KR101919569B1 - LED Lighting Arraratus - Google Patents

Abstract

The present invention relates to an LED lighting device, and more particularly, to a metal PCB which includes a dummy area which is formed in a tubular shape having an upper portion and a lower portion opened and a hollow portion and connects the plurality of effective regions and the adjacent effective regions, A printed circuit board having a plurality of protrusions protruding along a longitudinal direction on an inner surface of the dummy area; A plurality of LED chips mounted on the outer surface of the effective area of the printed circuit board; A base portion coupled to an upper portion of the printed circuit board and having at least one vent hole communicating with the hollow portion; A power supply unit coupled to the base unit and coupled to the at least a portion of the hollow of the printed circuit board to be electrically connected to the printed circuit board to supply power to the LED chip; An electrical connection unit provided at an upper end of the base unit and electrically connected to the power supply unit to supply external power to the power supply unit when the power supply unit is coupled to an external power supply; And a heat dissipation member provided on an inner surface of the printed circuit board and formed in a shape corresponding to the printed circuit board so that a plate-shaped member can be closely fitted to the inner surface of the printed circuit board, And a second electrode.

Description

LED Lighting Arr.

The present invention relates to an LED lighting apparatus, and more particularly, to an LED lighting apparatus having a printed circuit board with a heat dissipating unit closely coupled thereto to maximize manufacturing productivity due to simplification of a structure while cooling performance is sufficient.

An LED (Light Emitting Diode) chip is a kind of semiconductor, which is a material that emits light when electrical energy is converted into light energy when voltage is applied. The lighting device using the LED chip is advantageous in that power consumption is small as compared with an incandescent lamp or a fluorescent lamp which has been mainly used as a light source of conventional lighting, and light of various colors can be realized.

The LED lighting device must effectively cool the heat generated by the LED chip during operation to ensure its operation and lifetime. However, there has been a problem that the conventional LED illumination device can not efficiently cool generated heat. If the cooling performance is sufficient, there is a problem that the structure for cooling the heat is complicated and the manufacturing cost and efficiency are low.

In addition, there is a problem that the heat generated by the power supply unit that supplies power to the LED chip can not be effectively cooled.

Conventionally, a structure for cooling the heat generated in the LED chip includes a structure, a substrate mounted with the LED chip mounted on the structure, and a heat sink coupled to the structure to receive heat generated from the LED chip mounted on the substrate do. In such a conventional configuration, a large number of components are present on the path through which the heat generated from the LED chip is transmitted to the heat sink, so that the thermal resistance of these components all operate. Therefore, Has come. Further, there is also a problem that the manufacturing efficiency is deteriorated due to the complicated configuration in which a large number of parts are employed.

In addition, there has been a problem that a worm or the like enters into the internal space to deteriorate performance and cause a failure.

Korean Public Utility Model No. 20-2009-0049670

SUMMARY OF THE INVENTION It is an object of the present invention to provide an LED lighting device which has a sufficient cooling performance and a simple structure, and which has high manufacturing efficiency.

The LED illumination device of the present invention is a metal PCB having a tubular shape having an upper portion and a lower portion opened and a hollow portion and a dummy region connecting the plurality of effective regions and the adjacent effective regions, A printed circuit board having a plurality of protrusions protruding along a longitudinal direction on an inner surface of the dummy area; A plurality of LED chips mounted on the outer surface of the effective area of the printed circuit board; A base portion coupled to an upper portion of the printed circuit board and having at least one vent hole communicating with the hollow portion; A power supply unit coupled to the base unit and coupled to the at least a portion of the hollow of the printed circuit board to be electrically connected to the printed circuit board to supply power to the LED chip; An electrical connection unit provided at an upper end of the base unit and electrically connected to the power supply unit to supply external power to the power supply unit when the power supply unit is coupled to an external power supply; And a heat dissipation member provided on an inner surface of the printed circuit board and formed in a shape corresponding to the printed circuit board so that a plate-shaped member can be closely fitted to the inner surface of the printed circuit board, And a second electrode.

Preferably, the protrusion provided on the printed circuit board is formed to extend in the vertical direction after being protruded, and the coupling portion of the heat dissipation unit is formed to pass through.

It is preferable that the outer surface of the dummy area of the printed circuit board is formed with a groove portion at a position opposite to the position where the protrusion is formed, and the printed circuit board is a polygonal columnar shape bent along the grooves.

