KR101871274B1 - Solar cell and solar cell panel including the same - Google Patents

Abstract

A solar cell panel according to an embodiment of the present invention includes a semiconductor substrate, a solar cell including a conductive region formed on the semiconductor substrate or on the semiconductor substrate, and an electrode connected to the conductive region; And a wiring material electrically connected to the electrode to connect the solar cell to another solar cell or to an external circuit. The electrode includes a plurality of finger lines including an outermost finger line adjacent to an edge of the semiconductor substrate, and a bus bar line connected to the wiring material. Wherein the solar cell comprises a plurality of electrode regions in which the plurality of finger lines are located and partitioned by the wiring material, one edge region adjacent to one side edge of the semiconductor substrate and including between the adjacent two electrode regions, And another edge region adjacent to the other edge of the semiconductor substrate and including between two adjacent electrode regions of the plurality of electrode regions. Wherein the one edge region and the other edge region are arranged in an electrode portion having a shape different from that of the plurality of finger lines in the plurality of electrode regions and having a density lower than that of the plurality of finger lines. And the electrode portions of the one-edge region and the other-end edge region are located on the same line or on the outer side of the outermost finger line.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a solar cell,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solar cell and a solar cell panel including the same, and more particularly, to a solar cell connected by a wiring material and a solar cell panel including the solar cell.

With the recent depletion of existing energy sources such as oil and coal, interest in alternative energy to replace them is increasing. Among them, solar cells are attracting attention as a next-generation battery that converts solar energy into electric energy.

A plurality of such solar cells are connected in series or in parallel by a ribbon, and are manufactured in the form of a solar cell panel by a packaging process for protecting a plurality of solar cells. Solar panels require long-term reliability because they must be developed for a long time in various environments. At this time, conventionally, a plurality of solar cells are connected by a ribbon.

However, if a solar cell is connected using a ribbon having a large width of about 1.5 mm, since the large width of the ribbon may cause light loss, it is necessary to reduce the number of ribbons disposed in the solar cell. And the adhesion strength of the ribbon may not be excellent, or the degree of bending of the solar cell may be increased by the ribbon. Thereby, there is a limit in improving the output of the solar cell panel, and the reliability of the solar cell panel may be deteriorated because the ribbon is dropped or the solar cell is damaged.

If the electrode structure is improved to prevent this, the efficiency of the solar cell may be lowered and the output of the solar cell panel may be lowered.

The present invention provides a solar cell capable of improving the output and reliability of the solar cell panel and a solar cell panel including the solar cell.

A solar cell panel according to an embodiment of the present invention includes a semiconductor substrate, a solar cell including a conductive region formed on the semiconductor substrate or on the semiconductor substrate, and an electrode connected to the conductive region; And a wiring material electrically connected to the electrode to connect the solar cell to another solar cell or to an external circuit. A plurality of finger lines formed in parallel in the first direction and including an outermost finger line adjacent to an edge of the semiconductor substrate; and a plurality of finger lines formed in a second direction intersecting the first direction, And a bus bar line to be connected. One edge region is located at one end of the bus bar line adjacent to one side edge of the semiconductor substrate and the other edge region is located at the other edge of the bus bar line adjacent to the other edge side of the semiconductor substrate. The bus bar line in each of the one-edge region and the other-end edge region includes an electrode portion having an opening in its interior and an outermost end portion thereof located on the same line or outward as the outermost finger line.

A solar cell according to an embodiment of the present invention includes: a semiconductor substrate; A conductive type region formed on the semiconductor substrate or on the semiconductor substrate; And an electrode connected to the conductive region. A plurality of finger lines formed in parallel in the first direction and including an outermost finger line adjacent to an edge of the semiconductor substrate; and a plurality of finger lines formed in a second direction intersecting the first direction, And a bus bar line to be connected. One edge region is located at one end of the bus bar line adjacent to one side edge of the semiconductor substrate and the other edge region is located at the other edge of the bus bar line adjacent to the other edge side of the semiconductor substrate. The bus bar line in each of the one-edge region and the other-end edge region includes an electrode portion having an opening in its interior and an outermost end portion thereof located on the same line or outward as the outermost finger line.

According to this embodiment, the optical loss can be minimized by diffused reflection or the like by using the wire-shaped wiring material, and the pitch of the wiring material can be reduced, thereby reducing the movement path of the carrier. Thus, the efficiency of the solar cell and the output of the solar cell panel can be improved. At this time, the edge distance of the first electrode is limited according to the width of the wiring material, so that the adhesion between the wiring material having the wire form and the first electrode can be improved. Accordingly, damage to the solar cell, which may occur when the wiring material is separated from the first electrode, can be prevented, and the solar cell can have excellent electrical characteristics and excellent reliability. Further, the number of the wiring materials can be limited according to the width of the wiring material, and the output of the solar cell panel can be maximized.

Also, in this embodiment, the electrode part is located on the same line or outward as the outermost finger line in the edge area and the edge area at the other end, so that the connection structure with the wiring material can be stably formed. The current generated in the one edge region and the electrode region adjacent to the other edge region through the electrode portion can be effectively transferred to the wiring material. As a result, the current generated in the portion of the electrode region located at one edge region and the edge region adjacent to the other edge region can be effectively transferred to the wiring member by the electrode portion. Thus, in order to improve the adhesive force or bonding force of the wiring material, it is possible to prevent a reduction in the efficiency that may be caused by the edge region and the edge region. Thus, the efficiency of the solar cell can be improved and the output of the solar cell panel can be improved.

In addition, the shape of the electrodes located at one edge region and the electrode regions positioned at the other edge region may be different from each other to simplify the electrode structure while stably forming the connection structure of the wiring material.

1 is a perspective view illustrating a solar cell panel according to an embodiment of the present invention.
2 is a cross-sectional view taken along the line II-II in FIG.
3 is a partial cross-sectional view illustrating an example of a solar cell included in the solar cell panel of FIG.
4 is a partial cross-sectional view showing another example of a solar cell included in the solar cell panel of FIG.
FIG. 5 is a perspective view schematically showing a first solar cell and a second solar cell connected by a wiring material in the solar cell panel of FIG. 1;
6 is a perspective view and a cross-sectional view showing a wiring material before being attached to the electrode of the solar cell shown in Fig.
7 is a cross-sectional view showing a wiring member attached to the pad portion of the electrode of the solar cell shown in Fig.
8 is a schematic cross-sectional view of part A of Fig.
FIG. 9 is a plan view showing a solar cell included in the solar cell panel of FIG. 1 and a ribbon connected to the solar cell.
10 is a photograph of a cross section of a solar cell to which wiring materials having different widths are attached.
11 is a graph showing the results of measuring the adhesion of the wiring material at the end of the electrode while varying the width and edge distance of the wiring material.
12 is a graph showing the output of the solar cell panel measured while changing the width and the number of wiring materials.
13 is a partial front plan view of a solar cell panel according to another embodiment of the present invention.
14 is a partial front plan view of a solar cell panel according to another embodiment of the present invention.
15 is a partial front plan view of a solar cell panel according to another embodiment of the present invention.
16 is a partial front plan view of a solar cell panel according to another embodiment of the present invention.
17 is a partial front plan view of a solar cell panel according to another embodiment of the present invention.
18 is a partial front plan view of a solar cell panel according to another embodiment of the present invention.
19 is a partial front plan view of a solar cell panel according to another embodiment of the present invention.
20 is a graph showing the results of measurement of adhesion force while pulling a wiring material attached to a solar cell panel using an experimental apparatus.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, it is needless to say that the present invention is not limited to these embodiments and can be modified into various forms.

In the drawings, the same reference numerals are used for the same or similar parts throughout the specification. In the drawings, the thickness, the width, and the like are enlarged or reduced in order to make the description more clear, and the thickness, width, etc. of the present invention are not limited to those shown in the drawings.

Wherever certain parts of the specification are referred to as "comprising ", the description does not exclude other parts and may include other parts, unless specifically stated otherwise. Also, when a portion of a layer, film, region, plate, or the like is referred to as being "on" another portion, it also includes the case where another portion is located in the middle as well as the other portion. When a portion of a layer, film, region, plate, or the like is referred to as being "directly on" another portion, it means that no other portion is located in the middle.

Hereinafter, a solar cell and a solar cell panel including the solar cell according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a perspective view showing a solar cell panel according to an embodiment of the present invention, and FIG. 2 is a sectional view cut along a line II-II in FIG.

1 and 2, the solar cell panel 100 according to the present embodiment includes a plurality of solar cells 150 and a wiring material 142 for electrically connecting the plurality of solar cells 150. The solar cell panel 100 includes a sealing member 130 that surrounds and seals a plurality of solar cells 150 and a wiring member 142 that connects the solar cells 150 and a front surface 130 that is positioned on the front surface of the solar cell 150 on the sealing member 130. [ And a rear substrate 200 positioned on the rear surface of the solar cell 150 on the sealing material 130. The rear substrate 200 includes a substrate 110, This will be explained in more detail.

First, the solar cell 150 may include a photoelectric conversion unit that converts the solar cell into electric energy, and an electrode that is electrically connected to the photoelectric conversion unit and collects and transfers a current. The plurality of solar cells 150 may be electrically connected in series, parallel, or series-parallel by the wiring member 142. Specifically, the wiring material 142 electrically connects two neighboring solar cells 150 among the plurality of solar cells 150.

The bus ribbons 145 are connected by the wiring members 142 to connect both ends of the wiring material 142 of the solar cell 150 (that is, the solar cell string) forming one row alternately. The bus ribbon 145 may be disposed at an end of the solar cell string and in a direction intersecting the end. These bus ribbons 145 may connect solar cell strings adjacent to each other, or may connect solar cell strings or solar cell strings to a junction box (not shown) that prevents current flow backward. The material, shape, connection structure, etc. of the bus ribbon 145 can be variously modified, and the present invention is not limited thereto.

The sealing material 130 may include a first sealing material 131 positioned on the front surface of the solar cell 150 and a second sealing material 132 positioned on the rear surface of the solar cell 150. The first sealant 131 and the second sealant 132 block water or oxygen which may adversely affect the solar cell 150 and allow the respective elements of the solar cell panel 100 to chemically bond. By a lamination process of applying heat and / or pressure while the rear substrate 200, the second sealing material 132, the solar cell 150, the first sealing material 131, and the front substrate 110 are sequentially positioned, The battery panel 100 can be integrated.

The first sealing material 131 and the second sealing material 132 may be made of ethylene vinyl acetate copolymer resin (EVA), polyvinyl butyral, silicon resin, ester resin, olefin resin, or the like. However, the present invention is not limited thereto. Accordingly, the first and second sealing materials 131 and 132 may be formed by a method other than lamination using various other materials. The first and second sealing materials 131 and 132 are optically transparent so that light incident through the rear substrate 200 or light reflected from the rear substrate 200 can reach the solar cell 150 do.

The front substrate 110 is positioned on the first sealing material 131 to constitute the front surface of the solar cell panel 100. The front substrate 110 may be made of a material having a strength capable of protecting the solar cell 150 from an external impact or the like and a material having optical transparency capable of transmitting light such as sunlight. For example, the front substrate 110 may be formed of a glass substrate or the like. At this time, the front substrate 110 may be formed of a tempered glass substrate so as to improve the strength, or various other materials may be added to improve various other characteristics. Alternatively, the front substrate 110 may be a sheet or a film made of resin or the like. That is, the present invention is not limited to the material of the front substrate 110, and the front substrate 110 may be formed of various materials.

The rear substrate 200 is positioned on the second sealing member 132 and protects the solar cell 150 from the rear surface of the solar cell 150. The rear substrate 200 may function as a waterproof, insulating, and ultraviolet shielding function.

The rear substrate 200 may have a strength to protect the solar cell 150 from an external impact or the like and may have a property of transmitting or reflecting light according to a desired structure of the solar cell panel 100. For example, in the structure in which light is incident through the rear substrate 200, the rear substrate 200 may have a light-transmitting material and the light may be reflected through the rear substrate 200, Non-transmissive material or reflective material. For example, the rear substrate 200 may be formed of a substrate such as glass or a film or a sheet. For example, the rear substrate 200 may be a TPD (Tedlar / PET / Tedlar) type or a polyvinylidene fluoride (PVDF) resin formed on at least one side of a polyethylene terephthalate (PET) . Poly (vinylidene fluoride) is a polymer having a structure of (CH ₂ CF ₂ ) n and has a double fluorine molecular structure, and therefore has excellent mechanical properties, weather resistance, and ultraviolet ray resistance. The present invention is not limited to the material of the rear substrate 200 and the like.

An example of a solar cell included in a solar cell panel according to an embodiment of the present invention will be described in detail with reference to FIG.

3 is a partial cross-sectional view illustrating an example of a solar cell included in the solar cell panel of FIG.

3, a solar cell 150 according to the present embodiment includes a semiconductor substrate 160 including a base region 10, a conductive layer 160 formed on the semiconductor substrate 160 or on the semiconductor substrate 160, Regions 20 and 30, and electrodes 42 and 44 connected to the conductive regions 20 and 30. [ The conductive regions 20 and 30 may include a first conductive type region 20 having a first conductivity type and a second conductive type region 30 having a second conductive type. 44 may include a first electrode 42 connected to the first conductivity type region 20 and a second electrode 44 connected to the second conductivity type region 30. The solar cell 150 may further include a first passivation film 22, an antireflection film 24, a second passivation film 32, and the like. This will be explained in more detail.

The semiconductor substrate 160 may be formed of a crystalline semiconductor. In one example, the semiconductor substrate 160 may be composed of a single crystal or polycrystalline semiconductor (e.g., single crystal or polycrystalline silicon). In particular, the semiconductor substrate 160 may be composed of a single crystal semiconductor (for example, a single crystal semiconductor wafer, more specifically, a single crystal silicon wafer). When the semiconductor substrate 160 is made of a single crystal semiconductor (for example, single crystal silicon), the solar cell 150 is based on the semiconductor substrate 160 formed of a crystalline semiconductor having a high crystallinity . Accordingly, the solar cell 150 can have excellent electrical characteristics.

The front surface and / or the rear surface of the semiconductor substrate 160 may be textured to have irregularities. The irregularities may be, for example, a pyramid shape having an irregular size, whose outer surface is composed of the (111) surface of the semiconductor substrate 160. When the surface roughness of the semiconductor substrate 160 is increased by forming concavities and convexities on the front surface of the semiconductor substrate 160 by such texturing, the reflectance of light incident through the front surface of the semiconductor substrate 160 can be reduced. Accordingly, the amount of light reaching the pn junction formed by the base region 10 and the first conductivity type region 20 can be increased, so that the optical loss can be minimized. However, the present invention is not limited thereto, and it is also possible that the irregularities due to texturing are not formed on the front surface and the rear surface of the semiconductor substrate 160.

The semiconductor substrate 160 may include a base region 10 having a second conductivity type including a second conductivity type dopant at a relatively low doping concentration. For example, the base region 10 may be located farther from the front surface of the semiconductor substrate 160 than the first conductivity type region 20, or closer to the rear surface. And the base region 10 may be closer to the front of the semiconductor substrate 160 than the second conductivity type region 30 and further away from the backside. However, the present invention is not limited thereto, and it goes without saying that the position of the base region 10 can be changed.

