substrate 10 from the pass space 15 on the upstream side and transfers the substrate 10 to one of the deposition chambers 11 (for example, the deposition chamber 11a) ). The transport robot 14 receives the substrate 10 on which the film formation process in the film formation cluster 1 has been completed from one of the plurality of the film formation chambers 11 (for example, the film formation chamber 11b) To the buffer chamber (16).

A vortex chamber 17 is provided between the buffer chamber 16 and the pass chamber 15 for changing the direction of the substrate. As a result, the orientation of the substrate in the upstream-side film-forming clusters and the downstream-side film-forming clusters becomes the same, facilitating the substrate processing.

Chambers such as the deposition chamber 11, the mask stock chamber 12, the transfer chamber 13, the buffer chamber 16, the vortex chamber 17 and the like constituting the production line of the organic EL display device are fabricated in the manufacturing of the organic EL display panel During the process, it remains in a high vacuum state. To this end, a pump, particularly a cryo pump, is installed in these chambers for evacuating the space in the chamber. A vacuum exhaust pump (for example, a rough exhaust pump described later) is also provided in the pass room 15, but a cryo pump for high vacuum exhaust may or may not be provided.

1, the structure of the manufacturing line of the organic EL display device of the present invention has been described. However, the structure of the device manufacturing line of the present invention is not limited to this, and it is also possible to have different kinds of chambers, It may be different.

Hereinafter, the structure of a vacuum device and a vacuum system for evacuating the film formation chamber 11, taking the film formation chamber 11 as an example, will be described.

<Vacuum system and vacuum system>

2 schematically shows a deposition chamber 11 provided with a vacuum apparatus (or a vacuum system).

A substrate holder 112 for holding the substrate 10 and a mask holder 113 for holding the mask 18 are installed on an upper portion of the deposition chamber 11 do. A loading / unloading valve 114 for loading / unloading the substrate 10 or the mask 18 is provided on a sidewall of the deposition chamber 11 facing the transfer chamber 13.

In the film formation chamber 11, a vacuum system for evacuating the processing space in the film formation chamber 11 is provided. The vacuum system of the present invention includes a vacuum device and a control unit 24. The vacuum device is connected to the film formation chamber 11 to perform a high vacuum discharge (e.g., 10 ^-8 Torr) A cryo pump 20 and a rough exhaust pump 21 for performing low vacuum evacuation (for example, 10 ^-3 Torr) of the internal space of the deposition chamber 11 and a pump operation (22).

The cryopump 20 is connected to the deposition chamber 11 by placing an exhaust port 115 provided on the bottom surface of the chamber of the deposition chamber 11 and a valve for high vacuum exhaustion 116.

The cryo pump 20 is a pump for exhausting the internal space of the film formation chamber 11 to a high vacuum by condensing or adsorbing gas molecules in the chamber on a cryogenic temperature surface. The cryo pump 20 includes a cryogenic plate (also called a cryo panel) And a freezer (not shown) for lowering the temperature of the plate. A porous layer (not shown) is formed on the surface of the cryogenic plate to collect the condensed gas and moisture. The refrigerator of the cryo pump 20 lowers the temperature of the cryogenic plate to a predetermined temperature by expanding the refrigerant (for example, helium) compressed at a high pressure to a low pressure.

A plurality of (for example, two) cryo pumps 20 are provided in the film formation chamber 11. [ As a result, the processing time Tact can be reduced by increasing the vacuum evacuation speed, and even when vacuum evacuation by one cryopump 20 connected to the deposition chamber 11 is not properly performed, The inside of the deposition chamber 11 can be kept in a high vacuum state by the vacuum pump 20.

The pump operating portion 22 compresses the helium used as the refrigerant of the cryopump 20 to a high pressure to provide the high pressure helium refrigerant to the freezer of the cryopump 20. [ The refrigerant compressed at the high pressure in the pump operating portion 22 and the refrigerant expanded at the low pressure in the refrigerator of the cryo pump 20 are discharged through the refrigerant piping 23 between the pump operating portion 22 and the cryo pump 20 Flows. The refrigerant pipe (23) is provided with a refrigerant pressure sensor (25) for sensing the pressure of the refrigerant. This allows the pump operating portion 22 to compress the refrigerant with a sufficient pressure, that is, to determine whether the pump operating portion 22 is operating normally, as described later.

The rough exhaust pump 21 is connected to the deposition chamber 11 through a rough exhaust valve 118 provided in the chamber wall of the deposition chamber 11. It pumps for rough exhaust 21, a cryo-pump 20 is prior to evacuating the inner space of the deposition chamber 11 at a high vacuum state, the interior space of the chamber 11, a low vacuum (e.g., 10 ^{- 3} Torr). As a result, high vacuum exhausting by the cryopump 20 can be performed. The rough exhaust pump 21 may be a rotary pump or the like which does not normally require a pump operating portion, but the present invention is not limited thereto.

The control unit 24 controls the vacuum exhaust operation of the vacuum apparatus. The control unit 24 controls the degree of vacuum in the chamber measured by the chamber pressure sensor 117 provided in the vacuum chamber of the deposition chamber 11, the refrigerant pressure sensed by the refrigerant pressure sensor 25 provided in the refrigerant pipe 23, The operation of the cryopump 20, the pump operating portion 22 connected to the cryopump 20, and the rough exhaust pump 21, etc., based on the temperature of the cryogenic plate detected by the temperature sensor installed in the freezer of the ophthalmologic pump 20, . Further, the control unit 24 may be included in the pump operating unit 22.