The base includes a support member coupled to an upper end of the printed circuit board and having a first vent hole communicating with the hollow, a base member coupled to the support and having a second vent hole communicating with the first vent hole, Member.

The power supply unit may include a power supply board and a plurality of power supply components mounted on the power supply board, and the power supply board may be disposed in the hollow space and disposed in the vertical direction.

It is preferable that the heat dissipating unit includes a plurality of fin portions that are formed by cutting a part of the heat dissipating unit in contact with the inner surface of the effective region.

The plurality of fin portions may be provided with a heat pipe coupled to the fin portions.

The hollow may be provided with a blowing fan.

Wherein the blowing fan is coupled to a blowing fan bracket extending downward from the support member.

It is preferable that the fin portions are inclined with respect to the vertical direction.

And an upper end portion of the cover member is coupled to the base portion so as to surround all of the plurality of LED chips.

Wherein the upper end of the cover member is hermetically sealed by the base portion and the lower end of the cover member is hermetically sealed by the lower end of the printed circuit board, And a plurality of LED chips mounted on an outer surface of the printed circuit board are disposed in a closed space in which the inflow of external air is blocked.

And the outer surface of the printed circuit board is inclined outward with respect to the central axis in the up-and-down direction.

Preferably, the second vent hole of the base member is provided with a first mesh member having a plurality of through holes.

The inner side surface of the base member is provided with a fusion bond formed protruding from at least a portion of the portion where the first mesh member is in contact with the first mesh member, and the first mesh member is preferably fusion bonded to the fusion bond.

Preferably, the open bottom end of the tubular printed circuit board is provided with a bottom cover coupled to the open portion, and the bottom cover is provided with a third vent hole.

It is preferable that the third vent hole of the lower cover is provided with a second mesh member having a plurality of through holes.

The inner surface of the lower cover may be provided with a fused silica protruding from at least a portion of the portion contacting the second mesh member, and the second mesh member is preferably fused to the fused silica.

According to the LED illumination device of the present invention, by employing the tubular metal PCB having the hollow and the heat dissipating unit closely coupled thereto, it is possible to obtain a sufficient heat dissipation performance with a simple structure and high manufacturing efficiency.

1 is a perspective view showing an LED illumination device according to an embodiment of the present invention,
Fig. 2 is a schematic exploded perspective view of the LED illumination device of Fig. 1,
3 is a sectional view taken along the line III-III in Fig. 2,
FIGS. 4 to 6 are views for explaining a combined body of the printed circuit board and the heat dissipating unit of FIG. 2,
7 and 8 are views for explaining another embodiment of the printed circuit board and the heat radiating portion.
9 is a view for explaining another embodiment of the heat dissipation unit,
Fig. 10 is a top view of the base member of Fig. 2,
11 is a view for explaining an embodiment in which a guide member is further provided as another embodiment of the present invention,
12 is a view showing only a guide member of Fig. 11; Fig.
13 to 15 are views for explaining an embodiment in which a base member is provided with a first mesh member,
Figs. 16 and 17 are views for explaining an embodiment in which a lower lid is provided with a second mesh member. Fig.

Hereinafter, an LED illumination device 1 according to an embodiment of the present invention will be described in detail with reference to FIGS. 1 to 6. FIG.

The LED lighting apparatus 1 of this embodiment includes a printed circuit board 10, a plurality of LED chips 20, a base 30, a power supply 50, an electrical connection 60, and a heat dissipation unit 70 .

The metal PCB 10 is a metal PCB, which has the same function as a printed circuit board in comparison with a conventional PCB. However, the material of the base is made of FR-4, epoxy It is a printed circuit board used as metal instead of resin. The metal is usually aluminum or copper. Since aluminum or copper is a metal having a relatively high thermal conductivity, the heat generated from components mounted on the printed circuit board 10, which is metal PCB, can be quickly conducted to the entire metal base.

The printed circuit board 10 has a plurality of LED chips 20 mounted on a planar and generally rectangular metal substrate (see FIG. 4), and then the hollow printed circuit board 10 is hollow. The printed circuit board 10 is an integral member made of a single metal PCB.

In the printed circuit board 10, the upper end 12 and the lower end 14 are opened. The air is introduced from the open portion of the lower end 14 and is discharged to the open portion of the upper end 12 after being heated by the heat generated from the LED chips 20 or the power source portion because the upper and lower portions are not blocked, Can be easily performed. The hollow space formed inside the printed circuit board 10 is hollow. The hollow is the air channel.

