JP5576957B2 - Solar cell module - Google Patents

Description

The present invention relates to a solar Ikemo joules, in particular, reliable connection with the electrical connection between the electrode and the wiring of the wiring substrate of the solar cell can be carried out cold and simply, relatively good a solar collector Ikemo Joule having electrical characteristics.

In recent years, development of clean energy has been demanded due to problems of depletion of energy resources and global environmental problems such as an increase in CO _{2 in} the atmosphere. In particular, solar power generation using solar cells has been developed as a new energy source. It has been put to practical use and is on the path of development.

  As such a solar cell, conventionally, for example, a pn junction is formed on the light receiving surface of a single crystal or polycrystalline silicon substrate by diffusing an impurity having a conductivity type opposite to that of the silicon substrate. Double-sided electrode type solar cells, in which electrodes are formed on the back surface on the opposite side, are mainly used. In recent years, a so-called back electrode type solar cell in which both a p-type electrode and an n-type electrode are formed on the back surface of a silicon substrate has been developed.

  In addition, in order to reduce raw material costs, the silicon substrate has been made thinner. However, along with the thinning of the solar cells resulting from the thinning of the silicon substrate, cell cracks in the wiring work of the solar cells at the time of manufacturing the solar cell module have become a problem.

  In order to solve such a problem, for example, Patent Document 1 proposes a method of wiring solar cells using a wiring board. Here, the wiring board is configured to include a base material and wiring formed on the base material.

  Thus, although the proposal of using a wiring board for the connection of a photovoltaic cell is made | formed, it has not reached practical use. This is because of the following problems.

  First, regarding the connection between the electrode of the solar battery cell and the wiring of the wiring board, when connecting via solder, when using general lead-free solder (Sn—Ag—Cu solder or the like), 250 solder is used. It is necessary to heat to near ℃. Thus, when it is necessary to heat to a high temperature when connecting the electrode of the solar cell and the wiring of the wiring substrate, the wiring between the silicon substrate of the solar cell and the wiring substrate is required at the time of cooling after the high temperature heating. There is a problem that stress is generated due to a difference in thermal expansion coefficient from the material, and the solar battery cell is cracked or the connection between the solar battery cell and the wiring board is peeled off, resulting in low connection reliability.

  Moreover, when connecting the electrode of a photovoltaic cell and the wiring of a wiring board via a solder, the process of aligning and arrange | positioning a photovoltaic cell on a wiring board, and heating with a reflow furnace after that is required. However, this process is complicated, and when a solar cell having a large surface area is used, there is a problem in that misalignment tends to occur during reflow and frequent connection failures occur.

  Furthermore, instead of solder, as shown in Patent Document 2, it is conceivable to connect the electrodes of the solar cells and the wiring of the wiring board using an ACF (Anisotropic Conductive Film), but the ACF is expensive. It is difficult to use for a solar cell having a large surface area, and the electric resistance is too high to pass a large current, so that the F.V. There has been a problem that electrical characteristics such as F (Fill Factor) become low.

JP 2005-340362 A JP 2005-175436 A

In view of the above circumstances, the object of the present invention is to make the electrical connection between the electrode of the solar battery cell and the wiring of the wiring board at a low temperature and easily, and the connection is highly reliable and relatively good. and to provide a solar Ikemo Joule having electrical characteristics.

The present invention is a solar cell module in which a solar cell in which a plurality of solar cells are bonded to a wiring board with an insulating adhesive is sealed using a sealing material, and the solar cell is one of the semiconductor substrates. A back electrode type solar cell provided with a p-electrode and an n-electrode on the surface side, and a wiring substrate is provided on one surface side of the insulating base material on the p-electrode and the n-electrode of the solar cell. Correspondingly, conductive material wiring is provided, and as an insulating adhesive, an adhesive different from the sealing material between the adjacent electrodes of the solar battery cell , which is a silicone adhesive, acrylic A solar cell module in which an adhesive including at least one selected from the group consisting of an adhesive, an epoxy adhesive, and a rubber adhesive is installed.

Here, in the solar battery module of the present invention, it is preferable that the electrode of the solar battery cell and the wiring of the wiring board are electrically connected via a conductive adhesive.

Moreover, Te solar cell module odor of the present invention, it is preferable that the electrode and the wiring substrate of the solar cell lines are connected in direct contact.

Moreover, Te solar cell module odor of the present invention, it is preferable that the plurality of wiring boards are electrically connected by a conductive member.

Moreover, Te solar cell module odor of the present invention, the wiring board has, on the surface of the insulating substrate, and the n-type wiring, a p-type wiring, electrically and wiring for the n type and p-type wire And at least one end of the insulating base material is provided with a current collecting bus bar electrode, and one bus bar electrode and the other bus bar electrode of two adjacent wiring boards. it is not preferable that are electrically connected by are conductively member.

