KR101869554B1 - Display device - Google Patents

Abstract

A light emitting module according to an embodiment includes a plurality of light emitting diodes; A module substrate on which the plurality of light emitting diodes are mounted; A hole formed in the module substrate; First and second power line patterns formed along an area between the plurality of light emitting diodes and the module substrate in the module substrate and electrically connected to the plurality of light emitting diodes; And a dummy pattern formed in the module substrate, the dummy pattern being disposed between the first power line pattern and the hole.

Description

Display device {DISPLAY DEVICE}

The embodiment relates to a display device.

As information processing technology has developed, display devices such as LCD, PDP, and AMOLED have been widely used. Of these display devices, the LCD requires a backlight unit capable of generating light in order to display an image.

The light emitting module mounts a plurality of light emitting diodes on a substrate, and supplies external power to the plurality of light emitting diodes through a connector.

The embodiment provides a novel light emitting module.

The embodiment provides a light emitting module having a dummy pattern between the hole of the module substrate and the power line pattern.

Embodiments provide a light emitting module and a backlight unit having the module, wherein a dummy pattern is disposed on a module substrate so that a power line pattern can be reduced more than a reference interval to be separated from an edge portion of the module substrate or a metal structure.

Embodiments provide a display device in which irregularities are disposed on one surface of a dummy pattern to further reduce the interval from the power line pattern.

A display device according to an embodiment includes: a plurality of light emitting diodes; A module substrate on which the plurality of light emitting diodes are mounted; A hole formed in the module substrate; First and second power line patterns formed along an area between the plurality of light emitting diodes and the module substrate in the module substrate and electrically connected to the plurality of light emitting diodes; And a dummy pattern formed in the module substrate, the dummy pattern being disposed between the first power line pattern and the hole.

A display device according to an embodiment includes: a bottom cover; A protrusion protruding from a side surface of the bottom cover; A light guide plate on the bottom cover; And a light emitting module including a light emitting diode mounted on the module substrate and a module substrate corresponding to the light guide plate, the module substrate having a hole to which the protrusion is coupled, and the light emitting module includes: First and second power line patterns formed along an area between the diode and the module substrate and electrically connected to the plurality of light emitting diodes; And a dummy pattern formed in the module substrate, the dummy pattern being disposed between the first power line pattern and the hole.

Embodiments can improve the reliability of the light emitting module by arranging a dummy pattern between the edge portion of the module substrate and the power line pattern from the module substrate having the light emitting diode.

Embodiments provide a light emitting module capable of reducing the width of a module substrate.

The embodiment can improve the reliability of a light emitting module having a light emitting diode and a display device having the light emitting module.

1 is an exploded perspective view of a display device according to an embodiment.
2 is a view illustrating an example in which the light emitting module of FIG. 1 is coupled onto the bottom cover.
Figure 3 is a side cross-sectional view of the module substrate of Figure 2;
4 is a view showing a pattern of the module substrate of Fig.
FIG. 5 is a developed view of the dummy pattern and the power supply line patterns of FIG.
Fig. 6 is a view showing another example of the module substrate of Fig. 2. Fig.
7A and 7B are graphs showing the relationship of the pattern widths according to the currents applied to the module substrates.
8 is a graph showing a rated voltage according to an interval between patterns of a module substrate.

In the description of the embodiments, it is described that each substrate, frame, sheet, layer or pattern is formed "on" or "under" each substrate, frame, sheet, In this case, "on" and "under " all include being formed either directly or indirectly through another element. In addition, the upper or lower reference of each component is described with reference to the drawings. The size of each component in the drawings may be exaggerated for the sake of explanation and does not mean the size actually applied.

1 is an exploded perspective view showing a display device according to an embodiment.