Hereinafter, a process of vacuum evacuating the inner space of the deposition chamber 11 using the vacuum apparatus of the present invention will be described.

When the vacuum evacuation is started, the rough evacuation pump 21 is operated to make the internal space of the deposition chamber 11 a low vacuum state. That is, the rough discharge valve 118 provided in the chamber wall of the deposition chamber 11 is opened, and the rough discharge pump 21 is operated to discharge the inside of the deposition chamber 11 to a predetermined low vacuum state.

The cryo pump 20 operates in a state in which the high vacuum exhaust valve 116 is closed to cool the cryo-plate 20 of the cryo pump 20 to a predetermined temperature. That is, the helium refrigerant compressed at a high pressure in the pump operating portion 22 is supplied to the cryo pump 20, and the high-pressure helium refrigerant expands adiabatically at low pressure in the freezer of the cryo pump 20, Cool to a cryogenic temperature. Thereby, the inside of the cryo pump 20 becomes a high vacuum atmosphere.

The exhaust to the low vacuum state and the operation of the cryopump 20 may be performed either before.

The pressure in the deposition chamber 11 is set to a predetermined low vacuum pressure by the rough exhaust pump 21 and the cryo pump 20 reaches a predetermined cryogenic temperature so that the cryo pump 20 is in a high vacuum When the atmosphere is established, the rough exhaust valve 118 is closed, the high vacuum exhaust valve 116 is opened, and the gas and moisture remaining in the deposition chamber 11 are condensed / Adsorbed and trapped / fixed, so that the inner space of the film formation chamber 11 is exhausted in a predetermined high vacuum atmosphere. That is, the gas or moisture remaining in the deposition chamber 11 even after the low vacuum evacuation condenses the solid with a relatively high solidifying point, and the low solidifying point is trapped in the inner space of the porous material having a large surface area provided on the cryogenic plate surface Gas and water remaining in the deposition chamber 11 are removed, and the substrate is exhausted in a high vacuum state.

When the internal space of the film formation chamber 11 is in a predetermined high vacuum state, the substrate / mask loading / unloading valve 114 is opened and the substrate or mask is brought into the film formation chamber 11 from the high- do. The substrate or mask carried into the deposition chamber 11 is held in the substrate holder 112 and the mask holder 113 and the relative position of the substrate and the mask is adjusted by an alignment system not shown.

After the relative position of the substrate and the mask is adjusted to a high degree, a shutter (not shown) is opened, and an evaporated organic material or metal material for electrodes is heated on the evaporation source 111 and is deposited on the substrate 10 through the mask 18 .

&Lt; Connection structure of pump and pump operating part >

3 to 5, a connection structure of the pump (pump section) and the pump operating section in the vacuum apparatus / vacuum system according to the present invention will be described.

3 to 5, the vacuum device / vacuum system according to the present invention includes a plurality of pump units 30, 31, 32, etc. and a plurality of pump operation units 22a, 22b, 22c, ).

Each pump section is installed in each chamber defining a processing space for performing vacuum evacuation, and includes one or more pumps (e.g., a cryo pump).

In the vacuum apparatus / vacuum system according to the present invention, the pump section for evacuating the internal space of at least one of the chambers is connected to two or more different pump operating sections. The pump operation portion is a supply portion for supplying power or compressed refrigerant or the like to operate the pump. When the pump is a cryo pump, a compressor is used. When the pump is a rotary pump and a turbo molecular pump, a power source is used. The pump is not limited to these pumps, and the supply part may be used depending on the type of the pump.

Accordingly, even if any one of the two or more different pump operation units connected to the pump unit fails and can not operate normally, the pump unit completely stops operating so that the internal space of the chamber can not be maintained in a vacuum state Can be prevented.

In addition, at least one of the two or more different pump operating portions connected to the one pump portion is also connected to another pump portion other than the corresponding pump portion. Thereby, the number of necessary pump operating parts can be reduced, cost and power consumption can be reduced, and the space in the manufacturing line can be efficiently used.

The control unit (24) of the vacuum system according to the present invention controls the operation of the plurality of pump operating units. Thereby, the entire pump operating section can be controlled by one control section, and the configuration is simplified.

Hereinafter, a connection structure between the pump section and the pump operating section in the vacuum apparatus / vacuum system according to each embodiment of the present invention will be described.

First Embodiment

The vacuum apparatus / vacuum system according to the first embodiment of the present invention is for evacuating the internal space of two chambers (the first chamber and the second chamber), and as shown in FIG. 3 (a) A first pump section 30 connected to one chamber (for example, the deposition chamber 11a) for exhausting the internal space thereof and a second pump section 30 connected to the second chamber (for example, the deposition chamber 11b) And a second pump unit 31 for performing the above operation.

The first pump unit 30 includes a first pump 20a and a second pump 20b for evacuating the first chamber in a high vacuum state and the second pump unit 31 is connected to the high- And a third pump 20c for evacuating the exhaust gas. The number of the pumps constituting the pump unit for evacuating the internal space of the chamber may be determined in consideration of the volume of the chamber, the vacuum evacuation speed, and the like. The first pump to the third pump according to the first embodiment of the present invention may be the cryo pump described with reference to FIG. 2, but the present invention is not limited thereto.

The first pump 20a is connected to the first pump operating portion 22a and receives refrigerant compressed at a high pressure from the first pump operating portion 22a. The second pump 20b is connected to the second pump operating portion 22b rather than the first pump operating portion 22a. Accordingly, the pumps 20a and 20b of the first pump unit 30 for evacuating the first chamber are connected to the two pump operation units 22a and 22b, which are different from each other.