According to the present invention, an electric connection between the electrode of the solar battery cell and the wiring of the wiring board can be easily performed at a low temperature, and it is inexpensive, has a high connection reliability, and has a relatively good electric characteristic. it is possible to provide a conductive Ikemo joules.

It is typical sectional drawing of an example of the solar cell which can be used for this invention. It is typical sectional drawing of another example of the solar cell which can be used for this invention. (A) is a schematic plan view of an example of the back surface of the solar cell can be used in the present invention, (b) is a schematic of another example of the back surface of the solar cell can be used in the present invention FIG. It is a typical top view of an example of the wiring board which can be used for this invention. (A)-(c) is typical sectional drawing for demonstrating an example of the method of producing the wiring board which can be used for this invention. It is a typical top view of an example of the solar cell which can be used for this invention. It is a typical top view of another example of the solar cell which can be used for this invention. (A) And (b) is typical sectional drawing illustrating an example of the manufacturing method of the solar cell which can be used for this invention. It is typical sectional drawing of an example of the solar cell module of this invention.

  Embodiments of the present invention will be described below. In the drawings of the present invention, the same reference numerals represent the same or corresponding parts.

FIG. 1 shows a schematic cross-sectional view of an example of a solar cell that can be used in the present invention. Here, the solar cell shown in FIG. 1 has a solar cell 100 and a wiring substrate 200, and the light receiving surface of the n-type or p-type silicon substrate 101 of the solar cell 100 (sunlight is mainly incident). An antireflection film 102 is formed on the surface of the silicon substrate 101, and an n-type impurity doping region 104 formed by diffusing n-type impurities on the back surface (surface opposite to the light receiving surface) of the silicon substrate 101. The p-type impurity doping regions 105 formed by diffusing p-type impurities are alternately formed with a predetermined interval.

  A passivation film 103 is formed on the back surface of the silicon substrate 101, and an n-electrode 106 is formed so as to be in contact with the n-type impurity doping region 104 through a contact hole formed in the passivation film 103. A p-electrode 107 is formed in contact with the type impurity doping region 105.

  In addition, the wiring substrate 200 includes an insulating substrate 111, an n-type wiring 109 and a p-type wiring 110 formed on the insulating substrate 111.

  The n-electrode 106 of the solar battery cell 100 is electrically connected to the n-type wiring 109 of the wiring substrate 200, and the p-electrode 107 is electrically connected to the p-type wiring 110 of the wiring substrate 200. Yes.

Here, in the solar cell of this embodiment , the connection between the n-electrode 106 of the solar battery cell 100 and the n-type wiring 109 of the wiring substrate 200 and the connection between the p-electrode 107 and the p-type wiring 110 of the wiring substrate 200 are performed. Is characterized in that it is formed by adhesion between the solar battery cell 100 and the wiring substrate 200 by the adhesive 120.

  As described above, the solar battery cell 100 and the wiring board 200 are fixed by bonding with the adhesive 120 between the solar battery cell 100 and the wiring board 200, so that the solar battery cell 100 is aligned on the wiring board 200. The solar battery cell 100 can be fixed and connected on the wiring substrate 200 simply by installing the device, and then the solar battery is sealed in a sealing material such as a resin to produce a solar battery module. Good electrical connection is obtained by crimping. By producing the solar cell module in this manner, it becomes difficult to cause a positional shift after the solar cell is installed on the wiring board by the adhesive, and a solder connection process that requires heating at about 250 ° C. can be omitted. In addition, a highly reliable connection can be realized easily. Further, the n-electrode 106 of the solar battery cell 100 and the n-type wiring 109 of the wiring board 200 are directly in contact with each other, and the p-electrode 107 of the solar battery cell 100 and the p-type wiring 110 of the wiring board 200 are connected. Can be reduced in electrical resistance at the connecting portion as compared with the case where the connection is made using the ACF. Electrical characteristics such as F are also relatively good.

FIG. 2 shows a schematic cross-sectional view of another example of a solar cell that can be used in the present invention. 2 is connected to the n-type electrode 109 of the solar battery cell 100 and the n-type wiring 109 of the wiring substrate 200, and is used for the p-type of the p-electrode 107 of the solar battery cell 100 and the wiring substrate 200. 1 is different from the solar cell shown in FIG. 1 in that the connection to the wiring 110 is made through the conductive adhesive 108.

  Also in the solar battery shown in FIG. 2, the solar battery cell 100 and the wiring substrate 200 are fixed by the adhesive 120 between them. When solder is used as the conductive adhesive 108, for example, the conductive adhesive 108 may be installed and then connected by heating in a reflow furnace.

