KR101909822B1 - A radiation image sensing apparatus, method of operating the same, and method of preparing the same - Google Patents

Abstract

A radiation image sensing device, a method of operating the same, and a method of manufacturing the same are disclosed. The radiation image sensing apparatus according to one embodiment includes a scintillator for converting emitted radiation into light; a pixel array which is disposed on a side where the scintillator outputs light and includes a plurality of pixels; and a barrier membrane for blocking a part of the light outputted by the scintillator from being transmitted to the pixel array. It is possible to obtain high resolution, light intensity, and material resolution.

Description

Technical Field [0001] The present invention relates to a radiation image sensing apparatus, a radiation image sensing apparatus, a radiation image sensing apparatus, a radiation image sensing apparatus, a radiation image sensing apparatus,

The following embodiments are directed to a radiation image sensing device having energy resolution by a single shot, a method of operating the same, and a method of manufacturing the same.

Conventional x-ray image sensors have limitations in three aspects.

First, the problem of attenuation of spatial resolution is related to image resolution. This is influenced by the pixel pitch of the photodiode and the thickness of the scintillator.

Second, since most of the light emitted from the scintillator occurs in the direction of the X-ray incident direction, a large amount of light can not reach the sensor portion. This causes a problem that the object information can not be obtained accurately from the image because the SNR is reduced.

Third, it does not have material information. There is a limit to the reading of x-ray images because it is difficult to distinguish between the two substances when the Z-number is low but the thick substance and the high Z-number but the thin substance are present at the same time.

Embodiments can provide a radiation image sensing device having high resolution, light quantity, and material resolution.

In addition, the embodiments can provide a technique for determining the type of a material because the energy resolution is obtained without reducing the image performance by single image capturing.

According to one embodiment, a radiation image sensing apparatus includes a scintillator for converting irradiated radiation into light, a pixel array disposed on a side where the scintillator outputs light, a pixel array including a plurality of pixels, and a part of light output from the scintillator And a barrier membrane for blocking the pixel array from being transmitted to the pixel array.

The blocking layer may be located at a position corresponding to a pixel on a pixel-by-pixel basis so that the light output from the scintillator is not transmitted.

The blocking layer may be positioned between the scintillator and the pixel array.

The apparatus may further include a fiber optic plate (FOP) positioned between the scintillator and the pixel array.

Wherein a pixel of the plurality of pixels that does not receive light output from the scintillator through the blocking film generates a first pixel signal based on the irradiated radiation and the remaining pixels of the plurality of pixels, And generate a second pixel signal based on the light output by the scintillator and the irradiated radiation.

The apparatus may further comprise an image processor for combining the first pixel signal and the second pixel signal to produce an image.

The blocking layer may be implemented in the corresponding pixel among the plurality of pixels.

A method of manufacturing an image sensing device according to an exemplary embodiment includes forming a scintillator for converting irradiated radiation into light, a blocking film for blocking a portion of the light output by the scintillator from being transmitted to a pixel array including a plurality of pixels, forming a barrier membrane, and disposing the pixel array on a side from which the scintillator outputs light.

The blocking layer may be located at a position corresponding to a pixel on a pixel-by-pixel basis so that the light output from the scintillator is not transmitted.

The blocking layer may be positioned between the scintillator and the pixel array.

The method may further comprise forming an FOP (Fiber Optic Plate) between the scintillator and the pixel array.

According to an embodiment of the present invention, there is provided a method of operating an image sensing apparatus including a scintillator and a pixel array, the method comprising: a step of detecting, based on radiation irradiated with a pixel, And generating a second pixel signal based on the emitted light and the irradiated radiation, wherein the remaining pixels of the plurality of pixels except for the pixel are generated by the scintillator.

The method may further include generating an image by combining the first pixel signal and the second pixel signal.

The blocking layer may be located at a position corresponding to a pixel on a pixel-by-pixel basis so that the light output from the scintillator is not transmitted.

The blocking layer may be positioned between the scintillator and the pixel array.

1 is a schematic block diagram of an image sensing apparatus according to an embodiment.
Fig. 2 shows an example of the radiation image sensor shown in Fig.
Fig. 3 shows another example of the radiation image sensor shown in Fig.
FIG. 4 is a view for explaining a processing operation for a signal obtained through the radiation image sensor shown in FIG. 2 or FIG. 3. FIG.
5 is a flowchart illustrating an operation method of a radiation image sensing apparatus according to an exemplary embodiment of the present invention.
6 is a flowchart illustrating a method of manufacturing a radiation image sensing apparatus according to an embodiment.

