KR101932732B1 - Solar cell package and manufacturing method thereof - Google Patents

Abstract

Provided are a photovoltaic cell package with increased degree of freedom of connection to a circuit board and a manufacturing method thereof. According to one aspect of the present invention, the photovoltaic cell package comprises: a solar cell semiconductor having one surface and the other surface arranged side by side; positive and negative electrodes formed on one surface of the solar cell semiconductor; a protective layer stacked on the other surface of the solar cell semiconductor and made of a transparent material; an adhesive layer interposed between the solar cell semiconductor and the protective layer to adhere the protective layer to the solar cell semiconductor and made of a transparent material; and a film attached to one surface of the solar cell semiconductor to cover the positive and negative electrodes.

Description

[0001] SOLAR CELL PACKAGE AND MANUFACTURING METHOD THEREOF [0002]

The present invention relates to a solar cell package and a manufacturing method thereof.

Photovoltaic power generation using solar energy is attracting attention as a next-generation energy industry. Solar energy does not cause problems of exhaust gas generated when coal or oil is used, and is clean and suitable for prevention of global warming. Therefore, it is highly useful as an environmentally friendly alternative energy source.

A solar cell can be defined as a device that converts light energy into electric energy by using a photovoltaic effect that generates electrons when light is applied to a p-n junction diode. The solar cell can be classified into a silicon solar cell, a compound semiconductor solar cell represented by group I-III-VI or III-V, a dye-sensitized solar cell, and an organic solar cell, depending on materials used as a junction diode.

On the other hand, as the Internet of Things (IoT) has developed, the power supply problem of the sensor has arisen, and a solar cell has been suggested as one of the solutions. As the demand for such solar cells increases, various types of solar cells are required.

Korean Patent Laid-Open Publication No. 10-2013-0036891 (published on Apr. 14, 2015, a solar cell and a solar cell module using the same)

Embodiments of the present invention provide a solar cell package having a high degree of freedom of connection to a circuit board and a method of manufacturing the same.

According to an aspect of the present invention, there is provided a solar cell comprising: a solar cell semiconductor having one side and another side arranged side by side; A positive electrode and a negative electrode formed on the one surface of the solar cell semiconductor; A protective layer formed on the other surface of the solar cell semiconductor and made of a transparent material; An adhesive layer interposed between the solar cell semiconductor and the passivation layer to adhere the passivation layer to the solar cell semiconductor, the passivation layer comprising a transparent material; And a film attached to the one surface side of the solar cell semiconductor to cover the positive electrode and the negative electrode.

The positive electrode and the negative electrode are each formed in a plurality, and the plurality of positive electrodes and the plurality of negative electrodes may be alternately arranged.

The film may be an anisotropic conductive film.

And a passivation layer formed along a side surface of each of the protective layer, the adhesive layer, and the solar cell semiconductor and contacting the film.

The passivation layer may be made of a material including glass.

Solders may be formed on the surfaces of the positive electrode and the negative electrode, and the film may be attached to the solder.

A metal layer including tin is formed on the surfaces of the positive electrode and the negative electrode, and the film may be attached to the metal layer.

The protective layer may be made of a material including glass.

The film may be formed with a groove along at least a part of an outer periphery of the solar cell semiconductor.

According to another aspect of the present invention, there is provided a solar cell comprising: a first solar cell semiconductor; A first electrode formed on one surface of the first solar cell semiconductor and including a positive electrode and a negative electrode; A first passivation layer formed on the other surface of the first solar cell semiconductor and made of a transparent material; A first adhesive layer interposed between the first solar cell semiconductor and the first passivation layer to adhere the first passivation layer to the first solar cell semiconductor and made of a transparent material; A second solar cell semiconductor; A second electrode formed on one surface of the second solar cell semiconductor and including a positive electrode and a negative electrode; A second passivation layer formed on the other surface of the second solar cell semiconductor and made of a transparent material; A second adhesive layer interposed between the second solar cell semiconductor and the second protective layer to adhere the second protective layer to the second solar cell semiconductor and made of a transparent material; And a film attached to one surface of the first solar cell semiconductor and one surface of the second solar cell semiconductor so as to cover the first electrode and the second electrode, wherein the first solar cell semiconductor and the second solar cell The semiconductors may be spaced apart from one another.

In the film, a groove may be formed between the first solar cell semiconductor and the second solar cell semiconductor.

