KR101863135B1 - Plating apparatus capable of improving plating quality while effectively removing whiskers by electrodeposition method and plating method using the same - Google Patents

Plating apparatus capable of improving plating quality while effectively removing whiskers by electrodeposition method and plating method using the same Download PDF

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KR101863135B1
KR101863135B1 KR1020180005550A KR20180005550A KR101863135B1 KR 101863135 B1 KR101863135 B1 KR 101863135B1 KR 1020180005550 A KR1020180005550 A KR 1020180005550A KR 20180005550 A KR20180005550 A KR 20180005550A KR 101863135 B1 KR101863135 B1 KR 101863135B1
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water
plating
metal plate
roller
supply
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KR1020180005550A
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Korean (ko)
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김출기
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김출기
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1689—After-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0657—Conducting rolls

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The present invention relates to a plating apparatus for plating tin on copper and a plating method using the plating apparatus. More particularly, the present invention relates to a plating apparatus for plating copper on tin and then effectively removing whiskers through electrodeposition to improve plating quality, The present invention relates to a plating apparatus capable of removing whiskers generated by tin plating by electrodeposition which can produce a high quality plating product by performing an electroplating process and a plating method using the same.
To this end, a plating apparatus capable of removing whiskers generated by tin plating according to an embodiment of the present invention by electrodeposition includes a supply unit for supplying a metal plate, a plating unit for plating the supplied metal plate, A first drying unit provided immediately behind the plating bath and washing the plated metal plate with water, a primary drying unit provided immediately behind the water bath to dry the plating state while removing moisture from the metal plate, An electrodeposited portion disposed immediately behind the car dryer to electrostatically deposit the plated tin as electricity is energized by a metal plate material, a flat portion provided immediately behind the electrodeposited portion to flatten the electroplated surface, A water cooling tank for cooling the metal plate material which has been subjected to electrodeposition and flattening by using cold water, A secondary drying unit for drying the plated layer while removing moisture from the water-cooling tank, and a recovery unit provided at the rear of the secondary drying unit to recover the plated metal plate.

Figure R1020180005550

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plating apparatus capable of removing whiskers generated by tin plating by electrodeposition and a plating method using the plating apparatus,

The present invention relates to a plating apparatus for plating tin on copper and a plating method using the plating apparatus. More particularly, the present invention relates to a plating apparatus for plating copper on tin and then effectively removing whiskers through electrodeposition to improve plating quality, The present invention relates to a plating apparatus capable of removing whiskers generated by tin plating by electrodeposition which can produce a high quality plating product by performing an electroplating process and a plating method using the same.

Generally, in plating a metal plate, plating is performed by immersing a product to be plated in a plating bath and bringing the product into contact with the plating solution.

In this case, plating is performed through a chemical reaction. If plating is performed only by a chemical reaction, whiskers are generated during the chemical reaction, so that the plating surface is not smooth, and accordingly, a separate surface treatment process for smoothing the plating surface is required.

The surface treatment process mainly uses a heat treatment method. Conventionally, since the surface treatment is performed by heating the outside by providing a heating furnace on the outer side of the plate material, the temperature of the heat treatment can not be finely controlled. There arises a problem that the plating is not finely plated on the side of the plate to be plated.

In order to solve the above problem, in the prior art 1 (reflow equipment and method for tin plating process of metal plate), induction heating is applied to heat both sides of a plate, And the plating quality can be increased according to the through-flow.

However, in the prior art document 1, high-frequency heating is performed on both sides of the metal sheet when passing the high frequency through the metal sheet, so that the outside of the metal sheet is heated first, and then the outside is melted and flowed down.

In addition, since a separate flattening operation is not performed, only a reflow effect by high-frequency heating can be expected, and the plating quality is lowered due to cooling immediately after the plating surface is not uniform due to melting.

Prior Art 1 (Reflow apparatus and method for tin plating process of metal plate)

SUMMARY OF THE INVENTION The present invention has been conceived to solve the problems described above, and it is an object of the present invention to provide a plating method, in which electricity is supplied to a plated metal plate in a plating tank, In addition, it is possible to smoothly and uniformly perform the plating since the flattening operation is performed immediately after the electrodeposition, and in addition, the hot air, A plating apparatus capable of removing whiskers generated by tin plating by electrodeposition which can increase the plating quality of a product by releasing warm air or hot air at a uniform temperature as a whole when the surface is dried using hot air or a plating method using the plating apparatus And to provide the above objects.

