KR101908541B1 - Transparent substrate - Google Patents

Abstract

[PROBLEMS] To provide a small-sized cover glass having a light-shielding film with high adhesion or a transparent substrate on which a near-infrared cut filter can be easily manufactured.
[MEANS FOR SOLVING PROBLEMS] A transparent substrate having a plurality of optical elements attached on its surface, the transparent substrate having an incident surface on which light is incident and an exit surface through which light incident on the incident surface is emitted, And a light shielding portion which is formed so as to surround the outer periphery of the light transmitting portion in a frame shape on at least one surface of the incident surface and the light emitting surface and shields a part of the light.

Description

Transparent substrate {TRANSPARENT SUBSTRATE}

The present invention relates to a transparent substrate disposed on a front surface of a solid state image pickup device and particularly to a cover glass which is attached to a front surface of a package for housing a solid state image pickup device and protects the solid state image pickup device, And a near-infrared cut filter used for correcting a visual sensitivity.

2. Description of the Related Art In recent years, imaging modules incorporating solid-state imaging elements such as CCDs and CMOSs have been used in portable telephones and information terminals. The image pickup module includes a package made of ceramic or resin for protecting the solid-state image pickup device, and a cover glass attached to the front surface thereof to seal the solid-state image pickup device.

Since the solid-state image pickup device generally has spectral sensitivity ranging from the near-infrared range to the near-infrared range, the image pickup module is equipped with a near-infrared ray cut filter that cuts off the near-infrared ray portion of the incident light and corrects it to be close to human visibility. Infrared cut filter having the same structure as that of the near-infrared cut filter and the cover glass in order to reduce the size of the near-infrared cut filter (for example, Patent Document 1).

The near-infrared cut filter described in Patent Document 1 is composed of a plate-like transparent substrate (for example, an infrared ray absorbing glass), an ultraviolet to infrared light reflective film composed of a dielectric multilayer film formed on one surface of the transparent substrate, Prevention film.

When the optical component such as the near-infrared cut filter is disposed on the front surface (that is, in the optical path) of the solid-state image pickup device, light reflected by the side surface of the near-infrared cut filter is incident on the image pickup surface of the solid-state image pickup device, There is a problem in that a near-infrared cut filter described in Patent Document 1 is further provided with a frame-shaped light shielding layer on the ultraviolet / infrared light reflective film to shield the light path of light which causes ghost or the like.

Japanese Patent Application Laid-Open No. 2013-068688

(Summary of the Invention)

(Problems to be Solved by the Invention)

As described above, according to the near-infrared cut filter described in Patent Document 1, the near-infrared ray portion of the incident light can be cut, and the optical path of light causing ghost or the like can be cut off.

However, since the light-shielding layer of the near-infrared cut filter described in Patent Document 1 is formed by coating a photo-curable resin on the ultraviolet / infrared light reflective film or by vapor-depositing a black metal such as Cr, adhesion with the transparent substrate can not be strengthened , There is a problem that it is peeled off depending on the used environment.

In the case of a comparatively large size (40 mm x 40 mm x 0.3 mm) as in the near infrared ray cut filter described in Patent Document 1, it is relatively easy to form the light shielding layer with high precision. However, (For example, 5 mm x 5 mm x 0.2 mm) near-infrared rays cut filter is required as the size of the image pickup module becomes smaller as compared with the image pickup module which is provided with a light- It becomes difficult to form.

An object of the present invention is to provide a transparent substrate on which optical elements such as a small cover glass and a near-infrared cut filter can be manufactured, and a transparent substrate having a light- .

In order to achieve the above object, a transparent substrate according to the present invention includes an incident surface on which light is incident and an exit surface through which light incident on the incident surface is transmitted and emitted, Wherein each of the optical elements has a light transmitting portion capable of transmitting light and a light shielding portion formed so as to enclose the outer periphery of the light transmitting portion in a frame shape on at least one surface of the incident surface and the light emitting surface and shielding a part of the light .

According to such a configuration, since a plurality of optical elements are attached to the transparent substrate on multiple surfaces, even a small optical element can be easily handled, and the shielding portion can be formed on the optical element with high precision and high productivity. Further, since the light shielding portion is formed directly on the transparent substrate, it is possible to improve the adhesion between the light shielding portion and the transparent substrate.

