KR101966780B1 - High Speed Chuck Table Rubber Ped Grinding Machine and Processing Method - Google Patents

Abstract

The present invention relates to a chuck table rubber pad high speed processing machine and a method of processing the chuck table rubber pad which can be rapidly processed as compared with a method of manufacturing a chuck table rubber pad used in semiconductor manufacturing using a conventional mold, And cutting means for cutting the chuck table rubber pad; (b) a chuck table base located at a lower end of the chuck table rubber pad and capable of moving back and forth, right and left, up and down, and rotating; And (c) control means for adjusting the longitudinal and transverse movements of the chuck table base, the left and right, and the up and down, and the rotation of the chuck table base, wherein the cutting means comprises: (i) A circular cutting wheel having a cutting edge and cutting the rubber pad by rotation; And (ii) a rotating motor for rotating the cutting wheel.

Description

TECHNICAL FIELD [0001] The present invention relates to a high speed chuck table,

The present invention relates to a chuck table rubber pad high speed processing machine and a processing method thereof, and more particularly, to a chuck table rubber pad high speed processing machine and a method of processing the chuck table rubber pad, And a method of processing the same.

Until recently, various types of package types have been introduced, but chip scale packages (CSPs) have been attracting attention in recent years. The chip scale package refers to a package having a package size of about chip level, usually a package size of 1.2 times or less the chip size. Such a chip scale package has many advantages over a typical plastic package, and in particular has the advantage of a small package size. Because of these advantages, chip scale packages are used in a wide variety of products that are compact and require mobility, such as digital camcorders, mobile phones, notebook computers, and memory cards.

However, while the chip scale package has an absolute advantage in size, it still has a number of drawbacks compared to conventional plastic packages. One is that it is difficult to secure reliability, and the other is that there are many manufacturing facilities and raw materials to be added to chip scale package manufacturing and high cost of manufacturing due to high manufacturing cost.

As one way to solve such a problem, a non-via-package has been proposed, which is one of semiconductor package manufacturing processes. Since the external connection terminal such as a solder ball can be arranged on the entire one surface of the package, the package can cope with an increase in the number of input / output pins, has a small package mounting area, is highly utilized, has excellent thermal resistance and electrical characteristics And the use thereof is gradually increasing. Among these, the non-via-package using the tape wiring substrate is a non-conductive epoxy resin adhesive on top of a tape wiring board in the form of a strip in which substrate circuit wiring is formed on a polyimide film, And grouped into a plurality of package area units to form a group mold. Such a tape wiring board is manufactured as a semifinished semiconductor chip package which is cut in a predetermined length unit and fixed to a carrier frame for easy handling during the process. When the solder ball is attached to the bonding ball land portion exposed through the hole formed in the back surface of the tape wiring substrate and the attachment is completed through a reflow process at a high temperature, .

However, in the case of the conventional chuck table used in the sawing process, since it is manufactured by using different dies depending on the size and spacing of the semiconductors, it takes a lot of time to manufacture and has a disadvantage that the manufacturing cost is considerable.

Korean Patent No. 10-0555724 discloses a chuck table for semiconductor manufacturing. In the present invention, a chuck table for cutting a semiconductor package grouped in units of a plurality of package regions is disclosed. However, the manufacturing method is disadvantageous in that it requires a lot of manufacturing time and cost because it relies on injection molding using a metal mold.

Korean Patent Publication No. 2015-0000148 discloses a chuck table and a chuck table manufacturing method. The present invention discloses a chuck table and a manufacturing method thereof that can prevent shrinkage of the adsorption pad and accordingly a phase error. However, since the rubber pad is processed by filling the molten rubber with the mold, And time is excessively consumed.

Disclosure of Invention Technical Problem [8] The present invention has been made in order to solve the problems of the prior art described above, and it is an object of the present invention to provide a chuck table rubber pad, And to provide a chuck table rubber pad high speed processing machine capable of processing rubber pads of various sizes and a processing method thereof.

