KR101959327B1 - Apparatus of cooling and heating for floor - Google Patents

Abstract

The present invention relates to a floor heating / cooling apparatus capable of using both a cooling function and a heating function by using a thermoelectric element, A cooling and heating line portion formed on the floor of the heating and cooling space for cooling or heating; A bottom inflow pipe portion formed between the boiler portion and the cooling / heating line portion for supplying water supplied from the boiler portion to the cooling / heating line portion; A cooling and heating discharge pipe unit for supplying water from the cooling and heating line unit to the boiler unit; An inlet portion connected to the cooling / heating discharge pipe portion for supplying water flowing from the cooling / heating line portion; A cooling unit for cooling and supplying water supplied from the inflow part; And a discharge unit connected to the bottom inflow pipe unit and receiving water from the cooling unit and delivering the water to the heating / cooling line unit.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a floor heating /

The present invention relates to a floor heating and cooling apparatus, and more particularly to a floor heating and cooling apparatus capable of using both a cooling function and a heating function by using a thermoelectric element.

Generally, the boiler is provided with a water storage tank for supplying tap water and allowing a certain amount of water to be desiccated, so that the water that has been desiccated in the boiler is heated by a heating means to receive hot water if necessary, Circulates through the piping installed on the floor of the space, and provides warmth to the interior space of the house, office, and the like.

On the other hand, the cooling of the indoor space in summer uses a separate cooling system such as an air conditioner or a fan.

Korean Registered Utility Model No. 20-0219753 (registered on Jan. 30, 2001) describes the heating device for hot water boilers. According to the disclosed technology, in the construction of the heating device for a hot water boiler, a heater is connected to a discharge port on one side of the hot water boiler, and a distributor having a plurality of hot water pipes connected to the heater is connected to the heater, An electric heater is installed in the circulation passage formed in the circulation passage so that the heating water passing through the circulation passage is heated.

Korean Patent Laid-Open Publication No. 10-2016-0117966 (published Oct. 10, 2016) discloses a boiler. According to the disclosed technology, a heating tank body in which a fluid is stored in an enclosed space, and a plurality A heating tank in which a plurality of radiators are installed and heat exchange fluid is brought into contact with the periphery of the radiator to exchange heat with water circulated in the radiator; A hot water supply tank main body of a closed space in which the heat exchanged water is introduced and stored, and a heater module is coupled to one external side surface of the hot water supply tank main body, and water stored in the hot water supply tank main body is supplied to the heater module And a hot water supply tank for heating the hot water supply tank body to a predetermined temperature and then flowing back to the inside of the hot water supply tank body and discharging the stored water to an output unit formed on one side of the hot water supply tank body. do.

As described above, in the related art, since the cooling and heating devices are individually installed and operated independently of each other, there is a problem that the cooling device and the heating device must be installed and operated separately for cooling and heating. In addition, since the air conditioner is installed in a form occupying an indoor space, there is a problem that the indoor space becomes narrow.

Korean Registered Utility Model No. 20-0219753 Korean Patent Publication No. 10-2016-0117966

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems occurring in the prior art, and it is an object of the present invention to provide a floor heating and cooling apparatus which can use both a cooling function and a heating function by using a thermoelectric element.

According to an aspect of the present invention, there is provided a boiler comprising: a boiler unit for heating and supplying water; A cooling and heating line portion formed on the floor of the heating and cooling space for cooling or heating; A bottom inflow pipe portion formed between the boiler portion and the cooling / heating line portion for supplying water supplied from the boiler portion to the cooling / heating line portion; A cooling and heating discharge pipe unit for supplying water from the cooling and heating line unit to the boiler unit; An inlet portion connected to the cooling / heating discharge pipe portion for supplying water flowing from the cooling / heating line portion; A cooling unit for cooling and supplying water supplied from the inflow part; And a discharge unit connected to the bottom inflow pipe unit for receiving water from the cooling unit and delivering the water to the air conditioning line unit.

