KR101952232B1 - Module type mold with an ascending and descending module block and molding method using the same - Google Patents

Abstract

The present invention relates to a modular mold apparatus having a module block mounted thereon and a molding method using the module block. The modular mold apparatus according to the present invention comprises a base frame, And a second module block movably installed in the base frame and moving by the flow pressure of the heat medium flowing through the heat transfer channel.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a modular mold apparatus having a module block and a molding method using the module block,

The present invention relates to a modular mold apparatus equipped with a module block and a molding method using the module block. More particularly, the present invention relates to a mold apparatus for molding a mold module using a flow pressure of a heat medium flowing in a heat transfer channel in a modular mold, So that it is easy to adjust the temperature to be transferred to the surface to be molded without additional power source, and thus a modular mold apparatus equipped with a module block capable of easily producing ultra high tensile strength steel with different strength and molding ≪ / RTI >

In recent years, it has become an important issue to reduce the weight of the vehicle and to strengthen the body by increasing the safety standards and environmental regulations and increasing the demand for fuel efficiency improvement.

Therefore, a method of manufacturing an ultra-high strength part of 1500 MPa or more from a steel material having a strength of a normal steel level using a hot stamping technique has been increasing worldwide, and a method of manufacturing a high strength steel sheet ) Is used for skeletal members of a vehicle body and contributes effectively to reduction of fuel consumption and reduction of a car body for reduction of carbon dioxide emission.

The above-mentioned hot stamping is a kind of processing heat treatment technique which transforms into a hard tissue at the same time as a part is formed in a mold. In order to simultaneously achieve shape processing and high strength, a molding material is heated to a certain temperature or higher to form austenite austenite), molding it into a press, quenching it in a mold, and transforming it into martensite.

Recently, as an extension of hot stamping technology, customized hot stamping (THS) technology has been proposed and developed to control the characteristics depending on the part by changing the cooling condition in the parts differently. For example, B- The design has developed a high strength steel plate with high strength that is strong against impact damage and a high strength steel plate with high ductility for absorbing impact energy depending on the site for collision stability.

That is, a part of an object to be molded is brought into contact with a mold having a high thermal conductivity by quenching to form a hard tissue, and a part of the object is made into a mold having a small thermal conductivity There has been attempted a method in which the soft tissue is formed by contacting and quenching.

At this time, the mold used for hot stamping is manufactured in conformity with the shape of the object to be molded for manufacturing a molded object having different strengths, and a cooling channel is generally formed in the mold for cooling the object.

In such a configuration, there is a problem that it is difficult to transfer heat to the surface to be molded according to a required temperature for each part for forming the two-dimensional strength of the object to be molded.

Further, there has been a problem in that an additional device and a power source are required in order to move a part of the mold close to the surface to be molded in order to control heat conduction to the surface to be molded or prevent heat loss.

In addition, there is a problem in that it is difficult to control the speed at which the object to be cooled is required to be quenched and the portion where the object to be cooled is required to come into contact with the mold at a time, and the heat conduction speed of each part.

Therefore, a method for solving such problems is required.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and it is an object of the present invention to provide a method of manufacturing a mold module, To provide a modular mold apparatus equipped with a module block capable of easily adjusting the temperature to be transferred to a molding target surface without additional power source and thus capable of easily manufacturing ultra high tensile strength steel having different strengths and a molding method using the module block .

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are not intended to limit the invention to the precise form disclosed. There will be.

According to an aspect of the present invention, there is provided a modular mold apparatus including a module block having a base frame and a heating frame disposed on an upper portion of the base frame, And a second module block movably installed in the base frame and moving by a flow pressure of a heat medium flowing through the heat transfer channel.

The second module block includes a chamber in which the heating medium flows into the lower portion of the second module block and a space in which an opening hole is formed is formed. A piston portion positioned in the space of the chamber, and a connection portion inserted into the opening hole and connecting the heating portion and the piston portion.

In addition, the chamber may include an opening / closing part for selectively opening / closing the inflow of the heating medium to a lower portion of the chamber.

Meanwhile, the second module block may include a heat insulating material between a lower portion of the heating portion and an upper portion of the chamber.

The piston portion may include a sealing member between the piston and the space of the chamber.

In addition, the chamber may include a sealing member in at least one of the upper and lower portions in which the space of the chamber communicates.

Meanwhile, in the molding method using the modular mold apparatus according to the present invention, the second module block moves upward due to the flow of the heat medium flowing through the heat transfer channel and the flow pressure of the heat medium flowing into the chamber A heat transfer step of transferring heat of a relatively high temperature to a surface to be molded located above the second module block in a state in which the heating part protrudes toward the surface to be molded more than the first module block, And the second module block moves at the same height as the first module block by pressing the surface of the second module block.