According to an embodiment of the present invention, there is provided a plating apparatus capable of removing whiskers generated by tin plating by electrodeposition, comprising: a supply unit supplying a metal plate; A plating bath 200 provided at a rear side of the plating tank 200 for plating the supplied metal plate material C and a plating tank 200 provided at a rear side of the plating tank 200 for washing the plated metal plate C with water A primary drying unit 400 provided at a rear side of the water treatment tank 300 to dry the plating state while removing moisture from the metal plate C, The electrodeposited portion 500 is disposed immediately behind the electrodeposited portion 500 and electroplats the electrodeposited tin by electrodepositing the electrodeposited metal sheet C, (600) is provided on the rear side of the flat part (600), and electroplating and flattening are completed A secondary drying unit 700 provided immediately behind the water cooling tank 700 for drying the plating layer while removing moisture from the water cooling tank 700, 800); And a collecting unit 900 provided at the rear of the secondary drying unit 800 for collecting the plated metal plate C. FIG.

The supply unit 100 includes a supply unit frame 110 for supporting the supply unit 100 and a supply drum 110 for supplying the metal plate C in a state before being plated, A feeder control bar 130 rotatably provided at an upper portion of the feeder frame 110 so as to be pivotally moved toward or away from the feeder drum 120; A supply roller 140 provided at an end of the supply control bar 130 for guiding the supply of the metal plate C while supporting the outer surface of the metal plate C, And a tightening cylinder 150 provided at the other end of the supply roller 140 to rotate the supply portion control bar 130 so that the supply roller 140 is always in contact with the supply drum 120 side.

The electrodeposited part 500 includes a positive electrode energization roller 510 disposed behind the metal sheet material C in the conveying direction to energize electricity toward the metal sheet material C, A positive electrode current supply roller 520 and a positive electrode current supply roller 510 which are provided in front of the positive electrode energization roller 510 to absorb electricity supplied from the positive electrode energization roller 510 to allow continuous energization, And a ballast (530) connected to the negative electrode current collector roller (520) and keeping the electric power applied to the metal plate (C) constant.

The flat part 600 includes a brush roller 610 for flattening both surfaces of the metal plate C deposited by the electrodeposition part 500 with a brush and a brush roller 610 disposed directly behind the brush roller 610, And a flat roller (620) which pressurizes both surfaces of the plate material (C) and flattens them.

On the other hand, a plating method using a plating apparatus capable of removing whiskers generated by tin plating by electrodeposition includes a supply step (S10) of supplying a metal plate (C), a supplying step (S30) of washing the plated metal plate (C) with water, and a step of removing water from the metal plate (C) washed in the water washing step (S30) An electrodepositing step S50 for electroplating the metal plate material C dried in the primary drying step S40 by applying electricity to the metal plate material C deposited in the electrodeposition step S50; A cooling step S70 for cooling the flattened metal sheet C in the flattening step S60 and a cooling step S70 for cooling the flattened metal sheet C in the cooling step S70, The second step of drying the metal plate material (C) so as to maintain the plating state while removing the residual moisture, Action step (S80), and is characterized in that it comprises a number of steps (S90) to recover the metal sheet (C) was dried at the second drying step (S80).

A plating apparatus capable of removing whiskers generated by tin plating according to an embodiment of the present invention by electrodeposition and a plating method using the plating apparatus have the following effects.

First, plated tin is melted from the inside of the plated layer by heating the plated metal plate itself, and electrodeposited can obtain a high quality plated surface.

Secondly, there is an effect that the plating surface can be evenly plated as a whole through the flattening operation immediately after the electrodeposition.

Third, the hot air or hot air is dried to dry the plated surface so that the blowing air can be slowly blown away from the blowing pipe along the conveying direction based on the blowing pipe for blowing air, and is blown and dried at a uniform temperature There is an effect that can be.

Fourth, all the steps necessary for plating, such as supply, plating, drying, cleaning, cooling, electrodeposition, etc. of metal plate are arranged in one line, thereby shortening the working time and efficiently working.