Here, the base region 10 may be formed of a crystalline semiconductor containing a second conductive dopant. In one example, the base region 10 may be composed of a single crystal or a polycrystalline semiconductor (for example, single crystal or polycrystalline silicon) including a second conductive type dopant. In particular, the base region 10 may be comprised of a single crystal semiconductor (e.g., a single crystal semiconductor wafer, more specifically a single crystal silicon wafer) comprising a second conductive dopant.

The second conductivity type may be n-type or p-type. When the base region 10 has an n type, the base region 10 is formed of a single crystal or polycrystalline semiconductor doped with a Group 5 element (P), arsenic (As), bismuth (Bi), antimony (Sb) Lt; / RTI > When the base region 10 has a p-type, the base region 10 is formed of a single crystal or polycrystalline semiconductor doped with boron (B), aluminum (Al), gallium (Ga) Lt; / RTI >

However, the present invention is not limited thereto, and the base region 10 and the second conductive dopant may be composed of various materials.

As an example, the base region 10 may be n-type. Then, the first conductivity type region 20 forming the pn junction with the base region 10 has p-type conductivity. When the pn junction is irradiated with light, electrons generated by the photoelectric effect move toward the rear surface of the semiconductor substrate 160 and are collected by the second electrode 44, and the holes move toward the front surface of the semiconductor substrate 160, 1 electrode 42. In this case, Thereby, electric energy is generated. Then, holes having a slower moving speed than electrons may move to the front surface of the semiconductor substrate 160 rather than the rear surface thereof, thereby improving the conversion efficiency. However, the present invention is not limited thereto, and it is also possible that the base region 10 and the second conductivity type region 30 have a p-type and the first conductivity type region 20 has an n-type.

A first conductive type region 20 having a first conductivity type opposite to the base region 10 may be formed on the front side of the semiconductor substrate 160. The first conductive type region 20 forms a pn junction with the base region 10 to form an emitter region for generating carriers by photoelectric conversion.

In this embodiment, the first conductivity type region 20 may be a doped region constituting a part of the semiconductor substrate 160. Accordingly, the first conductive type region 20 may be formed of a crystalline semiconductor including the first conductive type dopant. In one example, the first conductive type region 20 may be composed of a single crystal or a polycrystalline semiconductor (for example, single crystal or polycrystalline silicon) including the first conductive type dopant. In particular, the first conductivity type region 20 may be composed of a single crystal semiconductor (for example, a single crystal semiconductor wafer, more specifically, a single crystal silicon wafer) including a first conductive type dopant. When the first conductive type region 20 is formed as a part of the semiconductor substrate 160, the junction characteristics between the base region 10 and the first conductive type region 20 can be improved.

However, the present invention is not limited thereto, and the first conductive region 20 may be formed separately from the semiconductor substrate 160 on the semiconductor substrate 160. In this case, the first conductivity type region 20 may be formed of a semiconductor layer having a crystal structure different from that of the semiconductor substrate 160 so as to be easily formed on the semiconductor substrate 160. For example, the first conductivity type region 20 may be an amorphous semiconductor, a microcrystalline semiconductor, or a polycrystalline semiconductor (e.g., amorphous silicon, microcrystalline silicon, or polycrystalline silicon) that can be easily fabricated by various methods, And the first conductive type dopant. Various other variations are possible.

The first conductivity type may be p-type or n-type. When the first conductive type region 20 has a p-type, the first conductive type region 20 is doped with boron (B), aluminum (Al), gallium (Ga), indium Single crystal or polycrystalline semiconductor. When the first conductive type region 20 has an n type, the first conductive type region 20 is doped with a Group 5 element such as (P), arsenic (As), bismuth (Bi), antimony (Sb) Single crystal or polycrystalline semiconductor. In one example, the first conductive type region 20 may be a boron-doped single crystal or polycrystalline semiconductor. However, the present invention is not limited thereto, and various materials may be used as the first conductivity type dopant.

In the figure, the first conductivity type region 20 has a homogeneous structure having a uniform doping concentration as a whole. However, the present invention is not limited thereto. Accordingly, in another embodiment, the first conductive type region 20 may have a selective structure, as shown in FIG.

Referring to FIG. 4, the first conductive region 20 having the selective structure includes a first portion 20a formed adjacent to the first electrode 42 to be in contact with the first electrode 20, And a second portion 20b formed in the portion.

The first portion 20a may have a relatively high doping concentration and the second portion 20b may have a lower doping concentration than the first portion 20a and may have a relatively high resistance. The thickness of the first portion 20a can be made larger than that of the first portion 20a. That is, the junction depth of the first portion 20a may be greater than the junction depth of the second portion 20b.

As described above, in this embodiment, a second portion 20b having a relatively high resistance is formed in a portion other than the first electrode 42 on which light is incident, thereby implementing a shallow emitter. Thus, the current density of the solar cell 150 can be improved. In addition, it is possible to reduce the contact resistance with the first electrode 42 by forming a first portion 20a having a relatively low resistance at a portion adjacent to the first electrode 42. [ Thus, the efficiency can be maximized.

As the structure, shape, etc. of the first conductivity type region 20, various structures, shapes, and the like can be applied.

Referring again to FIG. 3, a semiconductor substrate 160 having a second conductivity type, which is the same as the base region 10, and a second conductivity type dopant having a higher doping concentration than the base region 10, A second conductivity type region 30 may be formed. The second conductivity type region 30 forms a back surface field to prevent carriers from being lost by recombination on the surface of the semiconductor substrate 160 (more precisely, the back surface of the semiconductor substrate 160) Thereby constituting a rear electric field area.

In this embodiment, the second conductivity type region 30 may be a doped region constituting a part of the semiconductor substrate 160. Accordingly, the second conductive type region 30 may be formed of a crystalline semiconductor including the second conductive type dopant. As an example, the second conductivity type region 30 may be composed of a single crystal or a polycrystalline semiconductor (for example, single crystal or polycrystalline silicon) including a second conductivity type dopant. In particular, the second conductivity type region 30 may be composed of a single crystal semiconductor (for example, a single crystal semiconductor wafer, more specifically, a single crystal silicon wafer) including a second conductivity type dopant. When the second conductivity type region 30 is formed as a part of the semiconductor substrate 160, the junction characteristics between the base region 10 and the second conductivity type region 30 can be improved.

However, the present invention is not limited thereto, and the second conductive type region 30 may be formed separately from the semiconductor substrate 160 on the semiconductor substrate 160. In this case, the second conductivity type region 30 may be formed of a semiconductor layer having a crystal structure different from that of the semiconductor substrate 160 so that the second conductivity type region 30 can be easily formed on the semiconductor substrate 160. For example, the second conductivity type region 30 may be an amorphous semiconductor, a microcrystalline semiconductor, or a polycrystalline semiconductor (e.g., amorphous silicon, microcrystalline silicon, or polycrystalline silicon) that can be easily fabricated by various methods, And the second conductive type dopant. Various other variations are possible.

The second conductivity type may be n-type or p-type. When the second conductivity type region 30 has an n-type, the second conductivity type region 30 is doped with P, As, bismuth, antimony, or the like, which is a Group 5 element, Single crystal or polycrystalline semiconductor. When the second conductivity type region 30 has a p-type, the second conductivity type region 30 is doped with boron (B), aluminum (Al), gallium (Ga), indium Single crystal or polycrystalline semiconductor. In one example, the second conductivity type region 30 may be a phosphorus-doped single crystal or polycrystalline semiconductor. However, the present invention is not limited thereto, and various materials may be used as the second conductivity type dopant. The second conductive dopant of the second conductive type region 30 may be the same as or different from the second conductive type dopant of the base region 10.

In this embodiment, the second conductivity type region 30 has a homogeneous structure having a uniform doping concentration as a whole. However, the present invention is not limited thereto. Thus, in another embodiment, the second conductivity type region 30 may have a selective structure. The selective structure has a high doping concentration, a large junction depth and a low resistance in the portion of the second conductivity type region 30 adjacent to the second electrode 44, and a low doping concentration, a small junction depth and a high resistance Lt; / RTI > Since the selective structure of the second conductive type region 30 is the same as or similar to the selective structure of the first conductive type region 20 shown in FIG. 4, the selective structure of the first conductive type region 20 ) May be applied to the second conductivity type region 30. [ In yet another embodiment, as shown in FIG. 4, the second conductivity type region 30 may have a local structure.

Referring to FIG. 4, the second conductive type region 30 having a local structure may be formed of a first portion 30a formed locally at a portion where the second conductive type region 30 is connected to the second electrode 44. The second conductive type region 30 is positioned at a portion connected to the second electrode 44 to reduce the contact resistance with the second electrode 44 to maintain excellent fill factor . In addition, in the portion not connected to the second electrode 44, the second conductive type region 30 constituted of the doped region is not formed, thereby reducing the recombination that may occur in the doped region and short-circuit current (Jsc ) And the open-circuit voltage can be improved. In addition, since the internal quantum efficiency (IQE) has a good value at a portion where the second conductivity type region 30 is not formed, the characteristic for long wavelength light is excellent. The second conductivity type region 30 having a local structure can be formed in the same manner as that of the solar cell 150, The efficiency of the solar cell 150 can be improved by keeping both the current density and the open-circuit voltage excellent.

As the structure of the second conductivity type region 30, various other structures may be applied.

Referring again to FIG. 3, a first passivation film 22 and an antireflective film (not shown) are formed on the front surface of the semiconductor substrate 160, more precisely on the first conductive type region 20 formed on or in the semiconductor substrate 160 And the first electrode 42 is electrically connected to the first conductive type region 20 through the first passivation film 22 and the antireflection film 24 (that is, through the opening portion 102) (More specifically, contact).

The first passivation film 22 and the antireflection film 24 may be formed substantially entirely on the entire surface of the semiconductor substrate 160 except for the opening portion 102 corresponding to the first electrode 42. [

The first passivation film 22 is formed in contact with the first conductive type region 20 to passivate defects present in the surface or bulk of the first conductive type region 20. Accordingly, it is possible to increase the open-circuit voltage (Voc) of the solar cell 150 by removing recombination sites of the minority carriers. The antireflection film 24 reduces the reflectance of light incident on the front surface of the semiconductor substrate 160. Accordingly, the amount of light reaching the pn junction formed by the base region 10 and the first conductivity type region 20 can be increased by lowering the reflectance of light incident through the entire surface of the semiconductor substrate 160. Accordingly, the short circuit current Isc of the solar cell 150 can be increased. As described above, the efficiency of the solar cell 150 can be improved by increasing the open-circuit voltage and short-circuit current of the solar cell 150 by the first passivation film 22 and the anti-reflection film 24.

The first passivation film 22 may be formed of various materials. For example, the passivation film 22 may be a single film selected from the group consisting of a silicon nitride film, a silicon nitride film including hydrogen, a silicon oxide film, a silicon oxynitride film, an aluminum oxide film, MgF ₂ , ZnS, TiO ₂ and CeO ₂ And may have a multi-layered film structure in which two or more films are combined. For example, the first passivation film 22 may include a silicon oxide film having a fixed positive charge, a silicon nitride film, or the like when the first conductivity type region 20 has an n-type, and the first passivation film 20 ) Has a p-type, it may include an aluminum oxide film having a fixed negative charge.

The anti-radiation film 24 may be formed of various materials. For example, the antireflection film 24 may be a single film selected from the group consisting of a silicon nitride film, a silicon nitride film including hydrogen, a silicon oxide film, a silicon oxynitride film, an aluminum oxide film, MgF ₂ , ZnS, TiO _2, and CeO ₂ , Layer structure having a combination of at least two layers. In one example, the antireflective film 24 may comprise silicon nitride.

However, the present invention is not limited thereto, and it goes without saying that the first passivation film 22 and the anti-reflection film 24 may include various materials. It is also possible that any one of the first passivation film 22 and the antireflection film 24 performs an antireflection role and a passivation function so that the other is not provided. Alternatively, various films other than the first passivation film 22 and the antireflection film 24 may be formed on the semiconductor substrate 160. Other variations are possible.

The first electrode 42 is electrically connected to the first passivation film 22 through the opening 102 formed in the first passivation film 22 and the antireflection film 24 (that is, through the first passivation film 22 and the antireflection film 24) And is electrically connected to the conductive type region 20. The first electrode 42 may be made of a material having a high electrical conductivity (e.g., metal). The first electrode 42 may be formed with a pattern that allows light to pass therethrough. The specific shape will be described later with reference to FIG.

The second passivation film 32 is formed on the rear surface of the semiconductor substrate 160 more precisely on the second conductive type region 30 formed on the semiconductor substrate 160 and the second electrode 44 is formed on the second passivation film 30, (E.g., in contact) with the second conductivity type region 30 through the first conductive type region 32 (i.e., through the opening 104).

The second passivation film 32 may be formed substantially entirely on the rear surface of the semiconductor substrate 160 except for the opening 104 corresponding to the second electrode 44. [

The second passivation film 32 is formed in contact with the second conductive type region 30 to passivate defects present in the surface or bulk of the second conductive type region 30. Accordingly, it is possible to increase the open-circuit voltage (Voc) of the solar cell 150 by removing recombination sites of the minority carriers.

The second passivation film 32 may be formed of various materials. For example, the second passivation film 32 may be formed of any one selected from the group consisting of a silicon nitride film, a silicon nitride film including hydrogen, a silicon oxide film, a silicon oxynitride film, an aluminum oxide film, MgF ₂ , ZnS, TiO _2, and CeO ₂ Or may have a multilayered film structure in which two or more films are combined. For example, the second passivation film 32 may include a silicon oxide film, a silicon nitride film, or the like having a fixed positive charge when the second conductive type region 30 has an n-type, and the second conductive type region 30 ) Has a p-type, it may include an aluminum oxide film having a fixed negative charge.

However, the present invention is not limited thereto, and it goes without saying that the second passivation film 32 may include various materials. Alternatively, various films other than the second passivation film 32 may be formed on the rear surface of the semiconductor substrate 160. Other variations are possible.

The second electrode 44 is electrically connected to the second conductivity type region 30 through the opening 104 formed in the second passivation film 32. The second electrode 44 may be formed of a material having excellent electrical conductivity (e.g., metal). The second electrode 44 may be formed with a pattern that allows light to pass therethrough. The specific shape will be described later.

As described above, in this embodiment, the first and second electrodes 42 and 44 of the solar cell 150 have a predetermined pattern, so that the solar cell 150 can receive light from the front and back surfaces of the semiconductor substrate 160 It has a bi-facial structure. Accordingly, the amount of light used in the solar cell 150 can be increased to contribute to the efficiency improvement of the solar cell 150.

However, the present invention is not limited thereto, and it is also possible that the second electrode 44 is formed entirely on the rear side of the semiconductor substrate 160. It is also possible that the first and second conductivity type regions 20 and 30 and the first and second electrodes 42 and 44 are located on one side (for example, the rear side) of the semiconductor substrate 160, It is also possible that at least one of the first and second conductivity type regions 20 and 30 is formed over both sides of the semiconductor substrate 160. That is, the solar cell 150 described above is merely an example, and the present invention is not limited thereto.

The solar cell 150 described above is electrically connected to the neighboring solar cell 150 by the wiring material 142, which will be described in more detail with reference to FIG. 5 together with FIG. 1 and FIG.