It is to be understood that the specific structural or functional descriptions of embodiments of the present invention disclosed herein are presented for the purpose of describing embodiments only in accordance with the concepts of the present invention, May be embodied in various forms and are not limited to the embodiments described herein.

Embodiments in accordance with the concepts of the present invention are capable of various modifications and may take various forms, so that the embodiments are illustrated in the drawings and described in detail herein. However, it is not intended to limit the embodiments according to the concepts of the present invention to the specific disclosure forms, but includes changes, equivalents, or alternatives falling within the spirit and scope of the present invention.

The terms first, second, or the like may be used to describe various elements, but the elements should not be limited by the terms. The terms may be named for the purpose of distinguishing one element from another, for example without departing from the scope of the right according to the concept of the present invention, the first element being referred to as the second element, Similarly, the second component may also be referred to as the first component.

It is to be understood that when an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, . On the other hand, when an element is referred to as being "directly connected" or "directly connected" to another element, it should be understood that there are no other elements in between. Expressions that describe the relationship between components, such as "between" and "between" or "neighboring to" and "directly adjacent to" should be interpreted as well.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. It will be understood that, in this specification, the terms " comprises ", or " having ", and the like are to be construed as including the presence of stated features, integers, But do not preclude the presence or addition of steps, operations, elements, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the meaning of the context in the relevant art and, unless explicitly defined herein, are to be interpreted as ideal or overly formal Do not.

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. However, the scope of the patent application is not limited or limited by these embodiments. Like reference symbols in the drawings denote like elements.

1 is a schematic block diagram of an image sensing apparatus according to an embodiment.

Referring to FIG. 1, a radiation image sensing apparatus 10 includes a radiation image sensor 100. In addition, the radiation image sensing apparatus 10 may further include an image processor 200. For example, radiation may mean x-rays.

The radiation image sensing device 10 can sense the radiation image displayed by the radiation transmitted through the object 300 or the object 300 through the lens 400 under the control of the image processor 200 . The object 300 may refer to a subject or sample.

The radiation image sensing device 10 may be used in an x-ray device, a diagnostic device with an x-ray device attached, or a portable device with an x-ray device attached thereto. For example, a radiation image sensor can be implemented with a CMOS based crystal silicon X-ray image sensor.

The radiation is irradiated to the radiation image sensor 100 and the radiation image sensor 100 can block a portion of the light output from the scintillator that converts the irradiated radiation (e.g., x-rays) into light to be transmitted to the pixel array .

For example, the radiation image sensor 100 may transmit a portion of the light output by the scintillator to one or more of the pixels contained in the pixel array and not to one or more other pixels. Thus, one or more of the pixels may generate a pixel signal based on the irradiated radiation and the light emitted by the scintillator. Further, one or more other pixels may generate a pixel signal based on the irradiated radiation.

The radiation image sensor 100 may output a pixel signal based on the irradiated radiation and the light output by the scintillator and a pixel signal based on the irradiated radiation to the signal processor 200. [

The signal processor 200 may combine (or process and process) the pixel signal based on the irradiated radiation and the pixel signal based on the emitted light and the irradiated radiation to produce an image.

In one example, the signal processor 200 may be implemented as a separate chip from the radiation image sensor 100.

As another example, the signal processor 200 and the radiation image sensor 100 may be implemented as a single chip. That is, the signal processor 200 may be implemented within the image sensor 100.

Fig. 2 shows an example of the radiation image sensor shown in Fig.

Referring to FIG. 2, the radiation image sensor 100 includes a pixel array 110, a barrier layer 130, and a scintillator 150.

The pixel array 110 may include a plurality of pixels 113-1 through 113-12. Although FIG. 2 illustrates the pixel array 110 as being implemented with twelve pixels 113-1 through 113-12, the pixel array 110 is not necessarily limited thereto, and the pixel array 110 may be implemented with one or more pixels . Hereinafter, for the convenience of explanation, it is assumed that the pixel array 110 is implemented by a plurality of 12 pixels 113-1 to 113-12.