  However, in the solar cell shown in FIG. 2, it is very advantageous to use, for example, Sn—Bi solder having a low melting point, low cost and low electrical resistance as the conductive adhesive 108. Sn-Bi solder is applied in advance to at least one of the electrode of the solar battery cell 100 and the wiring of the wiring board 200, and the solar battery cell 100 is placed on the wiring board 200. Solar cell 100 and wiring substrate 200 are fixed by adhesive 120. Then, it seals in a sealing material like the above, without heating with a reflow furnace etc. Since the electrical connection via the conductive adhesive 108 is reliably performed by the processing heat at the time of sealing and the mechanical pressure bonding by sealing, the heating process by the reflow furnace can be omitted. The same applies to the case where a low-temperature curing type conductive adhesive (including a conductive adhesive other than solder) other than Sn-Bi solder is used as the conductive adhesive 108.

  For example, as shown in FIG. 1 and FIG. 2, the solar battery 100 is fixed to the wiring substrate 200 with an adhesive 120, thereby sealing the solar battery in a sealing material and completing the production of the solar battery module. In the meantime, it is possible to prevent the connection position between the solar battery cell 100 and the wiring substrate 200 from being shifted, and a highly reliable connection can be performed. Moreover, it can be expected that the connection between the solar battery cell 100 and the wiring board 200 is reinforced even after the solar battery is sealed.

  The adhesive 120 can be used without any particular limitation as long as the solar battery cell 100 and the wiring substrate 200 can be bonded together. For example, the adhesive 120 has a high heat resistance, such as a silicone adhesive or an acrylic adhesive. A material including at least one selected from the group consisting of an epoxy adhesive and a rubber adhesive can be used. Here, as a silicone adhesive, an acrylic adhesive, an epoxy adhesive, and a rubber adhesive, for example, conventionally known ones can be used.

  Moreover, as the adhesive 120, it is preferable to use an adhesive. When a pressure-sensitive adhesive is used as the adhesive 120, stress can be absorbed by the flexibility of the pressure-sensitive adhesive material, so that connection failure between the solar cell 100 and the wiring substrate 200 can be suppressed, and the solar cell. There is a tendency that 100 cracks can be effectively prevented. In addition, even when the connection position between the solar battery cell 100 and the wiring board 200 is shifted, there is an advantage that the solar battery cell 100 and the wiring board 200 can be separated and connected again. An adhesive is a kind of adhesive and generally has viscosity. It gives fluidity to the adherend by applying pressure, and cohesiveness against peeling becomes a holding force instead of curing. Say.

  Moreover, since it is necessary to heat a solar cell when sealing a solar cell, as the adhesive 120, what shows stable adhesiveness even when exposed to a temperature environment of 150 ° C. or higher is used. It is more preferable to use a material that exhibits stable adhesion even when exposed to a temperature environment of 180 ° C. or higher.

  In the above, “stable adhesiveness” means that even when heated, the adhesive has adhesiveness, and the solar battery cell and the wiring board do not cause a positional shift even with an impact such as vibration. . Furthermore, the adhesive preferably has stable adhesiveness even after heating, and it is preferable to ensure electrical connection by adhering the solar battery cell and the wiring board.

  Specifically, as an adhesive exhibiting stable adhesion even when exposed to a temperature environment of 180 ° C. or higher, SD4570 manufactured by Dow Corning as a silicone adhesive, Sumitomo 3M Co., Ltd. as an acrylic adhesive There are 9079 made and C-1080A / B made by Nacalai Tesque Co., Ltd. as an epoxy adhesive. Furthermore, there is DB5441 manufactured by Diabond Industry Co., Ltd. as an acrylic adhesive (adhesive) that can be screen-printed. Can be formed. These exhibit stable adhesion even when exposed to a temperature environment of 150 ° C. or higher. Moreover, the adhesive tape which apply | coated the adhesive agent (adhesive) to the PET base material or the PEN base material previously can be used. For example, PET tape YT153S manufactured by YOUNGWOO using a PET base material and a silicone adhesive, and tape No. manufactured by Sumitomo 3M Co., Ltd. using a PET base material and an acrylic adhesive. 754, Tape No. manufactured by Sumitomo 3M Limited using a PET base material and a rubber adhesive. There are 4734 etc., and acrylic adhesives such as T4900, G9052 etc. manufactured by Sony Chemical Co., which show stable adhesiveness even when exposed to a temperature environment of 150 ° C. or higher.

  The adhesive 120 is preferably installed on at least a part of the wiring board 200 other than the wiring.

Further, as the insulating substrate 111 used in wiring substrate 200, for example, it can be used as the material having a higher electrical resistance than the n-type wiring 109 and wires for p type 110, in this embodiment, PEN (polyethylene naphthalate) and / or PET (polyethylene terephthalate) are preferably used because the electrodes of the solar battery cell 100 and the wiring of the wiring substrate 200 can be connected at a low temperature. When PEN or PET is used as the insulating substrate 111 of the wiring substrate 200, the material cost is not so high, and the manufacturing cost of the solar cell tends to be reduced.