It is also preferable that a plurality of optical elements are arranged in a two-dimensional lattice pattern. According to this configuration, a plurality of optical elements can be easily separated, and it becomes possible to manufacture with high productivity.

The light-shielding portion may be formed of a thin film of metal or resin. According to this configuration, it becomes possible to easily form a light shielding portion having a high light shielding property.

It is also preferable that the optical element is a member disposed in the optical path of the solid-state image pickup device, and the area of the light-transmitting portion is larger than the area of the light-receiving surface of the solid- In this case, the optical element may be a cover glass disposed on the front surface of the package that houses the solid-state image pickup element, a near-infrared cut filter that removes near-infrared rays from the light incident on the solid-state image pickup element, And an optical low-pass filter for removing the light including the light.

It is also preferable that the transparent substrate is a glass substrate made of glass. In this case also, it is preferable that the glass substrate is a near infrared absorbing glass consisting of a phosphate glass containing fluorine phosphate-based glass, or Cu ²⁺ containing Cu ^2+. According to this configuration, the near infrared rays can be removed from the light incident on the solid-state image pickup element, so that the spectral sensitivity of the solid-state image pickup element is corrected to be close to the human visual sensitivity.

Further, the transparent substrate has an element formation portion in which a plurality of optical elements are formed, and a frame portion formed so as to surround the outer periphery of the element formation portion in a frame shape, and the frame portion is provided with a first index for separately separating a plurality of optical elements . According to this configuration, individual optical elements can be easily separated from the transparent substrate by cutting based on the first index.

It is also preferable that each optical element is disposed with a predetermined gap between adjacent optical elements, and that the first indicator is disposed according to the position of the gap.

It is also preferable that a second index is provided in the frame portion so that the position of each optical element in the element forming portion can be expressed by two-dimensional coordinates. In this case, it is preferable that the second index is constituted by an index indicating the position in the row direction of each optical element and an index indicating the position in the column direction. According to this configuration, it is possible to easily specify the position of the optical element attached to the transparent substrate on multiple surfaces, for example, and it becomes possible to easily manage the inspection result of each optical element.

It is also preferable that a third indicator is provided on the frame portion so that the transparent substrate can be individually discriminated. In this case, it is preferable that the third index is a serial number unique to each transparent substrate.

Further, it is preferable that the transparent substrate has a shape that is point-symmetric in plan view. According to this configuration, it becomes possible to easily specify the position of the optical element attached to the transparent substrate on the basis of the outer shape of the transparent substrate.

The transparent substrate may further include a functional film covering a plurality of optical elements. In this case, it is preferable that the functional film is an optical thin film having at least one function of anti-reflection, infrared cut, and ultraviolet cut.

INDUSTRIAL APPLICABILITY As described above, according to the present invention, a transparent substrate which can easily manufacture an optical element such as a small cover glass or a near-infrared cut filter having a light-shielding film with high adhesion is provided.

1 is a plan view of a transparent substrate according to an embodiment of the present invention.
2 is a view for explaining the constitution of a cover glass which is attached to a transparent substrate on multiple surfaces according to an embodiment of the present invention.
3 is a longitudinal sectional view for explaining a configuration of a solid-state imaging device in which a cover glass having multiple surfaces attached to a transparent substrate according to an embodiment of the present invention is separately mounted.
4 is an enlarged view of a cutting mark provided on a transparent substrate according to an embodiment of the present invention.
5 is a flowchart showing a method of manufacturing a transparent substrate according to an embodiment of the present invention.
6 is a plan view of a first modification of the transparent substrate according to the embodiment of the present invention.
7 is a plan view of a second modification of the transparent substrate according to the embodiment of the present invention.
8 is a plan view of a third modification of the transparent substrate according to the embodiment of the present invention.

(Mode for carrying out the invention)

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals, and description thereof is not repeated.