According to another aspect of the present invention, there is provided a method of manufacturing a solar cell, comprising: preparing a solar cell semiconductor having a positive electrode and a negative electrode formed on one surface thereof; Positioning the solar cell semiconductor such that one side of the solar cell semiconductor faces the film on the film; Forming a package by laminating a protective layer on the other surface of the solar cell semiconductor through an adhesive layer; And cutting the package such that the solar cell semiconductor is divided into a plurality of solar cell units.

The step of cutting the package may include cutting and separating the film corresponding to the plurality of solar cell units.

In cutting the package, a groove may be formed in the film.

The step of cutting the package may further include spin coating on the package to form a side surface of the plurality of solar cell units and a passivation layer in the groove.

The passivation layer may be made of a material including glass.

After forming the passivation layer, the method may further include forming a slit in the passivation layer.

According to another aspect of the present invention, there is provided a method of manufacturing a solar cell, comprising: preparing a solar cell semiconductor having a positive electrode and a negative electrode formed on one surface thereof; Positioning the solar cell semiconductor so that the other surface of the solar cell semiconductor faces the protective layer with an adhesive layer interposed therebetween; Laminating a film covering the positive electrode and the negative electrode on one surface of the solar cell semiconductor; And cutting the solar cell semiconductor and the film so that the solar cell semiconductor is divided into a plurality of solar cell units.

The protective layer may be made of a material including glass.

According to the embodiments of the present invention, the connection degree of the solar cell package to the circuit board is increased, and the solar cell package can be effectively protected.

1 is a cross-sectional view of a solar cell package according to an embodiment of the present invention;
2 and 3 are diagrams of a solar cell semiconductor according to an embodiment of the present invention.
4 is a cross-sectional view illustrating a solar cell package according to another embodiment of the present invention.
5 is a cross-sectional view illustrating a solar cell package according to another embodiment of the present invention.
6 is a sectional view of a solar cell package according to another embodiment of the present invention.
7 is a sectional view of a solar cell package according to another embodiment of the present invention.
8 is a sectional view of a solar cell package according to another embodiment of the present invention.
9 is a cross-sectional view illustrating a solar cell package according to another embodiment of the present invention.
10 is a sectional view of a solar cell package according to another embodiment of the present invention.
11 is a sectional view showing a solar cell package according to another embodiment of the present invention.
12 is a plan view of Fig.
13 to 15 illustrate a method of manufacturing a solar cell package according to an embodiment of the present invention.
16 and 17 illustrate a method of manufacturing a solar cell package according to an embodiment of the present invention.
18 and 19 are views showing a method of manufacturing a solar cell package according to another embodiment of the present invention.
20 to 22 illustrate a method of manufacturing a solar cell package according to another embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The present invention is capable of various modifications and various embodiments, and specific embodiments are illustrated in the drawings and described in detail in the detailed description. It is to be understood, however, that the invention is not to be limited to the specific embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the terms "comprises" or "having" and the like are used to specify that there is a feature, a number, a step, an operation, an element, a component or a combination thereof described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

Hereinafter, embodiments of a solar cell package and a method of manufacturing the same according to the present invention will be described in detail with reference to the accompanying drawings, wherein like reference numerals designate like or corresponding components A duplicate description thereof will be omitted.

FIG. 1 is a cross-sectional view illustrating a solar cell package 100 according to an embodiment of the present invention, and FIGS. 2 and 3 are views showing a solar cell semiconductor 110 according to an embodiment of the present invention.

1, a solar cell package 100 according to an embodiment of the present invention includes a solar cell 110, an electrode 120, a protective layer 130, an adhesive layer A, and a film 140 .

As the solar cell semiconductor 110, single crystal silicon, polycrystalline silicon, amorphous silicon, or the like can be used. An insulating layer may be formed on the solar cell 110. The insulating layer can insulate the electrodes 120 to be described later from each other.

The solar cell semiconductor 110 is provided with one surface and another surface. The solar cell semiconductor 110 may be formed in a thin plate shape. In this case, one surface and the other surface may be two surfaces facing each other except for a side surface.

The one surface and the other surface of the solar cell semiconductor 110 may have an octagonal shape as shown in FIG. 2, but the shape thereof is not limited.