As means for solving the above-mentioned technical problem,

A first aspect of the present invention is a cutting apparatus comprising: (a) cutting means for moving up and down and cutting a chuck table rubber pad; (b) a chuck table base located at a lower end of the chuck table rubber pad and capable of moving back and forth, right and left, up and down, and rotating; And (c) control means for adjusting the longitudinal and transverse movements of the chuck table base, the left and right, and the up and down, and the rotation of the chuck table base, wherein the cutting means comprises: (i) A circular cutting wheel having a cutting edge and cutting the rubber pad by rotation; And (ii) a rotating motor for rotating the cutting wheel.

The circular cutting wheel has a diameter of 80 to 120 mm, a thickness of 3 to 10 mm, a cutting edge of 5 to 20 mm along the circumferential surface, and a thickness of the cutting blade of 0.2 to 1 mm. Table rubber pad high speed machine.

The rotation motor is a spindle motor, and a channel is formed therein to supply a lubricating means.

And the chuck table includes identification means for sorting the chuck table rubber pads and for distinguishing the cutting positions of the chuck table rubber pads.

The second aspect of the present invention also provides a method of manufacturing a chuck table comprising: (a) providing a pre-fabricated chuck table rubber pad on a chuck table base having suitable identification means; (b) recognizing the identification means of the chuck table, confirming the position of the chuck table, the type of rubber pad and the cutting position; (c) supplying power and lubricating means to the rotating motor to rotate the cutting wheel; (d) moving the chuck table base back and forth, left and right, moving the cutting means up and down, cutting the chuck table rubber pads located above the chuck table base at regular intervals; And (e) rotating the chuck table base by 90 degrees and repeating the step (d) to obtain a chuck table cut to a predetermined size. And provides a processing method.

The chuck table rubber pad high speed processing machine and its processing method according to the present invention minimizes the use of a mold commonly used in conventional semiconductor manufacturing chuck table rubber pad processing machines, It is possible to process the chuck table having various sizes according to the size, so that the production cost of the chuck table for semiconductor manufacturing can be greatly reduced.

1 and 2 are a front view and a side view of a chuck table rubber pad high-speed processing machine for semiconductor manufacturing according to an embodiment of the present invention,
3 is a schematic view of a cutting wheel according to an embodiment of the present invention,
4 is a plan view of a chuck table having various shapes,
FIG. 5 is an installation view of a chuck table for semiconductor manufacturing according to an embodiment of the present invention; FIG.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In order to clearly explain the present invention, parts not related to the description are omitted, and similar parts are denoted by similar reference numerals throughout the specification.

FIG. 1 and FIG. 2 respectively show a chuck table rubber pad high-speed processor for semiconductor manufacturing according to a preferred embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a chuck table according to a first embodiment of the present invention; Fig. (b) a chuck table base located at a lower end of the chuck table rubber pad and capable of moving back and forth, right and left, up and down, and rotating; And (c) control means for controlling the vertical movement of the chuck table base, the horizontal movement, the vertical movement, and the rotation of the chuck table base.

In the present invention, the cutting means may include a circular cutting wheel 100 and a rotary motor 110. The cutting means is provided so as to be movable up and down. A circular cutting wheel 100 rotatable by a rotary motor 110 may be installed inside the cutting means. The cutting wheel 100 cuts the rubber pad of the chuck table 200 located at the lower portion of the cutting means by the rotation, and can move up and down to cut the rubber pad to an accurate depth. At this time, the rotation of the cutting wheel 100 may be performed by the motor 110, and the center of the cutting wheel 100 may be directly connected to the rotation axis of the motor 110. However, It is also possible to use the motor and the cutting wheel 100 in combination with gears. Further, when the rotation axis of the motor and the rotation axis of the cutting wheel 100 are apart from each other, a chain, a belt, or the like may be connected and rotated.