The pixel array 110 may be arranged such that the irradiated radiation may be first reached (or passed). The irradiated radiation may reach the scintillator 150 primarily after passing the pixel array 110 primarily. That is, the pixel array 110 may be disposed on a side where the scintillator 150 outputs light.

The scintillator 150 can convert the irradiated radiation into light. For example, scintillator 150 may convert radiation that has passed through pixel array 110 to light. Thereafter, the scintillator 150 can output the converted light to the pixel array 110.

By arranging the pixel array 110 on the side from which the scintillator 150 outputs light, the point of emission in response to the radiation reaching the pixel array 110 in the scintillator 150 is close to the pixel array 110 can do.

Most of the light generated in the scintillator 150 is generated in the direction toward the pixel array 110 in the direction of radiation incidence so that a large amount of light (for example, the radiation directly irradiated and the light generated in the scintillator 150) 110 < / RTI > Thus, by increasing the SNR, the object 300 information can be obtained accurately from the image obtained from the pixel array 110. [ In addition, since the thickness of the scintillator 150 can be reduced, the problem of the spatial resolution degradation caused by the radiation image sensor 100 can be solved.

The blocking layer 130 may include one or more barrier membranes 133-1, 133-3, 133-5, or 133-7 to prevent a portion of the light output by the scintillators 150 from being transmitted to the pixel array 110. [ . ≪ / RTI > The blocking films 133-1, 133-3, 133-5, and 133-7 may be formed of a metal.

The blocking films 133-1, 133-3, 133-5, or 133-7 may be located between the scintillator 150 and the pixel array 110. [ In FIG. 2, the blocking films 133-1, 133-3, 133-5, and 133-7 are illustrated as being formed outside the pixel array 110, but the present invention is not limited thereto. For example, 133-1, 133-3, 133-5, or 133-7 may be implemented within the corresponding pixel 113-2, 113-5, 113-8, or 113-11.

The blocking films 133-1, 133-3, 133-5, and 133-7 may be located at positions corresponding to (or corresponding to) the pixels for each pixel so that the output light is not transmitted. The blocking film 133-1 may be located at a position corresponding to the pixel 113-2 and may block the light outputted from the scintillator 150 from being transmitted to the pixel 113-2. The blocking film 133-3 may be located at a position corresponding to the pixel 113-5 and may block the light outputted from the scintillator 150 from being transmitted to the pixel 113-5. The blocking film 133-5 may be located at a position corresponding to the pixel 113-8 and may block the light outputted from the scintillator 150 from being transmitted to the pixel 113-8. The blocking film 133-7 may be located at a position corresponding to the pixel 113-11 so as to block the light outputted from the scintillator 150 from being transmitted to the pixel 113-11.

A plurality of pixels 113-1 to 113-12 included in the pixel array 110 are directly irradiated while the pixels 113-2, 113-5, 113-8, The light outputted from the scintillator 150 can not be received by the light-receiving elements 133-1, 133-3, 133-5, or 133-7.

As shown in FIG. 2, when it is assumed that radiation is irradiated to the pixels 113-4 to 113-9 of the pixel array 110, the pixels 113-4, 113-6, 113-7, 113-9 can receive the irradiated radiation directly and receive the light output from the scintillator 150. The pixels 113-4, 113-6, 113-7, and 113-9 may generate a pixel signal based on the irradiated radiation and the light output by the scintillator 150. [ The pixels 113-5 and 113-8 receive the irradiated radiation directly and can not receive the light output by the scintillator 150 through the blocking films 133-3 and 133-5. Thus, the pixels 113-5 and 113-8 can generate a pixel signal based on the irradiated radiation.

At this time, the radiation reacting directly to the pixels 113-4 to 113-9 corresponds to low energy radiation, and the radiation reacting in the scintillator 150 mostly absorbs high energy radiation.

Although pixels 113-5 and 113-8 directly absorb only the irradiated radiation to produce a pixel signal, pixels 113-4, 113-6, 113-7, and 113-9 generate many light For example, the radiation directly irradiated and the light generated in the scintillator 150) to generate a pixel signal, thereby obtaining a radiation image of high resolution and low noise.