In one embodiment, the cooling unit includes: a main body having an inner surface made of heat insulating material; A cooling pipe formed inside the body for guiding water supplied to the inlet to the outlet; And a plurality of thermoelectric means formed on the upper and lower portions of the cooling pipe, respectively, for cooling the cooling pipe and cooling the cooling pipe to discharge the generated heat to the outside.

In one embodiment, the thermoelectric device includes a thermoelectric element for cooling the cooling pipe; A cooling plate formed in contact with one side of the thermoelectric element to transfer cool air generated in the thermoelectric element to the cooling pipe; A cooling fan formed on one side of the cooling plate for radiating cold air; A heat dissipation heat sink formed on the other side of the thermoelectric element to discharge heat generated from the thermoelectric element to the outside; And a heat dissipation fan formed on one side of the heat dissipation heat sink for dissipating heat.

In one embodiment, the cooling unit further includes a heat sink formed behind the cooling pipe for dissipating heat to the outside.

In one embodiment, the cooling unit further includes a drain pipe formed at a lower portion of the main body, for discharging the condensed water generated by the thermoelectric unit to the outside.

In one embodiment, the cooling unit includes input means formed on the outside of the main body for receiving a command for controlling the temperature and generating a command signal corresponding thereto; And a controller for receiving the command signal and adjusting an amount of current flowing in the thermoelectric element.

In one embodiment, the cooling unit includes: a temperature sensor formed on one side of the main body, the temperature sensor detecting a temperature of the main body; And a memory for presetting and storing a limit temperature value so that the temperature is not further lowered.

In one embodiment, the controller cuts off the current flowing in the thermoelectric element when the temperature sensed by the temperature sensor is lower than or equal to the threshold temperature value.

In one embodiment, the inlet includes: a cooling inlet pipe connected to the cooling / heating discharge pipe portion for supplying water from the cooling / heating line portion to the cooling portion; And a T-shaped valve having both sides thereof disposed between the cooling / heating discharge pipe portions and a center portion thereof installed toward the cooling inlet pipe.

In one embodiment, the pump further includes a circulation pump portion formed at a lower portion of the bottom inflow pipe portion for circulating water.

According to the present invention, the circulation of the hot water and the cold water in the cooling / heating line portion provided at the bottom of the cooling / heating space is controlled so that the cooling / heating space can be freely converted into cooling or heating according to the season.

According to the present invention, a cooling unit for cooling is added based on a conventional boiler heating system, so that the cooling / heating system can be easily constructed.

According to the present invention, since it is not necessary to provide a separate cooling device for cooling, not only a cost for purchasing a cooling device can be reduced, but a cooling device occupying a space is not required to be installed in a room, There is an effect that it can be ensured widely.

1 is a view for explaining a floor cooling / heating apparatus according to an embodiment of the present invention.
Fig. 2 is a sectional view illustrating the cooling unit shown in Fig. 1 as a first example.
Fig. 3 is a perspective view illustrating the cooling unit shown in Fig. 1 as a first example.
Fig. 4 is a view for explaining the thermoelectric converting means shown in Fig. 2. Fig.
Fig. 5 is a view for explaining the cooling unit in Fig. 1 as a second example. Fig.
Fig. 6 is a view for explaining the cooling unit in Fig. 1 as a third example. Fig.
7 is a view for explaining an inflow portion shown in Fig.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention. However, the description of the present invention is merely an example for structural or functional explanation, and the scope of the present invention should not be construed as being limited by the embodiments described in the text. That is, the embodiments are to be construed as being variously embodied and having various forms, so that the scope of the present invention should be understood to include equivalents capable of realizing technical ideas. Also, the purpose or effect of the present invention should not be construed as limiting the scope of the present invention, since it does not mean that a specific embodiment should include all or only such effect.

Meanwhile, the meaning of the terms described in the present invention should be understood as follows.