The electrode 120 is formed on one side of the solar cell semiconductor 110 and may include a positive electrode 121 and a negative electrode 122. The positive electrode 121 and the negative electrode 122 may be made of a metal such as platinum (Pt). The electrode 120 formed on the solar cell 110 may be referred to as a " solar cell ".

2, the positive electrode 121 includes a common electrode 120 and a branch electrode 120, and the negative electrode 122 may include a common electrode 120 and a branch electrode 120.

The common electrodes 123 and 124 may be formed at the edges of the solar cell semiconductor 110 and may be spaced apart from each other along the sides of the solar cell semiconductor 110. Or the common electrodes 123 and 124 may be arranged along one side of the solar cell semiconductor 110.

When the common electrode 123 of the positive electrode 121 is formed along one side of the solar cell semiconductor 110, the common electrode 124 of the negative electrode 122 has a different side And may be parallel to the common electrode 123 of the positive electrode 121. [

The branched electrodes 125 and 126 may extend from the common electrodes 123 and 124. When the common electrodes 123 and 124 are formed along the sides of the solar cell semiconductor 110, 126 may extend in a direction perpendicular to the direction in which the common electrodes 123, 124 are formed. One or more branch electrodes 125, 126 extending from one common electrode 123, 124 may be provided. In the solar cell semiconductor 110 having a size of 125 mm in width and width, the width of one branched electrode 125, 126 may be 0.15 mm.

The plurality of branch electrodes 125, 126 may be arranged parallel to each other. The branch electrode 125 of the positive electrode 121 and the branch electrode 126 of the negative electrode 122 may be arranged parallel to each other. An insulating layer may be formed between the branched electrodes 125 and 126 and the branched electrodes 125 and 126.

In Fig. 3, a solar cell semiconductor 110 cut in a U shape in Fig. 2 is shown. The cut solar cell semiconductor can be referred to as a 'solar cell unit'. However, since the solar cell unit eventually becomes another solar cell semiconductor, the term "solar cell unit" will be introduced only when it is necessary to distinguish the solar cell semiconductor from the solar cell unit in order to prevent the term confusion.

The solar cell unit can be cut into various shapes, and even when the solar cell semiconductor 110 has an octagonal shape, the solar cell unit can have a rectangular shape. On the other hand, a plurality of solar cell units can be made from one solar cell semiconductor 110. In the case of FIGS. 2 and 3, more than four solar cell units can be made from one solar cell semiconductor 110.

The electrode 120 of the solar cell unit may include only the branch electrodes 125 and 126 without including the common electrode. In this case, the positive electrodes 121 and 125 and the negative electrodes 122 and 126 are respectively formed in plural numbers, and the plurality of positive electrodes 121 and 125 and the plurality of negative electrodes 122 and 126 may be alternately arranged in parallel.

The number of the electrodes 120 of the solar cell unit may be determined according to the size of cutting the solar cell semiconductor 110. 3, the total number of the electrodes 120 of the solar cell unit (the number of the positive electrodes 121 and the number of the negative electrodes 122) is 10. However, the number of the electrodes 120 may be two or four, .

The electrode 120 may be connected to a pad of a printed circuit board when the solar cell package 100 is mounted on a printed circuit board. In this case, the common electrodes 123 and 124 or branch electrodes 125 and 126 may be connected to the pads of the printed circuit board.

Referring again to FIG. 1, the protective layer 130 of the solar cell package 100 is stacked on the other side of the solar cell semiconductor 110, and protects the solar cell semiconductor 110. The protection layer 130 may be made of a transparent material so that solar light can be incident on the solar cell semiconductor 110. Meanwhile, the thickness of the protective layer 130 may be 0.5 mm.

The protective layer 130 may be formed of a material including polycarbonate (PC), polyethylene terephthalate (PET), ethylene tetrafluoroethylene (ETFE) But are not limited to these.

When the protective layer 130 is made of PC, it has excellent heat resistance, is not deformed by ultraviolet rays, and can have excellent weather resistance. When the protective layer 130 is made of PET, it can have an environmentally friendly and soft feel. The strength can be enhanced when the protective layer 130 is made of ETFE.

The protective layer 130 may be formed outwardly along the outer surface by an embossing process. Such irregularities can prevent scratching of the solar cell semiconductor 110.