1, a display device 100 includes a display panel 10 on which an image is displayed, and a backlight unit 20 that provides light to the display panel 10. [

The backlight unit 20 includes a light guide plate 70 for providing a surface light source to the display panel 10, a reflective sheet 45 for reflecting the leaked light, A light emitting module 30, and a bottom cover 40 which forms a lower outer appearance of the display device 100. [

Although not shown, the display device 100 includes a panel supporter that supports the display panel 10 from the lower side, a tower that forms a rim of the display device 100 and supports the periphery of the display panel 10 Cover.

Although not shown in detail, the display panel 10 may include a lower substrate and an upper substrate coupled to each other to maintain a uniform cell gap, and a liquid crystal layer (not shown) interposed between the two substrates . A plurality of gate lines and a plurality of data lines intersecting the plurality of gate lines may be formed on the lower substrate, and a thin film transistor (TFT) may be formed on the intersections of the gate lines and the data lines. Color filters may be formed on the upper substrate. The structure of the display panel 10 is not limited thereto, and the display panel 10 may have various structures. As another example, the lower substrate may include a color filter as well as a thin film transistor. In addition, the display panel 10 may have various structures according to a method of driving the liquid crystal layer.

Although not shown, a gate driving printed circuit board (PCB) for supplying a scan signal to a gate line is formed at an edge of the display panel 10, a data driving printed circuit board (PCB) May be provided.

A polarizing film (not shown) may be disposed on at least one of the upper side and the lower side of the display panel 10. An optical sheet 60 is disposed under the display panel 10 and the optical sheet 60 may be included in the backlight unit 20 and may include at least one prism sheet and / have. The optical sheet 60 may be removed, but is not limited thereto.

The diffusing sheet diffuses the incident light evenly, and the diffused light can be converged on the display panel by the prism sheet. Here, the prism sheet may be selectively formed using a horizontal or vertical prism sheet, one or more roughness enhancing sheets, or the like. The types and the number of the optical sheets 60 may be added or deleted within the technical scope of the embodiments, but the invention is not limited thereto.

The light emitting module 30 may be disposed on at least one side 42 of the side surface of the bottom cover 40. The light emitting module 30 may be disposed on at least two sides, for example, both sides or all sides of the bottom cover 40, but is not limited thereto. Also, the light emitting module 30 may be disposed on the bottom of the bottom cover 40 and may be mounted in a direct-down manner. In this case, configurations of optical members such as a light guide plate and an optical sheet may be changed.

The light emitting module 30 includes a module substrate 32 and a plurality of light emitting diodes 34 arranged on one side of the module substrate 32.

The plurality of light emitting diodes 34 are arranged along the light incoming direction X of the light guide plate 70 at a predetermined pitch and at least one of the light emitting diodes 34 is formed of at least one color such as at least one of white, One is emitted. The embodiment may use a light emitting diode that emits light of at least one color or a combination of light emitting diodes that emit a plurality of colors.

The light emitting diode 34 may include an LED chip using a Group III-V compound semiconductor and a molding member for protecting the LED chip. At least one type of fluorescent material may be added to the molding member, but the present invention is not limited thereto. The LED chip may emit a wavelength in a visible light band or emit light in an ultraviolet band.

The light emitting diodes 34 may be arranged in at least one row, but are not limited thereto. The light emitting diodes 34 mounted on the module substrate 32 may be arranged at regular intervals or may be arranged at irregular intervals.

The module substrate 32 may be coupled to the bottom of the bottom cover 40 in a direction perpendicular to the bottom of the bottom cover 40 or in a direction parallel to the bottom of the bottom cover 40.

The light emitting diodes 34 are mounted on a front surface (or an upper surface) of the module substrate 32 and the module substrate 32 is bonded to a side surface 42 of the bottom cover 40 with an adhesive member 50 . The module substrate 32 may be adhered to or adhered to another heat dissipation plate, and a fastening member other than an adhesive member may be used to fix the module substrate 32. [

The plurality of light emitting diodes 34 are arranged opposite to each other on at least one side of the light guide plate 70 (that is, a light incident portion), and light generated from the plurality of light emitting diodes 34 is incident. The light guide plate 70 may be formed in a polygonal shape including at least four side surfaces as viewed from the upper surface where the surface light source is generated and the upper surface. The light guide plate 70 is made of a transparent material and may include one of acrylic resin such as polymethyl methacrylate (PMMA), polyethylene terephthalate (PET), polycarbonate (PC), and polyethylene naphthalate . The light guide plate 70 may be formed by an extrusion molding method, but the invention is not limited thereto.