The terms "first "," second ", and the like are intended to distinguish one element from another, and the scope of the right should not be limited by these terms. For example, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

It is to be understood that when an element is referred to as being "connected" to another element, it may be directly connected to the other element, but there may be other elements in between. On the other hand, when an element is referred to as being "directly connected" to another element, it should be understood that there are no other elements in between. On the other hand, other expressions that describe the relationship between components, such as "between" and "between" or "neighboring to" and "directly adjacent to" should be interpreted as well.

It should be understood that the singular " include "or" have "are to be construed as including a stated feature, number, step, operation, component, It is to be understood that the combination is intended to specify that it does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

All terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, unless otherwise defined. Commonly used predefined terms should be interpreted to be consistent with the meanings in the context of the related art and can not be interpreted as having ideal or overly formal meaning unless explicitly defined in the present invention.

BEST MODE FOR CARRYING OUT THE INVENTION A floor cooling / heating apparatus according to an embodiment of the present invention will now be described in detail with reference to the drawings.

1 is a view for explaining a floor cooling / heating apparatus according to an embodiment of the present invention.

1, the floor cooling / heating apparatus 10 includes a boiler unit 100, a cooling / heating line unit 200, a floor inflow pipe unit 300, a cooling / heating discharge pipe unit 400, an inflow unit 500, A portion 600, and a discharge portion 700. [

The boiler unit 100 heats the water at the time of heating by receiving water from the outside and supplies the heated water to the heating / cooling line unit 200 through the floor inflow pipe unit 300 to heat the heating / cooling space .

In one embodiment, the boiler unit 100 recovers water cooled by the cooling / heating line unit 200 through the cooling / heating discharge pipe unit 400, and then reheats the heated water to the floor inflow pipe unit 300, So that it can circulate.

The cooling / heating line unit 200 is formed at the bottom of the cooling / heating space to cool or heat the cooling / heating space.

In one embodiment, the heating / cooling line unit 200 can heat the cooling / heating space when heated water is supplied from the bottom inlet pipe unit 300 to the boiler unit 100, The cooling / heating space can be cooled when the cooled water is supplied.

The floor inflow pipe portion 300 is formed between the boiler portion 100 and the cooling and heating line portion 200 and transfers the heated water supplied from the boiler portion 100 to the heating and cooling line portion 200.

The cooling / heating discharge piping unit 400 receives water from the cooling / heating line unit 200 and transfers the water to the boiler unit 100 to circulate the water.

In one embodiment, the cooling / heating discharge pipe unit 400 can transfer the water supplied from the cooling / heating line unit 200 during heating to the boiler unit 100, To the inlet (500) to circulate the water.

The inflow part 500 is connected to the cooling / heating discharge pipe part 400 and supplies the water introduced from the cooling / heating line part 200 to the cooling part 600.

The cooling unit 600 cools water supplied from the inflow unit 500 and provides the cooled water to the discharge unit 700.

The discharge unit 700 is connected to the bottom inflow pipe unit 300 and supplies the cooled water from the cooling unit 600 to the cooling / heating line unit 200.

The floor cooling / heating apparatus 10 having the above-described configuration may further include a circulation pump unit 800 and a makeup water injecting unit (not shown in the figure for convenience of explanation).

The circulation pump unit 800 is formed at the bottom of the bottom inflow pipe unit 300, and circulates water.

In one embodiment, the circulation pump unit 800 is located below the cooling unit 600 and is connected to the bottom inflow pipe unit 300 to forcibly circulate water.

The replenishment water injection unit is connected to the boiler unit 100 to supply water to the boiler unit 100 so that water can be replenished to the boiler unit 100 when necessary.