The printed circuit board 10 includes a plurality of effective regions 15 and a dummy region 16 connecting adjoining effective regions 15 to each other.

Referring to FIG. 2 and FIG. 4, a plurality of LED chips 20 are mounted on the outer side of the effective region 15. The specific configuration, number and arrangement of the LED chip 20 can be variously selected as needed.

On the inner surface of the dummy area 16, a plurality of protrusions 17 are provided. The protrusions 17 are formed discontinuously along a straight line in the longitudinal direction. Further, in the case of the present embodiment, each protrusion 17 is formed to extend in the vertical direction after being protruded. According to the embodiment, the specific shape and number of protrusions can be modified.

In the case of this embodiment, a groove 18 is formed on the outer surface of the dummy region 16. [ The groove 18 is formed on the opposite side of the position where the projection 17 is formed. The shape and size of the protrusion 17 and the groove 18 correspond to each other.

That is, each protrusion 17 is formed on the inner side surface by pushing out the outer surface of the metal layer of the metal PCB, and at the same time, the groove portion 18 is formed. Referring to FIG. 4, the left and right side surfaces of the protrusion 17 are cut and the upper and lower ends indicated by '19' are connected to the body. In Figs. 3, 4 and 6, the protruding portion 17 appears to be separated from the body because of the cross-sectional view.

Using the press or the like, the groove and the protrusion are completed in one step. On the other hand, this machining method is also called lancing machining. The projecting portion is also referred to as a lancing portion.

The printed circuit board 10 illustrated in Fig. 2 has a plate-like metal PCB having a polygonal columnar shape in which lines formed by the grooves 18 are bent. Here, the printed circuit board 10 has a polygonal column shape, meaning that a hollow is formed inside, and the overall shape of the outside is a polygonal column shape. In the case of this embodiment, it is in the form of a ten-column.

3, it is easy to make the printed circuit board 10 of a plate-like shape into a polygonal column without deforming the effective region 15 due to the configuration of the groove portion 18. [

On the other hand, although not specifically shown, the printed circuit board 10 and the power source unit 50 are electrically connected by a wire or the like.

The base portion 30 is coupled to the upper end 12 of the printed circuit board 10. The base portion 30 is formed with at least one vent hole communicating with the hollow. Not only the metal printed circuit board 10 is fixed to the base 30 but also the power supply unit 50, the electrical connection unit 60 and the cover member 90 are fixed.

In the case of this embodiment, the base portion 30 includes a support member 32 and a base member 36. [

The support member 32 is a member coupled to the upper end 12 of the printed circuit board 10 and has a first vent hole 33 communicating with the hollow. Referring to FIG. 2, the support member 32 may be formed in a ring shape, and a lower surface of the support member 32 may have a structure (not shown) in which the upper end 12 of the printed circuit board 10 is inserted and fixed.

The base member 36 is engaged with the support member 32. The base member (36) is provided with a second vent hole (37) communicating with the first vent hole (33). In the present embodiment, referring to FIG. 2 and FIG. 10, the second vent hole 37 has a plurality of vertically extending through holes. The configuration in which the elongated members are bent and then staggered one above the other and are provided with the second ventilation holes 37 therebetween is for minimizing the dust sitting down into the interior of the base member 36. [ The specific shape of the second vent hole may be variously modified according to the embodiment.

In this embodiment, the lower cover 95 is coupled to the lower end portion 14 of the printed circuit board 10. A plurality of third ventilation holes 96 are formed in the lower lid 95 so that air can flow smoothly. The lower cover 95 may be coupled to the lower end portion 14 of the printed circuit board 10 to maintain the shape of the printed circuit board 10.

The power supply unit 50 is coupled to the base unit 30. In this embodiment, the power supply unit 50 is coupled to the base member 36 of the base unit 30. The power supply unit 50 is electrically connected to the printed circuit board 10 to supply power to the LED chips 20. The power supply unit 50 functions as a normal power supply unit, and supplies external power to the LED chips 20 in a suitable manner.

In this embodiment, the power supply unit 50 includes a power supply board 52 and a plurality of electrical components 54 mounted on the power supply board 52. In the electric components 54, heat is generated during operation. Therefore, these electric parts also require cooling. To this end, in the case of the present embodiment, the power supply substrate 52 is positioned so that at least a part thereof is arranged in the hollow and arranged in the vertical direction.

