KR101899957B1 - Soldering apparatus for two-board - Google Patents

Abstract

The present invention relates to a soldering apparatus for a printed circuit board, which comprises a transfer unit for transferring a substrate module formed by electrically connecting a first printed circuit board and a second printed circuit board with a plurality of jump pins, A first soldering impregnation unit for intensively impregnating the soldering liquid on the entire connection region of the jump pin, a reversing unit for reversing the substrate module, and a second soldering impregnation unit for intensively impregnating the soldering liquid on the entire connection region of the second printed circuit board and the jump pin. And a soldering impregnated portion.
The present invention relates to a method of manufacturing a printed circuit board in which a substrate module composed of a multilayer printed circuit board connected to each other by a jump pin is transported in parallel to a floor, And then soldering the whole of the jump pin connection portion of another printed circuit board located on the lower layer by smudging the substrate module, the soldering workability and productivity of the printed circuit board and the jump pin of the multi-layer are improved, and the solder ball is printed It is possible to prevent the occurrence of a short by blocking the flow into the circuit board.

Description

[0001] SOLDERING APPARATUS FOR TWO-BOARD [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a soldering apparatus for a printed circuit board, and more particularly, to a soldering apparatus for a printed circuit board in which a plurality of printed circuit boards are connected to each other via a jump- The entire jump-pin connecting portion of the circuit board is soldered simultaneously, and then the substrate module is tilted so that the entire jump-pin connecting portion of another printed circuit board located on the lower layer is soldered simultaneously, To a soldering apparatus of a laminated printed circuit board capable of improving the soldering workability and productivity of a pin and preventing a solder ball from flowing into a multilayer printed circuit board to prevent a short circuit.

The junction box of the vehicle mainly performs functions such as power supply and distribution and wire protection for each electric component, and the junction box stores and protects each device (fuse, relay, etc.) And maintenance of operating efficiency through rapid heat dissipation.

If the relays and fuses constituting the junction box are damaged, it is troublesome to replace the damaged component parts. Therefore, it is possible to solve troubles due to frequent replacement and to further diagnose the failure of each component part Next-generation intelligent junction boxes are being developed that can be used semi-permanently by replacing relays and fuses with IPS, a semiconductor device.

The technical structure described above is a background technique for assisting the understanding of the present invention, and does not mean the prior art widely known in the technical field to which the present invention belongs.

A conventional junction box structure has been proposed in Korean Patent Publication No. 10-2005-0082584.

The conventional junction box is provided with a plurality of printed circuit boards arranged in a multi-layer structure due to an increase in the option (function) of the vehicle. In the multi-layer printed circuit board, soldering is carried out in a standing state after inserting a jump- There is a problem that the solder ball is scattered between the printed circuit boards facing each other to cause a short circuit of the electronic circuit.

Therefore, there is a need to improve this.

SUMMARY OF THE INVENTION The present invention has been conceived in order to solve the above-mentioned problems, and it is an object of the present invention to provide a method of manufacturing a printed circuit board by transferring a substrate module composed of a multilayer printed circuit board connected to each other by a jump pin, Layer printed circuit board and jump pins by simultaneously impregnating the substrate module with the solder and simultaneously impregnating the whole of the jump pin connection portion of another printed circuit board located on the lower layer with soldering so as to improve the soldering workability and productivity of the multi- And a soldering apparatus for a printed circuit board.

According to the present invention, there is provided a soldering apparatus for a laminated printed circuit board, which prevents a solder ball from flowing into a printed circuit board between a plurality of printed circuit boards by applying a solder solution to a surface of the printed circuit board from below, The purpose is to provide.

A soldering apparatus for a stacked printed circuit board according to the present invention includes: a transfer unit for transferring a substrate module formed by electrically connecting a first printed circuit board and a second printed circuit board with a plurality of jump pins; A first soldering impregnating unit for intensively impregnating a soldering liquid on the entire connection area between the first printed circuit board and the jump pin; A reversing unit for reversing the substrate module; And a second soldering impregnation unit for intensively impregnating a soldering liquid on the entire connection area between the second printed circuit board and the jump pin.