The floor cooling / heating apparatus 10 having the above-described configuration controls the circulation of the hot water and the cold water to the cooling / heating line unit 200 provided at the bottom of the cooling / heating space, so that the cooling / And the cooling unit 600 for cooling is added based on the existing boiler heating system, so that the cooling / heating system can be easily constructed. In addition, since it is not necessary to provide a separate cooling apparatus for cooling, it is possible to reduce the cost for purchasing a cooling apparatus, and it is not necessary to install a cooling apparatus occupying a space in the room, .

FIG. 2 is a cross-sectional view illustrating the cooling unit in FIG. 1 as a first example, and FIG. 3 is a perspective view illustrating the cooling unit in FIG. 1 as a first example.

Referring to FIGS. 2 and 3, the cooling unit 600 includes a main body 610, a cooling pipe 620, and a thermoelectric unit 630.

The main body 610 has an inner surface formed of a heat insulating material and forms a sealed space therein.

The cooling pipe 620 is formed inside the main body 610 and guides the water supplied to the inlet portion 500 to the outlet portion 700.

In one embodiment, the cooling pipe 620 is cooled by the heat absorption phenomenon of the thermoelectric means 630, so that the water flowing into the inside can be cooled.

In one embodiment, the cooling pipe 620 may be formed of a thin tube-shaped copper pipe, a titanium pipe, or the like to enhance the cooling efficiency.

The cooling pipe 620 is connected to the inlet 500 to allow water to flow in from the inlet 500 and the bottom to connect to the outlet 700 so that the outlet 700 is connected to the outlet 700, Water can be discharged.

In one embodiment, the cooling pipe 620 may be formed in the form of a coil-like copper tube wound inside the body 610.

In an embodiment, the cooling pipe 620 may be formed at an angle (for example, 20 to 50 degrees) at a portion connected to the discharge portion 700 so that the water can be supplied without any solidification.

The heat transfer means 630 is formed at one or more of the upper and lower portions of the cooling pipe 620 so as to cool the cooling pipe 620 and to dissipate the heat generated while cooling.

In one embodiment, the thermoelectric means 630 may be formed on one side of the body 610 as shown in FIG. 2, and may be formed on the upper and lower portions of the body 610 as shown in FIG. 3 .

The heat transfer means 630 is formed at an upper portion of one side of the main body 610 corresponding to the upper portion of the cooling pipe 620 to primarily cool the cooling pipe 620 and to cool the cooling pipe 620 The cooling pipe 620 is formed at a lower portion of the lower portion of the main body 610 to cool the cooling pipe 620 to improve cooling efficiency.

The thermoelectric phenomenon can be classified into the Hebeck effect of obtaining the electromotive force by using the temperature difference between the both ends, the Peltier effect of cooling and heating by the electromotive force, and the Thomson effect of generating electromotive force by the temperature difference of the conductor.

The Seebeck Effect is a circuit made up of two different conductive materials. When a different temperature is applied to the contact points between the two conductive materials, a current or voltage is generated. The heat flow that moves from a hot place to a cold place Thereby generating this current.

The Peltier effect is a phenomenon in which a direct current flows through a circuit composed of different conductors, where one side of the junction between the different conductors is heated according to the direction of the current, while the other side is cooled.

The Thomson effect is a phenomenon in which heat is absorbed or released as current flows through a metal wire of uniform quality when there is a temperature gradient. When the current flows from the high temperature part to the low temperature part, iron absorbs heat and releases heat from copper.

A thermoelectric element (thermoelectric element) using thermoelectric phenomenon is a generic name of a device that utilizes various effects that are caused by the interaction of heat and electricity. Thermistors used for stabilizing the circuit, heat, power, and light detection, devices using the JEBEQ effect used for measuring the temperature, and Peltier devices used for manufacturing the refrigerator or the thermostat.

The above Peltier effect is a phenomenon in which two kinds of metal ends are connected to each other and a current is caused to flow therebetween, one end of the terminal absorbs heat and the other terminal generates heat in accordance with the current direction. When a semiconductor such as bismuth (Bi) or tellurium (Te), which is different from the two kinds of metals, is used, a Peltier element having an efficient heat absorbing and exothermic effect can be obtained. This allows the endothermic and exothermic switching depending on the current direction, and the endothermic and calorific values are controlled by the amount of current.