Fifth, the supply of the metal plate and the recovery of the plated metal plate are automatically performed, so that the continuous operation can be performed without the need of the operator.

FIG. 1 is a conceptual diagram showing an overall configuration of a plating apparatus capable of removing whiskers generated by tin plating by electrodeposition according to an embodiment of the present invention. FIG.
2 is a perspective view illustrating a supply unit of a plating apparatus capable of removing whiskers generated by tin plating by electrodeposition according to an embodiment of the present invention.
3 is a perspective view showing a plating bath of a plating apparatus capable of removing whiskers generated by tin plating by electrodeposition according to an embodiment of the present invention.
4 is a cross-sectional view of a water tank of a plating apparatus capable of removing whiskers generated by tin plating by electrodeposition according to an embodiment of the present invention
5 is a perspective view illustrating a primary drying unit of a plating apparatus capable of removing whiskers generated by tin plating by electrodeposition according to an embodiment of the present invention.
6 is a perspective view illustrating an electrodeposition portion of a plating apparatus capable of removing whiskers generated by tin plating by electrodeposition according to an embodiment of the present invention.
7 is a perspective view showing a flat portion of a plating apparatus capable of removing whiskers generated by tin plating by electrodeposition according to an embodiment of the present invention.
8 is a perspective view showing a water-cooling tank of a plating apparatus capable of removing whiskers generated by tin plating by electrodeposition according to an embodiment of the present invention.
FIG. 9 is a diagram showing the state of use of the plating apparatus according to the embodiment of the present invention, in which the whiskers generated by tin plating can be removed by electrodeposition,
10 is a perspective view illustrating a secondary drying unit of a plating apparatus capable of removing whiskers generated by tin plating by electrodeposition according to an embodiment of the present invention.
FIG. 11 is a perspective view illustrating a recovery unit in a plating apparatus capable of removing whiskers generated by tin plating by electrodeposition according to an embodiment of the present invention. FIG.
12 is a process diagram illustrating a plating method using a plating apparatus capable of removing whiskers generated by tin plating by electrodeposition according to an embodiment of the present invention

TECHNICAL FIELD The present invention relates to a plating apparatus for plating tin on a metal plate, particularly a copper plate, and a plating method using the plating apparatus. The supplying unit and the collecting unit are provided with an automatic operation, It is possible to improve the plating quality by applying an electrodeposition method using electricity by applying electricity to the plate material and by resistance heating as well as to make the plating surface more uniformly flattened by the planarization process immediately after the electrodeposition so as to maximize the plating quality, The present invention relates to a plating apparatus capable of removing whiskers generated by electrodeposition and a plating method using the plating apparatus.

Hereinafter, a plating apparatus capable of removing whiskers generated by tin plating by electrodeposition and a plating method using the plating apparatus according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a conceptual diagram showing an overall configuration of a plating apparatus capable of removing whiskers generated by tin plating by electrodeposition according to an embodiment of the present invention. FIG.

1, the present invention includes a supply unit 100, a plating tank 200, a water tank 300, a primary drying unit 400, an electrodeposition unit 500, a flat portion 600, a water- The secondary drying unit 800, and the recovery unit 900 are sequentially arranged in this order.

This makes it possible to complete all processes required for plating in one process line.

2 is a perspective view illustrating a supply unit of a plating apparatus capable of removing whiskers generated by tin plating by electrodeposition according to an embodiment of the present invention.

2, the feeder 100 includes a feeder frame 110 for supporting the entire feeder 100 and a metal plate C disposed inside the feeder frame 110 to be plated, A supply drum 120 for supplying a metal plate C by rotation in a state in which the supply drum 120 is rotated and a supply drum 120 for supplying the metal plate C to the supply drum 120 by being rotated toward or away from the supply drum 120, A supply control bar 130 rotatably installed at an upper portion of the supply drum 120 and a supply control bar 130 provided at an end of the supply control bar 130 at a side of the supply drum 120 to be closer to or away from the supply drum 120, A supply roller 140 which is always in contact with the supply drum 120 side in accordance with the amount of the metal plate C wound around the supply roller 120 and supports the metal plate C, 140 at the other end thereof And a tightening cylinder 150 which closely contacts the supply roller 140 provided in the supply control bar 130 to the supply drum 120 side.