A soldering apparatus for a stacked printed circuit board according to the present invention includes: a first flux shroud for concentrically applying a flux to a connecting portion of the first printed circuit board and the jump pin; And a second flux applicator for concentrically applying a flux to a connection portion between the second printed circuit board and the jump pin.

Wherein the first printed circuit board, which is flux-coated in the first flux shroud, is conveyed to the first soldering impregnation unit after drying through the first preheating unit; The second printed circuit board coated with flux at the second flux shroud can be transferred to the second soldering impregnation unit after drying through the second preheating unit.

And the jump pin is inserted along the edge of the first printed circuit board and the second printed circuit board so that both ends of the jump pin are exposed to the outside.

The first soldering impregnated portion may include a first soldering casing disposed below the transfer portion and contacting a lower surface of the first printed circuit board along an inner side of a locus of the jumping pins when the substrate module is lowered; The soldering liquid supplied along the periphery of the first soldering casing is concentrated on the lower side surface of the first printed circuit board exposed to the outside of the first soldering casing, thereby soldering the jump pin, A first soldering pot for guiding; And a first soldering overflow casing for holding soldering liquid which flows over the first soldering pot to prevent external leakage.

The first flux shell is disposed on the lower side of the transfer unit and contacts the lower side of the first printed circuit board along the inside of the locus of the jumping pins when the substrate module is lowered; The first flux casing is provided along the circumference of the first flux casing and is flux-concentrated to a lower side of the first printed circuit board exposed to the outside of the first flux casing, Pot; And a first flux overflow casing for containing the flux flowing over the first flux pot to prevent the outflow of flux.

The first flux casing may connect a first air supply unit to prevent flux from being supplied to the first printed circuit board side from the flux pot to flow into the lower inside of the first printed circuit board.

Wherein the conveying unit comprises: a conveying guide rail arranged in parallel; A mounting conveyance pin which is rotatably provided on each of the conveyance guide rails along the axial direction and which is disposed on the lower side of the first printed circuit board or the second printed circuit board disposed on the upper side of the substrate module; And an actuating part for guiding and conveying the substrate module by rotating the stationary feed pin.

The operating portion includes a gear wheel member provided on each of the stationary transfer pins; An actuating motor for transmitting a rotational force to the gear wheel member of the specific mount transfer pin; An electric shafts disposed axially along each of the transport guide rails and rotatably disposed; And a gear tooth member provided on a circumferential surface of each of the electric shafts and gearing the all gear wheel members disposed along the axial direction of the electric shafts to feed the substrate module.

The transfer guide rail may include a stopper for fixing the substrate module at a specific position for a set time.

Wherein the conveying guide rail is divided into a plurality of parts so as to be partially lifted and lowered at a specific position; And can be moved up and down by the ascending and descending section.

According to another aspect of the present invention, there is provided a method of soldering a printed circuit board, comprising the steps of: transferring a first printed circuit board and a second printed circuit board by arranging a plurality of jump pins electrically connected to each other, ; A first soldering impregnation step of intensively impregnating a soldering liquid on a lower side surface setting portion of the first printed circuit board to solder the entire connection portion between the first printed circuit board and the jump pin located below the substrate module; Reversing the substrate module after soldering the first printed circuit board and the jump pin; And a second soldering impregnation step of intensively impregnating a soldering liquid on a lower side surface setting portion of the second printed circuit board to solder the entire connection portion between the second printed circuit board located below the substrate module and the jump pin, .

A soldering method of a stacked printed circuit board according to the present invention is characterized by comprising: a first flux applying step of applying a flux concentrically to a whole connecting portion of the first printed circuit board and the jump pin; And a second flux applying step of applying a flux concentrically to all the connection portions of the second printed circuit board and the jump pin.

As described above, according to the soldering apparatus of the laminated printed circuit board according to the present invention, unlike the prior art, the substrate module composed of the multilayer printed circuit board connected to each other by the jump pins is transferred in parallel to the floor, The entire jump pin connection portion of the substrate is soldered simultaneously and then the substrate module is padded to simultaneously solder the entire jump pin connection portions of the other printed circuit boards located on the lower layer to perform the soldering operation of the printed circuit board and the jump pin And productivity and productivity can be improved.