In the prior art, two cryo pumps for evacuating one chamber were connected to the same pump operating part. As a result, if the pump operating part fails, the operation of all of the cryo pumps for evacuating the chamber is stopped, so that the chamber can not be maintained in a high vacuum state.

In contrast, in the present invention, since the two pumps 20a and 20b included in the first pump section 30 connected to the first chamber are connected to the two pump operation sections 22a and 22b, which are different from each other, It is possible to maintain the high vacuum state in the first chamber by increasing the output of the other pump operating portion even if any one of the pump operating portions fails and the time until the preparation for proceeding maintenance of the failed pump operating portion is made You can earn.

The third pump 20c of the second pump section 31 is connected to the second pump operating section 22b and receives the refrigerant compressed at a high pressure from the second pump operating section 22b.

By using the second pump operating portion 22b connected to the second pump 20b of the first pump portion 30 without separately providing the pump operating portion for supplying the high pressure refrigerant to the third pump 20c, And the second pump operating portion 22b are connected to two different pumps 20b and 20c, the number of pump operating portions used for evacuating the first chamber and the second chamber can be reduced.

As shown in FIG. 3 (b), in the modification of the first embodiment of the present invention, the second pump portion 31 for evacuating the second chamber is connected to the third pump 20c, 20d. And the fourth pump 20d is connected to the first pump operating portion 22a.

As a result, even if the second pump operating portion 22b for supplying the high-pressure refrigerant to the third pump 20c fails, the output of the first pump operating portion 22a connected to the fourth pump 20d The high vacuum state in the first chamber and the second chamber can be maintained without increasing the number of pump operating portions

The controller 24 controls the first pump operating portion 22a and the second pump operating portion 22b and the first pump portion 30 and the second pump portion When the pressure of the refrigerant detected by the refrigerant pressure sensor 25 provided in the refrigerant pipe 23 between the refrigerant pipe 23 and the refrigerant pipe 23 is out of a predetermined range and the refrigerant is not compressed to a sufficient pressure, It is determined that the pump operation portion has failed. For example, the pressure of the refrigerant in the refrigerant pipe 23 for supplying the high-pressure refrigerant from the first pump operating portion 22a to the first pump 20a of the first pump portion 30, or the pressure of the refrigerant in the first pump operating portion 22a The pressure of the refrigerant supplied to the fourth pump 20d of the second pump portion 31 falls below a predetermined range, it is determined that the first pump operating portion 22a has failed.

In this case, the control unit 24 controls the second pump 20b of the first pump unit 30 and the second pump operation unit 22b connected to the third pump 20c of the second pump unit 31 By increasing the output, the pressure in the first chamber and the second chamber can be maintained within a predetermined high vacuum range.

In the first embodiment and its modification of the present invention, since the vacuum device / vacuum system is constituted by the two pump parts 30 and 31 and the two pump operating parts 22a and 22b, The connection between the pump in the pump section and the pump operating section becomes simple, and the maintenance wiring relationship becomes easy to understand. In addition, since the two pump operating portions 22a and 22b can be controlled by one control portion 24, the control is simplified.

The first embodiment and its modifications of the present invention are applicable to, for example, two film forming chambers 11a and 11b or two other film forming chambers 11c and 11c disposed on the same substrate flow line in the production line of the organic EL display panel shown in FIG. , 11d, respectively, to a vacuum device / vacuum system for vacuum evacuation. This will be described later with reference to Fig.

Second Embodiment

Fig. 4 schematically shows the arrangement and connection structure of the vacuum system / vacuum system according to the second embodiment of the present invention.

The vacuum apparatus / vacuum system according to the second embodiment of the present invention is for evacuating the internal space of three chambers (first chamber, second chamber, third chamber) A first pump unit 30 for evacuating the internal space of the second chamber (for example, the first chamber 12a), a second pump unit 31 for evacuating the internal space of the second chamber (for example, the transport chamber 13) And a third pump portion 32 for evacuating the third chamber (e.g., the mask stock chamber 12b).

The first pump unit 30 includes a first pump 20a and a second pump 20b and the second pump unit 31 includes a third pump 20c and a fourth pump 20d, The third pump section 32 includes a fifth pump 20e and a sixth pump 20f. The number of pumps included in each pump unit may vary depending on the volume of the internal space of the chamber to be evacuated by the pump unit, the vacuum exhaust speed, and the like. For example, when the first pump unit 30 and the third pump unit 32 evacuate the mask stock chamber 12a and the mask stock chamber 12b having a relatively small volume, they may be constituted by only one pump have.

The vacuum system / vacuum system according to the second embodiment of the present invention includes three pump operation parts 22a, 22b, 22c connected to three pump parts.

4, the first pump 20a of the first pump unit 30 is connected to the first pump operation unit 22a, the second pump 20b is connected to the second pump operation unit 22b, Respectively. The third pump 20c of the second pump section 31 is connected to the second pump operating section 22b and the fourth pump 20d is connected to the third pump operating section 22c. The fifth pump 20e of the third pump section 32 is connected to the third pump operating section 22c and the sixth pump 20f is connected to the first pump operating section 22a.

Thereby, as in the first embodiment and its modification, at least one of the three pump units is connected to two or more different pump operating units. That is, in the second embodiment of the present invention, each of the three pump units is connected to two different compressors. Thus, even if any one of the pump operation parts connected to one pump part fails, the output of another pump operation part connected to the corresponding pump part can be adjusted so that the chamber provided with the pump part can be maintained in a high vacuum state.