5 is a perspective view schematically showing a first solar cell 151 and a second solar cell 152 connected by a wiring material 142 in the solar cell panel 100 of FIG. In FIG. 5, the solar cell 150 is schematically illustrated with a semiconductor substrate 160 and electrodes 42 and 44. 6 is a perspective view and a cross-sectional view showing a wiring material 142 before being attached to the electrodes 42 and 44 of the solar cell 150 shown in FIG. 1, and FIG. 7 is a sectional view of the solar cell 150 shown in FIG. Sectional view showing a wiring member 142 attached to a pad portion (reference numeral 422 in Fig. 9) of the electrodes 42 and 44 of Fig. And Fig. 8 is a schematic cross-sectional view of part A of Fig. Only the pad portion 422 and the wiring material 142 are shown in FIG. 7 for the sake of simplicity and explanation. 8, the wiring member 142 connecting the first solar cell 151 and the second solar cell 152 is mainly shown.

5, two adjacent solar cells 150 (for example, first solar cell 151 and second solar cell 152) among the plurality of solar cells 150 are connected to wiring materials 142 ). The wiring member 142 is electrically connected to the first electrode 42 positioned on the front surface of the first solar cell 151 and the second solar cell 152 positioned on one side The second electrode 44 located on the rear side of the second electrode 44 is connected. And the other wiring material 1420a is electrically connected to the second electrode 44 located on the rear surface of the first solar cell 151 and the other electrode on the other side of the first solar cell 151 The first electrode 42 is connected. Another wiring material 1420b is disposed between the first electrode 42 located on the front surface of the second solar cell 152 and the rear surface of another solar cell positioned on one side The second electrode 44 is connected to the second electrode 44. Accordingly, the plurality of solar cells 150 can be connected to each other by the wiring materials 142, 1420a, and 1420b. Hereinafter, the description of the wiring material 142 can be applied to all the wiring materials 142 connecting the two neighboring solar cells 150.

In this embodiment, the wiring material 142 is connected to the first electrode 42 (more specifically, the bus bar line 42b of the first electrode 42) on the front surface of the first solar cell 151, A first portion 1421 extending from the first edge 161 toward the second edge 162 opposite thereto and a second portion 1421 extending from the rear surface of the second solar cell 152 toward the second edge 162 A second portion 1422 extending from the first edge 161 to the opposite second edge 162 in a state of being connected to the bus bar line 44b of the second electrode 44, And a third portion 1423 extending from the front surface of the second edge 162 of the second solar cell 152 to the rear surface of the second solar cell 152 and connecting the first portion 1421 and the second portion 1422 have. As a result, after the wiring member 142 traverses the first solar cell 151 in a partial area of the first solar cell 151, the second solar cell 152 traverses the second solar cell 152 in a partial area of the second solar cell 152 Can be located. As described above, the wiring member 142 has a smaller width than that of the first and second solar cells 151 and 152, and a part (for example, the bus bar electrode 42b) of the first and second solar cells 151 and 152, The first and second solar cells 151 and 152 can be effectively connected even by a small area.

The wiring member 142 may be arranged to extend along the bus bar line 42b while contacting the bus bar line 42b on the bus bar line 42b at the first and second electrodes 42 and 44 have. Thus, the wiring material 142 and the first and second electrodes 42 and 44 are continuously contacted with each other, thereby improving electrical connection characteristics. However, the present invention is not limited thereto. It is also possible that the bus bar line 42b is not provided and in this case the wiring material 142 contacts the plurality of finger electrodes 42a across the plurality of finger lines 42a in the direction crossing the finger lines 42a And to be connected. However, the present invention is not limited thereto.

A plurality of wiring materials 142 may be provided on the basis of one surface of each solar cell 150 to improve the electrical connection characteristics of the neighboring solar cells 150. Particularly, in this embodiment, the wiring material 142 is composed of a wire having a width smaller than that of a ribbon having a relatively wide width (for example, 1 mm to 2 mm) (For example, 2 to 5) of the number of the conventional ribbons 142 are used.

In this embodiment, the wiring material 142 may include a coating layer 142b coated with a thin thickness on the surface of the core layer 142a, including the core layer 142a, as shown in Fig. The core layer 142a is composed of a wire or the like having an excellent electrical conductivity and substantially carries the current and the coating layer 142b is formed of a variety of materials such as a material for protecting the core layer 142a, Can play a role. For example, the coating layer 142b may include a solder material, and may be melted by heat to adhere the wiring material 142 to the electrodes 42 and 44 easily. Then, the wiring material 142 is easily attached to the electrodes 42 and 44 by soldering by placing the wiring material 142 on the electrodes 42 and 44 without using any adhesive agent, . This makes it possible to simplify the tabbing process.

At this time, the tableting process may be performed by applying a flux to the wiring material 142, placing the flux-coated wiring material 142 on the electrodes 42 and 44, and then applying heat. The flux is intended to prevent the formation of an oxide film which interferes with soldering and is not necessarily used.

The core layer 142a may be formed of a material (e.g., a metal, more specifically, Ni, Cu, Ag, Al) having a good electrical conductivity as a main material (for example, a material containing 50 wt% or more, SnBi, SnPb, SnPbAg, SnCuAg, SnCU, or the like as a main material, if the coating layer 142b includes a solder material, However, the present invention is not limited thereto, and the core layer 142a and the coating layer 142b may include various materials.

As another example, the wiring material 142 may be attached to the electrodes 42 and 44 using a separate conductive adhesive. In this case, the wiring material 142 may or may not include the coating layer 142b. As a conductive adhesive, conductive particles such as Ni, Al, Ag, Cu, Pb, Sn, SnIn, SnBi, SnP, SnPbAg, SnCuAg, and SnCu are contained in an epoxy synthetic resin or a silicone- , And may be a substance that exists in the form of a liquid phase and is thermally cured when heat is applied. When such a conductive adhesive is used, a conductive adhesive is placed on the electrodes 42 and 44, heat is applied after positioning the wiring 142, or a conductive adhesive is applied or placed on the surface of the wiring 142 The wiring member 142 can be attached to the electrodes 42 and 44 by placing the electrodes 42 and 44 thereon and applying heat thereto.

As described above, when a wire having a width smaller than that of the conventional ribbon is used as the wiring material 142, the material cost can be greatly reduced. Since the width of the wiring member 142 is smaller than that of the ribbons, a sufficient number of the wiring members 142 can be provided to minimize the movement distance of the carriers, thereby improving the output of the solar cell panel 100.

In addition, the wire constituting the wiring material 142 according to the present embodiment may have a round, oval, or curved cross section or a rounded cross section to induce reflection or diffuse reflection. The light reflected on the rounded surface of the wire constituting the wiring member 142 is reflected or totally reflected on the front substrate 110 or the rear substrate 200 located on the front or rear surface of the solar cell 150, ). ≪ / RTI > Thus, the output of the solar cell panel 100 can be effectively improved. However, the present invention is not limited thereto. Therefore, the wire constituting the wiring member 142 may have a polygonal shape such as a quadrangle, or may have various other shapes.

In this embodiment, the width W1 of the wiring material 142 may be 250 탆 to 500 탆. The current generated in the solar cell 150 by the wire-shaped wiring material 142 having such a width is efficiently supplied to the external circuit (for example, a bypass diode of a bus ribbon or a junction box) or another solar cell 150 . In this embodiment, the wiring material 142 can be individually positioned and fixed on the electrodes 42 and 44 of the solar cell 150 without being inserted into a separate layer, film, or the like. Accordingly, if the width W1 of the wiring material 142 is less than 250 mu m, the strength of the wiring material 142 may be insufficient, the connecting area of the electrodes 42 and 44 is too small, . If the width W1 of the wiring material 142 exceeds 500 mu m, the cost of the wiring material 142 increases and the wiring material 142 hinders the incidence of light incident on the front surface of the solar cell 150, Can be increased. The force exerted in the direction in which the wiring member 142 is spaced apart from the electrodes 42 and 44 becomes large so that the adhesion between the wiring member 142 and the electrodes 42 and 44 may be low and the electrodes 42 and 44, It is possible to cause a problem such as cracks in the resin layer 160. In one example, the width W1 of the wiring material 142 may be in the range of 350 to 450um (in particular, 350um to 400um). The output can be improved while increasing the adhesion with the electrodes 42 and 44 in this range.

Here, the thickness T2 of the coating layer 142b in the wiring material 142 before the tableting process is smaller than 10% of the width of the core layer 142a (for example, 20um or less, for example, 7um to 20um) to be. At this time, if the thickness of the coating layer 142b is less than 7 탆, the tableting process may not be performed smoothly. If the thickness of the coating layer 142b exceeds 20 mu m, the material cost increases and the width of the core layer 142a becomes small, so that the strength of the wiring material 142 may be lowered. 7, after the wiring material 142 is attached to the solar cell 150 by the tableting process, the coating layer 142b flows down so that the wiring 142 and the solar cell 150 Is located thicker between the wiring member 142 and the pad portions 422 of the electrodes 42 and 44 and thinner on the other surface of the core layer 142a. The portion located between the wiring material 142 and the solar cell 150 may have a width W7 equal to or larger than the diameter of the core layer 142a of the wiring material 142. [ The thickness T1 of the coating layer 142b between the wiring material 142 and the pad portions 422 of the electrodes 42 and 44 may be in the range of 11 to 21 um and the surface of the other portion of the core layer 142a The thickness T2 of the coating layer 142b may have a very thin thickness of 2 탆 or less (for example, 0.5 탆 to 1.5 탆). The width W1 of the wiring material 142 in this specification means the width of the core layer 142a on the surface perpendicular to the thickness direction of the solar cell 150 passing through the center of the wiring material 142 or It can mean diameter. At this time, since the coating layer 142b has a very small thickness at the center of the core layer 142a, the coating layer 142b does not have much significance to the width of the wiring material 142, W1 may mean the sum or diameter of the widths of the core layer 142a and the coating layer 142b on the surface perpendicular to the thickness direction of the solar cell 150 passing through the center of the core layer 142a.

By providing the wire-shaped wiring material 142 in this manner, the effect of improving the output can be exhibited. In this embodiment, since the neighboring solar cells 150 are electrically connected to each other by using the wiring material 142 having a thinner width than the conventional one, the adhesion area between the wiring material 142 and the electrodes 42 and 44 is small It may not be enough. Furthermore, if the wiring member 142 has a rounded cross section having a circular shape, an elliptical shape, or a curved line, the attachment area with respect to the electrodes 42 and 44 becomes smaller, so that the adhesion force with the electrodes 42 and 44 may not be high. In addition, if the wiring member 142 has a rounded cross section having a circular shape, an elliptical shape, or a curved line, the thickness of the wiring material 142 becomes relatively large, so that the solar cell 150 or the semiconductor substrate 160 can be made more easily.

Particularly, between the first solar cell 151 and the second solar cell 152, the wiring material 142 must be connected from the front surface of the first solar cell 151 to the rear surface of the second solar cell 152, In this portion, the wiring material 142 can be wound. 8, the first portion 1421 of the wiring material 142 is kept attached (for example, in contact with) on the first electrode 42 of the first solar cell 151 The second portion 1422 of the wiring material 142 is kept attached (for example, in contact) on the second electrode 44 of the second solar cell 152. The third portion 1423 of the wiring member 142 should be connected such that the first portion 1421 and the second portion 1422 described above are not bent. The third portion 1423 has a portion 1423a bent to have a convex arc shape toward the front side so as to have a certain distance from the first solar cell 151 in the vicinity of the edge of the first solar cell 151, And a portion 1423b connected to the portion 1423a at an inflection point and bent to have a convex arc shape toward the rear so as to have a certain distance from the second solar cell 152 near the edge of the second solar cell 152 can do.

The curved portions 1423a and 1423b of the third portion 1423 are connected to the connecting portion with the first portion 1421 or the second portion 1422 (The edge portion of the solar cell 152) toward a direction away from the first or second solar cell 151, 152. As a result, the wiring member 142 receives a force in a direction away from the electrodes 42 and 44 at the edge of the solar cell 150.

The boundary between the first portion 1421 and the third portion 1423 or the boundary between the second portion 1422 and the third portion 1423 (i.e., the wiring material 142 and the electrodes 42 and 44 are finally connected The closer to the edge of the solar cell 150 the smaller the radius of curvature of the arc. The force of the wiring member 142 adjacent to the edge of the solar cell 150 in the direction away from the solar cell 150 becomes large and the adhesion between the wiring member 142 and the electrodes 42 and 44 may be reduced . Accordingly, when the wire-like wiring material 142 is provided as in the present embodiment, the portion of the electrodes 42 and 44 adjacent to the edge of the solar cell 150 and to which the wiring material 142 is connected 142 must be spaced apart from the edge of the solar cell 150 by a predetermined distance or more so that the wiring member 142 and the electrode 42 , 44) can be attached.

In consideration of this, electrodes 42 and 44 of the solar cell 150 are formed in this embodiment, which will be described in detail with reference to FIG. Hereinafter, the second electrode 44 will be described in detail with reference to the first electrode 42 with reference to FIG.

FIG. 9 is a plan view showing a solar cell included in the solar cell panel of FIG. 1 and a ribbon connected to the solar cell.

Referring to FIG. 9, in this embodiment, the solar cell 150 (or the semiconductor substrate 160) can be partitioned into the electrode region EA and the edge region PA. At this time, the solar cell 150 (or the semiconductor substrate 160) may include, for example, first and second edges 161 and 162 parallel to the finger line 42a, First, second, third, and fourth edges 163, 164 intersecting at right angles. The third and fourth edges 163 and 164 each have a central portion 163a and 164a that is substantially orthogonal to the first and second edges 161 and 162 and occupies most of the third or fourth edges 163 and 164, And inclined portions 163b and 163b connected to the first and second edges 161 and 162 in an inclined manner at the central portions 163a and 164a, respectively. Thus, for example, the solar cell 150 may have a roughly octagonal shape in plan view. However, the present invention is not limited thereto, and the planar shape of the solar cell 150 may have various shapes.

In the present embodiment, the electrode area EA may be a region in which the finger lines 42a formed in parallel to each other are arranged at a uniform pitch P. [ The electrode region EA may include a plurality of electrode regions EA defined by the wiring member 142. [ The edge region PA includes between the adjacent two electrode regions EA and extends in the longitudinal direction of the semiconductor substrate 160 or the edge of the solar cell 150 (that is, the wiring member 142 or the bus bar line 42b) (For example, an edge intersecting with the edge or wiring material 142 or the bus bar line 42b). At this time, the edge region PA is a region where the electrode portions 424a and 424b are located at a density lower than the density of the finger line 42a of the electrode region EA, or a region where the electrode portions 424a and 424b are not located .

In the present embodiment, the electrode area EA may have a plurality of electrode areas EA defined by the bus bar line 42b or the wiring material 142. More specifically, the electrode area EA includes a first electrode area EA1 located between two neighboring bus bar lines 42b or the wiring material 142, and a second electrode area EA1 between the wiring material 142 and the third And two second electrode regions EA2 positioned between the first and second edges 163 and 164, respectively. Since the number of the first electrode regions EA1 is plural (that is, the number of the wiring members 142) One less number).