The adhesive layer A is interposed between the other surface of the solar cell semiconductor 110 and the protective layer 130 to adhere the protective layer 130 to the other surface of the solar cell semiconductor 110. The adhesive layer (A) may be made of a transparent material so that solar light can be incident on the solar cell semiconductor (110). On the other hand, the adhesive layer (A) may have a thickness of 300 mu m.

The adhesive layer (A) can be made of a material including EVA (ethylene vinyl acetate, EVA). The adhesive layer (A) made of EVA may have adhesive property and will melt when the temperature rises.

The adhesive layer (A) may have a lower melting point than the protective layer (130). Therefore, when the temperature rises, only the adhesive layer A is dissolved, and the protective layer 130 may not be deformed.

The film 140 serves to protect the electrode 120 and is attached to one side of the solar cell semiconductor 110 so as to cover the positive electrode 121 and the negative electrode 122. The thickness of the film 140 may be 200 to 300 mu m.

The film 140 may be a mounting tape or a tape such as a cellophane, a PET material, or the like. In this case, when the solar cell package 100 is mounted on the printed circuit board, the solar cell package 100 may be mounted on the printed circuit board after the film 140 is removed.

As shown in Fig. 1, the film 140 may be attached to one surface of the electrode 120 (on the bottom surface, the surface connected to the printed circuit board). In this case, the film 140 is not attached to the side surface of the electrode 120, and the side surface of the electrode 120 is left as an empty space.

4 is a cross-sectional view illustrating a solar cell package 100 according to another embodiment of the present invention.

4, the film 140 may be bent and attached along the curvature of the electrode 120. In this case, the film 140 is sandwiched between the positive electrode 121 and the negative electrode 122, The film 140 may be attached to part or all of the side surface of the electrode 120.

5 is a cross-sectional view illustrating a solar cell package 100 according to another embodiment of the present invention.

Referring to FIG. 5, the film 145 may be an anisotropic conductive film (ACF). That is, the film 145 may be a water-quality film containing fine conductive particles M (or polymer particles coated with fine conductive particles). Here, the fine conductive particles M may be nickel (Ni), gold (Au), or the like.

The film 145 formed by mixing the fine conductive particles M and the adhesive resin is adhered to the electrode 120 of the solar cell package 100 and subjected to the heating and pressurizing process so that the energization of the fine conductive particles M Direction can be set to the Z axis (up and down) (insulated in the XY plane (left and right) direction).

In this case, when the solar cell package 100 is mounted on the printed circuit board, it can be mounted on the printed circuit board with the film 145 included.

6 is a cross-sectional view illustrating a solar cell package 100 according to another embodiment of the present invention.

Referring to FIG. 6, a solar cell package 100 according to an embodiment of the present invention may further include a passivation layer 150.

The passivation layer 150 is formed along the sides of each of the protective layer 130, the adhesive layer A and the solar cell semiconductor 110 and covers the side surface of the electrode 120 at the edge, Can be contacted with the film (140). As shown in FIG. 6, the boundary line between the passivation layer 150 and the film 140 may be inclined.

The passivation layer 150 formed on the side surface may serve to prevent unnecessary surface leakage current on the side surface. In particular, when the solar cell semiconductor 110 is a solar cell unit, a surface leakage current may be generated at the cut surface, and the passivation layer 150 may prevent this. According to the passivation layer 150, oxygen atoms (O) are bonded to a silicon dangling bond to remove surface energy states that may be present in the forbidden energy bandgap, Thereby reducing or eliminating the surface leakage current.

In addition, the passivation layer 150 may also be formed on the passivation layer 130. In this case, only the passivation layer 150 and the film 140 are directly visible in the solar cell package 100 (although the protective layer 130 can be seen through the transparent passivation layer 150) has exist)

The passivation layer 150 may be made of a material including resin or glass. The glass passivation layer 150 may be phosphosilicate glass (PSG), borophosphosilicate glass (BPSG), or the like. In addition, the thickness of the passivation layer 150 made of a glass material may be uneven.

The passivation layer 150 may be formed of the same material as the film 140. In this case, the film 140 and the passivation layer 150 may be formed without a boundary therebetween.

7 is a cross-sectional view illustrating a solar cell package 100 according to another embodiment of the present invention.

In the solar cell package 100 according to the embodiment of the present invention shown in FIG. 7, the protective layer 135 is made of a material including glass and may have a thickness of 0.3 mm. The protective layer 135 made of a material including glass may be a glass substrate. When the protective layer 135 is formed of glass, it may be effective in preventing moisture penetration.