The radiation image sensor 100 also detects the pixel signals of the pixels 113-5 and 113-8 and the pixel signals of the pixels 113-4, 113-6, 113-7, and 113-9 in one shot, Information on high energy (or energy material) and information on low energy can all be acquired. The image processor 200 combines the pixel signals of the pixels 113-5 and 113-8 and the pixel signals of the pixels 113-4, 113-6, 113-7, and 113-9, And obtain information about the object 300, e.g., the type of material, from the image.

Fig. 3 shows another example of the radiation image sensor shown in Fig.

Referring to FIG. 3, the radiation image sensor 100 may further include an FOB (Fiber Optic Plate) 170. The FOB 170 may be positioned between the scintillator 150 and the pixel array 110.

By placing the FOB 170 between the scintillator 150 and the pixel array 110, the energy of the radiation information measured directly through the pixels included in the pixel array 110 and the radiation information measured through the scintillator 150 . Thus, the energy resolution can be effectively increased, and the radiation image sensor 100 can have a higher energy resolution.

FIG. 4 is a view for explaining a processing operation for a signal obtained through the radiation image sensor shown in FIG. 2 or FIG. 3. FIG.

Referring to FIG. 4, among the plurality of pixels included in the pixel array 110, a pixel that does not receive the light output by the scintillator 150 through the blocking film directly absorbs the irradiated radiation, ≪ / RTI > The first pixel signal may be used to generate a direct image for the material.

The pixels receiving the light output by the scintillator 150 among the plurality of pixels included in the pixel array 110 simultaneously absorb the irradiated radiation and the light output by the scintillator 150 to generate the substances (substance 1 and substance 2) Lt; RTI ID = 0.0 > a < / RTI > The second pixel signal may be used to generate an indirect image for the material.

The image processor 200 may combine the first pixel signal and the second pixel signal to generate a high-resolution good SNR image. Further, the image processor 200 can distinguish the substance 1 and the substance 2 using the generated image.

5 is a flowchart illustrating an operation method of a radiation image sensing apparatus according to an exemplary embodiment of the present invention.

Referring to FIG. 5, among the plurality of pixels included in the pixel array 110, the light outputted from the scintillator 150 is transmitted and received through the blocking films 133-1, 133-3, 133-5, and 133-7, The failing pixel may generate the first pixel signal based on the irradiated radiation (S510).

The pixels other than the pixels that do not receive the light output from the scintillator 150 among the plurality of pixels included in the pixel array 110 are selected based on the light output from the scintillator 150 and the second pixel signal (S530).

The image processor 200 may generate an image by combining the first pixel signal and the second pixel signal (S550).

6 is a flowchart illustrating a method of manufacturing a radiation image sensing apparatus according to an embodiment.

Referring to FIG. 6, a scintillator 150 may be formed in which irradiated radiation is converted into light (S610).

A blocking film 133-1, 133-3, 133-5, or 133-7 for blocking a portion of the light output by the scintillator 150 from being transmitted to the pixel array 110 including a plurality of pixels may be formed (S630).

The pixel array 110 may be disposed on a side where the scintillator 150 outputs light (S650).

The energy dissociation of the above-described radiation image sensing device 10 makes it easier to diagnose diseases in the medical field, and the diagnosis of tumors that can not be distinguished from conventional x-rays can be more accurate. Especially, it can show a great effect in the field which is difficult to diagnose by imaging like breast cancer diagnosis. In addition, in the field of industry, defect inspection can be divided into various materials and inspection can be performed for each material, so that it can effectively cope with inspection of electronic and electric parts such as PCB and electric parts.

The apparatus described above may be implemented as a hardware component, a software component, and / or a combination of hardware components and software components. For example, the apparatus and components described in the embodiments may be implemented within a computer system, such as, for example, a processor, a controller, an arithmetic logic unit (ALU), a digital signal processor, a microcomputer, a field programmable gate array (FPGA) , A programmable logic unit (PLU), a microprocessor, or any other device capable of executing and responding to instructions. The processing device may execute an operating system (OS) and one or more software applications running on the operating system. The processing device may also access, store, manipulate, process, and generate data in response to execution of the software. For ease of understanding, the processing apparatus may be described as being used singly, but those skilled in the art will recognize that the processing apparatus may have a plurality of processing elements and / As shown in FIG. For example, the processing unit may comprise a plurality of processors or one processor and one controller. Other processing configurations are also possible, such as a parallel processor.