In addition, the present invention can prevent a solder ball from flowing into a printed circuit board between the printed circuit boards by applying the solder solution to the surface of the printed circuit board from below.

1 is a side view showing a configuration of a soldering apparatus for a printed circuit board according to an embodiment of the present invention.
2 is a perspective view of a soldering apparatus for a stacked printed circuit board according to an embodiment of the present invention.
3 is a perspective view of a transfer part of a soldering apparatus according to an embodiment of the present invention.
4 is a rear perspective view of a conveyance unit according to an embodiment of the present invention.
5 is an enlarged perspective view showing a lifting and lowering portion of a soldering apparatus according to an embodiment of the present invention.
6 is a schematic view showing an operating state of a lifting / lowering part according to an embodiment of the present invention.
FIG. 7 is a cross-sectional view illustrating a laminated printed circuit board according to an embodiment of the present invention in a state of flux coating and soldering impregnation.
8 is a flowchart illustrating a soldering method of a printed circuit board according to an embodiment of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of a soldering apparatus for a stacked printed circuit board according to the present invention will be described with reference to the accompanying drawings. In this process, the thicknesses of the lines and the sizes of the components shown in the drawings may be exaggerated for clarity and convenience of explanation. In addition, the terms described below are defined in consideration of the functions of the present invention, which may vary depending on the intention or custom of the user, the operator. Therefore, definitions of these terms should be made based on the contents throughout this specification.

FIG. 1 is a side view showing a structure of a soldering apparatus for a printed circuit board according to an embodiment of the present invention, and FIG. 2 is a perspective view of a soldering apparatus for a printed circuit board according to an embodiment of the present invention.

FIG. 3 is a perspective view of a transfer unit of a soldering apparatus according to an embodiment of the present invention, and FIG. 4 is a rear perspective view of a transfer unit according to an embodiment of the present invention.

FIG. 5 is an enlarged perspective view showing a lifting and lowering portion of a soldering apparatus according to an embodiment of the present invention, FIG. 6 is a schematic view showing an operating state of a lifting and lowering portion according to an embodiment of the present invention, Sectional view showing a state in which a laminated printed circuit board according to an embodiment is subjected to flux application and soldering impregnation.

Referring to FIGS. 1 to 7, a soldering apparatus 100 of a stacked printed circuit board according to an embodiment of the present invention transfers a substrate module 10 substantially in parallel to a floor, The soldering process is performed by soldering the connection portion between the first printed circuit board 20 and the jump pin 40 and then soldering the connection portion between the second printed circuit board 30 and the jump pin 40, to be.

In particular, the substrate module 10 includes a first printed circuit board 20 on which various elements (not shown) are mounted and a circuit pattern (not shown) is formed, and various elements (not shown) The first printed circuit board 20 and the second printed circuit board 30 are electrically connected to each other so that the first printed circuit board 20 and the second printed circuit board 30 are electrically connected to each other. And the other end of which is inserted into the second printed circuit board (30).

A plurality of jump pins 40 are disposed along the edges of the first printed circuit board 20 and the second printed circuit board 30 and the first printed circuit board 20 and the second printed circuit board 30 ) Are transported in a side-by-side (side-by-side) relation to the floor.

Here, the soldering apparatus 100 includes a frame 110, a transfer unit 200, a first flux decorating unit 300, a first preheating unit 400, a first soldering impregnation unit 500, an inversion unit 600, A second flux decorating portion 700, a second preheating portion 800, and a second soldering impregnating portion 900.

The frame 110 includes a transfer part 200, a first flux decorating part 300, a first preheating part 400, a first soldering impregnating part 500, a reversing unit 600, a second flux decorating part 700, The second preheating unit 800, and the second soldering impregnation unit 900, as shown in FIG. Of course, the frame 110 may be removed.

The transfer unit 200 serves to transfer the substrate module 10. At this time, firstly, the first printed circuit board 20 is transported while being disposed on the lower side of the second printed circuit board 30.

In particular, the substrate module 10 includes a first flux decorating part 300, a first preheating part 400, a first soldering impregnating part 500, a reversing unit 600, The second preheating portion 800, and the second soldering impregnated portion 900 in order.