At this time, the width W2 of the first electrode area EA1 may be smaller than the width W3 of the second electrode area EA2. In this embodiment, a large number of wiring materials 142 or bus bar lines 42b are provided. Therefore, if the width W3 of the second electrode area EA2 is relatively large, the inclined parts 163b and 164b of the third or fourth edges 163 and 164 may be positioned in the second electrode area EA2 Whereby the bus bar line 42b or the wiring material 142 may not be located at the third or fourth edges 163 and 164. However, the present invention is not limited thereto, and the width W2 of the first electrode area EA1 and the width W3 of the second electrode area EA may have various values.

The edge region PA corresponds to a portion where the wiring material 142 is located and includes a first edge region PA1 located at a portion where the finger line 42a is not formed between the finger lines 42a, A second edge spaced apart from the first to fourth edges 161, 162, 163, 164 of the semiconductor substrate 160 by a certain distance from the outermost finger line 42a to a portion other than the first edge region PA1, Area PA2. The first edge region PA1 may be located at a portion adjacent to the edge of the solar cell 150 at a portion where the wiring material 142 is located. The first edge region PA1 is an area formed to separate the first pad portion 422a from the edge of the solar cell 150 so that the wiring material 142 can be attached to the first electrode 42 with sufficient bonding force.

At this time, the edge region PA is formed between the adjacent two electrode regions EA, one edge region (the edge region PA) located at one end of the bus bar line 42b adjacent to the first edge 161 of the semiconductor substrate 160 And the other edge region PA4 located at the other end of the bus bar line 42b adjacent to the second edge 162 of the semiconductor substrate 160. [ More specifically, once the edge area PA3 is formed, each first edge area PA1 adjacent to the first edge 161 and a part of the corresponding second edge area PA2 (i.e., (I.e., a portion located between the first edge region PA and the first edge 161 in the second region PA2). And the other end edge area PA4 is connected to each of the first edge areas PA1 adjacent to the second edge 162 and a part of the corresponding second edge area PA2 A portion located between the first edge region PA and the second edge 162).

Here, the edge region PA3 may be a region located adjacent to the first gate electrode 161 of the semiconductor substrate 160 and an end portion of the wiring material 142 may be located. The wiring member 142 may extend to another solar cell 150 or an external circuit through the other edge region PA4 and the second edge 162 of the semiconductor substrate 160. [ It should be noted that the terms "once" and "other end" in the specification are used for the purpose of distinction, and the present invention is not limited thereto.

The first electrode 42 may include a plurality of finger lines 42a spaced apart from each other with a constant width W5 and pitch P in the electrode area EA. Although the finger lines 42a are parallel to the main edges of the solar cell 150 (particularly, the first and second edges 161 and 162) in the first direction, But is not limited thereto. At this time, the plurality of finger lines 42a are connected to the outermost finger lines 421a, 422a (which are closest to the edges of the semiconductor substrate 160 (more specifically, the first and second edges 161, 162) ). As used herein, the outermost finger line includes a continuous single finger line or a plurality of discrete finger lines that is the shortest distance from the first edge 161 or the second edge 162 in the second direction. In this specification, the semiconductor device includes an outermost finger line 421a adjacent to the first edge 161 of the semiconductor substrate, and includes one end of the line portion 421 formed in parallel in the first direction or one end of the line portion 421 A plurality of finger lines 42a between the pad portion 442 formed at the end portion and the first edge 161 are set as the first finger lines and the outermost finger lines adjacent to the second edge 162 of the semiconductor substrate A plurality of fingers 422a between the pad portion 442 and the second edge 162 formed at the other end of the line portion 421 formed in parallel in the first direction or the other end of the line portion 421, The plurality of finger lines 42a formed as a third finger line and formed in parallel in the first direction in a region corresponding to the center region of the semiconductor substrate, specifically, the length portion of the line portion, is referred to as a second finger line.

In one example, the finger line 42a of the first electrode 42 may have a width W5 of 35 um to 120 um. The finger line 42a of the first electrode 42 may have a pitch P of 1.2 mm to 2.8 mm and the number of the finger lines 42a in the direction crossing the finger line 42a may be 55 to 130. This width W5 and pitch P can be formed by easy process conditions and are limited to effectively collect the current generated by the photoelectric conversion while minimizing shading loss due to the finger line 42a. And the finger line 42a may have a thickness of 5 [mu] m to 50 [mu] m. The thickness of this finger line 42a may be in a range that can easily be formed in the process and have a desired specific resistance. However, the present invention is not limited thereto, and the width, pitch, thickness, etc. of the finger line 42a may be variously changed according to changes in process conditions, the size of the solar cell 150, have.

At this time, the width W1 of the wiring material 142 may be smaller than the pitch P of the finger lines 42a, and may be larger than the width of the finger lines 42a. However, the present invention is not limited thereto and various modifications are possible.

The first electrode 42 may include a bus bar line 42b formed at least in a second direction intersecting the finger lines 42a in the electrode area EA to connect the finger line 42a . In this embodiment, the bus bar line 42b further includes electrode portions 424a and 424b located in the first edge region PA1 and overlapping the wiring member 142. [

In one example, the bus bar line 42b may be formed continuously from the portion adjacent to the first edge 161 to the portion adjacent to the second edge 162 in the electrode region EA. As described above, the bus bar line 42b may be positioned so as to correspond to the portion where the wiring material 142 for connection with the neighboring solar cell 150 is located. These bus bar lines 42b may be provided so as to correspond one-to-one to the wiring members 142. [ Accordingly, in this embodiment, the bus bar lines 42b may be provided in the same number as that of the wiring material 142 with reference to one surface of the solar cell 150. [ In this embodiment, the bus bar line 42b is formed in a direction adjacent to the wiring material 142 and orthogonal to or inclined with respect to the finger line 42a. The bus bar line 42b includes electrode parts connected to, It can mean.

The bus bar line 42b includes a line portion 421 having a relatively narrow width along the direction in which the wiring member 142 is connected in the electrode region EA and a line portion 421 extending in the same direction as the line portion 421 And a pad portion 422 connected to the second finger line and wider than the line portion 421 to increase a connection area with the wiring member 142. [ It is possible to minimize the area for blocking the light incident on the solar cell 150 by the narrow width line portion 421 and to reduce the width of the wiring member 142 and the bus bar line 42b by the wide width pad portion 422. [ The adhesion force can be improved and the contact resistance can be reduced. The pad portion 422 has a width larger than that of the line portion 421 and is a region to which the wiring material 142 is substantially attached. The wiring member 142 may be attached to the line portion 421 or may be in a state where the wiring member 142 is placed on the line portion 421 without the wiring member 142 being attached to the line portion 421. [

The pad portion 422 is formed on the end portion of the line portion 421 in the electrode region EA (that is, the portion where the first electrode 42 and the wiring portion 142 are connected or the edge regions PA3 and PA4, And a second pad portion 422b located in an inner region of the bus bar line 42b except for the first pad portion 422a. The first pad portion 422a is located at the end of the bus bar line 42b . Further, the first and second edges 161 and 162 of the semiconductor substrate are spaced apart from each other at the first or second edge 161 and 162 of the semiconductor substrate, respectively, than the shortest distance to the outermost finger line of the finger line 42a adjacent to the first or second edge 161 and 162, The shortest distance to one pad portion 422a may be longer. The inner end of the one or the other end edge regions PA3 and PA4 may be a portion of the one or the other end edge region farthest from the first edge 161 or the second edge 162 respectively. In addition, the finger lines 42 may not be formed in the region where the wiring material 142 passes between the first or second edges 161 and 162 of the semiconductor substrate and the first pad portion 422a. A force may be applied to the wiring member 142 in a direction away from the first electrode 42 (in a direction away from the semiconductor substrate 160) at the end of the line portion 421 or the first pad portion 422a have. Accordingly, the area of the first pad portion 422a in the corresponding region is made larger than that of the second pad portion 422a, so that the wiring member 142 and the first electrode 42 can have strong adhesion. At this time, even if the width of the first pad portion 422a is larger than the width of the second pad portion 422b, it is difficult to contribute greatly to improving the adhesion with the wiring material 142. Therefore, the length of the first pad portion 422a (The length measured in the longitudinal direction of the wiring material 142) L1 can be made larger than the length of the second pad portion 422b (the length measured in the longitudinal direction of the wiring material 142) L2.

The width of the pad portion 422 (more specifically, the width of each of the first pad portion 422a and the second pad portion 422b) is greater than the width of the line portion 421, the rim portion 423 and the electrode portions 424a and 424b ), And the finger line 42a. The pitch of the bus bar line 42b may be larger than the pitch of the finger line 42a.

The line portion 421 of the bus bar line 42b is provided so as to correspond to the wiring material 142 in this embodiment. More specifically, a bus bar electrode having a width much larger than that of the finger line 42a is disposed corresponding to the wiring member 142. In this embodiment, the width of the bus bar line 42b The line portion 421 is located. In this embodiment, the line unit 421 may connect a plurality of finger lines 42a to provide a path through which the carrier can bypass when some finger lines 42a are disconnected.

Herein, the bus bar electrode refers to an electrode portion formed in a direction crossing the finger line to correspond to the ribbon and having a width of 12 times or more (usually 15 times or more) the width of the finger line. Since the bus bar electrode has a relatively large width, it is usually formed by two or three electrodes. The line portion 421 of the bus bar line 42b in this embodiment is formed in a direction intersecting with the finger line 42a so as to correspond to the wiring material 142, Electrode portion having a width can be referred to.

For example, the width W4 of the line portion 421 may be 0.5 to 10 times the width W5 of the finger line 42a. In this specification, the width W4 of the line portion 421 may be equal to the first width W4. If the ratio is less than 0.5 times, the width of the line portion 421 is reduced and the effect of the line portion 421 may not be sufficient. If the ratio exceeds 10 times, the width of the line portion 421 becomes large, and the light loss can be increased. In particular, since the wiring member 142 is provided in a large number in this embodiment, the number of the line portions 421 is also increased, and the optical loss can be further increased. More specifically, the width W4 of the line portion 421 may be 0.5 to 7 times the width W5 of the finger line 42a. The above ratio can be reduced to 7 times or less to further reduce the optical loss. For example, referring to the optical loss, the width W4 of the line portion 421 may be 0.5 to 4 times the width W5 of the finger line 42a. More specifically, the width W4 of the line portion 421 may be 0.5 to 2 times the width W5 of the finger line 42a. In this range, the efficiency of the solar cell 150 can be greatly improved.

Alternatively, the width W4 of the line portion 42b may be equal to or smaller than the width W1 of the wiring material 142. [ The width W4 of the line portion 42b is smaller than the width W4 of the wiring portion 142b in the width direction of the wiring member 142. In the case where the wiring member 142 has a circular, And the width W1 of the recess 142 can be made smaller or smaller than the width W1. By reducing the width W4 of the line portion 42b as described above, it is possible to reduce the area of the first electrode 42, thereby reducing the material cost of the first electrode 42. [

For example, the ratio of the width W1 of the wiring member 142 to the width W4 of the line portion 42b may be 1: 0.07 to 1: 1. If the ratio is less than 1: 0.07, the width of the line portion 42b is too small and the electrical characteristics and the like may be lowered. If the ratio is more than 1: 1, the contact property with the line part 42b is not greatly improved, but only the area of the first electrode 42 is increased, thereby increasing the optical loss and increasing the material cost. For example, in consideration of optical loss, material cost, etc., the ratio may be 1: 0.1 to 1: 0.5 (more specifically, 1: 0.1 to 1: 0.3).

Alternatively, the width W4 of the line portion 421 may be between 35 [mu] m and 350 [mu] m. If the width W4 of the line portion 421 is less than 35 mu m, the width of the line portion 42b may be too small to reduce the electrical characteristics and the like. When the width W4 of the line portion 421 exceeds 350 mu m, the contact property with the line portion 42b is not greatly improved, and only the area of the first electrode 42 is increased to increase the light loss, there is a problem. For example, considering the light loss, material cost, etc., the width W4 of the line portion 421 may be in the range of 35 袖 m to 200 袖 m (more specifically, 35 袖 m to 120 袖 m).

However, the present invention is not limited thereto. Accordingly, the width W4 of the line portion 421 can be variously modified within a range that minimizes the shading loss while effectively transmitting the current generated by the photoelectric conversion.

The width W6 of the pad portion 422 is larger than the width W4 of the line portion 421 and may be equal to or larger than the width W1 of the wiring member 142. [ In this specification, the width W6 of the pad portion 422 may be equal to the second width W2. The pad portion 422 is a portion for increasing the contact area with the wiring material 142 to improve the adhesion with the wiring material 142. The width of the pad portion 422 is set to be larger than that of the line portion 421, will be.

For example, the ratio of the width W1 of the wiring member 142 to the width W6 of the pad portion 422 may be 1: 1 to 1: 5. If the ratio is less than 1: 1, the width W6 of the pad portion 422 is not sufficient and the adhesion force between the pad portion 422 and the wiring material 142 may not be sufficient. If the ratio is more than 1: 5, an area where light is lost by the pad portion 422 is increased, and the shading loss may be large. The ratio may be 1: 2 to 1: 4 (more specifically, 1: 2.5 to 1: 4).

Or, for example, the width W6 of the pad portion 422 may be 0.25 mm to 2.5 mm. If the width W6 of the pad portion 422 is less than 0.25 mm, the contact area between the pad portion 422 and the wiring member 142 may be insufficient because the contact area with the wiring member 142 is insufficient. If the width W6 of the pad portion 422 exceeds 2.5 mm, the area where light is lost by the pad portion 422 is increased and the shading loss may be large. For example, the width W6 of the pad portion 422 may be 0.8 mm to 1.5 mm.

The lengths L1 and L2 of the pad portion 422 may be greater than the width of the finger line 42a. For example, the lengths L1 and L2 of the pad portion 422 may be 0.035 mm to 30 mm. If the lengths L1 and L2 of the pad portion 422 are less than 0.035 mm, the contact area with the wiring material 142 is not sufficient and the adhesion between the pad portion 422 and the wiring material 142 may not be sufficient. If the length of the pad portion 422 exceeds 30 mm, the area where light is lost by the pad portion 422 is increased and the shading loss may be large.

At this time, the length L1 of the first pad portion 422a to which a larger force is applied may be larger than the length L2 of the second pad portion 422b. More specifically, the length L1 of the first pad portion 422a may be 0.4 mm to 30 mm and the length L1 of the first pad portion 422a may be 0.4 mm to 3.2 mm Lt; / RTI > The length L2 of the second pad portion 422b may be 0.035 mm to 1 mm, more specifically 0.4 mm to 1 mm. As a result, the adhesive force by the first pad portion 422a, which applies a large force, can be further improved, and the area of the second pad portion 422b can be reduced, thereby reducing optical loss and material cost.

Or, for example, the ratio of the width W5 of the finger line 42a to the length L1, L2 of the pad portion 422 may be 1: 1.1 to 1:20. In this range, the adhesion area between the pad portion 422 and the wiring material 142 can be increased, and the adhesion between the pad portion 422a and the wiring material 142 can be improved.

Alternatively, for example, the ratio of the width W1 of the wiring member 142 to the length L1, L2 of the pad portion 422 may be 1: 1 to 1:10. If the ratio is less than 1: 1, the lengths (L1, L2) of the pad portion 422 are not sufficient and the adhesion force between the pad portion 422 and the wiring material 142 may not be sufficient. If the ratio exceeds 1:10, the area where light is lost by the pad portion 422 increases and the shading loss may be large. Considering the adhesion, light loss and the like, the ratio may be 1: 3 to 1: 6.