According to the present invention, a modular mold apparatus having a module block and a molding method using the module block can achieve the following effects.

First, by using a heat medium flowing through the heat transfer channel as a power source to move the module block up and down, an additional device and a power source for ascending and descending are not required, and cost and energy can be saved.

Second, the modular mold can be selectively lifted and lowered, so that the thermal conductivity transmitted from the mold to the molding target surface can be precisely controlled and changed according to the required strength of each portion of the molding target surface.

Thirdly, it is possible to minimize the time during which the surface to be molded is exposed to the air medium layer to prevent heat loss on the surface to be molded, and thus to precisely control the thermal conductivity transmitted to the surface to be molded.

Fourth, when the shape of the molding object is partially changed and the required thermal conductivity of the molding object is also changed, it is easy to reflect the design change through the replacement of the module on the base frame, .

The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the description of the claims.

1 is a view schematically showing a configuration of a modular mold apparatus according to the present invention.
2 is a view showing a heat medium flowing through a heat transfer channel in a modular mold apparatus according to the present invention.
3 is a view showing a state in which the second module block is moved up and down by the flow pressure of the heating medium in the modular mold apparatus according to the present invention.
4 is a view showing a coupling structure of a modular mold apparatus having a second module block that ascends and descends in a modular mold apparatus according to the present invention.
5 to 7 are views showing a state in which the second module block is lifted and lowered by the flow pressure of the heating medium in the modular mold apparatus according to the present invention.
8 is a view showing an embodiment of a molding method using a modular mold apparatus according to the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description of the present invention, the well-known functions or constructions are not described in order to simplify the gist of the present invention.

Moreover, in describing the present invention, terms indicating directions such as front / rear, left / right, or top / bottom are described so that those skilled in the art can clearly understand the present invention. And the scope of the rights is not limited.

1 to 7, the structure of a modular mold apparatus having a module block according to the present invention will be described in detail.

FIG. 1 is a view schematically showing a configuration of a modular mold apparatus according to the present invention. FIG. 2 is a view showing a heat medium flowing in a heat transfer channel in a modular mold apparatus according to the present invention. In which the second module block is lifted and lowered by the flow pressure of the heating medium in the modular mold apparatus according to the first embodiment of the present invention.

4 is a view showing a coupling structure of a modular mold apparatus having a second module block that ascends and descends in the modular mold apparatus according to the present invention, In which the second module block is lifted and lowered by the flow pressure of the heating medium.

As shown in FIG. 1, the modular mold apparatus according to the present invention allows the mold module to move up and down using the flow pressure of the heat medium flowing through the heat transfer channel in the modular mold, thereby being transmitted to the molding target surface without additional power source The first module block 200 and the second module block 300 in a configuration in which the temperature can be easily controlled and therefore the super high tensile strength steel having a different strength can be easily manufactured.

The base frame 100 is formed in a long plate shape so that the first module block 200, the second module block 300 and the chamber 400 described later can be disposed adjacent to the upper portion of the base frame 100 And the shape and configuration of the above-described module block or the like can be efficiently disposed on the base frame 100, the present invention is not limited to this embodiment and may be various.

In such a configuration, when the shape of the object to be shaped is partially changed and the transmission temperature required for the object surface O is also changed, it is easy to reflect the design change through replacement of the module on the upper part of the base frame, Can have the effect of

2 and 3, the first module block 200 may be disposed above the base frame 100, and may include a heat transfer channel (not shown) (220) may be formed.

Here, the heat medium flowing through the heat transfer channel 200 is not limited as long as it is a medium for transferring heat, and may be various. In the modular mold apparatus according to the present invention, the heat medium is referred to as cooling water.

At this time, a plurality of the first module blocks 200 may be disposed adjacent to each other, and the heat transfer channels 220 of the plurality of first module blocks 200 may communicate with each other.

That is, the heat medium flowing into the heat transfer channel 220 may be configured to flow through the heat transfer channels 220 formed in the plurality of first module blocks 200 and communicated with each other.

In such a configuration, even when the design of the object to be molded is changed, the reflection of the design change can be easily reflected through the replacement of a part of the first module block 200 disposed on the base frame 100, The heat transfer channel 220 of the module block 200 can also be easily communicated, thereby reducing the cost.

The base frame 100 has an inlet channel (not shown) through which the heating medium flows and communicates with the heat transfer channel 220, and an outlet channel (not shown) through which the heating medium flowing through the heat transfer channel 220 flows. Can be formed.

In this configuration, since the heating medium flows through the heat transfer channel 220 through the inflow channel 220 provided in the base frame 100 and the heat medium flowing through the heat transfer channel 220 can be discharged through the outflow channel, It is possible to form a plurality of first module blocks 220 having different temperatures by variously configuring and forming the heat transfer channels 220 formed in the module block 300.