The first flux decorating part 300 is provided with a function of concentrating the flux over the entire connection area between the first printed circuit board 20 and the jump pin 40 located below the substrate module 10 for the first time, . Here, 'flux' is a composition that cleans the soldering area of the first printed circuit board 20, prevents oxides from forming during soldering, and ensures soldering.

In addition, the first preheating unit 400 serves to heat the first printed circuit board 20 coated with the flux to dry the flux in a short time. Of course, the first preheating unit 400 can be variously applied.

The first soldering impregnation unit 500 may include a first soldering impregnation unit 500 and a second soldering impregnation unit 500. The first soldering impregnation unit 500 may include a first flux substrate 300 and a first preheating unit 400, It serves to impregnate the soldering solution intensively throughout the connection area. At this time, soldering solution can be applied variously such as lead solution.

The inverting unit 600 is formed by inverting the substrate module 10 after the connection portions of the first printed circuit board 20 and the jump pins 40 are soldered by the first soldering impregnation unit 500, . As a result, the second printed circuit board 30 is disposed on the lower side of the first printed circuit board 20 of the board module 10. Of course, the reversal unit 600 can be applied in various ways.

The second flux decorating part 700 is inverted by the reversing unit 600 and extends over the entire connection area between the second printed circuit board 30 and the jump pin 40 located below the substrate module 10 It functions to concentrate the flux.

In addition, the second preheating part 800 functions to heat the flux-applied second printed circuit board 30 to dry the flux in a short time. Of course, the second preheating unit 800 can be variously applied.

The second soldering impregnation unit 900 is connected to the second printed circuit board 30 of the substrate module 10 via the second flux decorating unit 700 and the second preheating unit 800, It serves to impregnate the soldering solution intensively throughout the connection area.

Accordingly, the substrate module 10 is transferred by the transfer unit 200, and all of the connection portions of the first printed circuit board 20 located at the first lower side and the plurality of jump pins 40 are soldered at the same time, And the jump pins 40 are simultaneously soldered to the second printed circuit board 30 and the jump pins 40. Thus, soldering workability and productivity are significantly improved and the solder balls are penetrated into the substrate modules 10 during the soldering process A short is not generated.

In particular, a plurality of jump pins 40 are inserted along the edges of the first printed circuit board 20 and the second printed circuit board 30 so that both ends of the jump pins 40 are exposed to the outside. Thus, the first printed circuit board 20 and the second printed circuit board 30 are electrically connected.

Meanwhile, the first flux shell 300 includes a first flux casing 310, a first flux pot 320, and a first flux overflow casing 330.

In particular, the first flux decorating portion 300 is formed on the edge of the first printed circuit board 20 including the connection portions of the jump pins 40 of the first printed circuit board 20 disposed below the substrate module 10, It is responsible for fluxing the whole.

The first flux casing 310 is disposed below the transfer unit 200. The upper surface of the circumference of the first flux casing 310 is brought into contact with the lower surface of the first printed circuit board 20 when the substrate module 10 is lowered. At this time, the upper side of the circumference of the first flux casing 310 is brought into contact with the lower side of the first printed circuit board 20 along the inside of the locus of the jump pins 40. This is to prevent the flux from flowing into the element side mounted on the first printed circuit board 20. [ Of course, the first flux casing 310 can be deformed into various shapes.

The first flux pot 320 is provided along the periphery of the first flux casing 310 and the flux is supplied to the lower surface of the first printed circuit board 20 exposed to the outside of the first flux casing 310 After concentrated fluxing on the side, it serves to guide the overflow to the outside.

That is, the first flux pot 320 is formed along the circumferential surface of the first flux casing 310 and the circumferential surface of the first flux pot 320 is formed lower than the circumferential surface height of the first flux casing 310. In addition, the first flux pot 320 is connected to the first flux supplier 322. The flux is gradually increased in the interior of the first flux pot 320 through the first flux supply part 322 and the flux is transferred to the first printed circuit board 20 and the jump pin 40 through the connection parts of the first printed circuit board 20 and the jump pin 40, do. Thereafter, the flux is swept outward along the circumferential surface of the first flux pot 320 having a relatively low height.