As a result, the cooling of the electric components 54 is performed by the air flowing through the hollow. Particularly, the power supply substrate 52 is arranged in the vertical direction, so that it is not disturbed by the air flow.

The electrical connection portion 60 is coupled to the portion 38 provided on the upper portion of the base member 36. The electrical connection portion 60 is a member electrically connected to the power supply portion 50 so that external power is supplied to the power supply portion 50 when the power supply portion 50 is coupled to an external power supply. The electrical connection portion 60 has a size and shape corresponding to the electric socket to be standardized. However, the specific shape of the electrical connection part can be variously modified depending on the capacity of the lighting device and the shape and size of the external socket to be coupled.

The heat dissipating portion 70 is provided on the inner surface of the printed circuit board 10. 'Inner side' refers to the opposite side of the outer side of the LED chip. The heat radiating portion 70 is made of a thin metal plate. Since a thin metal plate can be obtained by pressing, the productivity is excellent. The heat dissipating portion 70 is a metal having a relatively high thermal conductivity such as aluminum or copper.

The heat dissipating portion 70 has a shape corresponding to the shape of the printed circuit board so as to be tightly coupled to the inner surface of the printed circuit board 10. [ In this embodiment, the protruding portion 17 is formed on the inner surface of the printed circuit board 10 and the heat dissipating portion 70 is provided with the engaging portion 72 in which the respective protruding portions 17 are fitted. Since the protruding portion 17 is discontinuously provided with a narrow and elongated protruding shape, the engaging portion 72 is a shape in which the protruding portions 17 can be engaged with each other and is a through hole.

5, when the heat dissipating unit 70 is overlapped on the printed circuit board 10, the protruding portions 17 of the printed circuit board 10 are naturally inserted into the fitting portions 72 of the heat dissipating unit 70 (See Fig. 6), the heat dissipating portion 70 and the printed circuit board 10 are combined. The heat radiating portion 70 and the printed circuit board 10 are in mutual surface contact.

When the LED chips 20 are folded toward the outside with respect to the protrusions 17 in a state where the heat dissipation unit 70 and the printed circuit board 10 are coupled to each other, Thereby completing the assembly of the printed circuit board 10 provided with the unit 70. Referring to FIG. 3, the process of folding the printed circuit board 10 is easily accomplished by deforming the groove 18 provided on the opposite side of the protruding portion 17.

Due to such a coupling method, the heat dissipating unit 70 and the printed circuit board 10 can be brought into surface-to-surface contact with each other without any separate bonding means, and heat transfer is sufficiently performed. However, depending on the embodiment, it may be possible to maximize the heat transfer by applying a thermally conductive material to the surfaces where both structures face each other.

On the other hand, in the case of this embodiment, the heat dissipating portion 70 has a plurality of fin portions 74 that are partly cut and folded in a portion contacting the inner surface of the effective region 15. The presence of the fin portion 74 allows for more effective air and heat transfer.

Since the heat dissipating portion 70 is a thin metal plate, the process of forming the fin portions 74 can be easily performed using a press or the like. The specific shape of the fin portion can be variously modified as needed.

Further, in the case of the present embodiment, the plurality of fin portions 74 are provided with the heat pipes 77 coupled to the fin portions 74. The fin portion 74 is formed with a coupling groove, so that the heat pipe can be easily engaged. Referring to Fig. 5, a heat pipe 77 of a thin diameter is coupled to a coupling groove provided in the fin portions 74 in a zigzag shape.

In a manufacturing process of holding a plate-like heat dissipating portion 70 with a heat pipe coupled thereto by using a suitably configured jig in this state and folding the plate into a desired shape, the heat pipe 77 as shown in Fig. 2 It is possible to form a combination of the same tubular printed circuit board 10 and the heat radiating portion 70.

The projections 17 inserted into the elongated hole-like engaging portions 72 are more firmly fixed to the engaging portions 72 because the grooves 18 are deformed into a widened form. The heat dissipating unit 70 can be tightly coupled and fixed to the printed circuit board 10 without a separate fixing means.

The heat generated from the LED chip 20 can be transmitted to the entire heat dissipating unit 70 more quickly and can be transferred into the air due to the configuration of the heat pipe 77 that thermally couples the fin portions 74.

7 and 8 illustrate modified embodiments of a combined body of the printed circuit board 10a and the heat radiating portion 70a.