At this time, the supply drum 120 is connected to a separate power means (not shown) and is rotated by the power to supply the metal plate C to the plating vessel 200 side, and the time required for plating, The metal plate material C can be supplied while adjusting the rotation speed by applying the time.

Accordingly, it is possible to continuously supply the metal plate material C in an optimum time according to the process.

3 is a perspective view showing a plating vessel of a plating apparatus capable of removing whiskers generated by tin plating by electrodeposition according to an embodiment of the present invention.

3, the plating tank 200 includes a heating roller 210 for heating the metal plate C supplied from the supply unit 100 while heating the metal plate C, A plating supporting roller 220 provided inside the plating tank 200 at the back of the plating supporting roller 220 to support the metal plating material C in contact with the tin plating solution so that tin plating is performed, A plating induction roller 230 provided on the rear side of the plating tank 200 for guiding the tin-plated metal plate C to the next process and a plating induction roller 230 disposed on the rear side of the plating induction roller 230, And a cold air cooling unit 240 for cooling and cooling cold air.

The heating roller 210 has a built-in heater 211 therein to heat the entire heating roller 210.

As a result, the tin plating is performed in a state of being heated by the heating roller 210 while the tin plating is performed in the plating tank 200, thereby improving the plating efficiency while improving the quality of the plating surface, Immediately after the completion of the tin plating by the tin plating solution in the plating bath 200, the plating state can be maintained at a high quality by cooling the substrate using the cold wind.

4 is a cross-sectional view illustrating a water tank of a plating apparatus capable of removing whiskers generated by tin plating by electrodeposition according to an embodiment of the present invention.

4, the water washing tank 300 is for washing the metal plate material C which has been plated by the plating liquid in the plating tank 200, and the metal plate material C, which has been plated, And a metal plate (not shown) which is provided in the water treatment tank 300 at the rear of the water treatment tank entry roller 310 and enters the water treatment tank 300 by the water treatment tank entry roller 310, C of the metal plate C which has been washed with the washing liquid is transferred to the drying tank 300 through the primary drying And a water-washing induction roller 330 for guiding water to the unit 400.

At this time, an ultrasonic wave generator 340 is further provided at a lower portion of the water tank 300 to generate ultrasonic vibration toward the water tank 300 during washing of the metal plate C, thereby enhancing water washing efficiency by ultrasonic vibration do.

In addition, a water tank heater 350 for heating the washing water in the water tank 300 is further provided in the lower space of the water tank 300.

The constant water bath heater 350 can raise the temperature of the washing water stored in the water treatment tank 300 to further increase the washing power.

As a result, the metal plate material C, which has been plated and cooled, can be efficiently washed and removed by washing in the water tank 300.

5 is a perspective view illustrating a primary drying unit of a plating apparatus capable of removing whiskers generated by tin plating by electrodeposition according to an embodiment of the present invention.

5, the primary drying unit 400 is installed on both sides of the metal plate C so as to face upward and downward. The primary drying unit 400 includes a blowing pipe for generating hot air or hot air from the outside on the basis of the metal plate C 410, and a V-shaped discharge hole 420 for discharging hot air or hot air through the blowing pipe 410.

The V-shaped discharge holes 420 are formed in a pointed shape toward the outer side with respect to the blowing pipe 410. The V-shaped discharge holes 420 are formed in parallel with the blowing pipe 410 to discharge warm air or hot air blown from the blowing pipe 410, Considering that the temperature is lowered away from the blowing pipe 410 in the course of the discharge of hot air or hot air into the V-shaped discharge hole 420, the hot air or hot air is discharged toward the metal plate C , The plating surface can be evenly dried by blowing at a relatively uniform temperature.

As a result, the metal plate material C which has been washed with water can be dried quickly, and can be dried at a uniform temperature as a whole, so that the plated surface is more uniformly dried and the quality of the plated surface can be maintained high.

6 is a perspective view illustrating an electrodeposition portion of a plating apparatus capable of removing whiskers generated by tin plating by electrodeposition according to an embodiment of the present invention.

