KR101887439B1 - Electronic control unit - Google Patents

Abstract

The present invention relates to an electronic control device. The present invention relates to an electronic control device including a housing, a substrate provided in the housing, and a connector partially exposed to one side of the housing, the substrate being connected to the connector, And a second substrate connected to the first substrate through a bending portion and having a second electronic element mounted thereon, wherein the second substrate is housed in a second substrate accommodating space formed in the housing, 1 is a plan view of an electronic control device according to an embodiment of the present invention.

Description

ELECTRONIC CONTROL UNIT

The present invention relates to an electronic control device. More particularly, the present invention relates to an electronic control device capable of effectively performing heat dissipation of an electronic device that generates heat while reducing the size of the electronic control device.

An electronic control device including an electronic element for control and a printed circuit board on which the electronic element is mounted is used in various fields.

Typically, the vehicle is equipped with an electronic control unit such as an ECU (electronic control unit) for electronically controlling various devices. Such an electronic control unit is provided with information provided from sensors or switches installed in various parts of the vehicle, processes the information thus provided to improve ride comfort and safety of the vehicle, and provides various facilities to the driver and passengers And performs various electronic control functions.

An electronic control device for a vehicle including such an ECU includes a housing, a printed circuit board (PCB) accommodated in the housing, and a connector or the like coupled to one side of the circuit board for external socket connection .

The circuit board may include various electronic devices, and the electronic device includes a heat generating electronic device that generates heat. The heat generated in the heating electronic device is dissipated through the housing to the outside.

Since the circuit board included in such an electronic control unit is in the form of a flat plate, there is a problem that the size of the housing for incorporating the circuit board can not be increased. Further, there is a need to improve the housing structure and the mounting structure of the circuit board in order to effectively dissipate the heat generated in the electronic device mounted on the circuit board.

Korean Registered Patent No. 10-1428933 (Announced 2014.08.08)

An object of the present invention is to provide an electronic control device that effectively reduces heat dissipation of an electronic device mounted on a circuit board while reducing the size of the housing of the electronic control device.

The present invention relates to an electronic control device including a housing, a substrate provided in the housing, and a connector partially exposed to one side of the housing, the substrate being connected to the connector, And a second substrate connected to the first substrate through a bending portion and having a second electronic element mounted thereon, wherein the second substrate is housed in a second substrate accommodating space formed in the housing, 1 is a plan view of an electronic control device according to an embodiment of the present invention.

In one embodiment, the housing may include a housing body and a housing cover covering an upper portion of the housing body.

The second substrate accommodating space may be formed in a trench shape and may be formed between the second substrate contact surface and the auxiliary wall surface.

Also, at least a part of the first substrate may be held in contact with a first substrate contact surface constituting the bottom surface of the housing, and the second substrate may be held in contact with the second substrate contact surface.

In one embodiment, the second substrate may be supported on the second substrate contact surface side by a second substrate support member positioned between the auxiliary wall surface and one surface of the second substrate.

The second substrate supporting member may be a fixing clip provided on the second substrate.

A first radiating fin may be provided on a rear surface of the first substrate contacting surface, and a second radiating fin may be provided on a rear surface of the second substrate contacting surface.

In one embodiment, the second substrate accommodating space may be filled with a heat-dissipating adhesive, and the second substrate may be fixed in the second substrate accommodating space by the heat-dissipating adhesive.

In one embodiment, when the first substrate is horizontally disposed in the housing, the second substrate accommodation space may be formed in a vertical direction.

According to the present invention, the second substrate connected to the first substrate through the bending portion can be mounted in the housing in a direction different from the first substrate, thereby reducing the planar size of the electronic control device.

According to the present invention, there is an advantage that a part of the electronic device generating heat can be mounted on the second board and the heat can be radiated through the side radiating fins of the housing, thereby improving the heat radiation performance of the electronic control device.