The cutting wheel 100 may have a diameter of 80 to 120 mm, a thickness of 3 to 10 mm, and a cutting blade 120 of 5 to 20 mm along the circumferential surface. The cutting wheel 100 cuts the rubber pad by rotation, and a cutting blade 120 is formed on the circumference of the cutting wheel 100. The cutting blade may be formed into a shape having a plurality of cutting teeth such as a saw, or a shape in which a sharp blade is formed along a circumferential surface without cutting teeth. In this case, the thickness of the cutting wheel 100 is 3 to 10 mm. However, since the thickness of the cutting blade 120 is 0.2 to 1 mm, cutting can not be performed beyond the thickness of the cutting blade 120, Cutting is possible. The thickness of the cutting blade 120 may be selected according to the cutting thickness of the rubber pad. If the thickness of the cutting blade 120 is less than 0.2 mm, The replacement cost may be excessive, and if the thickness exceeds 1 mm, the rubber pads are moved due to friction due to rotation during cutting, which makes it difficult to cut the rubber pads accurately.

If the diameter of the cutting wheel 100 is less than 80 mm, the rubber pad may move due to friction as the speed of the circumferential surface is relatively slow. When the cutting wheel 100 has a diameter of more than 120 mm, The blade may be damaged by friction with the rubber pad during cutting.

The cutting wheel 100 may be made of iron, aluminum, titanium, tungsten, stainless steel or an alloy of any of these materials, and more preferably tungsten And the cutting edge 120 may be diamond coated.

In the present invention, the chuck table base 300 may be provided with a chuck table 200 for cutting. The chuck table base 300 is vertically and horizontally moved so that the chuck table base 300 is cut at an accurate position according to each cutting position when the rubber pad is cut.

The chuck table base 300 and the chuck table 200 are preferably coupled to each other by a pin. When the chuck table base 300 and the chuck table 200 are fixed by bolts, it is difficult to separate the chuck table base 200 and the chuck table 200 from each other after the chuck table 200 It is necessary to separately prepare the base 300 corresponding to the size of the base 300. However, when the base 300 and the chuck table 200 are coupled using a pin, a pin hole corresponding to the size of each chuck table 200 is previously formed on the base, and the position of the pin is changed according to the size of the chuck table 200 So that the base 300 and the chuck table 200 can be simply coupled.

In addition, the chuck table 200 may include identification means for identifying the kind of the chuck table rubber pad and the cutting position. Since each chuck table 200 is different in cutting position and cutting depth according to each semiconductor, when the chuck table 200 is provided on the chuck table base 300 by having identification means for each chuck table 200 The discrimination means can be recognized and the cutting position can be automatically determined. At this time, the information identified by the identification means is stored in the following control means, and the exact position can be cut by the data according to each information. Further, since the identification means is installed at a predetermined position of the chuck table 200, it is used for initial position measurement of the chuck table 200 so that the accurate position can be cut.

In the present invention, it may include control means 400 for controlling the upper and lower parts of the cutting means and the chuck table base 300 back and forth, right and left, up and down movement and rotation. The control means 400 adjusts the front, back, right and left, up and down movement and rotation of the chuck table base 300 so that the cutting wheel 100 can be cut at an accurate position of the rubber pad. At this time, the control means 400 can use a mechanical control means which has grooves in each of the moving shafts and stops at the positions of the grooves according to the respective steps. Preferably, the position of each moving shaft is It is preferable to use an electronic means capable of controlling. It is further preferable that the electronic control means (400) is provided with a storage means so as to store the cutting position of each chuck table (200). In this case, if the same or similar chuck table 200 is fabricated in the future, it is possible to easily set the position using the stored data without resetting each position.

In the present invention, the rotary motor 110 is a spindle motor, and a duct is formed therein to supply lubricating means. A spindle motor is a motor that rotates with a constant rotation speed in a unidirectional direction. In contrast to a conventional motor in which an internal shaft around which a winding is wound is rotated, a spindle motor has a winding wound around the motor base, Means a motor in which the outer case rotates. In the case of such a spindle motor, since the number of revolutions and the rotation torque are higher than those of the conventional motor, it is preferable to use a spindle motor in the present invention.