A reflection pattern (not shown) may be formed on the upper surface and / or the lower surface of the light guide plate 70. The reflection pattern may be uniformly irradiated through the entire surface of the light guide plate 70 by reflecting / / diffusing the incident light, which is made up of a predetermined pattern, for example, a reflection pattern or / and a prism pattern. The lower surface of the light guide plate 70 may be formed in a reflective pattern, and the upper surface may be formed in a prism pattern. A scattering agent may be added to the inside of the light guide plate 70, but the present invention is not limited thereto.

A reflective sheet 45 may be provided under the light guide plate 70. The reflective sheet 45 reflects light traveling to the lower portion of the light guide plate 70 toward the display panel. The backlight unit 20 causes the light leaked to the lower portion of the light guide plate 70 to re-enter the light guide plate 70 by the reflective sheet 45, so that the light efficiency is lowered, And the like can be prevented. The reflective sheet 45 may be formed of, for example, PET, PC, PVC resin or the like, but is not limited thereto. The reflective sheet 45 may be a reflective layer formed on the top surface of the bottom cover 40, but is not limited thereto.

The bottom cover 40 includes a receiving part 41 having an opened upper part and a light emitting module 30, an optical sheet 60, a light guide plate 70 and a reflecting sheet 45 Can be accommodated. The bottom cover 40 may be formed of a material having a high heat dissipation efficiency, such as a stainless steel material, and is not limited thereto.

The light emitting module 30 may include a reflective sheet 45, a light guide plate 70 and an optical sheet 60 sequentially stacked on the bottom portion 40 of the bottom cover 40, The light guide plate 70 is disposed on the side surface 42 of the light guide plate 70 so as to correspond to one side surface of the light guide plate 70.

At least one light emitting module 30 may be disposed in the bottom cover 40, but the present invention is not limited thereto.

2, the module substrate 32 may be in the form of a bar, and a connector 36 may be provided at a portion of the module substrate 32. The connector 36 may include at least one of an upper surface and a lower surface of the module substrate 32 And the embodiment will be described as an example in which the connector 36 is installed on the upper surface 31 of the module substrate 32.

The module substrate 32 may include a resin-based printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB, and an FR-4 substrate. The module substrate 32 may include a printed circuit board having a metal layer therein.

A plurality of holes 32A are formed in the lower portion of the module substrate 32. The holes 32A are spaced apart from the light emitting diodes 34 and disposed below the region between the adjacent light emitting diodes 34. [

The protrusion 43 protruding from the one side surface 42 of the bottom cover 40 is inserted into the hole 32A of the module substrate 32 to support the module substrate 32 while maintaining the position of the module substrate 32 . The protrusion 43 of the bottom cover 40 protrudes from the surface to which the module substrate 32 is coupled. When the module substrate 32 is disposed at the bottom of the bottom cover 40, 40).

The bottom cover 40 may be made of a metal such as stainless steel and the protrusion 43 may be made of the same metal as the bottom cover 40. [

When the protrusion 43 or the metal structure of the bottom cover 40 is coupled to the hole 32A of the module substrate 32, a space between the circuit pattern disposed in the module substrate 32 and the protrusion 43 Electrical interference is generated, and a current applied to the circuit pattern due to electrical interference may leak. The width of the module substrate 32 may be increased to shield the circuit pattern from the protrusion 43 for shielding the circuit pattern disposed in the module substrate 32 from other structures. In this case, there is a problem that the width of the module substrate 32 is increased. As the width of the module substrate 32 is increased, the thickness of the backlight unit is increased, and the design of the bottom cover may need to be changed.