1 is a perspective view of an electronic control apparatus according to a preferred embodiment of the present invention.
2 is an exploded perspective view of an electronic control device according to a preferred embodiment of the present invention.
3 is a rear perspective view of a housing body constituting a housing of an electronic control unit according to a preferred embodiment of the present invention.
4 is a perspective view of a connector board assembly of an electronic control unit according to a preferred embodiment of the present invention, as viewed from the bottom surface.
5 is a view showing a detailed configuration of a substrate and a bending portion of an electronic control device according to a preferred embodiment of the present invention.
6 is a perspective view showing a state in which a connector substrate assembly is seated on a housing main body in an electronic control device according to a preferred embodiment of the present invention.
FIG. 7 is a cross-sectional view taken along line AA 'in FIG. 6. FIG.
8 is a view showing a cross section in the direction BB 'in Fig.
9 is a view for explaining a process of placing a connector board assembly on a housing main body in an electronic control device according to a preferred embodiment of the present invention.
FIG. 10 is a view showing a configuration of a substrate and a bending portion included in an electronic control apparatus according to another preferred embodiment of the present invention.
11 is a cross-sectional view illustrating a structure for coupling a second substrate to a housing main body in an electronic control device according to another preferred embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the drawings, the same reference numerals are used to designate the same or similar components throughout the drawings. In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear. In addition, the preferred embodiments of the present invention will be described below, but it is needless to say that the technical idea of the present invention is not limited thereto and can be variously modified by those skilled in the art.

FIG. 1 is a perspective view of an electronic control device according to a preferred embodiment of the present invention, and FIG. 2 is an exploded perspective view of an electronic control device according to a preferred embodiment of the present invention.

The electronic control apparatus 10 according to an embodiment of the present invention includes a housing main body 20 and a housing cover 60 constituting a housing and a connector 42 exposed to one side of the housing and a connector 42 connected to the connector 42 And a connector substrate assembly 40 including a first substrate 46 and a second substrate 50 connected to the first substrate 46.

The housing main body 20 may have a joining surface 22 forming a rim and the housing cover 60 may be coupled to the housing main body 20 in contact with the joining surface 22. [ A screw fixing hole 23 is formed in the housing main body 20 and a screw through hole 62 is formed in the housing cover 60 and a fixing screw 64 is screwed into the screw through hole 62 The housing cover 60 can be coupled to the housing main body 20 by engaging with the screw fixing hole 23 through the through hole. However, it is needless to say that the housing main body 20 and the housing cover 60 may be coupled to each other by welding or using an adhesive in the practice of the present invention.

In one embodiment, the housing main body 20 is formed with a connector receiving portion 24 for receiving the connector 42 at one side thereof. The connector 42 is partially exposed to the outside in a state of being accommodated in the connector accommodating portion 24.

A first substrate contact surface 26 may be formed on the bottom surface of the housing body 20 to support and contact at least a portion of the first substrate 46. The first substrate contact surface 26 may serve to support the first substrate 46 while transferring heat from the first substrate 46. In one embodiment, a first thermal conductive medium 28 may be provided on the upper surface of the first substrate contact surface 26. The first thermal conductive medium 28 is in intimate contact with the lower surface of the first substrate 46 and allows heat from the first substrate 46 to be effectively transferred to the first substrate contact surface 26.

A second substrate accommodating space 30 for accommodating the second substrate 50 is formed in the housing main body 20. The second substrate accommodating space 30 may be provided in the housing body 20 in the form of a trench. In one embodiment, the second substrate receiving space 30 may be formed on the opposite side of the connector receiving portion 24 with the first substrate contacting surface 26 therebetween. The second substrate receiving space 30 may be formed between the second substrate contacting surface 31 and the auxiliary wall surface 33 formed in the vertical direction. That is, the space between the second substrate contact surface 31 and the auxiliary wall surface 33 forms the second substrate accommodation space 30.

2, the second substrate accommodating space 30 is formed in a vertical direction. However, in the embodiment of the present invention, the second substrate accommodating space 30 may include a first substrate 46, And a space formed not parallel to the plane that is seated on the base plate (not shown). Accordingly, the second substrate contact surface 31 may not be a wall surface formed in a vertical direction but may be a wall surface formed obliquely to have a predetermined angle with respect to the first substrate contact surface 26.

In one embodiment, the second substrate contact surface 31 may be prepared with a second thermally conductive medium 58 applied thereto to support heat transfer with the second substrate 50.

The connector substrate assembly 40 is provided with a first substrate 46 connected to the connector 42 or fixed to the connector 42 and a second substrate 50 connected to the first substrate 46 through the bending portion 48 . The first substrate 46 may be provided with a first electronic device 52. The bending portion 48 may be formed in the form of a flexible printed circuit or a flexible flat cable for connecting the first substrate 46 and the second substrate 50 As shown in FIG. Accordingly, the first substrate 46 and the second substrate 50 are electrically connected to each other through the bending portion 48, while the bending portion 48 may be bent and positioned on different planes.

3 is a rear perspective view of a housing body constituting a housing of an electronic control unit according to a preferred embodiment of the present invention.