  The n-type wiring 109 and the p-type wiring 110 used for the wiring substrate 200 can be used without particular limitation as long as they are made of a conductive material, but from the viewpoint of further reducing the electrical resistance of the wiring. Is preferably composed of a material containing at least one selected from the group consisting of copper, aluminum and silver. The n-type wiring 109 and the p-type wiring 110 may be made of the same material or different materials.

  Moreover, as the conductive adhesive 108, for example, a conductive material can be used, and it is preferable to use one having a melting temperature or a curing temperature of 180 ° C. or lower, and 150 ° C. or lower. It is more preferable to use one. The melting or curing of the conductive adhesive 108 is preferably performed in a solar cell sealing step from the viewpoint of simplification of the process, and this sealing step is usually performed at 180 ° C. or lower. In addition, when the melting temperature or the curing temperature of the conductive adhesive 108 is 180 ° C. or lower, for example, even when a PEN film is used for the insulating substrate 111 of the wiring substrate 200, the insulating substrate 111 tends to hardly heat shrink. It is in. In addition, when the melting temperature or the curing temperature of the conductive adhesive 108 is 150 ° C. or lower, for example, even when a PET film is used as the insulating substrate 111 of the wiring substrate 200, the insulating substrate 111 tends to hardly heat shrink. It is in.

  The melting temperature of the conductive adhesive 108 is a temperature at the start of melting of the conductive adhesive 108, and the curing temperature of the conductive adhesive 108 is a temperature at the start of curing of the conductive adhesive 108. is there.

  Further, as the conductive adhesive 108, it is preferable to use Sn—Bi solder. As the conductive adhesive 108, Sn—Bi solder, for example, melts at a low temperature of about 140 to 150 ° C., so that it can be processed at a low temperature, can be obtained at a low cost, and is easy to handle. The resistance can be low. Here, the Sn—Bi-based solder means a solder having Sn and Bi as main components among metals constituting the solder, and the total mass of Sn and Bi is 90% by mass or more of the total mass of the solder.

  In addition, the electrical resistivity of the conductive adhesive 108 is preferably 0.001 Ωcm or less from the viewpoint of improving the electrical characteristics of the solar cell.

  Further, in the present invention, as the solar battery cell, for example, a back electrode type in which both an n electrode and a p electrode are formed only on the back surface of a semiconductor substrate such as a silicon substrate as shown in FIG. 1 or FIG. It is preferable to use solar cells. In addition, as a member which comprises a photovoltaic cell, a conventionally well-known thing can be used, for example.

In FIG. 3 (a), shows a schematic plan view of an example of the back surface of the solar cell may be used in actual invention. Here, an n-electrode 106 and a p-electrode 107 are formed on the back surface of the silicon substrate 101. The n-electrode 106 and the p-electrode 107 are respectively in the same direction on the back surface of the silicon substrate 101 (the paper surface in FIG. 3A). In the left-right direction). The strip-shaped n-electrodes 106 and strip-shaped p-electrodes 107 are alternately arranged one by one in the vertical direction on the paper surface of FIG.

In FIG. 3 (b), a schematic plan view of another example of the back surface of the solar cell may be used in actual invention. Here, an n electrode 106 and a p electrode 107 are formed on the back surface of the silicon substrate 101, and each of the n electrode 106 and the p electrode 107 is formed in a dot shape. In addition, the dotted n-electrodes 106 are arranged adjacent to each other in the vertical direction and the horizontal direction of the paper surface of FIG. 3B, and the dotted p-electrodes 107 are adjacent to each other. Are arranged. Note that the dot-like n-electrode 106 and the dot-like p-electrode 107 shown in FIG. 3B are linearly arranged in the vertical direction and the horizontal direction of the paper surface of FIG.

  The electrode shape of the n-electrode 106 and the p-electrode 107 on the back surface of the solar battery cell is, for example, a strip shape as illustrated in FIG. 3A and / or a dot shape as illustrated in FIG. 3B, for example. It is preferable to do. In this case, there is a tendency that bubbles do not remain between the solar battery cell and the wiring board when the solar battery is sealed in a sealing material described later.

Figure 4 shows a schematic plan view of an example of a wiring board which can be used in actual invention. Here, an n-type wiring 109 and a p-type wiring 110 are provided on the surface of the insulating substrate 111 of the wiring board 200, and the n-type wiring 109 and the p-type wiring 110 are electrically connected. A connection electrode 113 is provided for connection.

  In addition, a current-collecting bus bar p-electrode 114 is electrically connected to the p-type wiring 110 installed at one end in the longitudinal direction of the insulating substrate 111 and installed at the other end. A current-collecting bus bar n-electrode 115 is electrically connected to the n-type wiring 109.

  Furthermore, an adhesive (not shown) is applied to at least a part of the region other than the n-type wiring 109, the p-type wiring 110, the connection electrode 113, the bus bar p electrode 114, and the bus bar n electrode 115 on the surface of the insulating substrate 111. ) Is arranged.