In one bus bar line 42b, the pad portions 422 may be arranged in a number of 6 to 24 (for example, 12 to 22). The plurality of pad portions 422 may be spaced apart. For example, one finger may be placed for each of two to ten finger lines 42a. According to this, the portion where the area of the bonding of the bus bar line 42b and the wiring material 142 increases is regularly provided, so that the adhesion force between the bus bar line 42b and the wiring material 142 can be improved. Alternatively, a plurality of pad portions 422 may be disposed such that distances between the two pad portions 422 are different from each other. In particular, the pad portion 422 can be arranged at a high density at the end of the bus bar line 42b where a larger force is applied than the other portion (i.e., the central portion of the bus bar line 42b). Various other variations are possible.

7, in order to adhere the coating layer 142b (the wiring material 142 and the pad portion 422) to a portion of the wiring material 142 adjacent to the pad portion 422, The width W7 of the adhesive layer located between the pad portions 422, for example, where the solder layer is located) may be from 1: 1 to 1: 3.33. However, the present invention is not limited thereto, and the ratio may have various values.

The width W6 of the pad portion 422 may be equal to or larger than the width W7 of the coating layer 142b in the portion adjacent to the pad portion 422. [ For example, the ratio of the width W7 of the coating layer 142b to the width W6 of the pad portion 422 in the portion adjacent to the pad portion 422 may be 1: 1 to 1: 4.5. If the ratio is less than 1: 1, the adhesion property between the wiring material 142 and the pad portion 422 may not be excellent. If the ratio is more than 1: 4.5, the area of the pad portion 422 becomes large, thereby increasing optical loss and increasing manufacturing cost.

However, the present invention is not limited thereto. The width W6 and the lengths L1 and L2 of the pad portion 422 may have various values within a range capable of increasing the contact area with the wiring member 142 and improving the adhesion with the wiring member 142. [ It is also possible that the pad portion 422 is not provided separately.

Referring again to FIG. 9, the first electrode 42 may further include a rim portion 423 that separates the electrode region EA and the first edge region PA1. The rim portion 423 extends from the end portion (or the pad portion 422) of the line portion 421 and extends through the end portions of the plurality of finger lines 42a adjacent to the edge region PA3 at one end to form the outermost finger lines 421a, 422a. ≪ / RTI > The rim portion 423 may connect the end portion of the finger line 42a adjacent to the edge region PA3. The frame 423 serves to provide a path through which the carrier flows when there is a disconnection or the like on a part of the finger line 42a adjacent to the edge area PA3. The electrode portions 424a and 424b located in the edge region PA3 may be connected to the finger line 42a via the rim portion 423. The current collected by the finger line 42a located in the edge region PA3 adjacent to the edge region PA3 in the electrode region EA passes through the edge portion 423 and is electrically connected to the wiring member 142 through the electrode portions 424a and 424b. ). ≪ / RTI > Thus, the current generated in the electrode region EA adjacent to the edge region PA3 can be effectively transmitted to the electrode portions 424a and 424b. However, the present invention is not limited thereto. It is also possible that the electrode portions 424a and 424b in the first edge region PA1 are directly connected to the finger line 42a without passing through the rim portion 423. Various other variations are possible.

The finger portion 42a and the bus bar line 422 are arranged such that the width of the first edge region PA1 gradually increases as the rim portion 423 is directed toward the first or second edge 161 or 162 of the solar cell 150 42b. In one example, the first edge area PA1 may have a rough triangular shape, and the two edge portions 423 defining the first edge area PA1 may have a rough "V shape" . Whereby the outer ends of the finger lines 42a in the two electrode areas EA adjacent to the first edge area PA1 can be arranged to be gradually distant from each other. The first edge area PA1 may have a shape that becomes wider as it gets closer to the first or second edges 161 and 162 of the solar cell 150 between the two electrode areas EA. Accordingly, the width of the end portion of the electrode region EA adjacent to the first edge region PA1 may be smaller than the other portion. For example, the first edge region PA1 may have an isosceles triangle shape, and each electrode region EA may have a roughly octagonal shape.

Thus, the wiring member 142 can be stably positioned in the first edge area PA1 without being attached to the rim 423. The end portion of the wiring material 142 that is not connected to the other solar cell 150 in this embodiment extends to the inside of the first edge region PA1 through the end portion of the line portion 421, 1 edge area PA1 (or the edge area PA3). Thus, the wiring member 142 can be stably fixed to the end of the line portion 421 and can be fixed to the first electrode 42 with a sufficient adhesive force by the first pad portion 422a. On the other hand, when the end portion of the wiring material 142 is located at the end of the line portion 421 or does not reach the end portion of the line portion 421, It may not be stably attached to the one pad portion 422a. Alternatively, when the end portion of the wiring material 142 extends to the second edge region PA2, a problem such as unnecessary short-circuiting may occur.

For example, the length of the wiring material 142 located in the first edge area PA1 in the first edge area PA1 may be longer than the length of the portion in which the wiring material 142 is not located. That is, the ratio of the length L3 of the first edge area PA1 to the length L4 of the wiring material 142 located in the first edge area PA1 may be 1: 0.5 to 1: 1. Then, the wiring material 142 can be stably attached to the first pad portion 422a. More specifically, the ratio of the length L3 of the first edge area PA1 to the length L4 of the wiring material 142 located in the first edge area PA1 may be 1: 0.6 to 1: 0.9 . Within this range, it is possible to prevent the wiring material 142 from stably attaching to the first pad portion 422a and extending to the second edge region PA2. However, the present invention is not limited thereto.

The other end of the wiring material 42 may extend to the outside of the semiconductor substrate 160 through the first edge region PA1 (or the other edge region PA4). That is, the wiring material 42 continuously extends from the edge region PA3 through the first pad portion 422a adjacent thereto to the first pad portion 422a adjacent to the other edge region PA4, and the first pad portion 422a and the other edge region PA4 to the outside of the semiconductor substrate 160.

At this time, the wiring material 142 is structurally coupled or attached to the pad portion 422. The wiring material 142 may be structurally bonded or attached to the line portion 421 and / or the electrode portions 424a and 424b in the one and the other end edge regions PA3 and PA4, ≪ / RTI > Even if the wiring material 142 is not structurally coupled or attached to the line portions 421 and / or the electrode portions 424a and 424b in the one and the other end edge regions PA3 and PA4, (E. G., Electrically connected). This is because the coating layer 142b including the solder material in the wiring member 142 can be adhered to the pad portion 422 having a relatively wide width but can be attached to the line portion of the bus bar line 42b having a relatively narrow width 421 and / or the electrode portions 424a, 424b.

The coupling strength between the bus bar line 42b and the wiring material 142 in the edge area PA3 and the edge area PA4 is set to be smaller than the width of the bus bar in the area other than the edge area PA3 and the edge area PA4. The line 42b and the wiring material 142 may be smaller than the bonding force between the line 42b and the wiring material 142. [ Particularly, in the edge region PA3 and the edge region PA4, the coupling strength between the electrode portions 424a and 424b of the bus bar line 42b and the wiring member 142 is greater than that of the pad portion 422 A sufficient bonding force can be realized by the pad portion 422. In the one edge region PA3 and the other edge region PA4, a small electrode area can be obtained with a small electrode area So that an electrical connection can be made.

The width W8 of the first edge region PA1 (or the width of one or both of the edge regions PA3 and PA4) located between the outermost finger lines 421a and 422a is smaller than the width W1 of the wiring member 142 It can be big. Thus, the wiring material 142 can be stably positioned in the first edge area PA1. Particularly, when the wiring material 142 is bent to the left or right in the first edge area PA1 during the process of attaching the wiring material 142, the wiring material 142 can be positioned in the first edge area PA1.

The width W8 of the first edge area PA1 may be 0.73 mm to 3.8 mm. For example, the width W8 of the first edge area PA1 may be 0.73 mm to 2 mm. Alternatively, the width W1 of the wiring material 142: the width of the first edge area PA1 may be 1 : 1.46 to 1: 15.2 (for example, 1: 1.46 to 1: 5). The wiring material 142 can be stably positioned within the first edge area PA1 within this range.

Alternatively, when the width W8 of the first edge area PA1 is L and the edge distance D is D, L and D can satisfy the following equation (1). Here, the edge distance D refers to the distance between the inner edge of the first edge region PA1 (or the pad portion 422 located at this portion) located inside the outermost finger lines 421a and 422a and the solar cell 150 (more specifically, the first or second edge 161, 162).

&Quot; (1) "

0.9 占 (0.1569 占 D + 0.3582) ? L? 1.1 (0.1569 占 D + 0.3582)

(Where the unit of L is mm and the unit of D is mm).

The width W8 of the first edge area PA1 is sufficiently secured as the edge distance D increases as the edge distance D increases as the wiring material 142 bends. . However, the present invention is not limited thereto.

The width of the rim portion 423 is smaller than the width of the line portion 421. For example, the width of the line portion 421 may be at least two times the width of the rim portion 423. Then, the sum of the widths of the two edge portions 423 in the two branched portions in the line portion 421 is equal to or smaller than the line portion 421. [ The width of the rim portion 423 can be minimized and the width of the bus bar line 42b can be prevented from widening at the portion where the rim portion 421 and the two rim portions 423 are connected. For example, the width W4 of the line portion 421 may be two to ten times the width of the rim portion 423. Or, as an example, the line width of the rim portion 423 may be 35um to 120um.

Alternatively, the width of the rim portion 423 may be smaller than the finger line 42a or may be the same as or similar to the finger line 42a. For example, the width of the rim portion 423 may be less than or equal to twice the width of the finger line 42a (e.g., 0.5 to 2 times). Accordingly, it is possible to prevent a problem such as an increase in optical loss due to the rim 423 while realizing the effect of the rim 423. However, the present invention is not limited to this, and it suffices if the width of the rim portion 423 is wide enough to connect the finger lines 42a to allow current flow therethrough.

In this embodiment, the bus bar line 42b may include electrode portions 424a and 424b positioned at one edge region PA3 and the other edge region PA4, respectively. The wiring members 142 are overlapped and contacted or the wiring members 142 are electrically connected to the electrode portions 424a and 424b located in the edge region PA3 and the edge region PA4. As a result, the electrode portions 424a and 424b are paths through which current can flow to the wiring member 142, so that the electrode portions 424a and 424b can be regarded as a part of the bus bar line 424b.

The edge portions PA3 and PA4 of the electrode regions EA adjacent to the one edge region PA3 and the other edge region PA4 are formed through the electrode portions 424a and 424b located in the edge region PA3 and the edge region PA4, To the wiring material 142. [0051] Thereby, the portion of the electrode region EA located at the portion adjacent to the edge region PA3 and the edge region PA4 at one end (that is, the two edge regions PA3 and PA4 arranged in parallel to the direction parallel to the finger line 42a) ) Of the electrode region EA located between the two edge regions PA1 and PA2 and / or the portion of the electrode region EA located between the other edge region PA3 and the other edge region PA3 located parallel to the finger line 42a) Can be effectively transferred to the wiring material 142 by the electrode portions 424a and 424b. Accordingly, even when the first edge region PA1 (or the one edge region PA3 and the other edge region PA4) is provided to improve the adhesive force or bonding force of the wiring member 142, Can be prevented. Accordingly, the efficiency of the solar cell 150 can be improved and the output of the solar cell panel 100 can be improved.

Unlike in the present embodiment, in the case where the electrode portions 424a and 424b are not provided in the edge region PA3 and the edge region PA4 at one end, the edge regions PA3 and PA4 adjacent to the edge region PA3 and the edge region PA4, The electric current generated in the region EA is collected in the first pad portion 422a and then transferred to the wiring material 142. [ According to this, it may be difficult to effectively collect the electric current generated in the portion of the electrode region EA adjacent to the edge region PA3 and the edge region PA4.

The electrode portions 424a and 424b may be formed to have a shape that can be connected to the finger line 42a, the bus bar line 42b, or the wiring member 142. In this case, The electrode portions 424a and 424b are positioned at the edge region PA3 and the edge region PA4 at one end with less density than the finger line 42a of the electrode region EA.

More specifically, once the edge area PA3 and the other edge area PA4 are formed symmetrically with respect to the center line of the semiconductor substrate 160 (that is, the center line parallel to the finger line 42a). As described above, in the present embodiment, one edge region PA3 and the other edge region PA4 are provided on both side edges (i.e., the first and second edges 161 and 162) of the semiconductor substrate 160, It is possible to effectively prevent the deterioration of the adhesion of the wiring material 142 that may occur at both side edge portions of the wiring 160.

In this embodiment, the electrode portion 424a located in the edge region PA3 has an opening in the inside and the outermost end portion of the electrode portion 424a is located in the same line as the outermost finger line 421a adjacent thereto, (I.e., closer to the first edge 161 of the semiconductor substrate 160). Similarly, the electrode portion 424b located at the other end edge region PA has an opening in the inside thereof, and the outermost end portion of the electrode portion 424b is located on the same line as the outermost finger line 422a adjacent thereto, (I.e., closer to the second edge 162 of the semiconductor substrate 160). Thus, the electrode portions 424a and 424b can be stably connected to the wiring member 142. This makes it possible to more stably transfer the current generated in the portion of the electrode region EA adjacent to the one end and the other end edge regions PA3 and PA4 to the wiring member 142. [

Since the electrode portions 424a and 424b located in the one edge region PA3 and the other edge region PA4 are provided with openings (portions where no electrode is formed) The electrode parts 424a and 424b of high density can be formed and the connection with the finger line 42a can be smoothly performed. The outermost end portion of the electrode portions 424a and 424b (i.e., the outer end portion of the second electrode portion 4242 and the outer end portion of the second electrode portion 4243) are on the same line or more than the outermost finger line 42a The electric current collected at the finger line 42a adjacent to the outside can be effectively transmitted to the wiring material 142 without being remained.

In this embodiment, the electrode portion 424a formed by the edge region PA3 and the electrode portion 424b formed at the other edge region PA4 have different shapes. The openings of the electrode portions 424a located at the edge region PA3 and the openings of the electrode portions 424b located at the other edge region PA4 may have different shapes or arrangements. The end portion of the wiring material 142 is located in the edge region PA3 and the wiring material 142 is extended to the outside of the semiconductor substrate 160 in the edge region PA4. The length of the wiring material 142 located in the edge area PA3 is different from the length of the wiring material 142 located in the other edge area PA4. More specifically, the length of the wiring material 142 located at the other edge region PA4 is larger than the length of the wiring material 142 once located in the edge region PA. The electrode portion 424a formed by the edge region PA3 and the electrode portion 424b located at the other edge region PA4 have different shapes (i.e., non-symmetrical shapes).

More specifically, the electrode portion 424a in the edge region PA3 includes a first electrode portion 4241 located inside the outermost finger line 421a, and a second electrode portion 4241 extending from the first electrode portion 4241, And a second electrode portion 4242 extending in the same line or outward as the outermost finger line 421a in the direction intersecting the first electrode portion 4241.

At this time, the first electrode portion 4241 is located on both sides of the edge region PA3 in parallel with the finger line 42a or intersect (for example, orthogonal to) the line portion 421 of the bus bar line 42b (Connected directly or via the rim 423) to the finger line 42a located within the portion of the electrode area EA. The first electrode portion 4241 is connected to the finger line 42a located in the portion of the electrode region EA located on both sides of the edge region PA3 so that the first electrode portion 4241 is formed in the portion of the electrode region EA So that current can be transmitted to the first electrode unit 4241. Accordingly, an opening is positioned between the first electrode portion 4241, the first pad portion 422a located at the inner end portion, and the rim portion 423.

