KR101874881B1 - Door opening and closing device for semiconductor manufacturing facility - Google Patents
Door opening and closing device for semiconductor manufacturing facility Download PDFInfo
- Publication number
- KR101874881B1 KR101874881B1 KR1020170182925A KR20170182925A KR101874881B1 KR 101874881 B1 KR101874881 B1 KR 101874881B1 KR 1020170182925 A KR1020170182925 A KR 1020170182925A KR 20170182925 A KR20170182925 A KR 20170182925A KR 101874881 B1 KR101874881 B1 KR 101874881B1
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- KR
- South Korea
- Prior art keywords
- cylinder
- door
- opening
- closing
- vacuum chamber
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
Abstract
The present invention discloses a door opening / closing apparatus for a semiconductor manufacturing facility. A door opening / closing apparatus for a semiconductor manufacturing facility is provided with a door provided in a vacuum chamber, a cylinder part hinged to the door at one end and hinged to the vacuum chamber at the other end and connected to the cylinder part, And an opening / closing guide part for compressing or extending the part. Therefore, the present invention can easily open and close the door while maintaining the pressure of the vacuum chamber, and can stably maintain the opened state of the door.
Description
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a door opening and closing apparatus for a semiconductor manufacturing facility, and more particularly, to a door opening and closing apparatus for a semiconductor manufacturing facility which is capable of opening and closing a door while maintaining the pressure of a vacuum chamber, .
In general, various processes such as deposition, photolithography, etching, ashing, and cleaning are required for manufacturing a semiconductor device, and many processes are performed in a chamber.
There are various kinds of chambers for semiconductor fabrication according to the use thereof, but recently, a plasma chamber in which the frequency of use is increasing is used to perform deposition or etching using plasma.
In addition, a desired process is performed on the wafer in a process chamber while maintaining a proper correlation of internal pressure and external pressure during the semiconductor manufacturing process. The external pressure comes from the atmospheric pressure surrounding the semiconductor manufacturing equipment. And the internal pressure comes from an artificially controlled vacuum around the process chamber in the semiconductor manufacturing equipment.
The semiconductor manufacturing facility generally has a load lock chamber and a transfer chamber in order to maintain the internal pressure. The load lock chamber and the transfer chamber are maintained at internal pressure to protect the process chamber during the semiconductor manufacturing process.
Here, the process chamber, the load lock chamber, and the transfer chamber include a door moving device provided with a wafer moving path so that the wafer can move between the chambers, and the wafer moving path is sealed in accordance with a process so that the internal pressure of each chamber is maintained .
However, since the door device for a semiconductor manufacturing facility as described above needs to open a door of several hundred kilos by using a crane or the like, it is difficult to maintain the pressure inside the chamber, There is a problem that can not be maintained.
Therefore, there is a need to improve this.
On the other hand, Japanese Patent Laid-Open No. 10-2008-0082211 discloses a "cover of a processing chamber used in a substrate processing apparatus ".
It is an object of the present invention to provide a door opening / closing device for a semiconductor manufacturing facility which is capable of opening and closing a door while maintaining the pressure of a vacuum chamber, and stably maintaining the opened state thereof .
According to an aspect of the present invention, there is provided a door opening / closing apparatus for a semiconductor manufacturing facility, the door opening and closing apparatus comprising: a door provided in a vacuum chamber; a door hinged to the door at one end and hinged to the vacuum chamber at the other end; A cylinder part for opening and closing the door, and an opening / closing part connected to the cylinder part to compress or extend the cylinder part.
In the present invention, the cylinder portion includes a cylinder rod and a cylinder housing.
In the present invention, the cylinder part is hinged to the door through a rod-and-bearing member, and the cylinder housing is hinged to the vacuum chamber through a tilting member.
The tilting member may include a hinge block rotatably coupled to a hinge bracket coupled to the vacuum chamber, a hinge block coupled to the hinge block and the cylinder housing to interlock with the hinge block and the cylinder housing, And an interlocking gear box.
In the present invention, the cylinder unit may further include a cylinder operation sensing member for sensing a position where the cylinder unit is extended or contracted by the opening / closing part.
In the present invention, the opening and closing member includes a gear box coupled to the cylinder, and an actuator coupled to the gear box.
As described above, the door opening / closing apparatus for a semiconductor manufacturing facility according to one aspect of the present invention can open / close the door easily while maintaining the pressure of the vacuum chamber unlike the prior art, Can be stably maintained.
Further, according to the present invention, it is possible to easily detect the extension or contraction distance of the cylinder rod of the cylinder part.
1 is a perspective view illustrating a door opening / closing apparatus for a semiconductor manufacturing facility according to an embodiment of the present invention.
2 is a side view showing a door opening / closing apparatus for a semiconductor manufacturing facility according to an embodiment of the present invention.
3 is an enlarged view of a main part of a door opening / closing device for a semiconductor manufacturing facility according to an embodiment of the present invention.
4 is an exploded perspective view showing a cylinder part and an opening / closing guide part according to an embodiment of the present invention.
5 is an exploded perspective view showing a cylinder operation sensing member according to an embodiment of the present invention.
6 is an operational state view of a door opening / closing device for a semiconductor manufacturing facility according to an embodiment of the present invention.