In addition, a duct is provided in the motor 110 so that the lubricating means can lubricate the shaft inside the motor, and the lubricating means is supplied to the cutting wheel to reduce dust and heat generated when the rubber pad is machined. Since the cutting wheel rotates at a high speed and cuts the rubber pad, the rubber pad may be deteriorated or melted by frictional heat. Also, when the melted rubber pad is attached to the cutting edge 120, it takes a lot of time to remove it. Therefore, it is preferable to cool the cutting wheel 100 and the cutting blade 120 using the lubricating means, and it is also possible to cool the cutting blade 100 using compressed air if necessary.

Hereinafter, a method of manufacturing a rubber pad for a semiconductor manufacturing chuck table according to the present invention will be described in detail.

The rubber pad is first processed and inserted into the chuck table 200. In this case, the primary processing is preferably performed using a metal mold, or may be manufactured by CNC machining.

The primary chuck table 200 as described above is prepared in combination with the chuck table base 300 as shown in FIG. At this time, the chuck table base 300 and the chuck table 200 are fixed by fins, and the fins are positioned on a suitable pin hole among a plurality of pin holes preset in the chuck table base 300, The table 200 is fixed so as not to move.

After the chuck table 200 is fixed, the chuck table base 300 is moved to a predetermined position by the control means 400, and based on the information of the identification means located in the chuck table 200, The data relating to the position and the cutting position of the tool 200 is input to the control means 400. [

When cutting is started, power and lubricating means are supplied to the rotary motor 110 to rotate the cutting knife 100, and the cutting means moves up and down to perform cutting.

When the cutting means is lowered, the control means 400 moves the chuck table base 300 in the longitudinal direction to cut the rubber pads with a predetermined depth and width. Based on the information of the identification means, The cutting means rises and the chuck table base 300 returns to its original position.

When the cutting of one row is completed, the control means 400 moves the chuck table base 300 to the left and right sides based on the information of the identification means, and cuts the next position. .

After the primary cutting is completed, the control means 400 performs secondary cutting by rotating the chuck table base 300 by 90 degrees based on the information of the identification means, So that the chuck table 200 is cheered.

Hereinafter, the present invention will be described in more detail with reference to examples.

Example  One

To verify the production speed of the same chuck table, 10 chuck tables of the same kind were produced continuously.

The size of each rubber pad on the chuck table was 20 x 20 mm and the spacing between the rubber pads was 0.6 mm.

The cutting wheel used was 100 mm in size, 0.6 mm in thickness, made of tungsten, and the cutting edge was coated with diamond.

The mold was manufactured using aluminum and then rubber was injected to manufacture a chuck table that was first processed. The primary chuck table was subjected to secondary processing using the chuck table rubber pad high speed processor of the present invention, Respectively.

Comparative Example  One

A chuck table under the same conditions as in Example 1 was manufactured using only aluminum molds. Unlike Example 1, the gap between the rubber pads was manufactured using a mold, and after the fabrication, the chuck table was completed.

Example 2

In order to confirm the production speed of each different chuck table, 10 kinds of chuck tables were successively produced.

The size of each rubber pad on the chuck table was 5 x 5 mm, 10 x 10 mm, 15 x 15 mm, 20 x 20 mm, 25 x 25 mm, and 30 x 30 mm, and the spacing between the rubber pads was 0.4 mm and 0.8 mm.

The cutting wheel used was 100 mm in size, made of tungsten with a cutting edge of 0.4 mm thickness and a cutting edge of 0.8 mm, and the cutting edge portion was coated with diamond.

The mold was manufactured using aluminum and then rubber was injected to manufacture a chuck table that was first processed. The primary chuck table was subjected to secondary processing using the chuck table rubber pad high speed processor of the present invention, Respectively.