8 is a cross-sectional view illustrating a solar cell package 100 according to another embodiment of the present invention.

Referring to FIG. 8, a solar cell package 100 according to an embodiment of the present invention includes a solder 160 interposed between an electrode 120 and a film 140. That is, a solder 160 is formed on the surface of the electrode 120, and the film 140 may be attached to the solder 160. Here, the solder 160 may be a solder bump formed at necessary positions of the positive electrode 121 and the negative electrode 122, respectively. The solder bumps may be hardened after the solder paste is applied.

The film 140 may simultaneously protect the solder 160 and the electrode 120 and the solder 160 may be removed after the film 140 is removed when the solar cell package 100 is mounted on the printed circuit board, And may be connected to the printed circuit board pad through a reflow process which melts at a high temperature of ~ 250 ° C. Accordingly, the solar cell package 100 can be mounted on a printed circuit board in a flip chip manner.

9 is a cross-sectional view showing a solar cell package 100 according to another embodiment of the present invention.

A solar cell package 100 according to an embodiment of the present invention includes a metal layer 170 interposed between an electrode 120 and a film 140. That is, the metal layer 170 may be formed on the surface of the electrode 120, and the film 140 may be attached to the metal layer 170. Here, the metal layer 170 may include tin (Sn), silver (Au), copper (Cu), and the like, and may be formed by plating or metal paste application. The metal layer 170 may be formed at a desired position of the positive electrode 121 and the negative electrode 122, respectively.

The film 140 protects the metal layer 170 and the electrode 120 together and when the solar cell package 100 is mounted on a printed circuit board the film 140 is removed after the metal layer 170 is melted and printed And may be connected to a circuit board pad.

10 is a cross-sectional view illustrating a solar cell package 100 according to another embodiment of the present invention.

Referring to FIG. 10, a solar cell package 200 according to an embodiment of the present invention includes a plurality of solar cells. That is, the solar cell package 200 according to the embodiment of the present invention includes a plurality of solar cell semiconductors 210 and 310, and a plurality of solar cell semiconductors 210 and 310 are attached to one film 240 .

The solar cell package 200 according to FIG. 10 includes two solar cell semiconductors 210 and 310, specifically, a first solar cell semiconductor 210; A first electrode 220 formed on one surface of the first solar cell semiconductor 210 and including a positive electrode 221 and a negative electrode 222; A first protective layer 230 formed on the other surface of the first solar cell 210 and made of a transparent material; The first solar cell 210 is interposed between the first solar cell 210 and the first protection layer 230 to adhere the first protection layer 230 to the first solar cell 210, 1 adhesive layer (A); A second solar cell semiconductor 310; A second electrode 320 formed on one surface of the second solar cell semiconductor 310 and including a positive electrode 321 and a negative electrode 322; A second protective layer 330 formed on the other surface of the second solar cell 310 and made of a transparent material; The second passivation layer 330 is interposed between the second solar cell 310 and the second passivation layer 330 to bond the second passivation layer 330 to the second cell cell 310, 2 adhesive layer (A); And a film 240 attached to one surface of the first solar cell semiconductor 210 and one surface of the second solar cell semiconductor 310 to cover the first electrode 220 and the second electrode 320, And the first and second solar cell semiconductors 210 and 310 are spaced apart from each other.

In this case, when the film 240 is removed, the first solar cell semiconductor 210 and the second solar cell semiconductor 310 can be completely separated from each other.

11 is a cross-sectional view illustrating a solar cell package 400 according to another embodiment of the present invention. 11, a plurality of solar cell semiconductors 410 are attached to one film 440 as in FIG. Further, grooves G may be formed in the film 440. [

The groove G may be formed along at least a part of the outer periphery of the solar cell semiconductor 410. Here, the 'outer edge of the solar cell semiconductor 410' may be an edge (edge) of a region of the film 440 covered with the solar cell semiconductor 410. That is, the grooves G may be formed along at least a part of the edges.

The groove G may be formed between the solar cell semiconductor 410 and the solar cell semiconductor 410. Since the depth of the groove G is smaller than the thickness of the film 440, the film 440 is not separated even if the groove G is formed. The sectional shape of the groove G is not limited, and the lower end may be tapered. In this case, when the user removes only the film 440, a plurality of solar cell semiconductors 410 separated from each other can be obtained.