1 is a plan view of a transparent substrate 10 according to an embodiment of the present invention. The transparent substrate 10 of this embodiment is attached to the front face of the package 300 that houses the solid state image pickup device 200 (Fig. 3), protects the solid state image pickup device 200, A so-called work substrate, to which a glass 100 (optical element) is attached on multiple surfaces. 2 is a plan view of the cover glass 100 attached to the transparent substrate 10 of the present embodiment, and FIG. 2 (b) is a longitudinal sectional view thereof. 3 is a longitudinal sectional view for explaining the configuration of the solid-state imaging device 1 in which the opening of the package 300 of the solid-state imaging element 200 is sealed by the cover glass 100 of the present embodiment.

As shown in Figs. 1 and 2, the transparent substrate 10 of the present embodiment is formed of a glass substrate 101 having a rectangular plate-like appearance, and has a rectangular shape in which a cover glass 100 is adhered And a frame portion OF is formed at an edge portion surrounding the surface attachment region Z. The surface attachment region Z is formed in the surface attachment region Z, In the surface attachment region Z, the cover glass 100 is attached in the form of six pieces (transverse direction) x six pieces (longitudinal direction). The cover glass 100 of the present embodiment has a size of 6 mm (transverse direction) × 5 mm (longitudinal direction) and is arranged in a two-dimensional lattice pattern with a gap d of 0.2 mm in the longitudinal and transverse directions And is cut along the gap d so that 36 cover glasses 100 are finally obtained. As described above, in the transparent substrate 10 of the present embodiment, each of the surface-attached cover glasses 100 is partitioned by the gap d, and the gap d is formed by separating the cover glass 100 It functions as an indicator and has a so-called cleavage site.

As shown in Fig. 2, each cover glass 100 has a rectangular plate-like appearance, and is composed of a glass substrate 101 and a light shielding film 102 formed on the glass substrate 101. As shown in Fig. 2 (b)) of the glass substrate 101 is formed so that when the cover glass 100 is attached to the package 300, the incident surface on which the light directed toward the solid-state image pickup device 200 is incident And the other surface (lower surface in FIG. 2 (b)) of the glass substrate 101 is an exit surface 101b through which light incident on the incident surface 101a is emitted.

Glass substrate 101 of the present embodiment is a (phosphate-based glass containing fluorine or phosphate-based glass containing Cu ²⁺ to Cu ²⁺⁾ infrared absorption glass containing Cu ^2+. In general, fluorophosphate-based glass has excellent weatherability, and by adding Cu ²⁺ to glass, near infrared rays can be absorbed while maintaining high transmittance in the visible light range. Therefore, when the glass substrate 101 is disposed in the optical path of the incident light incident on the solid-state image pickup device 200, it functions as a sort of low-pass filter so that the spectral sensitivity of the solid-state image pickup device 200 becomes close to the human visual sensitivity Corrected. In the fluorine phosphate glass used in the glass substrate 101 of the present embodiment, a known glass composition may be used. In particular, Li ⁺ , an alkaline earth metal ion (e.g., Ca ²⁺ , Ba ²⁺ , , And a rare earth element ion (such as Y ³⁺ or La ³⁺ ). The thickness of the glass substrate 101 of the present embodiment is not particularly limited, but is preferably in the range of 0.1 to 1.5 mm from the viewpoint of achieving a reduction in size and weight.

The light shielding film 102 is a thin film of Cr (chrome), and has a function of shielding a part of incident light incident on the incident surface 101a to remove unnecessary light which causes ghosting or the like. The light shielding film 102 is formed into a frame shape along the outer shape of the glass substrate 101 when the cover glass 100 is viewed in plan. That is, in the cover glass 100 of the present embodiment, the light transmitting portion T, which is formed in a rectangular shape at the center and through which the light incident from the incident surface 101a is transmitted to the emitting surface 101b, And a light shielding portion S for shielding light incident on the incident surface 101a is formed.