The second module block 300 is movably provided in the base frame 100 and can be moved by the flow pressure of the heat medium flowing through the heat transfer channel 220.

In this configuration, by using the heat medium flowing through the heat transfer channel 220 as a power source to move up and down the module block, an additional device and a power source for ascending and descending are not required, and thus, the cost and energy can be reduced have.

In addition, by using the moving second module block 300 to contact the surface to be molded, it is possible to minimize the time during which the molded object is exposed to the air medium layer to prevent heat loss on the surface to be molded, The degree of precision can be adjusted.

Hereinafter, the configuration and the manner in which the second module block 300 can be moved by the flow pressure of the heating medium will be described later.

Meanwhile, as shown in FIG. 4, the modular mold apparatus according to the present invention may include a chamber 400.

The chamber 400 is provided under the second module block 300, and a space 420 in which a heating medium flows into the chamber 400 and an opening hole is formed in the chamber 400 may be formed.

In this configuration, the heating medium flowing into the chamber 400 can have a function of moving up and down the second module block 300 through the opening hole of the chamber 400 by using the flow pressure.

Therefore, the cost and energy can be saved by making the second module block 300 ascend and descend without any additional configuration and power source.

The chamber 400 may include an opening / closing part 380 for selectively opening / closing the inflow of the heating medium into the lower part of the chamber 400.

The opening and closing part 380 may be formed in the form of a valve and the opening and closing part may be formed so as to selectively open and close the inflow of the heating medium into the chamber 400 from the heat transfer channel 220, can do.

In this configuration, when the second module block 300 is not required to move up and down, the opening and closing portions are closed to prevent the heat medium from flowing into the chamber 400, thereby minimizing energy loss.

Also, the opening and closing part 380 can be opened and closed at a low level, so that the upward and downward movement of the second module block 300 can be controlled more easily.

4 to 7, the configuration of the second module block 300 of the modular mold apparatus according to the present invention and the flow pressure of the heat medium flowing into the chamber 400 are used to form the second module block 300 will be ascended and descended will be described in detail.

Referring to FIG. 4, the second module block 300 of the modular mold apparatus according to the present invention may include a heating unit 320, a piston unit 360, and a connection unit 340.

The heating unit 320 can transmit heat to the surface to be molded.

At this time, the heater 320 may be provided with one or more heater cartridges 322.

In addition, it may be advantageous to provide the heater cartridge 280 close to the upper surface of the first module block to efficiently transmit heat to the surface to be molded.

In such a configuration, the number and the capacity of the heater cartridge 322 can be adjusted so as to have a temperature required by the surface to be molded, so that heat can be more effectively transmitted to the surface to be molded.

Further, it is possible to precisely control and change the thermal conductivity transmitted from the mold to the molding object surface in accordance with the required strength of each part of the object.

The second module block 300 of the modular mold apparatus according to the present invention may include a heat insulating material 500 between the lower part of the heating part 32 and the upper part of the chamber 400.

In this configuration, the heat of the heating medium flowing into the chamber 400 is prevented from being transferred to the second module block 200, so that the second module block 200 can transmit heat to the surface to be molded without heat loss Lt; / RTI >

The piston 360 may be located in the space of the chamber 400.

Further, the connection portion 340 is inserted into the opening hole and can connect the heating portion and the piston portion.

6, by the flow pressure of the heat medium flowing into the lower portion of the chamber 400, the piston portion of the second module block 300 located in the space 420 of the chamber 400 The heating unit 320 connected to the connection unit 340 moves upward and is positioned above the adjacent first module block 200 so that the heating unit 320 can be contacted first.

Therefore, the heating portion 320 of the second module block 300 can be brought into contact with the surface to be molded with priority, and the thermal conductivity transmitted to the object can be precisely controlled.

In addition, it is possible to minimize the time during which the surface to be molded is exposed to the air medium layer to prevent heat loss on the surface to be molded, and thus to precisely control the thermal conductivity transmitted to the surface to be molded.

In the modular mold apparatus according to the present invention, a plurality of second module blocks 300 may be disposed, and an opening / closing unit 380 located under the chamber 400 of each second module block 300 may be selectively The second module block 300 can control the temperature to be transferred to the surface to be molded for each part so that the dissimilar strength of the object can be controlled more precisely.

In this configuration, the modular mold can be selectively lifted and lowered, so that the thermal conductivity transmitted from the mold to the molding target surface can be precisely controlled and changed according to the required strength of each portion of the molding target surface.

At this time, the piston 360 may include a sealing member 540 between the piston 360 and the space of the chamber 400.

5 to 7, a sealing member 540 is provided between the piston 360 and the space of the chamber 400, so that a heat medium is generated in the chamber 400 It is possible to prevent the heating medium from flowing into the space 420 of the chamber 400 and flowing out to the outside through the opening hole when the piston 360 flows up and down.