The second electrode portion 4242 may intersect the finger line 42a (for example, orthogonally) or may be parallel to the line portion 421 of the bus bar line 42b. The second electrode portion 4242 extends from the first electrode portion 4241 at a position spaced apart from the first pad portion 422a of the bus bar line 42b and is electrically connected to the wiring member 142 by the first pad portion 422a. It is possible to prevent the unnecessary interference from being caused by increasing the coupling strength with the electrode and to reduce the electrode area and thus to reduce the material cost. The second electrode part 4242 is positioned to pass through the center of the first electrode part 4241, thereby greatly increasing the area or probability of connection with the wiring material 142. Thus, the current transmitted through the first electrode unit 421 can be stably transmitted to the wiring member 142. [

Thereby, a kind of opening is formed between one side (left side of the drawing) of the first electrode part 4241, the second electrode part 4242 adjacent to one side of the first electrode part 4241, and the first side edge 161 . An opening is formed between the second electrode portion 4242 and the first edge 161 adjacent to the other side of the first electrode portion 4241, the other side of the first electrode portion 4241, and the first edge portion 161.

In this case, for example, in the first edge area PA1, the position of the first electrode part 4241 in the direction parallel to the line part 421 is longer than the inner edge of the first edge area PA1, (42b). ≪ / RTI > That is, the length L3 of the first edge area PA1 in the direction parallel to the line part 421: the distance between the first electrode part 4241 and the first pad part 422a is 1: 0.5 to 1: 1 < / RTI > More specifically, the length L3 of the first edge region PA1: the distance between the first electrode portion 4241 and the first pad portion 422a may be 1: 0.6 to 1: 0.9. Then, when the wiring material 142 is placed on the second electrode portion 4242 across the first electrode portion 4241, the wiring material 142 can be stably attached to the first pad portion 422a . And the wiring material 142 can be prevented from extending to the second edge region PA2. However, the present invention is not limited thereto.

In the other edge region PA4, the electrode portion 424b may include a third electrode portion 4243 which is located on the same line or outward as the outermost finger line 422a. Accordingly, the wiring material 142 can extend to the outside of the semiconductor substrate 160 across the third electrode portion 4243. At this time, the third electrode part 4243 is formed in a direction parallel to the finger line 42a or in a direction intersecting (for example, orthogonal to) the line part 421 of the bus bar line 42b and the other end edge area PA4, (Connected via a direct connection or rim 423) to a finger line 42a located within a portion of the electrode region EA located on both sides of the electrode region EA.

Thus, the third electrode portion 4243 is connected to the finger line 42a located in the portion of the electrode region EA located on both sides of the other edge region PA4. Accordingly, the current generated in the electrode region EA can be stably transferred to the first electrode portion 4241 through the third electrode portion 4243. Since the wiring material 142 extends to the outside of the semiconductor substrate 160 in the other edge region PA4 only the third electrode portion 4243 can be stably connected to the finger line 42a. In consideration of this, the structure of the electrode portion 424b is simplified in the other edge region PA4, thereby reducing the manufacturing cost and simplifying the manufacturing process. As a result, an opening is positioned between the third electrode portion 4243, the first pad portion 422a located at the inner end portion, and the rim portion 423. At this time, the distance between the third electrode portion 4243 and the adjacent first pad portion 422a is larger than the distance between the first electrode portion 4241 and the adjacent first pad portion 422a. The area of the opening formed between the first pad portion 422a and the third electrode portion 4243 in the other end edge region PA4 is located in the edge region PA3 at one end and the first pad portion 422a May be larger than the area of the opening formed between the first electrode portions 4241.

In the drawing, the electrode portions 424a and 424b are arranged on the same line or extend to the same line as the outermost finger lines 421a and 422a. However, the present invention is not limited thereto, and the electrode portions 424a and 424b may extend to protrude from the outermost finger lines 421a and 422a as shown in FIGS. This will be described in more detail later.

As described above, in this embodiment, the second electrode portion 4242 in the direction parallel to the line portion 421 in the edge region PA3 is located on the same line or on the outer side as the outermost finger line 421a, The third electrode portion 4243 in the direction intersecting the line portion 421 is positioned on the same line or outwardly as the outermost finger line 422a in the PA4. This takes into consideration that the end portion of the wiring material 142 is located in the edge region PA3 and the wiring material 142 extends to the outside across the other edge region PA4. The wiring member 142 and the electrode portions 424a and 424b can be stably connected even if the arrangement of the wiring members 142 is different.

The width of the electrode portions 424a and 424b located in the edge area PA may be larger than the finger line 42a or may be the same as or similar to the finger line 42a and smaller than the pitch of the finger line 42a. For example, the width of the electrode portions 424a and 424b may be less than or equal to twice the width of the finger line 42a (for example, 0.5 to 2 times). Alternatively, the width of the wiring member 142 may be larger than the width of the electrode portions 424a and 424b. The ratio of the width of the electrode portions 424a and 424b to the widths and pitches of other electrode portions and the wiring material 142 may be different from the widths and pitches of the electrode portions and the wiring materials 142 other than the finger lines 42a. The distance ratio can be applied as is. Accordingly, it is possible to prevent the problem of increase in optical loss due to the electrode portions 424a and 424b while realizing the effect of the electrode portions 424a and 424b. However, the present invention is not limited thereto, and it suffices that the electrode portions 424a and 424b have a width in a range in which current can flow smoothly.

In this embodiment, the thickness of the bus bar line 42b may be between 3 탆 and 45 탆. The thickness of the bus bar line 42b may be in a range that can be easily formed in the process and have a desired specific resistance. However, the present invention is not limited thereto, and the thickness of the bus bar line 42b may be variously changed according to changes in process conditions, the size of the solar cell 150, the material of the bus bar line 42b, and the like.

In this embodiment, the finger line 42a and the bus bar line 42b may be formed of different layers. That is, the finger line 42a may be composed of different layers from the line portion 421, the pad portion 422, and the electrode portions 424a and 424b constituting the bus bar line 42b. The rim portion 423 constitutes a part of the finger line 42a and may be formed of the same layer as the finger line 42a and may form a part of the bus bar line 42b, . For example, the bus bar line 42b may be formed first, and then the finger line 42a may be formed over at least a portion of the bus bar line 42b, as shown in the upper enlargement circle of FIG. In this embodiment, the finger line 42a located on one side (for example, the left side of the drawing) and the finger line 42a located on the other side (for example, the right side of the drawing) And are spaced apart from one another. If the portion where the finger line 42a is not formed on the bus bar line 42b as described above, the manufacturing cost in forming the finger line 42a can be minimized. However, the present invention is not limited thereto, and it is also possible that the finger line 42a is located across the entire bus bar line 42b.

The finger line 42a and the bus bar line 42b may be made of the same material or different materials. For example, when the finger line 42a and the bus bar line 42b are formed by printing, the paste for forming the bus bar line 42b has a relatively low viscosity and a paste for forming the finger line 42a Can have a relatively high viscosity. Accordingly, the thickness of the finger line 42a may be higher than the thickness of the bus bar line 42b after firing. Accordingly, as described above, when the bus bar line 42b is formed first and then the finger line 42a is formed, more stable formation can be performed.

For example, the content of the metal (for example, silver) of the paste for forming the finger line 42a may be larger than the content of the metal (for example, silver) of the paste for forming the bus bar line 42b have. Thus, the resistance of the finger line 42a directly related to the carrier collection can be reduced to improve the carrier collection efficiency, and the metal content of the bus bar line 42b can be reduced, thereby reducing manufacturing costs.

At this time, the finger line 42a of the first electrode 42 is formed through the passivation film 22 and the antireflection film 24, and the bus bar line 42b is formed through the passivation film 22 and the antireflection film 24, Lt; / RTI > In this case, an opening (reference numeral 102 in Fig. 3) is formed in a shape corresponding to the finger line 42a at a portion where the bus bar line 42b is not located, and is formed at a portion where the bus bar line 42b is located . At this time, the first conductivity type region 20 may have a shape corresponding to a portion where the opening 102 is formed. That is, the first conductivity type region 20 may be formed to have a shape corresponding to the finger line 42a in the electrode region EA, and may not be formed in the portion corresponding to the bus bar line 42b have. In this case, the line portion 421, the pad portion 422, and the electrode portions 424a and 424b (the rim portion 423) constituting the bus bar line 42b constitute part of the bus bar line 42b The edge portion 423 is also formed on the passivation film 22 and the antireflection film 24 and the first conductive type region 20 may not be formed in the corresponding portion. The line portion 421 and the pad portion 422 (including the rim portion 423 in the case where the rim portion 423 constitutes a part of the bus bar line 42b) constituting the bus bar line 42b, May be configured as a floating electrode.

However, the present invention is not limited to the above, and it is also possible to form the bus bar line 42b after forming the finger line 42a first. Alternatively, as shown in the lower enlargement circle in FIG. 9, the finger lines 42a and the bus bar lines 42b may be formed of the same layer formed of the same material together by a single process. Various other variations are possible.

The first electrode 42 is connected to the end of the finger line 42a to define an electrode region EA and a second edge region PA2 at a portion adjacent to the third and fourth edges 163 and 164 And a border line 42c. The edge lines 42c are spaced at equal intervals from the third and fourth edges 163 and 164 at the portions adjacent to the third and fourth edges 163 and 164 to form the third and fourth edges 163 and 164, And may have the same or similar shape as that of FIG. At this time, the edge line 42c connects the ends of the finger line 42a adjacent to the third and fourth edges 163, 164.

The first and second edges 161 and 162 and the outermost finger line 42a and between the third and fourth edges 163 and 164 and the edge line 42c and between the first and second edges 161 and 162 and the outermost finger line 42a, The second edge region PA2 may be formed. The width W9 of the second edge region PA2 may be 0.5 mm to 1.5 mm. If the width W9 of the second edge area PA2 is less than 0.5 mm, a problem such as an unnecessary shunt may occur. If the width of the second edge area PA2 exceeds 1.5 m, the area of the ineffective area becomes large and the efficiency of the solar cell 150 may not be high. However, the present invention is not limited thereto.

The width of the border line 42c may be the same as or similar to the finger line 42a. The width, thickness, other electrode portions, and the relationship of the wiring material 142, etc. of the finger lines 42a can be applied to the border lines 42c as they are. The border line 42c may constitute a part of the finger line 42a as an example.

In the present embodiment, when the width W1 of the wiring material 142 is W and the edge distance D is D, W and D can satisfy the following equation (2).

&Quot; (2) "

13.732 · ln (W) - 71.436 - 0.0000321462 · (W) ² ≤ D ≤ 13.732 · ln (W) - 71.436 + 0.0000321462 · (W) ²

(Where the unit of W is um and the unit of D is mm).

A force is applied to the wiring member 142 in a direction away from the solar cell 150 at the first pad portion 422a of the first electrode 42 where the wiring member 142 is located, The adhesion between the first electrodes 42 may be deteriorated. That is, as shown in Fig. 10, when the width W1 of the wiring material 142 is increased, the degree of warping of the solar cell 150 or the semiconductor substrate 160 becomes larger. In FIG. 10, 300 wire is a case where the width W1 of the wiring material 142 is 300um, 330wire is the case where the width W1 of the wiring material 142 is 330um, And the width W1 is 400 mu m. When the width W1 of the wiring member 142 is increased as described above, a larger force is applied to the wiring member 142 in the direction away from the solar cell 150 in the first pad portion 422a of the first electrode 42, The adhesion with the first electrode 42 can be made smaller. In order to prevent the deterioration of the adhesion force, in this embodiment, the edge distance D is sufficiently secured to minimize the stress applied to the first electrode 42.

That is, the present inventors have found that the adhesion force between the wiring material 142 and the first electrode 42 has a sufficient value only when the edge distance D increases as the width W1 of the wiring material 142 increases, The range of the edge distance D in accordance with the width W1 of the light-shielding layer 2 is expressed by Equation (2). As described above, since the wiring material 142 is connected to the first pad portion 422a with a sufficient area and a sufficient bonding force, the distance between the first pad portion 422a and the edge of the semiconductor substrate 160 is set to be the edge distance (D).

The inventors of the present invention measured the adhesion of the wiring material 142 at the first pad portion 422a of the first electrode 42 while changing the width W1 and the edge distance D of the wiring material 142. [ At this time, a case where the adhesive force has a value equal to or more than a certain value (for example, a value of 1.5 N or more (more preferably, 2 N or more)) is found and represented by x (x) in FIG. 11, the portion including the range of the edge distance D corresponding to the width W1 of the wiring member 142 is found so as to include the portion where the X display is located, The above-mentioned equation (2) is derived.

If the edge distance D falls within the range of the above-mentioned equation (2) when the width W1 of the wiring material 142 has a constant value, the wiring material 142 having the wire shape is electrically connected to the first electrode 42 It can be stably attached to the end portion. Thus, according to the present embodiment, the adhesive force of the wiring material 142 can be improved by adjusting the edge distance D while realizing various effects by using the wiring material 142 having a wire form.

At this time, since the width W1 of the wiring material 142 is 250 to 500 um, the edge distance D can have a value of 2.37 mm to 21.94 mm. More specifically, when the width W1 of the wiring material 142 is 250um or more and less than 300um, the edge distance D may be 2.37mm to 9.78mm. When the width W1 of the wiring material 142 is 300 mu m or more and less than 350 mu m, the edge distance D may be 3.99 mm to 12.94 mm. When the width W1 of the wiring material 142 is not less than 350 mu m and less than 400 mu m, the edge distance D may be 5.06 mm to 15.98 mm. When the width W1 of the wiring material 142 is 400um or more and less than 450um, the edge distance D may be 5.69mm to 18.96mm. When the width W1 of the wiring material 142 is 450 to 500 mu m, the edge distance D may be 5.94 mm to 21.94 mm. In this range, the above-mentioned formula (2) is satisfied and an excellent adhesion can be obtained.

For example, when the width W1 of the wiring material 142 is 250um or more and less than 300um, the edge distance D may be 4mm to 9.78mm. When the width W1 of the wiring material 142 is 300 mu m or more and less than 350 mu m, the edge distance D may be 6 mm to 12.94 mm. When the width W1 of the wiring material 142 is 350um or more and less than 400um, the edge distance D may be 9mm to 15.98mm. When the width W1 of the wiring material 142 is 400um or more and less than 450um, the edge distance D may be 10mm to 18.96mm. When the width W1 of the wiring material 142 is 450 to 500 mu m, the edge distance D may be 12 mm to 21.94 mm. In this range, it is possible to have sufficient adhesion strength more stably. Particularly, in this embodiment, when the width W1 of the wiring material 142 is 350um or more and less than 400um, the edge distance D may be 9mm to 15.98mm. Thus, the output of the solar cell panel 100 can be maximized. However, the present invention is not limited thereto.

Since the first pad portion 422a is located at the end of the bus bar line 42b where the wiring material 142 is located in this embodiment, the first pad portion 422a and the first pad portion 422a of the solar cell 150 Or the edge distance D between the second edges 161 and 162 may satisfy the above-described expression (2) and the range.