For example, when the second pump operating portion 22b fails, the second pump 20b and the third pump 20c connected to the second pump operating portion 22b can not evacuate the first chamber and the second chamber, To increase the amount of vacuum evacuation by the first pump 20a which is another pump connected to the first pump 20a and the fourth pump 20d which is another pump connected to the second chamber, 22a and the output of the third pump operating portion 22c with respect to the fourth pump 20d, respectively. Thus, even if the second pump operating portion 22b fails, the inner space of the first chamber and the second chamber can be maintained in a predetermined high vacuum state.

At the same time, in order to lower the displacement of the fifth pump 20e and the sixth pump 20f of the third pump portion 32 for evacuating the third chamber, the first pump operation portion 22a and the output of the third pump operating portion 22c with respect to the fifth pump 20e are lowered so that the first chamber to the third chamber can be maintained at the same pressure.

In this way, even when the second pump operating portion 22b is broken, the first pump operating portion 22a and the third pump operating portion 22c can be operated at the same vacuum level while maintaining the first to third chambers at the same degree of vacuum. It is possible to prevent the load from exceeding the performance, and it is possible to prevent the first pump operating portion 22a and the third pump operating portion 22c from being overloaded.

The output control of the pump operating section is performed by the control section 24 based on the refrigerant pressure detected by the refrigerant pressure sensor 25 provided in the refrigerant pipe between the pump operating section and the pump section.

As described above, according to the vacuum apparatus / vacuum system of the second embodiment of the present invention, even when the number of the pump operating portions is prevented from increasing, even when any one of the pump operating portions fails, .

Third Embodiment

5 schematically shows a connection structure of n pump units and n pump operation units for evacuating n chambers (n is an integer of 4 or more), respectively, according to the third embodiment of the present invention .

A vacuum apparatus / vacuum system according to a third embodiment of the present invention includes n pump sections for evacuating n chambers (n is an integer of 4 or more) and evacuating n chambers connected to n pump sections .

In the third embodiment of the present invention, the k-th pump section for evacuating the internal space of the k-th chamber (1? K? N-1) includes a 2k-1 pump and a 2k-th pump. The second k-1 pump is connected to the k-th pump operating portion, and the second k-th pump is connected to the (k + 1) -th pump operating portion. The n-th pump section for evacuating the inner space of the n-th chamber includes a 2n-1 pump and a 2n-th pump, the 2n-1 pump is connected to the n-th pump operating part, And is connected to the operation unit.

That is, two pump operating parts are connected to each pump part, and each of the pump operating parts is connected to two different pump parts for evacuating the internal space of two different chambers.

Thereby, it is possible to prevent the problem that the pump unit connected to the pump operation unit stops completely when one of the pump operation units fails, while suppressing an increase in the number of pump operation units.

In addition, the control unit 24 of the vacuum system according to the third embodiment adjusts the outputs of other normally operating pump operating parts in the same manner as in the first and second embodiments, even if any one of the pump operating parts fails, It is possible to control so that the pressures in all of the chambers evacuated by the valves are kept equal.

For example, when the k-th pump operation section fails, the second k-1 pump of the k-th pump section and the second k-2 pump of the k-1 pump section connected thereto are stopped, In order to keep the internal space of the k-th chamber at a predetermined pressure range, the displacement of the second k-3 pump, which is another pump installed in the k-1 chamber, and the second pump, which is another pump installed in the k-th chamber, is increased. To this end, the output of the (k-1) th pump operating part for the 2k-3 pump and the output of the (k + 1) th pump operating part for the 2k th pump are increased.

Further, in order to prevent the load applied to the k-th pump operation portion and the (k + 1) th pump operation portion from becoming larger than the performance of the corresponding pump operation portion, 1 pump of the (k + 1) pump operating portion. Likewise, by reducing the output to each pump of the other normal pump actuating part, it is possible to control so that the vacuum pressure in each chamber can be maintained in an equivalent state, even if the operation of some pumps is stopped due to the failure of the k-th pump actuating part .

In the third embodiment of the present invention, each pump section includes two pumps and each pump operating section is connected to two different pumps. However, the present invention is not limited to this, and at least one of the plurality of pump sections The two pumps may be connected to two different pump operating parts. Further, at least one of the two different pump operating portions may be connected to another third pump.

In the third embodiment of the present invention, since the n pump sections are connected to the n pump operation sections in order to evacuate four or more n chambers, it is possible to control the n pump operation sections through one control section And the configuration is simplified.

However, the present invention is not limited to this, and four or more n pump sections may be divided into two pump sections or three pump section groups, and two pump operation sections or three pump operation sections, respectively, It may be connected in the same manner as in the embodiment. For example, in the case of evacuating six chambers to six pump sections and six pump operating sections, the pump section and the pump operating section are connected to each other by dividing them into three groups of two pump sections, as in the first embodiment or its modification Alternatively, the pump unit and the pump operation unit may be connected as in the second embodiment by dividing the pump unit into two groups by three pump units. The two pump portions may be connected in the same manner as in the first embodiment or the modification thereof, and the three pump portions may be connected in the same manner as in the second embodiment, and the remaining one pump portion may be connected to only one pump operating portion.

Fourth Embodiment

6 schematically shows a connection structure between a pump section and a pump operating section, to which the technical idea of the present invention is applied, in a manufacturing line of an organic EL display panel.

In a fourth embodiment of the present invention, a plurality of chambers constituting a production line of an organic EL display panel are divided into a plurality of groups each including at least two chambers, and a pump And the pump operating portion.