Referring to Figure 3, the rear side of the housing body 20 is shown. A plurality of radiating fins may be provided on the rear surface of the housing main body 20. [ In one embodiment, the first radiating fins 32 having the first substrate contacting surface 26 are provided on the rear surface and the second radiating fins 32 are provided on the rear surface of the second substrate contacting surface 31 forming one surface of the second substrate receiving space 30 The second radiating fins 34 are provided. The heat dissipation fins 32 and 34 function to promote heat dissipation of heat generated in the electronic devices 52 and 54 provided on the first substrate 46 or the second substrate 50.

FIG. 4 is a perspective view of a connector board assembly of an electronic control unit according to a preferred embodiment of the present invention, viewed from a bottom surface direction, FIG. 5 is a perspective view showing a detailed structure of a board and a bending portion of an electronic control apparatus according to a preferred embodiment of the present invention, Fig.

The connector 42 may include a connector external pin 44a electrically connected to the outside and a connector internal pin 44b electrically connected to the first board 46. [ The connector 42 may be fixed to one side of the first substrate 46.

The second substrate 50 may be provided with a second electronic device 54.

In one embodiment, the second substrate 50 is provided with at least one retaining clip 56. The fixing clip 56 is made of a material having elasticity and may be substantially U-shaped. The fixing clip 56 functions to provide an elastic force such that one side of the second substrate 50 is in close contact with the second substrate contact surface 31. However, in the practice of the present invention, the second substrate 50 may be closely attached to the second substrate contact surface 31 by using a member such as a spring or rubber instead of the fixing clip 56. The securing clip 56, spring or rubber or the like may be referred to as a second substrate support member. In the embodiment of the present invention, the fixing clip 56 and the like are not prepared while being fixed to the second substrate 50, and the second substrate 50 is not inserted into the second substrate accommodating space 30 Or may be inserted into the second substrate accommodation space 30 to support the second substrate 50 thereafter.

2, 4 and 5, a surface on which the first electronic component 52 is mounted on the first substrate 46 and a surface on which the second electronic component 54 is mounted on the second substrate 50 They are opposite to each other. This is because the heat generated in the first electronic element 52 is transmitted to the first substrate contact surface 26 side where the first substrate 46 is placed and the heat generated in the second electronic element 54 is transmitted to the second substrate 50 Is transmitted to the second substrate contact surface 31 which is in contact with one surface of the first substrate contact surface 31.

However, in the practice of the present invention, the second electronic element 54 may be provided on the other surface of the second substrate 50, unlike the configuration shown in FIG. 4 and FIG. In this case, the second substrate contact surface 31 will be changed not to the substrate contact surface 31 shown in FIG. 2, but to the facing surface thereof, that is, the auxiliary wall surface 33 side.

FIG. 6 is a perspective view showing a state in which a connector substrate assembly is seated in a housing main body in an electronic control device according to a preferred embodiment of the present invention, FIG. 7 is a view showing a cross section in the AA 'direction in FIG. 6, 8 is a view showing a cross section in the BB 'direction in FIG.

At least a portion of the first substrate 46 may be located on top of the first substrate contact surface 26 and a first thermal conductive medium 28 may be provided between the first substrate contact surface 26 and the first substrate 46 have. The heat generated in the first electronic component 52 is transferred to the first substrate contact surface 26 through the first thermally conductive medium 28.

The second substrate 50, which is connected to the first substrate 46 through the bending portion 48, is located in the second substrate accommodation space 30. The second substrate 50 is located in a different plane than the first substrate 46. One side of the fixing clip 56 provided on the second substrate 50 is supported by the auxiliary wall surface 33. Since the second substrate 50 is supported by the support clip 56, the second substrate 50 can be brought into close contact with the second substrate contact surface 31. A second heat transfer medium 58 may be provided between the second substrate 50 and the second substrate contact surface 31. The heat generated in the second electronic device 54 mounted on the second substrate 50 is transferred to the second substrate contact surface 31 through the second heat conductive medium 58.

9 is a view for explaining a process of placing a connector board assembly on a housing main body in an electronic control device according to a preferred embodiment of the present invention.

The process of placing the connector board assembly 40 on the housing main body 20 will be described with reference to Fig.

Referring to FIG. 9A, the second substrate 50 is inserted into the second substrate accommodating space 30 of the housing main body 20. One side of the second substrate 50 can be closely attached to the second substrate contact surface 31 forming one side wall of the second substrate accommodation space 30 by the fixing clip 56 provided on the second substrate 50 .

9 (b), the bending portion 48 is bent in a state where the second substrate 50 is inserted into the second substrate accommodation space 30, thereby moving the first substrate 40 to the housing main body 20).

