KR101889385B1 - 패턴이 있는 기판의 가공 방법 - Google Patents

패턴이 있는 기판의 가공 방법 Download PDF

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Publication number
KR101889385B1
KR101889385B1 KR1020130069853A KR20130069853A KR101889385B1 KR 101889385 B1 KR101889385 B1 KR 101889385B1 KR 1020130069853 A KR1020130069853 A KR 1020130069853A KR 20130069853 A KR20130069853 A KR 20130069853A KR 101889385 B1 KR101889385 B1 KR 101889385B1
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KR
South Korea
Prior art keywords
substrate
pattern
dividing
processing
crack
Prior art date
Application number
KR1020130069853A
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English (en)
Korean (ko)
Other versions
KR20140044260A (ko
Inventor
나오야 기야마
쇼헤이 나가토모
이쿠요시 나카타니
유마 이와츠보
Original Assignee
미쓰보시 다이야몬도 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 미쓰보시 다이야몬도 고교 가부시키가이샤 filed Critical 미쓰보시 다이야몬도 고교 가부시키가이샤
Publication of KR20140044260A publication Critical patent/KR20140044260A/ko
Application granted granted Critical
Publication of KR101889385B1 publication Critical patent/KR101889385B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0673—Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/60—Preliminary treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
KR1020130069853A 2012-10-02 2013-06-18 패턴이 있는 기판의 가공 방법 KR101889385B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012220319A JP6003496B2 (ja) 2012-10-02 2012-10-02 パターン付き基板の加工方法
JPJP-P-2012-220319 2012-10-02

Publications (2)

Publication Number Publication Date
KR20140044260A KR20140044260A (ko) 2014-04-14
KR101889385B1 true KR101889385B1 (ko) 2018-08-17

Family

ID=50400497

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130069853A KR101889385B1 (ko) 2012-10-02 2013-06-18 패턴이 있는 기판의 가공 방법

Country Status (4)

Country Link
JP (1) JP6003496B2 (zh)
KR (1) KR101889385B1 (zh)
CN (1) CN103706951B (zh)
TW (1) TWI550703B (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6064519B2 (ja) * 2012-10-29 2017-01-25 三星ダイヤモンド工業株式会社 レーザー加工装置、および、パターン付き基板の加工条件設定方法
JP6036173B2 (ja) * 2012-10-31 2016-11-30 三星ダイヤモンド工業株式会社 レーザー加工装置
JP6604715B2 (ja) * 2014-09-12 2019-11-13 株式会社ディスコ レーザー加工装置
US20220059994A1 (en) * 2018-12-13 2022-02-24 Sony Group Corporation Semiconductor apparatus and method for manufacturing semiconductor apparatus
CN112605535A (zh) * 2020-11-19 2021-04-06 天津三安光电有限公司 一种晶圆及晶圆划片方法及一种芯粒

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001058281A (ja) * 1999-06-18 2001-03-06 Mitsuboshi Diamond Industrial Co Ltd レーザーを用いたスクライブ法
JP2007220909A (ja) * 2006-02-16 2007-08-30 Disco Abrasive Syst Ltd ウエーハの分割方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4659300B2 (ja) * 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
ES2523432T3 (es) * 2003-07-18 2014-11-25 Hamamatsu Photonics K.K. Chip semiconductor cortado
DE102005038027A1 (de) * 2005-08-06 2007-02-08 Jenoptik Automatisierungstechnik Gmbh Verfahren zum Durchtrennen von spröden Flachmaterialien
JP2008127224A (ja) * 2006-11-17 2008-06-05 Lemi Ltd 脆性材料をフルカットするレーザ割断方法
JP2008198905A (ja) * 2007-02-15 2008-08-28 Hitachi Metals Ltd セラミックス基板及びセラミックス回路基板の製造方法並びに集合基板と半導体モジュール
JP5573832B2 (ja) * 2009-02-25 2014-08-20 日亜化学工業株式会社 半導体素子の製造方法
JP5056839B2 (ja) * 2009-12-25 2012-10-24 三星ダイヤモンド工業株式会社 被加工物の加工方法および被加工物の分割方法
JP5981094B2 (ja) * 2010-06-24 2016-08-31 東芝機械株式会社 ダイシング方法
JP5170196B2 (ja) * 2010-09-24 2013-03-27 三星ダイヤモンド工業株式会社 樹脂付き脆性材料基板の分割方法
JP5240272B2 (ja) * 2010-10-15 2013-07-17 三星ダイヤモンド工業株式会社 レーザー加工装置、被加工物の加工方法および被加工物の分割方法
JP5646550B2 (ja) * 2012-06-15 2014-12-24 三星ダイヤモンド工業株式会社 被加工物の加工方法、被加工物の分割方法およびレーザー加工装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001058281A (ja) * 1999-06-18 2001-03-06 Mitsuboshi Diamond Industrial Co Ltd レーザーを用いたスクライブ法
JP2007220909A (ja) * 2006-02-16 2007-08-30 Disco Abrasive Syst Ltd ウエーハの分割方法

Also Published As

Publication number Publication date
KR20140044260A (ko) 2014-04-14
JP6003496B2 (ja) 2016-10-05
TW201415546A (zh) 2014-04-16
CN103706951B (zh) 2016-08-10
CN103706951A (zh) 2014-04-09
TWI550703B (zh) 2016-09-21
JP2014069237A (ja) 2014-04-21

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E902 Notification of reason for refusal
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