For example, as shown in Fig. 6, the first film formation chamber 11a and the second film formation chamber 11b are formed as one group, and the third film formation chamber 11c and the fourth film formation chamber 11d are formed as another group As a group, a pump unit and a pump operating unit for evacuating the chamber in each group are connected in the same manner as in the modification of the first embodiment of the present invention.

As described above, by providing a separate vacuum / vacuum system in the first film formation chamber 11a and the second film formation chamber 11b and in the third film formation chamber 11c and the fourth film formation chamber 11d, Even if a failure occurs in one of the vacuum apparatus / vacuum system (for example, the pump operating section), the processing of the substrate through the other group can be normally performed without stopping.

In the production line of the organic EL display panel, the substrate transferred to the pass room 15 through the buffer chamber 16a and the vortex chamber 17 on the upstream side is transferred to the first film formation chamber 11a and the second film formation chamber The downstream buffer chamber 16b after the film formation process while passing through the third film formation chamber 11c and the fourth film formation chamber 11d or the downstream side buffer chamber 16b after the film formation process through the third film formation chamber 11c and the fourth film formation chamber 11d, &Lt; / RTI &gt; or may be processed with two flows.

Here, for example, even when the pump operating section connected to the pump section for evacuating the first film forming chamber 11a fails, the pump section and the pump operating section are connected according to the modified example of the first embodiment of the present invention, The vacuum degree in the first film formation chamber 11a can be maintained at a level equivalent to that of the second film formation chamber 11b by the other pump operation portion. Therefore, the film forming process for the substrate can be completed and transferred to the downstream side without discarding the substrate that has been film-formed in the first film formation chamber 11a. However, it is difficult to evacuate the two film deposition chambers for a long time by using only the other pump operating portion, which may be a burden on the other pump operating portion. Therefore, the flow of the substrate through the corresponding line is stopped at a proper time, The maintenance of the operating portion is performed. Even in the case where the flow of the substrate passing through the first film formation chamber / the second film formation chamber is stopped for maintenance, according to the configuration of the fourth embodiment of the present invention, The substrate flow does not have to stop, and the processing of the substrate can be continuously performed. Alternatively, if the first film forming chamber and the third film forming chamber are evacuated by one vacuum device / vacuum system, if the pump operating part of the vacuum device of one of the film forming chambers fails and maintenance is to be performed, Since both substrate flows must be stopped, the entire processing line of the substrate is stopped.

According to the fourth embodiment of the present invention, the first mask stock chamber 12a, the transfer chamber 13, and the second mask stock chamber 12b are connected to the vacuum evacuation / vacuum system of the second embodiment of the present invention, do. Accordingly, even if any one of the pump operating parts in the vacuum device for evacuating these three chambers fails, the degree of vacuum in these three chambers can be maintained to the same degree by adjusting the output of the other pump operating part. However, the present invention is not limited to this configuration, and the vacuum apparatus / vacuum system may have a different arrangement structure.

For example, a mask used for film formation of a substrate passing through the first film formation chamber 11a / the second film formation chamber 11b is accommodated in the first mask stock chamber 12a, so that the first film formation chamber 11a, The mask stock chamber 12a and the second film formation chamber 11b may be configured to be evacuated by the vacuum apparatus / vacuum system of the second embodiment of the present invention. Similarly, the third film formation chamber 11c, the second mask stock chamber 12b, and the fourth film formation chamber 11d can be configured to be evacuated by another vacuum device / vacuum system according to the second embodiment. In this case, the transport chamber 13 can be configured to be evacuated by another separate vacuum device / vacuum system. Particularly, when the pump operating portion of the vacuum chamber of the transfer chamber 13 fails, the entire line is stopped. Therefore, the pump portion for vacuum evacuating the transfer chamber 13 is connected to two or more pump operating portions .

Thus, even if one of the pump operation parts connected to the pump part for evacuating the first mask stock chamber 12a is broken and maintenance is performed, the third film formation chamber 11c / the fourth film formation chamber 11d The substrate processing can be continued without stopping the flow of the substrate.

In the fourth embodiment of the present invention shown in Fig. 6, the pump section for evacuating the buffer chamber 16a and the vortex chamber 17 to vacuum is connected to one pump operating section as in the prior art, The invention is not limited thereto, and a vacuum device / vacuum system may be constructed according to the first embodiment / modification of the present invention.

Since the pass room 15 does not require a high vacuum unlike the other chambers, normally only the rough pump is installed without installing the cryo pump, so that the vacuum system / vacuum system provided in the pass room 15 The pump operating portion is not included, but the cryopump may be provided in the pass room 15. [ In this case, the pass room 15 may be evacuated to a vacuum apparatus / vacuum system according to the second embodiment of the present invention together with two other chambers (for example, the buffer chamber 16a and the vortex chamber 17) , And another vacuum chamber (for example, the transport chamber 13), to the vacuum apparatus / vacuum system according to the first embodiment of the present invention.

Each of the pump actuating parts used in the vacuum device / vacuum system according to the present invention may have different output performance depending on the volume of the internal space of the chamber in which the pump part connected to the corresponding pump actuating part is connected.

&Lt; Vacuum exhaust method and device manufacturing method using the same &

A method of evacuating each chamber in a manufacturing line of an organic EL display panel in which a vacuum device / vacuum system according to the present invention is used, and a method of manufacturing a device using the method are described below.

First, a plurality of chambers are evacuated by a plurality of pump units provided in a plurality of chambers constituting a manufacturing line (S1). At this time, the vacuum evacuation of the plurality of chambers may be performed at the same time, or may be performed sequentially, or in a predetermined order in accordance with the flow on the substrate / mask production line.