3, the module substrate 32 includes a metal layer L1, a first insulating layer L2 on the metal layer L1, a wiring layer L3 on the first insulating layer L2, And a protective layer L4 on the protective layer L3.

The metal layer L1 includes at least one of Al, Cu, and Fe, and is formed on the entire lower surface of the module substrate 32, and is used as a heat dissipation plate. As the metal layer L1, for example, an Al plate having good heat dissipation efficiency can be used. The wiring layer L3 includes a circuit pattern and includes at least one of Cu, Au, Al, and Ag. For example, Cu may be used. The insulating layer L2 includes pre-impregnated materials, and may include an epoxy resin, a phenol resin, an unsaturated polyester resin, or the like.

A protective layer L4 is formed on the wiring layer L3 and the protective layer L4 includes a solder resist and the solder resist protects a region other than the pad on the upper surface of the module substrate 32. [

The thickness of the metal layer L1 may be greater than the thickness of the other layers, for example, 0.8 to 1.5 mm, and the thickness of the insulating layer L2 may be 85 to 100 탆. The wiring layer L3 may be formed to a thickness of 35 to 70 mu m and the protective layer L4 may be formed to a thickness of 15 to 30 mu m. A via hole may be formed in the module substrate 32, but the present invention is not limited thereto.

In addition, a plurality of wiring layers may be disposed in the module substrate 32, and an insulating layer may be further disposed between the plurality of wiring layers.

A light emitting diode 34 is mounted on the wiring layer L3 of the module substrate 32. The light emitting diodes 34 are arranged in a serial, parallel and serial / parallel combination structure by a circuit pattern of the wiring layer L3 .

Referring to FIGS. 4 and 5, the module substrate includes a dummy pattern 131, a first power line pattern 133, and a second power line pattern 135 for circuit connection of a light emitting diode. The first power line pattern 133 may be supplied with a first polarity power and the second power line pattern 135 may be supplied with a second polarity power. At least one of the first power line pattern 133 and the second power line pattern 135 may be formed in the module substrate 32 in accordance with an operation timing of the array of light emitting diodes 34 or a circuit connection, The present invention is not limited thereto. The first power line pattern 133, the second power line pattern 135, and the dummy pattern 131 are formed in the wiring layer of the module substrate 32.

When the first power source line pattern 133 and the second power source line pattern 135 are of different polarities, the interval T4 (added in the drawing) between them is larger than the interval between the power source line patterns of the same polarity . When the first power source line pattern 133 and the second power source line pattern 135 are of the same polarity, the interval therebetween may be narrower.

The first power line pattern 133 adjacent to the edge 32B of the module substrate 32 has a first polarity (+) and the second power line pattern 135 has the first power line pattern 133 Can be spaced apart.

The hole 32A of the module substrate 32 is formed more inward than the edge 32B of the module substrate 32 and is disposed closer to the first power line pattern 133. [ The gap T2 between the protrusion 43 coupled to the hole 32A of the module substrate 32 and the first power line pattern 133 is closer to the gap. A dummy pattern 131 may be disposed between the hole 32A of the module substrate 32 and the first power line pattern 133 to electrically connect the first power line pattern 133 to the hole 32A, The electrical reliability of the first power line pattern 133 can be secured. The dummy pattern 131 may be formed of the same material as the material of the wiring layer, for example, the first and second power line patterns 133 and 135.

The dummy pattern 131 is disposed around the hole 32A of the module substrate 32 so that the first power line pattern 133 is electrically interfered with the protrusion 43 disposed in the hole 32A Or short-circuiting.

The distance T1 between the dummy pattern 131 and the first power line pattern 133 may be 0.3 mm or less. The concave and convex portions 131A are formed on a surface of the dummy pattern 131 corresponding to the first power source line pattern 133 and the concave and convex portions 131A are formed on the surface of the first power source line pattern 133, It is possible to further secure the space distance. The dummy pattern 131 and the concavities and convexities 131A of the first power line pattern 133 may be electrically connected to the first power line pattern 133 even if the interval T3 between the first power line pattern 133 and the hole 32A is reduced. It is possible to secure reliability. The interval T1 between the first power line pattern 133 and the dummy pattern 131 may be 0.15 to 0.3 mm.