3, each cover glass 100 includes a front surface (see FIG. 3) of a package 300 that houses a solid-state image pickup device 200 such as a CCD (Charge-Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor) Nakagami side), and is fixed by an adhesive (not shown). When the cover glass 100 is attached to the package 300, the cover glass 100 is disposed in the optical path of the incident light incident on the solid-state image sensing device 200. However, as described above, (Unnecessary light is not incident on the solid-state image sensor, and ghost or flare does not occur). The sizes of the transparent portion T and the shielding portion S are the same as those of the optical element such as a lens disposed on the outer side of the solid state imaging device 1 and the size of the solid state image pickup element 200 and the size of the cover glass 100 The area of the transparent portion T is larger than the area of the light receiving surface of the solid state image pickup device 200. [

As described above, the transparent substrate 10 of this embodiment is provided with 36 small-sized cover glasses 100 on which the frame-like light shielding film 102 is formed. In the present embodiment, even if a small cover glass 100 is manufactured by manufacturing the transparent substrate 10 as a unit of work, the handling can be improved and the light shielding film 102 can be formed on the transparent substrate 10 with high precision and high productivity . Further, since the light-shielding film 102 of the present embodiment is directly formed on the glass substrate 101, adhesion with the glass substrate 101 is strong, and the structure is difficult to peel off.

1, in the transparent substrate 10 of the present embodiment, an extension line (that is, a frame portion OF) of each gap d and a side of each side of the surface attachment region Z A pair of cutting marks 103 (first index) are formed on the extension line (that is, on the frame portion OF) with the surface attachment region Z sandwiched therebetween. Fig. 4 is an enlarged view of the cutting mark 103 shown in Fig. As shown in Figs. 1 and 4, the cutting mark 103 of the present embodiment has a length of 0.2 mm and a width of 0.02 mm formed by the same process (that is, a thin film of Cr) Is a cross-shaped black mark composed of a horizontal line and is formed at a position spaced 1 mm from the surface attachment region Z, respectively. As described above, since the cutting marks 103 are formed along the respective sides of the gaps d and the surface attachment regions Z in the transparent substrate 10 of the present embodiment, , The cover glass 100 can be accurately cut by aligning the blade of the cutter with the cutting mark 103. [

In the transparent substrate 10 of the present embodiment, the indicators 104a to 104f indicating the surface attachment positions (i.e., two-dimensional coordinates) of the cover glass 100 and the indicators 105a to 104f, 105f (second indicator) are provided. As shown in Fig. 1, in the present embodiment, the indicators 104a to 104f are indexes indicating positions (i.e., coordinates) in the column direction of each cover glass 100, and the indicators 105a to 105f are, (I.e., coordinates) of the glass 100 in the row direction. Further, a serial number SN (third index) unique to each transparent substrate 10 is marked on the lower right side of the transparent substrate 10. The indexes 104a to 104f, the indexes 105a to 105f and the serial number SN are used for data management of the cover glass 100 judged as a good or defective item in an inspection process to be described later. In the present embodiment, the indicators 104a to 104f are alphabets A to F formed in the same process (that is, a thin film of Cr) as the light shielding film 102, and the indicators 105a to 105f are light shielding films Quot; 1 " to " 6 " formed in the same process (that is, a thin film of Cr) of the cover glass 100 in the transparent substrate 10 If the position can be specified in two-dimensional coordinates, another index may be used. The serial number SN of the present embodiment is directly imprinted on the glass substrate 101 when the glass substrate 101 is molded in order to manage each transparent substrate 10, Indicators other than the serial number (SN) may be used if they can be individually identified.

Next, a method of manufacturing the transparent substrate 10 of the present embodiment will be described. 5 is a flowchart showing a manufacturing method of the transparent substrate 10 according to the present embodiment. 5 (b) is a plan enlarged view of the transparent substrate 10 corresponding to each manufacturing step, and Fig. 5 (c) is a cross-sectional view of the transparent substrate 10 Sectional view of a transparent substrate 10 corresponding to a manufacturing process. 5 (b) and 5 (c) show only a part of the surface attachment region Z of the transparent substrate 10 for convenience of explanation. In order to facilitate understanding, in FIG. 5 (b), a part of the constituent elements is denuded, and in FIG. 5 (c), a part of the constituent elements is highlighted.

(Molding of glass substrate)

In the glass substrate forming step, a glass plate having a glass composition having optical characteristics is prepared, and the glass plate is cut by a known cutting method so that the outer size is substantially the same as the final shape (that is, the shape of the transparent substrate 10). The cutting method is a method in which a cutting line is cut with a diamond cutter and then the cutting is performed, or the cutting is performed in a dicing apparatus. The glass plate to be used in this step may be processed by roughing such as lapping to a plate thickness close to the final shape. When the glass plate is cut, the glass substrate 101 is obtained.