Vacuum evacuation can be performed through two steps of a low vacuum evacuation step and a high vacuum evacuation step. That is, it is evacuated to the low vacuum pressure by the rough exhaust pump 21 included in the vacuum system / vacuum system, and then to the high vacuum pressure using the cryo pump 20 which is the high vacuum exhaust pump have. The high vacuum evacuating step includes a step of compressing the refrigerant to a high pressure in two different pump operating parts (first pump operating part and second pump operating part) connected to one pump part, A step of supplying the high-pressure refrigerant to the two cryo pumps of the pump unit through the refrigerant pipe, the step of thermally expanding the high-pressure refrigerant in the refrigerators of the two cryo pumps to lower the temperature of the refrigerant to a cryogenic temperature, And cooling the cryogenic plates of the two cryo pumps to a predetermined temperature using a refrigerant.

The pressure of the refrigerant supplied from the pump operating portion to the pump portion is measured by the refrigerant pressure sensor 25 provided in each of the plurality of pump operating portions or the plurality of pump operating portions for supplying the high pressure refrigerant to the plurality of pump portions S2).

The pressure of the refrigerant supplied to the two different pump units (the first pump unit and the nth pump unit) connected thereto from any one of the pump operation units (for example, the first pump operation unit) The output to the first pump section of the second pump operating section, which is another pump operating section connected to the first pump section to which the first pump operating section is connected, and the output to the nth pump section to which the first pump operating section is connected The controller controls the output of the first pump section connected to the first pump section and the pressure of the n-th chamber to which the n-th pump section is connected to be maintained within a predetermined range by adjusting the output of the n-th pump section of the n-th pump operating section, (S3). The output control of the pump operating section is performed by the control section 24. [

At the same time, the output of the second pump operating part to the second pump part, which is another pump part connected to the second pump operating part, and the output of the nth pump operating part to the nth pump part connected to the nth pump operating part , The total output of the second pump operating portion and the total output of the nth pump operating portion are controlled so as not to exceed the output limits of the respective pump operating portions. The control unit 24 controls the output of the other pump operating unit that operates normally so that the pressures in the respective chambers are equal to each other.

This makes it possible to maintain the pressure in the plurality of chambers equally within a predetermined range that does not affect the device manufacturing process even when one or more of the pump operating parts fail.

A method of manufacturing a device such as an organic EL display device by forming an organic layer or an electrode metal layer on a substrate in a deposition chamber 11 equipped with a vacuum device / vacuum system according to the present invention will be described below.

First, high-pressure refrigerant is supplied from two or more different pump operating parts to the pump part provided in the film formation chamber 11, the high-pressure refrigerant is adiabatically expanded from two or more pumps in the pump part, do.

The mask and the substrate are carried into the film forming chamber 11 exhausted in a desired high vacuum state.

Thereby adjusting the relative position of the mask and the substrate.

The evaporated evaporation material is evaporated from the evaporation source on the substrate through the mask with the relative position adjusted.

While the film-forming step is performed from the carrying-in step, the pressure in the film-forming chamber 11 is measured by the chamber pressure sensor 117.

When the measured pressure in the chamber is out of a predetermined range, the pressure of the refrigerant supplied from two or more different pump operating portions connected to the pump portion provided in the deposition chamber is measured.

When the pressure of the refrigerant supplied from any one of the pump operating portions is out of a predetermined range, the refrigerant compressing operation by the corresponding pump operating portion is stopped, and the refrigerant compressing operation of the other pump operating portion connected to the corresponding pump portion Output and the output to another pump section connected to the other pump operating section are controlled so that the pressure of the other deposition chamber evacuated by the deposition chamber and the other pump section is controlled within a predetermined range.

According to this method, even if one of two or more different pump operating portions for supplying high-pressure refrigerant to the pump portion provided in the deposition chamber fails, the deposition chamber can be maintained in a predetermined pressure range, It is not necessary to immediately stop the film forming process of the film forming chamber, and the film forming process in the film forming chamber can be normally proceeded until it is ready for maintenance.

The above-described embodiment shows an example of the present invention, and the present invention is not limited to the configuration of the above-described embodiment, and may be appropriately modified within the scope of the present invention.

1: Tape Clusters
11: Deposition chamber (treatment chamber)
12: mask stock chamber
13: Carrier
14: Transfer robot
15: Pass room
16: buffer chamber
20: Cryo pump
20a, 20b, 20c, 20d, 20e, 20f: first to sixth pumps
21: Rough exhaust pump
22: Pump operating part
22a, 22b, 22c: a first pump operating portion to a third pump operating portion
23: Refrigerant piping
24:
25: Refrigerant pressure sensor
30: First pump section
31: Second pump section
32: Third pump section

Claims (29)