9 (b), the state shown in FIG. 6 is reached. After that, the housing cover 60 is coupled to the housing main body 20 to complete the assembly of the electronic control apparatus 10 have.

FIG. 10 is a view showing a configuration of a substrate and a bending portion provided in an electronic control device according to another preferred embodiment of the present invention, and FIG. 11 is a cross-sectional view of an electronic control device according to another preferred embodiment of the present invention, Fig. 3 is a cross-sectional view showing the structure of coupling to the housing main body;

10, an electronic control unit 10 according to another preferred embodiment of the present invention includes a second substrate 50 connected to a first substrate 46 via a bending portion 48, 54, but the fixing clip 56 is not provided.

In this case, the second substrate accommodation space 30 may be filled with the heat dissipation adhesive 70. The heat-dissipating adhesive 70 is a viscous fluid material, which is capable of heat transfer as well as an adhesive function. The heat-dissipating adhesive 70 may be made of an epoxy-based resin and can be cured by heating or the like.

11, when the second substrate 50 is inserted into the second substrate accommodating space 30, the heat dissipating adhesive 70 surrounds the second substrate 50, and the second substrate 50 is heat- Is fixed in the second substrate accommodation space (30) by the adhesive (70). The size of the second substrate 50 or the height of the second electronic element 54 mounted on the second substrate is relatively small and the width of the second substrate accommodating space 30 31) and the auxiliary wall surface 33) is small, it may be considered to fix the second substrate 50 by using the heat-dissipating adhesive 70 without the fixing clip 56.

According to the present invention, since the first substrate 46 and the second substrate 50 can be provided in the housing while being bent through the bending portion 48, the size of the electronic control device 10 can be reduced There are advantages.

The present invention may also be useful in the case where a large amount of heat is generated in an electronic device mounted on a substrate. The second electronic element 54 is provided on the second substrate 50 and the heat generated by the second electronic element 54 is radiated to the outside through the second substrate contact surface 31 and the second radiating fin 34 So that the heat radiation performance can be improved.

It will be apparent to those skilled in the art that various modifications, substitutions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims. will be. Therefore, the embodiments disclosed in the present invention and the accompanying drawings are intended to illustrate and not to limit the technical spirit of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments and the accompanying drawings . The scope of protection of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents should be construed as falling within the scope of the present invention.

10: Electronic control device 20: Housing body
22: joint surface 23: screw fixing hole
24: connector receiving portion 26: first board contact surface
28: first thermal conductive medium 30: second substrate accommodating space
31: second substrate contacting surface 32: first radiating fin
33: auxiliary wall surface 34: second radiating fin
40: connector board assembly 42: connector
44a: connector outer pin 44b: connector inner pin
46: first substrate 48: bending portion
50: second substrate 52: first electronic element
54: second electronic element 56: fixing clip
58: second heat conduction medium 60: housing cover
62: screw through hole 64: set screw
70: Heat-insulating adhesive

Claims (9)

1. An electronic control apparatus comprising a housing, a substrate provided in the housing, and a connector connected to the substrate and partially exposed to one side of the housing,
The substrate includes a first substrate coupled to the connector and having a first electronic component mounted thereon and a second substrate coupled to the first substrate through a bending portion and having a second electronic component mounted thereon,
The second substrate is provided in a second substrate accommodation space formed in the housing so as to be in a different plane from the first substrate,
Wherein the second substrate accommodating space is provided in a trench form and is formed between the second substrate contacting surface and the auxiliary wall surface. The method according to claim 1,
Wherein the housing includes a housing main body and a housing cover covering an upper portion of the housing main body. delete The method according to claim 1,
Wherein at least a part of the first substrate is held in contact with a first substrate contact surface constituting a bottom surface of the housing and the second substrate is held in contact with the second substrate contact surface. 5. The method of claim 4,
Wherein the second substrate is supported by the second substrate supporting member located on the side of the second substrate contact surface between the auxiliary wall surface and one surface of the second substrate. 6. The method of claim 5,
And the second substrate supporting member is a fixing clip provided on the second substrate. 5. The method of claim 4,
Wherein a first radiating fin is provided on a rear surface of the first substrate contacting surface and a second radiating fin is provided on a rear surface of the second substrate contacting surface. The method according to claim 1,
Wherein a heat dissipation adhesive is filled in the second substrate accommodation space and the second substrate is fixed in the second substrate accommodation space by the heat dissipation adhesive. The method according to claim 1,
Wherein when the first substrate is arranged in the housing in a horizontal direction, the second substrate accommodation space is formed in a vertical direction.

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