(Formation of Cr thin film)

In the Cr thin film forming step, a Cr thin film having a film thickness of about 0.1 占 퐉 is formed on the glass substrate 101 by a sputtering method, a vacuum deposition method, or the like as a base of the light shielding film 102. [

(Resist coat, baking)

In the resist coat and baking process, a photoresist is applied to the surface of the Cr thin film and baking is performed for a predetermined time. The photoresist is not particularly limited as long as the solubility of the photoresist is changed by the light in the ultraviolet or infrared wavelength region. As a coating method of the photoresist, well-known spin coating method, dip coating method and the like can be applied.

(Exposure, resist development)

In the exposure / resist developing step, the light shielding film 102, the cutting marks 103, the indices 104a to 104f, and the indices 105a to 105f are irradiated to the photoresist through a patterned photomask (not shown) . Then, the photoresist is developed using a developing solution according to the photoresist to form a resist in accordance with the patterns of the light-shielding film 102, the cutting marks 103, the indices 104a to 104f, and the indices 105a to 105f .

(Patterning)

In the patterning process, the Cr thin film is immersed in the Cr remover so as to etch the Cr thin film in the portion where the resist is not formed, and the light shielding film 102, the cutting mark 103, the indices 104a to 104f, and the indices 105a to 105f ). ≪ / RTI >

(Resist peeling)

In the resist stripping step, the substrate is immersed in a resist stripping agent such as alcohol to peel off the resist. Thus, the light-shielding film 102, the cutting mark 103, the indicators 104a to 104f, and the indicators 105a to 105f are formed on the glass base 101 and the cover glass 100 is attached on the multi- do.

(Inspection process)

In the inspecting step, various items such as the thickness and shape of the light-shielding film 102 are inspected for each cover glass 100 attached on the glass substrate 101, and a good or defective product is judged. The result of the determination of the good product and the defective product is determined by comparing the address information (i.e., two-dimensional coordinates) of the cover glass 100 specified by the indicators 104a to 104f and the indicators 105a to 105f, The data is managed together with the serial number SN and the cover glass 100 judged to be defective is not used after being cut. In addition, the cover glass 100 determined to be defective in the inspection process may be marked by stamping or engraving so as not to be misused.

As described above, according to the method of manufacturing the transparent substrate 10 of the present embodiment, the 36 light shielding films 102 along the cover glass 100 are simultaneously formed on the transparent substrate 10, Respectively. Therefore, compared with the conventional method of forming the light shielding film 102 for each cover glass 100, the light shielding film 102 can be easily handled and highly precise.

Although the embodiment of the present invention has been described, the present invention is not limited to the above-described embodiment, and various modifications are possible within the scope of the technical idea. For example, in the present embodiment, but a (phosphate-based glass containing fluorine or phosphate-based glass containing Cu ²⁺ to Cu ^2+), a glass substrate 101, the infrared-absorbing glass containing Cu ^2+, the visible For example, borosilicate glass, quartz, polyester resin, polyolefin resin, acrylic resin, or the like may be used.

In the present embodiment, the transparent glass substrate 10 is provided with six (horizontal) x six (vertical) cover glasses 100, but the present invention is not limited to this configuration. The size of the glass 100, and the like.

The transparent substrate 10 according to the present embodiment is of a structure in which the cover glass 100 is attached on multiple faces. Similarly, a near-infrared cut filter for removing near-infrared rays from the light incident on the solid- Pass filter that removes light having a high spatial frequency from the light incident on the optical fiber 200 may be provided on one side. In the case of constructing the near-infrared cut filter, the same glass substrate 101 as that of the transparent substrate 10 of the present embodiment can be used, and the thickness is preferably in the range of 0.1 to 1.5 mm. When an optical low-pass filter is formed, the transparent substrate 10 made of quartz or borosilicate glass may be used, and its thickness is preferably in the range of 0.1 to 3.0 mm.

Shielding film 102 is formed on the side of the incident surface 101a of the glass substrate 101. The light-shielding film 102 may be formed on the side of the emitting surface 101b, 101a and the emitting surface 101b.