The present inventor has also found that the number of the wiring materials 142 (or the number of the bus bar lines 42b) located on one surface of the solar cell 150 has a constant relationship with the width W1 of the wiring material 142. [ 12 is a graph showing the output of the solar cell panel 100 measured while changing the width W1 of the wiring material 142 to a different number. It can be seen that the output of the solar cell panel 100 has an excellent value if 6 to 33 wiring materials 142 having a width W1 of 250 to 500 um are provided. At this time, it is understood that when the width W1 of the wiring material 142 is increased, the number of the wiring materials 142 required can be reduced.

For example, when the width W1 of the wiring material 142 is 250um or more and less than 300um, the number of the wiring materials 142 (the number of the wiring materials 142 when the surface of the solar cell 150 is taken as a reference) To 33 < / RTI > When the width W1 of the wiring material 142 is 300 mu m or more and less than 350 mu m, the number of the wiring materials 142 may be 10 to 33. When the width W1 of the wiring material 142 is not less than 350 mu m and less than 400 mu m, the number of the wiring materials 142 may be 8 to 33. [ When the width W1 of the wiring material 142 is 400 탆 to 500 탆, the number of the wiring materials 142 may be 6 to 33. The number of the edge regions PA3 and PA4 may be equal to each other and the edge region PA3 and the edge region PA4 may also be 6 to 33 . If the width W1 of the wiring material 142 is 350 m or more, the output of the solar cell 100 is hardly increased even if the number of the wiring materials 142 exceeds 15. [ If the number of the wiring materials 142 increases, the solar cell 150 may be burdened. In consideration of this, when the width W1 of the wiring material 142 is 350um or more and less than 400um, the number of the wiring materials 142 may be 8 to 15. When the width W1 of the wiring material 142 is 400 탆 to 500 탆, the number of the wiring materials 142 may be 6 to 15. At this time, in order to further improve the output of the solar cell panel 100, the number of the wiring materials 142 may be 10 or more (for example, 12 to 13). However, the present invention is not limited to this, and the number of the wiring materials 142 and the number of the bus bar lines 42b may have different values.

At this time, the pitch of the wiring material 142 (or the pitch of the bus bar line 42b) may be 4.75 mm to 26.13 mm. This takes into consideration the width W1 and the number of the wiring material 142. [ For example, when the width W1 of the wiring material 142 is 250um or more and less than 300um, the pitch of the wiring material 142 may be 4.75mm to 10.45mm. When the width W1 of the wiring material 142 is 300 mu m or more and less than 350 mu m, the pitch of the wiring material 142 may be 4.75 mm to 15.68 mm. When the width W1 of the wiring material 142 is 350um or more and less than 400um, the pitch of the wiring material 142 may be 4.75mm to 19.59mm. When the width W1 of the wiring material 142 is 400 to 500 mu m, the pitch of the wiring material 142 may be 4.75 to 26.13 mm. More specifically, when the width W1 of the wiring material 142 is not less than 350 mu m and less than 400 mu m, the pitch of the wiring material 142 may be 10.45 mm to 19.59 mm. When the width W1 of the wiring material 142 is 400 to 500 mu m, the number of the wiring materials 142 may be 10.45 mm to 26.13 mm. However, the present invention is not limited to this, and the pitch of the wiring material 142 and the pitch of the bus bar line 42b may have different values.

In this embodiment, the first electrode 42, the wiring material 142, the electrode area EA, the edge area PA, and the like are arranged in the left-right direction (the direction parallel to the finger line 42a) 42b) or in a direction parallel to the wiring member 142). Thus, current flow can be stably implemented. However, the present invention is not limited thereto.

In the above description, the first electrode 42 is mainly described with reference to Figs. 9 to 12. Fig. The second electrode 44 may include a finger line, a bus bar line, and a border line corresponding to the finger line 42a, the bus bar line 42b, and the edge line 42c of the first electrode 42 . The contents of the finger line 42a, the bus bar line 42b and the frame line 42c of the first electrode 42 can be applied to the finger line, the bus bar line and the frame line of the second electrode 44 as they are. The description of the first conductivity type region 20 related to the first electrode 42 may be a description of the second conductivity type region 30 related to the second electrode 44. In this case, The description of the first passivation film 22 and the antireflection film 24 and the opening portion 102 related to the second electrode 42 is the same as that of the second passivation film 30 related to the second electrode 44, . ≪ / RTI >

The width, pitch, number and the like of the finger line 42a of the first electrode 42, the line portion 421 of the bus bar line 42b, and the pad portion 442 are the same as the finger line 42a of the second electrode 44, Pitch, number and the like of the line portion and the pad portion of the bus bar line 44a and the bus bar line 44b. The width, pitch, number and the like of the finger line 42a of the first electrode 42, the line portion 421 of the bus bar line 42b and the pad portion 442 may be the same as the finger line 42a of the second electrode 44, Pitch, number and the like of the line portions and the pad portions of the bus bar line 44a and the bus bar line 44b. For example, the width of the electrode portion of the second electrode 44 may be greater than the width of the electrode portion of the first electrode 42, which is relatively less incident on the second electrode 44, May be smaller than the pitch of the electrode portions of the corresponding first electrodes 42. [ Various other variations are possible. However, the number and the pitch of the bus bar lines 42b of the first electrode 42 may be the same as the number and the pitch of the bus bar lines of the second electrode 44, respectively. In addition, the first electrode 42 and the second electrode 44 may have different planar shapes, and various other modifications are possible.

According to the present embodiment, the optical loss can be minimized by diffused reflection or the like using the wire-shaped wiring material 142, and the pitch of the wiring material 142 can be reduced, thereby reducing the movement path of the carrier. Accordingly, the efficiency of the solar cell 150 and the output of the solar cell panel 100 can be improved. At this time, the edge distance D of the first pad portion 422a is limited according to the width of the wiring material 142, so that the adhesion between the wiring material 142 having a wire form and the first electrode 42 can be improved. Accordingly, damage to the solar cell 150, which may occur when the wiring member 142 is separated from the first electrode 42, can be prevented, and the solar cell 150 can have excellent electrical characteristics and excellent reliability. In addition, the number of the wiring materials 142 can be limited according to the width W1 of the wiring material 142, so that the output of the solar cell panel 100 can be maximized.

The electrode portions 424a and 424b in the edge region PA3 and the edge region PA4 are located on the same line or on the outer side of the outermost finger lines 421a and 422a and are connected to the wiring member 142 The structure can be stably formed. The currents generated in the portions of the electrode regions EA adjacent to the one edge region PA3 and the other edge region PA4 through the electrode portions 424a and 424b located in the edge region PA3 and the edge region PA4, To the wiring material 142. [0064] The current generated in the portion of the electrode region EA located in the vicinity of the edge region PA3 and the edge region PA4 can be effectively transmitted to the wiring member 142 by the electrode portions 424a and 424b have. Thus, even when the first edge region PA1 (or the one edge region PA3 and the other edge region PA4) is provided to improve the adhesive force or bonding force of the wiring member 142, Can be prevented. Accordingly, the efficiency of the solar cell 150 can be improved and the output of the solar cell panel 100 can be improved.

The shape of the electrode part 424a located at the edge area PA3 and the electrode part 424b located at the other edge area PA4 are different from each other to stably form the connection structure of the wiring material 142, can do.

Hereinafter, a solar cell according to another embodiment of the present invention and a solar cell panel including the same will be described in detail with reference to the accompanying drawings. Since the above description can be applied to the same or extremely similar parts as the above description, the detailed description will be omitted and only the different parts will be described in detail. It is also within the scope of the present invention to combine the above-described embodiments or variations thereof with the following embodiments or modifications thereof. Although the first electrode is described below as an example, the following description and illustration may be applied to the second electrode as it is.

13 is a partial front plan view of a solar cell according to another embodiment of the present invention. Fig. 13 (a) shows one edge region PA3, and Fig. 13 (b) shows the other edge region PA4.

Referring to FIG. 13A, in the edge region PA3, the second electrode portion 4242 protrudes more toward the first edge 161 than the outermost finger line 421a. The connection area or probability with the wiring material 142 can be further improved.

Referring to FIG. 13B, the third electrode portion 4243 in the other edge region PA may have a portion protruding more toward the second edge 162 than the outermost finger line 422a . In other words, the third electrode portion 4243 may have a shape protruding outwardly from the outermost finger line 422a while being connected to the outermost finger line 422a. The center portion of the third electrode portion 4243 is parallel to the outermost finger line 422a and both ends of the third electrode portion 4243 are inclined with respect to the outermost finger line 422a. . However, the present invention is not limited thereto, and the third electrode portion 4243 may have various shapes.

14 is a partial front plan view of a solar cell according to another embodiment of the present invention.

14, the third electrode portion 4243 is thicker than the outermost finger line 422a so that the outer edge of the third electrode portion 4243 is closer to the second edge 162a than the outermost finger line 422a As shown in Fig. If the thickness of the third electrode part 4243 is relatively increased, the area of connection with the wiring material 142 in the other edge area PA4 can be increased.

15 is a partial front plan view of a solar cell according to another embodiment of the present invention.

15, the third electrode portion 4243 is thicker than the outermost finger line 422a and the outer edge of the third electrode portion 4243 is located on the same line as the outermost finger line 422a, And the inner edge of the three-electrode portion 4243 is positioned inside the outermost finger line 422a. If the thickness of the third electrode part 4243 is relatively increased, the area of connection with the wiring material 142 in the other edge area PA4 can be increased.

16 is a partial front plan view of a solar cell panel according to another embodiment of the present invention.

16A and 16B, in this embodiment, the electrode portion 424a located at the edge region PA3 and the electrode portion 424b located at the other edge region PA4 are symmetrical with respect to each other Lt; / RTI > More specifically, the electrode part 424a and the edge area PA4 located in the edge area PA3 are positioned on the virtual line parallel to the finger line 42a while passing through the center of the solar cell 150, The electrode portions 424b may be symmetrical with respect to each other. The openings of the electrode portions 424a located at the edge region PA3 and the openings of the electrode portions 424b located at the other edge region PA4 may be symmetrical with respect to each other.

16A, the electrode portion 424a in the one-edge region PA3 includes the first electrode portion 4241 located on the inner side of the outermost finger line 421a, And a second electrode portion 4242 extending from the first electrode portion 4241 to the outermost finger line 421a in a direction intersecting the first electrode portion 4241 to the same line or outward. Since the shape of the electrode portion 424a in the edge region PA3 is the same as or extremely similar to the shape of the electrode portion 424a in the one-edge region PA3 described with reference to FIG. 9, detailed description thereof will be omitted.

16B, the electrode portion 424b in the other edge region PA4 includes a first electrode portion 4241 located inside the outermost finger line 421a, And a second electrode portion 4242 extending from the first electrode portion 4241 to the outermost finger line 421a in a direction intersecting the first electrode portion 4241 to the same line or outward. The shape of the electrode portion 424b in the other edge region PA3 is the same or extremely similar to the shape symmetrical to the shape of the electrode portion 424a in the one-edge region PA3 described with reference to FIG. 9, .

The first electrode portion 4241 located at the edge region PA3 and the first electrode portion 4241 located at the other edge region PA4 are symmetrical with respect to each other at the positions where they are the same or extremely similar in shape, And the second electrode portion 4242 located at the one edge region PA3 and the second electrode portion 4242 located at the other edge region PA4 are symmetrical with respect to each other at a position where the shape, Quot; width ".

However, the present invention is not limited thereto. For example, the electrode portion 424a located at the edge region PA3 and the electrode portion 424b located at the other edge region PA4 are located at positions symmetrical to each other, but may be different in shape, length, have. Alternatively, the electrode portion 424a located at the edge region PA3 and the electrode portion 424b located at the other edge region PA4 are not formed at exactly symmetrical positions, but at least one of the shape, length, They may be the same or extremely similar to each other. Other variations are possible.

In the present embodiment, the electrode portion 424a located at the edge region PA3 and the electrode portion 424b located at the other edge region PA4 are symmetrical to each other to simplify the structure and make the current flow uniform as a whole .

16 illustrates that each of the electrode portions 424a and 424b disposed at the edge region PA3 and the edge region PA at the other end includes the first electrode portion 4241 and the second electrode 4242, respectively. However, the present invention is not limited to this, and the shape of the electrode portions 424a and 424b positioned at the edge region PA3 and the edge region PA at the other end may have various shapes. This will be described with reference to FIG.

17 is a partial front plan view of a solar cell panel according to another embodiment of the present invention.

Referring to FIGS. 17A and 17B, in this embodiment, as shown in FIG. 16, an electrode portion 424a located at one end edge region PA3 and an electrode portion located at the other end edge region PA4 424b may be symmetrical to each other.

17A, the electrode portion 424a in the one-edge region PA3 includes the first electrode portion 4241 located inside the outermost finger line 421a, A second electrode portion 4242 extending from the electrode portion 4241 in the direction intersecting the first electrode portion 4241 to the same line or outward as the outermost finger line 421a and a second electrode portion 4242 extending from the outermost finger line 422a, And a third electrode part 4243 which is located on the same line or on the outer side of the third electrode part 4243. The second electrode unit 4242 reaches the third electrode unit 4243 so that the second electrode unit 4242 and the third electrode unit 4243 can be connected to each other. The third electrode portion 4243 may connect the outermost finger lines 421a located on both sides of the edge region PA3.

17B, the electrode portion 424b in the other edge region PA4 includes a first electrode portion 4241 located on the inner side of the outermost finger line 421a, A second electrode portion 4242 extending from the first electrode portion 4241 in the direction intersecting the first electrode portion 4241 to the same line or outward as the outermost finger line 421a and the second electrode portion 4242 extending in the same direction as the outermost finger line 422a And a third electrode part 4243 located on the line or on the outer side. The second electrode unit 4242 reaches the third electrode unit 4243 so that the second electrode unit 4242 and the third electrode unit 4243 can be connected to each other. The third electrode portion 4243 may connect the outermost finger lines 421a located on both sides of the other edge region PA4 with each other. In addition, in this embodiment, at least one of the outermost finger line 421a of the first finger line and the outermost finger line 421a of the third finger line may extend without a short circuit.

The first electrode portion 4241, the second electrode portion 4242, the third electrode portion 4243, and the edge portion 423 in the edge region PA3 and the edge region PA4 of the edge portion PA3, respectively, Thereby forming an opening in the closed space formed by the opening. For example, the openings may be positioned on both sides of the rim 423 and the second electrode 4242, and may be positioned between the first electrode 4241 and the rim 423.

In the drawing, the first electrode portion 4241 located at one edge region PA3 and the electrode portion 4241 located at the other edge region PA4 are formed so as to have the same or extremely similar shape, length, and width at positions symmetrical to each other Located. The second electrode portion 4242 located at the edge region PA3 and the second electrode portion 4242 located at the other edge region PA4 have the same or extremely similar shape, . The third electrode portion 4243 located at the edge area PA3 and the third electrode portion 4243 located at the other edge region PA4 may have the same or very similar shape, Can be located.

However, the present invention is not limited thereto. For example, the electrode portion 424a located at the edge region PA3 and the electrode portion 424b located at the other edge region PA4 are formed at positions symmetrical to each other. However, the shapes may be different from each other, have. Alternatively, the electrode portion 424a located at the edge region PA3 and the electrode portion 424b located at the other edge region PA4 are not formed at exactly symmetrical positions, but at least one of the shape, length, They may be the same or extremely similar to each other. Other variations are possible.