The dummy pattern 131 is disposed between the hole 32A of the module substrate 32 and the first power line pattern 133 so that the hole 32A of the module substrate 131 and the first power line pattern The interval T3 between the protrusions 43 and the first power line pattern 133 can be reduced and the distance T2 between the first power line pattern 133 and the first power line pattern 133 can be reduced Interference can be eliminated.

The interval T2 between the first power line pattern 133 and the protrusion 43 is reduced in the module substrate 32 so that the width of the module substrate 32 is not increased. This means that the thickness of the backlight unit with the module substrate 32 may not be thicker.

6 shows a structure in which a hole is formed in the module substrate.

5, a dummy pattern 131 as shown in FIG. 5 is disposed around the hole 32C in the module substrate 32 so that the first power line pattern 133 adjacent to the hole 32C, 32C to be spaced apart from each other. When the metal protrusion is coupled to the hole 32C, the distance between the first power line pattern 133 and the metal protrusion need not be increased.

FIG. 7A is a graph showing the current tolerance according to the conductor cross-sectional area, and FIG. 7B is a graph showing the relationship between the conductor cross-sectional area and the conductor width.

As shown in Figs. 7A and 7B, when the conductor cross-sectional areas P1, P2, and P3 increase, the conductor width increases and the allowable value for the current to flow increases. P1 is 35 占 퐉 (10 占 퐉), P2 is 70 占 퐉 (20Z), and P3 is a pattern having a thickness of 105 占 퐉 (30Z).

8 is a diagram showing the relationship between the voltage and the pattern width.

Referring to FIG. 8, when the conductor spacing increases by 0.3 mm or more, the rated voltage rapidly increases. The embodiment can reduce the distance between the dummy pattern and the first power line pattern to 0.3 mm or less, and can be arranged narrower than the conductor spacing shown in FIG.

The light emitting module according to the embodiment can be applied not only to a backlight unit such as a portable terminal and a computer, but also to an illumination device such as an illumination light, a traffic light, a vehicle headlight, an electric signboard, a streetlight, and the like. Further, the light guide plate may not be disposed in the direct-type light emitting module, but the present invention is not limited thereto. Further, a light transmitting material such as a lens or glass may be disposed on the light emitting module, but the present invention is not limited thereto.

The present invention is not limited to the above-described embodiment and the attached drawings, but is defined by the appended claims. It will be apparent to those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined in the appended claims, As will be described below.

The present invention relates to a light emitting device and a method of manufacturing the same, and more particularly, to a light emitting diode (LED) A dummy pattern 133, 135: a power line pattern, 43: a projection

Claims (8)

A bottom cover including a first side, a second side corresponding to the first side, a third side, and a fourth side corresponding to the third side, the bottom cover including a projection;
And a light emitting module disposed corresponding to at least one side surface of the bottom cover,
The light emitting module includes:
A module substrate comprising a hole in contact with at least one side of the bottom cover and a hole disposed along the first side;
A plurality of light emitting diodes arranged on one surface of the module substrate;
A first power line pattern and a second power line pattern formed along an area between the plurality of light emitting diodes and a first side face of the module substrate;
And a dummy pattern disposed between the first power line pattern and the hole,
Said projection engaging said hole,
Wherein the first power line pattern is closer to the dummy pattern than the second power line. The display device according to claim 1, wherein the dummy pattern is disposed around the hole. The display device according to claim 2, wherein the dummy pattern has a surface corresponding to the first power line pattern formed by unevenness. The display device according to claim 3, wherein an interval between the dummy pattern and the first power line pattern is 0.15 to 0.3 mm. delete delete delete delete

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