In this embodiment, the opening of the upper end 12 of the printed circuit board 10a is formed so that its area is larger than the opening of the lower end 14. That is, the outer surface of the printed circuit board 10a is shaped to be tilted outward with respect to the central axis.

Therefore, in order to form the printed circuit board 10a having the heat radiating portion 30a having the shape shown in Fig. 8, it is necessary to form the printed circuit board 10a having the same shape as that of the fan- After fixing the portion 30a to the jig or the like, it may be bent along the groove portion 18a at the same time. Fix the parts where both side edges are fixed by using adhesive.

As shown in Fig. 8, the outer surface of the metal printed circuit board 10a on which the LED chips 20 are mounted is inclined to the outer side with respect to the center line C to some extent. As a result, it is possible to obtain an effect of reducing the area of the dark portion immediately below the LED illumination device. In other words, since the LED chip is not mounted on the lower opening of the printed circuit board 10a, there may be a region directly below the opening but not irradiated with light. However, the outer surface of the printed circuit board 10a may be slightly outward This tilting configuration minimizes this area.

Fig. 9 illustrates a state before the modified embodiment of the heat dissipation unit is coupled to the printed circuit board. The heat radiating portion 70b of this embodiment has a fitting portion 72 and fin portions 74b. The difference from the previous embodiment is that the fin portions 74b are inclined with respect to the vertical direction. With this configuration, it is possible to obtain an additional effect that heat transfer between the air flowing from below to above and the fin portions 74b can be performed more effectively.

On the other hand, in the case of this embodiment, a cover member 90 is provided.

The cover member 90 is formed in an open top and bottom and is coupled to the base unit 30 so as to enclose all of the LED chips 20. The cover member 90 serves to prevent glare and allow the light to spread out as a whole.

The cover member 90 is in the shape of a jar whose diameter of the intermediate portion is enlarged. The upper end portion 92 of the cover member 90 is coupled between the rim of the base member 36 and the lower end edge portion 39 of the base member 36 and a lower lid 95 is attached to the lower end portion 94 thereof .

Due to such a configuration, the plurality of LED chips 20 mounted on the outer surface of the printed circuit board 10 are located in the closed space 91 in which the inflow of outside air is blocked. Therefore, attachment of external contaminants such as dust to the LED chips 20 can be blocked.

On the other hand, in the case of the present embodiment, a blowing fan 80 is additionally provided. If the cooling performance is not sufficient even if the cooling fan is not provided, it is not necessary to provide the cooling fan. However, if the cooling capacity is insufficient due to the natural convection when the capacity is large as in the industrial lighting apparatus, the cooling fan may be additionally provided.

It is advantageous in terms of space utilization that the blowing fan 80 is located in the hollow. The blowing fan (80) is coupled to the blowing fan bracket (35) extending downward from the support member (32) into the hollow interior. The concrete shape of the bracket can be variously modified.

The LED illumination device 1 having the above-described configuration according to the embodiment of the present invention has the following operational effects.

According to the present embodiment, by employing the metal printed circuit board having the heat dissipating portion on one side, it is possible to obtain a sufficient heat dissipation performance while having a simple structure without the additional heat sink.

The printed circuit board 10 is provided with a thin plate heat dissipating portion which is in surface contact with the opposite side surface of the side surface on which the LED chip 20 is mounted. This has the advantage that the configuration is simple and the assembling process is simplified and the productivity is high. In the conventional case, the PCB is attached to a separate structure and the heat sink is combined to form the lighting device. However, in this embodiment, since a constant structure is formed only by the metal PCB and the heat dissipation portion of the thin plate without any separate structure, And has an advantage of excellent manufacturing efficiency.

Due to the above-described configurations, particularly the configuration of the air vents, the surrounding air is introduced into the open portion of the lower portion of the printed circuit board 10, the heat generated from the LED chip and the power source portion is received, It is possible to smoothly escape to the outside.

Further, since the assembly of the printed circuit board and the heat dissipation part is constituted by a single metal PCB and a single sheet metal heat dissipation part, the effect is that the structure is simple and the manufacturing is simple and the production efficiency is high.

In addition, it is possible to effectively cool the heat generated by the power source portion by disposing the power source portion in the hollow and vertically arranging the power source substrate.

Further, in the case of the present embodiment, since the air blowing fan is provided, there is an advantage that it can be applied to a lighting apparatus such as a street lamp having a relatively large capacity, a factory ceiling, and the like.