Such a thermoelectric element generates an electromotive force due to a temperature difference and absorbs or dissipates heat by an electromotive force.

The cooling unit 600 having the above-described configuration may further include a heat sink 640 and a drain pipe 650.

The heat radiating plate 640 is formed in contact with the rear side of the cooling pipe 620 to radiate heat generated by water supplied to the cooling pipe 620 to the outside.

In one embodiment, the heat sink 640 is formed at the rear and may include a fan (not shown in the drawings for ease of explanation) to more effectively dissipate the heat.

The drain pipe 650 is formed at a lower portion of the main body 610 and discharges the condensed water generated by the heat exchange of the thermoelectric means 630 to the outside.

In one embodiment, the drain pipe 650 may be formed obliquely at a certain angle (e.g., 10 to 30 degrees), so that condensate may not drain.

Fig. 4 is a view for explaining the thermoelectric converting means shown in Fig. 2. Fig.

4, the thermoelectric element 630 includes a thermoelectric element 631, a cooling plate 632, a cooling fan 633, a heat sink 634, and a heat dissipation fan 635.

The thermoelectric elements 631 are respectively formed on the upper and lower portions of the cooling pipe 620 to cool the cooling pipe 620.

In one embodiment, the thermoelectric element 631 receives power from the outside to cool the cooling plate 632 due to the occurrence of a heat absorption phenomenon at one side thereof, and at the same time generates heat at the other side, (634).

In one embodiment, the thermoelectric unit 630 is formed on the upper portion of one side of the body 610 corresponding to the upper portion of the cooling pipe 620 and the lower side of the body 610 corresponding to the lower portion of the cooling pipe 620 .

The cooling plate 632 is formed in contact with one side of the thermoelectric element 631 to transfer cool air generated in the thermoelectric element 631 to the cooling pipe 620 to cool the water inside the cooling pipe 620 .

In one embodiment, the cooling plate 632 may be formed to face the interior of the body 610.

The cooling fan 633 is formed on one side of the cooling plate 632 and radiates cool air toward the cooling pipe 620 while rotating.

In one embodiment, the cooling fan 633 may be formed such that one side is connected to the cooling plate 632 and the other side is in contact with the cooling pipe 620.

The heat dissipation heat sink 634 is formed in contact with the other side of the thermoelectric element 631 and discharges heat generated from the thermoelectric element 631 to the outside.

In one embodiment, when the thermoelectric element 631 is driven by current flow, heat is generated at the other side of the thermoelectric element 631, and the generated heat is discharged to the outside have.

In one embodiment, the heat-dissipating heat sink 634 is formed on the outside of the body 610, and can discharge heat to the outside.

In one embodiment, the heat-dissipating heat sink 634 is formed by extending a certain length in both directions to widen the surface area to which heat can reach when the heat transferred from the thermoelectric element 631 flows out to the outside, The heat can be quickly released to the outside.

The heat dissipation fan 635 is formed on one side of the heat dissipation heat sink 634 and dissipates heat radiated from the heat dissipation heat sink 634 while rotating.

Fig. 5 is a view for explaining the cooling unit in Fig. 1 as a second example. Fig.

5, the cooling unit 600 includes a main body 610, a cooling pipe 620, a thermoelectric unit 630, an input unit 660, and a controller 670. Here, the main body 610, the cooling pipe 620, and the thermoelectric element 630 are similar to those of FIG. 2, and thus the description thereof will be omitted and only the other portions will be described below.

The input means 660 is formed outside the main body 610 and receives a command for controlling the temperature and generates a corresponding command signal.

The controller 670 receives the command signal from the input means 660 and adjusts the amount of current flowing in the thermoelectric element 631.