  Each of the bus bar p electrode 114 and the bus bar n electrode 115 is provided with a slit 112 serving as a positioning opening.

  In FIG. 4, the regions of the n-type wiring 109, the p-type wiring 110, the connection electrode 113, the bus bar p electrode 114, and the bus bar n electrode 115 are separated by broken lines. It is not limited to one.

Hereinafter, with reference to schematic cross-sectional view of FIG. 5 (a) ~ FIG 5 (c), a description will be given of an example of a manufacturing step of a wiring board can be used in actual invention. First, as shown in FIG. 5A, a curable resin 122 is applied on the surface of an arbitrary base material 121, and a conductive sheet such as a copper foil is pasted on the surface of the curable resin 122. The n-type wiring 109 and the p-type wiring 110 are formed by etching this into a predetermined shape. Here, as the curable resin 122, for example, a conventionally known curable resin that is cured by heating and / or UV (ultraviolet radiation) irradiation and loses its adhesiveness is used.

  Next, as shown in FIG. 5B, the base material 121 on which the n-type wiring 109 and the p-type wiring 110 produced above are bonded to the insulating substrate 111 on which the adhesive 120 is installed. Then, heating and / or UV irradiation is performed on the interface between the curable resin 122 on the substrate 121 and the n-type wiring 109 and the p-type wiring 110. Thereby, the adhesiveness of the curable resin 122 is lost, and the n-type wiring 109 and the p-type wiring 110 are separated from the curable resin 122.

  Thereafter, as shown in FIG. 5C, the n-type wiring 109 and the p-type wiring 110 can be transferred to the adhesive 120 on the surface of the insulating substrate 111 by separating the base material 121. As a result, a wiring board having a configuration in which the adhesive 120 is exposed in at least a part of the region other than the n-type wiring 109 and the p-type wiring 110 on the surface of the insulating substrate 111 can be formed.

  In the above, depending on the material of the adhesive 120, the curable resin 122 may be heated and / or irradiated with UV before the base material 121 and the insulating substrate 111 are bonded together.

  Further, the base material 121 after the transfer of the n-type wiring 109 and the p-type wiring 110 to the adhesive 120 is re-used as a member for a solar cell module produced by sealing a solar cell in a sealing material. It can also be used.

FIG. 6 is a schematic plan view of an example of a solar battery that can be used in the present invention that is manufactured by installing solar cells on a wiring board on which an adhesive prepared as described above is installed. Show. At this time, the slit 112 may be used to align the installation position of the solar battery cell 100 on the wiring board 200.

  In the form shown in FIG. 6, in order to electrically connect two adjacent wiring boards 200, the bus bar p electrode 114 of one wiring board 200 and the bus bar n electrode 115 of the other wiring board 200 are electrically connected. The electrical members 116 are electrically connected. Further, for example, like the wiring pattern of the wiring substrate 200 in the form shown in FIG. 7, the solar cells 100 are naturally connected to each other by installing the solar cells 100 on the wiring substrate 200 without using the conductive member 116. It is good also as a structure electrically connected in series. Further, in this case, the insulating substrate 111 serving as the base material of the wiring substrate 200 may be used as it is as a weather resistant film.

  Further, another example of the method of connecting to the wiring board will be described with reference to FIG. First, as shown in FIG. 8A, a screen-printable adhesive 120 is pattern-printed on a portion other than the electrodes on the back surface of the solar battery cell 100. The adhesive 120 may be printed on the wiring board 200 side. However, since the electrode of the solar battery cell 100 can be made thinner than the wiring of the wiring board 200, the area other than the electrode is large, and printing is easy. It is preferable to print on the solar cell 100 side for the reason that the baking operation of 120 is easier for the solar cell 100 with a smaller size. Next, after the adhesive 120 is baked, as shown in FIG. 8B, the electrodes of the solar battery cell 100 are placed on the wiring of the wiring board 200 so that the solar battery 100 and the wiring board 200 are connected. Glue.

  In addition to the above method, the adhesive 120 is applied to the surface of the insulating substrate 111 and / or the back surface of the solar battery cell 100 on which the n-type wiring 109 and the p-type wiring 110 are patterned by a dispenser or the like. Then, the method etc. which install the photovoltaic cell 100 on the wiring board 200 can also be used.

  FIG. 9 shows a schematic cross-sectional view of an example of the solar cell module of the present invention produced by sealing the solar cell produced as described above, for example, in a sealing material. Here, the solar battery in which the solar battery cell 100 is installed on the wiring board 200 was accommodated in a container 128 made of a laminated film formed by sandwiching a metal film 127 between two opposing insulating films 126. It is sealed in a sealing material 125, and a transparent substrate 124 is installed on the surface of the sealing material 125.