The cover glass 100 of the present embodiment is described as being formed with only the light shielding film 102. However, the present invention is not limited to such a structure, and the light shielding film 102 may be formed using at least one of the antireflection film, the infrared cut film, An optical thin film having more than two functions may be formed. An optical thin film having at least one function of an antireflection film, an infrared cut film, and an ultraviolet cut film is formed on the surface of the cover glass 100 on which the light shielding film 102 is not formed (i.e., the emitting surface 101b) You can. Since such a functional film can be deposited all over the entire transparent substrate 10 (that is, all the cover glass 100 having a surface) by the sputtering method or the vacuum evaporation method after the resist stripping step, It is possible to construct a functional film that is efficient and has a small variation in performance.

In the present embodiment, the light shielding film 102 is a Cr thin film formed by a sputtering method, a vacuum deposition method, or the like, but the present invention is not limited thereto. As the light shielding film 102, a metal material such as Ta (tantalum), Mo (molybdenum), Ni (nickel), Ti (titanium), Cu (copper), Al , Or a resin material in which a plurality of colored layers having light transmittance are laminated can be used. In the case of using a resin material, the light-shielding film 102 can be formed by a known screen printing or the like, and the resist-coating and baking process, the exposure and resist development process, the patterning process, and the resist stripping process are unnecessary .

Although the cutting mark 103 in this embodiment is a black mark of a cross shape, it is only required to be able to visually or image-recognize the mark center point or the shape center line of the mark. For example, Marks of various shapes such as an I-shape, a circle shape (●), a rectangular shape (■), and a rhombus shape (◆) can be applied.

Further, although the transparent substrate 10 of the present embodiment is described as being composed of the glass substrate 101 having a rectangular plate shape, the present invention is not limited to such a structure. 6 to 8 are plan views showing first to third modified examples of the transparent substrate 10 according to the present embodiment.

<First Modification>

6, the transparent substrate 10A of the present modification has the cutout 110A formed by obliquely cutting the left upper corner of the glass substrate 101A, and thus the transparent substrate 10A of the present embodiment ). Further, in the transparent substrate 10A of this modification, the indexes 104a to 104f indicating the surface attachment positions (i.e., two-dimensional coordinates) of the cover glass 100 and the indexes 105a to 105f are not provided And is different from the transparent substrate 10 of the present embodiment.

As described above, when the notches 110A are provided in the transparent substrate 10A, the transparent substrate 10A has a point-symmetrical shape, so that the transparent substrate 10A has directionality. Therefore, for example, if the two-dimensional coordinates are formed on the basis of the cover glass 100 closest to the notch 110A, since the position of each cover glass 100 can be specified, It is not necessary to provide the indicators 104a to 104f and the indicators 105a to 105f that indicate the surface attachment positions (i.e., two-dimensional coordinates) like the transparent substrate 10 of FIG.

&Lt; Second Modified Example &

As shown in Fig. 7, the transparent substrate 10B of the present modification example is constituted of a substantially disc-shaped glass substrate 101B having an orientation flat 110B parallel to the row direction of the cover glass 100, And is different from the transparent substrate 10 of the present embodiment in that the cover glass 100 is attached on multiple surfaces. In the transparent substrate 10B of the present modification example, like the transparent substrate 10A of the first modification, the indicators 104a to 104f indicating the surface attachment positions (i.e., two-dimensional coordinates) of the cover glass 100, And is different from the transparent substrate 10 of the present embodiment in that the indicators 105a to 105f are not provided.

When the orientation flat 110B is provided on the substantially disc-shaped transparent substrate 10B as described above, the transparent substrate 10B has a point-symmetrical shape, so that the transparent substrate 10B has directionality. Therefore, for example, when the orientation flat 110B is downward, the cover glass 100 positioned at the uppermost left side is set as the reference (that is, first), and each cover glass 100 is counted in a predetermined direction , The position of each cover glass 100 can be specified in the transparent substrate 10B. Therefore, in the transparent substrate 10B of the present modification example, like the transparent substrate 10 of the present embodiment, the same as the transparent substrate 10A of the first modification, the index (the two-dimensional coordinate) 104a to 104f and indexes 105a to 105f need not be provided.