The software may include a computer program, code, instructions, or a combination of one or more of the foregoing, and may be configured to configure the processing device to operate as desired or to process it collectively or collectively Device can be commanded. The software and / or data may be in the form of any type of machine, component, physical device, virtual equipment, computer storage media, or device , Or may be permanently or temporarily embodied in a transmitted signal wave. The software may be distributed over a networked computer system and stored or executed in a distributed manner. The software and data may be stored on one or more computer readable recording media.

The method according to an embodiment may be implemented in the form of a program command that can be executed through various computer means and recorded in a computer-readable medium. The computer-readable medium may include program instructions, data files, data structures, and the like, alone or in combination. The program instructions to be recorded on the medium may be those specially designed and configured for the embodiments or may be available to those skilled in the art of computer software. Examples of computer-readable media include magnetic media such as hard disks, floppy disks and magnetic tape; optical media such as CD-ROMs and DVDs; magnetic media such as floppy disks; Magneto-optical media, and hardware devices specifically configured to store and execute program instructions such as ROM, RAM, flash memory, and the like. Examples of program instructions include machine language code such as those produced by a compiler, as well as high-level language code that can be executed by a computer using an interpreter or the like. The hardware devices described above may be configured to operate as one or more software modules to perform the operations of the embodiments, and vice versa.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. For example, it is to be understood that the techniques described may be performed in a different order than the described methods, and / or that components of the described systems, structures, devices, circuits, Lt; / RTI > or equivalents, even if it is replaced or replaced.

Therefore, other implementations, other embodiments, and equivalents to the claims are also within the scope of the following claims.

Claims (15)

A scintillator for converting the irradiated radiation into light;
A pixel array disposed on a side where the scintillator outputs light, the pixel array including a plurality of pixels;
A barrier membrane for blocking a portion of the light output by the scintillator from being transmitted to the pixel array,
And a radiation image sensor.
The method according to claim 1,
The blocking layer
Wherein the pixel is located at a position corresponding to a pixel for each pixel so as not to transmit light outputted from the scintillator.
3. The method of claim 2,
The blocking layer
And wherein the radiation image sensing device is located between the scintillator and the pixel array.
The method according to claim 1,
A FOP (Fiber Optic Plate) positioned between the scintillator and the pixel array,
The radiation image sensing device further comprising:
The method according to claim 1,
A pixel which does not receive the light output from the scintillator through the blocking film among the plurality of pixels generates a first pixel signal based on the irradiated radiation,
Wherein the pixels other than the pixel among the plurality of pixels generate a second pixel signal based on the light output by the scintillator and the irradiated radiation.

6. The method of claim 5,
An image processor for generating an image by combining the first pixel signal and the second pixel signal,
The radiation image sensing device further comprising:
The method according to claim 1,
Wherein the blocking layer is implemented within a corresponding pixel of the plurality of pixels.
Forming a scintillator for converting the irradiated radiation into light;
Forming a barrier membrane for blocking a portion of the light output by the scintillator from being transmitted to a pixel array including a plurality of pixels; And
Placing the pixel array on a side of the scintillator on which light is output
Wherein the radiation image sensing device comprises:
9. The method of claim 8,
The blocking layer
Wherein the scintillator is positioned at a position corresponding to a pixel for each pixel so as not to transmit light output from the scintillator.

10. The method of claim 9,
The blocking layer
Wherein the scintillator is positioned between the scintillator and the pixel array.
9. The method of claim 8,
Forming a FOP (Fiber Optic Plate) between the scintillator and the pixel array
Further comprising the steps of:
A method of operating a radiation image sensing device, comprising a scintillator and a pixel array,
Generating a first pixel signal based on radiation irradiated by a pixel that does not receive light output from the scintillator through a blocking film among a plurality of pixels included in the pixel array; And
Wherein the pixels other than the pixel among the plurality of pixels generate a second pixel signal based on the light output by the scintillator and the irradiated radiation
Wherein the radiation image sensing device comprises:
13. The method of claim 12,
Combining the first pixel signal and the second pixel signal to generate an image
Further comprising the steps of:
13. The method of claim 12,
The blocking layer
Wherein the scintillator is located at a position corresponding to a pixel on a pixel-by-pixel basis to prevent transmission of light output by the scintillator.
15. The method of claim 14,
The blocking layer
Wherein the scintillator is positioned between the scintillator and the pixel array.

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