  Here, as the transparent substrate 124, for example, a substrate transparent to sunlight can be used, and for example, a conventionally known glass substrate or the like can be used. Moreover, as the sealing material 125, resin etc. transparent with respect to sunlight can be used, for example, conventionally well-known EVA (ethylene vinyl acetate) resin etc. can be used.

  Moreover, as the insulating film 126, a conventionally well-known thing can be used, for example, a PET film etc. can be used, for example. In addition, by using the container 128 as the insulating substrate 111 serving as the base material of the wiring substrate 200, the insulating substrate of the wiring substrate 200 can be used as it is as a weather resistant film. Moreover, as the metal film 127, a conventionally well-known thing can be used, for example, metal films, such as aluminum, can be used, for example.

  Here, in the solar battery before sealing, the solar battery cell 100 is installed on the wiring substrate 200. However, when the solar battery is sealed, the electrodes of the solar battery cell 100 (n-electrode 106 and p-electrode 107). ) And the wiring of the wiring substrate 200 (n-type wiring 109 and p-type wiring 110) are preferably mechanically pressure-bonded. Thereby, the electrical connection of the electrode of the photovoltaic cell 100 and the wiring of the wiring board 200 can be made more reliable, and the reliability of the connection can be further improved.

  Here, the sealing of the solar cell into the sealing material 125 can be performed, for example, by a method including a pressure bonding step of the sealing material 125 and a curing step of the sealing material 125 as described below. First, after sandwiching the above solar cell between the sealing material 125 formed on the transparent substrate 124 and the sealing material 125 accommodated in the container 128, the transparent substrate 124 is subjected to vacuum pressure bonding or the like while being heated. The upper sealing material 125 and the sealing material 125 accommodated in the container 128 are pressure-bonded (pressure bonding process). Accordingly, the solar cell is accommodated in the sealing material 125 filled in the space surrounded by the transparent substrate 124 and the container 128.

  Thereafter, the sealing material 125 is further cured by heating or the like (curing process), whereby the solar cell having the above-described configuration is sealed in the sealing material 125 between the transparent substrate 124 and the container 128. . Here, when the sealing material 125 is cured, the electrode of the solar battery cell 100 and the wiring of the wiring board 200 are mechanically pressure-bonded to electrically connect the electrode of the solar battery cell 100 and the wiring of the wiring board 200. Connection is more reliable and connection reliability is further improved.

  In addition, by producing a solar cell module as described above, it is not necessary to go through the steps of applying a conductive adhesive and heating with a reflow furnace, and the number of steps can be reduced, so that the solar cell can be more easily made. Modules can be made.

  Further, as in the solar battery shown in FIG. 2, when the electrode of the solar battery cell 100 and the wiring of the wiring board 200 are connected via the conductive adhesive 108, the melting temperature or the curing temperature is 180 ° C. or less. It is preferable to use a conductive adhesive, it is more preferable to use a conductive adhesive having a melting temperature or a curing temperature of 150 ° C. or lower, and it is particularly preferable to use a Sn—Bi solder having a melting temperature of 150 ° C. or lower. .

  Here, also in the case where the electrode of the solar battery cell 100 and the wiring of the wiring substrate 200 are connected via the conductive adhesive 108, the solar battery is manufactured in the same manner as described above except that the conductive adhesive 108 is used. A solar cell module can be manufactured by sealing in a sealing material 125.

  When solder is used as the conductive adhesive 108, the solder is applied in advance on the wiring of the wiring substrate 200 and / or on the electrode of the solar battery cell 100 by dipping in a solder plating or molten solder bath. After that, it is preferable to electrically connect the electrode of the solar battery cell 100 and the wiring of the wiring substrate 200.

  Further, when a conductive adhesive made of Sn—Bi solder having a melting temperature or a curing temperature of 180 ° C. or lower, more preferably 150 ° C. or lower, particularly preferably a melting temperature of 150 ° C. or lower is used, The electrical connection between the electrode of the solar battery cell 100 and the wiring of the wiring board 200 via the adhesive is performed by, for example, the crimping process and the heat generated during the crimping process and / or the curing process of the sealing material 125 described above. This can be done during the curing process. Moreover, in this case, by applying solder in advance on the wiring of the wiring substrate 200 and / or on the electrode of the solar battery cell 100, generation of gas as when the cream solder is heated is suppressed. Can do. According to this method, the number of steps for applying the conductive adhesive 108 increases, but the electrical connection between the electrode of the solar battery cell 100 and the wiring of the wiring board 200 can be more reliably performed by the conductive adhesive 108. It is preferable in that it can be performed.