Hereinafter, preferred embodiments of a door opening / closing apparatus for a semiconductor manufacturing facility according to the present invention will be described with reference to the accompanying drawings. In this process, the thicknesses of the lines and the sizes of the components shown in the drawings may be exaggerated for clarity and convenience of explanation.
In addition, the terms described below are defined in consideration of the functions of the present invention, which may vary depending on the intention or custom of the user, the operator. Therefore, definitions of these terms should be made based on the contents throughout this specification.
2 is a side view showing a door opening / closing device for a semiconductor manufacturing facility according to an embodiment of the present invention. FIG. 3 is a side view of the door opening / Is an enlarged view of a main portion of a door opening / closing device for a semiconductor manufacturing facility according to an embodiment of the present invention.
5 is an exploded perspective view showing a cylinder operation sensing member according to an embodiment of the present invention, and FIG. 6 is an exploded perspective view illustrating a cylinder operation sensing member according to an embodiment of the present invention. FIG. 4 is an exploded perspective view showing a cylinder part and an opening / 1 is an operational state diagram of a door opening / closing device for a semiconductor manufacturing facility according to an embodiment of the present invention.
1 to 6, a door opening /
A
Since the door opening /
The
One end and the other end of the
The
The
The
The tilting
Meanwhile, a cylinder
The cylinder
The
A plurality of
The
A hydraulic cylinder may be used and the
The opening and closing
In the door opening /
For example, as the
Further, when the driving of the
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. I will understand.
Accordingly, the true scope of protection of the present invention should be defined by the claims.
100: Door opening / closing device for semiconductor manufacturing facility 10: Vacuum chamber
110: door 111: hinge member
120:
120b: cylinder housing 121: cylinder operation sensing member
123: Rod and bearing 125: Rod hinge bracket
127: tilting member 129: hinge bracket
130: opening and closing port opening 131: opening and closing port opening
131: gear box 133: actuator
Claims (5)
The cylinder part includes a cylinder rod and a cylinder housing, the cylinder rod is hinged to the door through a rod-and-bearing member, the cylinder housing is hinged to the vacuum chamber through a tilting member,
Wherein the tilting member comprises: a hinge block rotatably coupled to a hinge bracket coupled to the vacuum chamber; And
An interlocking gear box coupled to the hinge block and the cylinder housing for interlocking with the opening and closing drive unit and driving the cylinder rod;
And a door opening / closing device for a semiconductor manufacturing facility.
Wherein the cylinder portion further comprises a cylinder operation sensing member for sensing a position where the cylinder portion is extended or contracted by the opening / closing drive portion.
The opening and closing guide portion includes a gear box coupled to the cylinder portion; And
An actuator coupled to the gear box;
And a door opening / closing device for a semiconductor manufacturing facility.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020170182925A KR101874881B1 (en) | 2017-12-28 | 2017-12-28 | Door opening and closing device for semiconductor manufacturing facility |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020170182925A KR101874881B1 (en) | 2017-12-28 | 2017-12-28 | Door opening and closing device for semiconductor manufacturing facility |
Publications (1)
Publication Number | Publication Date |
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KR101874881B1 true KR101874881B1 (en) | 2018-07-05 |
Family
ID=62920624
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020170182925A KR101874881B1 (en) | 2017-12-28 | 2017-12-28 | Door opening and closing device for semiconductor manufacturing facility |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102420197B1 (en) | 2022-05-03 | 2022-07-14 | (주)에스제이오토메이션 | Door opening and closing device for semiconductor or display manufacturing facility to prevent gaps from occuring |
KR102439228B1 (en) * | 2022-05-02 | 2022-09-02 | (주)에스제이오토메이션 | Door open-and-close device |
KR20230060578A (en) | 2021-10-27 | 2023-05-08 | (주)에스제이오토메이션 | Door opening and closing device for semiconductor or display manufacturing facility to prevent gaps from occuring |
KR102565797B1 (en) * | 2022-11-22 | 2023-08-16 | (주)에스제이오토메이션 | Ai-based chamber door monitoring device |
WO2023214725A1 (en) * | 2022-05-02 | 2023-11-09 | (주)에스제이오토메이션 | Lid opening and closing device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001158347A (en) * | 1999-12-01 | 2001-06-12 | Kawasaki Heavy Ind Ltd | Motor-driven trap door device for vehicle |
-
2017
- 2017-12-28 KR KR1020170182925A patent/KR101874881B1/en active IP Right Grant
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001158347A (en) * | 1999-12-01 | 2001-06-12 | Kawasaki Heavy Ind Ltd | Motor-driven trap door device for vehicle |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20230060578A (en) | 2021-10-27 | 2023-05-08 | (주)에스제이오토메이션 | Door opening and closing device for semiconductor or display manufacturing facility to prevent gaps from occuring |
KR102439228B1 (en) * | 2022-05-02 | 2022-09-02 | (주)에스제이오토메이션 | Door open-and-close device |
WO2023214725A1 (en) * | 2022-05-02 | 2023-11-09 | (주)에스제이오토메이션 | Lid opening and closing device |
KR102420197B1 (en) | 2022-05-03 | 2022-07-14 | (주)에스제이오토메이션 | Door opening and closing device for semiconductor or display manufacturing facility to prevent gaps from occuring |
KR102565797B1 (en) * | 2022-11-22 | 2023-08-16 | (주)에스제이오토메이션 | Ai-based chamber door monitoring device |
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