In addition, the first flux overflow casing 330 includes a first flux casing 310 and a first flux pot 320 on the inner side thereof. The first flux flux 310 covers the flux flowing in the first flux pot 320, . Particularly, the first flux overflow casing 330 is fixed to the upper side of the frame 110. Of course, the first flux overflow casing 330 can be deformed into various shapes.

Particularly, the first air hole 312 may be formed so as to be connected to the first flux casing 310 alone or through the contact portion of the first flux casing 310 and the first flux overflow casing 330.

The first air hole 312 connects the first air supply unit 340 to supply air from the outside to the inside of the first flux casing 310. The flux supplied from the first air supply unit 340 to the first flux casing 310 at a high pressure is supplied to the first printed circuit board 20 from the first flux pot 320, Thereby preventing blocking of the inflow into the lower inside of the substrate 20. As a result, the elements of the first printed circuit board 20 are protected.

In addition, the first soldering impregnation unit 500 includes a first soldering casing 510, a first soldering pot 520, and a first soldering overflow casing 530.

The first soldering casing 510 is disposed below the transfer unit 200. The upper side of the circumferential surface of the first soldering casing 510 is brought into contact with the lower side of the first printed circuit board 20 when the substrate module 10 is lowered. At this time, the upper side of the circumferential surface of the first soldering casing 510 is brought into contact with the lower side of the first printed circuit board 20 along the inside of the locus of the jump pins 40. This is to prevent the soldering liquid from flowing into the device side mounted on the first printed circuit board 20. Of course, the first soldering casing 510 can be deformed into various shapes.

The first soldering pot 520 is provided along the periphery of the first soldering casing 510 and the soldering liquid is supplied to the first soldering casing 510 And is used to guide the overflow to the outside after being concentratedly applied to the lower side.

That is, the first soldering pot 520 is formed along the circumferential surface of the first soldering casing 510, and the circumferential surface of the first soldering pot 520 is formed lower than the circumferential surface height of the first soldering casing 510. In addition, the first soldering pot 520 is connected to the first soldering supply part 522. Accordingly, the soldering liquid gradually increases in the inside of the first soldering pot 520 through the first soldering supply part 522 and is applied over the entire connection area of each of the first printed circuit board 20 and the jump pin 40 And soldered. Thereafter, the soldering liquid swirls outward along the peripheral surface of the first soldering pot 520 having a relatively low height.

The first soldering overflow casing 530 is provided with a first soldering casing 510 and a first soldering pot 520 on the inner side to receive a soldering liquid flowing over the first soldering pot 520, . Particularly, the first soldering overflow casing 530 is fixed to the upper side of the frame 110. Of course, the first soldering overflow casing 530 can be deformed into various shapes.

Particularly, the first flux casing 310 can communicate with the first air hole 312, and the first air hole 312 can connect with the first air supply part 340.

Meanwhile, the second flux shell portion 700 includes a second flux casing 710, a second flux pot 720, and a second flux overflow casing 730.

Particularly, the second flux capping portion 700 includes the connecting portions of the jump pins 40 of the second printed circuit board 30 disposed on the lower side of the substrate module 10 while being inverted by the reversing unit 600 And functions to flux the entire edge of the second printed circuit board 30.

The second flux casing 710 is disposed below the transfer unit 200. The upper surface of the circumference of the second flux casing 710 is brought into contact with the lower surface of the second printed circuit board 30 when the substrate module 10 is lowered. At this time, the upper side of the circumference of the second flux casing 710 is brought into contact with the lower side of the second printed circuit board 30 along the inside of the locus of the jump pins 40. This is to prevent the flux from flowing into the element side mounted on the second printed circuit board 30. Of course, the second flux casing 710 can be deformed into various shapes.

The second flux pot 720 is provided along the circumference of the second flux casing 710 and is connected to the second flux casing 710 through a lower portion of the second printed circuit board 30 exposed to the outside of the second flux casing 710 After concentrated fluxing on the side, it serves to guide the overflow to the outside.