The cooling unit 600 having the above-described configuration may further include a temperature sensor 680 and a memory 690.

The temperature sensor 680 is formed on one side of the main body 610 to sense the temperature of the main body 610.

In one embodiment, the temperature sensor 680 is fixed to the interior of the body 610 or to the side of the body 610 to sense the temperature of the body 610.

In one embodiment, the temperature sensor 680 senses the temperature of the main body 610 in real time, displays the temperature of the sensed main body 610 on the screen, and informs the user.

The memory 690 stores and sets a limit temperature value (for example, minus 40 degrees) so that the temperature is no longer lowered.

At this time, the controller 670 can cut off the amount of current flowing through the thermoelectric element 631 when the temperature sensed by the temperature sensor 680 is equal to or lower than the threshold temperature value stored in the memory 690.

Fig. 6 is a view for explaining the cooling unit in Fig. 1 as a third example. Fig.

6, the cooling unit 600 includes a main body 910, a water tank 920, a cooling sink 930, a thermoelectric element 940, a heat sink 950, and a heat radiating fan 960 .

The main body 910 has an inner surface formed of a heat insulating material and forms a closed space therein.

The water tank 920 is formed inside the main body 610 and guides the water supplied to the inlet portion 500 to the outlet portion 700.

In one embodiment, the water tank 920 is cooled by the cooling sink 930 due to the heat absorption phenomenon of the thermoelectric element 940, so that the internal water can be cooled.

In one embodiment, the water tank 920 may be formed in the form of an aluminum tank to enhance the cooling efficiency.

The water tank 920 may include an inlet 921 connected to the inlet 500 for introducing water from the inlet 500 and a drain 700 connected to the outlet 700, And an outlet 922 for discharging the water. At this time, the discharge portion 700 can be formed obliquely at an angle of about 15 degrees in a downward direction.

The cooling sink 930 is formed in contact with one side of the thermoelectric element 940 and the water tank 920. The surface of the cooling sink 930 is cooled by the cold air generated in the thermoelectric element 940, So that the water in the water tank 920 is cooled.

A plurality of thermoelectric elements 940 are formed on one side of the body 910 to cool the water tank 920.

In one embodiment, the thermoelectric element 940 receives power from the outside to cool the cooling sink 930 due to a heat absorption phenomenon at one side thereof, and at the same time generates heat from the other side, 950).

The heat sink 950 is formed in contact with the other side of the thermoelectric element 940 and discharges heat generated from the thermoelectric element 940 to the outside.

In one embodiment, the heat sink 950 generates heat at the other side of the thermoelectric element 940 when the current flows and the thermoelectric element 940 is driven, and can release the generated heat to the outside .

In one embodiment, the heat sink 950 is formed on the exterior of the body 910 to allow heat to be released to the exterior.

The heat dissipation fan 960 is formed on one side of the heat sink 950 to dissipate the heat radiated from the heat sink 950 to the outside while rotating.

7 is a view for explaining an inflow portion shown in Fig.

Referring to FIG. 7, the inlet 500 includes a cooling inlet pipe 510 and a T-valve 520.

The cooling air inflow pipe 510 is connected to the cooling / heating discharge pipe unit 400 by a T valve 520 and supplies the water introduced from the T valve 520 to the cooling unit 600.

In one embodiment, the cooling inlet pipe 510 may be connected to the T-valve 520 on one side and the inlet of the cooling pipe 620 on the other side.

The T-shaped valve 520 is provided between the cooling / heating discharge pipe portions 400 and the center portion thereof is provided to the cooling inlet pipe 510 to change the flow path of the water.

In one embodiment, the T-type valve 520 is closed at the time of heating so that water can flow along the both sides of the cooling / heating discharge pipe part 400, and when the air conditioner is opened during cooling, The water can move toward the pipe 510. That is, while the air passage is blocked by the line of the cooling / heating discharge pipe unit 400 during cooling, the water can be circulated only to the cooling unit 600.