Comparative Example  2

A chuck table under the same conditions as in Example 2 was manufactured using only aluminum molds. Unlike Example 2, the gap between the rubber pads was manufactured using a mold, and after the fabrication, the chuck table was completed.

Experimental Example

Table 1 below compares the production times of the chuck tables.

Mold making time (Back) Processing time Total production time For one For 10 minutes One 10 things One 10 things Example 1 138 minutes 138 minutes 12 minutes 156 minutes 150 minutes 213 minutes Comparative Example 1 152 minutes 152 minutes 10 minutes 128 minutes 168 minutes 295 minutes Example 2 138 minutes 680 minutes 12 minutes 156 minutes 150 minutes 870 minutes Comparative Example 2 152 minutes 1520 minutes 10 minutes 128 minutes 168 minutes 1940 minutes

As shown in Table 1, when 10 chuck tables of one kind are manufactured, ten chuck tables are manufactured using one mold, so that no difference in speed is shown. However, as in Comparative Example 1 of the present invention, It can be seen that it takes a long time to manufacture the mold in order to form the gap portion in the mold. Further, in the case of the chuck table manufactured according to the first embodiment of the present invention, since the spacing portion is manufactured by cutting, almost no additional post-processing is required. However, in the case of manufacturing by the same method as Comparative Example 1, It was found that the production time required a little further in Comparative Example 2.

However, in the case of the second embodiment, after the five kinds of chuck table dies are manufactured, the cutting wheel can be replaced to form the gap portions of two thicknesses. On the contrary, In the case of Comparative Example 2, since all of the 10 types of molds corresponding to each chuck table were to be manufactured, it was found that the production time was required twice or more. This difference is considered to be due to the fact that there are more time differences in the field in view of the industry circumstances in which chuck tables for various semiconductors have to be produced.

The preferred embodiments of the present invention have been described in detail with reference to the drawings. It will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the appended claims.

Therefore, the scope of the present invention is defined by the appended claims rather than the foregoing detailed description, and all changes or modifications derived from the meaning, range, and equivalence of the claims are included in the scope of the present invention. .

100: Cutting wheel
110: Rotary motor
120: cutting blade
200: Chuck table
300: chuck table base
400: control means

Claims (5)

(a) cutting means for moving up and down and cutting the chuck table rubber pad;
(b) a chuck table base located at a lower end of the chuck table rubber pad and capable of moving back and forth, right and left, up and down, and rotating; And
(c) control means for controlling the vertical movement of the chuck table base and the front and rear, left and right, up and down movement and rotation of the chuck table base;
Wherein the cutting means includes a cutting means
(i) a circular cutting wheel having a cutting edge on its circumferential surface and cutting the rubber pad by rotation; And
(ii) a rotating motor for rotating the cutting wheel,
Wherein the circular cutting wheel has a diameter of 80 to 120 mm, a thickness of 3 to 10 mm, a cutting edge of 5 to 20 mm along a circumferential surface, and the thickness of the cutting edge is 0.2 to 1 mm,
The rotary motor is a spindle motor, and a duct is formed therein to supply lubricating means,
Wherein the chuck table includes identification means for identifying the kind of the rubber pad and the cutting position,
Wherein the chuck table base and the chuck table are coupled by pins, and a plurality of pin holes are machined to the chuck table base according to the size of the chuck table. delete delete delete A method of processing a rubber pad for semiconductor manufacturing using a semiconductor device manufacturing chuck table rubber pad high-speed processor according to claim 1, comprising the steps of:
(a) providing a pre-machined chuck table rubber pad on a chuck table base having identification means;
(b) recognizing the identification means of the chuck table, confirming the position of the chuck table, the type of rubber pad and the cutting position;
(c) supplying power and lubricating means to the rotating motor to rotate the cutting wheel;
(d) moving the chuck table base back and forth, left and right, moving the cutting means up and down, cutting the chuck table rubber pads located above the chuck table base at regular intervals; And
(e) rotating the chuck table base by 90 DEG, and then repeating step (d) to obtain a chuck table cut to a predetermined size.

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