That is, the second flux pot 720 is formed along the circumferential surface of the second flux casing 710, and the circumferential surface of the second flux pot 720 is formed to be lower than the circumferential surface height of the second flux casing 710. In addition, the second flux pot 720 is connected to the second flux supplier 722. Accordingly, the flux is gradually raised in the second flux pot 720 through the second flux supply unit 722, and the flux is transferred to the second printed circuit board 30 and the jump pin 40, do. Thereafter, the flux swirls outward along the circumferential surface of the second flux pot 720 having a relatively low height.

The second flux overflow casing 730 includes a second flux casing 710 and a first flux pot 320 on the inner side thereof to prevent flux from flowing out of the second flux pot 720, . Particularly, the second flux overflow casing 730 is fixed to the upper side of the frame 110. Of course, the second flux overflow casing 730 can be deformed into various shapes.

Particularly, the second air hole 712 can be opened so as to be connected to the second flux casing 710 alone, or through the contact area of the second flux casing 710 and the second flux overflow casing 730.

The second air hole 712 connects the second air supply unit 740 to supply air from the outside into the second flux casing 710. Accordingly, the air supplied from the second air supply unit 740 to the second flux casing 710 at a high pressure is supplied from the second flux pot 720 to the second printed circuit board 30 side, Thereby preventing the substrate 30 from being blocked from flowing into the lower portion of the substrate 30. As a result, the elements of the second printed circuit board 30 are protected.

The second soldering impregnation unit 900 includes a second soldering casing 910, a second soldering pot 920, and a second soldering overflow casing 930.

The second soldering casing 910 is disposed below the transfer unit 200. The upper side of the circumferential surface of the second soldering casing 910 is brought into contact with the lower side of the second printed circuit board 30 when the substrate module 10 is lowered. At this time, the upper side of the circumferential surface of the second soldering casing 910 is brought into contact with the lower side of the second printed circuit board 30 along the inside of the locus of the jump pins 40. This is to prevent the soldering liquid from flowing into the device side mounted on the second printed circuit board 30. Of course, the second soldering casing 910 can be deformed into various shapes.

The second soldering pot 920 is provided along the periphery of the second soldering casing 910 and the second soldering pot 920 is provided along the periphery of the second soldering casing 910, And is used to guide the overflow to the outside after being concentratedly applied to the lower side.

That is, the second soldering pot 920 is formed along the circumferential surface of the second soldering casing 910, and the circumferential surface of the second soldering pot 920 is formed lower than the circumferential surface height of the second soldering casing 910. In addition, the second soldering pot 920 is connected to the second soldering supply portion 922. Accordingly, the soldering liquid gradually increases in the interior of the second soldering pot 920 through the second soldering supply portion 922 and is applied over the entire connection portions of the second printed circuit board 30 and the jump pins 40 And soldered. Thereafter, the soldering liquid flows outward along the peripheral surface of the second soldering pot 920 having a relatively low height.

The second soldering overflow casing 930 includes a second soldering casing 910 and a second soldering pot 920 on the inner side to receive a soldering liquid flowing over the second soldering pot 920, . Particularly, the second soldering overflow casing 930 is fixed to the upper side of the frame 110. Of course, the second soldering overflow casing 930 can be deformed into various shapes.

Particularly, the second flux casing 710 can communicate with the second air hole 712, and the second air hole 712 can connect with the second air supply part 740.

The conveying unit 200 includes a conveying guide rail 210, a mounting conveying pin 220, and an operating unit 230.

The transport guide rails 210 are arranged on the frame 110 in parallel. At this time, the conveyance guide rails 210 may be formed variously.

The mounting guide pins 220 are rotatably mounted on the guide rails 210 along the axial direction. At this time, the stationary transferring pins 220 are provided inside the transfer guide rails 210 facing each other.

Thus, the stationary transfer pin 220 serves to mount the lower surface of the first printed circuit board 20 or the second printed circuit board 30 disposed on the upper side of the substrate module 10.

In particular, each of the mounting transfer pins 220 forms a step 222 to prevent the mounted substrate module 10 from moving in the axial direction of the mounting transfer pins 220. Thus, as the rim of the first printed circuit board 20 or the second printed circuit board 30 contacts the corresponding step 222, the substrate module 10 is moved along the axial direction of the conveying guide rail 210 And is transported stably.