In one embodiment, the T-shaped valve 520 may be formed as a solenoid valve and automatically opened and closed. For example, when the user selects the cooling mode through the input means 660, the cooling signal is generated and transmitted to the controller 670. The controller 670 receives the cooling signal from the input means 660, The valve 520 is opened. On the other hand, when the user selects the heating mode through the input means 660, the heating signal is generated and transmitted to the controller 670. The controller 670 receives the heating signal from the input means 660, Can be closed.

As described above, the embodiment of the present invention is not limited to the above-described apparatus and / or method, but may be implemented by a program for realizing a function corresponding to the configuration of the embodiment of the present invention and a recording medium on which the program is recorded And the present invention can be easily implemented by those skilled in the art from the description of the embodiments described above.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, It belongs to the scope of right.

10: Floor heating / cooling unit
100: Boiler section
200: Heating /
300: bottom inflow pipe section
400: Heating /
500: inlet
510: Cooling inflow pipe
520: T type valve
600:
610, 910:
620: Cooling piping
630: thermoelectric means
631, 940: thermoelectric element
632: cooling plate
633: Cooling fan
634: Heat sink heatsink
635, 960: heat-dissipating fan
640: heat sink
650: drain pipe
660: input means
670:
680: Temperature sensor
690: Memory
700:
800: Circulation pump section
920: Water tank
930: Cooling sink
950: Heatsink

Claims (10)

A boiler part for heating and supplying water to the container; A cooling and heating line portion formed on the floor of the heating and cooling space for cooling or heating; A bottom inflow pipe portion formed between the boiler portion and the cooling / heating line portion for supplying water supplied from the boiler portion to the cooling / heating line portion; A cooling and heating discharge pipe unit for supplying water from the cooling and heating line unit to the boiler unit; An inlet portion connected to the cooling / heating discharge pipe portion for supplying water flowing from the cooling / heating line portion; A cooling unit for cooling and supplying water supplied from the inflow part; And a discharge unit connected to the bottom inflow pipe unit for receiving water from the cooling unit and delivering the water to the heating / cooling line unit; The cooling unit includes a main body having an inner side surface made of a heat insulating material; A cooling pipe formed inside the body for guiding water supplied to the inlet to the outlet; A plurality of thermoelectric means formed on the upper and lower portions of the cooling pipe to cool the cooling pipe to cool the cooling pipe while cooling the heat; A heat sink formed at the rear of the cooling pipe for dissipating heat to the outside; And a drain pipe formed at a lower portion of the main body, for discharging condensed water generated by the thermoelectric means to the outside; Wherein the cooling pipe is formed in a shape of a coiled copper tube inside the body and is connected to the discharge part at an angle of 20 to 50 degrees; The heat transfer means is formed at an upper portion of one side of the main body corresponding to the upper portion of the cooling pipe to primarily cool the cooling pipe and is formed at a lower portion of one side of the lower portion of the cooling pipe, Lt; / RTI > Wherein the drain pipe is formed at an angle of 10 to 30 degrees;
The cooling unit may further include a temperature sensor formed on one side of the main body, wherein the temperature sensor senses the temperature of the main body in real time, displays the detected main body temperature on a screen,
A cooling inlet pipe connected to the cooling / heating discharge pipe portion for supplying water from the cooling / heating line portion to the cooling unit; And a T-shaped valve having both sides thereof disposed between the cooling / heating discharge pipe portions and a center portion thereof installed toward the cooling inlet pipe; The T-type valve is formed by a solenoid valve and is automatically opened and closed to allow water to flow straight along the both sides of the cooling / heating discharge pipe portion when heated. So that the water can be moved.
delete delete delete delete delete delete delete delete The method according to claim 1,
Further comprising a circulation pump unit formed at a lower portion of the bottom inflow pipe unit for circulating water.

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