In addition, since the LED chips mounted on the outer surface of the printed circuit board are positioned in the closed space where the outside air is blocked by the cover member, the LED chip can be prevented from being contaminated with dust or the like .

11 shows another embodiment in which a guide member 85 is further provided below the blowing fan 80. [ In Fig. 11, for convenience of explanation, only the required configuration is shown, and the heat dissipation portion and other configurations are omitted. Only the guide member 85 is shown in Fig.

The guide member 85 has a shape in which the diameter increases from the lower center portion toward the upper portion. The lower end 86 of the lower center of the guide member 85 is fixed to the lower cover 95. It can be said that the shape of the funnel is inverted from the lower end portion 86 to the enlarged diameter.

In the present embodiment, by providing the guide member 85, the air introduced into the hollow by the blowing fan 80 flows along the outer surface of the guide member 85. Since the air flow induced by the guide member 85 flows close to the heat dissipation unit, heat exchange between the heat dissipation unit and air can be performed more efficiently. It reduces the air escaping through the hollow without heat exchange. However, if the flow of air can be guided to the heat radiating portion side according to the embodiment, the specific shape of the guide member can be variously modified.

13 to 17 are views for explaining an embodiment in which the first mesh member 40 and the second mesh member 98 are provided on the base member 36b and the lower cover 95b, respectively.

In the present embodiment, the first mesh member 40 is provided in the second ventilation holes 37 of the base member 36b. Therefore, in order to allow air to pass through the second vent hole 37, it must pass through the first mesh member 40. The first mesh member 40 is a member having a plurality of through holes.

The first mesh member 40 is cut and used as a mesh member which is entirely rectangular. Referring to FIG. 14, the mesh member for forming the first mesh member 40 may be made of metal or synthetic resin, and may be woven using a yarn, or may be molded and manufactured. If a plurality of through holes capable of flowing air are provided, the material, the manufacturing method or the specific shape can be variously modified.

On the inner surface of the base member 36b, a fusion bond 42 is formed. 15, which shows only the base member 36b in a state before the first mesh member 40 is engaged, the fused silica 42 is formed so as to cover the inside of the elongated members forming the second vent holes 37 And protrude along the longitudinal direction on the side surface. The first mesh member 40 is brought into contact with the inner surface of the elongated members.

The partial enlarged cross-sectional view of Fig. 15 shows a cross-section of the elongated member, and the shape of the fused silica 42 can be grasped.

The mesh member cut in the form shown in Fig. 14 is made in contact with the inner side surface of the base member 36b on which the fused deposit 42 is formed to make a cylindrical shape. Then, the fused silica 42 and the first mesh member 40 are firmly bonded to each other by a method such as ultrasonic welding. If a jig suitable for the ultrasonic welding process is used, fusion bonding can be easily performed.

The third vent hole 96 is formed in the lower cover 95b and the second mesh member 98 having a plurality of through holes is formed in the third vent hole 96 of the lower cover 95b. . Similarly, the material, manufacturing method, or specific shape of the second mesh member 98 can be variously modified.

On the inner surface of the lower lid 95b, a fusion splice 97 is formed.

17, which shows only the lower cover 95b in a state before the second mesh member 98 is engaged, the fused acid 97 is radially provided on the inner surface of the formed portion of the third vent holes 96 Respectively. 17 is a cross-sectional view of a portion where the fused silica 97 is formed, and the shape of the fused silica 97 can be grasped. The method of joining the fused acid (97) and the second mesh member (98) is performed by an ultrasonic welding method.

However, in another embodiment, the method of joining the first and second mesh members 40 and 98 to the base member 36b and the lower cover 95b may be performed by using an adhesive or by forming a protrusion And the like can be applied.

Since the first mesh member 40 and the second mesh member 98 are provided on the base member 36b and the lower cover 95b in the present embodiment, There is a remarkable effect. Also, the inflow of dust is reduced. Generally, a lighting apparatus is attracted to a light, and a worm coming into the interior of the lighting apparatus is not only dirty in the internal space, but also may be damaged due to an internal influence of internal parts such as an electric circuit. However, the illumination apparatus of the present embodiment minimizes this possibility, so that the performance is improved and it can be used for a long time.