Referring to FIG. 6, the electrodeposited part 500 is heated by the primary drying unit 400 and then transferred to the metal plate C during the process of being dried. Whiskers generated during the process of plating, cooling and drying can be removed by melting the plating layer by the heating by the heating process, and whiskers, which are crystals of whiskers generated in the tin plating process, can not smooth the plating surface, It is preferable to remove whiskers as much as possible in order to prevent such accidents in advance.

The electrodeposited part 500 for removing such whiskers is provided with an electrode on a roller for supporting and supporting a metal plate in the course of the transfer of the metal plate C so that electricity is conducted by the metal plate C, A positive electrode energization roller 510 and a negative electrode energization roller 520 arranged in parallel to each other while being spaced from each other on a path through which the metal plate materials C are conveyed, The stabilizer 530 is connected to the negative electrode current supply roller 510 and the negative electrode energization roller 520 to prevent the current from being excessively energized or insufficiently energized.

Meanwhile, a plating layer supporting belt 540 is provided between the positive electrode energization roller 510 and the negative electrode energization roller 520 to prevent the plating layer from melting down due to gravity during the electrodeposition process .

The plating layer supporting belt 540 is made of a soft material having heat resistance and can be subjected to an electrodeposition process in a state in which both sides of the metal plate C are supported so that the plating layer does not flow down without being deformed by heat generated during the electrodeposition process .

As a result, the whiskers can be effectively removed and the plating quality can be further improved.

7 is a perspective view showing a flat portion of a plating apparatus capable of removing whiskers generated by tin plating by electrodeposition according to an embodiment of the present invention.

Referring to FIG. 7, the flat portion 600 is disposed immediately behind the electrodeposition portion 500 to flatten the plating layer to improve the plating quality before cooling the plated layer melted and electrodeposited through the electrodeposition home, A brush roller 610 for aligning the plating layer in contact with the plating layer on both upper and lower surfaces to which the metal plate material C is conveyed and a brush roller 610 disposed directly behind the brush roller 610 to flatten both surfaces of the metal plate material C And a flat roller 620.

As a result, the plating layer can be aligned and planarized immediately after the electrodeposition in the electrodeposition portion 500, so that the plating surface can be smoothly and uniformly coated.

FIG. 8 is a perspective view showing a water-cooling tank of a plating apparatus capable of removing whiskers generated by tin plating by electrodeposition according to an embodiment of the present invention, FIG. 9 is a perspective view of a plating apparatus according to an embodiment of the present invention, Which can be removed by electrodeposition, in a water-cooling tank in an easy-to-understand manner.

Referring to FIGS. 8 and 9, the water-cooling tank 700 receives the cooling water therein, is electrodeposited by the electrodeposition unit 500, passes through the flat part 600, A water-cooling bath entry roller 710 provided directly behind the flat part 600 to allow the flattened metal plate to enter the water-cooling bath, and a water- A water-cooling support roller 720 which is provided in the water-cooling tank 700 so as to be submerged in the cooling water and supports the metal sheet C downward while passing the cooling water therethrough, and a metal plate member C And a water-cooling guide roller 730 for guiding the water to the secondary drying unit 800 side.

Here, a cooling water heating unit 740 is provided at a lower portion of the water-cooled tank 700 where the cooling water is accommodated.

As a result, as the time elapses, the metal plate material (C) entering the heated state in the electrodeposition process is cooled, and the metal plate material (C) is deformed due to the impact due to quenching or cooled unevenly .

On the other hand, in the section where the water-cooled metal plate C is conveyed to the secondary drying unit 800, water is supplied to the upper part of the water- Rejection 750 is further provided.

When the metal plate C is drawn out from the water-cooling tank 700, the water removal unit 750 is rotated in close contact with the metal plate C on both sides of the metal plate C, A water absorbing roller 751 for absorbing the water absorbing roller 751 and a water absorbing roller 751 provided below the water absorbing roller 751 and rotatably disposed below the water absorbing roller 751 to press the water absorbing roller 751, And a water removing roller 752 for removing the water absorbed by the water removing roller 751.

At this time, the water absorbing roller 751 may be a sponge, a nonwoven fabric having good water absorption ability, a cushion of a cloth material, or the like.