In addition, the chamber 400 may include a sealing member 520 in at least one of the upper and lower portions through which the space communicates.

5 to 7, a sealing member 520 may be provided between the base frame 100 and the chamber 400, and may be provided between the heat insulating material 500 and the chamber 400. [ .

In this configuration, the heating medium flowing into the chamber 400 can be prevented from flowing into the space 420 of the chamber 400 when the second module block 300 is moved up and down, So that it can be prevented from flowing out to the outside.

As described above, the modular mold apparatus according to the present invention has been described, and a molding method using the modular mold apparatus according to the present invention will be described below.

In addition, in the description of the molding method using a modular mold apparatus having a module block to be described later, the components of the modular mold apparatus are as described above, and a detailed description thereof will be omitted.

8 is a view showing an embodiment of a molding method using a modular mold apparatus according to the present invention.

8, the molding method using the modular mold apparatus according to the present invention may include a heat medium flow step S100, an ascending step S200, a heat transfer step S300, and a descending step S400 .

The heat medium flow step (S100) may be a step in which the heat medium flows into the heat transfer channel (220).

In the step S200, the second module block 300 may be moved upward by the flow pressure of the heat medium flowing into the chamber.

At this time, as described above, the opening / closing part 380 is formed in the lower part of the chamber 400 to select whether to allow the heating medium to flow into the chamber 400, so that the second module block 300 moves upward You can choose.

With this configuration, it is possible to move the second module block 300 using only the flow pressure of the heating medium without additional configuration and power source, thereby saving cost and energy.

The heat transfer step S300 may be performed such that the heating unit 320 is relatively protruded toward the molding target surface from the first module block 200 and the molding target surface O positioned above the second module block 300 Lt; RTI ID = 0.0 > heat. ≪ / RTI >

With this configuration, the second module block 300 can be elevated and lowered as needed, and the heat transmitted to the molding target surface O positioned above the second module block 300 can be precisely adjusted have.

In addition, it is possible to reduce the time for which the surface to be molded O is exposed to the air-medium layer, thereby preventing heat loss on the surface to be molded.

Therefore, it is possible to precisely control and change the thermal conductivity transmitted from the mold to the object in accordance with the required strength of each part of the object.

The descending step S400 may be a step in which the second module block 300 moves at the same height as the first module block 200 by the pressing of the surface to be formed O.

In this configuration, the second module block 300 can be lowered only by the pressing of the surface to be molded O without any additional configuration or power source, and the heat medium introduced into the chamber 400 can be discharged to the outside through the heat transfer channel 220 It is possible to have an effect that can be discharged.

Although specific embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that the present invention is not limited to the disclosed embodiments, and that various modifications and changes may be made without departing from the spirit and scope of the present invention. It is self-evident to those of ordinary skill. Accordingly, it should be understood that such modifications or alterations should not be understood individually from the technical spirit and viewpoint of the present invention, and that modified embodiments fall within the scope of the claims of the present invention.

100: base frame
200: first module block
220: Open channel
300: second module block
320:
340:
360: piston portion
400: chamber
500: Insulation

Claims (7)

A base frame;
A first module block disposed at an upper portion of the base frame and having a heat transfer channel through which a heating medium for transferring heat flows; And
And a second module block movably provided in the base frame and moving by the flow pressure of the heat medium flowing through the heat transfer channel,
And a chamber in which the heating medium flows into the lower part of the second module block and a space in which an opening hole is formed is formed,
The second module block includes:
A heating unit for transmitting heat to the surface to be molded,
A piston portion located in the space of the chamber and
And a connecting portion inserted in the opening hole and connecting the heating portion and the piston portion. delete The method according to claim 1,
The chamber may comprise:
And an opening / closing unit for selectively opening / closing the inflow of the heating medium to a lower portion of the chamber. The method according to claim 1,
The second module block includes:
And a heat insulating material between the lower part of the heating part and the upper part of the chamber. The method according to claim 1,
Wherein the piston portion includes:
And a sealing member between the sealing member and the space of the chamber. The method according to claim 1,
The chamber may comprise:
And a sealing member on at least one of an upper portion and a lower portion in which the space of the chamber communicates. A molding method using a modular mold apparatus according to any one of claims 1 and 3 to 6,
A heating medium flowing step in which the heating medium flows in the heat transfer channel;
A rising step of moving the second module block upward by a flow pressure of the heat medium flowing into the chamber;
A heat transfer step of transferring heat of a relatively high temperature to a surface to be molded located above the second module block in a state where the heating part protrudes toward the surface to be molded more than the first module block; And
A lowering step of moving the second module block at the same height as the first module block by pressing of the surface to be molded;
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