In addition, the actuating part 230 serves to rotate the stationary feed pin 220. Thus, the substrate module 10 can be linearly transported by the rotation of the stationary feed pin 220.

Here, the operation portion 230 includes a gear wheel member 232, an operation motor 234, a transmission shaft 236, and a gear tooth member 238.

The gear wheel member 232 is provided in each of the stationary feed pins 220 and the operation motor 234 serves to transmit the rotational force to the gear wheel member 232 of the specific stationary feed pin 220. At this time, the driving force of the operation motor 234 transfers the rotational force to the gear wheel member 232 in various manners.

The electric shafts 236 are disposed axially along the respective conveyance guide rails 210 and are rotatably provided. Of course, the electric shafts 236 are rotatably provided along the conveying guide rails 210 in various ways.

The gear teeth member 238 is provided on the circumferential surface of the transmission shaft 236 and gears all the gear wheel members 232 disposed along the axial direction of the transmission shaft 236. When the operating motor 234 is driven, due to the gear engagement of the gear wheel member 232 and the gear tooth member 238, as the transmission shaft 236 is rotated, all the mounting conveyance pins 220 are moved in the same direction . Thus, the substrate module 10 is conveyed while being mounted on the mounting conveying pin 220. [

The substrate module 10 to be transferred may be placed at a position of the first flux decorating part 300, the first soldering impregnating part 500, the second flux decorating part 700 and the second soldering impregnating part 900 for a predetermined time It must be stopped.

Thus, the transport guide rail 210 is provided with the stopper 240 so that the substrate module 10 is fixed at a specific position for a set time. The stopper 240 is provided on the conveying guide rail 210 so that the stopper 240 is capable of protruding or retracting, and serves to fix the position of the substrate module 10 at the set position.

Of course, the stopper 240 can be deformed into various shapes.

In addition, the conveying guide rail 210 can be divided into a plurality of parts so as to be partially lifted and lowered at a specific position.

That is, the conveying guide rail 210 includes a first flux decorating part 300, a first preheating part 400, a first soldering impregnating part 500, a reversing unit 600, a second flux decorating part 700, The second preheating portion 800, and the second soldering impregnated portion 900, respectively. Thus, the conveying guide rails 210 can be raised and lowered by the respective ascending and descending sections 240 in the specific section.

Particularly, the conveyance guide rails 210 corresponding to the sections of the first flux decorating part 300, the first soldering impregnating part 500, the second flux decorating part 700 and the second soldering impregnating part 900, The first printed circuit board 20 or the second printed circuit board 30 of the substrate module 10 is flux coated and soldered after being raised and lowered by the steel portion 240.

At this time, the conveying guide rail 210 is divided into sections rather than ascending and descending as a whole, so that the load applied to the ascending and descending section 240 is reduced during the ascending and descending operations individually.

The ascending and descending section 240 includes a supporter 252 provided on the frame 110 and a vertically guiding member 254 guiding the conveying guide rail 210 up and down relative to the supporter 252.

Here, the upper and lower guide members 254 can be variously applied to an LM guide or the like.

8 is a flowchart illustrating a soldering method of a printed circuit board according to an embodiment of the present invention.

Referring to FIGS. 1, 2 and 8, a method of soldering a stacked printed circuit board according to an embodiment of the present invention includes a transfer step S10, a first flux application step S20, a first soldering impregnation step S30), an inversion step (S40), a second flux application step (S50), and a second soldering impregnation step (S60).

The transferring step S10 is a step in which the substrate module 10 is subjected to a first flux application step S20, a first soldering impregnation step S30, an inversion step S40, a second flux application step S50, and a second soldering impregnation step (S60).

At this time, the substrate module 10 is constructed by electrically connecting the first printed circuit board 20 and the second printed circuit board 30 with a plurality of jump pins 40 while arranging them in parallel with the floor.

In particular, the first printed circuit board 20 is disposed under the substrate module 10 in the first flux application step S20 and the first soldering impregnation step S30. In the second flux application step S50 and the second soldering impregnation step S60, the second printed circuit board 30 is disposed below the substrate module 10.