The water absorbing roller 751 absorbs moisture adhering to the surface of the metal sheet C and the water absorbing roller 751 absorbing the water absorbs moisture absorbed while being compressed by the water removing roller 752 At this time, the water discharged from the water absorption roller 751 flows into the water-cooling tank 700 again, thereby minimizing the waste of the cooling water and effectively removing the water from the cooled metal plate C. [

At this time, the water removing roller 752 is rotated by a separate driving device and is rotated while pressing the water absorbing roller 751 at a constant speed without affecting the rotation of the water absorbing roller 751, The driving device for rotating the driving gear 752 includes a driving motor 753 for generating a rotational power, a driving gear 754 directly connected to the driving motor 753 and rotated by the power of the driving motor 753, The driven gear 754 is rotated by the drive gear 754 in engagement with the drive motor 754 to be rotated together with the water removal roller 752 to rotate the water removal roller 752 by the power of the drive motor 753, ).

The driving gear 754 and the driven gear 755 are further provided with a gear housing 756 for preventing foreign matter from entering the driving gear 754 and the driven gear 755.

Accordingly, it is possible to accurately transmit a large force by driving the gears, prevent foreign matter from flowing into the driving gear 754 and the driven gear 755, It is possible to effectively remove water by pressing the water removing roller 752 in the second drying unit 800 and to remove unevenness on the surface of the layer by the water remaining as the water enters the secondary drying unit 800 .

10 is a perspective view showing a secondary drying unit of a plating apparatus capable of removing whiskers generated by tin plating by electrodeposition according to an embodiment of the present invention.

10, the secondary drying unit 800 is for drying the plating layer of the metal plate C cooled in the water-cooling tank 700, and is provided on both sides of the metal plate C so as to face upward and downward. A blowing pipe 810 for generating hot air or hot air from the outside on the basis of the metal plate C and a V-shaped discharge hole 820 for discharging hot air or hot air blowing through the blowing pipe 810 do.

The V-shaped discharge holes 820 are pointed outward with respect to the blowing tube 810 and are arranged in parallel to each other. The V-shaped discharge holes 820 are formed in the blowing tube 810 in order to discharge hot air or hot air blown from the blowing tube 810. Considering that the temperature is lowered away from the blowing pipe 810 in the course of discharging the hot air blown or the hot air to the V-shaped discharge hole 820, the hot air or hot air is discharged toward the metal plate C side, , The plating surface can be evenly dried by blowing at a relatively uniform temperature.

As a result, the metal plate material (C) that has been plated, electrodeposited and cooled can be dried quickly, and can be dried at a uniform temperature as a whole, so that the plated surface is dried more uniformly and the quality of the plated surface can be maintained high do.

11 is a perspective view showing a recovery unit in a plating apparatus capable of removing whiskers generated by tin plating by electrodeposition according to an embodiment of the present invention.

11, the collecting unit 900 is provided at the rear of the secondary drying unit 800 to collect the plated metal plate C. The collecting unit 900 collects the collected metal plate material C, A recovery drum 920 for continuously winding the metal plate C provided on the inner side of the recovery section frame 910 by rotating the metal plate material C by rotation; A recovery part control bar 930 rotatably installed on the upper part of the recovery part frame 910 and rotated by the drum 920 toward or away from the drum 920, And is always brought into close contact with the side of the recovery drum 920 in accordance with the amount of the metal plate C wound around the recovery drum 920 as it approaches or approaches the recovery drum 920, A recovery roller 940 for supporting the recovery part 9, A tightening cylinder 950 provided at the other end of the recovery roller 940 at the recovery roller 940 to closely contact the recovery roller 940 provided in the recovery part control bar 930 to the recovery drum 920 side, .

At this time, the recovery drum 920 is connected to a separate power unit (not shown) and is rotated by the power to recover the plated metal plate C, and the time necessary for the plating, such as the time required for plating, The metal plate material C can be recovered while adjusting the rotation speed.

Thus, the metal plate material C can be continuously recovered in an optimum time according to the process.

12 is a process diagram illustrating a plating method using a plating apparatus capable of removing whiskers generated by tin plating by electrodeposition according to an embodiment of the present invention.