  As described above, when a solar battery module is manufactured by sealing a solar battery manufactured by electrically connecting the electrode of the solar battery cell 100 and the wiring of the wiring board 200 in a sealing material. Besides the time of fixing with the adhesive 120 at normal temperature, heat can be prevented from being applied to the solar cell except during the pressure bonding step and / or the curing step of the sealing material 125. Thereby, since it can reduce the stress which arises from the difference in the thermal expansion coefficient of the photovoltaic cell and the wiring material of a wiring board like the past, it can suppress generation | occurrence | production of the crack of a photovoltaic cell. Further, it is possible to further reduce the thickness of the solar battery cell, and it is also possible to reduce the influence of thermal stress during actual operation of the solar battery module.

  Further, from the viewpoint of suppressing the ingress of water vapor into the solar cell module, a moisture permeation preventing layer such as a metal film 127 made of aluminum or the like having a large effect of inhibiting the permeation of water vapor is provided as shown in FIG. It is preferable to use the container 128 provided. When water vapor enters the solar cell module, corrosion of the interface between the electrode of the solar cell 100 and the wiring of the wiring substrate 200 or conductive adhesion between the electrode of the solar cell 100 and the wiring of the wiring substrate 200 is performed. Since corrosion of the agent 108 (particularly corrosion of Sn-Bi solder) is likely to occur, the use of the container 128 provided with the moisture permeation preventive layer can effectively suppress the occurrence of such corrosion. And the long-term reliability of the solar cell module tends to be improved.

  Here, as the container 128 provided with the moisture permeation preventive layer, for example, as shown in FIG. 9, a container made of a laminated film in which a metal film 127 made of aluminum is sandwiched between insulating films 126 made of PET. It is preferable to use it. For example, as shown in FIG. 9, by covering portions other than the transparent substrate 124 with this laminated film, it is possible to effectively suppress the entry of water vapor into the solar cell module. Moreover, it can be made to adhere | attach completely, for example using moisture permeation | blocking prevention tapes, such as a butyl rubber tape, in the part where it is difficult to adhere | attach laminated films, such as an end surface of a solar cell module.

  Thereafter, the wiring board of the solar cell module and the terminal box may be connected using a conductive member, and a frame body made of aluminum or the like may be fitted on the outer periphery of the solar cell module.

Example 1
First, a back electrode type solar cell having a back surface in the form shown in FIG. 3A was produced by a conventionally known method. Here, the solar battery cell 100 has a configuration in which strip-shaped n-electrodes 106 and p-electrodes 107 are alternately arranged on the back surface of the n-type silicon substrate 101 having a square-shaped light-receiving surface and a back surface each having a side of 100 mm. It has become.

  Next, wiring made of copper was transferred to the adhesive 120 on the insulating substrate 111 made of PET by the method shown in FIGS. Here, an acrylic pressure-sensitive adhesive was used as the adhesive 120.

  Subsequently, as shown in FIG. 7, 16 solar cells 100 were installed on one wiring substrate 200. Thus, a solar battery in which the solar battery cell 100 was fixed on the wiring board 200 with the adhesive 120 was produced. Here, the solar battery uses the n-electrode 106 of the solar battery cell 100 as the n of the wiring board 200 for each of the 16 solar battery cells 100 while using the slit 112 of the wiring board 200 as an alignment mark for alignment. It was prepared by installing on the mold wiring 109 and installing the p-electrode 107 of the solar battery cell 100 on the p-type wiring 110 of the wiring substrate 200.

  Thereafter, the solar cell produced as described above was sealed in a sealing material to produce a solar cell module having the form shown in FIG. Here, the solar cell is made of a laminated film in which a sealing material 125 made of EVA resin formed on a transparent substrate 124 made of a glass substrate and a metal film 127 made of aluminum are sandwiched between insulating films 126 made of PET. The solar cell is sandwiched between the sealing material 125 made of EVA resin and contained in the container 128, and then vacuum-heated and pressure-bonded to seal the sealing material 125 on the transparent substrate 124 and the sealing contained in the container 128. The material 125 was produced by pressure bonding (crimping step) and then curing the sealing material 125 by heating (curing step).

  In the above crimping step, the sealing material 125 formed on the transparent substrate 124 is placed on the sealing material 125 accommodated in the container 128, and is held at 140 ° C. for 7 minutes while being evacuated. Performed.

  Moreover, said hardening process was performed by hardening the sealing material 125 which consists of EVA resin by heating the sealing material 125 for 40 minutes at 145 degreeC after said crimping | compression-bonding process. Thereby, the adhesiveness of the electrode of the photovoltaic cell 100 and the wiring of the wiring board 200 improved.

  Then, the solar cell module produced as mentioned above was connected with the terminal box, and the frame body which consists of aluminum was inserted in the outer periphery of the solar cell module.

  By producing the solar cell module as described above, the electrical connection between the electrode of the solar cell and the wiring of the wiring board can be easily performed at a low temperature and the connection is highly reliable and relatively good. A solar cell module in which solar cells having electrical characteristics are sealed can be manufactured. In addition, inexpensive PET can be used as the insulating substrate 111, and further, the number of steps can be reduced because the insulating substrate 111 can be manufactured without applying a conductive adhesive and heating with a reflow furnace.