Although the present invention has been described with reference to the embodiments shown in the drawings, it is to be understood that various changes and modifications may be made without departing from the scope of the present invention. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

1: LED lighting device
10: printed circuit board 20: LED chip
30: base portion 36: base member
40: first mesh member 50: power source part
60: electrical connection part 70:
80: blower fan 85: guide member
90: Cover member 95: Lower cover
96: Third vent hole 97: Fused silica
97: second mesh member

Claims (19)

A metal PCB comprising a dummy area having a top and a bottom open and a hollow shape and connecting the plurality of effective areas and the adjacent effective areas, A printed circuit board having a plurality of protrusions protruding along the printed circuit board;
A plurality of LED chips mounted on the outer surface of the effective area of the printed circuit board;
A base portion coupled to an upper portion of the printed circuit board and having at least one vent hole communicating with the hollow portion;
A power supply unit coupled to the base unit and coupled to the at least a portion of the hollow of the printed circuit board to be electrically connected to the printed circuit board to supply power to the LED chip;
An electrical connection unit provided at an upper end of the base unit and electrically connected to the power supply unit to supply external power to the power supply unit when the power supply unit is coupled to an external power supply; And
And a heat dissipating unit provided on an inner surface of the printed circuit board and formed in a shape corresponding to the printed circuit board so that a plate-shaped member can be tightly coupled to an inner surface of the printed circuit board, And a light emitting diode (LED). The method according to claim 1,
Wherein the protrusion provided on the printed circuit board is formed to extend in the vertical direction after being protruded,
And the coupling portion of the heat dissipation portion is formed to pass through. 3. The method of claim 2,
Wherein a groove portion is formed on an outer side surface of the dummy region of the printed circuit board at a position opposite to a position where the projection portion is formed,
Wherein the printed circuit board has a polygonal columnar shape bent along the grooves. The method according to claim 1,
The base unit includes:
A support member coupled to an upper end of the printed circuit board and having a first vent hole communicating with the hollow,
And a base member coupled to the support member and having a second vent hole communicating with the first vent hole. The method according to claim 1,
The power supply unit includes a power supply board and a plurality of power supply components mounted on the power supply board,
Wherein the power unit substrate is disposed in the hollow and is disposed in a vertical direction. The method of claim 1,
Wherein the heat dissipation unit includes a plurality of fin portions that are formed by cutting a part of the fin portion in contact with the inner side surface of the effective region. The method according to claim 6,
Wherein the plurality of fin portions are provided with a heat pipe coupled to the fin portions. The method according to claim 1,
Wherein the hollow is provided with a blowing fan. 5. The method of claim 4,
The hollow is provided with a blowing fan,
Wherein the blowing fan is coupled to a blowing fan bracket extending downward from the support member. 9. The method of claim 8,
The lower portion of the blowing fan may further include a guide member having a shape whose diameter increases from the lower portion to the upper portion so as to guide the flow of the air introduced from the outside into the hollow by the operation of the blowing fan toward the heat radiating portion And a light source for emitting light. The method according to claim 6,
Wherein the pin portions are inclined with respect to the vertical direction. The method according to claim 1,
And an upper end portion of the cover member is coupled to the base portion so as to surround all of the plurality of LED chips. 13. The method of claim 12,
Wherein the cover member is in the shape of an enlarged jar with a diameter of an intermediate portion thereof,
Wherein an upper end portion of the cover member is hermetically closed by the base portion and a lower end portion of the cover member is hermetically sealed by a lower end portion of the printed circuit board,
Wherein the plurality of LED chips mounted on the outer surface of the printed circuit board are positioned in a closed space in which the inflow of external air is blocked. The method according to claim 1,
Wherein an outer surface of the printed circuit board is inclined outward with respect to a central axis in a vertical direction. 5. The method of claim 4,
Wherein the base member includes a first mesh member having a plurality of through holes formed in a second vent hole of the base member. 16. The method of claim 15,
Wherein an inner side surface of the base member is provided with a fusion bond formed protruding from at least a part of a portion in contact with the first mesh member so that the first mesh member is fusion- . The method according to claim 1,
The lower end of the open end of the tubular printed circuit board is provided with a lower cover coupled to the opened portion,
And a third vent hole is formed in the lower cover. 18. The method of claim 17,
And a second mesh member having a plurality of through holes formed in the third vent hole of the lower cover. 19. The method of claim 18,
Wherein the inner surface of the lower cover is provided with a fusion bond formed on at least a part of a portion in contact with the second mesh member so that the second mesh member is fused to the fusion bond. .

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