12, the present invention provides a method of manufacturing a metal plating apparatus, comprising: a supply step (S10) of supplying a metal plate material (C); a plating step of plating the metal plate material (C) (S30) washing the metal plate material (C) plated in the plating step (S20) with washing water; drying the washing water and the plating layer in the metal plate material (C) An electrodepositing step (S50) of electrodepositing the metal plate (C), which is dried in the primary drying step (S40), while removing whiskers as the plating layer is melted by supplying electricity to the metal plate (C) A planarization step (S60) of aligning the plating layer using a brush roller (610) provided with brushes on the outer periphery of the electroplated plating layer in the electrodeposition step (S50), and pressing and flattening the plating layer in a state in which the plating layer is aligned; In step S60, the plated layer of the planarized metal plate C is cooled A secondary drying step (S80) of drying the cooled metal plate (C) in a state of being maintained in a plating state; And a collecting step (S90) of collecting the metal plate material (C) having been completely plated and dried while being wound.

As a result, the whiskers can be effectively removed, and uniform and high quality plating surfaces can be obtained.

According to the present invention as described above, in performing tin plating on a copper plate, particularly, a copper plate, the entire plating process can be completed in a single line, whiskers generated in the plating process can be effectively removed through an electrodeposition process, The electroplated plating layer is aligned and planarized to uniform the plating surface as a whole to improve the plating quality and the entire process can be performed automatically so that all the plating processes can be completed without an operator.

100: Feeder 110: Feeder frame
120: feed drum 130: feeder control bar
140: Feed roller 150: Closing cylinder
200: plating tank 210: heating roller
220: plating support roller 230: plating induction roller
240: cool air cooling unit 300:
310: water tank entrance roller 320: water wash roller
330: water wash guide roller 340: ultrasonic wave generator
400: primary drying unit 410: blowing pipe
420: V-type emitting hole 500:
510: positive pole energizing roller 520: - pole energizing roller
530: ballast 540: plated layer support belt
600: flat portion 610: brush roller
620: flat roller 700: water cooling tank
710: Water-cooling tank entry roller 720: Water-cooling support roller
730: Water-cooling induction roller 740: Cooling water heating part
750: Water removal 751: Water absorption roller
752: Water removing roller 753: Driving motor
754: drive gear 755: driven gear
800: Secondary drying unit 810:
820: V-type emitting hole 900:
910: Recycle section frame 920: Recycle drum
930: Recovery part control bar 940: Collection roller
950: Closing cylinder C: Metal plate

Claims (5)