A vacuum system for evacuating a plurality of processing spaces,
A plurality of pump units each for exhausting any one of the plurality of processing spaces;
A plurality of pump operating portions each connected to at least one of the plurality of pump portions to operate the pump,
Detection means for detecting a failure of the plurality of pump operation portions or the plurality of pump portions,
And a control section for controlling the plurality of pump sections, the plurality of pump operating sections, and the detecting section,
At least one of the plurality of pump units is connected to two or more different pump operating units,
At least one of the two or more different pump operating portions is connected to two or more different pump portions,
Wherein when the detection means detects at least one pump operation part of at least two pump operation parts or at least one pump included in the at least one pump part by the detection part, By adjusting the output of the pump operation portion to which another pump operation portion of two or more different pump operation portions, or another pump included in the at least one pump portion, is connected, the pressure in the processing space to which the at least one pump portion is connected To be controlled within a predetermined range
Vacuum system. The method according to claim 1,
Wherein the first pump portion for exhausting the first processing space among the plurality of processing spaces includes a first pump and a second pump,
Wherein one of the first pump and the second pump is connected to the first pump operating portion of the plurality of pump operating portions and the other one of the first pump and the second pump is connected to the second pump operating portion
Vacuum system. A vacuum system for evacuating a plurality of processing spaces,
A plurality of pumps each for exhausting any one of the plurality of processing spaces;
A plurality of pump operating portions, each of which is connected to at least one of the plurality of pumps,
Detection means for detecting a failure of the plurality of pump operation portions or the plurality of pumps,
And a control section for controlling the plurality of pumps, the plurality of pump operating sections, and the detecting section,
Wherein the pump for exhausting the first processing space among the plurality of processing spaces includes a first pump and a second pump,
Wherein one of the first pump and the second pump is connected to a first pump operating portion of the plurality of pump operating portions and the other one of the first pump and the second pump is connected to the second pump operating portion And,
Wherein the pump for exhausting the second processing space among the plurality of processing spaces includes a third pump,
The third pump is connected to the second pump operating portion,
Wherein the control unit controls at least one pump operating part of two or more different pump operating parts connected to a pump for evacuating any one of the plurality of processing spaces by the detecting device, When detecting failure of at least one pump out of the pumps for exhausting the processing space, connecting to another pump operating part of the two or more different pump operating parts, or to another pump among the pumps for exhausting the one processing space By controlling the output of the pump operation section, the pressure within the one processing space is maintained within a predetermined range
Vacuum system. The method of claim 3,
Wherein the pump for exhausting the second processing space further comprises a fourth pump,
And the fourth pump is connected to the first pump operating portion,
Vacuum system. A vacuum system for evacuating a plurality of processing spaces,
A plurality of pumps each for exhausting any one of the plurality of processing spaces;
A plurality of pump operating portions, each of which is connected to at least one of the plurality of pumps,
Detection means for detecting a failure of the plurality of pump operation portions or the plurality of pumps,
And a control unit for controlling the plurality of pumps, the plurality of pump actuating units, and the detecting unit
Including,
Wherein the pump for exhausting the first processing space among the plurality of processing spaces includes a first pump and a second pump,
Wherein one of the first pump and the second pump is connected to the first pump operating portion of the plurality of pump operating portions and the other one of the first pump and the second pump is connected to the second pump operating portion ,
Wherein the pump for exhausting the second processing space among the plurality of processing spaces includes a third pump and a fourth pump,
Wherein one of the third pump and the fourth pump is connected to the second pump operating portion and the other one of the third pump and the fourth pump is connected to the third pump operating portion,
Wherein the control unit controls at least one pump operating part of two or more different pump operating parts connected to a pump for evacuating any one of the plurality of processing spaces by the detecting device, When detecting failure of at least one pump out of the pumps for exhausting the processing space, connecting to another pump operating part of the two or more different pump operating parts, or to another pump among the pumps for exhausting the one processing space By controlling the output of the pump operation section, the pressure within the one processing space is maintained within a predetermined range
Vacuum system. 6. The method of claim 5,
Wherein the pump for exhausting the third processing space among the plurality of processing spaces includes a fifth pump and a sixth pump,
Wherein one of the fifth pump and the sixth pump is connected to the third pump operating portion and the other one of the fifth pump and the sixth pump is connected to the first pump operating portion,
Vacuum system. 7. The method according to any one of claims 1 to 6,
Wherein the pump operating portion is a supply portion for supplying power or compressed refrigerant to the pump. 8. The method of claim 7,
The pump includes a cryo pump including a freezer,
Wherein the pump operating portion is a compressor for compressing refrigerant and supplying the compressed refrigerant to the freezer. The vacuum system according to claim 8, wherein the detecting means includes pressure measuring means for measuring pressure of the refrigerant supplied from the pump operating portion to the pump.
10. The refrigerating apparatus according to claim 9, wherein said detecting means detects the pressure of the refrigerant supplied from one of the two or more pump operating portions, which is measured by the pressure measuring means, , And judges that the pump operating part is malfunctioning. 7. The vacuum system according to any one of claims 1 to 6, wherein the control section controls the plurality of pump operating sections so that the pressure of the plurality of processing spaces becomes equal. A device manufacturing system comprising:
A plurality of chambers,
A plurality of pump units, each of which is installed in any one of the plurality of chambers;
Each of which is connected to at least one of the plurality of pump sections, for operating the pump,
Detection means for detecting a failure of the plurality of pump operation portions or the plurality of pump portions,
And a control section for controlling the plurality of pump sections, the plurality of pump operating sections, and the detecting section,
At least one of the plurality of pump units is connected to two or more different pump operating units,
At least one of the two or more different pump operating portions is connected to two or more different pump portions,