The first flux applying step S20 is a process of concentrating the flux over the entire connection area between the first printed circuit board 20 and the jump pin 40 located below the substrate module 10. [

In addition, the first soldering impregnation step (S30) is performed to concentrate the bottom surface setting portion of the first printed circuit board (20) in order to simultaneously solder all the connection portions of the first printed circuit board (20) To impregnate the soldering solution.

In addition, the inversion step S40 is a process of reversing the substrate module 10 after soldering the first printed circuit board 20 and the jump pins 40. As a result, the second printed circuit board 30 is disposed on the lower side. At this time, the reversing unit 600 reverses the substrate module 10.

The second flux application step S50 is a process of concentrating the flux over the entire connection area between the second printed circuit board 30 located below the substrate module 10 and the jump pin 40. [

The second soldering impregnation step S60 is performed to concentrate the lower surface setting portion of the second printed circuit board 30 for simultaneous soldering over the entire connection region of the second printed circuit board 30 and the jump pin 40 To impregnate the soldering solution.

Particularly, a preheating step may be performed between the first flux application step S20 and the first soldering impregnation step S30, and a preheating step may be performed between the second flux application step S50 and the second soldering impregnation step S60 Lt; / RTI >

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. I will understand. Accordingly, the true scope of the present invention should be determined by the following claims.

10: substrate module 20: first printed circuit board
30: second printed circuit board 40: jump pin
100: soldering apparatus 110: frame
200: conveying unit 210: conveying guide rail
220: stationary feed pin 230:
232: Gear wheel member 240: Stopper
250: ascending / descending portion 300: first flux shovel
310: first flux casing 320: first flux pot
330: first flux overflow casing 400: first preheating section
500: first soldering impregnation unit 510: first soldering casing
520: first soldering pot 530: first soldering overflow casing
600: inverting unit 700: second flux doffer
710: second flux casing 720: second flux pot
730: second flux overflow casing 800: second preheating part
900: second soldering impregnating portion 910: second soldering casing
820: second soldering pot 930: second soldering overflow casing

Claims (8)

A transfer unit for transferring the substrate module constructed by electrically connecting the first printed circuit board and the second printed circuit board with a plurality of jump pins; A first soldering impregnating unit for intensively impregnating a soldering liquid on the entire connection area between the first printed circuit board and the jump pin; A reversing unit for reversing the substrate module; A second soldering impregnation unit for intensively impregnating a soldering liquid on the entire connection area between the second printed circuit board and the jump pin; And a first flux concealer for concentrically applying a flux to a connection portion of the first printed circuit board and the jump pin,
Wherein the jump pins are inserted along edges of the first printed circuit board and the second printed circuit board so that both ends are exposed outward,
The first flux shell is disposed on the lower side of the transfer unit and contacts the lower side of the first printed circuit board along the inside of the locus of the jumping pins when the substrate module is lowered; A first flux pot disposed along the circumference of the first flux casing; And a first flux overflow casing for containing flux flowing over the first flux pot to prevent external flux,
Wherein a height of the circumferential surface of the first flux pot is lower than a circumferential height of the first flux casing, a flux is supplied to the first flux pot through the first flux supplier, And the first flux overflow casing is fliped along the circumferential surface of the first flux pot having a relatively low height after fluxing the entire connection portion of each pin,
Wherein the first flux casing connects the first air supply unit to prevent the flux supplied to the first printed circuit board side from the first flux pot from flowing into the lower inside of the first printed circuit board,
Wherein the transfer unit, the first soldering impregnation unit, the reversing unit, the second soldering impregnation unit, and the first flux decal part are supported or connected to the frame.
The method according to claim 1,
And a second flux decorating portion for concentrically applying a flux to the entire connection region of the second printed circuit board and the jump pin.
3. The method of claim 2,
Wherein the first printed circuit board, which is flux-coated in the first flux shroud, is conveyed to the first soldering impregnation unit after drying through the first preheating unit;
Wherein the second printed circuit board coated with the flux by the second flux shroud is conveyed to the second soldering impregnation unit after drying through the second preheating unit.
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