&Lt; Third Modified Example &

As shown in Fig. 8, in the transparent substrate 10C of the present modification, a notch 110C indicating the column direction of the cover glass 100 is formed instead of the orientation flat 110B of the second modification, Which is different from the transparent substrate 10B of the second modified example.

As described above, even if the notch 110C is provided on the substantially disc-shaped transparent substrate 10C, the transparent substrate 10C has a point-symmetrical shape, and the transparent substrate 10C has directionality. The position of each cover glass 100 can be specified in the transparent substrate 10C like the transparent substrate 10B of the second modification in the transparent substrate 10C of the present modification example, It is not necessary to provide the indicators 104a to 104f and the indicators 105a to 105f that indicate the surface attachment positions (i.e., two-dimensional coordinates) as in the case 10 of FIG.

It is also to be understood that the embodiments disclosed herein are illustrative in all respects and are not restrictive. The scope of the present invention is not limited to the above description, but is defined by the appended claims, and is intended to include all modifications within the meaning and scope equivalent to the claims.

1 solid state imaging device 10, 10A, 10B, 10C A transparent substrate
100 Cover glass 101, 101A, 101B, 101C Glass substrate
101a Incident surface 101b Emission surface
102 Shading film 103 Mark for cutting
104a, 104b, 104c, 104d, 104e, 104f Index
105a, 105b, 105c, 105d, 105e, and 105f,
110A Cutout 110B Orientation Flat
110C notch 200 solid state image pickup device
300 packages

Claims (16)

There is provided a transparent substrate having a plurality of optical elements having an incident surface on which light is incident and an outgoing surface through which light incident on the incident surface is emitted,
Each of the optical elements
A light-transmitting portion capable of transmitting the light,
And a light shielding portion formed so as to surround the outer periphery of the light transmitting portion in a frame shape on at least one surface of the incident surface and the light emitting surface and shielding a part of the light,
Wherein the transparent substrate has an element formation portion in which the plurality of optical elements are formed and a frame portion formed so as to surround the outer periphery of the element formation portion in a frame shape,
Wherein the frame portion is provided with a first indicator for individually separating the plurality of optical elements,
Each of the optical elements is disposed with a predetermined gap between adjacent optical elements,
Wherein the first index is disposed according to the position of the gap. The method according to claim 1,
Wherein the plurality of optical elements are arranged in a two-dimensional lattice pattern. 3. The method according to claim 1 or 2,
Wherein the light-shielding portion is formed of a thin film of metal or resin. 3. The method according to claim 1 or 2,
The optical element is a member disposed in the optical path of the solid-state image pickup element,
And the area of the light-transmitting portion is larger than the area of the light-receiving surface of the solid-state imaging element. 5. The method of claim 4,
Wherein the optical element comprises a cover glass disposed on a front surface of a package that houses the solid state image pickup element, a near infrared ray cut filter for removing near infrared rays from the light incident on the solid state image pickup element, Wherein the transparent substrate is an optical low-pass filter for removing light including a spatial frequency. 3. The method according to claim 1 or 2,
Wherein the transparent substrate is a glass substrate made of glass. The method according to claim 6,
^Wherein the glass substrate is a fluorine phosphate glass containing Cu ²⁺ or a near infrared absorbing glass comprising a phosphate glass containing Cu ²⁺ . delete delete The method according to claim 1,
Wherein the frame portion is provided with a second index capable of indicating the position of each of the optical elements in the element formation portion by two-dimensional coordinates. 11. The method of claim 10,
Wherein the second index is composed of an index indicating the position in the row direction of each optical element and an index indicating the position in the column direction. The method according to claim 1,
Wherein the frame portion is provided with a third index capable of individually identifying the transparent substrate. 13. The method of claim 12,
Wherein the third index is a serial number unique to the transparent substrate. 3. The method according to claim 1 or 2,
Wherein the transparent substrate has a shape that is in point-symmetrical in plan view. 3. The method according to claim 1 or 2,
Wherein the transparent substrate further comprises a functional film covering the plurality of optical elements. 16. The method of claim 15,
Wherein the functional film is an optical thin film having at least one function of reflection preventing, infrared cutting, and ultraviolet cutting.

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