Referring to Fig. 12, the position of the groove G can be more clearly revealed.

The area of the film 440 is formed to be equal to or larger than the entire area of the solar cell semiconductor 410 so that the film 440 can be exposed to the periphery of the solar cell semiconductor 410. Since the length of the groove G is shorter than the length of the film 440 and the depth of the groove G is smaller than the thickness of the film 440, the films 440 are not separated from each other, Only the cell semiconductor 410 is separated.

Therefore, when the user removes only the film 440, the solar cell package 400 according to the embodiment of the present invention is moved, packaged and sold in a state in which the film 440 is attached, So that the solar cell 410 can be mounted on the printed circuit board.

In FIG. 12, the groove G 'is formed at the outermost side of the solar cell semiconductor 410, but a groove may not be formed at the edge of the solar cell semiconductor 410, if necessary. This is because the case where the outermost groove G 'of the solar cell semiconductor 410 is present or absent or the film 440 is removed can be the same.

In FIG. 11, one solar cell semiconductor 410 is attached on a film 440, and a groove G is formed in the film 440 along the boundary between the solar cell units. And the position of the groove G is shown in Fig.

13 to 15 are views showing a method of manufacturing a solar cell package according to an embodiment of the present invention. 13 to 15, a solar cell package is manufactured using the solar cell semiconductor 110 shown in FIG. 2, and the term solar cell unit is introduced for preventing confusion.

13, the step of preparing a solar cell semiconductor 110 in which a positive electrode 121 and a negative electrode 122 are formed on one surface thereof; And positioning the solar cell semiconductor 110 such that one side of the solar cell semiconductor 110 faces the film 140 on the film 140. As a result, the electrode 120 of the solar cell semiconductor 110 is attached to the film 140.

14, a step of laminating the protective layer 130 on the other surface of the solar cell semiconductor 110 with the adhesive layer A interposed therebetween is performed to form the solar cell semiconductor 110, the adhesive layer A, Layer 130 are stacked in this order. The adhesive layer (A) and the protective layer (130) may cover the side surface of the solar cell semiconductor (110) as needed.

The protective layer 130 is vacuum laminated on the other side of the solar cell semiconductor 110. Specifically, the adhesive layer A and the protective layer 130 are formed on the solar cell semiconductor 110 in a vacuum lamination chamber. 110). The adhesive layer (A) is melted to have fluidity and spread on the other side of the solar cell semiconductor (110). Furthermore, the adhesive layer (A) can move to the side of the solar cell semiconductor (110).

At this time, the adhesive layer A has a lower melting point than the protective layer 130, so that only the adhesive layer A is melted while the protective layer 130 is maintained, The solar cell 130 may be adhered to the solar cell semiconductor 110. Meanwhile, as the protective layer 130 is vacuum-laminated, a vacuum space may be formed between the film 140 and the solar cell semiconductor 110. However, such a vacuum space may not be generated according to vacuum lamination conditions.

After the vacuum lamination is completed, the adhesive layer (A) is cured.

Referring to FIG. 15, the step of cutting the package is performed so that the solar cell semiconductor 110 is divided into a plurality of solar cell units. Here, the solar cell unit 110 may have the same size as that of FIG. 2 and the solar cell unit may have the same size as U of FIG. The package cutting can be done using a cutting machine such as a diamond sawing blade.

In the package cutting step, the film 140 is also cut and separated corresponding to the plurality of solar cell units, so that the solar cell package 100 completely separated from each other can be obtained. On the other hand, unnecessary adhesive layer (A) and protective layer (130), for example, adhesive layer (A) and protective layer (130) positioned on the side surface can be removed when the package is cut.

On the other hand, in the package cutting step, only the package comprising the solar cell semiconductor 110, the adhesive layer A, and the protective layer 130 can be cut except for the film 140. That is, in the package cutting step, only the solar cell semiconductor 110, the adhesive layer A, and the protective layer 130 are cut, and the film 140 is not cut.

16 and 17 are views showing a method of manufacturing a solar cell package according to an embodiment of the present invention. In FIGS. 16 and 17, a solar cell package is manufactured using the solar cell semiconductor 110 shown in FIG. 2, and the term solar cell unit is introduced for preventing confusion.