Wherein when the detection means detects at least one pump operation part of at least two pump operation parts or at least one pump included in the at least one pump part by the detection part, By adjusting the output of the pump operation portion to which another pump operation portion of two or more different pump operation portions, or another pump included in the at least one pump portion, is connected, the pressure in the processing space to which the at least one pump portion is connected To be controlled within a predetermined range
Device manufacturing system. 13. The method of claim 12,
Wherein the first pump unit installed in the first chamber of the plurality of chambers includes a first pump and a second pump,
Wherein one of the first pump and the second pump is connected to the first pump operating portion of the plurality of pump operating portions and the other one of the first pump and the second pump is connected to the second pump operating portion
Device manufacturing system. In a device manufacturing system,
A plurality of chambers,
A plurality of pumps, each of which is installed in any one of the plurality of chambers;
A plurality of pump operating portions, each of which is connected to at least one of the plurality of pumps,
Detection means for detecting a failure of the plurality of pump operation portions or the plurality of pumps,
And a control section for controlling the plurality of pumps, the plurality of pump operating sections, and the detecting section,
Wherein the pump installed in the first chamber of the plurality of chambers includes a first pump and a second pump,
Wherein one of the first pump and the second pump is connected to the first pump operating portion of the plurality of pump operating portions and the other one of the first pump and the second pump is connected to the second pump operating portion ,
Wherein the pump installed in the second chamber of the plurality of chambers includes a third pump,
The third pump is connected to the second pump operating portion,
Wherein the control unit controls at least one of the two or more pump operation units connected to the pump for exhausting one of the chambers by the detection unit, The pump operating part connected to the other pump among the two or more different pump operating parts, or the pump for exhausting the one chamber, of the pump operating part of the at least one pump, Controlling the output so as to maintain the pressure in the one chamber within a predetermined range
Device manufacturing system. 15. The method of claim 14,
Wherein the pump installed in the second chamber of the plurality of chambers further includes a fourth pump,
And the fourth pump is connected to the first pump operating portion,
Device manufacturing system. 16. The method of claim 15,
Wherein the first chamber and the second chamber are connected via a third one of the plurality of chambers
Device manufacturing system. 17. The method of claim 16,
Wherein the first chamber and the second chamber are evaporation chambers for depositing an organic material,
Wherein the third chamber is a transport chamber for transporting the substrate or the mask,
Device manufacturing system. In a device manufacturing system,
A plurality of chambers,
A plurality of pumps, each of which is installed in any one of the plurality of chambers;
A plurality of pump operating portions, each of which is connected to at least one of the plurality of pumps,
Detection means for detecting a failure of the plurality of pump operation portions or the plurality of pumps,
And a control section for controlling the plurality of pumps, the plurality of pump operating sections, and the detecting section,
Wherein the pump installed in the first chamber of the plurality of chambers includes a first pump and a second pump,
Wherein one of the first pump and the second pump is connected to the first pump operating portion of the plurality of pump operating portions and the other one of the first pump and the second pump is connected to the second pump operating portion ,
Wherein the pump installed in the second chamber of the plurality of chambers includes a third pump and a fourth pump,
Wherein one of the third pump and the fourth pump is connected to the second pump operating portion and the other one of the third pump and the fourth pump is connected to the third pump operating portion,
Wherein the control unit controls at least one of the two or more pump operation units connected to the pump for exhausting one of the chambers by the detection unit, The pump operating part connected to the other pump among the two or more different pump operating parts, or the pump for exhausting the one chamber, of the pump operating part of the at least one pump, Controlling the output so as to maintain the pressure in the one chamber within a predetermined range
Device manufacturing system. 19. The method of claim 18,
Wherein the pump installed in the third chamber of the plurality of chambers includes a fifth pump and a sixth pump,
Wherein one of the fifth pump and the sixth pump is connected to the third pump operating portion and the other one of the fifth pump and the sixth pump is connected to the first pump operating portion,
Device manufacturing system. 20. The method of claim 19,
Wherein the first chamber and the third chamber are connected via the second chamber
Device manufacturing system. 21. The method of claim 20,
Wherein the first chamber and the third chamber are a mask stock chamber in which a mask is housed before and after use,
Wherein the second chamber is a transport chamber for transporting the substrate or the mask,
Device manufacturing system. 22. The method according to any one of claims 14 to 21,
Wherein the pump operating portion is a supply portion for supplying power or compressed refrigerant to the pump. 23. The method of claim 22,
The pump includes a cryo pump including a freezer,
The pump operating section includes a compressor for compressing the refrigerant and supplying it to the refrigerator,
Device manufacturing system. The device manufacturing system according to claim 23, wherein the detecting means includes pressure measuring means for measuring a refrigerant supplied from the pump operating portion to the pump. 25. The method of claim 24,
When the pressure of the refrigerant supplied from any one of the two or more pump operating portions measured by the pressure measuring means deviates from a predetermined range, the detecting means detects that the pump operating portion fails Quot; device &quot; 22. The method according to any one of claims 14 to 21,
Wherein the control unit controls the plurality of pump actuating units so that the pressures in the plurality of chambers of the device manufacturing system become equal. A method of manufacturing a device,
Preparing the device manufacturing system of claim 24,
Supplying high-pressure refrigerant from two different pump operating parts to a plurality of pumps installed in any one of a plurality of chambers included in the device manufacturing system,
Expanding the high-pressure refrigerant in the plurality of pumps to evacuate the one chamber,
Measuring a pressure in the one chamber,
Measuring the pressure of the refrigerant supplied to the plurality of pumps from the two different pump operating portions, and
Wherein when the pressure of the refrigerant supplied from any one of the two pump operating portions is out of a predetermined range, the output of the other pump operating portion of the two different pump operating portions is adjusted, To maintain the pressure in said one chamber to which said pump is connected within a predetermined range
/ RTI &gt; 28. The method of claim 27,
Wherein the measuring of the pressure of the refrigerant is performed when the pressure measured in the step of measuring the pressure in the one chamber is out of a predetermined range,
/ RTI &gt; 28. The method of claim 27,
Wherein the controlling step also adjusts the output of another pump operating section that supplies high-pressure refrigerant to another pump installed in another chamber of the plurality of chambers so that the pressures in the plurality of chambers become equal.

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