(Example 2)
First, a back electrode type solar cell having a back surface in the form shown in FIG. 3A was produced by a conventionally known method. Here, the solar battery cell 100 has a configuration in which strip-shaped n-electrodes 106 and p-electrodes 107 are alternately arranged on the back surface of the n-type silicon substrate 101 having a square-shaped light-receiving surface and a back surface each having a side of 100 mm. It has become. This solar battery cell was immersed in a Sn-Bi solder bath and the electrode portion was solder coated.

  Next, as shown to Fig.8 (a), the acrylic adhesive was apply | coated to parts other than the electrode of the photovoltaic cell back surface by screen printing. Then, the adhesive force of the adhesive was developed by baking at 100 ° C.

  Subsequently, as shown in FIG. 7, 16 solar cells 100 were installed on one wiring substrate 200. Thus, a solar battery in which the solar battery cell 100 was fixed on the wiring board 200 with the adhesive 120 was produced. Here, the solar battery uses the n-electrode 106 of the solar battery cell 100 as the n of the wiring board 200 for each of the 16 solar battery cells 100 while using the slit 112 of the wiring board 200 as an alignment mark for alignment. It was prepared by installing on the mold wiring 109 and installing the p-electrode 107 of the solar battery cell 100 on the p-type wiring 110 of the wiring substrate 200.

  After that, by using a laminated film in which a metal film 127 made of aluminum is sandwiched between insulating films 126 made of PET as a base material of the wiring board 200 in advance, the solar battery cell 100 is fixed on the wiring board 200. In addition, an EVA resin sheet and a glass substrate are installed and held at 140 ° C. for 7 minutes while evacuating, and then the EVA is cured by heating at 145 ° C. for 40 minutes, so that the solar cell is pressure-sealed. A solar cell module was produced.

  By the above heating step, the solder previously coated on the electrode of the solar battery cell was melted and the electrode of the solar battery cell and the wiring of the wiring board were connected, so that a more reliable connection was obtained.

  Then, the solar cell module produced as mentioned above was connected with the terminal box, and the frame body which consists of aluminum was inserted in the outer periphery of the solar cell module.

  It should be understood that the embodiments and examples disclosed herein are illustrative and non-restrictive in every respect. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

According to the present invention, high reliability of the connection with the electrical connection between the electrodes and the wiring substrate of the solar cell lines can be carried out cold and simply, solar cells with relatively good electrical properties it is possible to provide a module.

  100 solar cell, 101 silicon substrate, 102 antireflection film, 103 passivation film, 104 n-type impurity doping region, 105 p-type impurity doping region, 106 n electrode, 107 p electrode, 108 conductive adhesive, 109 for n-type Wiring, 110 p-type wiring, 111 insulating substrate, 112 slit, 113 connection electrode, 114 bus bar p electrode, 115 bus bar n electrode, 116 conductive member, 120 adhesive, 121 base material, 122 curable resin, 124 Transparent substrate, 125 sealing material, 126 insulating film, 127 metal film, 128 container, 200 wiring board.

Claims (6)

A solar cell in which a plurality of solar cells are bonded to a wiring board with an insulating adhesive is a solar cell module sealed using a sealing material,
The solar cell is a back electrode type solar cell in which a p-electrode and an n-electrode are provided on one surface side of a semiconductor substrate,
The wiring board is provided with a wiring of a conductive material corresponding to the p electrode and the n electrode of the solar battery cell on one surface side of the insulating base material,
The insulating adhesive is an adhesive different from the sealing material between the adjacent electrodes of the solar battery cell, and is a silicone adhesive, an acrylic adhesive, an epoxy adhesive, and a rubber adhesive. A solar cell module provided with an adhesive containing at least one selected from the group consisting of adhesives .   The solar cell module according to claim 1, wherein the electrode of the solar battery cell and the wiring of the wiring substrate are electrically connected via a conductive adhesive.   The solar cell module according to claim 1, wherein the electrode of the solar battery cell and the wiring of the wiring board are in direct contact with each other. The solar cell module according to any one of claims 1 to 3, wherein a plurality of the wiring boards are electrically connected by a conductive member . The wiring board has an n-type wiring, a p-type wiring, a connection electrode for electrically connecting the n-type wiring and the p-type wiring on the surface of the insulating base, With
At least one end of the insulating base material is provided with a bus bar electrode for current collection,
The solar cell module according to claim 4 , wherein one bus bar electrode of the two adjacent wiring boards and the other bus bar electrode are electrically connected by the conductive member. The solar cell module of any one of Claim 1 to 5 with which the transparent substrate arrange | positioned at the light-receiving surface side of the said sealing material is provided so that it may be common in the plurality of the said photovoltaic cells.