16, preparing a solar cell semiconductor 410 having a positive electrode and a negative electrode 420 on one surface thereof; Positioning the solar cell semiconductor (410) such that one side of the solar cell semiconductor (410) faces the film (440) on the film (440); And a step of laminating the protective layer 430 on the other surface of the solar cell semiconductor 410 with the adhesive layer A interposed therebetween are performed to form the solar cell semiconductor 410, the adhesive layer A, the protective layer 430, A 'package' is formed.

The protective layer 430 is vacuum laminated on the other side of the solar cell semiconductor 410. Specifically, the adhesive layer A and the protective layer 430 are formed on the solar cell semiconductor 410 in a vacuum lamination chamber. 410) on the other surface. The adhesive layer (A) is melted to have fluidity and spread on the other side of the solar cell semiconductor (410). Further, if necessary, the adhesive layer (A) and the protective layer (430) can cover the side surface of the solar cell semiconductor (410) and the side surface of the electrode (420).

At this time, the adhesive layer A has a melting point lower than that of the protective layer 430, so that only the adhesive layer A is melted while the protective layer 430 is maintained, The solar cell 130 may be bonded to the solar cell semiconductor 410. After the vacuum lamination is completed, the adhesive layer (A) is cured.

17, a step of cutting the package is performed such that the solar cell semiconductor 410 is divided into a plurality of solar cell units, wherein a groove G is formed in the film 440. [ That is, not only the package but also the film 440 is cut, but the film 440 is not cut so as to be completely separated, but is cut only to the extent that the groove G is formed in the film 440. As a result, the packages are detached but stick together by the film 440. If the user removes only the film 440, a plurality of solar cell units can be obtained.

18 and 19 are views showing a method of manufacturing a solar cell package according to another embodiment of the present invention. It can be understood that Figs. 18 and 19 are performed after Fig.

Referring to FIG. 18, a passivation layer 450 may be formed between the solar cell units and the grooves G of the film 4140. The passivation layer 450 may be formed using a spin coating method. First, the package located on the film 440 is placed on the spin-coated plate, and the coating liquid is dropped while the plate is rotated while the interval between the solar cell units (the width of the groove G) The coating liquid may be impregnated between the solar cell units. As a result, the coating liquid is located in the side of the solar cell unit and in the groove G. [ In addition, a part of the coating liquid may remain on the protective layer 430. Such a coating liquid may be a material including glass.

Referring to FIG. 19, a step of forming a slit S in the passivation layer 450 is performed, and a plurality of solar cell units are singulated through the respective steps. The slit S may be formed by a diamond sawing blade. Also, by activating the rollers on the package, the passivation layer 450 may be mutually broken to form the slit S. Particularly, in the case of the passivation layer 450 made of a glass material, the passivation layer 450 may not be broken, and both thicknesses may be uneven.

Even if the passivation layer 450 is cut, the plurality of solar cell units are stuck together by the film 440. [ That is, the depth of the slit S coincides with the depth of the groove G of the film 440, so that a plurality of solar cell units are attached by the film 440, and when the film 440 is removed, It can be completely singulated into a solar cell unit.

20 to 22 are views showing a method of manufacturing a solar cell package according to another embodiment of the present invention. 20 to 22, the solar cell package 100 is manufactured using the solar cell semiconductor 110 shown in FIG. 2, and the term solar cell unit is introduced for preventing the term confusion.

20, preparing a solar cell semiconductor 110 having a positive electrode 121 and a negative electrode 122 formed on one surface thereof; And the step of positioning the solar cell semiconductor 110 such that the other surface of the solar cell semiconductor 110 faces the protective layer 135 with the adhesive layer A interposed therebetween. Here, the protective layer 135 may be a glass substrate.

Referring to FIG. 21, a step of laminating a film 140 covering the positive electrode 121 and the negative electrode 122 on one side of the solar cell semiconductor 110 is performed.

22, the step of cutting the solar cell semiconductor 110 and the film 140 is performed so that the solar cell semiconductor 110 is divided into a plurality of solar cell units.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit of the invention as set forth in the appended claims. The present invention can be variously modified and changed by those skilled in the art, and it is also within the scope of the present invention.