A supply part 100 for supplying the metal plate material C;
A plating tank 200 provided immediately behind the supply unit 100 for tin plating the supplied metal plate material C;
A water bath 300 provided immediately behind the plating bath 200 to wash the plated metal plate C with water;
A primary drying unit 400 disposed immediately behind the water treatment tank 300 to dry the plating state while removing moisture from the metal plate C;
An electrodeposited part 500 disposed immediately behind the primary drying part 400 for electrodepositing the plated tin by passing electricity through the metal plate material C;
A flat part 600 disposed immediately behind the electrodeposited part 500 to flatten the electroplated surface;
A water-cooling tank 700 provided immediately behind the flat portion 600 to cool the metal plate C, which has been subjected to electrodeposition and flattening, by using cooling water;
A secondary drying unit 800 provided immediately behind the water-cooling tank 700 to dry the plating layer while removing moisture from the water-cooling tank 700; And
And a collecting unit 900 disposed immediately behind the secondary drying unit 800 for collecting the plated metal plate C,
The supply unit 100 includes a supply unit frame 110 supporting the supply unit 100 and a supply drum 120 provided inside the supply unit frame 110 to supply a metal plate C before being plated, A supply part control bar 130 rotatably provided on the upper part of the supply part frame 110 so as to be pivotally moved toward or away from the supply drum 120 and a supply part control bar 130 rotatably mounted on the supply drum 120 of the supply part control bar 130, A supply roller 140 provided at a side end of the supply control bar 130 to guide the supply of the metal plate C while supporting the outer surface of the metal plate C, And a tightening cylinder (150) provided at the other end portion and rotating the supply portion control bar (130) so that the supply roller (140) always adheres to the supply drum (120) side,
The water washing tank 300 is for washing the metal plate material C which has been plated by the plating liquid in the plating tank 200 and is used for washing the metal plate material C into the water washing tank 300, And a metal sheet C which is provided in the water tray 300 and is introduced into the water tray 300 by the water entering tank 310 is provided at the rear side of the water tray entrance roller 310, And a metal plate C which has been washed with the washing liquid is supplied to the primary drying unit 400 provided at the back of the water treatment tank 300 And an ultrasonic wave generator 340 provided at a lower portion of the water treatment tank 300 to generate ultrasonic vibration toward the water storage tank 300 while the metal plate C is washed with water,
The electrodeposited part 500 includes a positive electrode energization roller 510 provided behind the metal plate material C in the conveying direction to energize electricity to the metal plate material C side, A negative electrode energization roller 520 provided in front of the electrode energization roller 510 for absorbing electricity supplied from the positive electrode energization roller 510 to make continuous energization, - a ballast (530) connected to the pole energizing roller (520) to keep the electricity to be conducted by the metal plate (C) constant,
The flat part 600 includes a brush roller 610 for flattening both sides of the metal plate material C deposited on the electrodeposition part 500 with a brush and a metal plate material 610 provided directly behind the brush roller 610, And a flat roller 620 for pressurizing and planarizing both sides of the rollers C,
The water-cooling bath 700 includes a water-cooling bath entry roller 710 provided directly behind the flat portion 600 to allow the flattened metal plate to enter the water-cooling bath, and a water- A water-cooling support roller 720 provided to support the metal plate C and passing the metal plate C while passing through the cooling water, and a metal plate C passing the water-cooling support roller 720 to the secondary drying unit 800 side And a cooling water heating unit (740) provided at a lower portion of the water-cooled tank (700) to receive cooling water,
At the rear of the water-cooling tank 700, a water-removing unit 750 is provided at an upper portion of the water-cooling tank 700,
When the metal plate C is drawn out from the water-cooling tank 700, the water removal unit 750 is rotated in close contact with the metal plate C on both sides of the metal plate C, A water absorbing roller 751 for absorbing the moisture absorbed by the water absorbing roller 751 and a water absorbing roller 751 for absorbing water absorbed by the water absorbing roller 751 while being pressed against the water absorbing roller 751, And a roller (752), wherein the whisker generated in the tin plating can be removed by electrodeposition.
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KR1020180005550A 2018-01-16 2018-01-16 Plating apparatus capable of improving plating quality while effectively removing whiskers by electrodeposition method and plating method using the same KR101863135B1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113897657A (en) * 2021-09-28 2022-01-07 扬中市新江镀业有限公司 Automatic intelligent tinning production line
CN117565362A (en) * 2024-01-15 2024-02-20 山东国鸿防水材料股份有限公司 Cooling forming equipment is used in waterproofing membrane production

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61266580A (en) * 1985-05-22 1986-11-26 Nisshin Steel Co Ltd Surface treatment of plated steel sheet
KR20050088268A (en) * 2005-08-02 2005-09-05 (주)월성금속 Copper and alloy plating method with tin and recrystallization apparatus for copper and alloy plated with tin
KR20100043793A (en) * 2008-10-21 2010-04-29 안병준 Plated wire having uniform thickness and surface of plated layer and its plating method
KR101051325B1 (en) 2008-12-24 2011-07-22 송감영 Reflow equipment and method for tin plating process treatment of metal plate

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61266580A (en) * 1985-05-22 1986-11-26 Nisshin Steel Co Ltd Surface treatment of plated steel sheet
KR20050088268A (en) * 2005-08-02 2005-09-05 (주)월성금속 Copper and alloy plating method with tin and recrystallization apparatus for copper and alloy plated with tin
KR20100043793A (en) * 2008-10-21 2010-04-29 안병준 Plated wire having uniform thickness and surface of plated layer and its plating method
KR101051325B1 (en) 2008-12-24 2011-07-22 송감영 Reflow equipment and method for tin plating process treatment of metal plate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113897657A (en) * 2021-09-28 2022-01-07 扬中市新江镀业有限公司 Automatic intelligent tinning production line
CN117565362A (en) * 2024-01-15 2024-02-20 山东国鸿防水材料股份有限公司 Cooling forming equipment is used in waterproofing membrane production
CN117565362B (en) * 2024-01-15 2024-03-29 山东国鸿防水材料股份有限公司 Cooling forming equipment is used in waterproofing membrane production

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