The detailed description of the first to third electrode units 4241, 4242, and 4243 is the same as or very similar to that of the first to third electrode units 4241, 4242, and 4243 with reference to FIG. The present invention may further include an embodiment in which the shape of the electrode portion 424a located at the edge region PA3 in FIG. 9 has the shape shown in FIG. 17 (a).

In this embodiment, the electrode portions 424a and 424b located in the edge region PA3 and the edge region PA4 of the other end include the first to third electrode portions 4241, 4242 and 4243, The path can be varied to make the current flow more smoothly.

18 is a partial front plan view of a solar cell panel according to another embodiment of the present invention.

Referring to FIG. 18, in this embodiment, the finger line 42a positioned between two adjacent bus bar lines 42b may be provided with a disconnected portion S, which is not continuously connected but is partially disconnected.

At this time, the disconnected portion S may be formed in the finger line 42a located in the first electrode region EA1 and not formed in the finger line 42a located in the second electrode region EA2. Since the finger line 42a is connected to one bus bar line 42b or the wiring material 142 even if the finger line 42a has the disconnected portion S in the first electrode area EA1, have. Accordingly, the area of the first electrode 42 can be reduced without interrupting the current flow in the first electrode region EA1, thereby reducing manufacturing cost and optical loss. The second electrode area EA2 is connected to the bus bar line 42b or the wiring material 142 only at one side so that the current is not supplied to the bus bar line 42b or the wiring material 142 located at one side without the disconnected part S. So that it can flow smoothly.

The disconnected portion S of the finger line 42a may be located at a central portion between two adjacent bus bar lines 42b. Thus, the current path can be minimized.

The width of the disconnected portion S may be 0.5 times or more the pitch of the finger line 42a and 0.5 times or less the pitch of the bus bar line 42b. If the width of the disconnection portion S is less than 0.5 times the pitch of the finger line 42a, the width of the disconnection portion S is small and the effect of the disconnection portion S may not be sufficient. If the width of the disconnection portion S exceeds 0.5 times the pitch of the bus bar line 42b, the width of the disconnection portion S becomes large and the electrical characteristics may be deteriorated. For example, the width of the single-wire portion S may be 1.5 mm to 1.8 mm. It is possible to maximize the effect of the disconnection section S within this range. However, the present invention is not limited to this, and the width of the single-wire portion S may have various values.

The ratio of the number of the finger lines 42a provided with the disconnected portion S to the number of the finger lines 42a measured in the direction parallel to the bus bar line 42b in each first electrode region EA1 May be 0.33 times to 1 time. It is possible to maximize the effect of the disconnection section S within this range. However, the present invention is not limited thereto, and the above-described ratio may vary.

Although the first electrode regions EA1 are each provided with the disconnected portions S in the drawing, the present invention is not limited thereto. A part of the plurality of first electrode areas EA1 may be provided with a disconnection part S and the other part may not be provided with a disconnection part S. Although the first electrode 42 is shown and described in the drawings and the foregoing description, the description may be applied to the second electrode 44 as it is.

19 is a partial front plan view of a solar cell according to another embodiment of the present invention.

Referring to FIG. 19, in this embodiment, the line width of the finger line 42a located between two adjacent bus bar lines 42b may include other portions. The finger line 42a may have a narrow portion S1 having a relatively narrow width and a wide portion S2 having a relatively wide width.

For example, in this embodiment, the finger line 42a includes the narrow portion S1 and the wide portion S2, and the finger line 42a positioned in the first electrode region EA1 includes the second electrode region EA2. (For example, the same width as that of the wide portion S2). In the first electrode area EA1, since the finger line 42a is connected to the two adjacent bus bar lines 42b or the wiring material 142, current can flow smoothly. The area of the first electrode 42 can be reduced by the narrow portion S1 of the first electrode 42 without interrupting the current flow in the first electrode region EA1, Can be reduced. The second electrode area EA2 is connected to the bus bar line 42b or the wiring material 142 only on one side so that the bus bar line 42b or wiring material 42b having a uniform width, 142) so that current can flow smoothly.

In this embodiment, the narrow portion S1 of the finger line 42a is located at a central portion between the two adjacent bus bar lines 42b and extends to the finger line 42a while being directed to each of the two bus bar lines 42b. Can be gradually increased. Thus, current flow can be smoothly performed. However, the present invention is not limited thereto, and the finger line 42a having the narrow portion S1 and the wide portion S2 may have various shapes.

The ratio of the number of the finger lines 42a provided with the narrowed portion to the number of the finger lines 42a measured in the direction parallel to the bus bar line 42b in each first electrode region EA1 is 0.33 times To 1-fold. Within this range, the effect of the narrowed portion can be maximized. However, the present invention is not limited thereto, and the above-described ratio may vary.

Although the first electrode regions EA1 are each provided with the narrow portion S1 in the drawing, the present invention is not limited thereto. The narrow portion S1 may be provided in a part of the plurality of first electrode regions EA1 and the narrow portion S1 may not be provided in the other portion. And the disconnection portions S shown in Fig. 18 may be mixed and positioned. Although the first electrode 42 is shown and described in the drawings and the foregoing description, the description may be applied to the second electrode 44 as it is.

Hereinafter, the present invention will be described in more detail with reference to experimental examples of the present invention. The following experimental examples are provided for the purpose of reference and the present invention is not limited thereto.

Experimental Example

A wiring material having a circular cross section and a width of 300 um was attached to a solar cell having an edge distance of 7.5 mm. The adhesive force was measured while pulling out the wiring material by an experimental apparatus (for example, a tensile testing apparatus). The measured adhesive force is shown in Fig.

In Fig. 20, the horizontal axis represents the distance, and the vertical axis represents the adhesion force. At this time, the horizontal axis can be divided into three sections. The first section I is a section until the wire starts to be pulled until the experimental device starts to operate and the wire is pulled. The second section II is a section in which the experimental device actually pulls the wire. The third section III And indicates a section after the wire has separated from the pad portion. Therefore, the actual adhesive force can be confirmed through the second section (II).

In the first section I, the distance is small, and no force is actually applied to the wiring material in the first section I.

In the second section (II), since the experimental apparatus pulls the wiring material, the stress applied to the wiring material also increases in proportion to the distance as the distance increases. Thus, the graph gradually rises toward the peak. More specifically, the adhesive force rises at the second section (II), and then abruptly drops to 2.058N at the highest point.

The third section (III) is a section after the highest point of the adhesive force. Since the wiring material is separated from the first pad section, the stress applied to the wiring material is rapidly reduced.

As described above, in this embodiment, the adhesion force of the wiring material is 2.058 N, which is a very good value.

Features, structures, effects and the like according to the above-described embodiments are included in at least one embodiment of the present invention, and the present invention is not limited to only one embodiment. Further, the features, structures, effects, and the like illustrated in the embodiments may be combined or modified in other embodiments by those skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

100: Solar panel
142: wiring material
150: Solar cell
42: first electrode
44: Second electrode
42a: Finger line
42b: bus bar line
42c: Border line
422:
422a: first pad portion
422b: second pad portion
423:
424a and 424b:
4241: first electrode portion
4242:
4243: Third electrode part

Claims (20)

1. A solar cell comprising: a semiconductor substrate; a conductive region formed on or in the semiconductor substrate; and an electrode connected to the conductive region; And
A wiring material electrically connected to the electrode for connecting the solar cell to another solar cell or to an external circuit;
Lt; / RTI >
The electrodes comprising a plurality of first finger lines formed in parallel in a first direction and including an outermost finger line adjacent a first edge of the semiconductor substrate,
A plurality of second finger lines formed in parallel in the first direction and formed in a central region of the semiconductor substrate,
And a plurality of third finger lines including an outermost finger line formed in parallel in the first direction and adjacent to a second edge of the semiconductor substrate,
A plurality of second finger lines intersecting the plurality of second finger lines and having a first width and an electrode width of a second width larger than the first width of the line portion, And a pad portion formed on the pad portion,
Wherein the plurality of first finger lines adjacent to the pad portion include one edge region having a first edge region in which a part of the first finger line is not formed,
Wherein the plurality of third finger lines adjacent to the pad portion include a second edge region having a first edge region in which a part of the third finger line is not formed,
Wherein the wiring member is larger than the line portion and has a width smaller than the width of the pad portion and overlaps with the pad portion in a second direction intersecting the first direction and the first edge region and the second end edge region of the one- Extending to the first edge region of the first substrate,
Wherein at least one of an outermost finger line of the first finger line and an outermost finger line of the third finger line extends without a short circuit.
The method according to claim 1,
And the end portion of the wiring material is located within the one-edge region.
3. The method of claim 2,
The wiring material extends to the other solar cell or the external circuit through the other edge region,
Wherein the electrode portion located at one edge region and the electrode portion located at the other edge region have different shapes.
The method according to claim 1,
Wherein the wiring material has a circular section.
The method according to claim 1,
Wherein the one edge region and the other edge region each include 6 or more to 33 or less.
The method of claim 3,
The electrode unit positioned in the one-edge region has a first electrode unit positioned inside the outermost finger line, and a second electrode unit disposed in the same direction as the outermost finger line along the direction crossing the first electrode unit from the first electrode unit. And a second electrode portion extending on the line or beyond,
And the electrode portion in the other edge region includes a third electrode portion that is located on the same line or outward as the outermost finger line,
Wherein the wiring member is located at the first electrode portion and the second electrode portion in the one-edge region,
And the wiring member is located at the third electrode portion in the other edge region.
The method according to claim 6,
Wherein the first electrode portion and the third electrode portion are parallel to the finger lines,
The second electrode portion being orthogonal to the finger line,
The second electrode portion is positioned to pass through the center of the first electrode portion,
Wherein the wiring material is located across the first electrode portion and the end portion of the wiring material is located over the second electrode portion,
And the wiring material crosses the third electrode part.
The method according to claim 1,
The wiring material extends to the other solar cell or the external circuit through the other edge region,
Wherein the electrode portion located at the one edge region and the electrode portion located at the other edge region are symmetrical to each other.
The method according to claim 1,
Wherein the wiring material extends to the one edge region or the other edge region located outside the one end edge region or the other edge edge region outside the pad section.
The method according to claim 1,
Wherein the length of the wiring material located at the one edge region and the length of the wiring material located at the other edge region are different from each other.
The method according to claim 1,
The one end edge region and the other end edge region each having an inner end located more inward than the outermost finger line,
The width of the wiring material is W, and the edge distance between the inner end of the one end or the other end edge region and the edge of the semiconductor substrate is D, the W and the D satisfy the following formula (1) .
&Quot; (1) "
13.732 * ln (W) - 71.436 - 0.0000321462 * (W) 2? D? 13.732 * ln (W) - 71.436 + 0.0000321462 * (W) 2
(Where the unit of W is um and the unit of D is mm)
12. The method of claim 11,
Wherein the width of the wiring material is from 250 to 500 mu m,
The edge distance is 2.37 mm to 21.94 mm,
Wherein the number of the wiring materials is 6 to 33 based on one surface of the solar cell.
The method according to claim 1,
Wherein a width of the electrode portion located at the one end edge region or the other end edge region is equal to or larger than the first finger line or the third finger line and smaller than the pitch of the first finger line or the third finger line,
The width of the wiring material is larger than the width of the electrode portion,
Wherein a width of the one end or the other end edge region between the outermost finger lines is larger than a width of the wiring material.
The method according to claim 1,
Wherein the one or both edge regions have a shape gradually increasing in width as they approach the edge of the semiconductor substrate.
The method according to claim 1,
Further comprising a rim portion for partitioning the one edge region and at least one electrode portion or between the other edge region and at least one electrode portion,
A plurality of first finger lines or third finger lines are connected to the rim,
And the electrode section of the one edge region or the other edge region is connected to the first finger line or the third finger line through the rim portion.
A semiconductor substrate;
A conductive type region formed on the semiconductor substrate or on the semiconductor substrate; And
The electrode connected to the conductive region
/ RTI >
The electrodes comprising a plurality of first finger lines formed in parallel in a first direction and including an outermost finger line adjacent a first edge of the semiconductor substrate,
A plurality of second finger lines formed in parallel in the first direction and formed in a central region of the semiconductor substrate,
And a plurality of third finger lines including an outermost finger line formed in parallel in the first direction and adjacent to a second edge of the semiconductor substrate,
A line portion connected to the plurality of second finger lines in a crossing manner and having a first width W4 and a second width W6 wider than the first width of the line portion, And a pad portion formed in an intersecting second direction and connected to the second finger line,
Wherein the plurality of first finger lines adjacent to the pad portion include one edge region having a first edge region in which the first finger line is not formed,
Wherein the plurality of third finger lines adjacent to the pad portion include a second edge region having a first edge region in which the third finger line is not formed,
A wiring member having a width larger than that of the line portion and smaller than a width of the pad portion and connected to the pad portion in the second direction and extending to the one edge region and the other edge region, panel.
17. The method of claim 16,
Wherein the electrode portion located at the one edge region and the electrode portion located at the other edge region have different shapes or are symmetrical to each other.
18. The method of claim 17,
The electrode unit positioned in the one-edge region has a first electrode unit positioned inside the outermost finger line, and a second electrode unit disposed in the same direction as the outermost finger line along the direction crossing the first electrode unit from the first electrode unit. And a second electrode portion extending on the line or beyond,
And the electrode portion in the other end edge region includes a third electrode portion that is located on the same line or outward as the outermost finger line.
1. A solar cell comprising: a semiconductor substrate; a conductive region formed on or in the semiconductor substrate; and an electrode connected to the conductive region; And
A wiring material electrically connected to the electrode for connecting the solar cell to another solar cell or to an external circuit;
Lt; / RTI >
The electrodes comprising a plurality of first finger lines formed in parallel in a first direction and including an outermost finger line adjacent a first edge of the semiconductor substrate,
A plurality of second finger lines formed in parallel in the first direction and formed in a central region of the semiconductor substrate,
And a plurality of third finger lines including an outermost finger line formed in parallel in the first direction and adjacent to a second edge of the semiconductor substrate,
And a plurality of pads formed in a second direction intersecting the first direction and connected to the second finger line,
Wherein the pad portion has a second width larger than the first width of the wiring material,
Wherein the plurality of first finger lines adjacent to the pad portion include one edge region having a first edge region in which the first finger line is not formed,
Wherein the wiring member overlaps with the pad portion in the second direction and extends to a first edge region of the one edge region.
1. A solar cell comprising: a semiconductor substrate; a conductive region formed on or in the semiconductor substrate; and an electrode connected to the conductive region; And
A wiring material electrically connected to the electrode for connecting the solar cell to another solar cell or to an external circuit;
Lt; / RTI >
The electrode includes a plurality of finger lines formed in parallel in the first direction,
And a plurality of line portions and a pad portion electrically connected to at least a portion of the plurality of finger lines,
The pad portions are disposed at both ends of the plurality of line portions,
The wiring material is connected to the line portion and the pad portion,
The shortest distance from the first or second edge of the semiconductor substrate to the first pad portion of the semiconductor substrate is longer than the shortest distance from the first or second edge of the semiconductor substrate to the outermost finger line of the finger line
Wherein a region of the semiconductor substrate between the first or second edge and the first pad portion passes through the wiring material,

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