100: solar cell package
110: solar cell semiconductor
120: Electrode
121: positive polarity
122: Negative electrode
123, 124: common electrode
125, 126: branch electrodes
130, 135: protection layer
A: Adhesive layer
140, 145: Film
M: fine conductive particles
150: Passivation layer
160: Solder
170: metal layer
200: Solar cell package
210: First Solar Cell Semiconductor
220: first electrode
221: positive polarity
222: Negative electrode
230: first protective layer
240: Film
G: Home
310: Second Solar Cell Semiconductor
320: second electrode
321: positive polarity
322: negative polarity
330: second protective layer
400: solar cell package
410: solar cell semiconductor
420: electrode
430: protective layer
440: Film
450: passivation layer
S: Slit

Claims (19)

1. A solar cell package mountable on a printed circuit board,
A solar cell semiconductor having one side and another side arranged side by side;
A positive electrode and a negative electrode formed on the one surface of the solar cell semiconductor;
A protective layer formed on the other surface of the solar cell semiconductor and made of a transparent material;
An adhesive layer interposed between the solar cell semiconductor and the passivation layer to adhere the passivation layer to the solar cell semiconductor, the passivation layer comprising a transparent material; And
And a film which is directly attached to and removed from the positive electrode and the negative electrode,
When the solar cell semiconductor is mounted on the printed circuit board, the film is removed from the positive electrode and the negative electrode,
The film is formed with a groove along at least a part of an outer periphery of the solar cell semiconductor,
Wherein a depth of the groove is smaller than a thickness of the film.
The method according to claim 1,
The positive electrode and the negative electrode are formed in plural numbers,
A plurality of positive electrodes and a plurality of negative electrodes are alternately arranged side by side.
delete The method according to claim 1,
And a passivation layer formed along a side surface of each of the protective layer, the adhesive layer, and the solar cell semiconductor and contacting the film.
5. The method of claim 4,
Wherein the passivation layer is made of a material including glass.
delete delete The method according to claim 1,
Wherein the protective layer is made of a material including glass.
delete 1. A solar cell package mountable on a printed circuit board,
A first solar cell semiconductor;
A first electrode formed on one surface of the first solar cell semiconductor and including a positive electrode and a negative electrode;
A first passivation layer formed on the other surface of the first solar cell semiconductor and made of a transparent material;
A first adhesive layer interposed between the first solar cell semiconductor and the first passivation layer to adhere the first passivation layer to the first solar cell semiconductor and made of a transparent material;
A second solar cell semiconductor;
A second electrode formed on one surface of the second solar cell semiconductor and including a positive electrode and a negative electrode;
A second passivation layer formed on the other surface of the second solar cell semiconductor and made of a transparent material;
A second adhesive layer interposed between the second solar cell semiconductor and the second protective layer to adhere the second protective layer to the second solar cell semiconductor and made of a transparent material; And
And a film directly attached to and removed from the first and second electrodes,
Wherein the first solar cell semiconductor and the second solar cell semiconductor are spaced apart from each other,
Wherein the first protective layer and the second protective layer are spaced apart from each other,
Wherein the first adhesive layer and the second adhesive layer are spaced apart from each other,
Wherein when the first solar cell semiconductor and the second solar cell semiconductor are mounted on the printed circuit board, the first solar cell semiconductor and the second solar cell semiconductor are separated and mounted, respectively, And a second electrode,
The film is provided with a groove located between the first solar cell semiconductor and the second solar cell semiconductor,
Wherein a depth of the groove is smaller than a thickness of the film.
delete A method of manufacturing a solar cell package mountable on a printed circuit board,
Preparing a solar cell semiconductor having a positive electrode and a negative electrode formed on one surface thereof;
Directly attaching a film to the positive electrode and the negative electrode;
Forming a package by laminating a protective layer on the other surface of the solar cell semiconductor through an adhesive layer; And
Cutting the package such that the solar cell semiconductor is separated into a plurality of solar cell units,
In cutting the package, the film is not cut,
Wherein when the plurality of solar cell units are mounted on the printed circuit board, the film is removed from the positive electrode and the negative electrode so that the plurality of solar cell units are separately mounted,
In the step of cutting the package, grooves are formed in the film,
Wherein a depth of the groove is smaller than a thickness of the film.
delete delete 13. The method of claim 12,
After the step of cutting the package,
And performing spin coating on the package to form a side surface of the plurality of solar cell units and a passivation layer in the grooves.
16. The method of claim 15,
Wherein the passivation layer is made of a material including glass.
16. The method of claim 15,
After forming the passivation layer,
And forming a slit in the passivation layer.
delete delete

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